KR102688488B1 - 고종횡비 전기도금 구조 및 이방성 전기도금 프로세스 - Google Patents

고종횡비 전기도금 구조 및 이방성 전기도금 프로세스 Download PDF

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Publication number
KR102688488B1
KR102688488B1 KR1020217019812A KR20217019812A KR102688488B1 KR 102688488 B1 KR102688488 B1 KR 102688488B1 KR 1020217019812 A KR1020217019812 A KR 1020217019812A KR 20217019812 A KR20217019812 A KR 20217019812A KR 102688488 B1 KR102688488 B1 KR 102688488B1
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South Korea
Prior art keywords
aspect ratio
high aspect
coil
structures
dielectric layer
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English (en)
Korean (ko)
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KR20210096185A (ko
Inventor
더글라스 피. 라이머
커트 씨. 스완슨
피터 에프. 래드윅
매튜 에스. 랭
폴 브이. 페사벤토
조셉 디. 스타키
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허친슨 테크놀로지 인코포레이티드
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Priority claimed from US16/693,169 external-priority patent/US11387033B2/en
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Publication of KR20210096185A publication Critical patent/KR20210096185A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/003—Printed circuit coils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020217019812A 2018-11-26 2019-11-23 고종횡비 전기도금 구조 및 이방성 전기도금 프로세스 Active KR102688488B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862771442P 2018-11-26 2018-11-26
US62/771,442 2018-11-26
US16/693,169 US11387033B2 (en) 2016-11-18 2019-11-22 High-aspect ratio electroplated structures and anisotropic electroplating processes
US16/693,169 2019-11-22
PCT/US2019/062885 WO2020112570A1 (en) 2018-11-26 2019-11-23 High-aspect ratio electroplated structures and anisotropic electroplating processes

Publications (2)

Publication Number Publication Date
KR20210096185A KR20210096185A (ko) 2021-08-04
KR102688488B1 true KR102688488B1 (ko) 2024-07-26

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217019812A Active KR102688488B1 (ko) 2018-11-26 2019-11-23 고종횡비 전기도금 구조 및 이방성 전기도금 프로세스

Country Status (6)

Country Link
JP (1) JP7494177B2 (enExample)
KR (1) KR102688488B1 (enExample)
CN (1) CN113396246B (enExample)
PH (1) PH12021551216A1 (enExample)
TW (1) TWI868089B (enExample)
WO (1) WO2020112570A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7844663B2 (ja) * 2022-03-30 2026-04-13 ステムコ カンパニー リミテッド コイル基板とその製造方法およびそれを含む電子装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6600404B1 (en) * 1998-01-12 2003-07-29 Tdk Corporation Planar coil and planar transformer, and process of fabricating a high-aspect conductive device
US6847527B2 (en) * 2001-08-24 2005-01-25 3M Innovative Properties Company Interconnect module with reduced power distribution impedance
JP2005236158A (ja) * 2004-02-23 2005-09-02 Murata Mfg Co Ltd 積層コイル部品、及び積層コイル部品の製造方法、並びに積層コイル部品の実装構造
US7527713B2 (en) * 2004-05-26 2009-05-05 Applied Materials, Inc. Variable quadruple electromagnet array in plasma processing
US8513124B1 (en) * 2008-03-06 2013-08-20 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
JP5306789B2 (ja) * 2008-12-03 2013-10-02 日本特殊陶業株式会社 多層配線基板及びその製造方法
JP5195956B2 (ja) * 2011-04-05 2013-05-15 大日本印刷株式会社 サスペンション用基板、サスペンション、素子付サスペンション、およびハードディスクドライブ
TWI488198B (zh) * 2013-08-02 2015-06-11 乾坤科技股份有限公司 多層線圈之製造方法
KR101558092B1 (ko) * 2014-06-02 2015-10-06 삼성전기주식회사 칩 전자부품 및 그 실장기판
KR101598295B1 (ko) * 2014-09-22 2016-02-26 삼성전기주식회사 다층 시드 패턴 인덕터, 그 제조방법 및 그 실장 기판
US9984858B2 (en) * 2015-09-04 2018-05-29 Lam Research Corporation ALE smoothness: in and outside semiconductor industry
KR102767042B1 (ko) * 2016-11-18 2025-02-14 허친슨 테크놀로지 인코포레이티드 고형상비 전기도금 구조 및 이방성 전기도금 프로세스
CN209449029U (zh) * 2016-11-28 2019-09-27 株式会社村田制作所 多层基板以及多层基板向电路基板的安装构造
KR101862503B1 (ko) * 2017-01-06 2018-05-29 삼성전기주식회사 인덕터 및 그의 제조방법

Also Published As

Publication number Publication date
TW202033835A (zh) 2020-09-16
CN113396246A (zh) 2021-09-14
PH12021551216A1 (en) 2021-11-08
CN113396246B (zh) 2025-08-26
JP7494177B2 (ja) 2024-06-03
JP2022507980A (ja) 2022-01-18
WO2020112570A1 (en) 2020-06-04
TWI868089B (zh) 2025-01-01
KR20210096185A (ko) 2021-08-04

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