KR19980045921A - 원소 티타늄이 없는 라이너 및 금속간 연결을 위한 제조 공정 - Google Patents

원소 티타늄이 없는 라이너 및 금속간 연결을 위한 제조 공정 Download PDF

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Publication number
KR19980045921A
KR19980045921A KR1019960064166A KR19960064166A KR19980045921A KR 19980045921 A KR19980045921 A KR 19980045921A KR 1019960064166 A KR1019960064166 A KR 1019960064166A KR 19960064166 A KR19960064166 A KR 19960064166A KR 19980045921 A KR19980045921 A KR 19980045921A
Authority
KR
South Korea
Prior art keywords
cavity
liner
metal
aluminum
vias
Prior art date
Application number
KR1019960064166A
Other languages
English (en)
Korean (ko)
Inventor
기리쉬 에이. 딕시트
Original Assignee
윌리엄 이. 힐러
텍사스 인스트루먼츠 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윌리엄 이. 힐러, 텍사스 인스트루먼츠 인코포레이티드 filed Critical 윌리엄 이. 힐러
Publication of KR19980045921A publication Critical patent/KR19980045921A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76853—Barrier, adhesion or liner layers characterized by particular after-treatment steps
    • H01L21/76861—Post-treatment or after-treatment not introducing additional chemical elements into the layer
    • H01L21/76862—Bombardment with particles, e.g. treatment in noble gas plasmas; UV irradiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1019960064166A 1995-12-12 1996-12-11 원소 티타늄이 없는 라이너 및 금속간 연결을 위한 제조 공정 KR19980045921A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US844495P 1995-12-12 1995-12-12
US60/008,444 1995-12-12

Publications (1)

Publication Number Publication Date
KR19980045921A true KR19980045921A (ko) 1998-09-15

Family

ID=21731636

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960064166A KR19980045921A (ko) 1995-12-12 1996-12-11 원소 티타늄이 없는 라이너 및 금속간 연결을 위한 제조 공정

Country Status (2)

Country Link
JP (1) JPH09275141A (ja)
KR (1) KR19980045921A (ja)

Also Published As

Publication number Publication date
JPH09275141A (ja) 1997-10-21

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application