KR102753865B1 - 핀 비용의 증가없는 고용량 sdram-향 메모리의 어드레싱 방법 - Google Patents

핀 비용의 증가없는 고용량 sdram-향 메모리의 어드레싱 방법 Download PDF

Info

Publication number
KR102753865B1
KR102753865B1 KR1020170004319A KR20170004319A KR102753865B1 KR 102753865 B1 KR102753865 B1 KR 102753865B1 KR 1020170004319 A KR1020170004319 A KR 1020170004319A KR 20170004319 A KR20170004319 A KR 20170004319A KR 102753865 B1 KR102753865 B1 KR 102753865B1
Authority
KR
South Korea
Prior art keywords
row
address
command
subset
bits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020170004319A
Other languages
English (en)
Korean (ko)
Other versions
KR20170104116A (ko
Inventor
무-티엔 창
디민 니우
홍종 정
임선영
김인동
최장석
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Publication of KR20170104116A publication Critical patent/KR20170104116A/ko
Application granted granted Critical
Publication of KR102753865B1 publication Critical patent/KR102753865B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/4063Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
    • G11C11/407Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
    • G11C11/408Address circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/08Word line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, for word lines
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • G11C13/0026Bit-line or column circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • G11C13/0028Word-line or row circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1015Read-write modes for single port memories, i.e. having either a random port or a serial port
    • G11C7/1018Serial bit line access mode, e.g. using bit line address shift registers, bit line address counters, bit line burst counters
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/04Arrangements for selecting an address in a digital store using a sequential addressing device, e.g. shift register, counter
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/06Address interface arrangements, e.g. address buffers
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/12Group selection circuits, e.g. for memory block selection, chip selection, array selection
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C8/00Arrangements for selecting an address in a digital store
    • G11C8/18Address timing or clocking circuits; Address control signal generation or management, e.g. for row address strobe [RAS] or column address strobe [CAS] signals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Dram (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Memory System (AREA)
KR1020170004319A 2016-03-03 2017-01-11 핀 비용의 증가없는 고용량 sdram-향 메모리의 어드레싱 방법 Active KR102753865B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201662303353P 2016-03-03 2016-03-03
US62/303,353 2016-03-03
US201662347569P 2016-06-08 2016-06-08
US62/347,569 2016-06-08
US15/227,911 2016-08-03
US15/227,911 US9837135B2 (en) 2016-03-03 2016-08-03 Methods for addressing high capacity SDRAM-like memory without increasing pin cost

Publications (2)

Publication Number Publication Date
KR20170104116A KR20170104116A (ko) 2017-09-14
KR102753865B1 true KR102753865B1 (ko) 2025-01-15

Family

ID=59722348

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170004319A Active KR102753865B1 (ko) 2016-03-03 2017-01-11 핀 비용의 증가없는 고용량 sdram-향 메모리의 어드레싱 방법

Country Status (5)

Country Link
US (2) US9837135B2 (https=)
JP (1) JP7007092B2 (https=)
KR (1) KR102753865B1 (https=)
CN (1) CN107154270B (https=)
TW (1) TWI688857B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10866746B2 (en) * 2017-12-28 2020-12-15 Silicon Motion Inc. Memory addressing methods and associated controller, memory device and host
TWI872402B (zh) 2017-12-28 2025-02-11 慧榮科技股份有限公司 快閃記憶體控制器、安全數位卡、使用於快閃記憶體控制器的方法以及存取安全數位卡的主機
WO2020219293A1 (en) 2019-04-26 2020-10-29 Rambus Inc. Memory controller partitioning for hybrid memory system
US11164613B2 (en) 2019-12-02 2021-11-02 Micron Technology, Inc. Processing multi-cycle commands in memory devices, and related methods, devices, and systems

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100660892B1 (ko) 2005-11-21 2006-12-26 삼성전자주식회사 더블 펌프드 어드레스 스킴의 메모리 장치에서 고속 동작을위해 확장된 유효 어드레스 윈도우로 유효 커맨드를샘플링하는 회로 및 방법
KR101832552B1 (ko) 2012-06-22 2018-02-26 인텔 코포레이션 Dram 당 주소 매김 능력 모드를 위한 방법, 장치 및 시스템

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6108745A (en) * 1997-10-31 2000-08-22 Hewlett-Packard Company Fast and compact address bit routing scheme that supports various DRAM bank sizes and multiple interleaving schemes
JP3872922B2 (ja) * 1999-06-28 2007-01-24 株式会社東芝 半導体記憶装置及びメモリ混載ロジックlsi
JP3702158B2 (ja) * 2000-09-01 2005-10-05 株式会社ルネサステクノロジ 半導体メモリ装置
US6493814B2 (en) * 2001-03-08 2002-12-10 International Business Machines Corporation Reducing resource collisions associated with memory units in a multi-level hierarchy memory system
US7093059B2 (en) * 2002-12-31 2006-08-15 Intel Corporation Read-write switching method for a memory controller
US7936639B2 (en) 2007-09-27 2011-05-03 Micron Technology, Inc. System and method for processing signals in high speed DRAM
US8130576B2 (en) 2008-06-30 2012-03-06 Intel Corporation Memory throughput increase via fine granularity of precharge management
CN105702277B (zh) * 2010-12-17 2018-05-08 艾沃思宾技术公司 存储器系统和存储器控制器
US9251874B2 (en) 2010-12-21 2016-02-02 Intel Corporation Memory interface signal reduction
US9104646B2 (en) 2012-12-12 2015-08-11 Rambus Inc. Memory disturbance recovery mechanism
US20160019161A1 (en) 2013-03-12 2016-01-21 Hewlett-Packard Development Company, L.P. Programmable address mapping and memory access operations
KR20150040481A (ko) 2013-10-07 2015-04-15 에스케이하이닉스 주식회사 메모리 장치, 메모리 장치 및 메모리 시스템의 동작방법
EP3447770B1 (en) 2013-11-11 2022-01-05 Rambus Inc. High capacity memory system using standard controller component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100660892B1 (ko) 2005-11-21 2006-12-26 삼성전자주식회사 더블 펌프드 어드레스 스킴의 메모리 장치에서 고속 동작을위해 확장된 유효 어드레스 윈도우로 유효 커맨드를샘플링하는 회로 및 방법
KR101832552B1 (ko) 2012-06-22 2018-02-26 인텔 코포레이션 Dram 당 주소 매김 능력 모드를 위한 방법, 장치 및 시스템

Also Published As

Publication number Publication date
JP7007092B2 (ja) 2022-01-24
US20180102152A1 (en) 2018-04-12
KR20170104116A (ko) 2017-09-14
TW201732601A (zh) 2017-09-16
CN107154270B (zh) 2019-07-30
TWI688857B (zh) 2020-03-21
US10504572B2 (en) 2019-12-10
US9837135B2 (en) 2017-12-05
JP2017157209A (ja) 2017-09-07
US20170256311A1 (en) 2017-09-07
CN107154270A (zh) 2017-09-12

Similar Documents

Publication Publication Date Title
US7471538B2 (en) Memory module, system and method of making same
EP3370152B1 (en) Integrated error checking and correction (ecc) in memory devices with fixed bandwidth interfaces
US8335894B1 (en) Configurable memory system with interface circuit
US8386722B1 (en) Stacked DIMM memory interface
US8644104B2 (en) Memory system components that support error detection and correction
US8917571B2 (en) Configurable-width memory channels for stacked memory structures
US8914589B2 (en) Multi-port DRAM architecture for accessing different memory partitions
US20090210636A1 (en) Methods and systems for two-dimensional main memory
EP3084767B1 (en) Techniques for accessing a dynamic random access memory array
US8495310B2 (en) Method and system including plural memory controllers and a memory access control bus for accessing a memory device
US20110205828A1 (en) Semiconductor memory with memory cell portions having different access speeds
CN111916120A (zh) 带宽提升的堆叠存储器
KR102753865B1 (ko) 핀 비용의 증가없는 고용량 sdram-향 메모리의 어드레싱 방법
US11983059B2 (en) Memory expansion card
US11699471B2 (en) Synchronous dynamic random access memory (SDRAM) dual in-line memory module (DIMM) having increased per data pin bandwidth
US20190042095A1 (en) Memory module designed to conform to a first memory chip specification having memory chips designed to conform to a second memory chip specification
US9563384B2 (en) Systems and methods for data alignment in a memory system
US8750068B2 (en) Memory system and refresh control method thereof
US7564735B2 (en) Memory device, and method for operating a memory device

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20170111

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20220111

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 20170111

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20240318

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20241011

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20250108

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20250109

End annual number: 3

Start annual number: 1

PG1601 Publication of registration