KR102679394B1 - A spraying device capable of maintaining the temperature of the chemical - Google Patents

Abstract

The present invention relates to an injection device capable of maintaining the temperature of a chemical solution, and more specifically, to an injection device used in a semiconductor wafer cleaning process, which is provided with a plurality of internal supply pipes within a single main pipe to enable multi-injection of various chemicals. In order to prevent process deviations from being influenced by the temperature of each chemical liquid having a different temperature, a partition wall is installed between the internal supply pipe and the internal supply pipe, and a cooling line through which a cooling means is circulated is further provided inside the partition wall. It relates to a maintainable injection device.

Description

A spraying device capable of maintaining the temperature of the chemical}

In the present invention, when spraying a chemical solution from a semiconductor wafer injection device, various chemical solutions are sprayed at different preset temperatures, but the temperature is prevented from fluctuating by being influenced by each other's temperatures within a single pipe, thereby reducing process deviation. It relates to a spray device capable of maintaining the temperature of the chemical solution to prevent it from occurring.

In general, the cleaning process during the semiconductor wafer manufacturing process is a process for removing foreign substances attached to the wafer, as well as etching and cleaning the deposition film deposited on the wafer to an appropriate thickness and then moving on to the drying process.

In a conventional cleaning device, a wafer chuck is installed so that the wafer is seated and fixed inside the cleaning chamber where cleaning is performed. A rotation axis connected to a rotation motor is coupled to the bottom of the wafer chuck to rotate the wafer chuck, and the upper side of the wafer chuck is The spray nozzle that sprays chemicals or pure water on the wafer is provided to be movable.

In the case of a spraying device equipped with a spray nozzle that sprays a chemical liquid as described above, recently, a multi-nozzle that mixes chemical liquids with room temperature and high temperature has been used. However, it is affected by the nozzle pipe temperature and does not change the required temperature or There was a problem with fluctuations in the set temperature.

This change in temperature of the chemical solution causes process deviation in the wafer cleaning process, and in a situation where increasingly compact chambers are required, the development of a device that can solve this problem in advance is urgently needed.

Republic of Korea Patent Publication No. 10-0812545 (registered on March 5, 2008) Republic of Korea Patent Publication No. 10-0221700 (registered on June 29, 1999)

The present invention was created to solve the above problems, and the purpose of the present invention is to prevent the influence of high temperature or room temperature of chemical solutions of different temperatures on the inside of the pipe in the injection device used in the semiconductor wafer cleaning device. The aim is to provide a spray device capable of maintaining the temperature of the chemical liquid, which solves the problem by installing a partition wall in the partition wall and installing a cooling means in a zigzag shape on the partition wall, and through the cooling means and the partition wall cooled by the cooling means.

Other objects and advantages of the present invention will be explained below and will be learned by practice of the present invention. Additionally, the objects and advantages of the present invention can be realized by the means and combinations indicated in the claims.

The present invention is a means to solve the above problems,

It is installed on the spray device 10 for spraying a chemical solution on the upper surface of the wafer in a semiconductor wafer cleaning device,

The injection device 10 is

A main pipe (11) forming an empty space inside;

At one end of the main pipe 11, a plurality of injection nozzles 12 are installed in an upright connection so as to correspond to the upper surface of the wafer;

An internal supply pipe (13) installed in the longitudinal direction inside the main pipe (11), one end of which is individually connected to a plurality of injection nozzles (12), so that chemical solutions having different preset temperatures are individually supplied to each pipe. );

A partition wall (20) installed in the longitudinal direction inside the main pipe (11), dividing the space between the internal supply pipes (13);

Inside the cooling partition wall 20, it is installed in a left and right zigzag shape in the longitudinal direction, and the cooling means is circulated inside the high temperature side of the plurality of internal supply pipes 13 within the main pipe 11. A cooling line (21) to ensure that the heat of the internal supply pipe (13) is offset without being transferred to the internal supply pipe (13) on the low temperature side;

It is characterized by being composed of.

As seen above, the present invention can prevent fluctuations in the spraying device used in a semiconductor wafer cleaning device from occurring due to an increase in the temperature of the low-temperature chemical solution due to the high-temperature chemical solution, even when chemicals with different temperatures are used. There is an effect.

In addition, the present invention has the effect of preventing process deviations due to temperature changes by preventing the chemical solution from changing from the preset temperature in the semiconductor wafer cleaning process.

In addition, the present invention has the effect of making installation and use more advantageous as a compact structure is required when using a multi-nozzle in the chamber of a semiconductor wafer cleaning device.

1 is a diagram showing an embodiment of an injection device capable of maintaining the temperature of a chemical liquid according to the present invention.
Figure 2 is a view showing an embodiment of a cross-section of an injection device capable of maintaining the temperature of a chemical solution according to the present invention.
Figure 3 is a view showing an embodiment of an auxiliary temperature control unit in the form of a spiral pipe according to the present invention.

Before describing the various embodiments of the present invention in detail, it will be appreciated that its application is not limited to the details of the configuration and arrangement of components described in the following detailed description or shown in the drawings. The invention may be embodied and practiced in different embodiments and carried out in various ways. Additionally, device or element orientation (e.g. “front”, “back”, “up”, “down”, “top”, “bottom”). The expressions and predicates used herein with respect to terms such as ", "left", "right", "lateral", etc. are merely used to simplify the description of the invention and related devices. Alternatively, you may notice that it does not simply indicate or imply that an element should have a particular orientation. Additionally, terms such as “first,” “second,” and the like are used herein and in the appended claims for purposes of description and are not intended to indicate or imply relative importance or intent.

The present invention has the following features to achieve the above object.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Prior to this, the terms or words used in this specification and claims should not be construed as limited to their usual or dictionary meanings, and the inventor should appropriately use the concept of terms to explain his or her invention in the best way. It must be interpreted as meaning and concept consistent with the technical idea of the present invention based on the principle of definability.

Accordingly, the embodiments described in this specification and the configurations shown in the drawings are only one of the most preferred embodiments of the present invention and do not represent the entire technical idea of the present invention, so at the time of filing this application, various alternatives are available to replace them. It should be understood that equivalents and variations may exist.

Hereinafter, an injection device capable of maintaining the temperature of a chemical solution according to a preferred embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3.

The spraying device capable of maintaining the chemical liquid temperature according to the present invention is installed in the spraying device 10 for spraying chemical liquid on the upper surface of the wafer in a semiconductor wafer cleaning device, and includes a main pipe 11, a spray nozzle 12, and an internal supply pipe ( 13), partition wall 20, and cooling line 21.

The main pipe 11 is in the form of a pipe forming an empty space inside, and in the present invention, a pipe with a circular cross-section is shown, but this cross-section can be changed in various ways depending on the user's embodiment.

The injection nozzle 12 is a nozzle installed at one end of the above-described main pipe 11 in an upright connection so as to correspond to the upper surface of the wafer, and each individually communicates with the internal supply pipe 13 to be described later inside the main pipe 11. By being connected, each of the spray nozzles 12 is a nozzle that allows different chemicals to be sprayed onto the wafer.

The internal supply pipe 13 is a pipe body installed in the longitudinal direction inside the above-mentioned main pipe 11, and one end is individually connected to a plurality of injection nozzles 12, and the chemical liquid has a different preset temperature for each pipe. This is a pipe that allows individual supply.

Of course, this internal supply pipe 13 receives the chemical solution from an external chemical solution storage tank, and a supply pump for supplying the chemical solution and a temperature control device (cooling device, heating device, etc.) to control the temperature of each chemical solution are externally installed. It is natural that it is connected and installed separately.

The partition wall 20 is installed in the longitudinal direction inside the above-described main pipe 11, and is a wall that partitions the space between the internal supply pipes 13, and has the shape of a plate with a predetermined thickness. As the space of the main pipe 11 is divided through the partition wall 20, each divided space is secured with an insulating space that maintains a different temperature through an internal air layer.

In the present invention, in addition to using only the partition wall 20 as described above, it is possible to further provide a cooling line 21 within the partition wall 20 as described later.

The cooling line 21 is installed in a left and right zigzag shape in the longitudinal direction inside the cooling partition wall 20, and allows cooling means (ex: PCW (Process Cooling Water), Air, etc.) to be circulated inside the cooling partition wall 20. It is a pipe body that allows heat from the internal supply pipe (13) on the high temperature side among the plurality of internal supply pipes (13) within the main pipe (11) to be offset without being transferred to the internal supply pipe (13) on the low temperature side.

In the case of the partition wall 20, the partition wall 20 is cooled by the internal cooling line 21, and the partition wall 20 itself is used as the partition wall 20 for cooling. This cooling line 21 and Due to the cooling line 21 installed and the cooled partition wall 20, the internal supply pipes 13 are prevented from being influenced by the temperature of each other. This is precisely to prevent the low-temperature chemical solution from receiving the temperature of the high-temperature chemical solution. In the case of low-temperature chemical liquid, since it is installed in correspondence with the internal supply pipe (13) through which the adjacent high-temperature chemical liquid passes throughout the entire length direction, the temperature is increased by the heat source of the internal supply pipe (13) through which the high-temperature chemical liquid continuously passes up to the spraying nozzle (12). This is to prevent the temperature of this low-temperature chemical solution from rising beyond the preset temperature (preset temperature range).

In addition, in the case of the cooling line 21, the number of internal supply pipes 13 inserted longitudinally into the single main pipe 11 can vary depending on the type of chemical liquid used,

According to the number of internal supply pipes (13) installed in the main pipe (11), the cross-sectional shape of the partition wall (20) dividing each internal supply pipe (13) can also be manufactured into one of the various cross-sectional shapes below. In the case where there are two supply pipes (13), the partition wall (20) may be formed with an 'I'-shaped cross-section that divides the inside of the main pipe (11) into two spaces, and in the case where there are three internal supply pipes (13), the main pipe (11) is divided into two spaces. (11) It can be formed with a 'Y' shaped cross section that divides the interior into three spaces, and in the case where there are four internal supply pipes (13), a '+' or ' It can be formed with an This is to ensure that the space of can be divided according to the number of internal supply pipes (13).

In addition, according to various embodiments of the user, in the case of the internal supply pipe 13, a spiral pipe is wound longitudinally around the outer circumference and maintains the temperature of the internal supply pipe 13 at a preset low or high temperature through a separate refrigerant. This means that an auxiliary temperature control unit 30 of the form can be further provided.

That is, if the internal supply pipe 13 is for a low-temperature refrigerant, a separate low-temperature refrigerant to maintain the low temperature is moved to the auxiliary temperature controller 30, and if the internal supply pipe 13 is a room temperature refrigerant, the appropriate temperature is maintained. All you have to do is move the refrigerant to the auxiliary temperature control unit 30, and depending on the user's embodiment, it may be applied only to the internal supply pipe 13 through which low-temperature refrigerant flows, and each of the internal supply pipes 13 has different An auxiliary temperature control unit 30 that maintains the temperature can be formed.

As described above, although the present invention has been described with limited examples and drawings, the present invention is not limited thereto, and the technical idea of the present invention and the following will be understood by those skilled in the art to which the present invention pertains. Of course, various modifications and changes are possible within the scope of equivalence of the patent claims to be described.

10: Injection device 11: Main pipe
12: spray nozzle 13: internal supply pipe
20: Bulkhead 21: Cooling line
30: Auxiliary temperature control unit

Claims (5)

It is installed on the spray device 10 for spraying a chemical solution on the upper surface of the wafer in a semiconductor wafer cleaning device,
The injection device 10 is
A main pipe (11) forming an empty space inside;
At one end of the main pipe 11, a plurality of injection nozzles 12 are installed in an upright connection so as to correspond to the upper surface of the wafer;
The internal supply pipe (13) is installed longitudinally inside the main pipe (11), and one end is individually connected to a plurality of injection nozzles (12), so that chemical solutions having different preset temperatures are individually supplied to each pipe. );
A partition wall (20) installed in the longitudinal direction inside the main pipe (11), dividing the space between the internal supply pipes (13) to secure an insulating space with an air layer within the partition space; It consists of
Inside the cooling partition wall 20, it is installed in a left and right zigzag shape in the longitudinal direction, and the cooling means is circulated inside the high temperature side of the plurality of internal supply pipes 13 within the main pipe 11. A cooling line (21) is provided to ensure that the heat of the internal supply pipe (13) is offset without being transferred to the internal supply pipe (13) on the low temperature side,
The partition wall 20 is
The partition wall 20 is cooled by the internal cooling line 21, and the partition wall 20 itself is used as a cooling partition wall 20.
The cooling line 21 is
The number of internal supply pipes (13) can vary depending on the type of chemical solution used.
Depending on the number of the internal supply pipes 13, the cross-sectional shape of the partition wall 20 dividing each internal supply pipe 13 is one of the 'I' shape, 'Y' shape, '+', and '*' shape. It is formed in a single cross-sectional shape, but in the case where there are two internal supply pipes (13), the partition wall (20) is formed in an 'I'-shaped cross section that divides the inside of the main pipe (11) into two spaces, and the internal supply pipe (13) ) in the case of three, it is formed as a 'Y'-shaped cross section that divides the inside of the main pipe (11) into three spaces, and in the case of four internal supply pipes (13), the inside of the main pipe (11) is divided into four spaces. It is formed with a '+' or ' The space inside the pipe (11) can be divided according to the number of internal supply pipes (13),
The internal supply pipe (13) is
The chemical liquid is further provided with an auxiliary temperature control unit (30) in the form of a spiral pipe that is wound longitudinally around the outer periphery and maintains the temperature of the internal supply pipe (13) at a preset low or high temperature through a separate refrigerant. Temperature maintenance capable spraying device.
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