KR102672511B1 - 컬러 계측을 사용한 기판의 두께 측정 - Google Patents

컬러 계측을 사용한 기판의 두께 측정 Download PDF

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Publication number
KR102672511B1
KR102672511B1 KR1020217028458A KR20217028458A KR102672511B1 KR 102672511 B1 KR102672511 B1 KR 102672511B1 KR 1020217028458 A KR1020217028458 A KR 1020217028458A KR 20217028458 A KR20217028458 A KR 20217028458A KR 102672511 B1 KR102672511 B1 KR 102672511B1
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KR
South Korea
Prior art keywords
color
substrate
color image
incidence
image
Prior art date
Application number
KR1020217028458A
Other languages
English (en)
Korean (ko)
Other versions
KR20210112414A (ko
Inventor
도미닉 제이. 벤베그누
보구슬라우 에이. 스웨덱
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/388,777 external-priority patent/US11557048B2/en
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20210112414A publication Critical patent/KR20210112414A/ko
Application granted granted Critical
Publication of KR102672511B1 publication Critical patent/KR102672511B1/ko

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/40—Analysis of texture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/90—Determination of colour characteristics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10024—Color image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Mechanical Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020217028458A 2019-02-07 2020-02-06 컬러 계측을 사용한 기판의 두께 측정 KR102672511B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962802662P 2019-02-07 2019-02-07
US62/802,662 2019-02-07
US16/388,777 US11557048B2 (en) 2015-11-16 2019-04-18 Thickness measurement of substrate using color metrology
US16/388,777 2019-04-18
PCT/US2020/016964 WO2020163570A1 (en) 2019-02-07 2020-02-06 Thickness measurement of substrate using color metrology

Publications (2)

Publication Number Publication Date
KR20210112414A KR20210112414A (ko) 2021-09-14
KR102672511B1 true KR102672511B1 (ko) 2024-06-07

Family

ID=71948073

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217028458A KR102672511B1 (ko) 2019-02-07 2020-02-06 컬러 계측을 사용한 기판의 두께 측정

Country Status (5)

Country Link
JP (1) JP7254197B2 (zh)
KR (1) KR102672511B1 (zh)
CN (1) CN113518691B (zh)
TW (1) TWI830864B (zh)
WO (1) WO2020163570A1 (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007256103A (ja) 2006-03-23 2007-10-04 Fujifilm Corp 測定チップの固定化膜の膜厚測定方法および測定チップ
US20180061032A1 (en) 2016-08-26 2018-03-01 Applied Materials, Inc. Thickness measurement of substrate using color metrology
US20180103247A1 (en) 2016-10-07 2018-04-12 Kla-Tencor Corporation Three-Dimensional Imaging For Semiconductor Wafer Inspection
JP2018204955A (ja) 2017-05-30 2018-12-27 レーザーテック株式会社 膜厚測定装置及び膜厚測定方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0394104A (ja) * 1989-09-06 1991-04-18 Toshiba Corp 膜厚測定方法と膜厚測定装置及びこれを用いた膜形成装置
US6939198B1 (en) * 2001-12-28 2005-09-06 Applied Materials, Inc. Polishing system with in-line and in-situ metrology
TWI252301B (en) * 2004-07-30 2006-04-01 Delta Electronics Inc Deposition system and film thickness monitoring device thereof
US8989890B2 (en) * 2008-11-07 2015-03-24 Applied Materials, Inc. GST film thickness monitoring
TW201100787A (en) * 2009-02-18 2011-01-01 Nikon Corp Surface examining device and surface examining method
US9528814B2 (en) * 2011-05-19 2016-12-27 NeoVision, LLC Apparatus and method of using impedance resonance sensor for thickness measurement
US10565701B2 (en) * 2015-11-16 2020-02-18 Applied Materials, Inc. Color imaging for CMP monitoring
US10563973B2 (en) * 2016-03-28 2020-02-18 Kla-Tencor Corporation All surface film metrology system
KR20180066381A (ko) * 2016-12-08 2018-06-19 삼성전자주식회사 기판 검사 시스템

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007256103A (ja) 2006-03-23 2007-10-04 Fujifilm Corp 測定チップの固定化膜の膜厚測定方法および測定チップ
US20180061032A1 (en) 2016-08-26 2018-03-01 Applied Materials, Inc. Thickness measurement of substrate using color metrology
US20180103247A1 (en) 2016-10-07 2018-04-12 Kla-Tencor Corporation Three-Dimensional Imaging For Semiconductor Wafer Inspection
JP2018204955A (ja) 2017-05-30 2018-12-27 レーザーテック株式会社 膜厚測定装置及び膜厚測定方法

Also Published As

Publication number Publication date
KR20210112414A (ko) 2021-09-14
CN113518691B (zh) 2024-03-08
TWI830864B (zh) 2024-02-01
JP2022519628A (ja) 2022-03-24
WO2020163570A1 (en) 2020-08-13
JP7254197B2 (ja) 2023-04-07
TW202042965A (zh) 2020-12-01
CN113518691A (zh) 2021-10-19

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