KR19990048020A - Polyamide Resin Composition - Google Patents

Polyamide Resin Composition Download PDF

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KR19990048020A
KR19990048020A KR1019970066621A KR19970066621A KR19990048020A KR 19990048020 A KR19990048020 A KR 19990048020A KR 1019970066621 A KR1019970066621 A KR 1019970066621A KR 19970066621 A KR19970066621 A KR 19970066621A KR 19990048020 A KR19990048020 A KR 19990048020A
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polyamide resin
weight
resin composition
parts
inorganic filler
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KR1019970066621A
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KR100477425B1 (en
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박용선
김상열
전영선
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구광시
주식회사 코오롱
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/16Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

본 발명은 폴리아미드 수지조성물에 관한 것으로서, 폴리아미드 수지에 에틸렌-옥텐계 고무를 첨가하여 무기물의 분산성을 향상시키고, 실리콘 유도체와 프로필렌계 공중합체를 커플링제로서 첨가함으로써 수지와 무기물 사이의 접착력을 향상시키고 수지자체의 터프니스(toughness)를 증진시켜 기계적 물성, 특히 충격강도를 크게 향상시키고 표면상태도 우수한 폴리아미드 수지조성물에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyamide resin composition, wherein an ethylene-octene rubber is added to a polyamide resin to improve the dispersibility of an inorganic substance, and an adhesive force between the resin and the inorganic substance is added by adding a silicone derivative and a propylene copolymer as a coupling agent. The present invention relates to a polyamide resin composition which greatly improves mechanical properties, particularly impact strength, and has excellent surface condition by improving the toughness of the resin itself and enhancing the toughness of the resin itself.

Description

폴리아미드 수지조성물Polyamide Resin Composition

본 발명은 폴리아미드 수지조성물에 관한 것으로서, 더욱 상세하게는 무기물의 분산성을 향상시켜 표면상태가 양호하며, 기계적 물성이 우수하여 엔지니어링 플라스틱으로 유용한 폴리아미드 수지조성물에 관한 것이다.The present invention relates to a polyamide resin composition, and more particularly, to a polyamide resin composition which improves dispersibility of an inorganic material and has a good surface state and has excellent mechanical properties.

고분자 물질에 탈크 등의 무기충전제를 첨가함으로써 굴곡강도와 치수안정성, 열변형온도 등의 기계적, 열적 성질을 강화시킨 고분자 조성물을 제조할 수 있다는 것은 이미 잘 알려진 사실이다.It is well known that the addition of inorganic fillers, such as talc, to polymer materials can produce polymer compositions with enhanced mechanical and thermal properties such as flexural strength, dimensional stability, and thermal strain temperature.

일반적으로 플라스틱 제품을 실제로 사용할 때 그 제품의 신용도를 보장하기 위해서는 강도와 내크리프(creep)성, 내충격성을 만족시켜야 하며, 특히 내충격성은 무기물로 강화된 물질에 있어서 갖추어야 할 가장 중요한 인자 중의 하나이다.In general, when the plastic product is actually used, in order to guarantee the credibility of the product, the strength, creep resistance, and impact resistance must be satisfied. In particular, the impact resistance is one of the most important factors to be equipped with an inorganic reinforced material.

그런데, 무기충전제와 같은 무기물이 첨가된 고분자 조성물에 충격이 가해지면 무기충전제가 충격을 분산시키기 보다는 힘을 집중시키기 때문에 고분자물질과 무기충전제 간의 접착이 불량하게 되고, 특히 무기충전제가 응집되어 있는 부분은 충격에 대하여 취약(brittle)으로 작용하게 되는 문제점이 있다.However, when an impact is applied to the polymer composition to which the inorganic material such as the inorganic filler is added, the inorganic filler concentrates the force rather than disperse the impact, so that the adhesion between the polymer material and the inorganic filler is poor, and in particular, the portion where the inorganic filler is aggregated. There is a problem that acts as a brittle to the impact (brittle).

이와같은 이유로 무기물이 충전되어 있는 강화 폴리아미드 수지조성물의 경우도 폴리아미드와 무기충전제의 접착성이 불량하고 내충격성이 저하되는 문제점이 있었다.For this reason, in the case of the reinforced polyamide resin composition in which the inorganic material is filled, there is a problem in that the adhesion between the polyamide and the inorganic filler is poor and the impact resistance is lowered.

따라서, 근래에는 이러한 문제점을 해결하기 위해 폴리아미드와 무기충전제 간의 접착력과 무기충전제의 분산성을 향상시키는 데 관심과 노력이 집중되어 왔다.Therefore, in recent years, attention and efforts have been focused on improving the adhesion between the polyamide and the inorganic filler and the dispersibility of the inorganic filler.

그 일예로 미국특허 제3,419,517호에는 실란계 커플링제를 첨가하여 무기충전제와 폴리아미드 수지간의 접착력을 향상시킴으로써 기계적 물성이 향상된 폴리아미드 수지조성물에 대하여 개시되어 있다.For example, US Pat. No. 3,419,517 discloses a polyamide resin composition having improved mechanical properties by adding a silane coupling agent to improve adhesion between the inorganic filler and the polyamide resin.

그러나, 상기와 같은 조성의 수지는 무기충전제로서 유리섬유를 첨가하는 경우에는 어느 정도 만족할 만한 수지이나 충격강도 및 터프니스면에서는 얇은 부품에 적용하기 부적합한 문제가 있었다.However, the resin having the composition described above has a problem in that it is not satisfactory to be applied to a thin part in terms of impact strength and toughness when the glass fiber is added as an inorganic filler, but somewhat satisfactory.

한편, 미국특허 제3,988,287호 및 제4,336,301호에는 실란계 커플링제와 함께 글리시딜 메타크릴레이트, 및 글리시딜 아릴레이트와 같은 에폭시 함유 화합물을 첨가하여 이루어진 수지조성물에 대하여 개시하고 있다.US Patent Nos. 3,988,287 and 4,336,301 disclose resin compositions formed by adding an epoxy-containing compound such as glycidyl methacrylate and glycidyl arylate together with a silane coupling agent.

그러나, 이와같은 수지조성물의 경우 무기충전제를 이러한 물질로 먼저 가공하여 사용하여야 하는 공정상의 복잡한 문제가 있었다.However, in the case of such a resin composition, there was a complicated process problem in that an inorganic filler must be first processed into such a material.

그리고, 상기 수지조성물들은 무기충전제와 폴리아미드 사이의 접착력만을 향상시켰을 뿐 충격강도의 증진에 중요한 요인인 분산성 및 수지 자체의 터프니스 향상에 대해서는 고려하지 않고 있다.In addition, the resin compositions only improve the adhesion between the inorganic filler and the polyamide, but do not consider dispersibility and toughness improvement of the resin itself, which are important factors in enhancing the impact strength.

본 발명의 목적은 기계적, 열적 성질 향상을 위해 첨가되는 무기충전제의 분산성을 향상시키고 수지 자체의 터프니스를 향상시켜 기계적 물성, 특히 충격강도를 크게 향상시키고 표면상태도 양호한 폴리아미드 수지조성물을 제공하는 데 있다.An object of the present invention is to improve the dispersibility of the inorganic filler added to improve the mechanical and thermal properties and to improve the toughness of the resin itself, thereby providing a polyamide resin composition that greatly improves mechanical properties, particularly impact strength, and has a good surface condition. There is.

상기와 같은 목적을 달성하기 위한 본 발명의 폴리아미드 수지조성물은 폴리아미드 수지 100 중량부, 무기충전제 10∼60 중량부, 말레인산무수물이 0.5% 그라프트된 에틸렌-옥텐 공중합체 5∼30 중량부, 및 커플링제 0.5∼5.0 중량부로 이루어진 것임을 그 특징으로 한다.Polyamide resin composition of the present invention for achieving the above object is 100 parts by weight of polyamide resin, 10 to 60 parts by weight of inorganic filler, 5 to 30 parts by weight of ethylene-octene copolymer 0.5% grafted maleic anhydride, And 0.5 to 5.0 parts by weight of the coupling agent.

이와같은 본 발명을 더욱 상세하게 설명하면 다음과 같다.The present invention will be described in more detail as follows.

본 발명은 터프너를 첨가하여 무기충전제의 분산성을 향상시킬 뿐만 아니라 수지자체의 흐름성을 증진시켜 무기물의 표면표출을 막아 표면상태가 양호하도록 한다.The present invention not only improves the dispersibility of the inorganic filler by adding a toughener, but also improves the flowability of the resin itself, thereby preventing surface expression of the inorganic material so that the surface state is good.

본 발명에서의 터프너는 에틸렌-옥텐 공중합체에 말레인산무수물이 0.5% 그라프트된 화합물로서, 비중이 0.869이며, 용융지수가 1.3g/10분 인 것이다.The tuffner in the present invention is a compound in which 0.5% of maleic anhydride is grafted to an ethylene-octene copolymer, and has a specific gravity of 0.869 and a melt index of 1.3 g / 10 minutes.

이와같은 터프너의 함량은 폴리아미드 수지 100 중량부에 대하여 5∼30 중량부, 바람직하기로는 10∼25 중량부인 바, 만일 그 함량이 5 중량부 미만이면 첨가효과가 미미하고, 30 중량부를 초과하여 첨가하면 터프너 첨가에 따른 효과상승이 없고 오히려 강도 등의 물성이 취약해지는 문제가 있다.The amount of such toughener is 5 to 30 parts by weight, preferably 10 to 25 parts by weight with respect to 100 parts by weight of polyamide resin. If the content is less than 5 parts by weight, the effect of addition is insignificant, and exceeds 30 parts by weight. When added, there is no effect increase due to the addition of the toughener, rather there is a problem that physical properties such as strength is weak.

한편, 본 발명에서는 커플링제를 첨가하여 수지와 무기물 사이의 접착력을 향상시키고 수지자체의 터프니스를 증진시켜 기계적 물성, 특히 충격강도의 상승효과를 얻도록 한다.On the other hand, in the present invention by adding a coupling agent to improve the adhesion between the resin and the inorganic material and to improve the toughness of the resin itself to obtain a synergistic effect of mechanical properties, in particular impact strength.

이같은 역할을 하는 커플링제는 프로필렌 단중합체에 말레인산무수물이 0.5% 그라프트된 화합물과 다음 화학식 1로 표시되는 실리콘 유도체의 혼합물이며, 그 함량은 폴리아미드 수지 100 중량부에 대하여 0.5∼5.0 중량부이다.The coupling agent which plays such a role is a mixture of a compound in which 0.5% of maleic anhydride is grafted to a propylene homopolymer and a silicone derivative represented by the following Formula 1, and its content is 0.5 to 5.0 parts by weight based on 100 parts by weight of polyamide resin. .

H2N(CH2)3Si(CH3)2OSi(CH3)2(CH2)3NH2 H 2 N (CH 2 ) 3 Si (CH 3 ) 2 OSi (CH 3 ) 2 (CH 2 ) 3 NH 2

이때, 프로필렌 단중합체에 말레인산무수물이 0.5% 그라프트된 화합물은 용융지수가 100g/10분 인 것이 바람직하다.In this case, the compound in which 0.5% of maleic anhydride is grafted to the propylene homopolymer is preferably a melt index of 100 g / 10 minutes.

만일, 커플링제의 함량이 폴리아미드 수지 100 중량부에 대하여 0.5 중량부 미만이면 원하는 분산성 향상을 얻기 어렵고, 5.0 중량부를 초과면 커플링제의 열분해에 의해 물성이 저하되고 제조원가가 상승되어 비경제적이다.If the content of the coupling agent is less than 0.5 parts by weight with respect to 100 parts by weight of the polyamide resin, it is difficult to obtain a desired dispersibility improvement. If the content of the coupling agent exceeds 5.0 parts by weight, the physical properties are lowered due to thermal decomposition of the coupling agent and the manufacturing cost is increased, which is uneconomical. .

그리고, 커플링제로 사용되는 그라프트된 프로필렌 단중합체와 실리콘 유도체와의 혼합시 그 함량비는 1:1∼2 중량비인 것이 바람직하다.In addition, the content ratio of the grafted propylene homopolymer and the silicone derivative used as the coupling agent is preferably 1: 1 to 2 weight ratio.

한편, 본 발명에서 폴리아미드 수지로는 지방족 또는 방향족 폴리아미드 수지를 사용할 수 있는데, 특히 지방족 폴리아미드 수지, 예를 들어 나일론 6, 나일론 66, 나일론 6-10, 나일론 6-12, 나일론 11, 및 나일론 12 중에서 선택된 1종 이상의 화합물을 사용할 수 있다.Meanwhile, in the present invention, an aliphatic or aromatic polyamide resin may be used as the polyamide resin, and in particular, an aliphatic polyamide resin, for example, nylon 6, nylon 66, nylon 6-10, nylon 6-12, nylon 11, and One or more compounds selected from nylon 12 can be used.

그리고, 무기충전제는 비섬유상의 점토, 활석, 운모 및 탄산칼슘 중에서 선택된 단독 또는 2종 이상의 혼합물인 바, 그 함량은 폴리아미드 수지 100 중량부에 대하여 5∼60 중량부, 바람직하기로는 10∼50 중량부이다.And, the inorganic filler is a single or a mixture of two or more selected from non-fibrous clay, talc, mica and calcium carbonate, the content is 5 to 60 parts by weight, preferably 10 to 50 to 100 parts by weight of polyamide resin Parts by weight.

만일, 무기충전제의 함량이 폴리아미드 수지 100 중량부에 대하여 5 중량부 미만이면 기계적, 열적 성질이 향상되지 않고, 60 중량부를 초과하여 사용하면 성형품의 표면상태가 나쁘고, 충격강도가 부족하여 깨어질 우려가 있다.If the content of the inorganic filler is less than 5 parts by weight with respect to 100 parts by weight of polyamide resin, the mechanical and thermal properties are not improved. If the content of the inorganic filler is greater than 60 parts by weight, the surface state of the molded article is bad, and the impact strength is insufficient. There is concern.

또한, 본 발명의 수지조성물은 이형제, 열안정제, 내후제, 난연제 또는 대전방지제 등을 필요에 따라 본 발명의 목적을 손상시키지 않는 범위내에서 포함할 수 있다.In addition, the resin composition of the present invention may include a release agent, a heat stabilizer, a weathering agent, a flame retardant or an antistatic agent within the scope of not impairing the object of the present invention, if necessary.

이와같은 조성으로 이루어진 폴리아미드 수지조성물의 제조는 이축압축기를 이용하여 수행되는 바, 수지조성물의 기계적 물성을 최대화하기 위하여 투입구가 2개 이상인 압축기를 사용하여 혼련하며, 1차 투입구에서는 폴리아미드 수지와 내열제, 이형제 및 커플링제를 블렌딩하여 투입하고, 2차 투입구에는 터프너를 투입하고, 무기충전제는 통상의 필러(filler) 투입구에서 투입하는 것이 가장 바람직하다.Preparation of the polyamide resin composition having such a composition is carried out using a twin-screw compressor, in order to maximize the mechanical properties of the resin composition kneaded by using a compressor having two or more inlets, the first inlet and the polyamide resin It is most preferable to add a heat-resistant agent, a mold release agent and a coupling agent by blending, a second inlet, a tuffer, and an inorganic filler in a conventional filler inlet.

이같은 수지조성물을 건조를 통해 수분을 제거한 후, 원하는 형상의 금형이 장착된 사출성형기에서 용이하게 제품을 성형할 수 있다.After the resin composition is dried to remove moisture, the product may be easily molded in an injection molding machine equipped with a mold having a desired shape.

이하, 본 발명을 상세하게 설명하면 다음과 같은 바, 본 발명이 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail as follows, but the present invention is not limited by the examples.

실시예 1∼6 및 비교예 1∼8Examples 1-6 and Comparative Examples 1-8

다음 표 1에 나타낸 바와 같은 조성 및 함량으로 3개의 투입구가 구비된 이축압축기를 사용하여 제 1 투입구에는 폴리아미드 수지, 이형제, 내열제 및 커플링제를 블렌딩하여 투입하고, 제 2 투입구에는 터프너를 혼합하여 정량 투입하며, 무기충전제는 제 3 투입구로 투입하였다.Next, using a twin-screw compressor having three inlets with the composition and content as shown in Table 1, the first inlet was blended with polyamide resin, a mold release agent, a heat-resistant agent, and a coupling agent, and a tufter was mixed with the second inlet. And the inorganic filler was added to the third inlet.

이러한 방법으로 나일론 6을 사용한 경우는 250℃로, 나일론 66을 사용한 경우는 280℃로 각각 이축압출기 내에서 용융 혼련하여 칩 상태로 제조한 다음, 이 칩을 90℃ 온도의 열풍건조기에서 5시간 동안 건조한 후, 나일론 6을 사용한 경우는 255℃에서, 나일론 66을 사용한 경우는 290℃로 가열된 스크류식 사출기를 사용하여 각각의 시편을 제작하였다.In this way, nylon 6 was used at 250 ° C., and nylon 66 was used at 280 ° C. for melt-kneading in a twin screw extruder, and the chips were prepared in a chip state. The chips were then heated in a hot air dryer at 90 ° C. for 5 hours. After drying, each specimen was prepared using a screw-type injection machine heated at 255 ° C. for nylon 6 and 290 ° C. for nylon 66.

이와같이 제조된 시편에 대하여 인장강도, 신도, 흐름성, 표면상태 및 충격강도를 측정하여 그 결과를 다음 표 2에 나타내었다.Tensile strength, elongation, flowability, surface state and impact strength of the specimens thus prepared were measured and the results are shown in Table 2 below.

이때, 인장강도 및 신도는 ASTM D-638에 의거 덤벨-1의 시편을 이용하여 측정하였고, 흐름성은 나일론 6을 사용하는 경우는 250℃, 나일론 66을 사용한 경우는 290℃에서 ASTD D-1238에 의거 용융지수로써 평가하였다.At this time, tensile strength and elongation were measured by using the specimen of Dumbbell-1 according to ASTM D-638, and the flowability was determined by using ASTD D-1238 at 250 ° C for nylon 6 and 290 ° C for nylon 66. Based on the melt index.

그리고, 표면상태는 육안으로 관찰하였으며, 충격강도는 ASTM D-256에 의거 측정하였다.The surface condition was visually observed and the impact strength was measured according to ASTM D-256.

폴리아미드 수지Polyamide resin 터프너(1) Toughener (1) 커플링제Coupling agent 무기충전제Inorganic filler 나일론 6Nylon 6 나일론 66Nylon 66 프로필렌 유도체(2) Propylene Derivatives (2) 실리콘 유도체(3) Silicone Derivatives (3) 탄산칼슘Calcium carbonate 활석talc 실시예Example 1One 100100 -- 25.025.0 0.50.5 1.01.0 3030 -- 22 100100 -- 10.010.0 1.01.0 1.01.0 4040 -- 33 100100 -- 15.015.0 1.01.0 2.02.0 2020 -- 44 -- 100100 15.015.0 0.50.5 0.50.5 -- 3030 55 -- 100100 20.020.0 1.01.0 1.01.0 -- 4040 66 -- 100100 10.010.0 1.01.0 2.02.0 -- 1010 비교예Comparative example 1One -- 100100 10.010.0 0.50.5 0.30.3 -- 3030 22 -- 100100 10.010.0 0.10.1 0.30.3 -- 3030 33 -- 100100 15.015.0 0.50.5 -- -- 3030 44 -- 100100 15.015.0 -- 0.30.3 -- 3030 55 -- 100100 25.025.0 0.50.5 0.30.3 -- 7070 66 -- 100100 15.015.0 0.50.5 7.07.0 -- 3030 77 -- 100100 35.035.0 0.50.5 0.50.5 -- 3030 88 -- 100100 20.020.0 8.08.0 0.30.3 -- 3030 (주)(1) 말레인산무수물이 0.5% 그라프트된 에틸렌-옥텐 공중합체, 비중 0.869, 용융지수 1.3G/10분, 듀퐁사 제품(2) 말레인산무수물이 0.5% 그라프트된 용융지수 100g/10분인 프로필렌 단중합체, EXXON CHEMICAL사 제품(3) H2N(CH2)3Si(CH3)2OSi(CH3)2(CH2)3NH2 (1) Ethylene-octene copolymer grafted with 0.5% maleic anhydride, specific gravity 0.869, melt index 1.3G / 10min, manufactured by DuPont (2) Melt index 100g / 10 with 0.5% maleic anhydride grafted Propylene homopolymer, manufactured by EXXON CHEMICAL Co., Ltd. (3) H 2 N (CH 2 ) 3 Si (CH 3 ) 2 OSi (CH 3 ) 2 (CH 2 ) 3 NH 2

인장강도(kg/㎠)Tensile Strength (kg / ㎠) 신도(%)Elongation (%) 용융지수(g/10분)Melt Index (g / 10min) 표면상태Surface condition 충격강도(kg·cm/cm)Impact strength (kgcm / cm) 실시예Example 1One 700700 1212 3030 양호Good 10.010.0 22 730730 1111 2525 양호Good 9.59.5 33 720720 1111 3535 양호Good 9.29.2 44 760760 1212 3434 양호Good 10.110.1 55 740740 1010 3737 양호Good 9.39.3 66 790790 1515 3131 양호Good 11.711.7 비교예Comparative example 1One 720720 77 3030 양호Good 5.25.2 22 580580 77 99 불량Bad 6.56.5 33 610610 88 88 불량Bad 7.67.6 44 620620 88 1010 불량Bad 6.86.8 55 900900 55 4040 불량Bad 8.18.1 66 555555 66 4545 불량Bad 9.19.1 77 530530 1717 2727 불량Bad 13.313.3 88 540540 88 4747 불량Bad 9.39.3

상기 표 2의 결과로부터 본 발명에서와 같이 폴리아미드 수지 100 중량부에 대하여 말레인산무수물이 0.5% 그라프트된 에틸렌-옥텐 공중합체를 터프너로 5∼30 중량부 첨가하고, 커플링제로서 실리콘 유도체와 그라프트된 프로필렌 공중합체를 혼합하여 0.5∼5.0 중량부 첨가한 폴리아미드 수지조성물은 인장강도, 신도, 충격강도 등이 우수하고 흐름성이 우수할 뿐만 아니라 표면상태도 양호함을 알 수 있다.From the results of Table 2, 5 to 30 parts by weight of an ethylene-octene copolymer having 0.5% of maleic anhydride grafted with a toughener was added to 100 parts by weight of the polyamide resin as in the present invention, and a silicone derivative as a coupling agent. It can be seen that the polyamide resin composition added by mixing 0.5 to 5.0 parts by weight of the grafted propylene copolymer has excellent tensile strength, elongation, impact strength, flowability, and surface condition.

그러나, 터프너, 커플링제, 무기충전제의 함량이 상기 범위를 벗어나는 경우나, 커플링제로 실리콘 유도체나 그라프트된 프로필렌 공중합체 중에서 단독으로 사용할 경우에는 전반적으로 물성이 나쁨을 알 수 있다.However, when the content of the toughener, the coupling agent, the inorganic filler is out of the above range, or when used alone in the silicone derivative or grafted propylene copolymer as the coupling agent, it can be seen that the overall physical properties are poor.

이상에서 상세히 설명한 바와 같이, 본 발명에 따른 폴리아미드 수지조성물은 무기충전제의 분산성을 향상시킬 뿐만 아니라 수지 자체의 흐름성을 증진시켜 무기물의 표면표출을 막아 표면상태가 양호하며, 또한 커플링제를 적절히 혼합하여 사용함으로써 수지와 무기충전제 사이의 접착력을 향상시켜 수지자체의 터프니스를 증진시킴으로써 기계적 물성, 특히 충격강도의 상승효과를 얻을 수 있다.As described in detail above, the polyamide resin composition according to the present invention not only improves the dispersibility of the inorganic filler, but also improves the flowability of the resin itself, thereby preventing the surface expression of the inorganic material, and also has a good surface state. By using it properly mixed, the adhesive force between the resin and the inorganic filler can be improved to enhance the toughness of the resin itself, thereby obtaining a synergistic effect of mechanical properties, particularly impact strength.

Claims (3)

폴리아미드 수지 100 중량부, 무기충전제 10∼60 중량부, 말레인산무수물이 0.5% 그라프트된 에틸렌-옥텐 공중합체 5∼30 중량부, 및 커플링제 0.5∼5.0 중량부로 이루어진 폴리아미드 수지조성물.A polyamide resin composition comprising 100 parts by weight of a polyamide resin, 10 to 60 parts by weight of an inorganic filler, 5 to 30 parts by weight of an ethylene-octene copolymer 0.5% grafted with maleic anhydride, and 0.5 to 5.0 parts by weight of a coupling agent. 제 1 항에 있어서, 상기 그라프트된 에틸렌-옥텐 공중합체는 비중이 0.869이며, 용융지수가 1.3g/10분 인 것임을 특징으로 하는 폴리아미드 수지조성물.The polyamide resin composition according to claim 1, wherein the grafted ethylene-octene copolymer has a specific gravity of 0.869 and a melt index of 1.3 g / 10 minutes. 제 1 항에 있어서, 상기 커플링제는 용융지수가 100g/10분인 말레인산무수물이 0.5% 그라프트된 프로필렌 단중합체와 다음 화학식 1로 표시되는 실리콘 유도체의 혼합물인 것임을 특징으로 하는 폴리아미드 수지조성물.The polyamide resin composition according to claim 1, wherein the coupling agent is a mixture of a propylene homopolymer having 0.5% grafted maleic anhydride having a melt index of 100 g / 10 minutes and a silicone derivative represented by the following Chemical Formula 1. 화학식 1Formula 1 H2N(CH2)3Si(CH3)2OSi(CH3)2(CH2)3NH2 H 2 N (CH 2 ) 3 Si (CH 3 ) 2 OSi (CH 3 ) 2 (CH 2 ) 3 NH 2
KR1019970066621A 1997-12-08 1997-12-08 Polyamide Resin Composition KR100477425B1 (en)

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KR100648807B1 (en) * 2001-12-29 2006-11-23 주식회사 코오롱 Polyamide resin composition reinforced with mineral
KR100658450B1 (en) * 2001-09-19 2006-12-15 주식회사 코오롱 Polyamide resin composition
CN116102882A (en) * 2022-12-22 2023-05-12 沈阳工业大学 Low-temperature high-toughness low-water-absorption bio-based PA56 alloy and preparation method thereof

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JP2678615B2 (en) * 1988-04-28 1997-11-17 東燃化学株式会社 Fiber reinforced polymer composition
JPH01311146A (en) * 1988-06-09 1989-12-15 Tonen Sekiyukagaku Kk Thermoplastic resin composition
JPH06166780A (en) * 1992-09-30 1994-06-14 Tonen Chem Corp Fiber-reinforced resin composition
KR0134305B1 (en) * 1994-06-20 1998-04-20 하기주 Fiber reinforced folyamid resin composition
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KR100648807B1 (en) * 2001-12-29 2006-11-23 주식회사 코오롱 Polyamide resin composition reinforced with mineral
CN116102882A (en) * 2022-12-22 2023-05-12 沈阳工业大学 Low-temperature high-toughness low-water-absorption bio-based PA56 alloy and preparation method thereof
CN116102882B (en) * 2022-12-22 2023-10-13 沈阳工业大学 Low-temperature high-toughness low-water-absorption bio-based PA56 alloy and preparation method thereof

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