KR102770824B1 - 이온 에너지 분포 함수들(iedf)의 생성 - Google Patents

이온 에너지 분포 함수들(iedf)의 생성 Download PDF

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KR102770824B1
KR102770824B1 KR1020237014022A KR20237014022A KR102770824B1 KR 102770824 B1 KR102770824 B1 KR 102770824B1 KR 1020237014022 A KR1020237014022 A KR 1020237014022A KR 20237014022 A KR20237014022 A KR 20237014022A KR 102770824 B1 KR102770824 B1 KR 102770824B1
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voltage
wafer
electrode
applying
energy distribution
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KR20230062662A (ko
Inventor
레오니드 도프
트래비스 코
올리비에 루에르
올리비에 주베르트
필립 에이. 크라우스
라진더 딘사
제임스 휴 로저스
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/08—Ion sources; Ion guns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/248—Components associated with high voltage supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32577—Electrical connecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32697—Electrostatic control
    • H01J37/32706—Polarising the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020237014022A 2016-12-12 2017-12-11 이온 에너지 분포 함수들(iedf)의 생성 Active KR102770824B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201662433204P 2016-12-12 2016-12-12
US62/433,204 2016-12-12
US15/834,939 US10312048B2 (en) 2016-12-12 2017-12-07 Creating ion energy distribution functions (IEDF)
US15/834,939 2017-12-07
KR1020217039273A KR102527251B1 (ko) 2016-12-12 2017-12-11 이온 에너지 분포 함수들(iedf)의 생성
PCT/US2017/065546 WO2018111751A1 (en) 2016-12-12 2017-12-11 Creating ion energy distribution functions (iedf)

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020217039273A Division KR102527251B1 (ko) 2016-12-12 2017-12-11 이온 에너지 분포 함수들(iedf)의 생성

Publications (2)

Publication Number Publication Date
KR20230062662A KR20230062662A (ko) 2023-05-09
KR102770824B1 true KR102770824B1 (ko) 2025-02-19

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KR1020237014022A Active KR102770824B1 (ko) 2016-12-12 2017-12-11 이온 에너지 분포 함수들(iedf)의 생성
KR1020197019342A Active KR102335200B1 (ko) 2016-12-12 2017-12-11 이온 에너지 분포 함수들(iedf)의 생성
KR1020217039273A Active KR102527251B1 (ko) 2016-12-12 2017-12-11 이온 에너지 분포 함수들(iedf)의 생성

Family Applications After (2)

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KR1020197019342A Active KR102335200B1 (ko) 2016-12-12 2017-12-11 이온 에너지 분포 함수들(iedf)의 생성
KR1020217039273A Active KR102527251B1 (ko) 2016-12-12 2017-12-11 이온 에너지 분포 함수들(iedf)의 생성

Country Status (6)

Country Link
US (4) US10312048B2 (enExample)
JP (3) JP7213808B2 (enExample)
KR (3) KR102770824B1 (enExample)
CN (2) CN109997214B (enExample)
TW (3) TW202503813A (enExample)
WO (1) WO2018111751A1 (enExample)

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JP2024133686A (ja) 2024-10-02
TWI784991B (zh) 2022-12-01
JP2020501351A (ja) 2020-01-16
TWI855415B (zh) 2024-09-11
US20210343496A1 (en) 2021-11-04
TW201833965A (zh) 2018-09-16
KR102335200B1 (ko) 2021-12-02
US11069504B2 (en) 2021-07-20
TW202312210A (zh) 2023-03-16
JP7213808B2 (ja) 2023-01-27
US20180166249A1 (en) 2018-06-14
JP7766751B2 (ja) 2025-11-10
US10312048B2 (en) 2019-06-04
WO2018111751A1 (en) 2018-06-21
US10685807B2 (en) 2020-06-16
CN112701025B (zh) 2024-03-26
US11728124B2 (en) 2023-08-15
CN112701025A (zh) 2021-04-23
KR20190083007A (ko) 2019-07-10
JP2023022086A (ja) 2023-02-14
KR20230062662A (ko) 2023-05-09
KR102527251B1 (ko) 2023-04-27
US20190259562A1 (en) 2019-08-22
CN109997214B (zh) 2023-08-22
KR20210150603A (ko) 2021-12-10
JP7703507B2 (ja) 2025-07-07
TW202503813A (zh) 2025-01-16
CN109997214A (zh) 2019-07-09
US20200266022A1 (en) 2020-08-20

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