KR102650086B1 - Battery pack substrate and Battery pack substrate accessing system - Google Patents

Abstract

The present invention relates to a battery pack substrate with enhanced security in the process of connecting to a battery pack substrate and a battery pack substrate connection system that can effectively connect to the battery pack substrate. A battery pack substrate according to an embodiment of the present invention includes a microcontroller; A board composed of a plate shape, the microcontroller mounted on at least one side, and a plurality of grooves formed on at least one side; a plurality of terminals made of a conductive material and configured to fill each of the plurality of grooves; and a signal path mounted on the board and configured to electrically connect the plurality of terminals and the microcontroller.

Description

Battery pack substrate and battery pack substrate accessing system {Battery pack substrate and Battery pack substrate accessing system}

The present invention relates to a battery pack substrate and a battery pack substrate connection system, and more specifically, to a battery pack substrate with enhanced security in the process of connecting to the battery pack substrate and a battery pack substrate connection system that can effectively connect to the battery pack substrate. It's about.

In recent years, as the demand for portable electronic products such as laptops, video cameras, and portable phones has rapidly increased, and as the development of energy storage batteries, robots, and satellites has begun in earnest, high-performance secondary batteries capable of repeated charging and discharging have been developed. Research is actively underway.

Currently commercialized secondary batteries include nickel cadmium batteries, nickel hydrogen batteries, nickel zinc batteries, and lithium secondary batteries. Among these, lithium secondary batteries have little memory effect compared to nickel-based secondary batteries, so they can be freely charged and discharged. It is receiving a lot of attention due to its advantages such as very low self-discharge rate and high energy density.

Batteries are used in a variety of fields, and fields where batteries have been widely used recently, such as electric vehicles or smart grid systems, often require large capacities. In order to increase the capacity of the battery pack, there may be a way to increase the capacity of the secondary battery, that is, the battery cell itself, but in this case, the effect of increasing capacity is not significant, there are physical limitations to expanding the size of the secondary battery, and management is inconvenient. has Therefore, battery packs in which multiple battery modules are connected in series and parallel are generally widely used.

Such a battery pack is equipped with a battery pack board equipped with a plurality of chips and an electric circuit configured to measure the voltage, current, and temperature of the battery and control charging and discharging of the battery. For example, the battery pack substrate may be equipped with chips such as microcontrollers and memory devices.

The microcontroller provided on the battery pack board needs to be connected to the microcontroller to upload or download software provided on the microcontroller or to debug the microcontroller.

However, the connector for connecting a microcontroller provided on a conventional battery pack board has the disadvantage of poor security because it can be accessed by hackers who are not permitted to access the microcontroller other than developers.

The present invention was created under the background of the above prior art, and relates to a battery pack substrate with enhanced security in the process of connecting to the battery pack substrate and an improved battery pack substrate connection system that can effectively connect to the battery pack substrate.

Other objects and advantages of the present invention can be understood from the following description and will be more clearly understood by practicing the present invention. In addition, it will be readily apparent that the objects and advantages of the present invention can be realized by means and combinations thereof indicated in the claims.

A battery pack substrate according to an embodiment of the present invention for achieving the above object includes a microcontroller; A board composed of a plate shape, the microcontroller mounted on at least one side, and a plurality of grooves formed on at least one side; a plurality of terminals made of a conductive material and configured to fill each of the plurality of grooves; and a signal path mounted on the board and configured to electrically connect the plurality of terminals and the microcontroller.

In addition, the plurality of terminals include a first terminal and a second terminal, the first terminal is configured to be electrically connected to a connection pin of the microcontroller, and the second terminal is electrically connected to the microcontroller. It can be configured not to connect.

In addition, the plurality of grooves include a first groove in which the first terminal is filled and a second groove in which the second terminal is filled, and the first groove and the second groove are each provided in a plurality, In the plurality of grooves, at least one second groove may be disposed between at least two first grooves.

Additionally, the plurality of grooves may be arranged so that at least one second groove is included within a polygon formed by connecting three or more first grooves.

Additionally, the plurality of grooves may be formed on both sides of the board, respectively.

Additionally, the plurality of terminals may each be filled to a height lower than the depth of the plurality of grooves in the depth direction of the plurality of grooves.

In addition, a battery pack board connection system according to an embodiment of the present invention for achieving the above object is composed of a microcontroller and a plate shape, the microcontroller is mounted on at least one surface, and a plurality of grooves are formed on at least one surface. It includes a formed board, a plurality of terminals made of a conductive material and configured to fill each of the plurality of grooves, and a signal path mounted on the board and configured to electrically connect the plurality of terminals and the microcontroller. a battery pack substrate; a mounting unit configured to allow the board to be mounted on an upper portion; a terminal contact unit configured to electrically contact the plurality of terminals by having a plurality of pins having portions extending vertically; and a connection unit electrically connected to the terminal contact unit and configured to be connected to an external device.

In addition, the battery pack board connection system according to an embodiment of the present invention is configured to be spaced a predetermined distance from the mounting unit so that the board can be interposed in the space, and can be moved in both directions in the direction of the mounting unit and in the opposite direction. It may further include a fixed unit.

In addition, the terminal contact unit is provided in each of the fixing unit and the mounting unit and is configured to protrude and extend in a direction toward each other, and is mounted at a position corresponding to the plurality of terminals to electrically connect to the plurality of terminals. It may include a plurality of pins configured to make contact.

In addition, the plurality of terminals include a first terminal and a second terminal, the first terminal is configured to be electrically connected to a connection pin of the microcontroller, and the second terminal is electrically connected to the microcontroller. It can be configured not to connect.

In addition, the plurality of grooves include a first groove in which the first terminal is filled and a second groove in which the second terminal is filled, and the first groove and the second groove are each provided in a plurality, In the plurality of grooves, at least one second groove may be disposed between at least two first grooves.

Additionally, the plurality of grooves may be arranged so that at least one second groove is included within a polygon formed by connecting three or more first grooves.

According to one aspect of the present invention, there is an advantage in enhancing security by making it difficult for hackers other than developers to access the microcontroller through an imaginary terminal among a plurality of terminals.

In addition, the present invention can have various other effects, and these other effects of the present invention can be understood through the following description and can be more clearly seen through examples of the present invention.

The following drawings attached to this specification illustrate preferred embodiments of the present invention, and serve to further understand the technical idea of the present invention together with the detailed description of the invention described later. Therefore, the present invention includes the matters described in such drawings. It should not be interpreted as limited to only .
1 is a perspective view schematically showing a partial configuration of a battery pack board connection system according to an embodiment of the present invention.
Figure 2 is a perspective view showing a battery pack substrate connection method according to a comparative example of the present invention.
Figure 3 is a perspective view schematically showing a partial configuration of a battery pack substrate according to an embodiment of the present invention.
Figure 4 is a plan view schematically showing a configuration in which a plurality of grooves are formed on a battery pack substrate according to an embodiment of the present invention.
Figure 5 is a cross-sectional view schematically showing a partial configuration of a battery pack substrate according to an embodiment of the present invention.
Figure 6 is a cross-sectional view schematically showing a partial configuration of a battery pack substrate according to another embodiment of the present invention.
Figure 7 is a front view schematically showing a partial configuration of a battery pack board connection system according to an embodiment of the present invention.
Figure 8 is a plan view schematically showing a partial configuration of a fixing unit according to an embodiment of the present invention.
Figure 9 is a front view schematically showing a configuration in which a battery pack substrate is mounted between a mounting unit and a fixing unit according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. Prior to this, the terms or words used in this specification and claims should not be construed as limited to their usual or dictionary meanings, and the inventor must appropriately use the concept of terms to explain his or her invention in the best way. It must be interpreted as meaning and concept consistent with the technical idea of the present invention based on the principle of definability.

Therefore, the embodiments described in this specification and the configurations shown in the drawings are only one of the most preferred embodiments of the present invention and do not entirely represent the technical idea of the present invention, so at the time of filing the present application, various options that can replace them are available. It should be understood that equivalents and variations may exist.

Additionally, when describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description will be omitted.

Throughout the specification, when a part is said to “include” a certain element, this means that it does not exclude other elements, but may further include other elements, unless specifically stated to the contrary.

Additionally, throughout the specification, when a part is said to be "connected" to another part, this refers not only to the case where it is "directly connected" but also to the case where it is "indirectly connected" with another element in between. Includes.

FIG. 1 is a perspective view schematically showing a partial configuration of a battery pack substrate connection system according to an embodiment of the present invention, and FIG. 3 is a perspective view schematically showing a partial configuration of a battery pack substrate according to an embodiment of the present invention. am.

1 and 3, the battery pack board connection system 1 according to an embodiment of the present invention includes a battery pack board, a mounting unit 100, a terminal contact unit 110, and a connection unit 200. Includes.

The battery pack board according to an embodiment of the present invention may include a microcontroller 10, a board 20, a plurality of terminals 23, and a signal path 25.

The microcontroller 10 may be a chip provided on a battery pack board and configured to control a battery management system (BMS). For example, the microcontroller 10 receives battery voltage, current, and temperature measurements and performs a battery balancing operation to equalize the charge of the battery based on the voltage, current, and temperature measurements. It can be done. For example, in order to perform the operations described above, the microcontroller 10 includes a processor known in the art, an application-specific integrated circuit (ASIC), a microcontroller unit (MCU), other chipsets, logic circuits, registers, It may be implemented in a form that selectively includes a communication modem and/or a data processing device.

Additionally, as shown in the configuration of FIG. 3, the microcontroller 10 may be mounted on the battery pack board. For example, the microcontroller 10 may be attached to the battery pack substrate. For example, the microcontroller 10 may be mounted on the battery pack board in a shouldered form.

The board 20 may be configured in a plate shape. Additionally, the board 20 may have the microcontroller 10 mounted on at least one side. For example, as shown in the configuration of FIG. 3, the board 20 may be formed in a plate shape and the microcontroller 10 may be mounted on one side.

Additionally, the board 20 may have a plurality of grooves 21 formed on at least one surface. For example, as shown in the configuration of FIG. 3, the board 20 may have a plurality of grooves 21 formed concavely toward the inside of the board 20 disposed on one surface.

Additionally, the board 20 refers to a board that is connected to at least one secondary battery provided in a battery pack and is equipped with at least one element that transfers information between the secondary battery and the BMS. For example, the battery pack substrate may be an Integrated Circuit Board (ICB) or a Printed Circuit Board (PCB) provided in the battery pack. Here, the ICB or PCB may refer to an integrated circuit board that is mounted on a sensing assembly provided in a battery pack and transmits information sensed from the electrode leads of the secondary battery to the BMS.

The plurality of terminals 23 may be made of a conductive material. For example, the plurality of terminals 23 may be made of an electrically conductive metal material. Additionally, the plurality of terminals 23 may be configured to fill the plurality of grooves 21, respectively. For example, as shown in the configuration of FIG. 3, the plurality of terminals 23 may be configured to be filled inside the plurality of grooves 21, respectively.

The signal path 25 may be mounted on the board 20. For example, as shown in the configuration of FIG. 3, the signal path 25 may be provided on the board 20. For example, signal path 25 may be printed on the surface of board 20. Additionally, the signal path 25 may be configured to be embedded within the board 20. However, the circuit printing form of the signal path 25 shown in FIG. 3 is an example, and the circuit of the signal path 25 may be printed in other forms.

Additionally, the signal path 25 may be configured to electrically connect the plurality of terminals 23 and the microcontroller 10. For example, as shown in the configuration of FIG. 3, the signal path 25 provides electrical connections between the plurality of terminals 23 and the connection pin 11 of the microcontroller 10 so that electrical signals can be exchanged. You can connect directly.

The mounting unit 100 may be configured so that the board 20 can be mounted on the top. For example, as shown in the configuration of FIG. 1, the mounting unit 100 may be configured in a plate shape and the board 20 may be mounted on one surface.

Preferably, the mounting unit 100 according to an embodiment of the present invention may further include a fastening part 130, as shown in the configuration of FIG. 1.

As shown in the configuration of FIG. 1, the fastening portion 130 may be provided on both sides of the mounting unit 100 in the longitudinal direction. In addition, the fastening part 130 is configured such that the separation distance between the two fastening parts 130 is the same as or similar to the length of the board 20 so that the board 20 can be fastened between the two fastening parts 130. can be placed.

The terminal contact unit 110 may include a plurality of pins 111 each having a portion extending vertically. For example, as shown in the configuration of FIG. 1, the terminal contact unit 110 may be provided with a plurality of pins 111 extending vertically on one surface.

Additionally, the terminal contact unit 110 may be configured to electrically contact the plurality of terminals 23 . For example, as shown in the configuration of FIGS. 1 and 3, the terminal contact unit 110 may be provided with a plurality of pins 111 at positions corresponding to the positions of the grooves 21 formed on the battery pack substrate. You can. Additionally, in the terminal contact unit 110, a plurality of pins 111 may each electrically contact a plurality of terminals 23.

Preferably, the battery pack board connection system 1 according to an embodiment of the present invention may further include a support 400, as shown in the configuration of FIG. 1. For example, the support 400 may be provided between the mounting unit 100 and the fixing unit 300. Additionally, the support 400 can move the fixing unit 300 in the direction of the mounting unit 100 and in a direction opposite to the mounting unit 100. For example, the support 400 may be provided with a motor to move the fixing unit 300.

The connection unit 200 may be electrically connected to the terminal contact unit 110. For example, as shown in the configuration of FIG. 1, the connection unit 200 may be electrically connected to a plurality of pins 111 provided in the terminal contact unit 110.

Additionally, the connection unit 200 may be configured to be connectable to an external device. For example, as shown in the configuration of FIG. 1, the connection unit 200 may be configured in a form to which a connector of an external device can be coupled. Additionally, the connection unit 200 can exchange electrical signals between the plurality of pins 111 and the external device when the connector of the external device is coupled to the connection unit 200.

Figure 2 is a perspective view showing a battery pack substrate connection method according to a comparative example of the present invention.

Referring to FIG. 2, the battery pack substrate according to the comparative example of the present invention may be provided with a connector 24.

The connector 24 may be mounted on a battery pack board. Additionally, the connector 24 may be directly electrically connected to the connection pin 11 of the microcontroller 10 through the signal path 25.

Additionally, the connector 24 may be configured to be capable of being coupled to the connector 31 of an external device, as shown in the configuration of FIG. 2 . Here, the connector 31 of the external device is connected to the external device through the connection line 30 to exchange electrical signals.

The battery pack board according to the comparative example of the present invention is connected to the microcontroller 10 by connecting the connector 31 of the external device to the connector 24 provided on the battery pack board. You can upgrade, program or debug software. However, in this case, an unauthorized outsider (e.g., a hacker) other than the developer of the microcontroller 10 can hack the microcontroller 10 through the connector 24, which is vulnerable to security. There is.

Figure 4 is a plan view schematically showing a configuration in which a plurality of grooves are formed on a battery pack substrate according to an embodiment of the present invention. In addition, FIG. 5 is a cross-sectional view schematically showing a partial configuration of a battery pack substrate according to an embodiment of the present invention, and FIG. 6 is a cross-sectional view schematically showing a partial configuration of a battery pack substrate according to another embodiment of the present invention. am.

First, referring to FIGS. 3 and 5, the battery pack substrate according to an embodiment of the present invention may be provided with a plurality of terminals.

Preferably, the plurality of terminals 23 may include a first terminal 23_a and a second terminal 23_b.

The first terminal 23_a may be configured to be electrically connected to the connection pin 11 of the microcontroller 10. For example, as shown in the configuration of FIG. 5, the first terminal 23_a may be made of an electrically conductive material. Additionally, the first terminal 23_a may be electrically connected to the signal path 25. Additionally, the first terminal 23_a may be electrically connected to the connection pin 11 of the microcontroller 10 through the signal path 25. For example, as shown in the configuration of FIG. 5, the signal path 25 may be configured to be embedded within the board 20.

The second terminal 23_b may be configured not to be electrically connected to the microcontroller 10. For example, as shown in the configuration of FIG. 5, the second terminal 23_b may be made of an electrically conductive material. Additionally, the second terminal 23_b may be configured not to be electrically connected to the signal path 25. In this case, the second terminal 23_b may be configured not to be electrically connected to the microcontroller 10.

Through this configuration, the battery pack board according to an embodiment of the present invention has a terminal that is electrically connected to the connection pin 11 of the actual microcontroller 10 when visually inspected from the outside of the battery pack board. It is structured so that it cannot be easily distinguished, which has the effect of improving security.

Referring to FIGS. 3 and 4 , the plurality of grooves 21 according to an embodiment of the present invention may include a first groove (21_a) and a second groove (21_b).

The first groove 21_a may be filled with the first terminal 23_a. Additionally, the second groove 21_b may be filled with the second terminal 23_b. For example, as shown in the configuration of FIGS. 3 and 4, a plurality of grooves 21 may be formed in region A of the battery pack substrate. Additionally, a first terminal 23_a made of an electrically conductive material may be filled inside the first groove 21_a. Additionally, a second terminal 23_b made of an electrically conductive material may be filled inside the second groove 21_b.

Additionally, the first groove 21_a and the second groove 21_b may each be provided in plural numbers. For example, as shown in the configuration of FIG. 4, a plurality of first grooves 21_a and a plurality of second grooves 21_b may be arranged.

Additionally, the plurality of grooves 21 may be formed such that at least one second groove 21_b is disposed between at least two first grooves 21_a. For example, as shown in the configuration of FIG. 4, one second groove 21_b may be disposed between two first grooves 21_a arranged in a straight line.

Referring to FIG. 4, the plurality of grooves 21 according to an embodiment of the present invention includes at least one second groove 21_b inside a polygon formed by connecting three or more first grooves 21_a to each other. It can be arranged as much as possible. For example, as shown in the configuration of FIG. 4, one second groove 21_b may be disposed inside a triangle formed by connecting three first grooves 21_a to each other.

Through this configuration, the battery pack substrate according to an embodiment of the present invention has the first groove (21_a) and the second groove (21_b) mixed and dispersed to provide a first terminal ( This has the effect of preventing the first groove 21_a filled with 23_a) from being easily found.

Referring to FIG. 5, the plurality of terminals 23 according to an embodiment of the present invention may each be filled to a height lower than the depth of the plurality of grooves 21 in the depth direction of the plurality of grooves 21. For example, as shown in the configuration of FIG. 5, the plurality of grooves 21 may be formed concavely toward the inside of the board 20. Additionally, each terminal 23 may be formed so that, when the depth of the groove 21 is h1, the height of the terminal 23 filled in the groove 21 is h2, which is lower than h1.

Through this configuration, the plurality of terminals 23 according to an embodiment of the present invention allows the pin 111, which is configured to contact the terminal 23, and the terminal 23 to easily contact the inside of the groove 21. There is an advantage.

Referring to FIG. 6, a plurality of grooves 21 according to an embodiment of the present invention may be formed on both sides of the board 20, respectively. For example, as shown in the configuration of FIG. 6, the first groove 21_a and the second groove 21_b may be formed on both sides of the board 20, respectively. Additionally, the first terminal 23_a and the second terminal 23_b may be disposed on both sides of the board 20, respectively.

Through this configuration, the plurality of grooves 21 and the plurality of terminals 23 according to an embodiment of the present invention have pins 111 in contact with the terminals 23 arranged on both sides of the board 20, respectively. There is an advantage that pressure can be applied from both sides, allowing effective contact between the pin 111 and the terminal 23.

FIG. 7 is a front view schematically showing a partial configuration of a battery pack board connection system according to an embodiment of the present invention, and FIG. 8 is a plan view schematically showing a partial configuration of a fixing unit according to an embodiment of the present invention. . Additionally, Figure 9 is a front view schematically showing a configuration in which a battery pack substrate is mounted between a mounting unit and a fixing unit according to an embodiment of the present invention. Additionally, in this embodiment, detailed description of parts to which the description of the previous embodiment can be similarly applied will be omitted, and the description will focus on parts where there are differences.

Referring to FIGS. 1 and 7 , the terminal contact unit 110 according to an embodiment of the present invention may be provided in the mounting unit 100 in a form that protrudes and extends upward. For example, as shown in the configuration of FIG. 7, the terminal contact unit 110 may be provided on one surface of the mounting unit 100. More specifically, the terminal contact unit 110 may be mounted on the upper surface of the mounting unit 100. Additionally, the terminal contact unit 110 may be provided in the mounting unit in a form that protrudes and extends upward from the mounting unit 100.

Preferably, the battery pack board connection system according to an embodiment of the present invention may further include a fixing unit 300, as shown in the configuration of FIG. 7.

The fixing unit 300 may be configured to be spaced a predetermined distance from the mounting unit 100 so that a board can be inserted in the space. For example, as shown in the configuration of FIG. 7, the fixing unit 300 may be spaced apart from the mounting unit 100 by a predetermined distance with the support 400 interposed therebetween. In this case, a hole may be formed in the fixing unit 300 and the mounting unit 100 so that the support 400 can be mounted.

Additionally, the fixing unit 300 may be configured to be movable in both directions, both in the direction of the mounting unit 100 and in the opposite direction. For example, the fixing unit 300 can move in the vertical direction by the support 400. In this case, the support 400 may be provided with a power device to move the fixing unit 300 in the vertical direction.

More preferably, the terminal contact unit 310 may be provided in the fixing unit 300 in a form that protrudes and extends downward. For example, as shown in the configuration of FIG. 7, the terminal contact unit 310 may be provided on one surface of the fixing unit 300. More specifically, the terminal contact unit 310 may be mounted on the lower surface of the fixing unit 300. Additionally, the terminal contact unit 310 may be provided in the fixing unit 300 in a form that protrudes and extends downward from the fixing unit 300 .

Preferably, the terminal contact units 110 and 310 are provided in the fixing unit 300 and the mounting unit 100, respectively, as shown in the configuration of FIG. 7, and are configured to protrude and extend in directions toward each other. It can be.

Additionally, the terminal contact units 110 and 310 may include a plurality of pins 111 and 311.

The plurality of pins 111 and 311 may be mounted at positions corresponding to the plurality of terminals 23 and may be configured to electrically contact the plurality of terminals 23 . For example, referring to FIGS. 3 and 7, the plurality of pins 111 and 311 allow the board 20 to be mounted on the mounting unit 100 and the fixing unit 300 to move in the direction of the mounting unit 100. Thus, when the terminal contact units 110 and 310 come into contact with the board 20, they may be disposed at positions corresponding to the plurality of terminals 23 so as to be able to electrically contact the plurality of terminals 23.

Preferably, the terminal contact units 110 and 310 of the mounting unit 100 and the fixing unit 300 may be mounted at positions facing each other with the board 20 in between. For example, as shown in the configuration of FIG. 7, the terminal contact unit 110 provided in the mounting unit 100 and the terminal contact unit 310 provided in the fixing unit 300 face each other in the vertical direction. It can be placed in a location.

Through this configuration, the terminal contact units 110 and 310 according to an embodiment of the present invention apply pressure to the board 20 from both sides in the vertical direction so that the plurality of pins 111 and 311 connect the plurality of terminals ( 23) can be easily contacted electrically.

Referring to Figures 5 and 7, a plurality of pins 111 and 311 according to an embodiment of the present invention are terminals electrically connected to the connection pin 11 of the microcontroller 10 among the plurality of terminals 23. It may be configured to be electrically connected to (23_a). For example, as shown in the configuration of FIGS. 4 and 7, the plurality of pins 111 and 311 are electrically connected to the first terminal 23_a, which is electrically connected to the connection pin 11 of the microcontroller 10. It may be placed in a position corresponding to the first terminal 23_a so that it can be connected to.

Referring to FIGS. 5 and 8 , the terminal contact unit 310 according to an embodiment of the present invention may include at least one imaginary pin among a plurality of pins 311 . For example, the terminal contact unit 310 may include a first pin 311_a and a second pin 311_b, as shown in the configuration of FIG. 8 . For example, the first pin 311_a may be disposed at a position corresponding to the first terminal 23_a so that it can be electrically connected to the first terminal 23_a. Additionally, the second pin 311_b may be disposed at a position corresponding to the second terminal 23_b so that it can be electrically connected to the second terminal 23_b. In this case, the first terminal 23_a is electrically connected to the connection pin 11 of the microcontroller 10, and the second terminal 23_b is electrically connected to the connection pin 11 of the microcontroller 10. It may not be connected. Accordingly, the second pin 311_b may be an imaginary pin that is not connected to the connection pin 11 of the microcontroller 10.

Additionally, the terminal contact unit 310 may be configured so that the positions of the plurality of pins 311 can be moved along the surface of the terminal contact unit 310. For example, in the configuration of FIG. 8, the terminal contact unit 310 moves the positions of the first pin 311_a and the second pin 311_b in the horizontal direction along the surface of the terminal contact unit 310. It can be configured. Through this configuration, the terminal contact unit 310 according to an embodiment of the present invention has a first terminal (23_a) and a second terminal (23_b) corresponding to the first pin (311_a) and the second pin (311_b). The arrangement positions of the first pin 311_a and the second pin 311_b may be moved according to the positions of .

Referring to FIGS. 8 and 9 , the fixing unit 300 according to an embodiment of the present invention may include a fixing cap 330.

The fixing cap 330 may be formed to protrude in the vertical direction so as to fix the board 20 when the terminal contact units 110 and 310 come into contact with the board 20. For example, as shown in the configuration of FIG. 9, the fixing cap 330 is disposed on the terminal contact units 110 and 310 by moving and pressing the fixing unit 300 in the direction of the mounting unit 100. When the plurality of pins 111 and 311 are in contact with the plurality of terminals 23, the board 20 can be fixed so that the plurality of pins 111 and 311 and the plurality of terminals 23 can be easily contacted. there is.

Additionally, the fixing caps 330 may be positioned at each corner of the fixing unit 300. For example, as shown in the configuration of FIGS. 8 and 9, the fixing cap 330 may be positioned at each of the four corners of the fixing unit 300. Through this configuration, the fixing cap 330 according to an embodiment of the present invention can stably fix the board 20.

Referring to Figures 7 and 9, the terminal contact units 110 and 310 according to an embodiment of the present invention are respectively provided in the fixing unit 300 and the mounting unit 100 and protrude and extend in directions toward each other. It can be configured in the form Additionally, the terminal contact units 110 and 310 may include a plurality of pins 111 and 311. Additionally, the plurality of pins 111 and 311 may be mounted at positions corresponding to the plurality of terminals 23 and configured to electrically contact the plurality of terminals 23 . Through this configuration, the terminal contact units 110 and 310 according to an embodiment of the present invention enable the plurality of pins 111 and 311 to apply pressure to the plurality of terminals 23 in both directions, thereby forming a plurality of contacts. The pins 111 and 311 can be easily contacted with the plurality of terminals 23.

Meanwhile, in this specification, terms indicating directions such as up, down, left, right, front, and back are used, but these terms are only for convenience of explanation and may vary depending on the location of the target object or the location of the observer. It is obvious to those skilled in the art that this can be done.

As described above, although the present invention has been described with limited examples and drawings, the present invention is not limited thereto, and the technical idea of the present invention and the following will be understood by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalence of the patent claims to be described.

10: Microcontroller
11: Connection pin
20: board
21: Home
23: terminal
24: connector
25: signal path
30: connecting line
31: connector
100: Mounting unit
110: terminal contact unit
111: pin
130: fastening part
200: connection unit
300: fixed unit
310: terminal contact unit
311: pin
330: Fixed cap
400: support

Claims (12)

delete delete delete delete delete delete microcontroller;
A board composed of a plate shape, the microcontroller mounted on at least one side, and a plurality of grooves formed on at least one side;
a plurality of terminals made of a conductive material and configured to fill each of the plurality of grooves;
a battery pack board mounted on the board and including a signal path configured to electrically connect at least one of the plurality of terminals and the microcontroller;
a mounting unit configured to allow the board to be mounted on an upper portion;
a terminal contact unit configured to electrically contact the plurality of terminals by having a plurality of pins having portions extending vertically; and
A battery pack board connection system comprising a connection unit electrically connected to the terminal contact unit and configured to be connected to an external device.
In clause 7,
A fixing unit configured to be spaced a predetermined distance away from the mounting unit so that the board can be interposed in the space, and configured to move in both directions in the direction of the mounting unit and in the opposite direction.
A battery pack board connection system further comprising:
According to clause 8,
The terminal contact unit is provided in each of the fixing unit and the mounting unit and is configured to protrude and extend in a direction toward each other, and is mounted at a position corresponding to the plurality of terminals to electrically contact the plurality of terminals. A battery pack board connection system comprising a plurality of pins configured to enable
According to clause 9,
The plurality of terminals include a first terminal and a second terminal,
The first terminal is configured to be electrically connected to a connection pin of the microcontroller,
The battery pack board connection system, wherein the second terminal is configured not to be electrically connected to the microcontroller.
According to clause 10,
The plurality of grooves include a first groove in which the first terminal is filled and a second groove in which the second terminal is filled,
The first groove and the second groove are each provided in plural numbers,
A battery pack board connection system, wherein the plurality of grooves include at least one second groove disposed between at least two first grooves.
According to clause 11,
A battery pack board connection system, wherein the plurality of grooves are arranged so that at least one second groove is included within a polygon formed by connecting three or more first grooves.

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