KR19980086713A - Z-stage - Google Patents

Abstract

The mounting table is supported against the unbalanced load to prevent the mounting table from inclining.

On the mounting table 51 which directly or indirectly mounts the object, the board | substrate 52 which supports this mounting table 51, the several lifting mechanism part 53 which raises and lowers the mounting table 51 with respect to the board | substrate 52, and this several lifting mechanism part 53, respectively And a synchronous drive device 54 for driving these in synchronization with each other. Each elevating mechanism part 53 arranged the position which can distribute the load applied to the mounting base 51 to each lifting mechanism part 53. As shown in FIG.

Description

ＺStage

The present invention relates to a Z stage for use in conducting an operation test, a characteristic test, or the like of, for example, an IC wafer or a liquid crystal substrate, and in particular, a Z stage which eliminates the influence of an unbalanced load applied to an object. It is about.

Generally as a Z stage, the thing of the structure as shown in FIG. 2 is known. 1 in the figure is a substrate. The mounting base 2 is attached to this board | substrate 1 so that raising and lowering is possible. The mounting table 2 is elevated by the elevating mechanism 3, and the lifting movement is guided by the guide mechanism 4.

The elevating mechanism 3 includes a drive motor 5 attached to the center of the substrate 1, a transfer screw 6 attached to the drive motor 5 and rotated, and a screw attached to the feed screw 6 attached to the mounting table 2 and simultaneously transferred to the feed screw 6. It consists of the nut 7 which moves up and down by the rotation of.

The guide mechanism part 4 is comprised from the guide 8 attached to the board | substrate 1 side, and the guide shaft 9 attached to the mounting table 2 side, and fitted to the guide 8, and sliding. This guide mechanism part 4 is arrange | positioned in the circumference | surroundings of the lifting mechanism part 3, and supports this mounting base 2 from the circumference so that the mounting table 2 can be elevated up and down smoothly.

And the mounting stage 2 is integrated with the θ stage for rotating the object.

On the Z stage configured as described above, a probe 11 is attached to the mounting table 2 to perform an operation test of an IC wafer, a liquid crystal substrate, or the like.

Specifically, as shown in FIG. 3, in the Z stage used for the operation test of the IC wafer 12 and the like, the mounting table 2 is formed in a circular shape. The IC wafer 12 is placed on the circular mounting table 2, and the probe 11 contacts the surface of the IC wafer 12 to perform an operation test or the like.

At this time, in order to improve the efficiency of the operation test and the like, a probe 13 in which a plurality of probes 11 are collectively attached and attached is used. The probe 13 is brought into contact with one end of the IC wafer 12 to perform measurement.

4, in the Z stage used for the operation test of the liquid crystal substrate 14, etc., the mounting table 2 is formed in rectangular shape. The liquid crystal substrate 14 is placed on the rectangular mounting table 2, and the probe 15 is brought into contact with the surface of the liquid crystal substrate 14 to perform an operation test or the like. A plurality of probes 15 are provided on two sides 14A and 14B adjacent to the liquid crystal substrate 14 over the entire area.

By the way, the conventional apparatus of the said structure has the following problems.

When the probe 11 is brought into contact with the surface of the IC wafer 12 or the like during the operation test or the like, a slight settling pressure is applied to the IC wafer 12 or the like. And the probes 13, 15 have a plurality of probes 11, so that the needle pressure is of a corresponding magnitude.

On the other hand, support of the mounting direction of the mounting base 2 is mainly taken up by the center elevation mechanism 3. Peripheral guide mechanism 4 allows movement in the lifting direction. Therefore, when force by probes 13 and 15 is applied to the end of mounting table 2, as shown by the dotted line in FIG. Is slightly inclined.

As a result, there is a problem that the probes 11 and 15 of the probes 13 and 15 in contact with the object cause misalignment or poor contact.

In contrast, the wedge-shaped base is provided on the lower surface of the mounting table 2 to eliminate the inclination of the mounting table 2, which is described in Japanese Unexamined Patent Application, First Publication No. 4 (1992) -50693. 3 (1991) -53193, "Fine motion Z stage apparatus" is known. However, in these cases, the lifting stroke of the mounting table 2 is short, and the use is limited.

In addition, the center of the mounting table 2 is supported by a stage support fixed to the base side, the surroundings are supported by a plurality of lifting arms, and the lifting arms are lifted to adjust the inclination angle of the mounting table 2 as The "wafer prober" of Unexamined-Japanese-Patent No. 5 (1993) -144892 is known. However, in this case, the inclination angle adjustment of the mounting table 2 is not aimed at raising and lowering the mounting table 2. That is, it is not the structure which can move the mounting base 2 to a probe in parallel, and can also eliminate the influence of the needle pressure by this probe.

This invention is made | formed in view of the said problem, and an object of this invention is to provide the Z stage which suppressed the inclination of a probe, etc. by suppressing the inclination of a mounting table.

1 is a front view showing a Z stage according to the present embodiment.

2 is a front view showing a conventional stage.

3 is a perspective view showing a mounting table for an IC wafer;

4 is a perspective view showing a mounting table for a liquid crystal substrate.

5 is a bottom view showing a Z stage according to the first embodiment;

6 is a plan view showing a Z stage according to the first embodiment;

7 is a schematic side view showing a liquid crystal substrate inspection device.

8 is a front view showing a liquid crystal substrate inspection device.

9 is a front view showing the circuit board inspection apparatus.

10 is a front view showing a Z stage according to the second embodiment;

11 is a bottom view showing a Z stage according to the second embodiment.

12 is a front view showing a Z stage according to the third embodiment;

Fig. 13 is a bottom view showing a Z stage according to the third embodiment.

14 is a front view showing a Z stage according to the fourth embodiment.

Fig. 15 is a bottom view showing a Z stage according to the fourth embodiment.

Fig. 16 is a plan view showing a Z stage according to the fourth embodiment.

17 is a front view showing a Z stage according to the fifth embodiment;

18 is a bottom view showing a Z stage according to the fifth embodiment;

Fig. 19 is a front view showing a Z stage according to the sixth embodiment.

20 is a bottom view showing a Z stage according to the sixth embodiment;

Fig. 21 is a front view showing the Z stage according to the seventh embodiment.

Fig. 22 is a bottom view showing the Z stage according to the seventh embodiment.

* Explanation of symbols for main parts of the drawings

21: Z stage, 42: Y stage portion, 51: mounting table, 52: substrate

53: lifting mechanism part, 54: synchronous drive device, 55: guide mechanism part

61: feed screw, 62: nut, 64: drive motor, 65: synchronous coupling mechanism

The Z stage according to the first aspect of the present invention is provided with a mounting table for placing an object directly or indirectly, a substrate supporting the mounting table, and moving forward and backward between the substrate and the mounting table. And a plurality of lifting mechanism portions having members for lifting up and down the substrate, and a synchronous driving device connected to the plurality of lifting mechanism portions, respectively, for driving them in synchronization.

With this arrangement, the synchronous driving device drives each lifting mechanism unit in synchronism, and raises and lowers the mounting table while keeping it constant without inclining the mounting surface. In a place where the mounting table is moved in parallel to a predetermined position, when a load is applied to the end of the mounting surface by contact with a team needle or the like, the load is distributed to a plurality of lifting mechanism portions. That is, each lifting mechanism part supports the mounting table and prevents this mounting table from inclining.

The Z stage according to the second aspect of the invention is provided with a plurality of the elevating mechanism portions at positions where the loads applied to the mounting table can be distributed to each of the elevating mechanism portions.

According to the above configuration, even when a load is applied to the end of the mounting table, the load is distributed to each lifting mechanism part to prevent the mounting table from inclining.

The Z stage according to the third aspect of the present invention is characterized in that the synchronous drive device is constituted by a single drive source, and a synchronous coupling mechanism which connects the drive source and each lift mechanism part to drive each lift mechanism part in synchronization with each other.

According to the above configuration, the driving force from the driving source is transmitted to each of the lifting mechanism portions by the synchronous coupling mechanism, and the lifting mechanism portions are driven in synchronization with each other. Thus, the mounting table lifts and lowers in a state where the mounting surface is kept constant. Movement), and each lifting mechanism part supports the mounting table against the load applied to the end portion, thereby reliably preventing the inclination.

The Z stage according to the fourth aspect of the invention is characterized in that the synchronous drive device includes a drive source individually connected to each lifting mechanism unit, and a synchronization control unit for controlling each drive source in synchronization with each other.

According to the above configuration, according to the control by the synchronous control unit, the respective driving sources operate in synchronization with each other, and the respective lift mechanisms are driven in synchronization with each other. Thus, the mounting table is lifted while keeping the mounting surface constant. Therefore, it is possible to reliably prevent the inclination of the mounting table against the load applied to the end portion.

Next, the Z stage of this invention is demonstrated, referring an accompanying drawing.

[First Embodiment]

1 is a front view showing the Z stage 21 according to the present embodiment, FIG. 5 is a bottom view showing the Z stage 21 in a state excluding the Y stage portion 42, and FIG. 6 shows the measuring stage 21 in a state excluding the mounting table 51. FIG. 7 is a schematic side view showing the liquid crystal substrate inspecting apparatus 23, FIG. 8 is a front view showing the liquid crystal substrate inspecting apparatus 23, and FIG. 9 is a front view showing the circuit board inspecting apparatus 24. FIG.

The Z stage 21 is an apparatus for elevating in a state where an object such as an IC wafer or a liquid crystal substrate is placed on the upper surface thereof. For example, an operation test, a characteristic test, or the like is performed by bringing the mounted IC wafer into contact with a probe. It is used to check the height of each probe of the probe. Incidentally, the lifting direction referred to herein is not limited to the vertical direction, but may be an inclined direction, a horizontal direction, or the like.

Although the measuring stage 21 may be used as a single body, the liquid crystal substrate inspection apparatus 23 (see Figs. 7 and 8) for measuring the liquid crystal substrate and the circuit board inspection apparatus 24 for measuring the IC wafer (Fig. 9). And the like).

As shown in Figs. 7 and 8, the liquid crystal substrate inspection apparatus 23 includes an apparatus body 25 having an inclined surface 25A on the front surface, an XYZθ stage 26 embedded in the inclined surface 25A of the apparatus body 25, and the XYZθ stage. It consists of the probe support plate 27 located in front of 26, and attached to the inclined surface 25A, and the probe 28 attached to this probe support plate 27. As shown in FIG. The probe 28 has many probes similarly to the said conventional probe 13,15.

As shown in FIG. 9, the circuit board inspection apparatus 24 includes a base 31, an XYZθ stage 32 fixed to the base 31, and a high temperature supported by a chuck holder 33 on the XYZθ stage 32. Iii) a chuck 34, a purge plate 35 covering the upper surface of the cryogenic chuck 34, a base plate 36 supporting the purge plate 35, a probe 37 attached to the base plate 36, and the base It consists of a manipulator 38 attached to the plate 36 to support the probe 37, and a shield cover 39 covering the whole. In addition, the above-described probe may be used instead of the probe 37 and the manipulator 38.

Each of the XYZθ stages 26 and 32 has the same configuration. Specifically, as shown in FIG. 7, the X stage portion 41 and the Y stage portion 42 which move the mounted liquid crystal substrate or the like on the same plane in front, back, left, and right, and the liquid crystal substrate are attached to the probe 28 (probe 37). It consists of the Z stage 21 which raises and lowers in the direction to approach, and the (theta) stage part 44 which rotates a liquid crystal board etc .. As shown in FIG.

As shown in Figs. 1, 5 and 6, the Z stage 21 has a mounting table 51 on which a liquid crystal substrate or the like as a measurement target is placed, a substrate 52 supporting the mounting table 51, a substrate 52 and a mounting table. Three elevating mechanism sections 53 arranged between the elevating substrates 51 and the elevating mechanism section 53 for supporting the mounting table 51 on the substrate 52, and a synchronous driving device 54 for driving the same in synchronism with the elevating mechanism sections 53, respectively; It consists of three guide mechanisms 55 which are arrange | positioned between the board | substrate 52 and the mounting table 51 with guide part 53, and guide and support the lifting of the mounting table 51 with respect to the board | substrate 52. As shown in FIG. And the stage stage part 44 of FIG. 7 is integrated in the mounting table 51 integrally. The board | substrate 52 is shape | molded in thick disk shape, and is hollow inside. The substrate 52 is fixed to the Y stage portion 42.

The elevating mechanism part 53 is mainly composed of three transfer screws 61 attached to the substrate 52 side, and a nut 62 attached to the mounting table 51 side and screwed to each transfer screw 61, respectively, to move up and down by rotation of the transfer screw 61. have. And this feed screw 61 is a rod member which moves forward and backward relatively with respect to the nut 62 (mounting stage 51).

Each feed screw 61 is attached to the same space | interval (position of the vertex of an equilateral triangle) mutually. Specifically, the bearings 63 are respectively fixed to positions at which the respective transfer screws 61 are attached to the substrate 52, and the respective transfer screws 61 are rotatably supported by the bearing 63. The nut 62 is being fixed to the position (position of the vertex of an equilateral triangle) corresponding to each said feed screw 61 among the back surfaces of the mounting table 51. In addition, since the mounting table 51 is circular and there are three lifting mechanism parts 53, as a position of each lifting mechanism part 53 which can distribute the load applied to this mounting table 51, the position of a vertex of an equilateral triangle is preferable. In addition, in the case where the load applied to the mounting table 51 is concentrated at a specific position, two lifting mechanism portions 53 are biased and disposed at the specific position.

The synchronous drive device 54 is a drive motor 64 attached to only one center in the center of the substrate 52, and the drive motor 64 and the three lift mechanism parts 53 are connected to the synchronous coupling mechanism 65 which drives each lift mechanism part 53 in synchronization with each other. Consists of. The synchronous coupling mechanism 65 includes three drive pulleys 66 attached to the rotation shaft 64A of the drive motor 64 which extends into the substrate 52, and proximal ends of the transfer screws 61 (the end portions of the transfer screws 61 located in the substrate 52). It consists of an attached driven pulley 67, three belts 68 which individually connect each of the driving pulleys 66 and each driven pulley 67, and a tension roller 69 which prevents idling due to the looseness of each belt 68. . As the drive motor 64, a stepping motor or a servo motor is used. A control unit (not shown) provided with a motor drive circuit is connected to the drive motor 64.

The guide mechanism part 55 is comprised of the guide 71 attached to the board | substrate 52 side through the support shaft 71A, and the guide shaft 72 attached to the mounting base 51 side, and fitted to the guide 71 and sliding in the lifting direction (up-down direction in FIG. 1). It is. This guide mechanism part 55 is arrange | positioned similarly to the said lift mechanism part 53 in mutually equal positions (position of the vertex of an equilateral triangle). In addition, each guide mechanism part 55 is located between each lifting mechanism parts 53, and each lifting mechanism part 53 is also arrange | positioned at equal intervals. As a result, the lift mechanisms 53 and the guide mechanisms 55 are disposed at positions of the vertices of the regular hexagon, respectively. As the guide 71 and the guide shaft 72, a dovetail groove structure, a linear bearing, and the like are used.

[action]

Next, the operation of the Z stage 21 having the above configuration will be described. Here, only the operation of the Z stage 21 will be described. The other stages, such as the X stage part 41 in the case where it is built in the XYZ (theta) stage 26, are known, and the operation description is abbreviate | omitted here.

When raising and lowering the mounting table 51, the drive motor 64 of the synchronous drive device 54 is first driven. Thereby, the three drive pulleys 66 integrally attached to the rotation shaft 64A rotate at the same time, and the three driven pulleys 67 rotate in synchronization with each other via the belts 68. And three feed screws 61 with each driven pulley 67 rotate in synchronization with each other while being supported by each bearing 63. Thereby, the three nuts 62 screwed to each transfer screw 61 are simultaneously pushed up or pulled down to the same pitch. As a result, the mounting table 51 is supported by the guide mechanism portion 55 in a state where the upper mounting surface thereof is not inclined and is kept constant, so that the mounting table 51 is accurately moved in parallel. Thereby, IC wafer 12 etc. of a mounting surface are moved to the probe 37 etc. in the state supported correctly, without inclination.

After the IC wafer 12 or the like touches the probe 37 or the like at a predetermined position, the mounting table 51 is pushed up a few microns in order to ensure electrical contact. As a result, electrical contact with each other is assured, and an operation test or the like is performed.

On the other hand, in contact with the probe 28 or the like, a load biased at the end of the mounting table 51 is applied by the needle pressure by the probe 28 or the like. The unbalanced load is distributed to three lifting mechanism parts 53 arranged at equal intervals and supported by the three lifting mechanism parts 53.

[effect]

As described above, since the mounting table 51 is supported by three lifting mechanism parts 53 disposed at equal intervals, the unloading load applied to the mounting table 51 is distributed to each lifting mechanism part 53, so that the inclination of the mounting table 51 can be reliably prevented. have.

As a result, the probe 28 or the like can be reliably brought into contact with the measurement object without causing positional shift or poor contact on the contact surface of the IC wafer 12 or the like.

Second Embodiment

Next, the Z stage according to the second embodiment will be described with reference to FIGS. 10 and 11. Since the whole structure of the Z stage 81 which concerns on this embodiment is substantially the same as the Z stage 21 of the said 1st Embodiment, the same code | symbol is attached | subjected to the same member, and the description is abbreviate | omitted. The Z stage 81 of this embodiment is characterized in that the structure of the synchronous drive device 82 is improved.

The synchronous drive device 82 of the present embodiment connects the drive motor 64 directly connected to one of the three lift mechanism parts 53 attached to the substrate 52, and the three lift mechanism parts 53 by connecting the drive motor 64 and the other two lift mechanism parts 53. Is composed of a synchronous coupling mechanism 83 for driving the motors in synchronization with each other.

The synchronous coupling mechanism 83 is a drive pulley 84 attached to the base end of the transfer screw 61 of the lifting mechanism portion 53 extending into the substrate 52 and attached to the base end of each transfer screw 61 of the other two lifting mechanism portions 53, respectively. It consists of a driven pulley 85, one belt 86 which connects these one drive pulley 84, and two driven pulleys 85 simultaneously, and three tension rollers 87 which prevent the idle rotation by this belt 86 loosening. And it is preferable to arrange | position the three tension rollers 87 in the position which approached the most in order to enlarge the angle which the belt 86 and each pulley 84 and 85 contact.

Also with the Z stage 81 of the above structure, the effect | action and effect similar to the said 1st Embodiment can be seen.

[Third Embodiment]

Next, the Z stage according to the third embodiment will be described with reference to FIGS. 12 and 13. Since the whole structure of the Z stage 91 which concerns on this embodiment is substantially the same as the Z stage 21 of said 1st Embodiment, the same code | symbol is attached | subjected to the same member, and the description is abbreviate | omitted. The Z stage 91 of the present embodiment is characterized in that the structure of the synchronous drive device 92 is improved.

The synchronous drive device 92 of the present embodiment includes three drive motors 64 each connected to three lift mechanisms 53 attached to the substrate 52, and a synchronous control unit connected to these drive motors 64 to synchronize each drive motor 64 with each other. (Not shown).

The synchronous control unit includes a single motor drive circuit, and each drive motor 64 is connected in parallel to this circuit. As a result, the three drive motors 64 are simultaneously controlled by the synchronization controller. That is, each drive motor 64 is operated in synchronization with each other.

Also with the Z stage 91 of the above structure, the same effect | action and effect as the said 1st Embodiment can be seen.

Fourth Embodiment

Next, the Z stage according to the fourth embodiment will be described with reference to FIGS. 14 to 16. The overall configuration of the Z stage 101 according to the present embodiment is almost the same as that of the Z stage 21 of the first embodiment. However, the Z stage 101 of this embodiment is an apparatus used for operation test of a rectangular liquid crystal substrate, and the like. Therefore, the mounting table 103 is formed in a rectangular shape in conformity with the liquid crystal substrate.

In the present embodiment, four lifting mechanism portions 53 and guide mechanism portions 55 are attached to four corners of the quadrilateral substrate 105, respectively.

The synchronous drive device 106 of the present embodiment connects the drive motor 64 attached to the center portion of the quadrilateral substrate 105 and the drive motor 64 and the four lift mechanism parts 53 to drive the lift mechanism parts 53 in synchronization with each other. It consists of a synchronous coupling mechanism 107.

The synchronous coupling mechanism 107 includes two drive pulleys 108 attached to the rotational shaft 64A of the drive motor 64 extending into the substrate 105, a driven pulley 109 attached to the proximal ends of the respective transfer screws 61 of the four lifting mechanism portions 53, and one It consists of two belts 110 connecting the driving pulley 108 and two driven pulleys 109, and three tension rollers 111 arranged in each of them to prevent idling caused by the looseness of each belt 110.

Also in the case of the Z stage 101 having the above-described configuration, by driving the drive motor 64, the respective feed screws 61 of the four lifting mechanisms 53 can be rotated in synchronization with each other via the drive pulley 108, the belt 110 and the driven pulley 109. Moreover, since each elevating mechanism part 53 is attached to the four corners of the rectangular mounting base 103, the unloading load applied to the mounting base 103 can be disperse | distributed to each elevating mechanism part 53. As shown in FIG. Thereby, the effect similar to the said 1st Embodiment can be seen.

[Fifth Embodiment]

Next, the Z stage according to the fifth embodiment will be described with reference to FIGS. 17 and 18. Since the whole structure of the Z stage 121 which concerns on this embodiment is substantially the same as the Z stage 101 of the said 4th embodiment, the same code | symbol is attached | subjected to the same member, and the description is abbreviate | omitted. This embodiment is characterized in that the structure of the synchronous drive device 126 is improved.

The synchronous drive device 126 connects the drive motor 64 directly connected to one of the four lift mechanism parts 53 attached to the substrate 105, and the four lift mechanism parts 53 are synchronized with each other by connecting the drive motor 64 and the other three lift mechanism parts 53. It consists of a synchronous coupling mechanism 127 for driving in one state.

The synchronous coupling mechanism 127 is attached to the base end of the transfer screw 61 of the lifting mechanism portion 53 extending into the substrate 105 and the drive pulley 128 attached to the base of the transfer screw 61 of the other three lifting mechanism portions 53, respectively. It consists of the driven pulley 129, the one belt 130 which connects these one drive pulley 128 and three driven pulleys 129 simultaneously, and the six tension rollers 131 which prevent the idling resulting from the looseness of this belt 130.

Also with the Z stage 121 of the above structure, the effect | action and effect similar to the said 1st Embodiment can be seen.

[Sixth Embodiment]

Next, the Z stage according to the sixth embodiment will be described with reference to FIGS. 19 and 20. Since the whole structure of the Z stage 131 which concerns on this embodiment is substantially the same as the Z stage 101 of the said 4th Embodiment, the same code | symbol is attached | subjected to the same member, and the description is abbreviate | omitted. This embodiment is characterized in that the structure of the synchronous drive device 135 is improved.

The synchronous drive device 135 is a synchronous control unit (not shown) for synchronously controlling the four drive motors 64 connected to the four lift mechanisms 53 attached to the substrate 105 and the respective drive motors 64 connected to the drive motors 64, respectively. Not configured).

The synchronous control unit includes a single motor drive circuit, and each drive motor 64 is connected in parallel to this circuit. In this way, the four drive motors 64 are simultaneously controlled by the synchronization controller. That is, each drive motor 64 operates in synchronization with each other.

Also with the Z stage 131 of the above structure, the effect | action and effect similar to the said 1st Embodiment can be seen.

[Seventh Embodiment]

Next, the Z stage according to the seventh embodiment will be described with reference to FIGS. 21 and 22. Since the overall configuration of the Z stage 141 according to the present embodiment is almost the same as that of the Z stage 101 of the fourth embodiment, the same reference numerals are assigned to the same members, and the description thereof is omitted. This embodiment is characterized in that the structure of the synchronous drive device 142 is improved.

The synchronous drive device 142 is composed of two systems of drive systems. Specifically, the two driving motors 64 attached to the center of the substrate 105 and the driving motors 64 and the two lifting mechanisms 53 in the vicinity thereof are connected to each other to drive the two lifting mechanisms 53 in synchronization with each other. It is comprised by the coupling mechanism 143 and the synchronous control part (not shown) which is connected to two drive motors 64, and controls each drive motor 64 in synchronization with each other.

The synchronous coupling mechanism 143 includes two drive pulleys 144 attached to the rotation shaft 64A of the drive motor 64 extending into the substrate 105, a driven pulley 145 attached to the proximal end of each feed screw 61 of the four lifting mechanism portions 53, and one It consists of two belts 146 for separately connecting the driving pulley 144 and two driven pulleys 145 in the vicinity, and a tension roller 147 disposed one in each to prevent idling due to the looseness of each belt 146.

The synchronous control unit includes a single motor drive circuit, and each drive motor 64 is connected in parallel to this circuit. In this way, the two drive motors 64 are simultaneously controlled by the synchronization controller. That is, each drive motor 64 operates in synchronization with each other.

Also with the Z stage 141 of the above structure, the effect | action and effect similar to the said 1st Embodiment can be seen.

[Modification]

(1) In each said embodiment, although the guide mechanism part 55 was arrange | positioned, you may support the mounting base 51 only by the lifting mechanism part 53, without providing this guide mechanism part 55. Also in this case, the mounting base 51 can be reliably supported by the plurality of lifting mechanisms 53 disposed therein, and the same effect and effect can be seen.

(2) In the above embodiment, the lifting mechanism portion 53 is composed of the feed screw 61 and the nut 62. However, the lifting mechanism portion 53 only needs to be capable of converting the rotation of the drive motor 64 into a linear motion. A rack as a moving rod member, or a rack and pinion gear may be used. In this case, the rack is fixed to the mounting table 51 and a worm gear or pinion gear is attached to the drive motor 64. In the case of the pinion gear, the reduction gear is disposed so that the rotation angle can be accurately controlled, and the rack attached to the mounting table 51 can be reliably supported.

In addition, the elevating mechanism portion 53 may be a linear drive source such as a linear motor or an ultrasonic motor. In addition, a scotch yoke mechanism or a cam mechanism having a large stroke may be used.

By this, the same effect and effect can be seen.

(3) In the above embodiment, pulleys (66, 67, etc.) and belts (68, etc.) are used as the synchronous coupling mechanisms (65, etc.), but the sprockets and chains may be used. In this case, a gear wheel which is attached to the feed screw 61 and the drive motor 64 of the elevating mechanism 53 and engages with each other may be used.

Thereby, the same effect | action and an effect can be seen.

As described above, according to the present invention, the following effects are obtained.

A plurality of lifting mechanisms support the mounting table, and the synchronizing drive unit drives the lifting mechanisms in synchronization, so that the mounting table can be reliably supported, and the mounting surface can be accurately supported without inclination even against the unbalanced load. It becomes possible.

Claims (4)

The mounting table which directly or indirectly mounts an object, the board | substrate which supports this mounting board, and the board | substrate is arrange | positioned by moving and advancing between this board | substrate and the said mounting board, and board | substrate. And a plurality of elevating mechanism portions having members for elevating relative to each other, and a synchronous driving device connected to the plurality of elevating mechanism portions and synchronously driving them. The Z stage according to claim 1, wherein the plurality of lifting mechanism portions are disposed at positions where the load applied to the mounting table can be distributed to the lifting mechanism portion. 3. The synchronous drive device according to claim 1 or 2, wherein the synchronous drive device includes one drive source, and a synchronous connection mechanism which connects the drive source and the lift mechanism part to drive the lift mechanism part in synchronization with each other. stage. The Z-stage according to claim 1 or 2, wherein the synchronous driving device includes a drive source individually connected to each lifting mechanism unit, and a synchronization control unit for controlling each drive source in synchronization with each other.