KR19990016553A - Wafer Transfer Device - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer device, wherein a plurality of carrier guide portions for simultaneously guiding a plurality of wafer carriers are installed in correspondence with each wafer carrier, and a shock is simultaneously delivered to the wafer carrier by a predetermined external impact so that the wafer is transferred. By preventing the carriers from deviating from the correct position, when the carrier guide portion is realigned later, the carrier can be aligned more quickly, thereby reducing the realignment time of the carrier guide portion.

Description

Wafer transfer equipment

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer transfer apparatus, and more particularly, to a wafer transfer apparatus in which a carrier guide portion for guiding a plurality of wafer carriers at the same time can respectively guide a wafer carrier corresponding to a wafer carrier.

In general, with the development of science and technology in modern society, various electronic products are also developing. In particular, the development of semiconductors has been developed differently every day, and the development of semiconductor devices with ultra-high density has further developed the electronic communication industry and the multimedia era.

Such a semiconductor device having an ultra-high density is referred to as a collection of modern scientific technologies supported by circuit design technology, equipment technology, and process technology.

In particular, the remarkable development of modern science and technology has accelerated the development of semiconductor manufacturing equipment technology, and the development of this technology enables the mass production of semiconductors.

In addition, automation in the semiconductor manufacturing process has played a part in the semiconductor production of products.

For example, the wafers which have been subjected to the predetermined process are stored in the wafer carrier, the wafer carrier is guided to the carrier guide part again using a predetermined transfer means, and then the wafers in the wafer carrier are taken out again and transferred to the quartz boat. The process of transferring the quartz boat into the process chamber and carrying out a predetermined process is all performed automatically.

However, the carrier guide portion for guiding the carrier even with a predetermined vibration and a small impact from the outside would leave the set position in position and cause a defect of the product.

1 is a block diagram schematically showing the configuration of a wafer transfer apparatus according to the prior art.

As shown in the drawing, the wafer transfer apparatus interviews the loading unit 1 for loading a wafer carrier containing 25 wafers having completed the preceding process by using a predetermined transfer means, and interviews both sides of the loaded carrier. A carrier guide portion 10 and a pusher 2 positioned below the carrier guide portion 10 to push up the wafers in the carrier guided by the carrier guide portion 10 to a predetermined height in an upward direction, A charger 3 is placed on top of the carrier guide portion 10 to receive and transport the wafers pushed up by a predetermined height, and a quartz boat 4 to receive the wafers from the charger to be loaded into the process chamber. have.

At this time, the carrier guide unit 10 guides two carriers, which usually accommodate 25 wafers, where the structure of the conventional carrier guide unit is described in detail as follows.

2 is a plan view schematically showing a structure of a carrier guide part according to the related art.

As shown. Two wafer carriers 11 accommodating 25 wafers, which are spaced apart from each other by a predetermined interval, which have completed the preceding steps, are guided at predetermined intervals while corresponding to one side of the short axis length. In this case, generally, the lower surface of the carrier 11 accommodating the wafers is open to expose the edges of the wafers.

In addition, the carrier guide portion 10 includes a first carrier guide portion 12 and a second carrier guide portion 13 for simultaneously guiding two carriers while integrally interviewing both sides of the long axis length of each carrier. . At this time, the guide grooves 14 are formed in the first and second carrier guide portions 12 and 13 for interviewing both side surfaces of the long axis length to guide the carrier 11.

In addition, the alignment of the first and second carrier guide parts 12 and 13 is adjusted on the upper surfaces of the first carrier guide part 12 and the second carrier guide part 13 with the carrier 11 therebetween. Four alignment adjustment units 15 are provided, two in total, so that the alignment misses generated when the first and second carrier guide units 12 and 13 are displaced can be reset. .

Referring to the operation of the wafer transfer device of such a structure in more detail as follows.

First, wafers which have completed the preceding process are stored in slots of the carrier 11, respectively. At this time, 25 pieces are normally accommodated in one carrier 11.

Subsequently, the carrier 11 which accommodates the wafer by a predetermined transfer means is guided and loaded between the first carrier guide portion 12 and the second carrier guide portion 13 spaced apart by a predetermined distance.

Then, the pusher 2 located below the carrier guide part 10 places the wafers accommodated in the carrier 11 in the slot of the pusher 2 and then pushes the wafers upward by a predetermined height.

Subsequently, the charger 3 located above the carrier guide part 10 receives the wafers and receives the wafers into the slots of the quartz boat 4, and the quartz boat 4 is transferred into the process chamber where a predetermined process is performed. , The process proceeds.

However, the carrier guide part, which is correctly set, may be displaced from its position due to a certain vibration and external physical shock. In order to reset it, the operator may use the alignment adjusting part installed in the carrier guide part. Although the first carrier guide portion and the second carrier guide portion are aligned, the carrier guide portion guides the two carriers at the same time, and therefore, the carriers move all the time, which takes a long time to accurately align the carriers.

Accordingly, it is an object of the present invention to provide a wafer transfer apparatus in which two carriers are not affected at the same time even if the carrier guide portion for guiding the two carriers is out of position by an external impact.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram schematically showing the configuration of a wafer transfer apparatus according to the prior art.

2 is a plan view showing in more detail the carrier guide portion of FIG.

3 is a plan view showing a carrier guide of the present invention.

In order to achieve the above object, the present invention provides a wafer transfer device,

A wafer carrier guide unit for guiding the wafer carriers respectively corresponding to a plurality of wafer carriers arranged in a line at predetermined intervals from one end of the edge;

A pusher positioned under the wafer carrier guide to push the wafers upward by a predetermined height;

And a charger configured to receive the wafers positioned on the wafer carrier guide part and pushed up by a predetermined height and transfer the wafers to a predetermined position.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same parts as in the prior art are given the same signs.

3 is a plan view schematically showing the structure of a carrier guide unit according to an embodiment of the present invention.

As shown, the two wafers 11, which have been completed in the preceding process, spaced apart from each other by predetermined intervals, are guided by predetermined intervals while corresponding to one side of the short axis length. In this case, typically 25 wafers are accommodated in one carrier 11, and the lower surface of the carrier 11 accommodating the wafers is opened to expose the edges of the wafers.

Here, according to the present invention, the carrier guide portion 20 includes a first carrier guide portion 22 and a second carrier guide portion 23 for guiding and interviewing both side surfaces of the long axis lengths of the respective carriers 11, respectively. consist of. At this time, the guide grooves 24 are formed in the first and second carrier guide portions 22 and 23 for interviewing both side surfaces of the long axis length to guide the carrier 11.

In addition, the upper surface of the first carrier guide portion 22 and the second carrier guide portion 23 forming the carrier guide portion 20 for guiding each of the carriers 11 is aligned with the carrier guide portion 20. Two alignment adjusting portions 25 are provided, each of which has four alignment adjusting portions 25 installed in one carrier guide portion 20, and the first and second carrier guide portions 22 are provided. The misalignment occurring at the time of deviation of the position (23) can be realigned.

As described above, although the carrier guide part guides the two carriers at the same time, in the present invention, since the carrier guide parts are respectively installed and guided with respect to the two carriers, when the carrier guide part is released from the correct position due to external impact, At the same time, if the carrier guide portion is later realigned without being affected, the alignment can be performed sooner.

As described above, the present invention separates one carrier guide portion for guiding two wafer carriers into two and installs corresponding to each wafer carrier so that an impact is simultaneously delivered to the wafer carrier by a predetermined external impact, thereby providing a wafer carrier. By preventing them from deviating from the correct position, when realigning the carrier guide part in the future, the alignment can be performed more quickly, which reduces the realignment time of the carrier guide part, thereby increasing the productivity of the product. have.

Claims (3)

In the wafer transfer apparatus, A wafer carrier guide unit for guiding the wafer carriers respectively corresponding to a plurality of wafer carriers arranged in a line at predetermined intervals from one end of the edge; A pusher positioned under the wafer carrier guide to push the wafers upward by a predetermined height; And a charger positioned on the wafer carrier guide and accommodating the wafers pushed up by a predetermined height and transported to a predetermined position. The wafer transfer apparatus of claim 1, wherein an alignment control unit for adjusting alignment of the wafer carrier guide unit is included in a predetermined region of the upper surface of each wafer carrier guide unit. The wafer transfer apparatus of claim 2, wherein the alignment adjusting unit is disposed on the upper surface of the wafer carrier guide in a diagonal manner.