KR100227468B1 - Ic socket - Google Patents

Abstract

[purpose]

An IC socket is provided which does not deform the lead when detaching from the mounting position of the IC package.

[Configuration]

Counting from at least one end of each row among the plurality of partition plates 2 along the two opposite sides of the IC socket main body 1, the tip portion 2a of the at least first partition plate is more than the base 2b thereof. It is formed so that the flow amount of the contact pin 2 in the row direction can be largely permitted.

Description

IC socket

1 is a main portion perspective view showing a first embodiment of the present invention.

2 is a partial plan view for explaining the operation of the present invention according to the first embodiment.

3 is a main portion perspective view showing a second embodiment of the present invention.

4 is a main portion perspective view showing a third embodiment of the present invention.

5 is a main portion perspective view showing a fourth embodiment of the present invention.

6 is a sectional view showing the principal parts of a fifth embodiment of the present invention;

7 is a plan view showing one example of a conventional IC socket.

8 is a partial cross-sectional view taken along the line VII-VII of FIG.

9 is a partial cross-sectional view taken along the line VII-VII of FIG.

FIG. 10 is a partial plan view showing a state of movement between a contact pin and a lead located at each edge end when the IC package is removed. FIG.

* Explanation of symbols for main parts of the drawings

1: IC socket body 1A: groove

1a: mounting hole 2: partition board

2a: distal end of the septum 2b: base of the septum

3: contact pin 3A, 3B: contact pin contact

3a, 3b: Head of contact pin 4: IC package

4a: Lead of IC package 5: Manual jig

The present invention provides an IC socket formed by inserting a contact pin configured to be in contact with each lead of an integrated IC package, which is arranged between two insulating boards along two opposite sides of a main body. It is about.

7 to 9 show an example of a conventional IC socket of this kind, FIG. 7 is a plan view thereof, FIG. 8 is a partial cross-sectional view along the line VII-VII of FIG. 7, and FIG. 9 is a VII- of FIG. A partial cross-sectional view along the X-ray. In the figure, 1 is an IC socket main body in which the planar shape is in the long direction and the cross-sectional shape is in the substantially H shape, and a plurality of partition plates 2 are formed by integral molding on two opposite sides thereof. Between the adjacent partition plates, a contact pin 3 inserted into the attachment hole 1a (FIG. 9) provided in the socket body 1 is inserted.

The contact pin 3 has the leads 3a and 3b extending upwards in parallel in approximately parallel direction as shown in FIG. 9 and the leads 4a of the IC package 4 on which the heads 3a and 3b are mounted. It is configured to contact at different positions up and down.

In this type of IC socket, however, the IC package 4 mounted at a predetermined position (dashed line position in FIG. 8) is removed from the socket body 1 by a manual jig (the width is constant but the thickness is directed from one end to the other end). In the case of using the thin member 5, which is thinner, the jig 5 is inserted into the groove 1A extending in the longitudinal direction of the central portion of the socket body 1, as shown in FIG. In this case, the method of inserting the insertion jig 5 is inappropriate, and when the jig 5 is bent or inclined with respect to the groove 1A, the insertion of the jig 5 itself is not smoothly performed. It will stop itself and work again. At this time, the IC package 4 is inclined as shown by the dashed line in FIG. 8, but the lead 4a at the end opposite to the raised side is schematically shown in FIG. You may rub between the contact pins.

In such a case, the IC package 4 is pushed back into the setting state, and then the insertion operation of the jig 5 is properly performed so that the IC package 4 can be taken out. (2), the play range of the contact pins 3 is extremely limited, and furthermore, since the leads 4a are made of a softer material than the contact pins 3, the contact pins 3 penetrate into There was a problem that the lead 4a bends as a result of the lead 4a strikingly striking the head 3a from the side.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of conventional IC sockets, and its object is to provide a contact pin for an IC package lead resulting from improper insertion of the insertion jig 5 when the IC package is removed. The idea is to provide an IC socket that is configured to prevent the bends that occur due to

In order to achieve the above object, the IC package according to the present invention is an IC socket formed by inserting a contact pin configured to contact each lead of a mounted IC package between partition plates arranged along two opposite sides of a main body. At least one upper end portion of the at least first separator plate by counting at at least one of the opposite sides of the two sides allows the amount of the flow in the direction of the thermal contact of the contact pin to be greater than that of the base plate of the partition plate. It is characterized in that formed to be.

According to the present invention, the tip portion of the at least first partition plate is cut out stepwise to a predetermined depth, or the height of the front of the at least first partition plate is sequentially lowered toward the tip of the partition plate. It is formed or the tip portion of the at least first sheet is thinner than the base of the partition plate.

In addition, the present invention provides an IC socket formed by inserting a contact pin configured to contact at two points between a base and a tip of each lead of the mounted IC package between the partition plates arranged along two opposite sides of the main body. And at least one contact pin continuously from at least one end of the two sides not facing each other so as to contact only the base of the lead.

[Action]

When removing the mounted IC package, when the lead at the end tries to move away from the contact pin and return to the original mounting state, if the adjacent contact pin is pushed to the side, the contact pin flows laterally to avoid the lead pin. It does not serve as a resistance member for preventing operation. For this reason, the said lead does not catch or bend the contact pin.

EXAMPLE

1 is a perspective view of principal parts showing a first embodiment of the present invention.

Since the whole structure of this embodiment is the same as that described in the prior art, illustration is omitted and the same member and part will be described with the same reference numeral.

As apparent from FIG. 1, according to the first embodiment of the present invention, at least one sheet is counted from the end of the partition plates 2 along the two opposite sides of the socket body 1, in this case a plurality of sheets. The tip end portion of the partition plate, i.e., the IC package storage side portion 2a, is stepped up to a predetermined depth in the IC package storage direction so as to be lower than the base portion 2b.

Therefore, according to this embodiment, the flow range in the thermal direction when the heads 3a and 3b of the contact pins 3 are pushed from the side expands dramatically as shown in FIG.

For this reason, even when the lead 4a deviating from the contact pin 3 contacts the contact pin 3 at the time of detaching the IC package 4, the contact pin 3 can be elastically escaped accordingly. As in the conventional IC socket, the lead 4a is not deformed by bending the lead 4a without being loaded beyond the allowable capacity.

As evident from this description, basically, if the tip portion of the at least first partition plate 2 is counted from the end, it is sufficient if the tip portion is cut off by a predetermined amount. Therefore, it is sufficient if the tip portion of the at least first partition plate is cut out in a predetermined amount.

3 is a main perspective view similar to FIG. 1 shown in the second embodiment of the present invention.

In this embodiment, counting from the end, the height of the front face of the plurality of partition plates 2 is formed to gradually decrease from the base portion 2b toward the tip portion 2a. Therefore, also in this embodiment, the effect is the same as in the first embodiment.

4 is a main perspective view similar to FIG. 1 showing a third embodiment of the present invention.

In this embodiment, counting from the end, the thickness of the plurality of partition plates 2 is formed so that the tip portion 2a becomes thinner stepwise than the base 2b. Therefore, also in this embodiment, the effects thereof are the same as in the first and second embodiments.

5 is a main perspective view similar to FIG. 1 showing a fourth embodiment of the present invention.

In this embodiment, counting from the end, the thickness of the plurality of partition plates 2 is formed so as to gradually become thin from the base 2b toward the tip portion 2a. Therefore, also in this embodiment, the effect thereof is the same as in the described embodiment.

6 is a sectional view showing the principal parts of a fifth embodiment of the present invention.

In this embodiment, as shown, the lead 4a of the IC package 4 is shaped like a J, and the head 3a divided into two of the contact pins 3 is the tip of the J-shaped lead 4a. That is, at the free end, the heads 3b respectively contact the bases of the J-shaped leads 4a. The head 3a of the at least first contact pin is counted from at least one opposite end of two opposite sides of the socket body 1, which is particularly effective in an IC socket having a contact pin having a so-called two-point contact configuration. It is comprised so that a contact pin may contact two points with the lead 4a by cutting.

Since the fifth embodiment is constituted as described above, even when the lead 4a penetrates between the partition plates when the IC package 4 is taken out, the contact pin portion to which the relatively free end of the lead 4a comes into contact ( Only a portion of the base 4a which is not 3a) and which is relatively hard to deform, is brought into contact with the contact pin. Even in this case, the leads 4a are not bent, and the shapes of all the leads 4a can be kept normal.

While the embodiments of the present invention have been described in various ways, the shape of the partition plate 2 at a predetermined position is not particularly limited to the embodiments, and any shape may be used as long as it can expand the flow range of the contact pins. The cutting surface or the like in the example may have a curved shape, or the cutting portion may be applied to some or all of the desulfurized partition plates, and each of the forming portions may be formed over part or all of the longitudinal direction.

Therefore, you may use combining the shape of the partition board demonstrated in each said Example suitably. When the lead end of the IC package falls between the first and second contact pins, the contact pins at the first end are bent toward the inner end surface side of the frame when they are returned to their original positions. It is advisable to allow for ablation. In addition, the part of the partition board in which the flow amount of a contact pin is largely allowable may be formed so that the upper part of a partition board may become thin gradually upward.

[Effects of the Invention]

As described above, according to the present invention, it is possible to provide a high quality IC socket suitable for inspection work of a large number of IC devices in which the lead of the IC package is not deformed when detaching from the mounting position of the IC package. In addition, according to the present invention, since no additional parts or complicated processing are required, the manufacturing cost is not increased as compared with conventional products.

Claims (5)

An IC socket formed by inserting contact pins so that a contact piece having a contact portion in one direction extends upwardly facing the main body so as to contact each lead of the IC package mounted between the partition plates arranged along two opposite sides of the main body. The flow rate of the contact pins in the direction of opening of the at least one sheet is counted from at least one end of the two sides not facing each other so that the amount of flow in the direction of opening of the contact pin is greater than that of the base of the partition plate. An IC socket, characterized in that it is formed to be largely acceptable. The IC socket according to claim 1, wherein each end portion of the at least one partition plate is cut out stepwise to a predetermined depth. The IC socket according to claim 1, wherein the height of the front surface of the at least first partition plate is sequentially lowered toward the tip portion. The IC socket according to claim 1, wherein the at least one first partition plate is formed so that the tip portion is thinner than the base. An IC socket formed by inserting contact pins configured to contact at two points with a base and a tip of each lead of an IC package mounted between two opposing sides of the main body, and the two sides facing each other. And counting from at least one end thereof so that the at least first contact pin contacts only the base of the lead.