KR100189791B1 - Polyimide resin composition - Google Patents

Polyimide resin composition Download PDF

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KR100189791B1
KR100189791B1 KR1019940035648A KR19940035648A KR100189791B1 KR 100189791 B1 KR100189791 B1 KR 100189791B1 KR 1019940035648 A KR1019940035648 A KR 1019940035648A KR 19940035648 A KR19940035648 A KR 19940035648A KR 100189791 B1 KR100189791 B1 KR 100189791B1
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resin composition
polyamide resin
weight
nylon
titanate
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KR960022839A (en
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신문철
고동휘
이재영
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구광시
주식회사코오롱
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/35Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/353Five-membered rings
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/521Esters of phosphoric acids, e.g. of H3PO4
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/56Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/14Glass
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    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02Polyalkylene oxides
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28Non-macromolecular organic substances
    • C08L2666/36Nitrogen-containing compounds
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28Non-macromolecular organic substances
    • C08L2666/40Phosphorus-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28Non-macromolecular organic substances
    • C08L2666/52Metal-containing compounds

Abstract

본 발명은 무기물이 첨가된 폴리아미드 수지조성물에 관한 것으로, 폴리아미드 수지에 인산 유도체와 옥시에틸렌 공중합체를 혼합 첨가하여 무기물의 분산을 향상시키고, 티타네이트계 커플링제를 사용하여 수지와무기물 사이의 접착력을 향상시키고 또한 옥사졸린 화합물을 부가하여 수지자체의 강인성을 증진시켜 기계적 물성 특히 충격강도를 크게 향상시키고 뿐만 아니라 표면도 우수한 폴리아미드 수지조성물에 관한 것이다.The present invention relates to a polyamide resin composition to which an inorganic substance is added, and improves dispersion of the inorganic substance by mixing and adding a phosphate derivative and an oxyethylene copolymer to the polyamide resin, and between the resin and the inorganic substance using a titanate coupling agent. The present invention relates to a polyamide resin composition which improves adhesion and also improves the toughness of the resin itself by adding an oxazoline compound to greatly improve mechanical properties, particularly impact strength.

Description

폴리아미드 수지조성물Polyamide Resin Composition

본 발명은 무기물이 첨가된 폴리아미드 수기조성물에 관한 것으로, 더욱 상세하게는 폴리아미드 수지에 인산 유도체와 옥시에틸렌 공중합체를 혼합 첨가하여 무기물의 분산을 향상시키고, 티타네이트계 커플링제를 사용하여 수지와 무기물 사이외 접착럭을 향상시키고 또한 옥사졸린 화합물을 부가하여 수지자체의 강인성을 증진시켜 기계적 물성 특히 충격강도를 크게 향상시키고 뿐만 아니라 표면도 우수한 폴리아미드 수지조성물에 관한 것이다.The present invention relates to a polyamide aqueous composition to which an inorganic substance is added, and more particularly, a mixture of a phosphoric acid derivative and an oxyethylene copolymer is added to a polyamide resin to improve dispersion of the inorganic substance, and a resin using a titanate coupling agent. The present invention relates to a polyamide resin composition which improves the mechanical properties, particularly impact strength, and improves the toughness of the resin itself by improving the adhesion between the inorganic material and the inorganic material and adding an oxazoline compound.

고분자 물질에다 무기충전제를 첨가함으로써 굴곡강도와 치수안정성, 열변형온도 등의 기계적, 열적성질이 뛰어 난 새로운 고분자조성물을 제조할 수 있다는 것은 이미 잘 알려진 사실이다.It is well known that the addition of inorganic fillers to polymer materials can produce new polymer compositions with excellent mechanical and thermal properties such as flexural strength, dimensional stability, and thermal deformation temperature.

일반적으로, 플라스틱 제품을 실제로 사용할 때 그 제품의 신용도를 보장하기 위해서는 강도와 내크리프성, 내충격성의 인자가 필요하며, 그중에서도 특히 내충격성은 무기물 강화 물질에 있어서 갖추어야 할 가장 중요한 인자 중의 하나이다.In general, when the plastic product is actually used, the factor of strength, creep resistance, and impact resistance is required to ensure the credibility of the product, and in particular, the impact resistance is one of the most important factors for the inorganic reinforcing material.

무기물이 첨가된 고분자 조성물에 충격이 가해지면 무기충전제가 충격을 분산시키기 보다는 힘을 집중시키기 때문에 고분자물질과 무기충전제간의 접착이 불량하게 되고, 특히 무기충전제가 응집되어 있는 부분은 충격에 대하여 취약으로 작용하게 되는 문제점이 있었다.When an impact is applied to the polymer composition to which the inorganic material is added, the inorganic filler concentrates the force rather than disperse the impact, so that the adhesion between the polymer material and the inorganic filler is poor, and in particular, the aggregated portion of the inorganic filler is vulnerable to impact. There was a problem working.

이와 같은 이유로, 무기물이 충전되어 있는 폴리아미드 수지조성물을 제조함에 있어서도 폴리아미드와 무기충전제의 접착성이 불량하고 내충격성이 저하되는 문제점이 발생하였는 바, 근래에는 이러한 문제점을 해결하기 위하여 폴리아미드와 무기충전제간의 접착력과 무기충전제의 분산성을 향상시키는데 관심과 노력이 집중되어 왔다.For this reason, in the production of a polyamide resin composition filled with inorganic substances, there is a problem in that the adhesion between the polyamide and the inorganic filler is poor and the impact resistance is lowered. Interest and efforts have been focused on improving the adhesion between the inorganic fillers and the dispersibility of the inorganic fillers.

미국특허 제3, 419, 517 호에서는 사일렌계 커프링제를 사용하여 무기물과 폴리아미드 수지간의 접착력을 향상시켜 폴리아미드 수지조성물의 기계적 물성을 향상시키는 방법을 제안하고 있다.US Patent No. 3, 419, 517 proposes a method of improving the mechanical properties of a polyamide resin composition by improving the adhesive force between an inorganic material and a polyamide resin using a xylene-based cuffing agent.

그러나 이 경우 유리섬유를 무기물로 사용하는 경우에는 만족할 만한 결과를 얻을 수 있었지만, 점토나 탈크, 탄산칼슘 등을 사용하는 경우에는 만족할 만한 결과를 얻을 수 없었다.However, in this case, satisfactory results were obtained when glass fiber was used as an inorganic material, but satisfactory results were not obtained when clay, talc, calcium carbonate, and the like were used.

또한 미국특허 제3, 988, 287 호, 제4, 336, 301 호 등에서는 사일렌계 커프링제와 함께 글리시딜메타크릴레이트 및 글리시딜아릴레이트와 같은 에폭시 함유 화합물을 함께 사용하는 방법을 제안하고 있으나, 무기충전제를 이러한 물질로 먼저 가공하여 사용하여야 하는 공정상의 복잡한 문제가 있었다.In addition, US Patent Nos. 3, 988, 287, 4, 336, 301 and the like propose a method of using an epoxy-containing compound such as glycidyl methacrylate and glycidyl arylate together with a silylene-based cuffing agent. However, there was a complicated problem in the process that the inorganic filler must first be processed into such a material.

그리고, 상기 예시된 미국특허들은 모두 무기충전제와 폴리아미드 사이의 접착력만을 향상시켰을 뿐 충격강도 증진의 중요한 요인인 분산성 및 수지자체의 강인성에 대해서는 고려를 하지 않고 있다.In addition, the above-described US patents all improve only the adhesion between the inorganic filler and the polyamide, but do not consider dispersibility and toughness of the resin itself, which are important factors in improving impact strength.

따라서 본 발명자는 무기충전제의 분산성 향상과 고분자 수지의 강인성 증진에 연구를 집중하여 기계적물성 특히 충격강도를 크게 향상시키고 표면상태도 양호한 폴리아미드 수지조성물을 종래보다 단순한 제조방법으로 개발하여 본 발명을 완성하였다.Therefore, the present inventors concentrated their research on improving dispersibility of inorganic fillers and toughness of polymer resins, and greatly improved mechanical properties, particularly impact strength, and developed a polyamide resin composition having a good surface state by a simpler manufacturing method than before. Completed.

이와 같이 종래의 단점을 해결하기 위하여 창안된 본 발명에 따른 폴리아미드 수지조성물은 분산제로 인산 유도체와 옥시에틸렌 공중합체를 혼합 사용하여 무기물의 분산성 향상 뿐만 아니라 수지 자체의 흐름성을 증진시켜 무기물의 표면표출을 막아 표면상태가 양호하며, 또한 사용한 티타네이트계 커플링제는 수지와 무기물 사이의 접착력을 향상시키고, 이와 더불어 사용한 옥사졸린 화합물 역시 수지자체의 강인성을 증진시켜 기계적물성 특히 충격강도의 상승효과를 보여주는 특징이 있다.Thus, the polyamide resin composition according to the present invention, which was devised to solve the disadvantages of the prior art, by using a phosphoric acid derivative and an oxyethylene copolymer as a dispersant, improves the dispersibility of the inorganic material as well as improves the flowability of the resin itself. The surface state is good by preventing surface expression, and the used titanate coupling agent improves the adhesion between the resin and the inorganic material, and the used oxazoline compound also enhances the toughness of the resin itself, thereby increasing the mechanical properties, particularly impact strength. There is a feature to show.

이하, 본 발명을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail.

본 발명은 무기물이 첨가된 폴리아미드 수지조성물에 있어서, 폴리아미드 수지에 대하여 무기충전제 5∼60 중량%, 옥사졸린 0.2∼5.0 중량%, 네오알콕시디옥틸피로포스페이트 티타네이트 0.02∼3.0 중량%, 폴리옥시에틸렌글리콜 0.05∼5.0 중량%, 인산유도체 0.05∼5.0 중량%로 이루어진 것을 특징으로 하는 폴리아미드 수지조성물에 관한 것이다.In the polyamide resin composition to which the inorganic substance is added, the inorganic filler is 5 to 60% by weight of inorganic filler, 0.2 to 5.0% by weight of oxazoline, 0.02 to 3.0% by weight of neoalkoxydioctylpyrophosphate titanate, poly The present invention relates to a polyamide resin composition comprising 0.05 to 5.0% by weight of oxyethylene glycol and 0.05 to 5.0% by weight of a phosphoric acid derivative.

이하, 본 발명을 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail.

본 발명에 있어서, 폴리아미드 수지로는 지방족 또는 방향족 폴리아미드 수지를 사용할 수 있는데, 특히 이 중에서 지방족 폴리아미드 수지, 예를 들면 나일론6, 나일론66, 나일론6, 10, 나일론6, 12, 나일론11 및 나일론12 중에서 어느 하나를 선택하여 사용하는 것이 좋다.In the present invention, as the polyamide resin, an aliphatic or aromatic polyamide resin can be used, and in particular, an aliphatic polyamide resin such as nylon 6, nylon 66, nylon 6, 10, nylon 6, 12, nylon 11 And nylon 12 may be selected and used.

또한 무기충전제는 점토, 활석, 탄산칼슘, 실리카, 운모 등의 비섬유상 무기물을 단독으로 사용하거나, 또는 둘 이상을 혼합하여 사용할 수 있으며, 그 함량은 폴리아미드 수지에 대하여 5∼60 중량%가 적당하다.In addition, the inorganic filler may be used alone or mixed with two or more non-fibrous inorganic materials such as clay, talc, calcium carbonate, silica, mica, and the content thereof is 5 to 60% by weight with respect to the polyamide resin. Do.

무기충전제의 함량을 5 중량% 미만으로 사용할 경우 기계적, 열적 성질의 향상을 기대하기 어렵고, 60 중량%를 초과 사용할 경우 제조된 성형질품의 표면이 나쁘고, 충격강도가 부족하여 깨어질 우려가 있다.When the content of the inorganic filler is less than 5% by weight, it is difficult to expect improvement in mechanical and thermal properties, and when the content of the inorganic filler is used in excess of 60% by weight, the surface of the manufactured product is bad and there is a risk of breaking due to insufficient impact strength.

본 발명에서 분산제는 다음 구조식(I)로 표시되는 옥시에틸렌 공중합체이다.In the present invention, the dispersant is an oxyethylene copolymer represented by the following structural formula (I).

상기 식에서 m은 10∼50 이다. m이 10 미만이면 휘발성이 강하여 가공시 가스가 많이 발생하고, 50을 초과하면 고른 분산을 얻기 어렵다.In the formula, m is 10 to 50. If m is less than 10, the volatility is high, and a lot of gases are generated during processing, and if it is more than 50, it is difficult to obtain even dispersion.

또한 사용하는 함량은 나일론 수지 자체에 대하여 0.05∼5.0 중량%정도가 적합한 바, 만약 사용량이 0.05 중량% 미만이면 원하는 분산성 향상을 얻기 어렵고, 5.0 중량%를 초과하면 분산제의 열분해에 의한 물성 저하가 발생하고, 제조원가가 상승하기 때문에 이 이상 투입할 필요가 없다.In addition, the content to be used is about 0.05 to 5.0% by weight with respect to the nylon resin itself, if the amount is less than 0.05% by weight it is difficult to achieve the desired dispersibility improvement, if the content exceeds 5.0% by weight of the physical property degradation due to thermal decomposition of the dispersant Generated, and manufacturing costs rise, so there is no need to inject more.

그리고 사용한 또 다른 분산제는 인산유도체로서 다음과 같은 구조를 가지고 있다.The other dispersant used was a phosphate derivative having the following structure.

상기 식에서 n은 2∼10이다. n이 10을 초과하는 경우는 분산제로서 역할이 떨어진다. 투입량은 나일론 수지에 대하여 0.05∼5.0 중량%가 적당한 바, 사용량이 0.05 중량% 미만이면 분산성 개선이 어렵고, 5.0 중량%를 초과하면 원가상승 및 수지의 물성저하가 일어난다. 이 두가지의 분산제를 동시에 사용하여야만 무기물의 분산성의 상승 효과를 볼 수 있고, 이와 더불어 우수한 표면을 얻을 수 있다.In the formula, n is 2 to 10. If n exceeds 10, the role of the dispersant is poor. Since the amount of the ethylene is 0.05 to 5.0% by weight with respect to the nylon resin, it is difficult to improve dispersibility when the amount is less than 0.05% by weight. Only when these two dispersants are used at the same time can see the synergistic effect of the dispersibility of the inorganic material, and can obtain an excellent surface.

또한, 수지 자체의 강인성 향상을 위하여 사용하는 옥사졸린 화합물은 다음과 같은 구조를 가지고 있다.In addition, the oxazoline compound used for improving the toughness of the resin itself has the following structure.

R: 2가의 유기기R: divalent organic group

ℓ: 0 또는 1의 정수ℓ: integer of 0 or 1

식 중의 수소윈자는 알킬기 또는 아릴기로 치환되어도 무방.The hydrogen winner in the formula may be substituted with an alkyl group or an aryl group.

이외 예로서는 1,3-페닐렌비스-2-옥사졸린, 2,2' -에틸렌비스(2-옥사졸린), 2, 2' 헥사메틸렌비스(2-옥사졸린), 2,2' -메틸렌비스(2-옥사졸린),2,2' -에틸렌비스(4-에틸-2-옥사졸린), 2,2' -비스(2-옥사졸린) 등이 사용될 수 있고, 함량은 나일론 수지에 대해서 0.2∼5.0 중량%가 바람직한바, 함량이 0.2 중량% 미만인 경우는 그 효과가 미미하며, 5.0 중량%를 초과하는 경우는 수지의 용융상태에서 말단의 카르복실기와 반응 후 미반응물이 남아 이것이 가공시 분해를 야기하여 물성 변화의 윈인으로 작용하게 된다.Other examples include 1,3-phenylenebis-2-oxazoline, 2,2'-ethylenebis (2-oxazoline), 2, 2 'hexamethylenebis (2-oxazoline), 2,2'-methylenebis (2-oxazoline), 2,2'-ethylenebis (4-ethyl-2-oxazoline), 2,2'-bis (2-oxazoline) and the like can be used, and the content is 0.2 for nylon resin. If the content is less than 0.2% by weight, the effect is insignificant. If the content is more than 5.0% by weight, unreacted substances remain after the reaction with the terminal carboxyl group in the molten state of the resin. It acts as a cause of change in physical properties.

그리고 본 발명에 사용한 커플링제는 유기티타네이트 화합물인 네오메톡시디옥틸피로포스페이트 티타네이트나 네오에톡시디옥틸피로포스페이트 티타네이트 중에서 어느 하나를 선택하여 사용하는 것이 바람직하며, 함량은 나일론 대비 0.02∼3.0 중량%가 좋다.In addition, the coupling agent used in the present invention is preferably selected from one of the organotitanate compound neomethoxy dioctyl pyrophosphate titanate and neoethoxy dioctyl pyrophosphate titanate, the content is 0.02 to 3.0 compared to nylon % By weight is good.

이와 같이 본 발명에 따른 수지조성물은 이축압출기를 이용하여 제조할 수 있는데, 수지조성물의 기계적 물성을 최대화하기 위하여 투입구가 2개 이상인 압출기를 사용하여 혼련하며, 1차 투입구에서는 나일론과 옥사졸린 화합물, 내열제, 이형제를 혼합하여 투입하고, 2차 투입구에는 분산제와 커플링제를 잘 혼련하여 투입하고, 무기물은 통상의 필러 투입구로 투입하는 것이 가장 바람직하다.As described above, the resin composition according to the present invention may be manufactured using a twin screw extruder. In order to maximize the mechanical properties of the resin composition, the resin composition is kneaded using an extruder having two or more inlets. In the first inlet, nylon and oxazoline compounds, It is most preferable to mix | blend a heat resistant agent and a mold release agent, and to mix | blend a dispersing agent and a coupling agent well in a secondary inlet, and to put an inorganic substance in a normal filler inlet.

또한 본 발명에 따른 목적을 손상하지 않는 범위내에서 이형제, 열안정제, 내후제, 난연제, 대전방지제 등의 첨가제를 필요에 따라 적절히 배합할 수 있다. 이렇게 제조되어진 수지조성물은 건조를 통해 수분을 제거한 후, 원하는 모양의 금형이 장착된 사출성형기에서 용이하게 제품을 성형할 수 있다.Moreover, additives, such as a mold release agent, a heat stabilizer, a weathering agent, a flame retardant, an antistatic agent, can be mix | blended suitably as needed in the range which does not impair the objective which concerns on this invention. The resin composition thus prepared can be easily molded in an injection molding machine equipped with a mold of a desired shape after removing moisture through drying.

이하, 본 발명을 실시예 및 비교예에 의거하여 더욱 상세하게 설명하면 다음과 같은 바, 본 발명이 실시예에 의해 한정되는 것은 아니다. 그에 따라 제조된 수지조성물은 다음과 같은 평가 방법에 의거, 평가하였다.Hereinafter, the present invention will be described in more detail based on Examples and Comparative Examples as follows, but the present invention is not limited by the Examples. The resin composition thus prepared was evaluated based on the following evaluation method.

[측정항목][Metric]

1. 인장강도: ASTM D-638에 의거해 덤벨-1의 시편을 이용해 측정하였다.1. Tensile strength: measured using a specimen of dumbbell-1 according to ASTM D-638.

2. 신 도: ASTM D-638에 의거해 딤벨-1의 시편을 이용해 측정하였다.2. Elongation: measured using a specimen of Dimbel-1 according to ASTM D-638.

3. 흐 름 성: 나일론6은 250℃, 나일론66은 290℃에서 ASTM D-1238에 의거 용융흐름지수(M. I.)를 평가하였다.3. Flowability: The melt flow index (M. I.) was evaluated according to ASTM D-1238 at 250 ° C for nylon 6 and 290 ° C for nylon 66.

4. 표 면: 육안 관찰하였다.4. Surface: Visual observation.

5. 충격강도: ASTM D-256에 의거해 평가하였다.5. Impact strength: evaluated according to ASTM D-256.

[ 실시예 1∼6, 비교예 1∼8 ][Examples 1-6, Comparative Examples 1-8]

나일론은 나일론6와 나일론66을 사용하였으며, 아래의 표1의 조성으로 3개의 투입구가 달려있는 이축압출기를 사용하여 제1투입구에는 나일론, 옥사졸린, 이형제, 내열제를 혼합하여 투입하고, 제2투입구에는 분산제와 커플링제를 혼합하여 정량 투입하고, 무기물은 제3투입구로 투입한다. 이러한 방법으로 나일론6은 250℃로 나일론66은 280℃로 각각 이축압출기내에서 용융 혼련하여 칩 상태로 제조한 다음, 이 칩을 90℃ 온도의 열풍건조기에서 5시간동안 건조한 후, 나일론6은 255℃, 나일론66은 290℃로 가열된 스크류식 사출기를 사용하여 각각의 시편을 제작, 위와 같은 측정방법으로 펑가했으며, 결과는 표2와 같다.Nylon 6 and Nylon 66 were used. The composition of Table 1 below used a twin screw extruder equipped with three inlets, and the first inlet was mixed with nylon, oxazoline, mold release agent, and heat-resistant agent. The inlet is mixed with a dispersant and a coupling agent in a fixed quantity, and the inorganic material is introduced into the third inlet. In this way, nylon 6 was melted and kneaded in a twin screw extruder at 250 ° C. and nylon 66 at 280 ° C., respectively, and the chip was dried in a hot air dryer at 90 ° C. for 5 hours, and then nylon 6 was 255. ℃ 66, nylon 66 was made by using a screw-type injection machine heated to 290 ℃, each specimen was prepared by the above measurement method, the results are shown in Table 2.

[표 1]TABLE 1

※ 위의 조성 모두 나일론 수지 대비 중랑%※ The above composition is middle% of nylon resin

1. 옥사졸린: EBO-2,2 -에틸렌비스(2-옥사졸린)1.Oxazoline: EBO-2,2-Ethylenebis (2-oxazoline)

MBO-2,2'-메틸렌비스(2-옥사졸린)MBO-2,2'-methylenebis (2-oxazoline)

2. 커플링제: NEPT-네오에톡시디옥틸피로포스페이트 티타네이트2. Coupling agent: NEPT-neoethoxydioctylpyrophosphate titanate

3. 분 산 제:3. Dispersant:

PG : 폴리옥시에틸렌글리콜(평균분자량: 1, 000)PG: Polyoxyethylene glycol (average molecular weight: 1,000)

PAPE : 인산펜틸에스터PAPE: Phenyl Phosphate

PAHE : 인산헵틸에스터PAHE: Phosphate Heptyl Ester

PAOE : 인산옥틸에스터PAOE: Octyl Phosphate

4. N-6 : 나일론64.N-6: Nylon 6

N-66 : 나일론66N-66: Nylon 66

표 2TABLE 2

Claims (3)

무기물이 첨가된 폴리아미드 수지조성물에 있어서, 폴리아미드 수지에 대하여 무기충전제 5∼60 중량%, 다음 구조식(I)로 표시되는 옥사졸린 0.2∼5.0 중량%, 네오알콕시디옥틸피로포스페이트 티타네이트 0.02∼3.0 중량%, 다음 구조식(II)로 표시되는 폴리옥시에틸렌글리콜 0.05∼5.0 중량%, 다음 구조식(III)으로 표시되는 인산유도체 0.05∼5.0 중량%로 이루어진 것을 특징으로 하는 폴리아미드 수지조성물.In the polyamide resin composition to which the inorganic substance is added, 5 to 60% by weight of inorganic filler, 0.2 to 5.0% by weight of oxazoline represented by the following structural formula (I), and neoalkoxydioctylpyrophosphate titanate relative to polyamide resin A polyamide resin composition comprising 3.0% by weight, 0.05 to 5.0% by weight of polyoxyethylene glycol represented by the following structural formula (II), and 0.05 to 5.0% by weight of the phosphate derivative represented by the following structural formula (III). (상기 식에서 R은 2가의 유기기, ℓ은 0 또는 1, m은 10~50, n은 2~10이다.(Wherein R is a divalent organic group, l is 0 or 1, m is 10-50, n is 2-10). 또한, 구조식 (I)에서 수소는 알킬리 또는 아릴기로 치환되어도 무방하다.)In the formula (I), hydrogen may be substituted with an alkyl or aryl group.) 제1항에 있어서, 무기충전제는 비섬유상의 점토, 활석, 운모, 타산칼슘 중에서 선택된 하나 또는 둘 이사의 혼합물임을 특징으로 하는 폴리아미드 수지조성물.The polyamide resin composition according to claim 1, wherein the inorganic filler is a mixture of one or two directors selected from non-fibrous clay, talc, mica and calcium carbonate. 제1항에 있어서, 네오알콕시디옥틸피로포스페이트 티타네이트는 네오메톡시디옥틸피로포스페이트 티타네이트 또는 네오에톡시디옥틸피로포스페이트 티타테이트 임을 특징으로 하는 폴리아미드 수지 조성물.The polyamide resin composition according to claim 1, wherein the neoalkoxydioctylpyrophosphate titanate is neomethoxydioctylpyrophosphate titanate or neoethoxydioctylpyrophosphate titanate.
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Publication number Priority date Publication date Assignee Title
KR20150037675A (en) * 2013-09-30 2015-04-08 코오롱인더스트리 주식회사 Polymer film
KR20150037676A (en) * 2013-09-30 2015-04-08 코오롱인더스트리 주식회사 Polymer film

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150037675A (en) * 2013-09-30 2015-04-08 코오롱인더스트리 주식회사 Polymer film
KR20150037676A (en) * 2013-09-30 2015-04-08 코오롱인더스트리 주식회사 Polymer film
KR102123625B1 (en) * 2013-09-30 2020-06-16 코오롱인더스트리 주식회사 Polymer film
KR102123626B1 (en) * 2013-09-30 2020-06-16 코오롱인더스트리 주식회사 Polymer film

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