KR19980087533A - - Google Patents

Info

Publication number
KR19980087533A
KR19980087533A KR19980020041A KR19980020041A KR19980087533A KR 19980087533 A KR19980087533 A KR 19980087533A KR 19980020041 A KR19980020041 A KR 19980020041A KR 19980020041 A KR19980020041 A KR 19980020041A KR 19980087533 A KR19980087533 A KR 19980087533A
Authority
KR
South Korea
Application number
KR19980020041A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR19980087533A publication Critical patent/KR19980087533A/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR19980020041A 1997-05-30 1998-05-30 KR19980087533A (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9157939A JPH10335035A (ja) 1997-05-30 1997-05-30 Ｂｇａ−ｉｃ用測定機構

Publications (1)

Publication Number Publication Date
KR19980087533A true KR19980087533A (ko) 1998-12-05

Family

ID=15660781

Family Applications (1)

Application Number Title Priority Date Filing Date
KR19980020041A KR19980087533A (ko) 1997-05-30 1998-05-30

Country Status (3)

Country Link
US (1) US6373267B1 (ko)
JP (1) JPH10335035A (ko)
KR (1) KR19980087533A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100423157B1 (ko) * 2001-06-28 2004-03-16 동부전자 주식회사 웨이퍼 레벨 칩 스케일 패키지 테스트 장치

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11329648A (ja) * 1998-05-19 1999-11-30 Molex Inc Ｉｃデバイスソケット
US8584353B2 (en) * 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US20070020960A1 (en) * 2003-04-11 2007-01-25 Williams John D Contact grid array system
US7597561B2 (en) * 2003-04-11 2009-10-06 Neoconix, Inc. Method and system for batch forming spring elements in three dimensions
US20050120553A1 (en) * 2003-12-08 2005-06-09 Brown Dirk D. Method for forming MEMS grid array connector
US7758351B2 (en) * 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
US6916181B2 (en) * 2003-06-11 2005-07-12 Neoconix, Inc. Remountable connector for land grid array packages
US7628617B2 (en) * 2003-06-11 2009-12-08 Neoconix, Inc. Structure and process for a contact grid array formed in a circuitized substrate
US7056131B1 (en) 2003-04-11 2006-06-06 Neoconix, Inc. Contact grid array system
US7114961B2 (en) * 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US7244125B2 (en) * 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US7113408B2 (en) * 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US6869290B2 (en) * 2003-06-11 2005-03-22 Neoconix, Inc. Circuitized connector for land grid array
US7070419B2 (en) * 2003-06-11 2006-07-04 Neoconix Inc. Land grid array connector including heterogeneous contact elements
US7009413B1 (en) * 2003-10-10 2006-03-07 Qlogic Corporation System and method for testing ball grid arrays
US20050227510A1 (en) * 2004-04-09 2005-10-13 Brown Dirk D Small array contact with precision working range
US7025601B2 (en) * 2004-03-19 2006-04-11 Neoconix, Inc. Interposer and method for making same
US7347698B2 (en) 2004-03-19 2008-03-25 Neoconix, Inc. Deep drawn electrical contacts and method for making
WO2005091998A2 (en) * 2004-03-19 2005-10-06 Neoconix, Inc. Electrical connector in a flexible host
US20050205988A1 (en) * 2004-03-19 2005-09-22 Epic Technology Inc. Die package with higher useable die contact pad area
US7090503B2 (en) * 2004-03-19 2006-08-15 Neoconix, Inc. Interposer with compliant pins
US20060000642A1 (en) * 2004-07-01 2006-01-05 Epic Technology Inc. Interposer with compliant pins
US7354276B2 (en) * 2004-07-20 2008-04-08 Neoconix, Inc. Interposer with compliant pins
US7259581B2 (en) * 2005-02-14 2007-08-21 Micron Technology, Inc. Method for testing semiconductor components
US20070050738A1 (en) * 2005-08-31 2007-03-01 Dittmann Larry E Customer designed interposer
US7357644B2 (en) * 2005-12-12 2008-04-15 Neoconix, Inc. Connector having staggered contact architecture for enhanced working range
DE102006052112A1 (de) * 2006-11-06 2008-05-08 Robert Bosch Gmbh Elektrische Kontaktanordnung
US7872483B2 (en) 2007-12-12 2011-01-18 Samsung Electronics Co., Ltd. Circuit board having bypass pad
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5585162A (en) * 1995-06-16 1996-12-17 Minnesota Mining And Manufacturing Company Ground plane routing
US5691041A (en) * 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
US5702255A (en) * 1995-11-03 1997-12-30 Advanced Interconnections Corporation Ball grid array socket assembly
US5730606A (en) * 1996-04-02 1998-03-24 Aries Electronics, Inc. Universal production ball grid array socket
US5952840A (en) * 1996-12-31 1999-09-14 Micron Technology, Inc. Apparatus for testing semiconductor wafers
US5962921A (en) * 1997-03-31 1999-10-05 Micron Technology, Inc. Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps
US5931685A (en) * 1997-06-02 1999-08-03 Micron Technology, Inc. Interconnect for making temporary electrical connections with bumped semiconductor components
JPH1172534A (ja) * 1997-08-28 1999-03-16 Mitsubishi Electric Corp テスト端子付き半導体装置およびｉｃソケット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100423157B1 (ko) * 2001-06-28 2004-03-16 동부전자 주식회사 웨이퍼 레벨 칩 스케일 패키지 테스트 장치

Also Published As

Publication number Publication date
US6373267B1 (en) 2002-04-16
JPH10335035A (ja) 1998-12-18

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
J201 Request for trial against refusal decision
B601 Maintenance of original decision after re-examination before a trial
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20010413

Effective date: 20020530