KR19990011647U - Semiconductor Wafer Carrying Cart - Google Patents

Abstract

The present invention relates to a cart (Cart) used in the semiconductor manufacturing process, and more particularly to a semiconductor wafer transport cart made possible to absorb vibration in order to transport the wafer, which is a semi-finished product of the semiconductor without damage. .

The present invention is to carry a wafer in a semi-finished state during the semiconductor manufacturing process to mount a plurality of carrier boxes containing a plurality of wafers to carry a large number of wafers at the same time, the carrier box or a tray containing the wafer By providing a shock absorbing member to the cart to the shock absorber to provide a semiconductor wafer transport cart made of at least the shock generated during transport can be blocked without being delivered to the wafer.

To this end, the present invention combines a mounting member capable of mounting a plurality of carrier boxes or trays on a trolley on which a caster is mounted via a wire rope shock absorber capable of absorbing shock in the vertical and horizontal directions, and a carrier on the mounting member. A cradle for mounting a box or tray is provided, and the mounting member is configured to be coupled to each other via a shock absorber.

Description

Semiconductor wafer transport cart.

The present invention relates to a cart (Cart) used in the semiconductor manufacturing process, and more particularly to a semiconductor wafer transport cart made possible to absorb vibration in order to transport the wafer, which is a semi-finished product of the semiconductor without damage. .

As is known, the process of manufacturing a semiconductor is very precise and requires a very clean space.

The semiconductor manufactures a wafer having a plurality of cells by integrating various semiconductor materials in a high density through a predetermined process on a base ceramic substrate.

This wafer requires a highly clean environment because it is made of highly compact elements, and it is necessary to thoroughly exclude surface damage caused by impacts and such efforts are continuing.

Semi-finished wafers, on the other hand, require spatial transfer in the manufacturing process, and the process of transferring them on an automated line or moving them from one line to another is essential.

In the transfer process, a tray in which several wafers can be inserted and a carrier box for protecting the tray are used.

Trays and carrier boxes are used to safely store or transport a large number of wafers, and when a shock is transmitted during the transfer of a carrier box in which such wafers are embedded, there is a risk of damaging the semiconductor product.

Despite such concerns, the transport of conventional wafers has primarily been dependent on trays and carrier boxes.

However, there is a problem in that the wafer shakes inside the tray, causing scratches on the surface, and at the same time, the problem is more serious because there is no proper transport means for transporting a plurality of carrier boxes.

The present invention is devised to solve such a conventional problem.

The object of the present invention is to provide a semiconductor wafer transport cart which is capable of transporting a large amount of wafers at the same time by carrying a plurality of carrier boxes in which a plurality of wafers are embedded in transporting semi-finished wafers during the semiconductor manufacturing process. .

In addition, the present invention is a semiconductor wafer carrying cart made of a buffer member to be installed in the carrier box or the tray on which the wafer is embedded so that the shock absorbing member can be blocked so that the impact generated at least during transportation can be blocked without being transferred to the wafer. To provide.

In addition, the present invention is to provide a semiconductor wafer carrying cart that can be mounted to the tray or carrier box in which the wafer is built inclined to prevent the wafer shake.

Therefore, the present invention provides a semiconductor wafer transport cart which is easy to transport a wafer, has a high transport efficiency, and can reduce a defect rate of a product by excluding a damage to a wafer that may occur during transport.

In order to realize the above object, the present invention combines a mounting member that can mount a plurality of carrier boxes or trays on a caster-mounted bogie through a wire rope shock absorber capable of absorbing shock in the vertical and horizontal directions. And a cradle for mounting a carrier box or a tray on the mounting member, and configured to be coupled to each other via a shock absorber in the mounting member.

1 is a schematic view showing a technical configuration of the present invention.

2 is a bogie configuration diagram as a basic embodiment of the present invention,

(a) is a plan view, (b) is a front view.

3 is a block diagram showing a first mounting member applied to the embodiment of FIG.

(a) is a planar state figure, (b) is a front state figure.

4 is an exploded perspective view illustrating a second mounting member applied to the embodiment of FIG. 2;

5 is an assembly configuration showing a cart according to the basic embodiment of the present invention.

Figure 6 is an assembly configuration showing a cart as another embodiment of the present invention.

Figure 7 is a perspective view showing a first mounting member as another embodiment of the present invention.

8 is an excerpt configuration diagram in which the second mounting member is coupled to the mounting member of FIG. 7;

(a) is a front view, (b) is a side view.

9 is an enlarged view illustrating main parts of FIG. 8;

10 is an assembly configuration showing a cart according to another embodiment of the present invention.

11 is a perspective view showing a wire rope shock absorber applied to the present invention.

Explanation of symbols on main parts of drawing

10: trolley 40, 40a, 40b: first mounting member

60, 60b: 2nd mounting member 67: support stand

S2: Shock Absorber S1: Wire Rope Shock Absorber

Hereinafter, the technical idea of the present invention will be described in detail with reference to the accompanying drawings.

Reference is made to the schematic diagram illustrating the technical configuration of the present invention in FIG. 1.

The semiconductor wafer transport cart of the present invention is roughly composed of a trolley 10, a first mounting member 40, a second mounting member 60, and a shock absorber S.

The first mounting member 40 is mounted on the trolley 10 with a shock absorber capable of absorbing shock therebetween, and the second mounting member 60 is a shock absorber capable of shock absorption on the first mounting member. It is mounted with the gap between.

With reference to Figures 2 to 5 looks at the basic embodiment of the present invention.

The trolley 10 is a bottom frame 11 made of a rectangular frame, and a handle (H) that is bent to the rear end of one side of the frame by bending the handle and mounts the caster 12 to the bottom of the bottom frame and the bottom The bracket 15 is welded to the inner four corners of the frame 11.

The first mounting member 40 coupled to the trolley 10 will be described.

The first mounting member 40 is configured to mount a plurality of carrier boxes or trays.

That is, a rectangular box is formed as a frame, and a rectangular box is formed in the upper portion of the cross section 41 for mounting the second mounting member 60 to be described later in the transverse direction between the frames to form a plurality of the lower four corners The inner side is constructed by welding the bracket 45 and the shock absorber cover 46 facing the bracket 15.

The transverse cross 41 is preferably formed as a cross between the inclined slope at a predetermined angle to prevent the damage caused by the shaking of the semiconductor wafer by mounting the second mounting member 60 to be described later.

Next, the second mounting member 60 will be described.

The second mounting member 60 is a bracket 61 in which the shock absorber mounting hole 61a is drilled at three places and bent at a right angle, and one end of the shock absorber S2 is screwed to the bracket, and the rest is bent at a right angle. (62) is provided by combining the other end of the bolt (65) passing through the shock absorber (S2) with a screw (66), but the support groove for mounting a carrier box or tray (68) on both ends of the support (62) Combining the support (67) having a screw (69) is configured to combine so that the support (62) performs a buffer function.

As described above, the bracket 15 of the trolley 10 is screwed with a conventional wire rope shock absorber S1, and a bracket of the first mounting member 40 is attached to an upper surface of the wire rope shock absorber S1. 45), the first mounting member 40 is cushionedly coupled to the trolley.

Meanwhile, the brackets 61 of the second mounting member 60 are screwed to the transverse sections 41 of the first mounting member 40, but the respective second mounting members 60 are spaced apart from each other by a proper distance. Independently, if possible. Reference numeral 47 denotes a memo case for storing a sliding roller for protecting against side impact of the first mounting member, 48 for a slidable table, and 49 for a memo about a wafer to be transported.

The present invention constituting the combined configuration as described above is based on the physical shock generated when the wafers mounted in the tray or carrier box containing a plurality of semiconductor wafers are respectively mounted on the second mounting member 60 to move. It acts to protect the wafer.

That is, the carrier grips the handle H in a state in which the tray or the carrier box is inserted into each of the second mounting members 60 in the support groove 68 formed in the support 67 of the support 62. Will be transported.

At this time, when the caster is caught by a contact with the ground or a small obstacle, the shock is generated, and thus it is blocked without being transferred to the semiconductor wafer by the shock absorber S2 formed on the wire rope buffer S1 and the second mounting member 60. .

The wire rope shock absorber S1 absorbs all of the front, rear left, right, and top and bottom vibrations so that the shock absorber may protect the first mounting member 40 from impact even if the shock is transmitted from any direction. By the shock transmission is blocked by the shock absorber (S2) the wafer acts to be safely transported from the impact.

Next, a description will be given of the technical configuration as another embodiment of the present invention described above.

As shown in Fig. 6, the frame 47 of the first mounting member 40a, which is fully buffered on the trolley 10, is formed step by step, and the transverse 41 is welded at each end to form a second frame on the transverse. The mounting member 60 is mounted step by step.

According to another embodiment of the present invention, since the second mounting member 60 is formed to be stepped, it is possible to obtain an effect of reducing spatial interference between at least each tray or carrier box.

On the other hand, look at the technical configuration of another embodiment of the present invention shown in Figure 7 to 10 as follows.

Since the structure of the trolley | bogie 10 differs only in the shape which bended the handle H, it abbreviate | omits description.

The first mounting member 40b welds a trapezoidal support member 50 through which the shock absorber mounting hole 51 is drilled, and a horizontal section 52 made of a square pipe at the lower portion of the support member, and is perpendicular to the horizontal section. A plurality of longitudinals 53 are formed by welding in a state spaced apart from each other.

The horizontal transverses 54 are welded to the lower ends of the vertical longitudinals 53, respectively, but the slopes 55 are welded to be inclined upward on one side of the upper side of the vertical longitudinals 53 and one side of the horizontal transverses 54, respectively.

In addition, the horizontal section 56 is welded so as to be connected between the vertical sections 53, and the trapezoidal support member 50a is formed by welding the buffer mounting holes 51 thereon, and the horizontal transverse sections at both ends. The support 54a, the bracket 57, and the shock absorber cover 58 are welded at both ends of the 54. As shown in FIG.

Next, the second mounting member 60b will be described.

The second mounting member 60b is coupled to the cross between the slopes 55 and consists of a bracket 70 of a flat plate in which the buffer mounting hole 71 is perforated, and a settable 73 bent at right angles. It is made by screwing the shock absorber (S2) between the stand and the bracket 70 and screwing the shock absorber (S2) between the above-described trapezoidal support member (50) to the upper side of the settlement.

According to another embodiment of the present invention, the upper and lower slopes 55 on both sides of the vertical section 53 are formed in Y-shapes to improve the mounting capacity of the carrier box or the tray, and the loading and unloading can be performed on both sides of the cart. Therefore, the transport capacity and workability are significantly improved.

Of course, the shock absorption as described above is formed between the wire rope shock absorber S1 and the first mounting member 40b and the second mounting member 60b formed between the bogie 10 and the first mounting member 40b. The same function by the shock absorber (S2).

The above-mentioned shock absorber S2 is most preferable when forming three points as a support point in consideration of shock absorption and balance maintenance.

The present invention as described in detail above has an effect of increasing the transport efficiency by carrying a cart for transporting a plurality of wafers in a tray or a carrier box at a time in carrying wafers produced during the semiconductor manufacturing process At the same time, by forming a shock absorber that absorbs the shock that may be generated during the transport over a second, it is possible to prevent damage to the wafer due to the transport shock to reduce the defective rate.

In addition, the present invention can be mounted inclined to one side in mounting the wafer in the cart to prevent the shaking due to the vibration generated during the transportation of the wafer to keep the wafer in a stable state, such as a practical design It is

Claims (7)

In forming a cart for carrying a tray or a carrier box carrying a semiconductor wafer, A bogie comprising a bottom frame made of a rectangular frame and a handle welded upright to one rear end of the frame and a caster coupled to the bottom of the bottom frame; A first mounting member positioned on an upper portion of the trolley and having a plurality of transverse spaces formed in a rectangular box shape to allow the carrier box or tray for receiving the wafer to be inclined upwardly; By providing a bracket bent at right angles and a right angled bent support for supporting the carrier box or tray and a plurality of second mounting member formed by coupling a shock absorbing shock absorber between the bracket and the support, The first mounting member is mounted on the four corners of the balance via the wire rope shock absorber for shock absorption. And the second mounting member is inclinedly coupled to be spaced apart from each other on the transverse sides of the first mounting member. 2. The first mounting member (40) according to claim 1, wherein the first mounting member (40) is formed in a rectangular box shape with a rectangular bar frame to enable a plurality of carrier boxes or trays to be mounted thereon, and the second mounting member in the transverse direction at the top of the frame (10). A plurality of transverse sections 41 for mounting 60 are welded, and a bracket 45 and a shock absorber cover 46 which face the bracket 15 on the bogie on the lower four corners are welded. A semiconductor wafer carrying cart. 2. The frame 47 of claim 1, wherein the frame 47 of the first mounting member 40a is formed stepped, and the transverse 41 is welded at each end to mount the second mounting member 60 stepwise on the transverse. A semiconductor wafer carrying cart, characterized in that made so that it can be. 4. The bracket 61 according to any one of claims 1 to 3, wherein one end of the shock absorber S2 is screwed into the bracket 61 and the bracket 61 is drilled at right angles and bent at right angles, and is perpendicular to the bracket. By providing the bent support 62 is coupled to the other end of the bolt 65 passing through the shock absorber (S2) with a screw 66, support for mounting a carrier box or tray on both ends of the support (62) And a second mounting member (60) in which the support (62) performs a cushioning function by engaging the support (67) having the groove (68) with the screw (69). 4. The semiconductor wafer transport cart according to any one of claims 1 to 3, wherein the transverse gap formed in said first mounting member comprises a slope transverse gap inclined to the front portion of the cart. The first mounting member 40b welds a trapezoidal support member 50 through which the shock absorber mounting hole 51 is drilled, and a horizontal section 52 made of a square pipe under the support member. A large number of vertical welds 53 are spaced apart from each other and welded horizontally. The horizontal transverse 54 is welded to the lower end of each vertical section 53, but the slopes 55 are respectively welded to be inclined upward on one side of the upper section of the vertical section 53 and one side of the horizontal cross section 54, The horizontal section 56 is welded so as to be connected between the vertical sections 53, and the trapezoidal support base 50a in which the buffer mounting hole 51 is perforated is welded on the upper section. A semiconductor wafer carrying cart, comprising: welding a support (54a), a bracket (57), and a shock absorber cover (58) at both ends. 7. The stabilizer according to claim 6, further comprising a bracket (70) of a flat plate that is coupled across the slope (55), and the buffer mounting hole (71) is perforated, and the support (73) bent at a right angle. And a second mounting member 60b formed by screwing the shock absorber S2 between the brackets 70 and screwing the shock absorber S2 between the trapezoidal support members 50 on one side of the seat. A semiconductor wafer transport cart.