KR19990002099A - Cd-free silver lead material and flux for it - Google Patents
Cd-free silver lead material and flux for it Download PDFInfo
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- KR19990002099A KR19990002099A KR1019970025626A KR19970025626A KR19990002099A KR 19990002099 A KR19990002099 A KR 19990002099A KR 1019970025626 A KR1019970025626 A KR 1019970025626A KR 19970025626 A KR19970025626 A KR 19970025626A KR 19990002099 A KR19990002099 A KR 19990002099A
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- silver
- silver lead
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
Abstract
본 발명은 은(Ag) 30 중량%와, 상기 구리(Cu) 35 중량%와, 상기 아연(Zn) 31.5 중량%와, 상기 니켈(Ni) 0.5 중량%와, 상기 인듐(In) 2.5 중량%와, 상기 주석(Sn) 0.5 중량%로 조성된 무 카드뮴(Cd-free) 은납재와 붕사(Na2B4O7) 19.0 중량%와, 붕산(H3BO3) 20.0 중량%와, 불화가리(KF) 34.0 중량%와, 불산(HF) 26.0 중량%와, 염화리튬(LiCl) 1.0 중량%로 조성된 무 카드뮴 은납재를 위한 플럭스에 관한 것으로서, 종래 기술의 카드뮴(Cd)을 포함한 은납재 및 플럭스와 동등하거나 더 우수한 접합 강도와 퍼짐성과 생산성을 가지면서 인체 및 환경에 나쁜 영향을 미치는 카드뮴(Cd) 성분을 전혀 포함하지 않기 때문에 카드뮴(Cd)에 의한 문제점을 근본적으로 해결하여 친환경 프로세스의 구축을 가능하게 하는 효과가 있다.The present invention is 30% by weight of silver (Ag), 35% by weight of copper (Cu), 31.5% by weight of zinc (Zn), 0.5% by weight of nickel (Ni), 2.5% by weight of indium (In) And 19.0 wt% of cadmium free (Cd-free) silver lead and borax (Na 2 B 4 O 7 ) composed of 0.5 wt% of tin (Sn), 20.0 wt% of boric acid (H 3 BO 3 ), and fluoride The present invention relates to a flux for cadmium-free silver lead composed of 34.0 wt% of girly (KF), 26.0 wt% of hydrofluoric acid (HF), and 1.0 wt% of lithium chloride (LiCl), including silver lead containing cadmium (Cd) of the prior art. Eco-friendly process by fundamentally solving the problem of cadmium (Cd) because it contains no cadmium (Cd) component which has the same or better bonding strength, spreading and productivity than ash and flux and adversely affects human body and environment. It has the effect of enabling the construction of.
Description
본 발명은 은납재 및 그를 위한 플럭스에 관한 것으로서, 특히 인체 및 환경에 유해한 카드뮴(Cd) 성분이 전혀 포함되지 않은 무 카드뮴 은납재 및 그를 위한 플럭스에 관한 것이다.The present invention relates to a silver lead material and a flux therefor, and more particularly, to a cadmium silver lead material and a flux therefor containing no cadmium (Cd) component harmful to humans and the environment.
일반적으로 은납재와 플럭스는 Cu+스틸(steel)에 대한 브레이징(brazing) 작업시 용가재(filler metal)로 사용된다.In general, silver and flux are used as filler metals for brazing operations on Cu + steel.
종래 기술에 의한 은납재는 은(Ag) 27.0 중량%와, 구리(Cu) 31.0 중량%와, 아연(Zn) 21.5 중량%와, 카드뮴(Cd) 20.5 중량%로 조성되어 있고, 플럭스는 붕사(Na2B4O7) 19.0 중량%와, 붕산(H3BO3) 15.0 중량%와, 불화가리(KF) 39.0 중량%와, 불산(HF) 26.5 중량%와, 염화리튬(LiCl) 0.5 중량%로 조성되어 있다.The silver lead material according to the prior art is composed of 27.0 wt% of silver (Ag), 31.0 wt% of copper (Cu), 21.5 wt% of zinc (Zn), and 20.5 wt% of cadmium (Cd), and the flux is borax (Na). 2 B 4 O 7 ) 19.0 wt%, 15.0 wt% boric acid (H 3 BO 3 ), 39.0 wt% Kali fluoride, 26.5 wt% hydrofluoric acid (HF), 0.5 wt% lithium chloride (LiCl) It is composed of.
상기 카드뮴(Cd)은 브레이징의 작업성을 좌우하는 핵심 성분으로서 은납재의 융점을 낮추고 유동성을 증가시키는 역할을 한다.The cadmium (Cd) is a key component that determines the workability of the brazing serves to lower the melting point of the silver lead material and increase the fluidity.
상기와 같이 조성된 종래 기술에 의한 은납재와 플럭스를 모재인 Cu+스틸에 소정량 도포한 후 토치(torch)에 의한 화염으로 모재의 용융 없이 용가재(은납재와 플럭스)를 녹이면 확산(diffusion)에 의하여 접합이 이루어지게 된다.After applying a predetermined amount of silver solder and flux according to the prior art composition to Cu + steel as a base material, and then dissolving the filler metal (silver solder and flux) without melting the base metal with a flame by a torch, it diffuses. Joining is made by.
그러나, 종래 기술에 의한 은납재에 포함된 카드뮴(Cd)은 그 자체의 융점(321.1℃)이 낮고 증기압이 높아 브레이징 작업시 쉽게 증발하기 때문에 인체 및 환경에 나쁜 영향을 미치는 문제점이 있었다.However, the cadmium (Cd) contained in the silver lead material according to the prior art has a problem that adversely affects the human body and the environment because its own melting point (321.1 ° C) is low and the vapor pressure is high to evaporate easily during brazing operation.
또한, 종래 기술에 의한 플럭스는 은납재에 대한 브레이징 작업시 모재(구리, 스틸)의 표면을 청정하게 하는 촉매 작용이 어렵기 때문에 퍼짐성이 떨어져서 접합부의 신뢰성 및 생산성을 저하시키는 문제점이 있었다.In addition, since the flux according to the prior art is difficult to catalyze the surface of the base material (copper, steel) during the brazing operation for the silver lead material, there is a problem in that the spreadability is poor and the reliability and productivity of the joint are lowered.
본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로서, 환경을 오염시키는 카드뮴(Cd)의 대체 원소로 인듐(In)을 사용함으로써 인체 및 환경에 무해한 무 카드뮴 은납재와, 상기 무 카드뮴 은납재의 조성 변경에 따라 그 조성이 적절하게 변경되어 퍼짐성 및 생산성 향상을 가능하게 하는 무 카드뮴 은납재를 위한 플럭스를 제공함에 그 목적이 있다.The present invention has been made to solve the above problems, by using indium (In) as an alternative element of cadmium (Cd) to pollute the environment harmless to the human body and the environment, and the cadmium silver lead-free material The purpose of the present invention is to provide a flux for cadmium-free silver lead material, which is appropriately changed according to the composition change, thereby enabling the spreadability and productivity to be improved.
상기와 같은 목적을 달성하기 위하여 본 발명에 의한 무 카드뮴 은납재는 은(Ag)과, 구리(Cu)와, 아연(Zn)과, 니켈(Ni)과, 인듐(In)과, 주석(Sn)으로 조성된 것을 특징으로 한다.In order to achieve the above object, the cadmium-free silver lead material according to the present invention is silver (Ag), copper (Cu), zinc (Zn), nickel (Ni), indium (In), tin (Sn) Characterized in that the composition.
본 발명에 의한 무 카드뮴 은납재는 실시예에 의하면 상기 은(Ag) 30 중량%와, 상기 구리(Cu) 35 중량%와, 상기 아연(Zn) 31.5 중량%와, 상기 니켈(Ni) 0.5 중량%와, 상기 인듐(In) 2.5 중량%와, 상기 주석(Sn) 0.5 중량%로 조성되는 것이 바람직하다.According to an embodiment of the present invention, the cadmium-free silver lead material includes 30 wt% of silver (Ag), 35 wt% of copper (Cu), 31.5 wt% of zinc (Zn), and 0.5 wt% of nickel (Ni). And, it is preferably composed of 2.5% by weight of the indium (In) and 0.5% by weight of the tin (Sn).
또한, 본 발명의 무 카드뮴 은납재를 위한 플럭스는 은(Ag)과, 구리(Cu)와, 아연(Zn)과, 니켈(Ni)과, 인듐(In)과, 주석(Sn)으로 조성된 무 카드뮴 은납재를 위한 플럭스(flux)에 있어서, 붕사(Na2B4O7) 19.0 중량%와, 붕산(H3BO3) 20.0 중량%와, 불화가리(KF) 34.0 중량%와, 불산(HF) 26.0 중량%와, 염화리튬(LiCl) 1.0 중량%로 조성된 것을 특징으로 한다.In addition, the flux for the cadmium-free silver lead material of the present invention is composed of silver (Ag), copper (Cu), zinc (Zn), nickel (Ni), indium (In), and tin (Sn). Flux for cadmium-free silver lead, comprising: 19.0 wt% of borax (Na 2 B 4 O 7 ), 20.0 wt% of boric acid (H 3 BO 3 ), 34.0 wt% of fluoride (KF), and hydrofluoric acid (HF) 26.0% by weight, and lithium chloride (LiCl) 1.0% by weight of the composition.
이하, 본 발명에 의한 무 카드뮴 은납재 및 그를 위한 플럭스의 바람직한 실시예를 상세하게 설명하면 다음과 같다.Hereinafter, a preferred embodiment of the cadmium-free silver lead and the flux therefor according to the present invention will be described in detail.
본 발명의 바람직한 실시예에 의한 무 카드뮴 은납재는 은(Ag) 30 중량%와, 구리(Cu) 35 중량%와, 아연(Zn) 31.5 중량%와, 니켈(Ni) 0.5 중량%와, 인듐(In) 2.5 중량%와, 주석(Sn) 0.5 중량%로 조성되어 있고, 상기 무 카드뮴 은납재를 위한 플럭스는 붕사(Na2B4O7) 19.0 중량%와, 붕산(H3BO3) 20.0 중량%와, 불화가리(KF) 34.0 중량%와, 불산(HF) 26.0 중량%와, 염화리튬(LiCl) 1.0 중량%로 조성되어 있다.Cadmium-free silver lead material according to a preferred embodiment of the present invention is 30% by weight of silver (Ag), 35% by weight of copper (Cu), 31.5% by weight of zinc (Zn), 0.5% by weight of nickel (Ni), indium ( In) 2.5 wt% and 0.5 wt% of tin (Sn), the flux for the cadmium-free silver lead material is 19.0 wt% of borax (Na 2 B 4 O 7 ), boric acid (H 3 BO 3 ) 20.0 It is comprised by weight%, 34.0 weight% of cupric fluoride (KF), 26.0 weight% of hydrofluoric acid (HF), and 1.0 weight% of lithium chloride (LiCl).
상기와 같이 조성된 본 발명의 바람직한 실시예와 종래 기술의 접합 강도, 퍼짐성 및 생산성을 비교 평가해 보면 아래 표 1과 같은 결과를 얻을 수 있다.Comparing and evaluating the bonding strength, spreadability and productivity of the prior art preferred embodiment of the present invention and composition as described above can obtain the results shown in Table 1 below.
[표 1]TABLE 1
상기에서 접합 강도는 유니버설 테스트 장비(universal testing machine)와 각각 15개의 시료를 이용하여 평가하였고, 퍼짐성은 은납재 시료(각각 3개)에 플럭스를 도포하여 동판 위에 놓고 일정 시간(3초) 동일하게 토치로 가열한 후 그 퍼진 면적을 측정하여 평가하였고, 생산성은 Cu+스틸의 브레이징 라인에서 근무하는 브레이징 작업자 2명을 랜덤 샘플링하여 평가하였으며, 상기 표 1에 기재된 생산성 측정치는 준비작업 시간이 포함된 것이다.In the above, the bond strength was evaluated by using a universal testing machine and 15 samples, and the spreadability was applied on the copper plate by applying flux to the silver solder samples (3 each), and the same time (3 seconds). After heating with a torch, the spread area was measured and evaluated. The productivity was evaluated by random sampling of two brazing workers working on the brazing line of Cu + steel, and the productivity measurement shown in Table 1 includes preparation time. .
상기 표 1의 결과에서 알 수 있듯이 본 발명의 바람직한 실시예에 의한 무 카드뮴 은납재와 플럭스는 종래 기술의 카드뮴(Cd)을 포함한 은납재와 플럭스에 비해 동등하거나 더 우수한 접합 강도와 퍼짐성과 생산성을 가지므로 종래 기술과 마찬가지로 Cu+스틸의 용가재로 적합한 동시에 카드뮴(Cd)에 의한 문제점을 근본적으로 해결할 수 있어 친환경(환경에 무해한) 프로세스의 구축을 가능하게 한다.As can be seen from the results of Table 1, the cadmium-free silver lead and the flux according to the preferred embodiment of the present invention have the same or better bond strength, spreadability and productivity than the silver lead and the flux including the cadmium (Cd) of the prior art. Since it is suitable as a filler material for Cu + steel as in the prior art, it is possible to fundamentally solve the problem caused by cadmium (Cd), thereby enabling the construction of an environment-friendly (environmental harmless) process.
이와 같이 본 발명은 종래 기술의 카드뮴(Cd)을 포함한 은납재 및 플럭스와 동등하거나 더 우수한 접합 강도와 퍼짐성과 생산성을 가지면서 인체 및 환경에 나쁜 영향을 미치는 카드뮴(Cd) 성분을 전혀 포함하지 않기 때문에 카드뮴(Cd)에 의한 문제점을 근본적으로 해결하여 친환경 프로세스의 구축을 가능하게 하는 효과가 있다.As such, the present invention does not include any cadmium (Cd) component which has a bonding strength, spreadability and productivity that is equal to or better than that of the silver solder and flux including cadmium (Cd) of the prior art and which adversely affects the human body and the environment. Therefore, there is an effect to fundamentally solve the problems caused by cadmium (Cd) to enable the construction of environmentally friendly processes.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970025626A KR100246229B1 (en) | 1997-06-19 | 1997-06-19 | Cd-free ag solder and flux |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970025626A KR100246229B1 (en) | 1997-06-19 | 1997-06-19 | Cd-free ag solder and flux |
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| KR19990002099A true KR19990002099A (en) | 1999-01-15 |
| KR100246229B1 KR100246229B1 (en) | 2000-04-01 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100605556B1 (en) * | 2004-10-28 | 2006-08-21 | 삼영기계(주) | Fulx and Method for Joining Dissimilar Metals |
| CN104907724A (en) * | 2015-05-25 | 2015-09-16 | 郑州机械研究所 | Reed-type environment-friendly coated silver brazing filler metal ring |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10319888A1 (en) | 2003-04-25 | 2004-11-25 | Siemens Ag | Solder material based on SnAgCu |
| KR100992441B1 (en) | 2008-11-07 | 2010-11-05 | (주)에이치케이툴스 | The manufacturing method of flux and the flux, BTA drill |
| KR101157494B1 (en) | 2010-08-25 | 2012-06-20 | 부산대학교 산학협력단 | Filler metal alloy composition |
| KR101231550B1 (en) * | 2012-07-30 | 2013-02-07 | (주)알코마 | Cu-p-ag-zn brazing alloy |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4315189C1 (en) * | 1992-09-02 | 1994-04-07 | Degussa | Use of a cadmium-free silver alloy as a hard solder |
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1997
- 1997-06-19 KR KR1019970025626A patent/KR100246229B1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100605556B1 (en) * | 2004-10-28 | 2006-08-21 | 삼영기계(주) | Fulx and Method for Joining Dissimilar Metals |
| CN104907724A (en) * | 2015-05-25 | 2015-09-16 | 郑州机械研究所 | Reed-type environment-friendly coated silver brazing filler metal ring |
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| KR100246229B1 (en) | 2000-04-01 |
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