KR19980073955A - Cleaning tank of semiconductor manufacturing apparatus - Google Patents

Abstract

It describes about the washing tank of a semiconductor manufacturing apparatus. This includes a bowl-shaped bath, two or more rectifying plates installed at the lower end of the bath and arranged so that the upper holes and the lower holes or the upper holes and the lower spacers are aligned with each other, and the upper hole or the upper spacer is exactly the same. Wafers are located in the middle. At this time, the size of the hole and the size of the hole and the spaced apart portion is each 3mm or less. Therefore, according to the present invention, since the amount of deionized water passing between the wafers can be increased, the cleaning efficiency of the wafer can be improved.

Description

Cleaning tank of semiconductor manufacturing apparatus

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus, and more particularly, to a cleaning tank of a semiconductor manufacturing apparatus capable of increasing the cleaning efficiency of a wafer.

Conditions that must be met for more efficient cleaning in the semiconductor manufacturing process, particularly in the cleaning process, include a large amount of deionized water flowing between wafers and a uniform flow between the wafers.

Various problems have been reported about the efficiency of cleaning in the cleaning tank. In particular, about 90% of the deionized water flowing into the cleaning bath for cleaning the wafer does not flow between the wafers, and it simply falls out of the cleaning tank. There is a problem that the cleaning efficiency is lowered because it goes out.

There are a number of things that affect the flow of deionized water introduced into the cleaning bath, among other things, depending on the position of the wafer and the location or shape of various structures in the cleaning bath, such as a rectifying plate installed for rectifying the deionized water. The flow of ionized water is often deformed.

SUMMARY OF THE INVENTION An object of the present invention is to provide a cleaning tank capable of obtaining the best cleaning efficiency by variously modifying the installation position and shape of the structure in the cleaning tank such as the above-mentioned rectifying plate and the position of the wafer in various ways.

1 is a schematic view showing a cleaning tank of a semiconductor manufacturing apparatus according to the present invention.

FIG. 2 shows the upper and lower rectifying plates aligned so that the holes (or spacings) of the upper rectifying plate and the spacings (or holes) of the lower rectifying plate are aligned, and the wafer is placed in the middle of the hole of the upper rectifying plate. It is a schematic diagram which shows the washing tank put.

Figure 3 shows the upper and lower rectifying plates are aligned so that the holes (or spacing) of the upper rectifying plate and the spacing (or holes) of the lower rectifying plate are aligned, and the wafer is placed in the middle of the spacing of the upper rectifying plate. It is a schematic diagram which shows the washing tank in which is placed.

4 shows that the upper and lower rectifying plates are aligned so that the holes (or spacing portions) of the upper rectifying plate and the holes (or spacing portions) of the lower rectifying plate are aligned, and the wafer is placed in the middle of the hole of the upper rectifying plate. It is a schematic diagram which shows the washing tank put.

5 is aligned with the upper and lower rectifying plates so that the holes (or spacing portions) of the upper rectifying plate and the holes (or spacing portions) of the lower rectifying plate lie in a straight line, and the wafer is placed in the middle of the spacing of the upper rectifying plate. It is a schematic diagram which shows the washing tank in which is placed.

The cleaning bath of the semiconductor manufacturing apparatus by this invention for achieving the said objective is a bowl-shaped vessel; Two or more rectifying plates installed at the lower end of the bath and arranged such that upper holes (or spacers) and lower holes (or spacers) are aligned with each other; And wafers positioned exactly in the middle of the upper hole or the upper separation portion.

In order to achieve the above object, the cleaning bath of the semiconductor manufacturing apparatus according to the present invention further includes a vessel in a vessel shape; Two or more rectifying plates installed at a lower end of the bath and arranged to align upper holes (or spacers) and lower spacers (or lower holes) with each other; And wafers positioned exactly in the middle of the upper hole or the upper separation portion.

In the present invention, the rectifying plate is preferably the size of the hole and the size of the separation portion of each 3mm or less.

EMBODIMENT OF THE INVENTION Hereinafter, with reference to an accompanying drawing, it demonstrates in detail about the washing tank of the semiconductor manufacturing apparatus by this invention.

First, Figure 1 is a schematic diagram showing a cleaning tank of the semiconductor manufacturing apparatus according to the present invention, 10 is a bowl-shaped bath, 12 is deionized water inlet, 20 is the lower rectifying plate, 22 is the upper rectifying plate And 30 represent wafers.

Deionized water introduced into the bath 10 through the deionized water inlet 12 is rectified while passing through the lower rectifying plate 20 and the upper rectifying plate 22, and then placed on the upper rectifying plate 22. The wafers 30 are cleaned between and through the outside 30. Thereafter, the deionized water that has been cleaned is overflowed to the outside of the bath 10.

At this time, the upper and lower rectifying plates 22 and 20 are installed at the lower end of the bath 10, there are a plurality of holes to rectify the deionized water passing through these holes. In addition, the wafers 30 are placed perpendicular to the upper rectifying plate 22.

Factors affecting the flow in the washing tank include the inflow rate of deionized water at the deionized water inlet 12, the structure inside the washing tank, and the shape of the washing tank itself. In the present invention, among these, in particular, to focus on the structure of the cleaning tank to obtain the desired flow. That is, it is intended to increase the cleaning efficiency of the wafer by allowing a uniform and large amount of deionized water to flow between the wafers.

To this end, first, the upper and lower rectifying plates 22 and 20 having densely distributed small holes are installed at the lower end of the bath 10 so as to generate a uniform flow, and then the wafers are placed exactly in the middle of the rectifying plate hole. Or in the exact middle of the gap between the holes (hereinafter referred to as the gap).

2 to 5 are schematic views showing the positional relationship between the holes (or the spaced part) of the upper and lower rectifying plates installed on the lower end of the cleaning tank and the wafer, in which the reference numeral 40 is a hole of the lower rectifying plate. For example, 42 represents holes of the upper rectifying plate, and 50 represents wafers, and the dotted line represents the axis of the wafer 50.

2, the upper and lower rectifying plates are aligned so that the holes 42 (or the spacing portions) of the upper rectifying plate and the spacing portions (or the holes 40) of the lower rectifying plate lie in a straight line. 3 shows a cleaning tank in which a wafer 50 is placed in the middle of the holes 42 of the upper rectifying plate, and FIG. 3 shows the gaps (or holes) of the holes 42 (or spacing portions) of the upper rectifying plate and the lower rectifying plate. The upper and lower rectifying plates are aligned so that the upper and lower rectifying plates are aligned, and the wafer 50 is placed in the middle of the separation part of the upper rectifying plate, and FIG. 42) The upper and lower rectifying plates are aligned so that the (or the separating parts) and the holes 40 (or the separating parts) of the lower rectifying plate are in a straight line, and the wafer (in the middle of the holes 42 of the upper rectifying plate) is aligned. 50 shows the cleaning bath in which 50 is placed, and FIG. 5 shows the holes 42 (or spacing) of the upper rectifying plate and the lower one. Of the current plate hole 40 (or the spacing portion) it is aligned from the upper and lower current plate to be placed in a straight line, and shows a cleaning tank with the wafer 50 in the middle portion spaced apart from the upper current plate is put.

As a result of investigating the flow of deionized water in the four cases mentioned above, first, when the wafer and the rectifying plate which act as pressure bodies in the flow of deionized water are not regularly arranged (in the case of FIGS. 2 to 5, the wafer and the rectifying plate are regularly Arrangements), the flow of deionized water becomes more irregular, and secondly, the wafers placed on the holes of the rectifying plate act as a pressure body for the flow of deionized water to hinder the flow of deionized water, but the gap between the wafers It can be seen that the flow of deionized water becomes more uniform when the size of the rectifying plate is larger than the hole size. (If the wafer is located in the middle of the hole of the rectifying plate, the deionized water flow is divided in half and the efficiency is improved. ).

At this time, it is most preferable that the size of the holes of the rectifying plate and the size of the separation portion are each 3 mm or less.

As a result of the two-dimensional flow analysis of the cleaning tank having the structure as shown in FIG. 5, the amount of deionized water flowing between the wafers is compared with the general cleaning tank whose holes (or separation parts) of the rectifying plate and the position of the wafer are not regular. The results were increased about 5 times (7% → 35%), and it was confirmed that a uniform flow was formed over the entire wafer except the outermost wafers.

The present invention is not limited to the above embodiments, and it is apparent that many modifications are possible by those skilled in the art within the technical idea of the present invention.

According to the cleaning tank of the semiconductor manufacturing apparatus according to the present invention, the holes of the upper and lower rectifying plates or the separation of the holes of the upper and lower rectifying plate and the separation of the lower rectifying plate, and place the wafer in the exact middle of the hole or the space of the wafer Increasing the amount of deionized water passing between them can increase the cleaning efficiency of the wafer.

Claims (4)

A bowl-shaped bath; Two or more rectifying plates installed at the lower end of the bath and arranged such that upper holes (or spacers) and lower holes (or spacers) are aligned with each other; And And a wafer positioned exactly in the middle of the upper spaced portion or the upper hole. The method of claim 1, wherein the rectifying plate, The size of the said hole and the size of the said space | interval part are each 3 mm or less, The washing tank of the semiconductor manufacturing apparatus characterized by the above-mentioned. A bowl-shaped bath; Two or more rectifying plates installed at a lower end of the bath and arranged to align upper holes (or spacers) and lower spacers (or holes) with each other; And And a wafer positioned exactly in the middle of the upper spaced portion or the upper hole. The method of claim 2, wherein the rectifying plate, The size of the said hole and the size of the said space | interval part are each 3 mm or less, The washing tank of the semiconductor manufacturing apparatus characterized by the above-mentioned.