JPH08306454A - Ic socket - Google Patents

Abstract

PURPOSE: To provide an IC socket by which a lead is not deformed when an IC package is taken out of a mounting position. CONSTITUTION: A tip part 2a of at least a first partition plate counted from at least one end of respective rows among a large number of partition plates 2 rowed up along the opposed two sides of an IC socket main body 1, is formed so that a loosely moving distance in the rowing-up direction of contact pins 2 can be largely allowed more than its base parts 2b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention inserts a contact pin configured to come into contact with each lead of an IC package mounted between partition plates arranged along two opposite sides of a main body. The present invention relates to an IC socket.

[0002]

2. Description of the Related Art FIGS. 7 to 9 show an example of a conventional IC socket of this type. FIG. 7 is a plan view thereof, and FIG.
7 is a partial sectional view taken along line VIII-VIII of FIG.
It is a fragmentary sectional view which follows a line. In the figure, 1 is an IC socket body having a rectangular planar shape and a substantially H-shaped end face,
A large number of partition plates 2 are arranged in a row on the opposite two sides by integral molding. Socket body 1 between adjacent partition plates
The contact pin 3 fitted in the mounting hole 1a (FIG. 9) formed in the hole is inserted. As shown in FIG. 9, the contact pin 3 has contact pieces 3A and 3B that extend upward substantially in parallel, and the heads 3a and 3b of the contact pin 3 have leads 4a of the mounted IC package 4. It is configured to make contact with different positions in the vertical direction.

[0003]

By the way, in this type of IC socket, a manual jig (with a constant width is used to remove the IC package 4 mounted at a predetermined position (the position indicated by the broken line in FIG. 8) from the socket body 1. If a rod-shaped member 5 having a thickness that decreases from one end to the other end is used, the jig 5 is inserted into a groove 1A extending in the central portion longitudinal direction of the socket body 1 as shown in FIG. It is done by inserting. In this case, if the method of inserting the insertion jig 5 is improper and the jig 5 is bent or inclined with respect to the groove 1A, the insertion itself of the jig 5 can be performed smoothly. It will disappear, and the work itself will be stopped and the work will be redone. At this time, the IC package 4 once assumes an inclined posture as shown by the chain line in FIG. 8, but at this time, the lead 4 at the end opposite to the lifted side is formed.
As shown in the schematic view of FIG. 10, a may be misaligned between the contact pins.

In such a case, the IC package 4 can be removed by pushing the IC package 4 into the set state again and then properly inserting the jig 5 so that the IC package 4 can be taken out. In the IC socket, the partition plate 2 limits the floating range of the contact pin 3 to an extremely small range, and since the lead 4a is made of a softer material than the contact pin 3, the head of the slipped contact pin 3 is There is a problem that the lead 4a is bent as a result of the lead 4a hitting the portion 3a from the side like a cogil.

The present invention has been made in view of the above problems of the conventional IC socket, and its purpose is to prevent improper insertion work of the insertion jig 5 when the IC package is removed. It is an object of the present invention to provide an IC socket configured so as to prevent the resulting bending of a lead of an IC package due to being caught by a contact pin.

[0006]

In order to achieve the above object, an IC package according to the present invention is provided with leads of an IC package mounted between partition plates arranged along two opposite sides of a main body. In an IC socket formed by inserting a contact pin configured to come into contact with a contact pin, at least an upper portion of a tip portion of at least a first partition plate counting from at least one end of the two sides which does not face each other It is characterized in that the tip end portion is allowed to have a larger amount of free movement in the row direction than the base portion of the partition plate.

According to the present invention, the tip portion of the at least first partition plate is cut in steps to a predetermined depth, or the height of the top surface of the at least first partition plate is the partition plate. Of the partition plate, or the thickness of the at least first partition plate is smaller than that of the base part of the partition plate.

Further, according to the present invention, the partition plates arranged along two opposite sides of the main body are in contact with each other at two points, that is, the base portion and the tip portion of each lead of the mounted IC package. In the IC socket formed by inserting the contact pins, at least the first contact pin counted from at least one end of the two sides which does not face each other is configured to contact only the base portion of the lead. There is.

[0009]

When the mounted IC package is detached, the lead at the end part comes off the contact pin, and when trying to restore the original mounting state again, when the adjacent contact pin is pushed to the side, The contact pin does not function as a resistance member that loosens and escapes to the side and blocks the movement of the lead. Therefore, the lead is not caught by the contact pin or bent.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view of an essential part showing a first embodiment of the present invention. Since the overall structure of this embodiment is the same as that described in the prior art, the illustration and description will be omitted, and the same members and portions will be described by using the same reference numerals. As is apparent from FIG. 1, according to the first embodiment of the present invention, the socket body 1
Of the partition plates 2 arranged along two opposing sides of the base plate 2b, at least one of which is counted from the end, and in this case, the tip portions of the plurality of partition plates, that is, the IC package housing side portions 2a, are the base portions 2b. It is cut in a stepwise manner to a predetermined depth in the IC package housing direction so as to be lower than the above.

Therefore, according to this embodiment, when the head portions 3a and 3b of the contact pin 3 are pushed from the side, the floating range in the row direction is greatly expanded as shown in FIG. . Therefore, when the IC package 4 is removed, the lead 4a that is disengaged from the contact pin 3 is
Even if it hits, the contact pin 3 can elastically escape accordingly, so that the lead 4a is deformed by bending the lead 4a without applying a load exceeding the allowable stress to the lead 4a, as in a conventional IC socket of this type. There is nothing to lose. As is clear from this description, basically, it is sufficient if at least the first end portion of the partition plate 2 counted from the end is cut out by a predetermined amount. It suffices if at least the front end portion of at least the first partition plate is cut off by a predetermined amount, counting from any one of the ends that do not face each other.

FIG. 3 is a perspective view similar to FIG. 1 showing a second embodiment of the present invention. In this embodiment, the heights of the top surfaces of the plurality of partition plates 2 counted from the ends are gradually lowered from the base portion 2b toward the tip portion 2a. Therefore, also in this embodiment, the function and effect are similar to those in the first embodiment.

FIG. 4 is a perspective view similar to FIG. 1 showing a third embodiment of the present invention. In this embodiment, the plurality of partition plates 2 counting from the end are formed so that the tip portion 2a is stepwise thinner than the base portion 2b. Therefore,
Also in this embodiment, the function and effect are similar to those of the first and second embodiments.

FIG. 5 is a perspective view similar to FIG. 1 showing a fourth embodiment of the present invention. In this embodiment, the thickness of the plurality of partition plates 2 counted from the end is from the base portion 2b to the tip portion 2
It is formed so as to become gradually thinner toward a. Therefore, also in this embodiment, the function and effect are similar to those of the above-mentioned embodiment.

FIG. 6 is a cross-sectional view of essential parts showing a fifth embodiment of the present invention. In this embodiment, as shown in the drawing, the lead 4a of the IC package 4 has, for example, a J-shape, and the two separate head portions 3a of the contact pin 3 are located at the tip portion or free end portion of the J-shaped lead 4a. , The head 3b contacts the base of the J-shaped lead 4a. It is particularly effective in an IC socket provided with a contact pin having a so-called two-point contact structure, and at least the head portion 3a of the first contact pin 3 counted from at least one end of two opposite sides of the socket body 1 which do not face each other. The contact pin is cut off so as to make a single point contact with the lead 4a.

Since the fifth embodiment is constructed as described above, even if the lead 4a is slipped between the partition plates when the IC package 4 is taken out, the contact where the free end portion of the lead 4a which is relatively easily deformed should hit. As a result, only the base portion of the lead 4a, which is relatively hard to deform, does not have the pin portion (3a) and comes into contact with the contact pin. Therefore, even in such a case, the leads 4a are not bent, and the shapes of all the leads 4a can be normally maintained.

Various embodiments of the present invention have been described above.
The shape of the partition plate 2 at a predetermined position is not particularly limited to the embodiment, and may be any shape as long as the floating range of the contact pin can be expanded. For example, the cut surface in each of the above embodiments is curved. It may be in a shape, and the cut portion and the like are
The present invention may be applied to a part or all of the partition plates arranged in a row, and the respective forming portions thereof may be formed over part or all of the longitudinal direction. Therefore, the shapes of the partition plates described in each of the above embodiments may be appropriately combined and used. Furthermore, IC
If the end of the package lead falls off between the first and second contact pins, the contact pin at the end is bent toward the inner end surface of the frame when returned to its original position. It is preferable to cut off the inner end surface portion of the frame. Furthermore, the part of the partition plate which allows a large amount of free play in the row direction of the contact pins may be formed such that the upper part of the partition plate is gradually thinned upward.

[0018]

As described above, according to the present invention, a large number of I's which do not deform the leads of the IC package when detached from the mounting position of the IC package.
It is possible to provide a high quality IC socket suitable for C device inspection work and the like. Further, according to the present invention, since additional parts and complicated processing are not particularly required, the manufacturing cost is not increased as compared with the conventional product.

[Brief description of drawings]

FIG. 1 is a perspective view of essential parts showing a first embodiment of the present invention.

FIG. 2 is a partial plan view for explaining the operation of the present invention according to the first embodiment.

FIG. 3 is a perspective view of an essential part showing a second embodiment of the present invention.

FIG. 4 is a perspective view of a main part showing a third embodiment of the present invention.

FIG. 5 is a perspective view of a main part showing a fourth embodiment of the present invention.

FIG. 6 is a cross-sectional view of essential parts showing a fifth embodiment of the present invention.

FIG. 7 is a plan view showing an example of a conventional IC socket.

8 is a partial cross-sectional view taken along the line VIII-VIII of FIG.

9 is a partial cross-sectional view taken along the line IX-IX in FIG.

FIG. 10 is a partial plan view showing a movement state of the contact pin and the lead located at each end portion when the IC package is removed.

[Explanation of symbols]

 1 IC Socket Main Body 1A Groove 1a Mounting Hole 2 Partition Plate 2a Partition Plate Tip 2b Partition Plate Base 3 Contact Pin 3A, 3B Contact Pin Contact Piece 3a, 3b Contact Pin Head 4 IC Package 4a IC Package Lead 5 Manual jig

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[Procedure amendment]

[Submission date] July 18, 1996

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0015

[Correction method] Change

[Correction content]

FIG. 6 is a cross-sectional view of essential parts showing a fifth embodiment of the present invention. In this embodiment, as shown in the drawing, the lead 4a of the IC package 4 is, for example, J-shaped, and the taller head 3a separated into two of the contact pins 3 is the tip of the J-shaped lead 4a. That is, it is particularly effective in an IC socket provided with a contact pin of a so-called two-point contact structure in which the shorter head 3b contacts the base of the J-shaped lead 4a at the free end, and is opposed to the socket body 1. The head 3a of at least the first contact pin 3 counted from at least one of the two sides that do not face each other is cut off so that the contact pin 3 makes one point contact with the lead 4a.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction content]

Since the fifth embodiment is constructed as described above, even if the lead 4a is slipped between the partition plates when the IC package 4 is taken out, the contact where the free end portion of the lead 4a which is relatively easily deformed should hit. As a result, only the base portion of the lead 4a, which is relatively hard to deform, does not have the pin portion (3a) and comes into contact with the contact pin. Therefore, even in such a case, the leads 4a are not bent, and the shapes of all the leads 4a can be normally maintained. this thing
Is at least one of the opposite sides of the socket body 1.
At least the height of the first contact pin counting from the end
Contours that are formed low or are arranged in rows along each of the above sides.
The total height of the kutpin group is sequentially from the center to the end
If it is formed so as to be low, the same effect can be obtained.
It is a suggestion.

Claims (5)

[Claims] 1. An IC socket in which contact pins configured to come into contact with respective leads of an mounted IC package are inserted between partition plates arranged along two opposite sides of a main body. , At least an upper portion of the tip portion of at least one of the partition plates counting from at least one end of the two sides that do not face each other, and the amount of looseness of the contact pin in the arranging direction is the tip end of the partition plate relative to the base portion An IC socket characterized in that the part is formed so as to be more tolerable. 2. The IC socket according to claim 1, wherein each tip portion of the at least first partition plate is cut in a stepwise shape to a predetermined depth. 3. The IC socket according to claim 1, wherein a height of a top surface of the at least one partition plate is formed so as to become gradually lower toward the tip portion. 4. The IC socket according to claim 1, wherein the thickness of the at least one partition plate is formed such that the tip portion is thinner than the base portion. 5. A contact pin configured to come into contact with a partition plate arranged along two opposing sides of a main body at two points of a base portion and a tip portion of each lead of an mounted IC package. In the IC socket, wherein at least the first contact pin counted from at least one end of the two sides that does not face each other is configured to contact only the base portion of the lead. .