KR102686082B1 - adhesive tape - Google Patents
adhesive tape Download PDFInfo
- Publication number
- KR102686082B1 KR102686082B1 KR1020227034717A KR20227034717A KR102686082B1 KR 102686082 B1 KR102686082 B1 KR 102686082B1 KR 1020227034717 A KR1020227034717 A KR 1020227034717A KR 20227034717 A KR20227034717 A KR 20227034717A KR 102686082 B1 KR102686082 B1 KR 102686082B1
- Authority
- KR
- South Korea
- Prior art keywords
- mass
- parts
- adhesive
- adhesive tape
- meth
- Prior art date
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 91
- 239000000853 adhesive Substances 0.000 claims abstract description 112
- 230000001070 adhesive effect Effects 0.000 claims abstract description 112
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 42
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 30
- 239000000178 monomer Substances 0.000 claims abstract description 26
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 22
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 14
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 11
- 125000002843 carboxylic acid group Chemical group 0.000 claims abstract description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 6
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 239000000203 mixture Substances 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 24
- -1 (meth)acrylic acid alkoxyalkyl ester Chemical class 0.000 claims description 23
- 230000001588 bifunctional effect Effects 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 10
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 8
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 7
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 5
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 5
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims description 3
- 210000002374 sebum Anatomy 0.000 abstract description 11
- 239000002537 cosmetic Substances 0.000 abstract description 9
- 235000013305 food Nutrition 0.000 abstract description 9
- 210000004243 sweat Anatomy 0.000 abstract description 9
- 239000012948 isocyanate Substances 0.000 abstract description 5
- 150000002513 isocyanates Chemical class 0.000 abstract description 5
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 125000004183 alkoxy alkyl group Chemical group 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 38
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- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 18
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- 229920000573 polyethylene Polymers 0.000 description 8
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- 239000006260 foam Substances 0.000 description 6
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
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- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 4
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 3
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
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- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
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- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
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- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
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- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
- IEQWWMKDFZUMMU-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethyl)butanedioic acid Chemical compound OC(=O)CC(C(O)=O)CCOC(=O)C=C IEQWWMKDFZUMMU-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
(메트)아크릴산알콕시알킬에스테르 20질량부 이상 40질량부 미만, 카르복실산기 함유 (메트)아크릴 모노머를 10질량부 이상 25질량부 미만, 탄소 원자수가 1~3의 알킬기, 시클로헥실기 또는 이소보르닐기를 갖는 (메트)아크릴산 알킬에스테르를 5질량부 이상 20질량부 미만, 및 탄소 원자수가 4~12의 알킬기를 갖는 (메트)아크릴산 알킬에스테르 30질량부 이상 50질량부 미만 (이상의 각 단량체의 합계 100질량부)를 포함하고, 이소시아네이트계 가교제 및 에폭시계 가교제의 한쪽 또는 양쪽을 사용하여 가교 구조가 형성되고, 중량 평균 분자량이 20만 이상 45만 미만인 아크릴계 공중합체를 함유하는 점착제 조성물이 점착제로서 사용된 점착 테이프가 개시된다. 이 점착 테이프는 피지, 땀, 식품, 화장품 등의 유지 성분에 대하여 높은 내구성을 갖고, 또한 피착체에 부착할 때 적당한 점착력을 갖는다.20 parts by mass but less than 40 parts by mass of alkoxyalkyl (meth)acrylate, 10 parts by mass but less than 25 parts by mass of (meth)acrylic monomer containing a carboxylic acid group, alkyl group having 1 to 3 carbon atoms, cyclohexyl group, or isobor. 5 or more parts by mass but less than 20 parts by mass of alkyl (meth)acrylate having a nyl group, and 30 or more parts by mass but less than 50 parts by mass of alkyl (meth)acrylate having an alkyl group having 4 to 12 carbon atoms (sum of each monomer above) 100 parts by mass), a cross-linked structure is formed using one or both of an isocyanate-based cross-linking agent and an epoxy-based cross-linking agent, and an acrylic copolymer having a weight average molecular weight of 200,000 to 450,000 is used as an adhesive. An adhesive tape is disclosed. This adhesive tape has high durability against oil and fat components such as sebum, sweat, food, and cosmetics, and also has appropriate adhesive strength when attached to an adherend.
Description
본 발명은 피지, 땀, 식품, 화장품 등의 유지 성분에 대하여 높은 내구성을 갖고, 또한 피착체에 부착할 때 적당한 점착력을 갖는 점착 테이프에 관한 것이다.The present invention relates to an adhesive tape that has high durability against oil and fat components such as sebum, sweat, food, and cosmetics, and also has appropriate adhesive strength when attached to an adherend.
최근 스마트폰이나 태블릿 PC로 대표되는 소형 휴대전자기기가 급격히 보급되고 있다. 이들 중 다수는, 표시 패널과 하우징을 아크릴계의 접착제나 양면 점착 테이프에 의해 접합하고 있다. 그리고, 모바일 전자기기의 대부분은 터치 패널을 탑재하고 있어, 사람의 손가락으로 터치해 조작되거나, 전화를 걸 때에는 사람의 얼굴에 닿거나 한다.Recently, small portable electronic devices such as smartphones and tablet PCs have become rapidly popular. In many of these, the display panel and the housing are joined using an acrylic adhesive or double-sided adhesive tape. In addition, most mobile electronic devices are equipped with a touch panel and are operated by touching them with a person's finger or touching the person's face when making a call.
사람의 손이나 얼굴에 터치 패널이 닿으면 피지나 지지 등의 유지가 터치 패널에 부착된다. 이 유지에는 올레산 등의 성분이 포함되어 있고, 유지의 SP값(용해도 파라미터)은 공업용 유기 용제에 가깝기 때문에, 일반적인 아크릴 수지를 용해한다.When a touch panel touches a person's hand or face, oil such as sebum or grease adheres to the touch panel. This oil contains components such as oleic acid, and its SP value (solubility parameter) is close to that of industrial organic solvents, so it dissolves common acrylic resins.
일반적인 산업용 유기 용제는 끓는점이 낮고 단시간에 기화하기 때문에 접착제나 점착제에 손상을 입히기 어렵다. 한편, 올레산 등의 유지 성분은 비등점이 높고, 생활 환경하에서는 기화하지 않고 전자 기기 내에 남기 때문에, 접착제나 점착 테이프에 데미지를 주고, 전자 기기 내의 부품에 부유나 박리를 발생시켜 전자 기기의 수명을 단축한다.General industrial organic solvents have a low boiling point and evaporate in a short period of time, so it is difficult to damage adhesives or adhesives. On the other hand, oil and fat components such as oleic acid have a high boiling point and do not vaporize under living conditions and remain in electronic devices, causing damage to adhesives and adhesive tapes and causing floating or peeling of parts within electronic devices, shortening the lifespan of electronic devices. do.
스마트폰 등의 소형 휴대전자 기기는 손으로 들고 사용하는 시간이 길고, 통화 시에는 얼굴에 닿을 수도 있다. 그 때문에, 소형 휴대 전자 기기에는, 피지나 땀, 식품, 화장품 등의 유지가 부착되기 쉽고, 이들 유지가 접착제나 점착 테이프에 도달하면, 점착력이 저하될 우려가 있다. 또한, 점착 테이프의 점착제층이 유지를 원인으로 하여 연화한 경우, 점착 테이프의 측면으로부터 점착제가 벗겨져 기기 내부의 디자인이나 기능이 손상되는 경우가 있다. 또한, 점착제층의 팽윤에 의해 외부 방향으로의 압력이 가해져, 전자 기기의 화면 표시가 정상적으로 행해지지 않는 경우도 있다.Small portable electronic devices, such as smartphones, are held and used for a long time, and may touch the face when talking on the phone. Therefore, oils and fats such as sebum, sweat, food, and cosmetics tend to adhere to small portable electronic devices, and when these fats and oils reach adhesives and adhesive tapes, there is a risk that the adhesive strength may decrease. Additionally, if the adhesive layer of the adhesive tape softens due to retention, the adhesive may peel off from the side of the adhesive tape, damaging the design or function inside the device. In addition, pressure in the outward direction is applied due to swelling of the adhesive layer, and there are cases where the screen of the electronic device is not displayed properly.
또한, 스마트폰 등의 소형 휴대 전자 기기의 화면 확대에 수반하는 내부 부품의 협액 연화나 박형화, 소형 웨어러블 기기의 실용화에 수반하여, 이러한 전자 기기의 내부에 사용되는 점착 테이프도 세폭화 E미세화되어 있어, 상기와 같은 문제는 더욱 발생하기 쉬워지고 있다고 생각된다.In addition, as the screens of small portable electronic devices such as smartphones become larger, internal components become thinner and narrower, and small wearable devices become more practical, the adhesive tapes used inside such electronic devices have also become thinner and finer. Therefore, it seems that problems like the above are becoming more likely to occur.
특허문헌 1에는, 휴대 전자 기기의 부품 고정에 사용하는 양면 점착 테이프로서, 피지 등의 유상 성분의 침투가 있었을 경우에도 점착제가 연화·팽윤되기 어렵고, 점착제가 튀어나오지 않는 양면 접착 테이프가 개시되어 있다. 그러나, 특허문헌 1의 발명은, 전자 기기 내부에서 발생하는 접착제나 점착 테이프의 부유나 박리에 직결하는 점착력의 저하에 관해서는 검토되어 있지 않다. 또한, 유지 성분의 내구성을 향상시킨 경우, 점착 테이프를 피착체에 부착할 때의 점착력이 저하되고, 내구성의 향상과 점착력의 유지가 양립하지 않는다는 과제가 있다.Patent Document 1 discloses a double-sided adhesive tape used for fixing components of portable electronic devices, in which the adhesive is difficult to soften or swell even when oily components such as sebum penetrate, and the adhesive does not protrude. . However, the invention in Patent Document 1 does not examine the decrease in adhesive force that is directly related to the floating or peeling of adhesives or adhesive tapes that occur inside electronic devices. In addition, when the durability of the fat component is improved, the adhesive strength when attaching the adhesive tape to the adherend decreases, and there is a problem that improvement in durability and maintenance of adhesive strength are not compatible.
따라서, 본 발명은 피지, 땀, 식품, 화장품 등의 유지 성분에 대하여 높은 내구성을 갖고, 또한 피착체에 부착할 때 적당한 점착력을 갖는 점착 테이프를 제공하는 것을 목적으로 한다.Therefore, the purpose of the present invention is to provide an adhesive tape that has high durability against oil and fat components such as sebum, sweat, food, and cosmetics, and also has appropriate adhesive strength when attached to an adherend.
본 발명의 점착 테이프는, 단량체 조성으로서, (메트)아크릴산알콕시알킬에스테르를 20질량부 이상, 40질량부 미만,카르복실산기 함유 (메트)아크릴 단량체를 10질량부 이상, 25질량부 미만, 하기 식 1에 의해 나타나는 (메트)아크릴산알킬에스테르를 5질량부 이상, 20질량부 미만, 및, 하기 식 2에 의해 나타나는 (메트)아크릴산알킬에스테르를 30질량부 이상, 50질량부 미만(이상의 각 단량체의 합계를 100질량부로 한다) 포함하는 아크릴계 공중합체로서, 2관능 이상의 이소시아네이트기 함유 화합물 및 2관능 이상의 글리시딜기 함유 화합물의 한쪽 또는 양쪽을 가교제로서 사용함으로써 가교 구조가 형성되고, 중량 평균 분자량이 20만 이상, 45만 미만인 상기 아크릴계 공중합체를 함유하는 점착제 조성물이 점착제로서 사용된 점착 테이프이다.The adhesive tape of the present invention has a monomer composition of 20 parts by mass or more but less than 40 parts by mass of alkoxyalkyl (meth)acrylate and 10 parts by mass or more but less than 25 parts by mass of a (meth)acrylic monomer containing a carboxylic acid group, as follows. 5 parts by mass or more and less than 20 parts by mass of the (meth)acrylic acid alkyl ester represented by the formula 1, and 30 parts by mass or more and less than 50 parts by mass of the (meth)acrylic acid alkyl ester represented by the following formula 2 (each of the above monomers) (the total of is 100 parts by mass), wherein a cross-linked structure is formed by using one or both of a bifunctional or higher isocyanate group-containing compound and a bifunctional or higher glycidyl group-containing compound as a cross-linking agent, and the weight average molecular weight is An adhesive composition containing the above acrylic copolymer in an amount of 200,000 or more and less than 450,000 is an adhesive tape used as an adhesive.
(식 1 중, R1은 CH2=CH- 또는 CH2=C(CH3)-를 나타내고, R2는 탄소 원자수가 1~3의 알킬기, 시클로헥실기 또는 이소보르닐기를 나타낸다.)(In Formula 1, R 1 represents CH 2 =CH- or CH 2 =C(CH 3 )-, and R 2 represents an alkyl group, cyclohexyl group, or isobornyl group having 1 to 3 carbon atoms.)
(식 2 중, R3은 CH2=CH- 또는 CH2=C(CH3)-를 나타내고, R4는 탄소 원자수가 4~12의 알킬기를 나타낸다.)(In Formula 2, R 3 represents CH 2 =CH- or CH 2 =C(CH 3 )-, and R 4 represents an alkyl group having 4 to 12 carbon atoms.)
본 발명에 관한 점착 테이프는 점착제 조성물이 점착 부여 수지를 더 포함 할 수 있다.In the adhesive tape according to the present invention, the adhesive composition may further include a tackifying resin.
본 발명에 따른 점착 테이프는 점착제 조성물이 실란 커플 링제를 더 포함 할 수 있다.The adhesive composition of the adhesive tape according to the present invention may further include a silane coupling agent.
본 발명에 따른 점착 테이프는 점착제 조성물이 산화 방지제를 더 포함 할 수 있다.The adhesive tape according to the present invention may further include an antioxidant in the adhesive composition.
본 발명에 관한 점착 테이프는, 추가로 기재를 갖고, 점착제 조성물을 사용하여 상기 기재의 편면 또는 양면에 점착제층을 형성할 수 있다.The adhesive tape according to the present invention further has a base material, and an adhesive layer can be formed on one side or both sides of the base material using an adhesive composition.
본 발명에 따른 점착 테이프는 피지, 땀, 식품, 화장품 등의 유지 성분에 대하여 높은 내구성을 가지며, 구체적으로는 유지 성분이 부착한 경우에도 일정한 점착력을 유지하는 것이 가능한 내유성을 갖는다. 또한, 본 발명에 관한 점착 테이프는, 피착체에 부착할 때에 적당한 점착력을 갖고, 또한 유지 성분이 부착한 경우의 점착력 유지 성능이 우수하다. 따라서, 본 발명에 따른 점착 테이프는, 예를 들면, 스마트폰 등의 소형 휴대 전자 기기의 표시 패널과 하우징의 접합이나, 하우징 내부의 부품 고정 등의 용도에 적합하게 사용할 수 있다.The adhesive tape according to the present invention has high durability against oil and fat components such as sebum, sweat, food, and cosmetics, and specifically has oil resistance that allows it to maintain a certain adhesive force even when oil and fat ingredients adhere. In addition, the adhesive tape according to the present invention has appropriate adhesive strength when attached to an adherend and is excellent in adhesive strength maintenance performance when a holding component adheres. Therefore, the adhesive tape according to the present invention can be suitably used for applications such as joining the display panel and housing of small portable electronic devices such as smartphones and fixing components inside the housing.
<아크릴계 공중합체><Acrylic copolymer>
본 발명에 관한 아크릴계 공중합체는, 단량체 조성으로서, (메트)아크릴산알콕시알킬에스테르, 카르복실산기 함유 (메트)아크릴 단량체, 상기 화학식 1에 의해 나타나는 (메트)아크릴산알킬에스테르, 및 상기 식 2에 의해 나타나는 (메트)아크릴산알킬에스테르를 함유하고, 2관능 이상의 이소시아네이트기 함유 화합물 또는 2관능 이상의 글리시딜기 함유 화합물을 가교제에 사용함으로써 가교 구조가 형성되고, 또한 중량 평균 분자량이 20만 이상, 45만 미만이다.The acrylic copolymer according to the present invention has, as a monomer composition, a (meth)acrylic acid alkoxyalkyl ester, a carboxylic acid group-containing (meth)acrylic monomer, a (meth)acrylic acid alkyl ester represented by the above formula (1), and the above formula (2) A crosslinked structure is formed by using a bifunctional or more isocyanate group-containing compound or a bifunctional or more glycidyl group-containing compound containing an alkyl ester of (meth)acrylate as a crosslinking agent, and having a weight average molecular weight of 200,000 or more and less than 450,000. am.
(메트)아크릴산알콕시알킬에스테르로서는, 예를 들면, (메트)아크릴산메톡시에틸, (메트)아크릴산메톡시프로필, (메트)아크릴산메톡시부틸, (메트)아크릴산에톡시에틸, (메트)아크릴산에톡시프로필, (메트)아크릴산에톡시부틸 등을 사용할 수 있다. 중합 반응의 안정성 및 입수의 용이성을 고려하여, (메트)아크릴산메톡시에틸을 사용하는 것이 바람직하다.Examples of (meth)acrylic acid alkoxyalkyl esters include methoxyethyl (meth)acrylate, methoxypropyl (meth)acrylate, methoxybutyl (meth)acrylate, ethoxyethyl (meth)acrylate, and (meth)acrylic acid. Toxypropyl, ethoxybutyl (meth)acrylate, etc. can be used. Considering the stability of the polymerization reaction and ease of availability, it is preferable to use methoxyethyl (meth)acrylate.
(메트)아크릴산알콕시알킬에스테르, 카르복실산기 함유 (메트)아크릴모노머, 상기 화학식 1에 의해 나타나는 (메트)아크릴산알킬에스테르, 및 상기 화학식 2에 의해 나타나는 (메트)아크릴산알킬에스테르(이하, 「상기 4종의 단량체」라고 칭함)의 합계 100질량부에 대한 (메트)아크릴산알콕시알킬에스테르의 함유량은, 20질량부 이상, 40질량부 미만이다. 이 함유량이 20질량부 미만이면 본 발명의 아크릴계 공중합체 중에 SP값이 높은 단량체 단위가 적어지기 때문에, 유지 성분에 대한 내구성이 저하되어, 피지나 땀, 식품, 화장품 등의 유지 성분이 부착된 경우에 점착력이 현저하게 저하되어 전자 기기 내부의 부품 고정 등의 용도에 필요한 점착력을 유지할 수 없다. 또한, 이 함유량이 40질량부 이상이면 점착제의 초기 점착력이 저하되기 때문에, 전자 기기 내부의 부품 고정 작업 등 시에 작업성이 저하된다. 이 함유량은 25질량부 이상, 40질량부 미만인 것이 보다 바람직하다.(meth)acrylic acid alkoxyalkyl esters, carboxylic acid group-containing (meth)acrylic monomers, (meth)acrylic acid alkyl esters represented by the formula 1, and (meth)acrylic acid alkyl esters represented by the formula 2 (hereinafter referred to as “4 above”) The content of (meth)acrylic acid alkoxyalkyl ester relative to a total of 100 parts by mass (referred to as “species monomer”) is 20 parts by mass or more and less than 40 parts by mass. If this content is less than 20 parts by mass, the number of monomer units with a high SP value in the acrylic copolymer of the present invention decreases, so durability against oil and fat components decreases, and oil and fat components such as sebum, sweat, food, and cosmetics adhere. The adhesive strength decreases significantly, making it impossible to maintain the adhesive strength required for applications such as fixing parts inside electronic devices. In addition, if this content is 40 parts by mass or more, the initial adhesive strength of the adhesive decreases, so workability decreases during work such as fixing parts inside electronic devices. It is more preferable that this content is 25 parts by mass or more and less than 40 parts by mass.
카르복실산기 함유 (메트)아크릴 단량체로서는, 예를 들면, (메트)아크릴산, (메트)아크릴산 β-카르복시에틸, 이타콘산, 크로톤산, 말레산, 푸마르산, 시트라콘산, 그라타콘산, 2-아크릴로일록시에틸숙신산, 2-아크릴로일록시에틸프탈산 등을 사용할 수 있다. 이 중, 얻어지는 점착제의 가교 밀도나 입수의 용이성을 고려하면, (메트)아크릴산을 사용하는 것이 바람직하다.Examples of (meth)acrylic monomers containing a carboxylic acid group include (meth)acrylic acid, β-carboxyethyl (meth)acrylate, itaconic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, grataconic acid, 2- Acryloyloxyethylsuccinic acid, 2-acryloyloxyethylphthalic acid, etc. can be used. Among these, considering the crosslinking density and availability of the obtained adhesive, it is preferable to use (meth)acrylic acid.
상기 4종의 모노머의 합계 100질량부에 대한 카르복실산기 함유 (메트)아크릴 모노머의 함유량은, 10질량부 이상, 25질량부 미만이다. 이 함유량이 10질량부 미만이면 점착제의 가교 밀도가 감소하고, 피지나 땀, 식품, 화장품 등의 유지 성분에 의해 점착제가 팽윤한다. 또한, 이 함유량이 25질량부 이상이면 점착제의 초기 점착력이 저하되기 때문에, 전자 기기 내부의 부품 고정 작업 등 시에 작업성이 저하된다. 이 함유량은 10질량부 이상, 23질량부 이하인 것이 보다 바람직하다.The content of the carboxylic acid group-containing (meth)acrylic monomer relative to a total of 100 parts by mass of the above four types of monomers is 10 parts by mass or more and less than 25 parts by mass. If this content is less than 10 parts by mass, the crosslinking density of the adhesive decreases, and the adhesive swells due to oil and fat components such as sebum, sweat, food, and cosmetics. In addition, if this content is 25 parts by mass or more, the initial adhesive strength of the adhesive decreases, so workability decreases during work such as fixing parts inside electronic devices. It is more preferable that this content is 10 parts by mass or more and 23 parts by mass or less.
상기 화학식 1에 의해 나타나는 (메트)아크릴산알킬에스테르로서는, 예를 들어 아크릴산메틸, 아크릴산에틸, 아크릴산프로필, 아크릴산이소프로필, (메트)아크릴산시클로헥실, (메트)아크릴산이소보르닐 등이 사용 할 수 있다. 입수의 용이성을 고려하면, 아크릴산메틸을 사용하는 것이 바람직하다.As the (meth)acrylic acid alkyl ester represented by the above formula (1), for example, methyl acrylate, ethyl acrylate, propyl acrylate, isopropyl acrylate, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, etc. can be used. . Considering ease of availability, it is preferable to use methyl acrylate.
상기 4종의 단량체의 합계 100질량부에 대한 상기 화학식 1로 나타나는 (메트)아크릴산알킬에스테르의 함유량은, 5질량부 이상, 20질량부 미만이다. 이 함유량이 5질량부 미만이면, 점착제의 내반발성이 감소하여, 전자 기기 내부의 부품 고정 등의 용도에 필요한 점착력을 만족시킬 수 없다. 또한,이 함유량이 20 질량부 이상이면, 점착제의 초기 점착력이 저하되어 전자 기기 내부의 부품 고정 작업 등의 경우에 작업성이 저하된다. 이 함유량은 5질량부 이상, 15질량부 이하인 것이 보다 바람직하다.The content of the alkyl (meth)acrylate represented by the formula (1) relative to a total of 100 parts by mass of the four types of monomers is 5 parts by mass or more and less than 20 parts by mass. If this content is less than 5 parts by mass, the repellency resistance of the adhesive decreases, and the adhesive strength required for applications such as fixing parts inside electronic devices cannot be satisfied. In addition, if this content is 20 parts by mass or more, the initial adhesive strength of the adhesive decreases and workability decreases in cases such as fixing parts inside electronic devices. It is more preferable that this content is 5 mass parts or more and 15 mass parts or less.
상기 화학식 2로 표시되는 (메트)아크릴산알킬에스테르로서는, 예를 들면, (메트)아크릴산부틸, (메트)아크릴산이소부틸, (메트)아크릴산t-부틸, (메트)아크릴산헥실, (메트)아크릴산이소헥실, (메트)아크릴산옥틸, (메트)아크릴산이소옥틸, (메트)아크릴산-2-에틸헥실, (메트)아크릴산노닐, (메트)아크릴산이소노닐, (메트)아크릴산데실, (메트)아크릴산이소데실, (메트)아크릴산도데실, (메트)아크릴산이소도데실 등을 사용할 수 있다. 아크릴계 공중합체의 점착제로서의 택을 유지하기 위해서 Tg(유리 전이점)가 낮은 (메트)아크릴산-2-에틸헥실 등을 사용하는 것이 바람직하다.Examples of the (meth)acrylic acid alkyl ester represented by the above formula (2) include butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, hexyl (meth)acrylate, and iso(meth)acrylate. Hexyl, octyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, iso (meth)acrylate Decyl, dodecyl (meth)acrylate, isododecyl (meth)acrylate, etc. can be used. In order to maintain the tack of the acrylic copolymer as an adhesive, it is preferable to use (meth)acrylic acid-2-ethylhexyl, etc., which has a low Tg (glass transition point).
상기 4종의 단량체의 합계 100질량부에 대한 상기 화학식 2로 나타나는 (메트)아크릴산알킬에스테르의 함유량은, 30질량부 이상, 50질량부 미만이다. 이 함유량이 30질량부 미만이면, 점착제의 초기 점착력이 저하되기 때문에, 전자 기기 내부의 부품 고정 작업 등의 경우에 작업성이 저하된다. 이 함유량이 50질량부 이상이면 유지 성분에 대한 내구성이 저하되고, 피지나 땀, 식품, 화장품 등의 유지 성분이 부착한 경우에 점착력이 현저하게 저하되어 전자 기기 내부의 부품 고정 등 의 용도에 필요한 점착력을 유지할 수 없다. 이 함유량은 30질량부 이상, 45질량부 이하인 것이 보다 바람직하다.The content of the (meth)acrylic acid alkyl ester represented by the above formula (2) relative to a total of 100 parts by mass of the four types of monomers is 30 parts by mass or more and less than 50 parts by mass. If this content is less than 30 parts by mass, the initial adhesive strength of the adhesive decreases, and therefore workability decreases in cases such as fixing parts inside electronic devices. If this content is 50 parts by mass or more, the durability of the oil and fat components decreases, and when oil and fat components such as sebum, sweat, food, and cosmetics adhere, the adhesive strength decreases significantly, making it necessary for applications such as fixing parts inside electronic devices. Adhesion cannot be maintained. It is more preferable that this content is 30 parts by mass or more and 45 parts by mass or less.
2관능 이상의 이소시아네이트기 함유 화합물(이하 「이소시아네이트계 가교제」라고도 한다.)로서는, 예를 들면, 톨릴렌디이소시아네이트, 크실렌디이소시아네이트, 클로르페닐렌디이소시아네이트, 헥사메틸렌디이소시아네이트, 테트라메틸렌디이소시아네이트, 이소포론디이소시아네이트, 디페닐메탄디이소시아네이트, 수소화된 디페닐메탄디이소시아네이트 등을 사용할 수 있다.Compounds containing bifunctional or higher isocyanate groups (hereinafter also referred to as “isocyanate-based crosslinking agents”) include, for example, tolylene diisocyanate, xylene diisocyanate, chlorphenylene diisocyanate, hexamethylene diisocyanate, tetramethylene diisocyanate, and isophorone diisocyanate. Isocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, etc. can be used.
2관능 이상의 글리시딜기 함유 화합물(이하 「에폭시계 가교제」라고도 한다.)로서는, 예를 들면, 1,3비스(N,N-디글리시딜아미노메틸)시클로헥산, N,N,N',N'-테트라글리시딜-m-크실렌디아민, N,N,N',N'-테트라글리시딜아미노페닐메탄, 트리글리시딜이소시아누레이트, m-N,N-디글리시딜아미노페닐글리시딜에테르, N,N-디글리시딜톨루이딘, N, N-디글리시딜아닐린, 펜타에리스리톨폴리글리시딜에테르, 1,6-헥산디올디글리시딜에테르 등을 사용할 수 있다.Compounds containing a bifunctional or higher glycidyl group (hereinafter also referred to as “epoxy-based crosslinking agent”) include, for example, 1,3bis(N,N-diglycidylaminomethyl)cyclohexane, N,N,N' ,N'-tetraglycidyl-m-xylenediamine, N,N,N',N'-tetraglycidylaminophenylmethane, triglycidyl isocyanurate, m-N,N-diglycidylaminophenyl Glycidyl ether, N,N-diglycidyltoluidine, N,N-diglycidylaniline, pentaerythritol polyglycidyl ether, 1,6-hexanediol diglycidyl ether, etc. can be used.
가교제로서 사용하는 2관능 이상의 이소시아네이트기 함유 화합물이나 2관능 이상의 글리시딜기 함유 화합물의 첨가량은 특별히 한정되지 않는다. 점착제 조성물의 팽윤도가 본 발명에 따른 점착 테이프의 사용 환경에 적합한 것이 되도록 가교제의 첨가량을 조절할 수 있다.There is no particular limitation on the amount of the compound containing a bifunctional or higher isocyanate group or the compound containing a bifunctional or higher glycidyl group used as a crosslinking agent. The amount of crosslinking agent added can be adjusted so that the swelling degree of the adhesive composition is suitable for the usage environment of the adhesive tape according to the present invention.
본 발명에 관한 아크릴계 공중합체는, 이들 단량체를 용액 중합, 괴상 중합, 현탁 중합, 유화 중합 등의 각종 중합 방법에 중합하여 생성시킬 수 있다. 예를 들어, 반응 용기 내에서, 이들 단량체와 중합 개시제를 에틸 아세테이트 등의 용매에 용해시키고, 항온 하에서 일정 시간 교반함으로써 아크릴계 공중합체를 얻을 수 있다.The acrylic copolymer according to the present invention can be produced by polymerizing these monomers through various polymerization methods such as solution polymerization, bulk polymerization, suspension polymerization, and emulsion polymerization. For example, an acrylic copolymer can be obtained by dissolving these monomers and a polymerization initiator in a solvent such as ethyl acetate in a reaction vessel and stirring the mixture at constant temperature for a certain period of time.
또한, 상기의 아크릴계 공중합체에, 가교제를 단독 또는 중합 개시제와 함께 첨가하여 교반함으로써, 가교 구조를 갖는 아크릴계 공중합체를 생성할 수 있다.Additionally, an acrylic copolymer having a crosslinked structure can be produced by adding a crosslinking agent alone or together with a polymerization initiator to the above acrylic copolymer and stirring it.
본 발명에 관한 아크릴계 공중합체의 중량 평균 분자량은 20만 이상, 45만 미만이다. 이 중량 평균 분자량이 20만 미만인 경우에는 점착제에 필요한 응집력이 얻어지지 않고, 점착 테이프를 피착체에 첩부했을 때의 점착제의 벌집이 생기는 원인이 된다. 또한, 이 중량 평균 분자량이 450,000 이상이면, 점착 테이프의 피착 체에 대한 추종성이 저하되어, 전자 기기 내부의 부품 고정 등에 필요한 점착력을 얻을 수 없다. 이 중량 평균 분자량은 25만 이상, 45만 미만인 것이 보다 바람직하다.The weight average molecular weight of the acrylic copolymer according to the present invention is 200,000 or more and less than 450,000. If the weight average molecular weight is less than 200,000, the cohesive force required for the adhesive cannot be obtained, which causes honeycombs to form in the adhesive when the adhesive tape is attached to the adherend. Additionally, if the weight average molecular weight is 450,000 or more, the adhesive tape's ability to follow the adherend deteriorates, making it impossible to obtain the adhesive strength required for fixing components inside electronic devices, etc. It is more preferable that this weight average molecular weight is 250,000 or more and less than 450,000.
본 발명에 관한 아크릴계 공중합체에는, 필요에 따라 점착 부여 수지, 실란 커플링제, 산화 방지제 등의 임의 성분을 첨가할 수 있다.Optional components such as a tackifying resin, a silane coupling agent, and an antioxidant can be added to the acrylic copolymer according to the present invention as needed.
점착 부여 수지로서는, 예를 들면, 로진 에스테르계 수지(로진 에스테르, 불균화 로진 에스테르, 수소 첨가 로진 에스테르 등), 테르펜계 수지(테르펜 수지, 방향족 변성 테르펜 수지, 수소 첨가 테르펜 수지, 테르펜 페놀 등), 석유계 수지(지방족계 석유 수지, 방향족계 석유 수지, 공중합계 석유 수지, 지방족계 석유 수지 등), 퓨어·모노머계 수지(쿠마론·인덴 수지, 스티렌 수지 등), 축합계 수지(페놀계 수지, 크실렌 수지 등) 등을 사용할 수 있다. 점착 부여 수지를 첨가함으로써, 점착제의 경도가 저하되고, 피착체에 대한 초기 점착력이 향상된다.Examples of tackifying resins include rosin ester resins (rosin ester, disproportionated rosin ester, hydrogenated rosin ester, etc.), terpene resins (terpene resins, aromatic modified terpene resins, hydrogenated terpene resins, terpene phenols, etc.). , petroleum resins (aliphatic petroleum resins, aromatic petroleum resins, copolymerized petroleum resins, aliphatic petroleum resins, etc.), pure/monomer resins (coumarone/indene resins, styrene resins, etc.), condensation resins (phenolic resins, etc.) resin, xylene resin, etc.) can be used. By adding a tackifier resin, the hardness of the adhesive decreases and the initial adhesion to the adherend improves.
실란 커플링제로서는, 예를 들면, 2-(3,4-에폭시시클로헥실)에틸트리메톡시실란, 3-글리시독시프로필트리메톡시실란, 3-글리시독시프로필메틸디에톡시실란, 3-글리시독시프로필트리에톡시실란, 트리스-(트리메톡시실릴프로필)이소시아누레이트 등을 사용할 수 있다. 실란 커플링제는 2종류 이상을 병용해도 된다. 실란 커플링제를 사용함으로써, 점착제의 내반발성을 향상시키고, 점착 테이프의 세폭화·미세 가공화에 수반하여 저하되는 내습열 하중성을 향상시킬 수 있다.As a silane coupling agent, for example, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3- Glycidoxypropyltriethoxysilane, tris-(trimethoxysilylpropyl)isocyanurate, etc. can be used. Two or more types of silane coupling agents may be used in combination. By using a silane coupling agent, the repellency resistance of the adhesive can be improved, and the moisture-heat load resistance that decreases with narrowing and fine processing of the adhesive tape can be improved.
산화 방지제로서는, 예를 들면, 힌더드 페놀계 산화 방지제 등을 사용할 수 있다. 산화 방지제를 첨가함으로써, 점착제의 내반발성을 향상시키고, 점착 테이프의 세폭화·미세 가공화에 수반하여 저하되는 내습열 하중성을 향상시킬 수 있다.As an antioxidant, for example, hindered phenol-based antioxidants can be used. By adding an antioxidant, the repulsion resistance of the adhesive can be improved and the moist and heat load resistance, which decreases with narrowing and fine processing of the adhesive tape, can be improved.
<점착 테이프><Adhesive tape>
본 발명에 관한 점착 테이프는, 전술한 아크릴계 공중합체(및 필요에 따라 임의 성분)를 함유하는 점착제 조성물이 점착제로서 사용된 점착 테이프이다. 「점착제 조성물이 점착제로서 사용된 점착 테이프」란, 예를 들면, 그 점착제 조성물을 시트상으로 형성한 점착 테이프(소위, 베이스리스 타입의 점착 테이프), 혹은 그 점착제 조성 물을 사용하여 기재의 한면 또는 양면에 점착제층을 형성한 점착 테이프이다.The adhesive tape according to the present invention is an adhesive tape in which an adhesive composition containing the above-described acrylic copolymer (and optional components as necessary) is used as an adhesive. “Adhesive tape in which an adhesive composition is used as an adhesive” means, for example, an adhesive tape in which the adhesive composition is formed into a sheet (so-called baseless type adhesive tape), or an adhesive tape in which the adhesive composition is used to form a sheet on one side of a substrate. Alternatively, it is an adhesive tape with an adhesive layer formed on both sides.
베이스리스 타입의 점착 테이프는, 예를 들면, 이형지 등의 지지체 상에 아크릴계 공중합체를 도포하고, 그 후 건조시킴으로써 형성할 수 있다. 한편, 기재를 갖는 점착 테이프는, 기재 상에 아크릴계 공중합체를 도포하고, 그 후 건조시킴으로써 점착제층을 형성해도 되고, 이형지 등의 지지체 상에 아크릴계 공 중합체를 도포하여 점착제 층을 형성 한 후, 이 점착제 층을 기재의 한면 또는 양면에 접합 할 수 있다. 베이스리스 타입의 점착 테이프 및 기재를 갖는 점착 테이프의 점착제층은, 단층이어도 되고, 복수의 층의 적층된 적층체로 이루어지는 것이어도 된다.A baseless type adhesive tape can be formed, for example, by applying an acrylic copolymer onto a support such as release paper and then drying it. On the other hand, for the adhesive tape with a base material, the adhesive layer may be formed by applying an acrylic copolymer on the base material and drying it thereafter, or the adhesive layer may be formed by applying the acrylic copolymer on a support such as release paper, and then forming the adhesive layer. The adhesive layer can be bonded to one or both sides of the substrate. The adhesive layer of the baseless type adhesive tape and the adhesive tape with a base material may be a single layer or may be composed of a laminated body of a plurality of layers.
기재를 갖는 점착 테이프에 있어서의 점착제층의 두께는, 바람직하게는 1~200㎛, 보다 바람직하게는 5~100㎛이다. 베이스리스 타입의 점착 테이프의 두께는, 바람직하게는 1~200㎛, 보다 바람직하게는 5~100㎛이다.The thickness of the adhesive layer in the adhesive tape with a base material is preferably 1 to 200 μm, more preferably 5 to 100 μm. The thickness of the baseless type adhesive tape is preferably 1 to 200 μm, more preferably 5 to 100 μm.
아크릴계 공중합체를 기재 또는 이형지 등의 지지체 상에 도포하는 방법은 특별히 한정되지 않고, 공지의 방법을 사용하면 된다. 그 구체예로서는, 롤 코터, 다이 코터, 립 코터, 딥 롤 코터, 바 코터, 나이프 코터, 스프레이 롤 코터 등을 사용한 방법을 들 수 있다.The method of applying the acrylic copolymer onto a support such as a substrate or release paper is not particularly limited, and a known method may be used. Specific examples include a method using a roll coater, die coater, lip coater, dip roll coater, bar coater, knife coater, spray roll coater, etc.
점착 테이프가 기재를 갖는 경우, 그 기재는 특별히 한정되지 않고, 공지의 기재를 사용하면 된다. 기재의 구체예로서는, 종이, 천, 부직포, 그물 등의 섬유계 기재, 올레핀계 수지, 폴리에스테르계 수지, 폴리염화비닐계 수지, 아세트산비닐계 수지, 폴리아미드계 수지, 폴리이미드계 수지, 폴리에테르에테르케톤(PEEK), 폴리페닐렌술피드(PPS) 등의 수지 기재(수지 필름 또는 수지 시트), 고무 시트, 발포 시트(발포 기재), 금속박, 금속판을 들 수 있다. 또한, 이들 적층체, 예를 들면, 수지 기재와 수지 이외의 기재의 적층체, 수지 기재끼리의 적층체여도 된다. 기재는 단층, 복층 중 어느 것이어도 좋다. 기재의 점착제층을 설치하는 면에는, 필요에 따라서, 배면 처리, 대전 방지 처리, 언더코팅 처리 등의 각종 처리가 실시되어 있어도 된다. 기재의 두께는 바람직하게는 5 내지 500㎛, 보다 바람직하게는 10 내지 200㎛이다.When the adhesive tape has a base material, the base material is not particularly limited, and a known base material may be used. Specific examples of the substrate include fiber-based substrates such as paper, cloth, non-woven fabric, and net, olefin-based resin, polyester-based resin, polyvinyl chloride-based resin, vinyl acetate-based resin, polyamide-based resin, polyimide-based resin, and polyether. Examples include resin substrates (resin films or resin sheets) such as ether ketone (PEEK) and polyphenylene sulfide (PPS), rubber sheets, foam sheets (foam substrates), metal foil, and metal plates. In addition, these laminates may be, for example, a laminate of a resin substrate and a substrate other than resin, or a laminate of resin substrates. The base material may be either a single layer or a double layer. The surface of the substrate on which the adhesive layer is installed may be subjected to various treatments, such as backside treatment, antistatic treatment, and undercoating treatment, as needed. The thickness of the substrate is preferably 5 to 500 μm, more preferably 10 to 200 μm.
접착 테이프는 이형지 또는 다른 필름으로 보호 될 수 있습니다. 이형지 또는 다른 필름은 특별히 한정되지 않고, 공지된 것을 필요에 따라 사용할 수 있다.Adhesive tapes can be protected with release paper or other films. The release paper or other film is not particularly limited, and known ones can be used as needed.
실시예Example
이하, 실시 예 및 비교 예를 들어 본 발명을 더욱 상세하게 설명한다.Hereinafter, the present invention will be described in more detail through examples and comparative examples.
(중량 평균 분자량)(Weight average molecular weight)
아크릴계 공중합체의 중량 평균 분자량(Mw)은, GPC법에 의해, 아크릴계 공중합체의 표준 폴리스티렌 환산의 분자량을 이하의 측정 장치 및 조건으로 측정한 값이다.The weight average molecular weight (Mw) of the acrylic copolymer is a value obtained by measuring the molecular weight of the acrylic copolymer in terms of standard polystyrene using the GPC method under the following measuring devices and conditions.
·장치:LC-2000 시리즈(일본 분광 주식회사제)·Device: LC-2000 series (manufactured by Nippon Spectrograph Co., Ltd.)
·컬럼:Shodex KF-806M×2개, Shodex KF-802M×1개· Column: Shodex KF-806M × 2, Shodex KF-802M × 1
·용리액:테트라히드로푸란(THF)· Eluent: Tetrahydrofuran (THF)
·유속:1.0mL/분·Flow rate: 1.0mL/min
·컬럼 온도:40℃·Column temperature: 40℃
·주입량:100μL·Injection amount: 100μL
·검출기:굴절률계(RI)・Detector: Refractometer (RI)
(초기 점착력)(initial adhesion)
기재 A를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 25㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 1왕복으로 가압 부착하고, 가압 첩부 후 20분 경과 후의 180°인하 벗겨 점착력(N/10mm폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.When using base material A: A sample of a 10 mm wide double-sided adhesive tape backed by a polyester film with a thickness of 25 ㎛ was pressed and attached to a SUS304 plate polished with No. 280 water-resistant abrasive paper with one reciprocation of a 2.0 kg roller, and 20 minutes had passed after the press application. After peeling off at 180°, the adhesive strength (N/10 mm width) was measured by the method described in JIS Z0237:2000.
기재 B를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 50㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 1왕복으로 가압 부착하고, 가압 첩부 후 20분 경과 후의 180°인하 벗겨 점착력(N/10mm폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.When using base material B: A 10 mm wide double-sided adhesive tape sample backed by a polyester film with a thickness of 50 ㎛ was pressed and attached to a SUS304 plate polished with No. 280 water-resistant abrasive paper with one reciprocation of a 2.0 kg roller, and 20 minutes had passed after the press application. After peeling off at 180°, the adhesive strength (N/10 mm width) was measured by the method described in JIS Z0237:2000.
(경시 점착력)(Adhesion over time)
기재 A를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 25㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 1왕복으로 가압 부착하고, 가압 첩부 후 72시간 후의 180°인발 벗겨 점착력(N/10mm 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.When using base material A: A sample of a 10 mm wide double-sided adhesive tape backed with a polyester film with a thickness of 25 ㎛ is pressed and attached to a SUS304 plate polished with No. 280 water-resistant abrasive paper with one reciprocation of a 2.0 kg roller. The 180° drawn peel adhesive strength (N/10 mm width) was measured by the method described in JIS Z0237:2000.
기재 B를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 50㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 2.5왕복으로 가압 부착하고, 가압 부착 후 72시간 후의 180°인발 벗겨 점착력(N/10㎜ 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.When using base material B: A sample of a 10 mm wide double-sided adhesive tape backed with a 50 ㎛ thick polyester film was pressed and attached to a SUS304 plate polished with No. 280 water-resistant abrasive paper using 2.5 reciprocations of a 2.0 kg roller. The 180° drawn peel adhesive strength (N/10 mm width) was measured by the method described in JIS Z0237:2000.
(촉진 후 점착력: Na)(Adhesion after acceleration: Na)
기재 A를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 25㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 1왕복으로 가압 부착하고, 온도 65±5℃ 습도 90±10%의 분위기하에 72시간 방치했다. 그 후, 온도 23±5℃ 습도 50±5%의 분위기하에 2시간 방치했다. 이 샘플의 180°인출 박리 점착력(N/10mm 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.When using base material A: A 10 mm wide double-sided adhesive tape sample backed by a 25 ㎛ thick polyester film was attached to a SUS304 plate polished with No. 280 water-resistant abrasive paper under pressure with one reciprocation of a 2.0 kg roller, temperature 65 ± 5°C and humidity. It was left for 72 hours in an atmosphere of 90 ± 10%. After that, it was left to stand for 2 hours in an atmosphere of a temperature of 23 ± 5°C and a humidity of 50 ± 5%. The 180° pull-out peel adhesion (N/10 mm width) of this sample was measured by the method described in JIS Z0237:2000.
기재 B를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 50㎛의 SUS 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 2.5왕복으로 가압 부착하고, 온도 60±5℃ 습도 90±10%의 분위기하에 72시간 방치했다. 그 후, 온도 23±5℃ 습도 50±5%의 분위기하에 2시간 방치했다. 이 샘플의 180°인출 박리 점착력(N/10mm 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.When using base material B: A 10 mm wide double-sided adhesive tape sample backed by a 50㎛ thick SUS film was attached to a SUS304 plate polished with No. 280 water-resistant abrasive paper by pressure using a 2.0 kg roller with 2.5 reciprocations, temperature 60 ± 5°C, humidity 90%. It was left for 72 hours in an atmosphere of ±10%. After that, it was left to stand for 2 hours in an atmosphere of a temperature of 23 ± 5°C and a humidity of 50 ± 5%. The 180° pull-out peel adhesion (N/10 mm width) of this sample was measured by the method described in JIS Z0237:2000.
(올레산 침지 후 점착력: Nb)(Adhesion after oleic acid immersion: Nb)
기재 A를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 25㎛의 폴리에스테르 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 1왕복으로 가압 부착하였다. 이 샘플을 올레산에 침지하고, 온도 65±5℃, 습도 90±10%의 분위기하에 72시간 방치했다. 그 후, 샘플을 용기로부터 취출하고, 순수를 사용하여 올레산을 닦아내고, 물방울을 닦아낸 후, 온도 23±5℃, 습도 50±5%의 분위기하에 2시간 방치했다. 이 샘플의 180°인출 박리 점착력(N/10mm 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.When using base material A: A sample of a 10 mm wide double-sided adhesive tape backed with a 25 ㎛ thick polyester film was pressure-applied to a SUS304 plate polished with No. 280 water-resistant abrasive paper using one reciprocation of a 2.0 kg roller. This sample was immersed in oleic acid and left in an atmosphere of 65 ± 5°C and 90 ± 10% humidity for 72 hours. Thereafter, the sample was taken out from the container, the oleic acid was wiped off using pure water, the water droplets were wiped off, and the sample was left in an atmosphere of a temperature of 23 ± 5°C and a humidity of 50 ± 5% for 2 hours. The 180° pull-out peel adhesion (N/10 mm width) of this sample was measured by the method described in JIS Z0237:2000.
기재 B를 사용한 경우: 280번 내수 연마지로 연마한 SUS304판에 두께 50㎛의 SUS 필름으로 뒷받침한 10mm 폭의 양면 점착 테이프 시료를 2.0kg 롤러 2.5왕복으로 가압 부착하였다. 이 샘플을 올레산에 침지하고, 온도 60±5℃, 습도 90±10%의 분위기하에 72시간 방치했다. 그 후, 샘플을 용기로부터 취출하고, 순수를 사용하여 올레산을 닦아내고, 물방울을 닦아낸 후, 온도 23±5℃, 습도 50±5%의 분위기하에 2시간 방치했다. 이 샘플의 180°인출 박리 점착력(N/10mm 폭)을 JIS Z0237:2000에 기재된 방법으로 측정하였다.When using base material B: A 10 mm wide double-sided adhesive tape sample backed by a 50 ㎛ thick SUS film was pressed and attached to a SUS304 plate polished with No. 280 water-resistant abrasive paper using 2.5 reciprocations of a 2.0 kg roller. This sample was immersed in oleic acid and left in an atmosphere of 60 ± 5°C and 90 ± 10% humidity for 72 hours. Thereafter, the sample was taken out from the container, the oleic acid was wiped off using pure water, the water droplets were wiped off, and the sample was left in an atmosphere of a temperature of 23 ± 5°C and a humidity of 50 ± 5% for 2 hours. The 180° pull-out peel adhesion (N/10 mm width) of this sample was measured by the method described in JIS Z0237:2000.
(올레산 침지 후 점착력 유지율:X)(Adhesion retention rate after oleic acid immersion:
하기 식에 의해 구했다.It was obtained by the following formula.
X=100×Nb/NaX=100×Nb/Na
(파괴 모드)(Destruction Mode)
촉진 후 점착력(Na)의 측정 후의 샘플 및 올레산 침지 후 점착력(Nb)의 측정 후의 샘플에 대해서, 각각 파괴가 발생하고 있는 부위를 관찰하였다. 점착제에 파괴가 발생하고 있는 경우를 응집 파괴(표 2~4의 「응집」), 점착제와 피착체 사이에 파괴가 발생하고 있는 경우를 계면 파괴, 기재에 파괴가 발생하고 있는 경우를 기재 파괴(표 2~4의 「기재」)로 하였다.For the sample after measurement of adhesion after acceleration (Na) and the sample after measurement of adhesion after immersion in oleic acid (Nb), the area where destruction occurred was observed, respectively. When destruction occurs in the adhesive, it is called cohesive failure (“cohesion” in Tables 2 to 4), when destruction occurs between the adhesive and the adherend, it is called interfacial failure, and when destruction occurs in the substrate, it is called substrate failure (“Cohesive”). It was set to “Description” in Tables 2 to 4).
[실시예 1][Example 1]
(아크릴계 공중합체의 조제)(Preparation of acrylic copolymer)
교반기, 온도계, 환류 냉각기 및 질소 도입관을 구비한 반응 장치에, 표 1에 나타내는 질량부의 공중합체를 구성하는 모노머, 아세트산에틸, 연쇄 이동제인 n-도데칸티올 0.03질량부 및 라디칼 중합 개시제인 라우릴 퍼옥사이드 0.05질량부를 투입하고, 질소 가스를 봉입한 후, 교반하면서 질소 가스 기류 하에서 67℃ 3시간 반응시켰다. 그 후, 82℃ 3시간 반응시켰다. 반응 종료 후, 실온까지 냉각하고, 아세트산에틸을 첨가하였다. 이것에 의해 고형분 농도 30%의 공중합체를 얻었다. 실시예 1에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 42만이었다. In a reaction apparatus equipped with a stirrer, thermometer, reflux condenser, and nitrogen introduction tube, parts by mass of the monomers constituting the copolymer shown in Table 1, ethyl acetate, 0.03 parts by mass of n-dodecanethiol as a chain transfer agent, and Ra as a radical polymerization initiator are added. 0.05 parts by mass of Uril peroxide was added, nitrogen gas was enclosed, and reaction was performed at 67°C for 3 hours under a nitrogen gas stream while stirring. After that, reaction was performed at 82°C for 3 hours. After completion of the reaction, the mixture was cooled to room temperature, and ethyl acetate was added. As a result, a copolymer with a solid content concentration of 30% was obtained. The weight average molecular weight of the acrylic copolymer prepared in Example 1 was 420,000.
(점착제의 조제)(Preparation of adhesive)
이 공중합체의 고형분 100질량부에 대하여, 가교제로서 이소시아네이트계 가교제(가교제 A)(도소사제, 상품명 L-45E)를 1.8질량부 첨가하여 점착제를 조제했다.With respect to 100 parts by mass of solid content of this copolymer, 1.8 parts by mass of an isocyanate-based crosslinking agent (crosslinking agent A) (manufactured by Tosoh Corporation, brand name L-45E) was added as a crosslinking agent to prepare an adhesive.
(양면 점착 테이프의 제조)(Manufacture of double-sided adhesive tape)
양면 코로나 방전 처리된 두께 12㎛의 폴리에틸렌테레프탈레이트 필름(기재 A)의 양면에 별도 제작한 하도제를 도포하고 120℃에서 건조함으로써, 기재 A에 하도층을 형성했다. 기재 A의 제1 면측의 언더코트층 상에, 조제한 점착제를 전면 평활하게 도포하고, 100℃에서 가열 건조하여, 두께 19㎛의 점착제층을 형성했다. 또한, 이 점착제층 상에 실리콘 처리된 박리지를 접합하였다. 그 후, 제 2 면측의 하도제층 상에도 마찬가지로 하여 조제한 점착제를 도포·건조하고, 박리지를 첩합하고, 40℃에서 3일간 양생했다. 이것에 의해 총 두께 50㎛의 양면 점착 테이프를 얻었다.A separately prepared primer was applied to both sides of a polyethylene terephthalate film (base material A) with a thickness of 12 μm that had been corona discharge treated on both sides and dried at 120°C to form an undercoat layer on the base material A. On the undercoat layer on the first surface side of the base material A, the prepared adhesive was applied smoothly over the entire surface and dried by heating at 100°C to form an adhesive layer with a thickness of 19 μm. Additionally, silicone-treated release paper was bonded onto this adhesive layer. After that, the adhesive prepared in the same manner was applied and dried on the primer layer on the second side, the release paper was bonded, and cured at 40°C for 3 days. This obtained a double-sided adhesive tape with a total thickness of 50 μm.
[실시예 2][Example 2]
점착제의 조제에 있어서, 가교제를 에폭시계 가교제(가교제 B)(綜硏化學社製, 상품명 E-5CM)로 변경한 것 이외는 실시예 1과 동일하게 하여, 양면 점착 테이프를 제작했다. In preparing the adhesive, a double-sided adhesive tape was produced in the same manner as in Example 1 except that the crosslinking agent was changed to an epoxy-based crosslinking agent (crosslinking agent B) (綜硏化學學學夾製, brand name E-5CM).
[실시예 3][Example 3]
양면 점착 테이프의 제조에 있어서, 실시예 1과 마찬가지로 조제한 점착제를 실리콘 처리된 이형지 상에 전면 평활하게 도포하고, 90℃에서 가열 건조하여, 두께 50㎛의 점착제층을 형성했다. 그리고, 양면을 코로나 방전 처리한 폴리에틸렌(PE)계 발포체로 이루어지는 두께 100㎛의 기재(기재 B)의 양면에 이형지 상의 점착제를 접합하고, 40℃에서 3일간 양생한 후, 총 두께 200㎛의 양면 점착 테이프를 얻었다.In the production of a double-sided adhesive tape, the adhesive prepared in the same manner as in Example 1 was applied smoothly over the entire surface on silicone-treated release paper and dried by heating at 90°C to form an adhesive layer with a thickness of 50 μm. Then, the adhesive on the release paper was bonded to both sides of a 100㎛ thick base material (base material B) made of polyethylene (PE) foam that had been subjected to corona discharge treatment on both sides, and cured at 40°C for 3 days, after which both sides had a total thickness of 200㎛. Adhesive tape was obtained.
[실시예 4][Example 4]
점착제의 조제에 있어서, 점착 부여 수지로서, 아세트산에틸에 의해 50% 희석액으로 한 아라카와 화학 공업 주식회사 제조 D-6011(상품명)을 8질량부, 실란 커플링제로서, 아세트산 에틸에 의해 5% 희석액으로 한 신에츠 화학 공업 주식회사제 KBM-403(상품명)을 2질량부, 산화 방지제로서, BASF 재팬 주식회사제 이르가녹스(등록 상표) 1010을 0.2질량부 첨가한 것 이외는 실시 실시예 3과 동일하게 하여 양면 점착 테이프를 제작하였다.In the preparation of the adhesive, 8 parts by mass of D-6011 (trade name) manufactured by Arakawa Chemical Industry Co., Ltd. diluted to 50% with ethyl acetate as the tackifying resin, and diluted to 5% with ethyl acetate as the silane coupling agent. Both sides were prepared in the same manner as in Example 3, except that 2 parts by mass of KBM-403 (trade name) manufactured by Shin-Etsu Chemical Co., Ltd. was added as an antioxidant, and 0.2 parts by mass of Irganox (registered trademark) 1010 manufactured by BASF Japan Co., Ltd. was added. An adhesive tape was produced.
[비교예 1][Comparative Example 1]
(아크릴계 공중합체의 조제)(Preparation of acrylic copolymer)
아크릴산메틸을 사용하지 않고, 아크릴산메톡시에틸 50질량부, 아크릴산 10질량부, 아크릴산-2-에틸헥실 40질량부를 사용하여, 가교제의 첨가량을 1.2질량부로 변경한 것 이외에는 실시예 1과 동일하게 하여, 고형분 농도 30%의 공중합체를 얻었다. 비교예 1에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 75만이었다.The same procedure as in Example 1 was carried out except that 50 parts by mass of methoxyethyl acrylate, 10 parts by mass of acrylic acid, and 40 parts by mass of 2-ethylhexyl acrylate were used instead of methyl acrylate, and the amount of crosslinking agent added was changed to 1.2 parts by mass. , a copolymer with a solid content concentration of 30% was obtained. The weight average molecular weight of the acrylic copolymer prepared in Comparative Example 1 was 750,000.
(점착제의 조제)(Preparation of adhesive)
이 공중합체의 고형분 100질량부에 대하여, 가교제로서 이소시아네이트계 가교제(가교제 A)(도소사제, 상품명 L-45E)를 1.2질량부, 점착 부여 수지로서 아세트산 에틸에 의해 50% 희석액으로 한 아라카와 화학 공업 주식회사 제조 D-6011(상품명)을 8질량부, 실란 커플링제로서, 아세트산 에틸에 의해 5% 희석액으로 한 신에쓰 화학 공업 주식회사 제조 KBM-403 (상품명)을 2질량부, 산화 방지제로서, BASF 재팬 주식회사제 이르가녹스(등록상표) 1010을 0.2질량부 첨가하고, 점착제를 조제했다.With respect to 100 parts by mass of the solid content of this copolymer, 1.2 parts by mass of an isocyanate-based crosslinking agent (crosslinking agent A) (manufactured by Tosoh Corporation, brand name L-45E) as a crosslinking agent and ethyl acetate as a tackifying resin were diluted 50% by Arakawa Chemical Industries. 8 parts by mass of D-6011 (brand name) manufactured by Shin-Etsu Chemical Co., Ltd. (brand name) as a silane coupling agent, 2 parts by mass of KBM-403 (brand name) manufactured by Shin-Etsu Chemical Co., Ltd. diluted by 5% with ethyl acetate, as an antioxidant, BASF Japan 0.2 parts by mass of Irganox (registered trademark) 1010 manufactured by Co., Ltd. was added to prepare an adhesive.
(양면 점착 테이프의 제조)(Manufacture of double-sided adhesive tape)
이 점착제를 사용한 것 이외에는, 실시예 1과 동일하게 하여 양면 점착 테이프를 얻었다.A double-sided adhesive tape was obtained in the same manner as in Example 1, except that this adhesive was used.
[비교예 2][Comparative Example 2]
아크릴계 공중합체의 제조에 있어서, 아크릴산메틸을 사용하지 않고, 아크릴산메톡시에틸 86질량부, 아크릴산 10질량부, 아크릴산 2-에틸헥실 4질량부를 사용하고, 가교제의 첨가량을 1.2질량부로 변경한 것 이외에는 실시예 1과 동일하게 하여, 양면 점착 테이프를 제작하였다. 비교예 2에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 105만이었다.In the production of the acrylic copolymer, 86 parts by mass of methoxyethyl acrylate, 10 parts by mass of acrylic acid, and 4 parts by mass of 2-ethylhexyl acrylate were used instead of using methyl acrylate, except that the amount of crosslinking agent added was changed to 1.2 parts by mass. In the same manner as Example 1, a double-sided adhesive tape was produced. The weight average molecular weight of the acrylic copolymer prepared in Comparative Example 2 was 1,050,000.
[비교예 3][Comparative Example 3]
아크릴계 공중합체의 제조에 있어서, 연쇄 이동제로서의 n-도데칸티올의 첨가량을 0.06질량부, 가교제 A의 첨가량을 2.4질량부로 변경한 것 이외에는 비교예 2로 마찬가지로, 양면 점착 테이프를 제작하였다. 비교예 3에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 34만이었다.In the production of the acrylic copolymer, a double-sided adhesive tape was produced in the same manner as Comparative Example 2, except that the addition amount of n-dodecanethiol as a chain transfer agent was changed to 0.06 parts by mass and the addition amount of crosslinking agent A was changed to 2.4 parts by mass. The weight average molecular weight of the acrylic copolymer prepared in Comparative Example 3 was 340,000.
[비교예 4][Comparative Example 4]
아크릴계 공중합체의 제조에 있어서, 아크릴산메톡시에틸을 사용하지 않고, 아크릴산-2-(에톡시에톡시)에틸(EOEOEA) 86질량부를 사용한 것 이외는 비교예 2와 동일하게 하여, 양면 점착 테이프를 만들었다. 비교예 4에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 측정할 수 없었다.In the production of the acrylic copolymer, a double-sided adhesive tape was made in the same manner as in Comparative Example 2 except that methoxyethyl acrylate was not used and 86 parts by mass of 2-(ethoxyethoxy)ethyl acrylate (EOEOEA) was used. made. The weight average molecular weight of the acrylic copolymer prepared in Comparative Example 4 could not be measured.
[비교예 5][Comparative Example 5]
양면 점착 테이프의 제조에 있어서, 비교예 1과 동일하게 조제한 점착제를 실리콘 처리된 이형지 상에 전면 평활하게 도포하고, 90℃에서 가열 건조하여, 두께 50㎛의 점착제층을 형성했다. 그리고, 양면을 코로나 방전 처리한 폴리에틸렌(PE)계 발포체로 이루어지는 두께 100㎛의 기재(기재 B)의 양면에 이형지 상의 점착제를 접합하고, 40℃에서 3일간 양생한 후, 총 두께 200㎛의 양면 점착 테이프를 얻었다.In the production of a double-sided adhesive tape, the adhesive prepared in the same manner as in Comparative Example 1 was applied smoothly over the entire surface on silicone-treated release paper and dried by heating at 90°C to form an adhesive layer with a thickness of 50 μm. Then, the adhesive on the release paper was bonded to both sides of a 100㎛ thick base material (base material B) made of polyethylene (PE) foam that had been subjected to corona discharge treatment on both sides, and cured at 40°C for 3 days, after which both sides had a total thickness of 200㎛. Adhesive tape was obtained.
[비교예 6][Comparative Example 6]
양면 점착 테이프의 제조에 있어서, 비교예 2와 마찬가지로 조제한 점착제를 실리콘 처리된 이형지 상에 전면 평활하게 도포하고, 90℃에서 가열 건조하여, 두께 50㎛의 점착제층을 형성했다. 그리고, 양면을 코로나 방전 처리한 폴리에틸렌(PE)계 발포체로 이루어지는 두께 100㎛의 기재(기재 B)의 양면에 이형지 상의 점착제를 접합하고, 40℃에서 3일간 양생한 후, 총 두께 200㎛의 양면 점착 테이프를 얻었다.In the production of a double-sided adhesive tape, the adhesive prepared in the same manner as in Comparative Example 2 was applied smoothly over the entire surface on silicone-treated release paper and dried by heating at 90°C to form an adhesive layer with a thickness of 50 μm. Then, the adhesive on the release paper was bonded to both sides of a 100㎛ thick base material (base material B) made of polyethylene (PE) foam that had been subjected to corona discharge treatment on both sides, and cured at 40°C for 3 days, after which both sides had a total thickness of 200㎛. Adhesive tape was obtained.
[비교예 7][Comparative Example 7]
양면 점착 테이프의 제조에 있어서, 비교예 3과 마찬가지로 조제한 점착제를 실리콘 처리된 이형지 상에 전면 평활하게 도포하고, 90℃에서 가열 건조하여, 두께 50㎛의 점착제층을 형성했다. 그리고, 양면을 코로나 방전 처리한 폴리에틸렌(PE)계 발포체로 이루어지는 두께 100㎛의 기재(기재 B)의 양면에 이형지 상의 점착제를 접합하고, 40℃에서 3일간 양생한 후, 총 두께 200㎛의 양면 점착 테이프를 얻었다.In the production of a double-sided adhesive tape, the adhesive prepared in the same manner as in Comparative Example 3 was applied smoothly over the entire surface on silicone-treated release paper and dried by heating at 90°C to form an adhesive layer with a thickness of 50 μm. Then, the adhesive on the release paper was bonded to both sides of a 100㎛ thick base material (base material B) made of polyethylene (PE) foam that had been subjected to corona discharge treatment on both sides, and cured at 40°C for 3 days, after which both sides had a total thickness of 200㎛. Adhesive tape was obtained.
[비교예 8][Comparative Example 8]
아크릴계 공중합체의 조제에 있어서, 아크릴산 10질량부 대신에 아크릴산-4-히드록시부틸 10질량부를 사용한 것 이외는 비교예 2와 동일하게 하여, 양면 점착 테이프를 제작하였다. 비교예 8에서 제조한 아크릴계 공중합체의 중량 평균 분자량은 73만이었다.In the preparation of the acrylic copolymer, a double-sided adhesive tape was produced in the same manner as in Comparative Example 2, except that 10 parts by mass of 4-hydroxybutyl acrylate was used instead of 10 parts by mass of acrylic acid. The weight average molecular weight of the acrylic copolymer prepared in Comparative Example 8 was 730,000.
실시예 1~실시예 4 및 비교예 1~비교예 8의 배합, 아크릴계 공중합체의 중량 평균 분자량 및 양면 점착 테이프를 형성할 때에 사용한 기재를 표 1에 나타낸다. 또한, 각각의 양면 점착 테이프에 대해 측정한 초기 점착력, 경시 점착력, 촉진 후 점착력 Na, 올레산 침지 후 점착력 Nb, 올레산 침지 후 점착력 유지율 X 및 파괴 모드를 표 2~표 4에 나타내었다.Table 1 shows the formulations of Examples 1 to 4 and Comparative Examples 1 to 8, the weight average molecular weight of the acrylic copolymer, and the substrate used to form the double-sided adhesive tape. In addition, the initial adhesive force, adhesive force over time, adhesive force Na after acceleration, adhesive force Nb after oleic acid immersion, adhesive retention rate X after oleic acid immersion, and failure mode measured for each double-sided adhesive tape are shown in Tables 2 to 4.
표 1에서 사용한 약칭은 이하와 같다.The abbreviations used in Table 1 are as follows.
AME=아크릴산메톡시에틸AME=methoxyethyl acrylate
EOEOEA=아크릴산-2-(2-에톡시에톡시)에틸EOEOEA=2-(2-ethoxyethoxy)ethyl acrylic acid
AA=아크릴산AA=acrylic acid
4-HBA=아크릴산-4-히드록시부틸4-HBA=4-hydroxybutyl acrylic acid
MA=아크릴산메틸MA=methyl acrylate
2-EHA=아크릴산-2-에틸헥실2-EHA=2-ethylhexyl acrylic acid
표 2~4에 나타내는 바와 같이, 실시예 1~4의 양면 점착 테이프는, 높은 초기 점착력 및 경시 점착력을 갖고, 또한, 올레산에의 침지 후에도 적당한 점착력을 유지하고 있었다. 따라서, 이들 양면 점착 테이프는 피지, 땀, 식품, 화장품 등의 유지 성분에 대하여 높은 내구성을 가지며, 또한 피착체에 부착할 때 적당한 점착력을 갖는 점착 테이프인 것 알 수 있다. 또한, 실시예 3과 실시예 4를 비교하면, 점착 부여 수지를 첨가한 실시예 4 쪽이 초기 점착력의 수치가 작아지고 있지만, 실시예 3은 계면 파괴인 것에 비해, 실시예 4는 기재 파괴이었기 때문에, 점착력의 저하는 발생하고 있지 않다고 생각된다.As shown in Tables 2 to 4, the double-sided adhesive tapes of Examples 1 to 4 had high initial adhesive strength and adhesive strength over time, and also maintained appropriate adhesive strength even after immersion in oleic acid. Therefore, it can be seen that these double-sided adhesive tapes have high durability against oil and fat components such as sebum, sweat, food, and cosmetics, and also have appropriate adhesive strength when attached to an adherend. Additionally, when comparing Example 3 and Example 4, the value of initial adhesion in Example 4 to which the tackifying resin was added was smaller, but Example 3 was due to interface destruction, whereas Example 4 was due to substrate destruction. Therefore, it is thought that no decrease in adhesive strength occurs.
한편, 비교예 1~4 및 8(각 점착제층의 두께 19㎛, 기재 A)에서 사용한 아크릴계 공중합체의 단량체 조성은, 실시예 1 및 2(각 점착제층의 두께 19㎛ , 기재 A)에서 사용한 아크릴계 공중합체의 단량체 조성과는 다르다. 또한, 비교예 1, 2, 4 및 8에서 사용한 아크릴계 공중합체의 중량 평균 분자량은 실시예 1 및 2에서 사용한 아크릴계 공중합체의 중량 평균 분자량보다 크다.On the other hand, the monomer composition of the acrylic copolymer used in Comparative Examples 1 to 4 and 8 (thickness of each adhesive layer is 19 μm, base material A) is the same as that used in Examples 1 and 2 (thickness of each adhesive layer is 19 μm, base material A). It is different from the monomer composition of acrylic copolymer. In addition, the weight average molecular weight of the acrylic copolymer used in Comparative Examples 1, 2, 4, and 8 is greater than that of the acrylic copolymer used in Examples 1 and 2.
그 결과, 비교예 1 및 8의 양면 점착 테이프는, 실시예 1 및 2의 양면 점착 테이프와 비교하여, 초기 점착력, 경시 점착력, 촉진 후 점착력 Na, 올레산 침지 후 점착력 Nb 및 올레산 침지 후 점착력 유지율 X가 열등했다.As a result, compared to the double-sided adhesive tapes of Examples 1 and 2, the double-sided adhesive tapes of Comparative Examples 1 and 8 had initial adhesive strength, adhesive strength over time, adhesive strength Na after acceleration, adhesive strength Nb after immersion in oleic acid, and adhesive retention rate X after immersion in oleic acid. was inferior.
비교예 2의 양면 점착 테이프는, 실시예 1 및 2의 양면 점착 테이프와 비교하여, 초기 점착력, 경시 점착력 및 촉진 후 점착력 Na가 뒤떨어졌다.The double-sided adhesive tape of Comparative Example 2 was inferior to the double-sided adhesive tape of Examples 1 and 2 in initial adhesive force, adhesive force over time, and adhesive force after acceleration Na.
비교예 3은, 비교예 2보다 아크릴계 중합체의 중량 평균 분자량을 저하시킨 예이다. 그 결과, 비교 예 3에서는 비교 예 2보다 몇 가지 항목이 향상되었다. 그러나, 실시예 1 및 2보다 초기 점착력, 경시 점착력 및 촉진 후 점착력 Na는 열등했다.Comparative Example 3 is an example in which the weight average molecular weight of the acrylic polymer was lowered compared to Comparative Example 2. As a result, Comparative Example 3 improved several items compared to Comparative Example 2. However, the initial adhesion, adhesion over time, and adhesion after acceleration Na were inferior to those of Examples 1 and 2.
비교예 4의 양면 점착 테이프는, 실시예 1 및 2의 양면 점착 테이프와 비교하여, 경시 점착력, 촉진 후 점착력 Na, 올레산 침지 후 점착력 Nb 및 올레산 침지 후 점착력 유지율 X 열등했다.The double-sided adhesive tape of Comparative Example 4 was inferior to the double-sided adhesive tape of Examples 1 and 2 in terms of adhesive strength over time, adhesive strength Na after acceleration, adhesive strength Nb after immersion in oleic acid, and adhesive retention rate X after immersion in oleic acid.
비교예 5~7(각 점착제층의 두께 50㎛, 기재 B)의 양면 점착 테이프는, 그 아크릴계 공중합체의 모노머 조성이 실시예 3 및 4(각 점착제층의 두께 50㎛, 기재 B)에 있어서의 아크릴계 공중합체의 단량체 조성과는 다르다. 또한, 비교예 5 및 6에서 사용한 아크릴계 공중합체의 중량 평균 분자량은 실시예 3 및 4에서 사용한 아크릴계 공중합체의 중량 평균 분자량보다 크다.The double-sided adhesive tapes of Comparative Examples 5 to 7 (thickness of each adhesive layer 50 μm, base material B) had the monomer composition of the acrylic copolymer in Examples 3 and 4 (thickness of each adhesive layer 50 μm, base material B). It is different from the monomer composition of the acrylic copolymer. In addition, the weight average molecular weight of the acrylic copolymer used in Comparative Examples 5 and 6 is greater than that of the acrylic copolymer used in Examples 3 and 4.
그 결과, 비교예 5의 양면 점착 테이프는, 실시예 3 및 4의 양면 점착 테이프와 비교하여, 초기 점착력, 올레산 침지 후 점착력 Nb 및 올레산 침지 후 점착력 유지율 X가 낮았다 . 또한, 파괴 모드 (Na) 및 (Nb)는 모두 응집 파괴이며, 점착제 층의 응집력이 열등했다.As a result, the double-sided adhesive tape of Comparative Example 5 had lower initial adhesive force, adhesive force Nb after immersion in oleic acid, and adhesive retention rate X after immersion in oleic acid compared to the double-sided adhesive tape of Examples 3 and 4. Additionally, both failure modes (Na) and (Nb) were cohesive failure, and the cohesion of the adhesive layer was inferior.
비교예 6의 양면 점착 테이프는 실시예 3 및 4의 양면 점착 테이프와 비교하여 초기 점착력이 떨어졌다. 또한, 파괴 모드 (Na) 및 (Nb)는 모두 응집 파괴이며, 점착제 층의 응집력이 열등했다.The double-sided adhesive tape of Comparative Example 6 had lower initial adhesive strength compared to the double-sided adhesive tape of Examples 3 and 4. Additionally, both failure modes (Na) and (Nb) were cohesive failure, and the cohesion of the adhesive layer was inferior.
비교예 7은 비교예 3의 점착제를 기재 B에 적용한 예이다. 그 결과, 비교 예 7에서는 비교 예 6보다 몇 가지 항목이 향상되었다. 그러나, 실시예 3 및 4보다 초기 점착력은 뒤떨어졌다.Comparative Example 7 is an example in which the adhesive of Comparative Example 3 was applied to substrate B. As a result, Comparative Example 7 improved several items over Comparative Example 6. However, the initial adhesive strength was inferior to Examples 3 and 4.
본 발명에 관한 점착 테이프는, 예를 들면, 스마트 폰 등의 소형 휴대 전자 기기의 표시 패널과 케이싱의 접합이나, 케이싱 내부의 부품 고정 등의 용도에 적합하게 사용할 수 있다.The adhesive tape according to the present invention can be suitably used for applications such as joining a display panel and a casing of a small portable electronic device such as a smart phone or fixing components inside the casing.
Claims (5)
(메트)아크릴산알콕시알킬에스테르를 20질량부 이상, 40질량부 미만,
카르복실산기 함유 (메트)아크릴 단량체를 10질량부 이상, 25질량부 미만,
하기 식 1에 의해 나타나는 (메트)아크릴산알킬에스테르를 5질량부 이상, 20질량부 미만, 및,
하기 식 2에 의해 나타나는 (메트)아크릴산알킬에스테르를 30질량부 이상, 50질량부 미만(이상의 각 단량체의 합계를 100질량부로 한다) 포함하는 아크릴계 공중합체로서,
2관능 이상의 이소시아네이트기 함유 화합물 및 2관능 이상의 글리시딜기 함유 화합물의 한쪽 또는 양쪽을 가교제로서 사용함으로써 가교 구조가 형성되고,
중량 평균 분자량이 20만 이상, 45만 미만인 상기 아크릴계 공중합체를 함유하는 점착제 조성물이 점착제로서 사용된 점착 테이프.
(식 1 중, R1은 CH2=CH- 또는 CH2=C(CH3)-를 나타내고, R2는 탄소 원자수가 1~3의 알킬기, 시클로헥실기 또는 이소보르닐기를 나타낸다.)
(식 2 중, R3은 CH2=CH- 또는 CH2=C(CH3)-를 나타내고, R4는 탄소 원자수가 4~12의 알킬기를 나타낸다.)As the monomer composition,
(meth)acrylic acid alkoxyalkyl ester at least 20 parts by mass and less than 40 parts by mass,
10 or more parts by mass but less than 25 parts by mass of (meth)acrylic monomer containing a carboxylic acid group,
5 parts by mass or more and less than 20 parts by mass of an alkyl (meth)acrylate represented by the following formula 1, and
An acrylic copolymer containing 30 parts by mass or more and less than 50 parts by mass (the total of each monomer above is 100 parts by mass) of an alkyl (meth)acrylate represented by the following formula 2,
A crosslinked structure is formed by using one or both of a bifunctional or higher isocyanate group-containing compound and a bifunctional or higher glycidyl group-containing compound as a crosslinking agent,
An adhesive tape in which an adhesive composition containing the acrylic copolymer having a weight average molecular weight of 200,000 or more and less than 450,000 is used as an adhesive.
(In Formula 1, R 1 represents CH 2 =CH- or CH 2 =C(CH 3 )-, and R 2 represents an alkyl group, cyclohexyl group, or isobornyl group having 1 to 3 carbon atoms.)
(In Formula 2, R 3 represents CH 2 =CH- or CH 2 =C(CH 3 )-, and R 4 represents an alkyl group having 4 to 12 carbon atoms.)
상기 점착제 조성물이 점착 부여 수지를 더 포함하는 점착 테이프.According to paragraph 1,
An adhesive tape wherein the adhesive composition further includes a tackifying resin.
점착제 조성물이 실란 커플링제를 추가로 포함하는 점착 테이프.According to paragraph 1,
An adhesive tape wherein the adhesive composition further includes a silane coupling agent.
점착제 조성물이 산화 방지제를 추가로 포함하는 점착 테이프.According to paragraph 1,
An adhesive tape whose adhesive composition further includes an antioxidant.
상기 점착 테이프는 추가로 기재를 갖고, 상기 점착제 조성물을 사용하여 상기 기재의 한면 또는 양면에 점착제층이 형성되는 것을 특징으로 하는 점착 테이프.According to paragraph 1,
The adhesive tape further has a base material, and an adhesive layer is formed on one or both sides of the base material using the adhesive composition.
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JPH11241053A (en) * | 1998-02-26 | 1999-09-07 | Oji Paper Co Ltd | Adhesive sheet and tape |
JPH11246828A (en) * | 1998-02-27 | 1999-09-14 | Oji Paper Co Ltd | Re-releasable tacky sheet |
JP2001172580A (en) | 1999-12-22 | 2001-06-26 | Oji Paper Co Ltd | Pressure sensitive adhesive sheet or pressure sensitive adhesive tape |
JP3755364B2 (en) * | 1999-12-22 | 2006-03-15 | 王子製紙株式会社 | Adhesive sheet or adhesive tape |
JP2006036911A (en) * | 2004-07-27 | 2006-02-09 | Sekisui Chem Co Ltd | Adhesive tape |
JP2008001739A (en) | 2006-06-20 | 2008-01-10 | Bridgestone Corp | Adhesive composition for electronic display, adhesive layer for electronic display and adhesive filter for electronic display |
JP5582327B2 (en) | 2008-03-07 | 2014-09-03 | Dic株式会社 | Oil-resistant double-sided adhesive tape |
KR101552741B1 (en) * | 2010-04-05 | 2015-09-11 | (주)엘지하우시스 | Pressure-sensitive adhesive composition for touch panel, pressure-sensitive adhesive film and touch panel |
JP5337172B2 (en) * | 2011-01-04 | 2013-11-06 | リンテック株式会社 | Method for producing pressure-sensitive adhesive composition for adhesive bandage |
JP2017058422A (en) * | 2015-09-15 | 2017-03-23 | 綜研化学株式会社 | Polarizing plate with pressure-sensitive adhesive layer |
JP6724542B2 (en) * | 2016-05-16 | 2020-07-15 | 東洋インキScホールディングス株式会社 | Adhesive and adhesive tape |
JP6849533B2 (en) * | 2017-05-30 | 2021-03-24 | 日東電工株式会社 | Adhesive sheet |
JP6843041B2 (en) * | 2017-12-27 | 2021-03-17 | 藤森工業株式会社 | Adhesive composition and adhesive film |
-
2020
- 2020-03-05 KR KR1020227034717A patent/KR102686082B1/en active IP Right Grant
- 2020-03-05 CN CN202080098140.0A patent/CN115244151B/en active Active
- 2020-03-05 WO PCT/JP2020/009351 patent/WO2021176641A1/en active Application Filing
- 2020-03-05 JP JP2022504875A patent/JP7395709B2/en active Active
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2021
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TW202140585A (en) | 2021-11-01 |
JP7395709B2 (en) | 2023-12-11 |
WO2021176641A1 (en) | 2021-09-10 |
CN115244151A (en) | 2022-10-25 |
CN115244151B (en) | 2023-12-12 |
KR20220148282A (en) | 2022-11-04 |
JPWO2021176641A1 (en) | 2021-09-10 |
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