KR102675745B1 - Head maintenance unit and apparatus for treating substrate - Google Patents

Abstract

The present invention provides an apparatus for processing a substrate. A substrate processing apparatus includes: a head unit including a head provided with at least one nozzle for discharging a processing liquid to a substrate; and a head maintenance unit that performs maintenance on the head, wherein the head maintenance unit includes: a liquid receiving block formed with at least one liquid receiving part having an open upper liquid receiving space; a pressure reducing line in fluid communication with the liquid receiving space and providing reduced pressure to the liquid receiving space; And it may include a pressure reducing valve installed in the pressure reducing line.

Description

Head maintenance unit and substrate processing device {HEAD MAINTENANCE UNIT AND APPARATUS FOR TREATING SUBSTRATE}

The present invention relates to a head maintenance unit and a substrate processing device.

Recently, display devices such as liquid crystal display devices and organic EL display devices are required to have high resolution. In order to manufacture a display device with high resolution, more pixels must be formed per unit area on the substrate, and it is important to accurately discharge a chemical solution such as ink into each of these densely arranged pixels. If this is not the case, a defective display element may be determined to be defective. Therefore, according to related technologies, in the manufacture of display elements, it is required to accurately manage the discharge point (eg, dot) of the chemical liquid discharged to each pixel and the discharge amount of the chemical liquid. Accordingly, in order to obtain data on the hitting point of the chemical and the discharge amount of the chemical when the head that discharges the ink discharges the chemical, or to minimize the occurrence of clogging in the nozzle due to solidification of the chemical in the nozzle formed on the head, general The head of the inkjet device performs pre-jetting.

Figure 1 is a diagram showing the head of a general inkjet device performing free jetting. Referring to FIG. 1, a typical inkjet device 1 includes a head unit 2. The head unit 2 includes a plurality of heads 4 that discharge ink droplets I, a head frame 3 into which the plurality of heads 4 are inserted, and a head interface board 5 that controls the heads 4. ) includes. Additionally, the inkjet device 1 includes a head maintenance member 6. The head maintenance member 6 includes a porous plate 8 that absorbs ink I in the form of droplets discharged by the head 4 and a support frame 7 that supports the porous plate 8. A plurality of porous plates 8 and support frames 7 are provided.

As described above, to check whether the discharge point of the ink (I) discharged by the head (4) and the discharge amount of the ink (I) are accurately managed (or to prevent clogging of the nozzles formed on the head (4)) ), the head 4 performs pre-jetting before processing the substrate. Pre-jetting is performed with the heads 4 positioned between the porous plates 8. Optionally, pre-jetting may be performed with the heads 4 located on top of the porous plate 8.

In order to accurately eject ink (I) into each of the densely arranged pixels as described above, recently, the volume of ink (I) ejected by the head 4 has gradually become smaller. The volume of ink (I) in the form of droplets discharged by the head 4 may be 6 pico liter (PL) or less. As the volume of ink (I) in the form of droplets ejected by the head 4 decreases, the ink (I) ejected may scatter when the head 4 performs pre-jetting. The scattered ink (I) may contaminate the head interface board (5) and/or the substrate processing apparatus (1) in which the head unit (2) is installed.

One object of the present invention is to provide a head maintenance unit and a substrate processing device that can effectively perform maintenance on the head.

Another object of the present invention is to provide a head maintenance unit and a substrate processing device that can minimize contamination of the substrate processing device by ink in the form of droplets discharged from the head when the head performs free jetting.

Another object of the present invention is to provide a head maintenance unit and a substrate processing device that can minimize scattering of ink in the form of droplets discharged from the head when the head performs free jetting.

The object of the present invention is not limited here, and other objects not mentioned will be clearly understood by those skilled in the art from the description below.

The present invention provides an apparatus for processing a substrate. A substrate processing apparatus includes: a head unit including a head provided with at least one nozzle for discharging a processing liquid to a substrate; and a head maintenance unit that performs maintenance on the head, wherein the head maintenance unit includes: a liquid receiving block formed with at least one liquid receiving part having an open upper liquid receiving space; a pressure reducing line in fluid communication with the liquid receiving space and providing reduced pressure to the liquid receiving space; And it may include a pressure reducing valve installed in the pressure reducing line.

According to one embodiment, the liquid receiving block may be connected to the pressure reducing line and include a pressure reducing flow path in fluid communication with the liquid receiving space.

According to one embodiment, the liquid receiving block may further include a connection passage formed between the pressure reduction passage and the liquid receiving space.

According to one embodiment, a connection valve may be installed in the connection passage to selectively communicate fluidly between the pressure reduction passage and the liquid receiving space.

According to one embodiment, a plurality of heads may be provided, and the number of liquid receiving parts may be the same as the number of heads provided.

According to one embodiment, the head and the liquid receiving part are provided in plurality, and the liquid receiving part may be formed on the liquid receiving block along the direction in which the head is arranged.

According to one embodiment, the device further includes a controller, the controller comprising: a purging step of purging the head by supplying gas to a pipe connected to the head; Additionally, the head unit may be controlled to perform at least one of the free jetting steps of discharging the treatment liquid in the form of droplets to the maintenance unit.

According to one embodiment, when performing the pre-jetting step, the liquid receiving block is located at the bottom of the head, and the controller turns on the pressure reducing valve when the head discharges the processing liquid in the form of droplets. ), the head unit, and the head maintenance unit can be controlled.

According to one embodiment, the liquid receiving part has a side extending along the vertical direction when viewed in cross section; And it may include an inclined surface extending in a downwardly inclined direction from the side surface.

Additionally, the present invention provides a head maintenance unit that includes a device for discharging ink to process a substrate and performs maintenance on a head discharging the ink. The head maintenance unit includes: a liquid receiving block including at least one liquid receiving portion having an open upper liquid receiving space; a pressure reducing line in fluid communication with the liquid receiving space and providing reduced pressure to the liquid receiving space; And it may include a pressure reducing valve installed in the pressure reducing line.

According to one embodiment, the liquid receiving block may be connected to the pressure reducing line and include a pressure reducing flow path in fluid communication with the liquid receiving space.

According to one embodiment, the liquid receiving block may further include a connection passage formed between the pressure reduction passage and the liquid receiving space.

According to one embodiment, a connection valve may be installed in the connection passage to selectively communicate fluidly between the pressure reduction passage and the liquid receiving space.

According to one embodiment, the liquid receiving portion may be formed on the liquid receiving block along a direction in which the plurality of heads are arranged.

According to one embodiment, the liquid receiving part has a side extending along the vertical direction when viewed in cross section; And it may include an inclined surface extending in a downwardly inclined direction from the side surface.

Additionally, the present invention provides a device for treating a substrate by discharging ink. A substrate processing apparatus includes: a head unit including at least one head provided with a nozzle that discharges ink in the form of droplets onto a substrate; a printing area where the head discharges the ink onto the substrate to perform a printing process on the substrate; When viewed from the top, a maintenance area is disposed in line with the printing area and performs maintenance on the head; a gantry provided to enable the head unit to move back and forth between the printing area and the maintenance area; and a head maintenance unit installed in the maintenance area, configured to be movable in a direction parallel to the movement direction of the substrate in the printing area, and performing maintenance on the head, wherein the head maintenance unit is configured to move in a direction parallel to the movement direction of the substrate in the printing area. a liquid receiving block including at least one liquid receiving portion having an open liquid receiving space; a pressure reducing line in fluid communication with the liquid receiving space and providing reduced pressure to the liquid receiving space; And it may include a pressure reducing valve installed in the pressure reducing line.

According to one embodiment, the liquid receiving block may be connected to the pressure reducing line and include a pressure reducing flow path in fluid communication with the liquid receiving space.

According to one embodiment, the liquid receiving part has a side extending along the vertical direction when viewed in cross section; And it may include an inclined surface extending in a downwardly inclined direction from the side surface.

According to one embodiment, the device further includes a controller, the controller comprising: a purging step of purging the head by supplying gas to a pipe connected to the head; Additionally, the head unit can be controlled to perform at least one of the free jetting steps of discharging the ink in the form of droplets using the maintenance unit.

According to one embodiment, when performing the pre-jetting step, the controller turns on the pressure reducing valve when the liquid receiving block is located below the head and the head discharges the ink in the form of droplets. The head unit and the head maintenance unit can be controlled to do so.

According to an embodiment of the present invention, maintenance on the head can be performed effectively.

Additionally, according to an embodiment of the present invention, it is possible to minimize contamination of the substrate processing device by ink in the form of droplets ejected from the head when the head performs free jetting.

Additionally, according to an embodiment of the present invention, scattering of ink in the form of droplets discharged from the head when the head performs free jetting can be minimized.

The effects of the present invention are not limited to the effects described above, and effects not mentioned above will be clearly understood by those skilled in the art from this specification and the accompanying drawings.

Figure 1 is a diagram showing the head of a general inkjet device performing free jetting.
Figure 2 is a diagram showing a substrate processing apparatus according to an embodiment of the present invention.
FIG. 3 is a diagram showing the head maintenance unit of FIG. 2.
FIG. 4 is a diagram showing the liquid receiving block of FIG. 3 and a pressure reducing line connected to the liquid receiving block.
FIG. 5 is a cross-sectional view of the liquid receiving block of FIG. 4 and the pressure reduction line viewed from BB'.
Figure 6 is a cross-sectional view of the liquid receiving block of Figure 4 viewed from AA'.
Figure 7 is a diagram showing the suction cleaning module of Figure 4.
Figure 8 is a diagram showing free jetting by the head of a substrate processing apparatus according to an embodiment of the present invention.
Figure 9 is a diagram showing a liquid receiving block according to another embodiment of the present invention.
Figure 10 is a diagram showing a liquid receiving block according to another embodiment of the present invention.
Figure 11 is a diagram showing a head maintenance unit according to another embodiment of the present invention.

Below, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Additionally, when describing preferred embodiments of the present invention in detail, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, the same symbols are used throughout the drawings for parts that perform similar functions and actions.

'Including' a certain component does not mean excluding other components, but rather including other components, unless specifically stated to the contrary. Specifically, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to include one or more other features or It should be understood that this does not exclude in advance the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Singular expressions include plural expressions unless the context clearly dictates otherwise. Additionally, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms may be used for the purpose of distinguishing one component from another component. For example, a first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component without departing from the scope of the present invention.

When a component is said to be "connected" or "connected" to another component, it is understood that it may be directly connected to or connected to that other component, but that other components may also exist in between. It should be. On the other hand, when it is mentioned that a component is “directly connected” or “directly connected” to another component, it should be understood that there are no other components in between. Other expressions that describe the relationship between components, such as "between" and "immediately between" or "neighboring" and "directly adjacent to" should be interpreted similarly.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless clearly defined in the present application, should not be interpreted as having an ideal or excessively formal meaning. .

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 2 to 10.

Figure 2 is a diagram showing a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 2 , the substrate processing device 100 according to an embodiment of the present invention may be an inkjet device that processes a substrate (S) by supplying a chemical solution, such as ink, onto the substrate (S). For example, the substrate processing apparatus 100 may perform a printing process on the substrate S by discharging ink I in the form of droplets on the substrate S. Additionally, the substrate S may be a glass substrate. However, it is not limited to this and the type of substrate S may be modified in various ways.

The substrate processing apparatus 100 includes a printing area 10, a maintenance area 20, a gantry 30, a head unit 40, a nozzle alignment unit 50, a fourth vision unit 60, and a controller 80. ), and may include a head maintenance unit 200.

When viewed from the top, the printing area 10 may have a longitudinal direction in the first direction (X). Hereinafter, when viewed from the top, the direction perpendicular to the first direction (X) is referred to as the second direction (Y), and the direction perpendicular to the first direction (X) and the second direction (Y) is referred to as the third direction. It is called (Z). The third direction (Z) may be a direction perpendicular to the ground. Additionally, the first direction (X) may be a direction in which the substrate (S), which will be described later, is transported. In the printing area 10, the head unit 40, which will be described later, discharges ink I in the form of droplets onto the substrate S, so that a printing process can be performed on the substrate S.

Additionally, the substrate S transferred from the printing area 10 may remain in a floating state. Accordingly, the printing area 10 may be provided with a levitation stage capable of levitating the substrate S when transferring the substrate S. Additionally, the printing area 10 may further include a transfer unit that grips and transfers one or both sides of the substrate S. The mentioned transfer unit may include a guide rail provided along one or both sides of the floating stage and a gripper that slides along the guide rail while holding one or both sides of the substrate S. Additionally, the substrate, for example, the substrate S, transferred from the printing area 10 may be transferred along the first direction (X).

In the maintenance area 20, maintenance on the head unit 40, which will be described later, can be performed. When viewed from the top, the maintenance area 20 may have a longitudinal direction in the first direction (X). Additionally, the maintenance area 20 may be arranged parallel to the printing area 10. For example, the maintenance area 20 and the printing area 10 may be arranged side by side along the second direction (Y).

Before or after the head unit 40 discharges the processing liquid I to the substrate S in the form of droplets, the maintenance area 20 allows the head 42 of the head unit 40 to be described later to discharge the processing liquid. You can. For example, in the maintenance area 20, at least one of a purging step and a free jetting step may be performed. The controller 80, described later, can control the head unit 40, described later, to perform at least one of a purging step and a free jetting step in the maintenance area 20.

In the purging step, an inert gas such as nitrogen may be supplied to a pipe (not shown) connected to the head 42 of the head unit 40, which will be described later, to purge the pipe connected to the head 42. When an inert gas is supplied to the pipe connected to the head 42, the supplied inert gas can push the treatment liquid (I) remaining in the pipe toward the nozzle 42a of the head 42. The processing liquid (I) pushed toward the nozzle 42a may be discharged through the nozzle 42a.

In addition, the pre-jetting step can be performed to collect data for controlling the dots of the treatment liquid (I) in the form of droplets discharged by the head 42 of the head unit 40 and the volume of the treatment liquid (I). there is. Additionally, the pre-jetting step may be performed to prevent the processing liquid I from solidifying in the nozzle 42a formed in the head 42 of the head unit 40 and clogging the nozzle 42a. In the pre-jetting step, the head 42 of the head unit 40 may discharge the treatment liquid I in the form of droplets. In the pre-jetting step, the head unit 40 may discharge the treatment liquid I in the form of droplets to the head maintenance unit 200 provided in the maintenance area. The volume of the treatment liquid (I) in the form of droplets discharged by the head unit 40 in the pre-jetting step may be 6 pico liter (PL) or less.

In addition, since the head unit 40, which will be described later, in the maintenance area 20 can discharge the processing liquid I in the form of droplets, the maintenance area 20 may have the same or similar process environment as the printing area 10. You can.

The gantry 30 can be provided so that the head unit 40, which will be described later, or the fourth vision unit 60, which will be described later, can move in a straight line. The gantry 30 may include a first gantry 31, a second gantry 32, and a third gantry 33. The first gantry 31 and the second gantry 32 may be provided to have a structure extending along the printing area 10 and the maintenance area 20. Additionally, the first gantry 31 and the second gantry 32 may be arranged to be spaced apart from each other along the first direction (X). That is, the first gantry 31 and the second gantry 32 allow the head unit 40, which will be described later, to move back and forth between the printing area 10 and the maintenance area 20 along the second direction (Y). It may be provided to have a structure extending along the second direction (Y) in which the printing area 10 and the maintenance area 20 are arranged.

Additionally, the third gantry 33 may be provided to have a structure extending along the printing area 10 in the second direction (Y). That is, the third gantry 33 may be provided with a structure that extends so that the fourth vision unit 60, which will be described later, can move along the second direction (Y).

The head unit 40 may discharge the processing liquid (I) in the form of droplets to the substrate (S). The processing liquid (I) discharged by the head unit 40 may be ink. The head unit 40 may perform a printing process on the substrate S by discharging the treatment liquid I in the form of droplets to the substrate S. For example, the head unit 40 may perform a printing process on the substrate S by discharging the treatment liquid I to the substrate S while reciprocating along the second direction Y.

The head unit 40 may include a head 42, a head frame 44, a head interface board 45, a first vision unit 46, and a second vision unit 48.

The head 42 may be provided with a plurality of nozzles 42a that discharge the processing liquid I in the form of droplets. At least one head 42 may be provided. For example, a plurality of heads 42 may be provided. The plurality of heads 42 may be arranged side by side along the first direction (X). A plurality of heads 42 may be fitted into the head frame 44 . Additionally, a head interface board 45 may be installed on the head frame 44. The head interface board 45 can control the head 42 and the volume of ink (I) ejected by the head 42.

The head 42 may be movably coupled to the first gantry 31 and the second gantry 32 via the head frame 44. For example, the head 42 may be provided to be movable along the second direction Y, which is the longitudinal direction of the first gantry 31 and the second gantry 32. In addition, the head 42 reciprocates in a straight line between the printing area 10 and the maintenance area 20 along the second direction (Y), which is the longitudinal direction of the first gantry 31 and the second gantry 32. You can move. Additionally, the first vision unit 46 and the second vision unit 48 may be combined on one side of the head 42 when viewed from the top. The first vision unit 46 and the second vision unit 48 may be arranged side by side along the first direction (X). The first vision unit 46 and the second vision unit 48 can check the ink (I) in the form of droplets ejected by the head 42. The first vision unit 46 and the second vision unit 48 may be cameras including an image acquisition module.

The nozzle alignment unit 50 may be provided in the maintenance area 20 . The nozzle alignment unit 50 may be provided between the first gantry 31 and the second gantry 32 when viewed from the top. Accordingly, the nozzle aligner 50 can check the status of the nozzles 42a formed on the head 42. For example, the nozzle alignment unit 50 may include a moving rail 52 and a third vision unit 54. The moving rail 52 may have a longitudinal direction in the first direction (X). The third vision unit 54 can reciprocate in a straight line along the first direction (X), which is the longitudinal direction of the moving rail 52. The third vision unit 54 can image the nozzles 42a of the head 42 while moving along the longitudinal direction of the moving rail 52.

The fourth vision unit 60 may be installed in the third gantry 33 to be movable along the second direction (Y), which is the longitudinal direction of the third gantry 33. The fourth vision unit 60 may be a camera including an image acquisition module. The fourth vision unit 60 may acquire images of ink droplets (I) discharged on the second substrate (S2) and transmit the acquired images to the controller 80, which will be described later. The controller 80 analyzes the image acquired by the fourth vision unit 60 and provides data to correct the dot point of the ink droplet ejected by the head unit 40, the moving speed of the head 42, the moving speed of the substrate, etc. can be calculated.

The head maintenance unit 200 may be installed in the maintenance area 20. The head maintenance unit 200 may be configured to be movable in the maintenance area 20 . For example, the head maintenance unit 200 may be configured to be movable along the first direction (X) in the maintenance area 20. For example, the head maintenance unit 200 may be configured to be movable in a direction parallel to the direction of movement of the substrate S in the printing area 10. The head maintenance unit 200 may perform maintenance on the head 42. The specific structure of the head maintenance unit 200 will be described later.

The controller 80 may control the substrate processing apparatus 100 . The controller 80 may control the substrate processing apparatus 100 so that the substrate processing apparatus 100 performs a processing process on the substrate S. For example, the controller 80 may control the substrate processing apparatus 100 so that the substrate processing apparatus 100 performs a printing process on the substrate S. Additionally, the controller 80 may control the substrate processing apparatus 100 so that the substrate processing apparatus 100 performs maintenance on the head unit 40 . For example, the controller 80 may control the head unit 40 and the head maintenance unit 200 to perform maintenance on the head unit 40. In addition, the controller 80 controls the images (photos or videos) acquired by the first vision unit 46, the second vision unit 48, the third vision unit 54, and the fourth vision unit 60. Based on this, data for correcting the hitting point of the treatment liquid (I) in the form of a droplet discharged by the head unit 40, the moving speed of the head 42, the moving speed of the substrate S, etc. It can be calculated.

In addition, the controller 80 includes a process controller consisting of a microprocessor (computer) that controls the substrate processing apparatus 100, a keyboard through which the operator performs command input operations, etc. to manage the substrate processing apparatus 100, A user interface consisting of a display that visualizes and displays the operating status of the substrate processing device 100, a control program for executing the processing performed in the substrate processing device 100 under the control of the process controller, and various data and processing conditions. Accordingly, each component may be provided with a storage unit in which a program for executing processing, that is, a processing recipe, is stored. Additionally, the user interface and storage may be connected to the process controller. The processing recipe may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, a portable disk such as a CD-ROM or DVD, or a semiconductor memory such as a flash memory.

FIG. 3 is a diagram showing the head maintenance unit of FIG. 2. Referring to FIG. 3, the head maintenance unit 200 may include a purging bath 210, a liquid receiving block 230, a pressure reduction line 240, a suction cleaning module 250, and a suction line 260. . In FIG. 3 , the pressure reduction line 240 and the suction line 260 are omitted for convenience of explanation.

The purging bath 210 may be configured to be movable along the first direction (X) in the maintenance area 20 . The purging bath 210 may be moved to a lower area of the head unit 40 when performing the purging step or the free jetting step of the head unit 40 described above. For example, the purging bath 210 may be configured to be movable along the first direction (X) in the maintenance area 20 by a moving member such as an LM guide. Additionally, the moving member is not limited to the LM guide, and may be variously modified into known devices capable of moving the purging bath 210.

The purging bath 210 may include a liquid receiving portion 211, a support frame 212, and a support plate 213.

The liquid receiving portion 211 may have a cylindrical shape with an open top. The liquid receiving portion 211 may have a receiving space that receives the treatment liquid I discharged from the head 42 when the purging step or the free jetting step described above is performed. The liquid receiving part 211 may be connected to a discharge line (not shown) capable of discharging the treatment liquid (I) supplied to the receiving space of the liquid receiving part 211 to the outside. Additionally, the liquid receiving portion 211 may be supported on the support plate 213 by a plurality of support frames 212. The support plate 213 may be combined with the above-described moving member (eg, LM guide). Accordingly, the purging bath 210 may be moved along the first direction (X) by the moving member.

Additionally, a liquid receiving block 230 and a suction cleaning module 250 may be installed in the liquid receiving portion 211 of the purging bath 210. At least one liquid receiving block 230 may be installed in the purging bath 210. For example, a plurality of liquid receiving blocks 230 may be installed in the purging bath 210 . For example, six liquid receiving blocks 230 may be installed in the purging bath 210 . However, it is not limited to this, and the number of liquid receiving blocks 230 installed in the purging bath 210 can be varied. Additionally, the liquid receiving blocks 230 are divided into two groups, and are divided into two groups. Any one of the groups may be arranged side by side along the second direction (Y). The other group of the two groups may be spaced apart from any of the above-described groups along the first direction (X), but may be arranged side by side along the second direction (Y). In addition, the suction cleaning module 250 At least one may be installed in the purging bath 210. For example, a plurality of suction cleaning modules 250 may be installed in the purging bath 210. For example, two suction cleaning modules 250 may be installed in the purging bath 210. However, it is not limited to this, and the number of suction cleaning modules 250 installed in the purging bath 210 may vary.

The liquid receiving block 230 may be disposed below the head unit 40 when the pre-jetting step of the head unit 40 described above is performed. The liquid receiving block 230 may receive the treatment liquid (I) discharged from the head unit 40 when the head unit 40 discharges the treatment liquid (I) in the form of droplets. Additionally, the suction cleaning module 250 may remove the treatment liquid (I) attached to the nozzle 42a of the head unit 40 or the surrounding area of the nozzle 42a from the head unit 40 using a vacuum suction method.

FIG. 4 is a view showing the liquid receiving block of FIG. 3 and the pressure reducing line connected to the liquid receiving block, FIG. 5 is a cross-sectional view of the liquid receiving block of FIG. 4 and the pressure reducing line viewed from line B-B', and FIG. 6 is a view showing the liquid receiving block of FIG. 4 and the pressure reducing line connected to the liquid receiving block. This is a cross-sectional view of the liquid receiving block from A-A'. Referring to FIGS. 4 to 6 , a pressure reducing passage 232, a coupling sphere 234, a liquid receiving portion 235, and a connection passage 237 may be formed in the liquid receiving block 230.

The pressure reduction passage 232 may be formed within the liquid receiving block 230. The pressure reduction flow path 232 may be formed within the liquid receiving block 230 along the longitudinal direction of the liquid receiving block 230 . The pressure reduction passage 232 formed in the liquid receiving block 230 may receive reduced pressure from the pressure reduction line 240 connected through the coupling hole 234. A pressure reducing valve 242 may be installed in the pressure reducing line 240. The pressure reducing valve 242 may be an on/off valve or may be provided as a flow control valve. As the pressure reduction valve 242 opens and closes, the reduced pressure provided by the pressure reduction line 240 may be transmitted to the pressure reduction passage 232.

A liquid receiving portion 235 may be formed on the upper part of the pressure reduction passage 232. The liquid receiving part 235 may have a liquid receiving space 236. The liquid receiving space 236 may be provided with an open top. At least one liquid receiving unit 235 may be provided. For example, a plurality of liquid receiving units 235 may be provided. The liquid receiving portions 235 may be provided in the same number as the heads 42 described above. The liquid receiving portion 235 may be formed on the liquid receiving block 230 along the direction in which the plurality of heads 42 are arranged. For example, if the head 42 is arranged along the first direction (X), the liquid receiving portion 235 may also be formed in the liquid receiving block 230 along the first direction (X). Accordingly, when the heads 42 of the head unit 40 are disposed on the upper part of the liquid receiving block 230 (for example, when performing free jetting), each head 42 is connected to the liquid receiving portions 235. It can be placed on top of each. Accordingly, free jetting for a plurality of heads 42 can be performed simultaneously.

The liquid receiving portion 235 may have a side surface 235a and an inclined surface 235b when viewed in the longitudinal direction of the liquid receiving block 230. The side surface 235a may extend along the longitudinal direction of the liquid receiving block 230 and in the vertical direction when viewed from the cross section of the liquid receiving block 230 (Chamfer prohibited). For example, a stepped portion may not be formed on the side surface 235a. Accordingly, as will be described later, when the head 42 discharges the treatment liquid (I) in the form of droplets, the treatment liquid (I) delivered to the liquid receiving space 236 flows downward along the side surface 235a. do. In other words, the problem that the treatment liquid (I) adheres to the liquid receiving part 235 and accumulates in the liquid receiving part 235 can be solved. Additionally, the inclined surface 235b may extend in a downwardly inclined direction from the side surface 235a. The inclined surface 235b may extend in a downwardly inclined direction toward the connection passage 237, which will be described later. The inclined surface 235b may help the treatment liquid (I) delivered to the liquid receiving space 236 to be transferred to the pressure reduction passage 232 through the connection passage 237.

Additionally, a connection passage 237 may be formed between the liquid receiving space 236 and the pressure reduction passage 232. The connection passage 237 may be formed to correspond to each of the plurality of liquid receiving portions 235. The connection passage 237 may allow the pressure reduction passage 232 and the liquid receiving space 236 to be in fluid communication with each other. Accordingly, the reduced pressure provided by the pressure reduction line 240 is transmitted to the pressure reduction flow path 232, the reduced pressure delivered to the pressure reduction flow path 232 is transmitted to the connection flow path 237, and the reduced pressure delivered to the connection flow path 237 is It can be delivered to the liquid receiving space 236.

Figure 7 is a diagram showing the suction cleaning module of Figure 4. Referring to FIG. 7, the suction cleaning module 250 may include a body 251 with a suction flow path formed therein, and a suction port 253 for suction cleaning the lower surface of the head 42. Additionally, the suction cleaning module 250 may be connected to the suction line 260. The suction line 260 may provide reduced pressure to the suction passage formed in the body 251. Additionally, a suction valve 262 may be installed in the suction line 260. By the reduced pressure provided by the suction line 260, the suction port 253 suctions the lower surface of the head 42, and the treatment liquid attached to the nozzle 42a formed in the head 42 or the surrounding area of the nozzle 42a. (I) can be removed.

Figure 8 is a diagram showing free jetting by the head of a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 8 , when performing a pre-jetting step on the head 42, the controller 80 can control the head unit 40 and the head maintenance unit 200. For example, when performing the free jetting step, the controller 80 may move the head maintenance unit 200 so that the liquid receiving block 230 is located below the head 42. For example, the controller 80 may move the head maintenance unit 200 so that each of the liquid receiving parts 235 of the liquid receiving block 230 is positioned correspondingly to the lower part of each of the plurality of heads 42. . At this time, the gap between the top of the liquid receiving portion 235 and the bottom of the head 42 may be 1 mm or less.

Thereafter, the controller 80 may control the head unit 40 to cause the head 42 to discharge the treatment liquid I in the form of droplets. At this time, the volume of the treatment liquid (I) in the form of droplets discharged from the head 42 may be 6 pico liter (PL) or less.

In addition, the controller 80 controls the head maintenance unit 200 so that the pressure reducing valve 242 is turned on before or after the head 42 discharges the treatment liquid (I). 200) can be controlled. When the pressure reducing valve 242 is turned on, the reduced pressure provided by the pressure reducing line 240 may be transmitted to the liquid receiving space 236 through the pressure reducing flow path 232 and the connection flow path 237. Accordingly, the treatment liquid (I) in the form of droplets discharged by the head unit 40 may be sucked into the liquid receiving space 236 by the reduced pressure delivered to the liquid receiving space 236. Accordingly, even if the volume of the treatment liquid (I) discharged in the form of droplets is very small, the problem of the treatment liquid (I) scattering can be minimized. In other words, the problem of the processing liquid (I) scattering in the pre-jetting step can be minimized, and contamination of the substrate processing device 100, such as the head unit 40, by the scattering processing liquid (I) can be minimized. there is. Accordingly, the risk that the substrate S being processed will be contaminated by impurities that may adhere to the head unit 40 can also be effectively reduced.

Figure 9 is a diagram showing a liquid receiving block according to another embodiment of the present invention. Referring to FIG. 9, each of the connection passages 237 formed in the liquid receiving block 230 according to another embodiment has a connection valve 238 that selectively communicates fluidly between the pressure reducing passage 232 and the liquid receiving space 236. Can be installed. The connection valve 238 may be an on/off valve or a flow control valve. The connection valve 238 can be turned on/off or its opening/closing rate can be adjusted by the controller 80. For example, the controller 80 may make the opening/closing rates of the connection valve 238 adjacent to the pressure reduction line 240 different from the opening/closing rate of the connection valve 238 far from the pressure reduction line 240. For example, the opening rate of the connection valve 238 adjacent to the pressure reduction line 240 may be smaller than the opening rate of the connection valve 238 far from the pressure reduction line 240. That is, depending on the location where the pressure reduction line 240 is connected, the amount of reduced pressure delivered to the liquid receiving space 236 of each of the liquid receiving parts 235 may be different. However, according to another embodiment of the present invention, the opening and closing rates of the connection valves 238 can be adjusted differently to equalize the amount of reduced pressure delivered to the liquid receiving space 236 of each liquid receiving part 235. there is.

Figure 10 is a diagram showing a liquid receiving block according to another embodiment of the present invention. Referring to FIG. 10, a liquid receiving member 290 may be installed in the liquid receiving block 230 according to another embodiment of the present invention. The liquid receiving member 290 may be a porous plate capable of absorbing the treatment liquid (I) discharged by the head 42. The liquid receiving member 290 may have a stepped shape so that the height of the upper surface 290a in the central area is different from the height of the upper surface 290b in the edge area. For example, the height of the upper surface 290a of the central area of the liquid receiving member 290 may be higher than the height of the upper surface 290b of the edge area. When the liquid receiving member 290 is provided, the processing liquid I may form at the edge area of the liquid receiving member 290. When the treatment liquid (I) forms on the edge area of the liquid receiving member 290, the treatment liquid (I) may be delivered to the lower surface of the head 42. Accordingly, the height of the upper surface 290b of the edge area of the liquid receiving member 290 is provided low, so that contamination of the head 42 due to the treatment liquid I can be minimized. Additionally, as the liquid receiving member 290 is provided as a porous plate, the reduced pressure transmitted to the liquid receiving space 236 may be transmitted to the lower surface of the head 42 through the liquid receiving member 290.

Figure 11 is a diagram showing a head maintenance unit according to another embodiment of the present invention. Referring to FIG. 11, the head maintenance unit 200 according to another embodiment of the present invention may further include a head cleaning module 270. The head cleaning module 270 may include a frame 272 and a head cleaning bar 274. The head cleaning bar 274 can wipe off the treatment liquid (I) attached to the head 42. The head cleaning bar 274 may be rotatably provided. The head cleaning bar 274 may be provided within a frame 272 with an open top.

In the above example, the liquid receiving block 230 is used in the pre-jetting step of the head unit 40 as an example, but it is not limited thereto. For example, the liquid receiving block 230 may be used in the same or similar manner in various processing steps and maintenance steps in which the head unit 40 discharges the processing liquid (I) having a fine volume.

The above detailed description is illustrative of the present invention. Additionally, the foregoing is intended to illustrate preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the inventive concept disclosed in this specification, the scope equivalent to the written disclosure, and/or the technology or knowledge in the art. The written examples illustrate the best state for implementing the technical idea of the present invention, and various changes required for specific application fields and uses of the present invention are also possible. Accordingly, the detailed description of the invention above is not intended to limit the invention to the disclosed embodiments. Additionally, the appended claims should be construed to include other embodiments as well.

Inkjet device: 1
Head Unit: 2
Head frame: 3
Heads: 4
Head interface board: 5
Absence of head maintenance: 6
Support frame: 7
Liquid receiving plate: 8
Head maintenance unit: 200
Purging Bath: 210
Liquid receiving part: 211
Support frame: 212
Support plate: 213
Liquid receiving block: 230
Decompression flow path: 232
Combining phrases: 234
Liquid receiver part: 235
Side: 235a
Slope: 235b
Liquid receiving space: 236
Connection Euro: 237
Connection valve: 238
Pressure relief line: 240
Pressure reducing valve: 242
Suction cleaning module: 250
Body: 251
Intake port: 253
Suction line: 260
Intake valve: 262
Head cleaning module: 270
Frame: 272
Head cleaning bar: 274
Liquid receiver member: 290

Claims (20)

delete In a device for processing a substrate,
A head unit including a head provided with at least one nozzle for discharging a processing liquid to a substrate; and
Includes a head maintenance unit that performs maintenance on the head,
The head maintenance unit is,
A liquid receiving block formed with at least one liquid receiving part having an open upper liquid receiving space;
a pressure reducing line in fluid communication with the liquid receiving space and providing reduced pressure to the liquid receiving space; and
Including a pressure reducing valve installed in the pressure reducing line,
The liquid receiving block is,
A substrate processing device comprising a pressure reduction flow path connected to the pressure reduction line and in fluid communication with the liquid receiving space. According to paragraph 2,
The liquid receiving block is,
A substrate processing apparatus further comprising a connection flow path formed between the pressure reduction flow path and the liquid receiving space. According to paragraph 3,
In the connection flow path,
A substrate processing device wherein a connection valve is installed to selectively communicate fluidly between the pressure reduction passage and the liquid receiving space. According to any one of claims 2 to 4,
The head is,
Provided in plural,
The above liquid collector blowing,
A substrate processing device provided in the same number as the number of heads provided. According to any one of claims 2 to 4,
The head and the liquid receiver are provided in plural numbers,
The above liquid receiver blowing,
A substrate processing device formed on the liquid receiving block along the direction in which the head is arranged. According to any one of claims 2 to 4,
The device is,
further comprising a controller,
The controller is,
A purging step of purging the head by supplying gas to a pipe connected to the head; and
A substrate processing device that controls the head unit to perform at least one of a pre-jetting step of discharging the processing liquid in the form of droplets to the maintenance unit. In clause 7,
The controller is,
When performing the pre-jetting step, the liquid receiving block is located at the bottom of the head, the head unit turns on the pressure reducing valve when the head discharges the treatment liquid in the form of droplets, and the head maintenance unit A substrate processing device that controls the unit. According to any one of claims 2 to 4,
The above liquid collector blowing,
When viewed in cross section, a side extending along an upward and downward direction; and
A substrate processing device comprising an inclined surface extending in a downwardly inclined direction from the side surface. delete In the head maintenance unit, which includes a device for discharging ink and processing a substrate, and performing maintenance on the head discharging the ink,
a liquid receiving block including at least one liquid receiving unit having an open upper liquid receiving space;
a pressure reducing line in fluid communication with the liquid receiving space and providing reduced pressure to the liquid receiving space; and
Including a pressure reducing valve installed in the pressure reducing line,
The liquid receiving block is,
A head maintenance unit connected to the pressure reduction line and including a pressure reduction flow path in fluid communication with the liquid receiving space. According to clause 11,
The liquid receiving block is,
A head maintenance unit further comprising a connection flow path formed between the pressure reducing flow path and the liquid receiving space. According to clause 12,
In the connection flow path,
A head maintenance unit equipped with a connection valve that selectively communicates fluidly between the pressure reducing passage and the liquid receiving space. According to any one of claims 11 to 13,
The above liquid collector blowing,
A head maintenance unit formed on the liquid receiving block along the direction in which the plurality of heads are arranged. According to any one of claims 11 to 13,
The above liquid collector blowing,
When viewed in cross section, a side extending along an upward and downward direction; and
A head maintenance unit including an inclined surface extending in a downwardly inclined direction from the side surface. delete In a device for discharging ink to process a substrate,
A head unit including at least one head equipped with a nozzle that discharges ink in the form of droplets onto the substrate;
a printing area where the head discharges the ink onto the substrate to perform a printing process on the substrate;
When viewed from the top, a maintenance area is disposed in line with the printing area and performs maintenance on the head;
a gantry provided to enable the head unit to move back and forth between the printing area and the maintenance area; and
A head maintenance unit installed in the maintenance area, configured to be movable in a direction parallel to the movement direction of the substrate in the printing area, and performing maintenance on the head,
The head maintenance unit is,
a liquid receiving block including at least one liquid receiving unit having an open upper liquid receiving space;
a pressure reducing line in fluid communication with the liquid receiving space and providing reduced pressure to the liquid receiving space; and
Including a pressure reducing valve installed in the pressure reducing line,
The liquid receiving block is,
A substrate processing device comprising a pressure reduction flow path connected to the pressure reduction line and in fluid communication with the liquid receiving space. According to clause 17,
The above liquid collector blowing,
When viewed in cross section, a side extending along an upward and downward direction; and
A substrate processing device comprising an inclined surface extending in a downwardly inclined direction from the side surface. According to any one of claims 17 and 18,
The device is,
further comprising a controller,
The controller is,
A purging step of purging the head by supplying gas to a pipe connected to the head; and
A substrate processing device that controls the head unit to perform at least one of a pre-jetting step of discharging the ink in the form of droplets to the maintenance unit. According to clause 19,
The controller is,
When performing the pre-jetting step, the liquid receiving block is located below the head, and the head unit turns on the pressure reducing valve when the head discharges the ink in the form of droplets, and the head maintenance unit. A substrate processing device that controls .

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