Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10B—ELECTRONIC MEMORY DEVICES
  • H10B12/00—Dynamic random access memory [DRAM] devices
  • H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
  • H10B12/31—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
  • H10B12/318—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor the storage electrode having multiple segments
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
  • H01L28/40—Capacitors
  • H01L28/60—Electrodes
  • H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
  • H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
  • H01L28/91—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions made by depositing layers, e.g. by depositing alternating conductive and insulating layers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
  • H01L28/40—Capacitors
  • H01L28/60—Electrodes
  • H01L28/82—Electrodes with an enlarged surface, e.g. formed by texturisation
  • H01L28/90—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions
  • H01L28/92—Electrodes with an enlarged surface, e.g. formed by texturisation having vertical extensions made by patterning layers, e.g. by etching conductive layers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10B—ELECTRONIC MEMORY DEVICES
  • H10B12/00—Dynamic random access memory [DRAM] devices
  • H10B12/01—Manufacture or treatment
  • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
  • H10B12/03—Making the capacitor or connections thereto
  • H10B12/033—Making the capacitor or connections thereto the capacitor extending over the transistor

Landscapes

• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Semiconductor Memories (AREA)
• Semiconductor Integrated Circuits (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=16607169

Family Applications (1)

Country Status (4)

• 1996
  • 1996-08-09 JP JP8211513A patent/JPH1056151A/ja active Pending
• 1997
  • 1997-06-12 TW TW086108151A patent/TW382145B/zh active
  • 1997-07-15 DE DE19730346A patent/DE19730346A1/de not_active Ceased
  • 1997-07-31 KR KR19970036334A patent/KR19980018255A/ko not_active Application Discontinuation

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