KR19980055731U - Socket assembly for semiconductor device (micro-VISA device) inspection - Google Patents
Socket assembly for semiconductor device (micro-VISA device) inspection Download PDFInfo
- Publication number
- KR19980055731U KR19980055731U KR2019980009717U KR19980009717U KR19980055731U KR 19980055731 U KR19980055731 U KR 19980055731U KR 2019980009717 U KR2019980009717 U KR 2019980009717U KR 19980009717 U KR19980009717 U KR 19980009717U KR 19980055731 U KR19980055731 U KR 19980055731U
- Authority
- KR
- South Korea
- Prior art keywords
- socket
- board
- contact
- socket assembly
- inspection
- Prior art date
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- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Abstract
본 제품은 메모리 칩의 성능 검사를 하기위한 중요한 부품의 하나인 CONTACTFINGER용 SOCKET ASSEMBLY로서 기존의 SOCKET 사용 시 SOCKET 수명이 다하여 교체 시 SOCKET 전체를 교환하여야 하나 본 제품은 CONTACTFINGER만 교체함으로 비용을 줄일 수 있으며, 또한 기존의 SOCKET 사용 시 P.C. BOARD상의 접촉 패턴과 SOCKET 간의 접촉을 위하여 SOCKET BOARD를 사용하여야 하나 본 고안은 CONTACT FINGER와 P.C BOARD와 직접 접촉하게 함으로서 원가 절감과 전체 회로선의 길이를 줄임으로 인한 주파수 특성이 양호함으로 고주파 및 SPEED관련 특성의 소자 검사 시 수율 개선 과 수입품인 I.C SOCKET의 대체 효과와 비용 절감을 위한 제품이다.This product is SOCKET ASSEMBLY for CONTACTFINGER, one of the important parts to test the performance of memory chip, and the entire SOCKET should be replaced when the existing SOCKET is used and the socket is replaced. , Or PC with existing SOCKET SOCKET BOARD should be used for the contact between the contact pattern on the board and SOCKET. However, this design makes direct contact with CONTACT FINGER and PC BOARD so that the frequency characteristics are good due to cost reduction and shortening the length of the entire circuit. It is a product to improve the yield at the time of device inspection and to replace the imported IC SOCKET and reduce the cost.
Description
본 고안 SOCKET ASSEMBLY는 기존의 SOCKET의 전기적 특성을 개선하였고, 또한 SOCKET 전체를 교체하지 않고 CONTACT FINGER 부분만 교체하게함으로 교체 비용을 절감케 한 것으로 기존의 SOCKET은 도면 1에서 SOCKET(E)와 P.C BOARD(I) 위의 패턴(H) 간의 연결을 위하여 또 하나의 SOCKET BOARD를 사용하여야 하나 본 고안은 SOCKET BOARD가 필요치 않으며, 기존의 SOCKET은 접촉 단자(G)가 교체가 불가능한 고정형 이거나 낱개로 하나 하나씩 교체 하여야 하나 본 고안은 접촉 단자(G)를 열 접착 고정 TAPE을 사용하여 필요한 숫자만큼 연결하여 한꺼번에 교체 가능케 하였으며, 또한 실리콘 고무(F)가 접촉 단자 (CONTACT FINGER) 상단과 하단에 위치하여 접촉 단자의 탄성을 항상 일정하게 유지 하도록 하였다.SOCKET ASSEMBLY of the present invention improved the electrical characteristics of the existing SOCKET, and also reduced the replacement cost by replacing only the entire contactor part without replacing the entire SOCKET. The existing SOCKET is SOCKET (E) and PC BOARD in Figure 1. (I) Another SOCKET BOARD should be used for the connection between the above pattern (H), but this design does not require the SOCKET BOARD. However, this design makes it possible to replace the contact terminal (G) as many times as needed by using a heat-adhesive fixed tape, and the silicone rubber (F) is located at the top and the bottom of the contact terminal. The elasticity of the was always kept constant.
이하에서 본 고안 장치의 구조 및 작동 상태를 첨부 도면을 참고로 하여 상세히 설명한다.Hereinafter, the structure and operation state of the device of the present invention will be described in detail with reference to the accompanying drawings.
1) 도면 제 1 도 와 같이 접촉 단자(G)(CONTACT FINGER)를 SOCKET BODY(E)에 하단에서 상단으로 삽입 후 P.C BOARD (I)상의 접촉 패턴(H)에 접촉되게 고정볼트(J)로 고정 한다.1) Insert the contact terminal G (CONTACT FINGER) into the socket body (E) from the bottom to the top as shown in Fig.1, and then fix it to the fixing bolt (J) to make contact with the contact pattern (H) on the PC BOARD (I). Fix it.
2) 반도체소자(B)를 진공 물림장치(A)로 집어서 SOCKET 덮개인 HOUSING (C)에 삽입 되어 누르면 접촉 단자(G)와 P.C BOARD위의 접촉 패턴(H)간의 동시 접촉으로 인하여 검사가 수행된다.2) The semiconductor device (B) is picked up by the vacuum stitching device (A) and inserted into the housing cover (HOUSING (C)), and the test is performed by the simultaneous contact between the contact terminal (G) and the contact pattern (H) on the PC board. Is performed.
이때 2)번 동작의 수십 만번이 되풀이 될 시 CONTACT FINGER(G)의 탄력성 유지를 위하여 실리콘 고무 판(F)을 SOCKET BODY(E) 상단과 하단에 부착시킨다.At this time, if hundreds of thousands of operations are repeated, silicon rubber plate (F) is attached to the top and bottom of the socket body (E) to maintain the elasticity of the contact finger (G).
3) CONTACT FINGER(G)간 간격을 정확히 유지하기 위하여 열 접착 TAPE(K)을사용하여 핀간을 연결하여 CONTACT FINGER(G)를 SOCKET BODY(E)에 삽입 및 분리가 용이 하게 제작 한다.3) In order to maintain the gap between contact finger (G) accurately, connect pin between pins using heat adhesive tape (K) to easily insert and remove contact finger (G) into socket body (E).
상기의 식별자가 없습니다.No identifier above
제 1 도는 분리단면도1 is a cross-sectional view
제 2 도는 평면도 / 밑면도Second degree top view / bottom view
제 3 도는 조립 단면도3rd turning assembly section
* 도면의 주요 부분에 대한 설명* Description of the main parts of the drawing
A : 반도체 소자의 물림 장치A: bite device of semiconductor element
B : 검사할 반도체 소자(마이크로 BGA 소자)B: semiconductor device to be inspected (micro BGA device)
C : SOCKET 덮개 (HOUSING)C: SOCKET cover (HOUSING)
D : 고정핀 (GUARD PIN)D: GUARD PIN
E : CONTACT FINGER(접촉 단자) 고정 SOCKET(SOCKET BODY)E: CONTACT FINGER (SOCKET TERMINAL) SOCKET (SOCKET BODY)
F : 실리콘 고무판(쿠션 고무)F: Silicone rubber plate (cushion rubber)
G : 접촉 단자(CONTACT FINGER)G: CONTACT FINGER
H : P.C. BOARD 상 접촉 패턴H: P.C. BOARD phase contact pattern
I : P.C. BOARDI: P.C. BOARD
J : 고정볼트J: Fixing Bolt
K : CONTACT FINGER를 열접착 TAPE로 연결한 상태K: CONTACT FINGER is connected with heat adhesive tape
상기의 식별자가 없습니다.No identifier above
상기의 식별자가 없습니다.No identifier above
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019980009717U KR19980055731U (en) | 1998-06-09 | 1998-06-09 | Socket assembly for semiconductor device (micro-VISA device) inspection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019980009717U KR19980055731U (en) | 1998-06-09 | 1998-06-09 | Socket assembly for semiconductor device (micro-VISA device) inspection |
Publications (1)
Publication Number | Publication Date |
---|---|
KR19980055731U true KR19980055731U (en) | 1998-10-07 |
Family
ID=69512533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019980009717U KR19980055731U (en) | 1998-06-09 | 1998-06-09 | Socket assembly for semiconductor device (micro-VISA device) inspection |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR19980055731U (en) |
-
1998
- 1998-06-09 KR KR2019980009717U patent/KR19980055731U/en not_active Application Discontinuation
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