KR19980040479A - Copper waste treatment method - Google Patents

Copper waste treatment method Download PDF

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Publication number
KR19980040479A
KR19980040479A KR1019960059665A KR19960059665A KR19980040479A KR 19980040479 A KR19980040479 A KR 19980040479A KR 1019960059665 A KR1019960059665 A KR 1019960059665A KR 19960059665 A KR19960059665 A KR 19960059665A KR 19980040479 A KR19980040479 A KR 19980040479A
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South Korea
Prior art keywords
copper
organic solvent
waste liquid
acid
oxime
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KR1019960059665A
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Korean (ko)
Inventor
김응조
신병철
문영환
Original Assignee
안덕기
삼성엔지니어링 주식회사
이형도
삼성전기 주식회사
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Priority to KR1019960059665A priority Critical patent/KR19980040479A/en
Priority to IDP973736A priority patent/ID19043A/en
Priority to CN97126373A priority patent/CN1192486A/en
Publication of KR19980040479A publication Critical patent/KR19980040479A/en

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    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/66Treatment of water, waste water, or sewage by neutralisation; pH adjustment
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/26Treatment of water, waste water, or sewage by extraction
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/72Treatment of water, waste water, or sewage by oxidation
    • C02F1/725Treatment of water, waste water, or sewage by oxidation by catalytic oxidation

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Abstract

본 발명은 암모니아성 동폐액과 염산산성 동폐액을 유기용매 추출법으로 동시에 처리하여 동을 화합물 형태로 회수하고, 동을 회수하고 남은 부식폐액을 재처리하여 다시 에칭액으로 재생시키는 방법에 관한 것으로서, 간단한 공정을 거쳐 고순도의 동화합물을 회수할 수 있을 뿐만 아니라 애칭액도 재생하여 이용할 수 있다.The present invention relates to a method of recovering copper in the form of a compound by simultaneously treating ammonia copper waste liquid and hydrochloric acid copper waste liquid by an organic solvent extraction method, recovering copper, and reprocessing the remaining corrosion waste liquid again to an etching solution. Through the process, not only can the high purity copper compound be recovered, but also the nicking liquid can be recovered and used.

Description

동폐액 처리방법Copper waste treatment method

도 1은 본 발명의 일 실시예에 의한 동폐액의 연속추출공정을 나타낸 도면이다.1 is a view showing a continuous extraction process of copper waste liquid according to an embodiment of the present invention.

본 발명은 전자제품의 필수부품인 각종 인쇄회로기판(Printed Circuit Board) 제조시 부생되는 동(銅)폐액으로부터 고순도 동을 회수하고 또한 동을 회수하고 남은 폐액을 부식액(이하 에칭액)으로 재생시키는 방법에 관한 것이다. 더욱 상세하게는 인쇄회로기판의 에칭공정에서 발생하는 암모니아성 동폐액과 염산산성 동폐액을 유기용매 추출법으로 동시에 처리하여 고순도의 동을 회수하고, 동을 회수하고 남은 폐액을 재처리하여 다시 에칭액으로 재생시키는 방법에 관한 것이다.The present invention recovers high-purity copper from copper waste liquid produced by the production of various printed circuit boards, which are essential parts of electronic products, and recovers the waste liquid after the recovery of copper with corrosion liquid (hereinafter referred to as etching solution). It is about. More specifically, the ammonia copper waste liquid and the hydrochloric acid copper waste liquid generated in the etching process of the printed circuit board are simultaneously treated with an organic solvent extraction method to recover copper of high purity, and after the copper is recovered, the remaining waste liquid is retreated to an etching solution. It relates to a method of regeneration.

인쇄회로기판은 일반적으로 플라스틱판에 얇은 동판을 적층하고, 그 동판 위에 원하는 부분만 항부식성 잉크(Etching-Resistant Ink)로 인쇄 도포하여 에칭액으로부터 보호되도록 한 후, 동 적층판을 에칭액과 접촉시켜 회로가 아닌 부분의 동을 부식시켜 제거하고, 항부식성 잉크가 인쇄 도포되어 있어 부식되지 않는 부분이 회로를 이루도록 하여 제조한다. 인쇄회로기판은 단층 및 다층 인쇄회로기판으로 구분되며, 단층회로기판 제조시에는 염산산성 동폐액만이 발생한다. 그러나, 일반적으로 많이 사용되는 다층인쇄회로기판의 제조시에는 내층회로 형성시 염산산성 동폐액이 발생하며, 외층회로 형성시에는 암모니아성 동폐액이 발생하므로 일반적인 인쇄회로기판 제조공정에서는 동량의 염산산성 동폐액과 암모니아성 동폐액이 발생하게 된다.In general, a printed circuit board is laminated with a thin copper plate on a plastic plate, and only a desired portion is printed and coated with an etching-resistant ink on the copper plate to protect it from the etching solution, and then the circuit board is brought into contact with the etching solution. The copper of the non-corrosive portion is removed by corrosion, and the anti-corrosive ink is printed and coated so that the non-corrosive portion forms a circuit. Printed circuit boards are classified into single layer and multilayer printed circuit boards. In manufacturing single layer printed circuit boards, only hydrochloric acid copper waste liquid is generated. However, in the manufacture of multilayer printed circuit boards, which are commonly used, hydrochloric acid copper waste liquids are generated when forming inner layer circuits, and ammonia copper waste liquids are generated when outer layer circuits are formed, so the same amount of hydrochloric acid is used in general printed circuit board manufacturing processes. Copper waste liquid and ammonia copper waste liquid will be generated.

에칭액은 사용기간이 증가함에 따라 함유된 동농도가 점점 증가하게 되며 동의 농도가 130g/l 이상이 되면 부식효과가 급격히 감소하므로 동폐액으로 폐기처분된다.Etching liquid is gradually disposed of as copper waste liquid because the copper concentration contained is gradually increased as the service life is increased and the corrosion effect is sharply reduced when the copper concentration is more than 130g / l.

동폐액은 염산을 사용하여 동판을 용해할 경우 발생하는 염산산성 동폐액과 암모니아수를 사용하여 동판을 용해할 경우 발생하는 암모니아성 동폐액으로 구분되는데, 염산산성 동폐액 및 암모니아성 동폐액은 과량의 동(銅)과 함께 염산 또는 암모니아수를 함유한 공해물질로서, 적절히 처리되지 않을 경우 심각한 공해와 자원낭비를 유발하므로 이 동폐액으로부터 동을 회수하고 처리폐액은 에칭액으로 또는 다른 용도로 재생하는 기술의 개발이 필요하다.Copper waste liquid is divided into hydrochloric acid copper waste liquid generated by dissolving copper plate using hydrochloric acid and ammonia copper waste liquid produced when dissolving copper plate using ammonia water. Pollutants containing hydrochloric acid or ammonia water, together with copper, cause severe pollution and waste of resources if not treated properly. Therefore, copper is recovered from this copper waste liquid and the treatment waste liquid is recovered by etching or for other uses. Need development

[발명의목적][Objective of the invention]

본 발명의 목적은 간단한 공정을 거쳐 경제적으로 염산산성 동폐액과 암모니아성 동폐액을 동시에 처리하여 동을 회수하며 아울러 처리된 폐액을 다시 에칭액으로 재생하려는 것이다.It is an object of the present invention to economically process copper hydrochloric acid copper waste liquid and ammonia copper waste liquid through a simple process to recover copper, and also to recover the treated waste liquid back into etching liquid.

[발명이속하는기술분야및그분야의종래기술][Technical Field to which the Invention belongs and Conventional Technology in the Field]

종래의 동폐액의 처리는 전해법, 유기용매 추출법, 이온교환막 전해법 등의 기술을 이용하여 염산산성 동폐액으로부터 동의 회수, 암모니아성 동폐액으로부터 동의 회수, 또는 암모니아와 염산산성 동폐액으로부터 동시에 동을 회수하는 방법이 알려져 있으나, 이들 처리법은 모두 공정 및 경제적인 측면에서 커다란 문제점이 있다.Conventional treatment of copper waste liquid is performed by recovering copper from hydrochloric acid copper waste liquid, recovering copper from ammonia copper waste liquid, or from ammonia and hydrochloric acid copper waste liquid using techniques such as electrolytic method, organic solvent extraction method, ion exchange membrane electrolytic method, etc. There is a known method for recovering, but all of these treatments have great problems in terms of process and economics.

즉, 일본국 특허 공개소 55-145176호, 동소 55-145177호 등에는 전해조를 이용하여 부식폐액의 동을 회수하는 방법을 개시하고 있으나, 이들 방법은 장치의 부식이 심하고 시설 투자비가 과다하여 대량처리가 곤란한 문제점이 있다.In other words, Japanese Patent Laid-Open Publication No. 55-145176 and Japanese Patent Application Laid-Open No. 55-145177 disclose a method of recovering copper of corrosion waste liquid using an electrolytic cell, but these methods have a large amount of corrosion of the apparatus and excessive investment in facilities. There is a problem that the processing is difficult.

또한 일본국 특허출원 공개소 62-53592호, 동소 54-146233호에는 유기용매 추출법이 게재되고 있으나, 이들 방법은 암모니아성 동폐액만 처리 가능한 방법으로 일반적으로 제조공정 중 동량 발생하는 염산산성 동폐액을 처리할 수 없는 결정적인 문제점이 있다.In addition, although Japanese Patent Application Publication Nos. 62-53592 and 54-146233 disclose organic solvent extraction methods, these methods are capable of treating only ammoniacal copper waste liquids, and generally hydrochloric acid copper waste liquids generated in the same amount during the manufacturing process. There is a crucial problem that cannot be handled.

또한, 이온교환막 전해법을 이용하는 방법으로 일본국 특허공개소 61-246395호, 동소 61-133192호 등이 있으나 이들 방법은 이온교환막의 비용이 고가이며 설비투자가 과다하다.In addition, Japanese Patent Application Laid-Open No. 61-246395, Japanese Patent Application No. 61-133192, and the like are used as ion exchange membrane electrolytic methods, but these methods are expensive in terms of cost and excessive investment in facilities.

암모니아성 동폐액으로부터 동을 회수하는 방법으로는 암모니아성 동폐액에 가성소다를 넣고 가열하여 산화동을 석출시켜 이를 회수하고 암모니아를 휘발시켜 포집하는 재래식 방법이 있으나 이 방법은 회수된 산화동에 나트륨 등의 불순물이 함유되어 상품가치가 낮고, 황산동, 염화동으로 전환시킬때 산으로 다시 녹이는 공정이 필요하며, 산화동 회수후 처리폐액을 재처리하는 추가공정이 필요하여 비경제적이다. 그리고 암모니아성 동폐액에 대하여 유기용매로 동을 추출하고 에칭액을 재생하는 대한민국 특허공고 제94-7179호에 개시된 방법은 염산산성 동폐액을 처리할 수 없다는 문제점이 있다.There is a conventional method of recovering copper from the ammonia-based copper waste liquid by adding caustic soda to the ammonia copper waste liquid, heating it to precipitate copper oxide, recovering it, and volatilizing and collecting ammonia. The product value is low because it contains impurities, and it is necessary to dissolve the acid again when converting it to copper sulfate or copper chloride, and it is uneconomical because it requires an additional process of reprocessing the waste liquid after recovery of copper oxide. In addition, the method disclosed in Korean Patent Publication No. 94-7179 for extracting copper with an organic solvent and regenerating etching solution with respect to the ammonia-based copper waste liquid has a problem in that the hydrochloric acid copper waste liquid cannot be treated.

염산산성 동폐액으로부터 동을 회수하는 방법으로는 염산산성 동폐액에 철 또는 아연을 투입하여 동을 얻고 염화철이나 염화아연을 용해시키는 재래식 방법이 있으나 이 재래식 방법은 회수되는 동에 철이나 아연 등이 함유되어 있어 이를 다시 제련하여야 하는 문제점이 있다. 그리고 염산산성 동폐액을 전기분해하여 전기동을 회수하는 일본국 특허공개소 제60-116789 등에 개시된 방법은 비교적 고순도의 전기동을 회수할 수는 있으나 부생되는 염산으로 인하여 장치 부식의 우려가 있고 운전에 어려움이 있다.There is a conventional method for recovering copper from copper acid hydrochloric acid, which is obtained by adding iron or zinc to copper acid hydrochloric acid, to obtain copper, and dissolving iron chloride or zinc chloride. It is contained, there is a problem that must be re-smelted. In addition, the method disclosed in Japanese Patent Publication No. 60-116789, which recovers electrolytic copper by electrolysis of hydrochloric acid copper waste liquid, can recover copper of relatively high purity, but there is a risk of corrosion of the device due to by-produced hydrochloric acid and difficulty in operation. There is this.

암모니아성 동폐액과 염산산성 동폐액을 혼합하여 동을 회수하는 방법으로는 염산산성 동폐액을 암모니아성 동폐액으로 pH 3-6 범위에서 중화시켜 침전물로서 염기성 염화동을 얻는 대한민국 특허공고 제93-4476에 개시된 방법이 있다. 그러나 대한민국 특허공고 제93-4476에 개시된 방법은 염기성 염화동 이외에 반응부산물인 염화암모늄이 동시에 석출되어 제품의 순도가 낮고, 침전물의 여과시 입자크기의 조절이 곤란하며 동(銅)제품으로 전환시 추가공정이 필요하다는 문제점이 있다.A method for recovering copper by mixing ammonia copper waste liquid and hydrochloric acid copper waste liquid is to obtain basic copper chloride as a precipitate by neutralizing the hydrochloric acid copper waste liquid in a pH 3-6 range with ammonia copper waste liquid. There is a method disclosed in. However, the method disclosed in Korean Patent Publication No. 93-4476 is low in purity because of the simultaneous precipitation of ammonium chloride, a reaction by-product, in addition to basic copper chloride, it is difficult to control the particle size when filtering the precipitate, and is added when converting to a copper product. There is a problem that a process is required.

[발명이이루고자하는기술적과제][Technical Challenges to Invent]

본 발명은 위에서 언급한 바와 같이 복잡한 공정, 비경제성 및 염산산성 동폐액과 암모니아성 동폐액의 동시 처리가 어려운 점, 순도가 낮은 점 등을 비롯한 종래기술의 문제점을 해결하고자 하였다.The present invention has been made to solve the problems of the prior art, including the complicated process, the economical and hydrochloric acid copper and ammonia copper is difficult to simultaneously process, low purity and the like.

[발명의구성및작용]Composition and Action of the Invention

본 발명자들은 상기 여러가지 문제점을 해결하기 위하여 연구한 결과, 염산산성 동폐액과 암모니아성 동폐액 혼합시 pH 2 이하로 조정하여 반응 부산물이나 염기성 염화동의 석출 없이 혼합폐액을 제조하고, 이 혼합폐액중의 동을 액상촉매가 함유된 유기용매로 추출하여 고순도의 동을 화합물 상태로 회수함과 동시에 동을 회수한 이후의 추출폐액에 소량의 첨가제를 투입하여 에칭액으로 전량 재생할 수 있는 새로운 기술을 발명하게 되었다. 이하 본 발명의 구성 및 작용을 상세히 설명한다.The present inventors have studied to solve the above various problems, and when the mixture of acidic copper acid hydrochloric acid and ammonia copper waste liquid is adjusted to pH 2 or less to prepare a mixed waste liquid without precipitation of reaction by-products or basic copper chloride, Invented a new technology that extracts copper with an organic solvent containing a liquid catalyst to recover high-purity copper in a compound state, and at the same time, adds a small amount of additives to the extraction waste liquid after recovering copper, and regenerates it entirely with an etching solution. . Hereinafter, the configuration and operation of the present invention will be described in detail.

본 발명은 염산산성 동폐액과 암모니아성 동폐액을 혼합하여 pH 2 이하로 중화시키는 단계와, 상기 혼합된 동폐액을 액상촉매가 함유된 유기용매와 접촉시켜 동이온을 유기용매상으로 추출하는 단계와, 상기 추출된 유기용매상을 무기산으로 역추출하여 고순도의 동을 화합물 상태로 회수하는 단계를 포함하는 동폐액으로부터 고순도 동을 회수하는 방법을 제공한다.The present invention comprises the steps of neutralizing the acidic copper waste liquid and the ammonia copper waste liquid to pH 2 or less, and contacting the mixed copper waste liquid with an organic solvent containing a liquid catalyst to extract the copper ions to the organic solvent phase And it provides a method for recovering high purity copper from the copper waste liquid comprising the step of recovering the extracted organic solvent phase with an inorganic acid to recover a high purity copper in a compound state.

일반적으로 동의 농도가 진해져서 폐기되는 암모니아성 동폐액과 염산산성 동폐액의 성분조성은 다음 표 1과 같다.In general, the composition of ammonia copper waste liquid and hydrochloric acid copper waste liquid discarded due to the increase of copper concentration is shown in Table 1 below.

구분division 총Cu함량Total Cu content 염화암모늄(NH4Cl)Ammonium Chloride (NH 4 Cl) 염산(HCl)Hydrochloric acid (HCl) 암모니아(NH3)Ammonia (NH 3 ) 암모니아성 동폐액Ammonia Copper Waste 100 ∼ 170100-170 240 ∼ 300240 to 300 80 ∼ 12080-120 -- 염산산성 동폐액Acid hydrochloric acid copper waste liquid 110 ∼ 150110 to 150 -- 70 ∼ 10070-100

(단위 ; g/l)(Unit; g / l)

본 발명은 암모니아성 동폐액과 염산산성 동폐액을 혼합하여 pH 2 이하로 중화한 후, 액상촉매가 함유된 옥심계, 디케톤계, 인산계, 카르복실산계 또는 포스핀산계 유기용매와 접촉시켜 동이온을 유기용매상으로 추출하는 방법을 사용하였는데, 여기에서 혼합 폐액을 pH 2.5 이하로, 더욱 바람직하게는 pH 1.5∼2.0으로 하는 것은 아래의 화학식 1과 같이 암모니아성 동폐액과 염산산성 동폐액의 혼합액이 pH 3 이상인 경우 반응부산물인 염화암모늄과 염기성 염화동이 침전되어 동의 추출이 곤란한 문제점이 있으므로 pH를 조절하여 반응부산물이나 염기성 염화동의 석출이 없는 맑은 혼합폐액을 제조하여 동을 추출하는 것이 바람직하기 때문이다. 또한, 유기용매 추출공정을 채택한 이유는 99 % 이상의 고순도의 동을 경제적으로 회수할 수 있기 때문이다.The present invention mixes ammonia-based copper waste solution with hydrochloric acid copper waste solution and neutralizes it to pH 2 or less, and then contacts with an oxime-based, diketone-based, phosphoric-acid-based, carboxylic-based or phosphinic-based organic solvent containing a liquid catalyst. A method of extracting ions into an organic solvent phase was used, wherein the mixed waste solution to pH 2.5 or less, and more preferably to pH 1.5 to 2.0, is a mixture of ammonia copper waste acid and hydrochloric acid copper waste liquid as shown in Formula 1 below. If the mixed solution has a pH of 3 or more, ammonium chloride and basic copper chloride, which are reaction byproducts, are precipitated, so it is difficult to extract copper. Thus, it is preferable to prepare a clear mixed waste liquid without precipitation of the reaction byproduct or basic copper chloride and extract copper by adjusting the pH. Because. The reason why the organic solvent extraction process is adopted is that it is possible to economically recover high purity copper of 99% or more.

[화학식 1][Formula 1]

Cu(NH3)4Cl2+ 4H2O + 2CuCl2→ CuCl2·2Cu(CH)2+ 4NH4ClCu (NH 3 ) 4 Cl 2 + 4H 2 O + 2 CuCl 2 → CuCl 2 2Cu (CH) 2 + 4 NH 4 Cl

혼합 동폐액의 pH가 2.5 이하인 경우 동폐액상의 동이온이 유기용매상으로 추출되는 속도가 현저히 낮아져 추출장치가 대형화되는 문제점이 있으나 본 발명에서는 유기용매에 액상촉매를 도입함으로써 이와 같은 문제점을 해결하였다. 이를 상세히 설명하면 다음과 같다.When the pH of the mixed copper waste liquid is 2.5 or less, the rate of extracting copper ions from the copper waste liquid into the organic solvent phase is significantly lowered, thereby increasing the size of the extraction device. However, the present invention solves such problems by introducing a liquid catalyst into the organic solvent. . This will be described in detail as follows.

상기 암모니아성 동폐액, 염산산성 동폐액, 산성용액이 혼합된 폐액을 유기용매와 접촉시키면 암모니아성 동폐액과 염산산성 동폐액에서 동시에 추출반응이 일어나며 그 대표적인 반응은 화학식 2, 3과 같다.When the ammonia copper waste liquid, hydrochloric acid copper waste liquid, and the acidic solution mixed waste liquid are contacted with an organic solvent, an extraction reaction occurs simultaneously in the ammonia copper waste liquid and the hydrochloric acid copper waste liquid, and the typical reactions are represented by Chemical Formulas 2 and 3.

[화학식 2][Formula 2]

암모니아성 동폐액으로부터 동의 추출반응Extraction of Copper from Ammonia Copper Waste

Cu(NH3)4Cl2+ 2RH → CuR2+ 2NH4Cl + 2NH3 Cu (NH 3 ) 4 Cl 2 + 2RH → CuR 2 + 2NH 4 Cl + 2NH 3

[화학식 3][Formula 3]

염산산성 동폐액으로부터 동의 추출반응Extraction reaction of copper from acidic hydrochloric acid

CuCl2+ 2RH → CuR2+ 2HClCuCl 2 + 2RH → CuR 2 + 2HCl

상기 반응식에서 R 은 유기용매를 나타낸다.In the above scheme, R represents an organic solvent.

이와 같은 추출반응시 암모니아성 동폐액으로부터는 암모니아(NH3)가 부생되고 염산산성 동폐액으로부터는 염산 (HCl)이 부생되는데 암모니아와 염산이 서로 중화되어 혼합수용액의 pH 변화가 크게 일어나지 않고 안정된 상태에서 반응이 진행되므로 동의 추출이 용이하다. 암모니아성 동폐액과 염산산성 동폐액을 동량 혼합하는 경우에는 pH가 3 이상이 되므로 일반적으로 무기산을 추가로 투입하여 pH를 2 이하로 조절하는 것이 바람직하다. 상기 무기산으로는 황산, 염산, 질산, 인산 등이 바람직하며, 그 중 황산, 염산이 더욱 바람직하다.In this extraction reaction, ammonia (NH 3 ) is a by-product from ammonia copper waste solution and hydrochloric acid (HCl) is a by-product from hydrochloric acid copper waste solution.Ammonia and hydrochloric acid are neutralized to stabilize the pH of mixed aqueous solution. Since the reaction proceeds in, it is easy to extract the copper. In the case where the same amount of ammonia copper waste liquid and hydrochloric acid copper waste liquid are mixed, the pH becomes 3 or more. As the inorganic acid, sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid, and the like are preferable, and sulfuric acid and hydrochloric acid are more preferable.

본 발명에서 동의 추출 목적으로 사용될 수 있는 유기용매는 옥심계, 디케톤계, 인산계, 카르복실산계, 포스핀산계 등이며 구체적으로는 다음과 같은 화합물을 포함한다.Organic solvents that can be used for the purpose of extracting copper in the present invention are oxime, diketone, phosphoric acid, carboxylic acid, phosphinic acid and the like, and specifically include the following compounds.

옥심계 : 5,8-디에칠-7하이드록시-6-도데카논 옥심Oxime system: 5,8-Diethyl-7hydroxy-6-dodecanone oxime

2-하이드록시-5 도데실 벤조페논 옥심2-hydroxy-5 dodecyl benzophenone oxime

2-하이드록시-5 노닐 벤조 옥심2-hydroxy-5 nonyl benzo oxime

2-하이드록시-5 노닐 아세토 페논 옥심2-hydroxy-5 nonyl acetophenone oxime

2-하이드록시-3 크로로-5-노닐 벤조 옥심2-hydroxy-3 chloro-5-nonyl benzo oxime

5-노닐 사리실 옥심5-nonyl saricil oxime

디케톤계 : 페닐알킬 베타-디케톤Diketone series: phenylalkyl beta-diketone

인산계 : 디-2-에틸헥실인산 (D2EPHA)Phosphoric acid system: di-2-ethylhexyl phosphate (D2EPHA)

2-에틸핵실하이드로겐 2-에틸헥실인산 (PC 88A)2-ethylnucleosilhydrogen 2-ethylhexyl phosphoric acid (PC 88A)

카르복실산계 : 버사틱산Carboxylic acid type: Versatic acid

포스핀산계 : 시아넥스 301, 302, 303Phosphonic acid: Cyanex 301, 302, 303

이상의 유기용매 중에서 옥심계가 바람직하고 상품명으로는 Henkel사 제품인 LIX 84, LIX 54 등이 바람직하다. 또한 이상의 유기용매는 단독으로 또는 2 이상이 혼합되어 사용될 수 있다. 동추출용 유기용매의 조성은 일반적으로 상기 유기용매 5-90%, 석유 등의 희석제 10-95%로 구성될 수 있으나, 고농도의 동폐액으로부터 동을 추출하는 경우에는 동 추출용 유기용매 전체 부피를 100%라 할 때 30부피%의 옥심계 유기용매를 사용하는 것이 바람직하다.An oxime system is preferable among the above organic solvents, and, as a brand name, LIX 84, LIX 54, etc. made by Henkel Corporation are preferable. In addition, the above organic solvents may be used alone or in combination of two or more. The composition of the organic solvent for copper extraction may be generally composed of 5-90% of the organic solvent, 10-95% of a diluent such as petroleum, but when extracting copper from a high concentration of copper waste liquid, the total volume of the organic solvent for copper extraction When it is 100% it is preferable to use an oxime organic solvent of 30% by volume.

혼합 동폐액의 pH가 2.5 이하인 경우, 동폐액상의 동이온의 유기용매상으로의 추출속도가 현저히 낮아져 추출장치가 대형화되는 문제점이 있으나 본 발명에서는 추출용매에 동폐액 중 동이온의 유기용매상으로의 추출속도를 현저히 증가시키고 또한 추출용매와 동폐액의 분리속도를 빠르게 하는 액상촉매를 도입하여 이와 같은 문제점을 독창적으로 해결하였다.When the pH of the mixed copper liquid is 2.5 or less, the extraction rate of copper ions into the organic solvent phase of the copper waste liquid is significantly lowered, so that the extraction apparatus is enlarged. However, in the present invention, the extraction solvent is used as an organic solvent of copper ions in the copper solvent. This problem has been solved uniquely by introducing a liquid catalyst which significantly increases the extraction speed and speeds up the separation of the extraction solvent and the copper waste solution.

사용되는 액상촉매는 비점 100 - 250℃ 범위의 파라핀계, 아로마틱계, 나프텐계의 탄화수소 화합물 및 이들의 혼합물로서 예를 들면, 이소데카놀, 2-에틸헥사놀, 티리부틸포스페이트(TBP), 노닐알콜 또는 이들의 혼합물이며, 바람직하게는 이소데카놀, 2-에틸헥사놀, 또는 구입 가능한 유기용매 혼합물로서 유공사 제품인 코코졸(kocosol) 등이 적합하다. 본 발명에서 액상촉매는 바람직하게는 동추출용 유기용매 총부피를 100%로 할 때 5-70부피%, 더욱 바람직하게는 20-50부피%가 적합하다.The liquid catalysts used are paraffinic, aromatic and naphthenic hydrocarbon compounds having a boiling point in the range of 100-250 ° C. and mixtures thereof, for example isodecanol, 2-ethylhexanol, thiributyl phosphate (TBP), nonyl Alcohols or mixtures thereof, preferably isodecanol, 2-ethylhexanol, or commercially available organic solvent mixtures such as cocosol, etc. are suitable. In the present invention, the liquid catalyst is preferably 5-70% by volume, more preferably 20-50% by volume, when the total volume of the organic solvent for copper extraction is 100%.

이상의 추출공정에 따라 유기용매상으로 이동된 동은 황산, 염산, 질산 등의 무기산용액으로 역추출(stripping)된다. 예를 들면, 황산 수용액으로 역추출할 경우의 반응은 화학식 4와 같다.Copper, which has been transferred to the organic solvent phase according to the above extraction process, is back extracted with an inorganic acid solution such as sulfuric acid, hydrochloric acid and nitric acid. For example, when back-extracted with an aqueous sulfuric acid solution, the reaction is as shown in Chemical Formula 4.

[화학식 4][Formula 4]

CuR2+ H2SO4→ 2RH + CuSO4 CuR 2 + H 2 SO 4 → 2RH + CuSO 4

역추출에 사용되는 무기산용액(이하에서 역추출액)은 일정한 고농도의 동이 농축될 때까지 재사용된다. 이 역추출액에서 유기용매의 오염을 제거하기 위하여 활성탄층을 통과시킬 수도 있다. 고농도의 동을 함유하는 역추출액은 소량의 진한 산을 투입하여 포화된 무기산 염을 석출시키거나 증발, 농축하여 무기산 염을 결정상태로 회수할 수 있으며 증발 농축하는 경우 과다한 에너지가 소모되므로 진한 산을 투입하여 회수하는 방법이 바람직하다. 또한 동 추출후 남은 폐액은 암모니아수(NH3solution), 탄산암모늄(NH4HCO3), 인산암모늄((NH4)3(PO4)), 질산암모늄(NH4NO3), 나트륨염(NaClO2)과 같은 안정제, 부식방지제 소량을 투입하여 에칭액으로 재생하여 사용할 수 있다.The inorganic acid solution used for back extraction (hereinafter referred to as back extraction) is reused until a certain concentration of copper is concentrated. In this back extract, the activated carbon layer may be passed to remove the contamination of the organic solvent. The back extract containing high concentration of copper can add a small amount of concentrated acid to precipitate saturated mineral acid salts, or evaporate and concentrate to recover the inorganic acid salts in crystalline state. The method of throwing in and recovering is preferable. In addition, the remaining liquid after copper extraction was ammonia water (NH 3 solution), ammonium carbonate (NH 4 HCO 3 ), ammonium phosphate ((NH 4 ) 3 (PO 4 )), ammonium nitrate (NH 4 NO 3 ), sodium salt (NaClO A small amount of stabilizer and corrosion inhibitor as in 2 ) can be added and recycled into the etchant.

이하에서는 본 발명의 실시예를 개시하였다. 그러나, 본 발명의 범위가 아래의 실시예에 의하여 한정되는 것은 아니다.Hereinafter, an embodiment of the present invention has been disclosed. However, the scope of the present invention is not limited by the following examples.

실시예 1Example 1

실험에 사용된 염산산성 동폐액과 암모니아성 동폐액의 조성은 표 2와 같다.The composition of hydrochloric acid copper waste liquid and ammonia copper waste liquid used in the experiment is shown in Table 2.

구분division 총Cu함량Total Cu content 염화암모늄(NH4Cl)Ammonium Chloride (NH 4 Cl) 염산(HCl)Hydrochloric acid (HCl) 암모니아(NH3)Ammonia (NH 3 ) 암모니아성 동폐액Ammonia Copper Waste 130130 240240 8989 -- 염산산성 동폐액Acid hydrochloric acid copper waste liquid 115115 -- -- 7676

(단위: g/l)(Unit: g / l)

염산산성 동폐액 100ml에 암모니아성 동폐액 100ml를 혼합한 후 pH를 2.0으로 조절하면서 염화암모늄이 결정으로 석출하는 것을 방지하기 위하여 증류수 95ml, 황산 5ml를 첨가하여 짙은 초록빛의 혼합 동폐액 300ml를 제조하였다. 유기용매는 부피비율로 옥심계(LIX 84) 30 %, 코코졸(상표명) 30%, 석유 40%를 혼합하여 조제하였다. 조제된 유기용매 300ml와 혼합동폐액 300ml를 1리터 분액깔대기에 넣고 격렬히 2분간 흔든 다음 5분간 방치하면 수용액상과 유기용매상이 분리된다. 수용액상을 분액깔대기로 분리하고 남은 유기용매에 증류수 300ml를 투입하여 격렬히 흔들어 세척한 다음 세척액을 유기용매와 분리한다. 세척된 유기용매에 30% 농도의 황산용액 300ml을 넣고 2분간 격렬히 흔들면 동이온이 황산용액으로 역추출된다. 역추출이 행하여진 유기용매는 강한 산성이므로 증류수로 잔여 산기를 2회 세척하고 처음의 수용액상은 암모니아수를 첨가하여 pH 2로 조정한 후에 다시 유기용매로 추출하며 같은 방법으로 총 6회 실시한다. 이 때 황산 용액은 계속 반복 사용되며 6회의 추출이 끝난 수용액상은 짙은 초록빛에서 무색의 맑은 용액으로 변하고 동이온 농도가 3ppm 이하로 된다. 역추출 황산용액을 증발 농축하여 황산동의 결정을 실험실적으로 24g 얻었으며, 황산동의 순도는 CuSO4·5H2O 기준으로 99.9% 이상이며 불순물의 농도는 다음 표 3과 같다.100 ml of ammonia-based copper waste solution was mixed with 100 ml of hydrochloric acid hydrochloric acid solution, and then, 95 ml of distilled water and 5 ml of sulfuric acid were added to prevent precipitation of ammonium chloride into crystals while adjusting the pH to 2.0. . The organic solvent was prepared by mixing 30% oxime (LIX 84), 30% cocosol (trade name), and 40% petroleum by volume ratio. 300 ml of the prepared organic solvent and 300 ml of mixed copper liquid are placed in a 1-liter funnel, shaken vigorously for 2 minutes, and left for 5 minutes to separate the aqueous phase and the organic solvent phase. The aqueous phase is separated with a separatory funnel, and 300 ml of distilled water is added to the remaining organic solvent, followed by vigorous shaking to separate the washing solution from the organic solvent. 300ml of 30% sulfuric acid solution was added to the washed organic solvent, and vigorously shaken for 2 minutes, copper ions were back extracted into sulfuric acid solution. The organic solvent extracted back is strongly acidic, so the remaining acid groups are washed twice with distilled water, the first aqueous phase is adjusted to pH 2 by adding ammonia water, and extracted again with organic solvent. At this time, the sulfuric acid solution is repeatedly used, and the six-extracted aqueous phase is changed from dark green to colorless and clear solution, and the copper ion concentration is 3 ppm or less. The back extracted sulfuric acid solution was evaporated and concentrated to obtain 24g of crystals of copper sulfate, and the purity of copper sulfate was 99.9% or more based on CuSO 4 · 5H 2 O, and the concentrations of impurities are shown in Table 3 below.

CuCu FeFe ZnZn NiNi CdCD AsAs CaCa SnSn NaNa 25.61%25.61% 2ppm2 ppm 3ppm3 ppm 미량a very small amount 미량a very small amount 0.15ppm0.15 ppm 미량a very small amount 미량a very small amount 미량a very small amount

동이 추출된 300 ml의 추잔액에 172g/l의 염화암모늄만 남게 되고 이 추잔액에 암모니아수 75ml, 탄산암모늄 10g, 나트륨염 100mg, 질산암모늄 30mg, 인산암모늄 0.3mg을 첨가하여 에칭액으로 재생하였다.Only 172 g / l of ammonium chloride remained in the 300 ml extract, which was extracted with copper, and 75 ml of ammonia water, 10 g of ammonium carbonate, 100 mg of sodium salt, 30 mg of ammonium nitrate, and 0.3 mg of ammonium phosphate were added to the etching solution.

실시예 2Example 2

실시예 1과 동일하게 동을 추출하고 역추출액으로 30%의 질산 수용액을 사용하여 고순도(99.9%)의 질산동을 얻었다.Copper was extracted in the same manner as in Example 1 and high purity (99.9%) of copper nitrate was obtained using a 30% nitric acid solution as a back extract.

실시예 3Example 3

실시예 1과 동일하게 동을 추출하고 역추출액으로 25%의 염산 수용액을 사용하여 고순도(99.9%)의 염화동을 얻었다.Copper was extracted in the same manner as in Example 1, and high-purity (99.9%) copper chloride was obtained using a 25% aqueous hydrochloric acid solution as a back extract.

실시예 4Example 4

실시예 1을 연속공정에 적용하여 실시예 1과 같은 동폐액 혼합물과 유기용매를 향류식 믹서-세틀러(mixer-settler)장치로 접촉, 분리하였으며 역추출 무기산으로 30%의 황산 수용액을 사용하였다. 이 때 유기용매상과 수용액상의 비율을 8:1로 하여 실험하였으며 추출단 4단, 세척단 2단, 역추출단 2단, 역추출후 세척단 2단으로 하였다. 각 추출단에서 암모니아수를 투입하여 pH는 2로 유지하였으며 체류시간은 믹서에서 2분, 세틀러에서 8분의 체류시간을 갖게 하였다. 이와 같은 과정에서 수용액상으로 방류되는 동이온의 농도는 3ppm 이하이며 동의 순도는 황산동 제품기준으로 99.9% 이상이었다. 이 공정을 도 1에 나타내었다.Example 1 was applied to a continuous process, and the same copper mixture and the organic solvent as in Example 1 were contacted and separated with a countercurrent mixer-settler apparatus, and 30% aqueous sulfuric acid solution was used as the back extraction inorganic acid. At this time, the ratio of the organic solvent phase and the aqueous phase was tested to be 8: 1, and the extraction stage was 4 stages, the washing stage 2 stages, the back extraction stage 2 stages, and the back extraction after the extraction stage 2 stages. Ammonia water was added from each extraction stage to maintain a pH of 2, and the residence time was 2 minutes in the mixer and 8 minutes in the settler. In this process, the concentration of copper ions discharged into the aqueous phase was 3 ppm or less, and the copper purity was 99.9% or more based on the copper sulfate product standard. This process is shown in FIG.

[발명의효과][Effects of the Invention]

본 발명의 방법으로 인쇄회로기판 제조공정 중에 발생하는 염산산성 동폐액과 암모니아성 동폐액을 동시에 처리하면 고순도의 동화합물을 회수하여 재활용할 수 있을 뿐만 아니라 부식액도 재생하여 이용할 수 있는 이점이 있다. 인쇄회로기판 제조업체에서는 산업 폐기물이 발생하지 않아 동폐액처리에 수반되는 여러가지 문제점을 해결할 수 있으며 회수되는 동은 동도금, 안료, 매염제, 피혁처리제로 이용되고 있는 고순도의 황산동이나 이외에 공업적으로 광범위하게 사용되고 있는 염화동이나 질산동으로 회수할 수 있는 경제적 이점이 있다.By treating hydrochloric acid copper waste liquid and ammonia copper waste liquid generated in the process of manufacturing a printed circuit board by the method of the present invention at the same time, it is possible to recover and recycle the copper compound of high purity as well as to regenerate and use the corrosion liquid. Printed circuit board manufacturers can solve various problems associated with copper waste treatment because industrial waste does not occur. The recovered copper is widely used industrially in addition to high-purity copper sulfate, which is used as copper plating, pigment, mordant, and leather treatment agent. There is an economic advantage to recover with copper chloride or copper nitrate.

Claims (13)

염산산성 동폐액과 암모니아성 동폐액을 혼합하고 산도를 pH 2.5 이하로 조정하는 단계와, 상기 pH 2 이하로 조정된 혼합 동폐액을 액상촉매가 포함된 유기용매와 접촉시켜 동이온을 유기용매상으로 추출하는 단계와, 상기 추출된 유기용매상의 동이온을 역추출하여 동을 화합물 상태로 회수하는 단계를 포함하는 동폐액 처리방법.Mixing the acidic copper waste fluid and the ammonia copper waste liquid and adjusting the acidity to pH 2.5 or less, and contacting the mixed copper waste liquid adjusted to pH 2 or less with an organic solvent containing a liquid catalyst to form copper ions in an organic solvent phase. And extracting copper ions from the extracted organic solvent and recovering copper in a compound state. 제 1항에 있어서, 상기 혼합 동폐액의 산도는 pH 1.5∼2.0 범위로 조정하는 것을 특징으로 하는 동폐액 처리방법.The method of claim 1, wherein the acidity of the mixed copper waste liquid is adjusted to a pH range of 1.5 to 2.0. 제 1항에 있어서, 상기 유기용매는 옥심계, 디케톤계, 인산계, 카르복실산계, 포스핀산계 및 이들의 혼합물을 포함하는 그룹 중에서 선택되는 것을 특징으로 하는 동폐액 처리방법.The method of claim 1, wherein the organic solvent is selected from the group consisting of oxime, diketone, phosphoric acid, carboxylic acid, phosphinic acid and mixtures thereof. 제 3항에 있어서, 상기 옥심계 유기용매는 5,8-디에칠-7하이드록시-6-도데카논 옥심, 2-하이드록시-5 도데실 벤조페논 옥심, 2-하이드록시-5 노닐 벤조 옥심, 2-하이드록시-5 노닐 아세토 페논 옥심, 2-하이드록시-3 크로로-5-노닐 벤조 옥심, 5-노닐 사리실 옥심 및 이들의 혼합물을 포함하는 그룹 중에서 선택되는 것을 특징으로 하는 동폐액 처리방법.The oxime organic solvent according to claim 3, wherein the oxime organic solvent is 5,8-dimethyl-7hydroxy-6-dodecanone oxime, 2-hydroxy-5 dodecyl benzophenone oxime, 2-hydroxy-5 nonyl benzo oxime , 2-hydroxy-5 nonyl acetophenone oxime, 2-hydroxy-3 chloro-5-nonyl benzo oxime, 5-nonyl saricil oxime, and a mixture thereof. Treatment method. 제 3항에 있어서, 상기 디케톤계 유기용매는 페닐알킬 베타-디케톤인 것을 특징으로 하는 동폐액 처리방법.The method of claim 3, wherein the diketone organic solvent is phenylalkyl beta-diketone. 제 3항에 있어서, 상기 인산계 유기용매는 디-2-에틸헥실인산(D2EPHA), 2-에틸핵실하이드로겐 2-에틸헥실인산(PC 88A) 및 이들의 혼합물을 포함하는 그룹 중에서 선택되는 것을 특징으로 하는 동폐액 처리방법.The method of claim 3, wherein the phosphate organic solvent is selected from the group consisting of di-2-ethylhexyl phosphate (D2EPHA), 2-ethylhexylhydrogen 2-ethylhexyl phosphate (PC 88A), and mixtures thereof. Copper waste liquid treatment method characterized in that. 제 3항에 있어서, 상기 카르복실산계 유기용매는 버사틱산인 것을 특징으로 하는 동폐액 처리방법.The method of claim 3, wherein the carboxylic acid-based organic solvent is versatic acid. 제 3항에 있어서, 상기 포스핀산계 유기용매는 시아넥스(상표) 301, 302, 303 중에서 1 이상을 선택하는 것을 특징으로 하는 동폐액 처리방법.The method of claim 3, wherein the phosphinic acid-based organic solvent is selected from the group consisting of Cyanex (301), 302, 303 or more. 제 2항에 있어서, 상기 액상촉매는 비점 100 - 250℃ 범위의 파라핀계, 아로마틱계, 나프텐계의 탄화수소 화합물 및 이들의 혼합물 중에서 선택되는 것을 특징으로 하는 동폐액 처리방법.[Claim 3] The method of claim 2, wherein the liquid catalyst is selected from among paraffinic, aromatic, naphthenic hydrocarbon compounds and mixtures thereof having a boiling point of 100 to 250 ° C. 제 9항에 있어서, 상기 액상촉매는 이소데카놀, 2-에틸헥사놀, 티리부틸포스페이트(TBP), 노닐알콜 및 이들의 혼합물을 포함하는 그룹 중에서 선택되는 것을 특징으로 하는 동폐액 처리방법.10. The method of claim 9, wherein the liquid catalyst is selected from the group consisting of isodecanol, 2-ethylhexanol, thiributyl phosphate (TBP), nonyl alcohol and mixtures thereof. 제 1항에 있어서, 상기 역추출은 무기산을 첨가하여 수행되는 것을 특징으로 하는 동폐액 처리방법.The method for treating copper waste liquid according to claim 1, wherein the reverse extraction is performed by adding an inorganic acid. 제 11항에 있어서, 상기 무기산은 황산, 질산, 염산 중에서 선택되는 것을 특징으로 하는 동폐액 처리방법.12. The method of claim 11, wherein the inorganic acid is selected from sulfuric acid, nitric acid, hydrochloric acid. 유기용매 추출단계와 역추출단계로부터 동이 추출된 잔여 폐액에 염을 부가하여 재생 에칭액을 제조하는 것을 특징으로 하는 동폐액 처리방법.And a salt is added to the residual waste liquid from which the copper is extracted from the organic solvent extraction step and the reverse extraction step to prepare a regenerated etching solution.
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WO2005120675A1 (en) * 2004-06-08 2005-12-22 Daeil Development Co., Ltd. Method for treating of etching acid waste containing phosphoric acid, acetic acid and nitric acid
CN109055938A (en) * 2018-08-30 2018-12-21 惠州大亚湾亿田环保技术有限公司 A kind of acid erosion copper waste liquid environmental protection recyclable device and its technique of zero-emission

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CN100383282C (en) * 2005-09-23 2008-04-23 祁佰伟 Comprehensive utilization method of corrosive liquid for producing breastplate
CN102019430B (en) * 2009-09-18 2012-09-05 福建师范大学福清分校 Method for recovering copper from alkaline etching waste liquid and recycling alkaline etching liquid
CN102839379A (en) * 2012-09-26 2012-12-26 重庆康普化学工业有限公司 On-line treatment method of acidic etching solution
CN107857331B (en) * 2017-11-15 2020-05-12 山东大学 Method for recovering and removing copper ions in wastewater by using solid foam method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005120675A1 (en) * 2004-06-08 2005-12-22 Daeil Development Co., Ltd. Method for treating of etching acid waste containing phosphoric acid, acetic acid and nitric acid
CN109055938A (en) * 2018-08-30 2018-12-21 惠州大亚湾亿田环保技术有限公司 A kind of acid erosion copper waste liquid environmental protection recyclable device and its technique of zero-emission

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