KR102663475B1 - Cutting tools with hard coating - Google Patents
Cutting tools with hard coating Download PDFInfo
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- KR102663475B1 KR102663475B1 KR1020230118799A KR20230118799A KR102663475B1 KR 102663475 B1 KR102663475 B1 KR 102663475B1 KR 1020230118799 A KR1020230118799 A KR 1020230118799A KR 20230118799 A KR20230118799 A KR 20230118799A KR 102663475 B1 KR102663475 B1 KR 102663475B1
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- 239000011248 coating agent Substances 0.000 title claims description 18
- 238000000576 coating method Methods 0.000 title claims description 18
- 239000000463 material Substances 0.000 claims abstract description 19
- 229910052796 boron Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- -1 cemented carbide Substances 0.000 abstract description 4
- 239000011195 cermet Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 55
- 230000000052 comparative effect Effects 0.000 description 24
- 229910008484 TiSi Inorganic materials 0.000 description 19
- 229910010038 TiAl Inorganic materials 0.000 description 10
- 239000000203 mixture Substances 0.000 description 7
- 238000003754 machining Methods 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910008482 TiSiN Inorganic materials 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010849 ion bombardment Methods 0.000 description 2
- QRXWMOHMRWLFEY-UHFFFAOYSA-N isoniazide Chemical compound NNC(=O)C1=CC=NC=C1 QRXWMOHMRWLFEY-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/044—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
- B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/221—Ion beam deposition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/042—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
- C23C28/048—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material with layers graded in composition or physical properties
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
Abstract
본 발명은 초경합금, 서멧(cermet), CBN과 같은 경질모재 상에 경질피막이 형성된 절삭공구에 관한 것이다.
본 발명에 따른 절삭공구는 경질모재와, 상기 경질모재 상에 형성된 경질피막을 포함하고, 상기 경질피막은 Ti(1-x)SixN(x는 원자비)로 이루어진 제 1 피막을 포함하고, 상기 절삭공구의 여유면과 경사면이 만나는 지점을 인선부 R이라고 하고, 인선부 R에서 상기 경사면과 여유면 방향으로 50㎛ 범위 이내에 있어서 상기 제 1 피막의 Si 원자비를 Rx라 할 때, 0<Rx≤0.10을 만족하고, 상기 여유면의 중앙 지점을 C라고 하고, C의 주변 50㎛ 이내의 상기 제 1 피막의 Si 원자비를 Cx라 할 때, 0.15≤Cx≤0.30을 만족하는 것을 특징으로 한다.The present invention relates to a cutting tool in which a hard film is formed on a hard base material such as cemented carbide, cermet, or CBN.
The cutting tool according to the present invention includes a hard base material and a hard film formed on the hard base material, and the hard film includes a first film made of Ti (1-x) Si x N (x is the atomic ratio), , the point where the relief surface and the rake surface of the cutting tool meet is called the cutting edge R, and the Si atomic ratio of the first film within a range of 50㎛ from the cutting tool R in the direction of the rake surface and the relief surface is called R x , When 0 < R Characterized by satisfaction.
Description
본 발명은 초경합금, 서멧(cermet), CBN과 같은 경질모재 상에 경질피막이 형성된 절삭공구에 관한 것이다.The present invention relates to a cutting tool in which a hard film is formed on a hard base material such as cemented carbide, cermet, and CBN.
HRC 50 이상의 고경도 강(steel)과 같이 경도가 높은 피삭재의 가공 시에 절삭공구의 수명 향상을 위해 각종 세라믹스로 이루어지는 경질피막을 절삭공구의 표면에 형성하는 기술이 채용되고 있다.In order to improve the lifespan of cutting tools when machining workpieces with high hardness, such as high-hardness steel of HRC 50 or higher, technology is being adopted to form a hard film made of various ceramics on the surface of the cutting tool.
이러한 경질피막 중 Ti와 Si의 복합 질화물인 TiSiN 피막은 우수한 내마모성과 내열성을 가지므로, 고경도 강 등의 절삭 가공에 있어 우수한 내구성을 발휘한다. 그러나 TiSiN 피막은 Si 함량에 높은 경우 내마모성은 우수하지만 내치핑성이 저하되고, Si 함량이 낮은 경우 내마모성이 저하되는 문제점이 있다.Among these hard films, the TiSiN film, which is a composite nitride of Ti and Si, has excellent wear resistance and heat resistance, and thus demonstrates excellent durability in cutting high-hardness steel, etc. However, the TiSiN film has excellent wear resistance when the Si content is high, but chipping resistance is reduced, and when the Si content is low, the wear resistance is reduced.
절삭공구의 영역별로, 예를 들어 지속적인 충격이 가해지는 인선(cutting edge)부와, 칩(chip)과의 마찰이 지속적으로 일어나는 경사면(rake face) 또는 여유면(flank face)에 요구되는 경질피막의 특성은 달라질 수 있다.Hard coating required for each area of the cutting tool, for example, the cutting edge where constant impact is applied, and the rake face or flank face where friction with chips occurs continuously. The characteristics may vary.
하기 특허문헌에는 인선을 중심으로 인선 중심으로부터 500㎛ 이내의 플랭크면에서 원자 기준 Si의 함량을 FSi, 인선 중심으로부터 500㎛ 이내의 레이크면에서 원자 기준 Si의 함량을 RSi라 할때, 0.5<FSi/(FSi+RSi)≤0.6 가 되도록 인선을 경계로 하여 경사면과 여유면의 Si 함량을 다르게 조절함으로써 절삭공구의 내마모성을 향상시키면서 내치핑성을 향상시킨 기술이 개시되어 있다.In the following patent document, when the atomic-based Si content on the flank surface within 500㎛ from the cutting edge center is F Si , and the atomic-based Si content on the rake surface within 500㎛ from the cutting edge center is R Si , 0.5 A technology has been disclosed that improves the wear resistance of a cutting tool and improves the chipping resistance by differently adjusting the Si content of the rake surface and the relief surface with the cutting edge as the boundary so that < FSi / ( FSi + R Si ) ≤ 0.6.
본 발명의 과제는 내치핑성을 일정 이상 수준으로 유지하면서, 내마모성이 향상된 절삭공구용 경질피막을 제공하는 것이다.The object of the present invention is to provide a hard coating for cutting tools with improved wear resistance while maintaining chipping resistance at a certain level or higher.
본 발명은, 경질모재와, 상기 경질모재 상에 형성된 경질피막을 포함하는 절삭공구로, 상기 경질피막은 Ti(1-x)SixN(x는 원자비)로 이루어진 제 1 피막을 포함하고, 상기 절삭공구의 여유면과 경사면이 만나는 지점을 인선부 R이라고 하고, 인선부 R에서 상기 경사면과 여유면 방향으로 50㎛ 범위 이내에 있어서 상기 제 1 피막의 Si 원자비를 Rx라 할 때, 0<Rx≤0.10을 만족하고, 상기 여유면의 중앙 지점을 C라고 하고, C의 주변 50㎛ 이내의 상기 제 1 피막의 Si 원자비를 Cx라 할 때, 0.15≤Cx≤0.30을 만족하는, 절삭공구를 제공한다.The present invention is a cutting tool comprising a hard base material and a hard film formed on the hard base material, wherein the hard film includes a first film made of Ti (1-x) Si x N (x is the atomic ratio), , the point where the relief surface and the rake surface of the cutting tool meet is called the cutting edge R, and the Si atomic ratio of the first film within a range of 50㎛ from the cutting tool R in the direction of the rake surface and the relief surface is called R x , When 0 < R We provide cutting tools that satisfy your needs.
또한, 상기 제 1 피막에 있어서, Rx/Cx<0.67을 만족할 수 있다.Additionally, in the first coating, R x /C x <0.67 can be satisfied.
또한, 상기 제 1 피막의 두께는 0.1 ~ 3㎛이고, 상기 제 1 피막의 경도는 40GPa 이상일 수 있다.Additionally, the thickness of the first film may be 0.1 to 3㎛, and the hardness of the first film may be 40 GPa or more.
또한, 상기 경질피막은 제 1 피막의 하부에 형성되는 제 2 피막을 더 포함하고, 상기 제 2 피막은 Al(1-a-b-c)TiaCrbMecN (Me는 B, Si, Zr, V, Mn, Nb, Mo, Ta, W 중에서 선택된 1종이며, 0≤a≤0.8, 0≤b≤0.5, 0≤c≤0.15, 0<a+b, a+b+c<1, a,b,c는 원자비)으로 이루어질 수 있다.In addition, the hard film further includes a second film formed on the lower part of the first film, and the second film is Al (1-abc) Ti a Cr b Me c N (Me is B, Si, Zr, V , Mn, Nb, Mo, Ta, W, 0≤a≤0.8, 0≤b≤0.5, 0≤c≤0.15, 0<a+b, a+b+c<1, a, b, c can be made up of atomic ratio).
또한, 상기 제 2 피막의 두께는 0.1 ~ 10㎛일 수 있다.Additionally, the thickness of the second film may be 0.1 to 10 μm.
본 발명에 따른 절삭공구는 지속적인 충격이 가해지는 인선부의 내치핑성을 유지하면서, 칩과 마찰이 지속적으로 일어나는 여유면의 내마모성을 향상시킴으로써, 경질피막의 위치 영역에 맞추어 국소적으로 최적의 절삭성능을 발휘하도록 함으로써, 고경도 강과 같이 경도가 높은 피삭재의 가공 시, 절삭공구의 수명을 연장할 수 있다.The cutting tool according to the present invention maintains the chipping resistance of the cutting edge where continuous impact is applied, while improving the wear resistance of the flank surface where chips and friction continuously occur, thereby providing locally optimal cutting performance tailored to the location area of the hard film. By exerting this, the lifespan of the cutting tool can be extended when machining workpieces with high hardness such as high-hardness steel.
도 1은 절삭공구의 인선부, 경사면, 여유면 및 여유면의 중심을 나타낸 도면이다.
도 2는 드릴 및 엔드밀 형상의 절삭공구의 인선부 및 중심을 나타낸 도면이다.
도 3은 절삭공구의 인선부의 중심에서 50㎛ 이내의 영역을 나타낸 도면이다.
도 4는 본 발명의 실시예에 따른 절삭공구의 단면 구조를 개략적으로 나타낸 도면이다.Figure 1 is a view showing the center of the cutting edge, rake surface, relief surface, and relief surface of a cutting tool.
Figure 2 is a diagram showing the cutting edge and center of a cutting tool in the shape of a drill or end mill.
Figure 3 is a diagram showing the area within 50㎛ from the center of the cutting tool edge.
Figure 4 is a diagram schematically showing the cross-sectional structure of a cutting tool according to an embodiment of the present invention.
이하 본 발명을 설명함에 있어, 관련된 공지 기능 또는 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요 하게 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명을 생략할 것이다. 또한, 어떤 부분이 어떤 구성요소를 '포함'한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 포함할 수 있는 것을 의미한다.Hereinafter, in describing the present invention, if a detailed description of a related known function or configuration is judged to unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, when a part is said to 'include' a certain component, this does not mean that other components are excluded, but that it can further include other components, unless specifically stated to the contrary.
본 발명은, 경질모재와, 상기 경질모재 상에 형성된 경질피막을 포함하는 절삭공구이다.The present invention is a cutting tool comprising a hard base material and a hard film formed on the hard base material.
[경질모재][Hard base material]
상기 경질모재는 절삭공구에 요구되는 형상에 맞추어 성형될 수 있으며, 예를 들면, 인써트(insert) 형상, 드릴(drill) 및 엔드밀(Endmill) 형상으로 성형된 것일 수 있다.The hard base material may be molded to the shape required for the cutting tool, for example, it may be molded into an insert shape, drill, or endmill shape.
인써트(insert) 형상으로 성형된 절삭공구는, 도 1에 도시된 바와 같이, 대략 직육면체 형상으로 형성되고 중심부에 체결공이 형성되어 있다. 도면에서 상면은 경사면(rake face)을 형성하고 도면에서 측면은 여유면(flank face)을 형성하며, 경사면과 여유면의 경계부가 인선(cutting edge)부를 형성하며, 4개의 모서리부분이 노즈부를 형성한다.As shown in FIG. 1, the cutting tool formed into an insert shape is formed in a substantially rectangular parallelepiped shape and has a fastening hole formed in the center. In the drawing, the upper surface forms a rake face, the side surface in the drawing forms a flank face, the boundary between the rake face and the flank face forms a cutting edge, and the four corners form a nose part. do.
인써트(insert) 형상의 절삭공구의 경우, 여유면의 "중앙부"는, 도 1에 도시된 바와 같이, 여유면을 구성하는 4개의 모서리의 대각선이 교차하는 지점을 의미한다.In the case of an insert-shaped cutting tool, the "center part" of the relief surface refers to the point where the diagonals of the four corners constituting the relief surface intersect, as shown in FIG. 1.
드릴(drill) 및 엔드밀(Endmill) 형상으로 성형된 절삭공구의 '중앙부'는, 도 2에 도시된 바와 같이, 밑날로부터 2mm 이상 떨어진 날장의 인선부와 수직방향으로 도식할 경우 만나는 다음 절삭날간 거리의 중앙 부분을 의미한다.As shown in Figure 2, the 'central part' of a cutting tool formed in the shape of a drill and an endmill is the cutting edge of the blade that is 2 mm or more away from the base edge and the next cutting edge that meets when drawn in the perpendicular direction. It refers to the central part of the street.
[경질피막][Hard membrane]
경질피막은 상기 경질모재 상에 형성되는 피막이다.A hard film is a film formed on the hard base material.
본 발명의 일 실시형태에 있어서, 상기 경질피막은 Ti(1-x)SixN (x는 원자비)로 이루어진 제 1 피막을 포함하고, 상기 절삭공구의 여유면과 경사면이 만나는 지점을 인선부 R이라고 하고, 인선부 R에서 상기 경사면과 여유면 방향으로 50㎛ 범위 이내에 있어서 상기 제 1 피막의 Si 원자비를 Rx라 할 때, 0<Rx≤0.10을 만족하고, 상기 여유면의 중앙 지점을 C라고 하고, C의 주변 50㎛ 이내의 상기 제 1 피막의 Si 원자비를 Cx라 할 때, 0.15≤Cx≤0.30을 만족하는 것을 특징으로 한다.In one embodiment of the present invention, the hard film includes a first film made of Ti (1-x) Si Let's call it part R, and if the Si atomic ratio of the first film is R When the central point is C and the Si atomic ratio of the first film within 50㎛ around C is C x , it is characterized by satisfying 0.15≤C x≤0.30 .
상기 제 1 피막은 바람직하게 상기 경질피막의 상면(최표면)에 위치하는 것일 수 있다. 또한, 상기 제 1 피막은 1개의 층으로 이루어지거나, 2 이상의 층이 적층된 다층구조로 이루어질 수 있다.The first coating may preferably be located on the upper surface (outermost surface) of the hard coating. Additionally, the first coating may be composed of one layer or may be composed of a multi-layer structure in which two or more layers are stacked.
본 발명은, 제 1 피막을 구성하는 Ti(1-x)SixN 피막에 있어서, 도 3에 도시된 바와 같이, 인선부 R 및 인선부 R에 인접한 50㎛ 이내의 영역에 형성되는 피막에 포함되는 Si의 원자비는 0<Rx≤0.10 로 상대적으로 낮게 함으로써 인선부에 지속적으로 가해지는 충격에 대응할 수 있는 인성을 부여하여 인선부의 내치핑성을 향상시킨다. The present invention relates to the Ti (1-x) Si The atomic ratio of Si included is relatively low at 0<R
또한, 제 1 피막을 구성하는 Ti(1-x)SixN 피막에 있어서, 여유면의 중앙 지점 C과 이의 주변 50㎛ 이내의 영역의 경우 Si의 원자비를 0.15≤Cx≤0.30로 상대적으로 높게 함으로써 내마모성을 향상시킴으로써, 칩과 마찰이 지속적으로 일어나는 여유면의 내마모성을 향상시킨다. In addition, in the Ti (1-x ) Si By increasing the wear resistance, it improves the wear resistance of the flank surface where chips and friction continuously occur.
즉, 제 1 피막을 구성하는 Si의 원자비를 인선부와 여유면을 다르게 함으로써, 특히 HRC 50 이상의 고경도 강(steel)과 같이 경도가 높은 피삭재의 가공 시에 절삭공구의 수명을 보다 더 연장할 수 있는 효과를 얻을 수 있다.In other words, by varying the atomic ratio of Si, which constitutes the first film, between the cutting edge and the relief surface, the life of the cutting tool is further extended, especially when machining workpieces with high hardness such as high hardness steel of HRC 50 or higher. You can achieve the desired effect.
또한, 상기 제 1 피막에 있어서, Rx/Cx<0.67을 만족하는 것이 바람직하다. 인선부 R의 Si 원자비와 여유면 중앙 지점 C의 Si 원자비의 차이가 적어도 상기 수치 범위 이상으로 차이가 나는 것이 인선부의 내치핑성 향상 효과와 여유면의 내마모성 향상를 통한 전체적인 절삭공구 수명 연장에 더 바람직하기 때문이다.Additionally, in the first coating, it is desirable to satisfy R x /C x <0.67. The difference between the Si atomic ratio of the cutting edge R and the Si atomic ratio of the flank center point C is at least greater than the above value range, which has the effect of improving the chipping resistance of the cutting edge and extending the overall cutting tool life by improving the wear resistance of the flanking surface. Because it is more desirable.
또한, 상기 제 1 피막의 0.1 ~ 3㎛ 인 것이 바람직한데, 이는 제 1 피막의 두께가 0.1㎛ 미만일 경우 제 1 피막이 갖는 내마모성을 충분히 구현할 수 없고, 3㎛ 초과일 경우, 내부응력이 커져 내치핑성이 오히려 저하할 수 있기 때문이다. 상기 제 1 피막의 보다 바람직한 두께는 0.2 ~ 1.5㎛이다.In addition, it is preferable that the thickness of the first coating is 0.1 to 3㎛. This means that if the thickness of the first coating is less than 0.1㎛, the wear resistance of the first coating cannot be sufficiently realized, and if the thickness is more than 3㎛, the internal stress increases, leading to chipping resistance. This is because performance can actually deteriorate. A more preferable thickness of the first coating is 0.2 to 1.5 μm.
또한, 상기 제 1 피막의 경도는 바람직하게 40GPa 이상일 수 있다.Additionally, the hardness of the first film may preferably be 40 GPa or more.
또한, 상기 경질피막은, 도 4에 도시된 바와 같이, 제 1 피막의 하부에 형성되며, 1개의 층 또는 2 이상의 층으로 이루어진 다층 구조로 이루어지는 제 2 피막을 더 포함할 수 있다.In addition, as shown in FIG. 4, the hard film may further include a second film formed below the first film and having a multi-layer structure consisting of one layer or two or more layers.
상기 제 2 피막은 Al(1-a-b-c)TiaCrbMecN(Me는 B, Si, Zr, V, Mn, Nb, Mo, Ta, W 중에서 선택된 1종이며, 0≤a≤0.8, 0≤b≤0.5, 0≤c≤0.15, 0<a+b, a+b+c<1, a,b,c는 원자비)으로 이루어질 수 있다.The second film is Al (1-abc) Ti a Cr b Me c N (Me is a type selected from B, Si, Zr, V, Mn, Nb, Mo, Ta, W, 0≤a≤0.8, 0≤b≤0.5, 0≤c≤0.15, 0<a+b, a+b+c<1, a,b,c are atomic ratios).
Al과 Ti 또는 Cr을 포함하는 질화물 박막인 제 2 피막은 내마모성이 우수할 뿐만 아니라 내열성과 내치핑성이 우수한 피막으로 알려져 있다. 이러한 조성의 제 2 피막을 내마모성이 우수한 제 1 피막의 아래와 경질모재의 사이에 배치함으로써 내마모성이 우수하지만 내치핑성 등이 상대적으로 떨어지는 제 1 피막의 내치핑성을 보완할 수 있게 된다.The second film, which is a nitride thin film containing Al and Ti or Cr, is known to have excellent wear resistance as well as heat resistance and chipping resistance. By arranging the second film of this composition between the hard base material and the bottom of the first film, which has excellent wear resistance, it is possible to supplement the chipping resistance of the first film, which has excellent wear resistance but is relatively poor in chipping resistance.
제 2 피막은 Al, Ti 및 Cr 외에도 B, Si, Zr, V, Mn, Nb, Mo, Ta, W 중 어느 하나의 금속 원소를 가질 수 있다. 이들 금속 원소의 조절을 통해 제 2 피막의 내마모성, 내치핑성, 내열성 등이 크게 향상될 수 있다.The second film may have any one of the metal elements B, Si, Zr, V, Mn, Nb, Mo, Ta, and W in addition to Al, Ti, and Cr. By controlling these metal elements, the wear resistance, chipping resistance, heat resistance, etc. of the second film can be greatly improved.
제 2 피막에서 a, b, c는 금속 원소인 Al, Ti, Cr, Me의 조성비를 결정하게 되는데, Al의 조성이 큰 경우 내마모성, 내산화성 및 윤활성이 더 우수하나 Al 함량이 너무 높아질 경우 치핑성이 증가하는 문제가 있어, Ti와 Cr의 함량은 0≤a≤0.8, 0≤b≤0.5인 것이 바람직하다.In the second film, a, b, and c determine the composition ratio of the metal elements Al, Ti, Cr, and Me. If the Al composition is large, wear resistance, oxidation resistance, and lubricity are superior, but if the Al content is too high, chipping occurs. Since there is a problem of increased resistance, it is preferable that the contents of Ti and Cr are 0≤a≤0.8 and 0≤b≤0.5.
기타원소는 Zr, B 등 첨가를 통해 제 2 피막의 내치핑성, 내열성, 내마모성 등을 향상시킬 수 있으나, 함량이 높을 경우 비정질상의 증가로 잔류응력 증가의 원인으로 작용할 수 있기 때문에 기타원소인 Me의 함량은 0≤c≤0.15인 것이 바람직하다.Other elements can improve the chipping resistance, heat resistance, and wear resistance of the second film by adding Zr, B, etc., but if the content is high, it can act as a cause of increased residual stress due to an increase in the amorphous phase, so the other elements, Me, are added. The content is preferably 0≤c≤0.15.
상기 제 2 피막의 두께는, 1㎛ 미만에서는 충분히 내마모성을 보완하기 어렵고 10㎛을 초과하면 내부응력이 커져 오히려 치핑성이 높아질 수 있기 때문에, 0.1 ~ 10㎛인 것이 바람직하고, 보다 바람직한 두께는 1 ~ 8㎛ 이다.The thickness of the second film is preferably 0.1 to 10 ㎛, because if it is less than 1 ㎛, it is difficult to sufficiently compensate for wear resistance, and if it exceeds 10 ㎛, internal stress increases and chipping resistance may increase. A more preferable thickness is 1 ㎛. It is ~8㎛.
또한, 상기 인선부에서 인선부에 수직한 방향으로 200㎛ 이상 떨어진 경사면 영역에 있어서, 제 1 피막을 구성하는 Ti(1-x)SixN 피막의 Si의 원자비도 0.10 ~ 0.30 이 되도록 형성할 수 있다.In addition, in the inclined surface area 200㎛ or more away from the cutting edge in the direction perpendicular to the cutting edge, the Si atomic ratio of the Ti (1-x) Si You can.
<실시예><Example>
본 발명의 실시예에서는 초경합금으로 이루어진 모재 표면에 2가지의 표면처리(이온 봄바드먼트(Ion Bombardment))와 물리적 기상 증착법(physical vapor deposition, PVD)인 아크 이온 플레이팅 법을 이용하여, 도 4에 도시된 것과 같이 제 2 피막과 제 1 피막으로 구성된 경질피막을 형성하였다.In an embodiment of the present invention, two types of surface treatments (ion bombardment) and an arc ion plating method (physical vapor deposition (PVD)) are used on the surface of the base material made of cemented carbide, Figure 4 As shown in , a hard film composed of the second film and the first film was formed.
구체적으로, 코팅에 사용한 타겟으로는 TiAl, AlCr, TiSi의 아크 타겟을 사용하였으며, 상기 모재를 습식 마이크로 블라스팅 및 초순수로 세척한 뒤 건조한 상태에서 코팅로 내 회전 테이블 상의 중심축에서 반경 방향으로 소정 거리 떨어진 위치에 원주를 따라 장착하고 코팅로 내 초기 진공압력을 8.5×10-5 Torr 이하로 감압하였다.Specifically, arc targets of TiAl, AlCr, and TiSi were used as targets for coating. After wet microblasting and washing with ultrapure water, the base material was dried and placed at a predetermined distance in the radial direction from the central axis on the rotary table in the coating furnace. It was installed along the circumference at a remote location, and the initial vacuum pressure in the coating furnace was reduced to below 8.5×10 -5 Torr.
온도를 400 ~ 600℃로 가열한 후 Ar 가스 분위기 하에서 상기 회전 테이블 상에서 자전하면서 회전하는 모재에 Ar 가스 분위기 하에서 바이어스(bias) 전압을 -400 ~ -200V을 인가하여 30 ~ 90분간 Ar 이온 봄바드먼트(Ion Bombardment)를 수행하였다. 코팅을 위한 가스압력은 50mTorr 이하 바람직하게는 40mTorr 이하로 유지하여 하부층인 제 2 피막 및 상부층인 제 1 피막을 성막하였다.After heating to a temperature of 400 to 600°C, a bias voltage of -400 to -200 V is applied to the rotating base material on the rotary table under an Ar gas atmosphere, and an Ar ion bombard is applied for 30 to 90 minutes. Ion bombardment was performed. The gas pressure for coating was maintained at 50 mTorr or less, preferably 40 mTorr or less, to form the second film as the lower layer and the first film as the upper layer.
제 2 피막은 TiAl, AlCr 및 TiSi 타겟을 사용하여 바이어스 전압 -100 ~ -30V, 아크 전류 100 ~ 150A, 반응가스로 N2를 주입하여 압력 20 ~ 40mtorr 조건으로 성막하였다.The second film was formed using TiAl, AlCr, and TiSi targets at a bias voltage of -100 to -30V, an arc current of 100 to 150A, and N 2 as a reaction gas injected at a pressure of 20 to 40 mtorr.
상기 제 1피막은 TiSi 타겟을 사용하여 -400 ~ -200V 바이어스 전압을 인가하고 아크 전류 100 ~ 150A, 반응가스로 N2를 주입하여 압력 20 ~ 40mtorr 조건으로 성막하였다.The first film was formed using a TiSi target by applying a bias voltage of -400 to -200V, using an arc current of 100 to 150A, and injecting N 2 as a reaction gas at a pressure of 20 to 40 mtorr.
상기한 조건으로 본 발명의 실시예와 비교예를 제조하였으며, 이에 해당되는 경질 피막의 조건, 두께에 대한 기본 정보를 아래 표 1에 나타내었다. 코팅조건은 장비특성 및 조건에 따라 달라질 수 있다.The examples and comparative examples of the present invention were manufactured under the above-described conditions, and basic information on the conditions and thickness of the corresponding hard film is shown in Table 1 below. Coating conditions may vary depending on equipment characteristics and conditions.
(조성비)target 1
(Composition fee)
(조성비)target 2
(Composition fee)
(㎛)thickness
(㎛)
(조성비)target
(Composition fee)
(V)bias voltage
(V)
(㎛)thickness
(㎛)
표 1의 조건에 따라 만들어진 샘플에 대해서 부위별 Si함량을 측정하였다. 표 1에 따른 실시예와 비교예의 경질 피막의 단면을 SEM(Scanning Electron Microscope) 15,000배율로 분석하고 EDS(Energy Dispersive Spectrometer)로 조성을 분석하여, 도 1과 같이 절삭공구의 여유면과 경사면이 만나는 지점을 인선부 R이라고 하고, 인선부 R에서 상기 경사면과 여유면 방향으로 50㎛ 범위 이내에 있어서 상기 제 1 피막의 Si 원자비를 Rx, 상기 여유면의 중앙 지점을 C라고 하고, C의 주변 50㎛ 이내의 상기 제 1 피막의 Si 원자비를 Cx, 인선부 R에서 여유면 방향으로 C 방향으로 500㎛ 떨어진 제 1피막의 Si 원자비를 Wx라고 했을 때의 결과를 하기 표 2에 나타내었다(이때의 Si 함량은 비금속을 제외한 함량이다).The Si content of each part was measured for samples made according to the conditions in Table 1. The cross sections of the hard films of the examples and comparative examples according to Table 1 were analyzed at a magnification of 15,000 with a SEM (Scanning Electron Microscope) and the composition was analyzed with an EDS (Energy Dispersive Spectrometer), and the point where the relief surface of the cutting tool and the inclined surface meet as shown in Figure 1. is called the cutting edge R, and within a range of 50 ㎛ from the cutting edge R in the direction of the inclined surface and the relief surface, the Si atomic ratio of the first film is R Table 2 shows the results when the Si atomic ratio of the first film within ㎛ is C (Si content at this time excludes non-metals).
실시예의 경우 EDS로 분석 결과 제 1 피막의 Si 함량이 0<Rx≤0.10을 만족하고, Wx에서 Cx로 인선부에서 거리가 멀어짐에 따라 점차적으로 제 1피막의 Si 함량이 감소하며 0.15≤Cx≤0.30의 범위를 만족하는 것을 확인할 수 있다. 또한 Rx/Cx<0.67를 만족하는 것을 확인할 수 있으며, 이와 같이 형성된 경질 피막의 내마모성과 내치핑성을 다음과 같은 조건으로 평가하였다.In the case of the example, as a result of EDS analysis, the Si content of the first film satisfies 0<R x ≤0.10, and as the distance from the cutting edge increases from W x to C x , the Si content of the first film gradually decreases to 0.15. It can be confirmed that the range of ≤C x ≤0.30 is satisfied. In addition, it can be confirmed that R x /C x <0.67 is satisfied, and the wear resistance and chipping resistance of the hard film formed in this way were evaluated under the following conditions.
(1) 내마모성 평가(1) Wear resistance evaluation
피삭재: 열처리 SKD61 (지름: 100mm)Work material: heat treated SKD61 (diameter: 100mm)
샘플형번: CNNMG120408-VP3Sample model number: CNNMG120408-VP3
절삭속도: 80 m/minCutting speed: 80 m/min
절삭이송: 0.15 mm/revCutting feed: 0.15 mm/rev
절삭깊이: 1.5mmCutting depth: 1.5mm
절삭유: 사용Coolant: Used
(2) 내치핑성 평가(2) Chipping resistance evaluation
피삭재: 금형강 NAK80 (300mm×200mm×100mm)Work material: Mold steel NAK80 (300mm×200mm×100mm)
샘플형번: ADKT170608PESR-MMSample model number: ADKT170608PESR-MM
절삭속도: 100 m/minCutting speed: 100 m/min
절삭이송: 0.15 mm/toothCutting feed: 0.15 mm/tooth
절삭깊이: 5mmCutting depth: 5mm
절삭유: 미사용Coolant: Not used
상기와 같이 2가지의 조건으로 평가한 가공 결과를 하기 표 3에 나타내었다.The processing results evaluated under the two conditions as described above are shown in Table 3 below.
(cm3)Chip removal amount
(cm3)
(mm)Processing length
(mm)
상기 절삭 성능 평가 결과와 같이 실시예 1 ~ 7은, 비교예 1 ~ 7 보다 우수한 공구 수명을 나타내었다. 특히, 열처리 SKD61 피삭재 가공의 칩제거량이 현저히 증가하면서 NAK80 피삭재 가공길이도 향상된 결과를 보여주었다. 이를 통해 인선부와 여유면의 Si 함량 차이를 통해 내마모와 내치핑성을 보완하여 공구의 수명이 향상됨을 확인할 수 있었다.As shown in the cutting performance evaluation results, Examples 1 to 7 showed superior tool life than Comparative Examples 1 to 7. In particular, as the chip removal amount of heat-treated SKD61 workpiece machining increased significantly, the machining length of NAK80 workpiece also showed improved results. Through this, it was confirmed that the lifespan of the tool was improved by supplementing wear resistance and chipping resistance through the difference in Si content between the cutting edge and the relief surface.
Claims (5)
상기 경질모재 상에 형성된 경질피막을 포함하는 절삭공구로,
상기 경질피막은 Ti(1-x)SixN(x는 원자비)로 이루어진 제 1 피막을 포함하고,
상기 절삭공구의 여유면과 경사면이 만나는 지점을 인선부 R이라고 하고, 인선부 R에서 상기 경사면과 여유면 방향으로 50㎛ 범위 이내에 있어서 상기 제 1 피막의 Si 원자비를 Rx라 할 때, 0<Rx≤0.10을 만족하고,
상기 여유면의 중앙 지점을 C라고 하고, C의 주변 50㎛ 이내의 상기 제 1 피막의 Si 원자비를 Cx라 할 때, 0.15≤Cx≤0.30을 만족하며,
Rx/Cx≤0.5을 만족하는, 절삭공구.
Hard base material,
A cutting tool comprising a hard film formed on the hard base material,
The hard film includes a first film made of Ti (1-x) Si x N (x is the atomic ratio),
The point where the relief surface and the rake surface of the cutting tool meet is called the cutting edge R, and when the Si atomic ratio of the first film is R Satisfies <R x ≤0.10,
When the central point of the relief surface is C, and the Si atomic ratio of the first film within 50㎛ around C is C x , 0.15≤C x ≤0.30 is satisfied,
A cutting tool that satisfies R x /C x ≤0.5.
상기 제 1 피막의 두께는 0.1 ~ 3㎛이고,
상기 제 1 피막의 경도는 40GPa 이상인, 절삭공구.
According to claim 1,
The thickness of the first film is 0.1 to 3㎛,
A cutting tool wherein the first film has a hardness of 40 GPa or more.
상기 경질피막은 제 1 피막의 하부에 형성되는 제 2 피막을 더 포함하고,
상기 제 2 피막은 Al(1-a-b-c)TiaCrbMecN (Me는 B, Si, Zr, V, Mn, Nb, Mo, Ta, W 중에서 선택된 1종이며, 0≤a≤0.8, 0≤b≤0.5, 0≤c≤0.15, 0<a+b, a+b+c<1, a,b,c는 원자비)으로 이루어지는, 절삭공구.
According to claim 1,
The hard film further includes a second film formed below the first film,
The second coating is Al (1-abc) Ti a Cr b Me c N (Me is a type selected from B, Si, Zr, V, Mn, Nb, Mo, Ta, W, 0≤a≤0.8, A cutting tool consisting of 0≤b≤0.5, 0≤c≤0.15, 0<a+b, a+b+c<1, and a, b, and c are atomic ratios).
상기 제 2 피막의 두께는 0.1 ~ 10㎛인, 절삭공구.
According to claim 4,
A cutting tool wherein the second film has a thickness of 0.1 to 10 μm.
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KR20180127353A (en) * | 2016-03-30 | 2018-11-28 | 미츠비시 히타치 쓰루 가부시키가이샤 | Cloth cutting tool |
KR20220066455A (en) * | 2020-11-16 | 2022-05-24 | 한국야금 주식회사 | Hard film for cutting tools |
KR20220124167A (en) * | 2020-01-08 | 2022-09-13 | 스미또모 덴꼬오 하드메탈 가부시끼가이샤 | cutting tool |
KR20230102643A (en) | 2021-12-30 | 2023-07-07 | 한국야금 주식회사 | Cutting tools with hard coating |
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KR20180127353A (en) * | 2016-03-30 | 2018-11-28 | 미츠비시 히타치 쓰루 가부시키가이샤 | Cloth cutting tool |
KR20220124167A (en) * | 2020-01-08 | 2022-09-13 | 스미또모 덴꼬오 하드메탈 가부시끼가이샤 | cutting tool |
KR20220066455A (en) * | 2020-11-16 | 2022-05-24 | 한국야금 주식회사 | Hard film for cutting tools |
KR20230102643A (en) | 2021-12-30 | 2023-07-07 | 한국야금 주식회사 | Cutting tools with hard coating |
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