KR102638122B1 - Method for manufacturing air-cooling plate used in battery and cooling plate manufactured thereby - Google Patents

Abstract

The present invention relates to a method of manufacturing an air-cooled cooling plate used in an electric vehicle battery and a cooling plate manufactured thereby. It has a large surface area in contact with the air, which is advantageous for heat dissipation and cooling, but also has strong adhesion, high thermal conductivity, and is thin and light, making it suitable for use in electric vehicle batteries or secondary batteries.

Description

Manufacturing method of air-cooled cooling plate and cooling plate manufactured thereby {METHOD FOR MANUFACTURING AIR-COOLING PLATE USED IN BATTERY AND COOLING PLATE MANUFACTURED THEREBY}

The present invention relates to a method of manufacturing an air-cooled cooling plate used in batteries or secondary batteries for electric vehicles and to a cooling plate manufactured thereby. Specifically, the present invention relates to a large surface area in contact with air, which is advantageous for heat dissipation and cooling. It relates to a method of manufacturing a cooling plate suitable for use in batteries for electric vehicles, etc. because it has strong adhesion, high thermal conductivity, and is thin and light, and to the cooling plate manufactured thereby.

The performance of lithium-ion batteries used in electric vehicles varies greatly depending on battery temperature. The optimal temperature inside the battery is 25℃, and the temperature of the battery is directly affected by the range. Therefore, management technology that can effectively control temperature is needed. In addition, rapid charging technology for electric vehicle batteries has been developed recently, but there is a problem that the charging speed may be slowed down by the heat generated during rapid charging of the battery, so the development of components that can effectively cool the batteries of such electric vehicles. This is necessary.

Parts used to cool these electric vehicles include cooling plates made of metal. However, since conventional cooling plates are somewhat heavy compared to their heat dissipation performance, they have the problem of lowering the operating efficiency of electric vehicles, and have the disadvantage of being expensive and having a difficult manufacturing process.

Above all, the manufacturing process of the heat sink for the air-cooled cooling plate had problems in that it was difficult to integrate the large area of the battery pack or that there were limits to the weight and thinness of the heat sink due to process limitations.

Accordingly, the problem to be solved by the present invention is to provide a cooling plate suitable for use in electric vehicle batteries and secondary batteries because it has a large surface area in contact with the air, which is advantageous for heat dissipation and cooling, but also has strong adhesion, high thermal conductivity, and is thin and light. To provide a manufacturing method and a cooling plate manufactured thereby.

The problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

A method of manufacturing a cooling plate according to an embodiment of the present invention to solve the above problem includes the steps of (a) forming a hot melt resin layer on one surface of a metal plate to manufacture a support plate; (b) a heat dissipation plate in which the first lower part, the first inclined part, the upper part, the second inclined part, and the second lower part are sequentially formed to form one unit, and a plurality of the units are formed into a wrinkled shape that is continuously repeated; , overlapping the lower portion of the heat dissipation plate to be in contact with the hot melt resin layer of the support plate; and (c) heating the heat dissipation plate and the overlapping support plate to 100-300° C. to adhere them to each other.

Before step (a), chromate-treating one surface of the metal plate; and forming a primer layer on one side of the chromated metal plate, wherein the primer may include a thermoplastic olefin (TPO)-based resin.

The heat dissipation plate includes a molded metal plate, has a thickness of 2 mm or less, and the wrinkle shape has a cross section in the first direction of each unit. ' shape, and the inclined portion and upper portion of each unit may include a curvature in a second direction perpendicular to the first direction.

The metal may include one or more selected from the group consisting of aluminum, aluminum alloy, iron, copper, and stainless steel.

The hot melt resin includes a polyolefin (PO)-based resin, and the thickness of the hot melt resin layer may be 160 μm or less.

A cooling plate according to an embodiment of the present invention for solving the above problem includes a support plate and a heat dissipation plate that are overlapped and attached to each other, and the support plate includes: a metal plate; and a hot melt resin layer disposed on one surface of the metal plate, wherein at least a portion of the heat dissipation plate has a first lower portion, a first inclined portion, an upper portion, a second inclined portion, and a second lower portion formed sequentially to form one unit. and the plurality of units include a continuously repeating wrinkle shape, the support plate is attached to a lower part of the heat dissipation plate, an air space formed between the upper part of the heat dissipation plate and the support plate, and the units of the heat dissipation plate and the unit. The air layer space formed according to the standard interval between the spaces may be defined.

The cooling plate has (1) adhesion: 200 N/10 mm or more, (2) thermal conductivity: 3 W/mK or more, (3) hot melt resin layer thickness: 160 μm or less, (4) heat dissipation plate thickness: It may satisfy 2mm or less.

Specific details of other embodiments are included in the detailed description.

Figure 1a is a schematic diagram of a cooling plate manufactured by a method according to an embodiment of the present invention.
Figure 1B is a schematic diagram of comparative examples and examples related to Experimental Example 4.
Figure 2 is a photograph of a cooling plate according to an embodiment of the present invention.
Figure 3 is a photograph of a peeled specimen according to an adhesion test conducted according to an experimental example of the present invention.
Figure 4 shows the results of an adhesion test conducted according to an experimental example of the present invention.
Figure 5 shows the results of a temperature change test over time conducted according to an experimental example of the present invention.

The advantages and features of the present invention and methods for achieving them will become clear with reference to the embodiments described in detail below. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms, and only the embodiments serve to ensure that the disclosure of the present invention is complete, and those skilled in the art It is provided to fully inform the person of the scope of the invention, and the present invention is only defined by the scope of the claims.

The terminology used herein is for describing embodiments and is not intended to limit the invention. As used herein, 'and/or' includes each and every combination of one or more of the mentioned items. Additionally, the singular form also includes the plural form unless specifically stated in the phrase. As used in the specification, 'comprises' and/or 'comprising' does not exclude the presence or addition of one or more other components in addition to the mentioned components. The numerical range indicated using '-' or 'to' indicates a numerical range that includes the values written before and after it as the lower and upper limits, respectively, unless otherwise specified. ‘About’ or ‘approximately’ means a value or numerical range within 20% of the value or numerical range stated thereafter.

Additionally, when describing the components of an embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, or order of the component is not limited by the term.

Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used with meanings that can be commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless clearly specifically defined.

Also, in describing embodiments of the present invention, if detailed descriptions of related known configurations or functions are judged to impede understanding of the embodiments of the present invention, the detailed descriptions will be omitted.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

A method of manufacturing a cooling plate according to an embodiment of the present invention includes the steps of (a) forming a hot melt resin layer on one surface of a metal plate to manufacture a support plate; (b) In a heat dissipation plate in which the first lower part, the first inclined part, the upper part, the second inclined part and the second lower part form one unit, and the unit is formed into a continuously repeating wrinkle shape, the lower part of the heat dissipating plate is Overlapping the support plate in contact with the hot melt resin layer; and; (c) heating the support plates on which the heat dissipation plates overlap to 100-300° C. to adhere them to each other.

Before step (a), the step of chromate-treating one surface of the metal plate may be further included.

The metal plate may be a plate made of metal containing one or more of aluminum, aluminum alloy, iron, copper, and stainless steel. Specifically, the metal plate may be an aluminum plate.

In particular, chromate treatment of aluminum can improve the corrosion resistance of the aluminum surface. In addition, aluminum whose surface is chromated can have features such as improved conductivity, formation of an etched surface, and aesthetic appearance. Aluminum chromate treatment may be performed using trivalent chromate and/or hexavalent chromate, but embodiments of the present invention are not limited thereto.

Chromate treatment of aluminum may be performed by applying one or more standards among MIL-DTL-5541, MIL-C-5541, and KS W 1120, but embodiments of the present invention are not limited thereto. In an exemplary embodiment, aluminum chromate treatment may be performed by a method sequentially comprising the steps of alkaline degreasing, alkaline etching, desmut, aluminum chromate, and drying. Additionally, a washing step may be further included between each step.

In some embodiments of the present invention, forming a primer layer on one surface of the metal plate or the chromated metal plate may be further included before step (a).

The primer layer can be formed by coating or applying a primer containing a thermoplastic olefin (TPO)-based component. TPO is a functional polymer material that retains elasticity at room temperature but becomes flexible at high temperatures like a thermoplastic resin, allowing for processing. The primer layer can improve the adhesion performance between the metal plate and the hot melt resin layer. Specifically, by thinning the hot melt resin layer, thermal conductivity can be increased while sufficient adhesion to the metal plate can be maintained. In particular, when the primer layer is a TPO-based component, the adhesion may be significantly better than when the primer layer is an epoxy-based or rubber-based component.

In an exemplary embodiment, TPO may be a single resin or a mixed resin containing at least one selected from the group consisting of polyethylene resin and polypropylene resin.

In some other embodiments, the TPO may be formed including a hard segment corresponding to the thermoplastic portion and a soft segment corresponding to the thermoset portion. Hard segments can impart thermoplasticity, and soft segments can impart elasticity such as rubber or elastomer. Therefore, the TPO may be made of two or more types of polymer blocks. For example, the TPO may include a rubber or elastomer block as a soft segment, hard segments such as a styrene block may form both end blocks, the rubber or elastomer block may provide adhesion, and the styrene block may It can be cross-linked to form a network structure.

Specifically, the TPO may be a styrene-based thermoplastic elastomer (SBC, Thermoplastic Styrene Block Copolymer; TPS, Styrenic themoplastic elastomer), for example, styrene-butadiene-styrene (SBS)-based copolymer, styrene-isoprene-styrene ( SIS)-based copolymer, styrene-isobutylene-styrene (SIBS)-based copolymer, styrene-ethylene-butadiene-styrene (SEBS)-based copolymer, styrene-ethylene-propylene-styrene (SEPS)-based copolymer, styrene- It may be butadiene rubber (SBR), etc. Alternatively, the TPO may be a hydrogenated styrene-ethylene-butadiene-styrene (SEBS) copolymer, a hydrogenated styrene-ethylene-propylene-styrene (SEPS) copolymer, or a styrene-ethylene-ethylene-propylene-styrene (SEEPS) copolymer. It may be a combination, etc.

When the TPO is a styrene-based thermoplastic elastomer (SBC, TPS), excellent heat resistance can be achieved by including styrene, and the oil absorption of process oil can be increased by appropriately adjusting the styrene content. For example, the content of styrene in the styrene-based TPO may be 10 to 50 mol% of the monomers forming the entire styrene-based thermoplastic elastomer.

The thickness of the primer layer may be 5-10 μm. If the thickness of the primer layer is less than 5 μm, the effect of improving adhesion may be minimal, and if it is more than 10 μm, adhesion may actually decrease or thermal conductivity may decrease.

The hot melt resin layer is a layer formed of a resin that exhibits adhesion at a high temperature of 100-300 ℃, and is used to laminate a polyolefin (PO) film containing one or more of polyethylene (PE) and polypropylene (PP). It can be formed by doing so.

In some embodiments, the PO film of the present invention may be a film prepared by adding a compatibilizer containing a maleic anhydride functional group to PE and graft polymerizing it. However, embodiments of the present invention are not limited thereto.

The thickness of the hot melt resin layer may be 160 μm or less, specifically 120 μm or less, and more specifically 100 μm or less. Additionally, it may be 20 μm or more. As the thickness of the hot melt resin layer increases, adhesion increases slightly, but thermal conductivity may decrease. The cooling plate of the present invention sets the thickness of the hot melt resin layer below the above range by introducing a primer layer, thereby maintaining high thermal conductivity while maintaining high adhesion that meets the standard, and preventing corrosion due to external chemicals, etc. You can.

The primer layer and hot melt resin layer may be formed on the entire surface of one side of the support plate, may be formed on at least a portion of the support plate, or may be formed only on a portion that is in contact with and overlaps the lower part of the heat dissipation plate.

When a hot melt resin layer is formed on a metal plate to manufacture a support plate, the support plate can be overlapped to be in contact with the lower part of the heat dissipation plate formed in a corrugated shape.

At least a portion of the heat dissipation plate may be molded into a wrinkle shape, and the thickness of the heat dissipation plate may be 2 mm or less, preferably 1 mm or less, and more preferably 0.3 mm or less.

The heat dissipation plate may be a metal plate, or may be a plate made of a metal containing one or more of aluminum, aluminum alloy, iron, copper, and stainless steel. Specifically, the metal plate may be an aluminum plate.

The thickness may be a measurement of the thickness of the metal itself of the metal plate, which is the corrugated surface of the heat dissipation plate.

The wrinkle shape may be a shape in which the first lower part, the first inclined part, the upper part, the second inclined part, and the second lower part arranged sequentially form one unit, and a plurality of units are continuously repeated in the first direction, The second lower part of the first unit may be the first lower part of the second unit.

The cross section of each of the plurality of units continuous in the first direction is ' ' shape, and the inclined portion and upper part of the unit may have a curvature in the second direction. The first direction and the second direction may be perpendicular to each other and perpendicular to the thickness direction of the support plate and the heat dissipation plate, and may be directions corresponding to the horizontal and vertical directions of the support plate and the heat dissipation plate, respectively. Referring to FIG. 1A, the first direction may be the x-axis direction, the second direction may be the y-axis direction, and the third direction may be the z-axis direction.

The curvature can form a wave shape, and this curvature can improve the strength of the heat dissipation plate and increase heat dissipation performance by expanding the contact area with air.

The heat dissipation plate may be molded by applying pressure or heat and pressure.

The heat dissipation plate may have a hot melt resin layer formed on at least a portion of its lower portion, and may further include a primer layer between the lower portion and the hot melt resin layer.

The heat dissipation plate according to an embodiment of the present invention may have a shape as shown in FIG. 2.

The corrugated shape of the heat dissipation plate may be formed by pressurizing at least a portion of the heat dissipation plate to form irregularities in the pressed portion. In the pressing method, a part of a metal plate can be pressed with a press of a predetermined shape so that the pressed part has a downward concave shape, or the metal plate can be placed on a frame of a predetermined shape and the entire metal plate is pressed with a press to form a subplate. It is also possible to form a shape that is convex upward with the frame shape. A known press for pressing can be used, and the pressure for pressing can also be an appropriate pressure necessary to deform the metal plate.

After the lower part of the heat dissipation plate is overlapped with the support plate, a high temperature of 100-300 ° C is applied to the support plate, so that the heat dissipation plate and the support plate are strongly attached to each other by the hot melt resin of the support plate, and the cooling plate of the present invention can be manufactured. .

When attaching the heat dissipation plate and the support plate, high temperature and pressure may be applied. Pressure can be applied at 1 MPa to 50 MPa, preferably at 5 MPa to 30 MPa.

The cooling plate manufactured in the same manner as above has a heat dissipation plate in a corrugated shape as shown in Figure 1a, so the area in contact with the air can be maximized, and the metal thickness forming the corrugated surface of the heat dissipation plate is very thin, so it can be thinned. As a result, the weight becomes very light, making it possible to reduce the weight.

Referring to FIG. 1A, the cooling plate 100 includes a support plate 10 and a heat dissipation plate 20 that are attached and overlap each other. The support plate is a metal plate and includes a hot melt resin layer 40 disposed on one side of the metal plate. Additionally, the heat dissipation plate includes at least a portion molded into a corrugated shape (21). The support plate overlaps the lower part of the heat dissipation plate, and an air space 22 is formed between the upper part of the heat dissipation plate and the support plate, and an air space 23 is formed according to the standard distance between units of the heat dissipation plate. Includes.

The metal plate may have one side chromated, and may further include a primer layer 30 on the chromate-treated side.

The primer layer and the hot melt resin layer may be formed at least partially, or may be formed only at a portion that is in contact with and overlaps the lower part of the heat dissipation plate.

The reference interval is an interval for the air space formed between units and may be an interval formed according to the width of the lower part and the inclination of the slope.

In one embodiment, the cooling plate of the present invention may satisfy one or more of the following (1) to (4), and specifically, may satisfy all of the following (1) to (4).

(1) Adhesion: 200 N/10 mm or more, preferably 250 N/10 mm or more (maximum value based on T Peel Test)

(2) Thermal conductivity: 3 W/mK or more, preferably 4 W/mK or more, more preferably 5 W/mK or more.

(3) Thickness of hot melt resin layer: 160 μm or less, preferably 120 μm or less, more preferably 100 μm or less.

(4) Thickness of heat dissipation plate: 2 mm or less, preferably 1 mm or less, more preferably 0.3 mm or less.

Hereinafter, the present invention will be described through experimental examples, but it is obvious that the effect of the present invention is not limited by the following experimental examples.

Preparation Example 1: Preparation of cooling plate of the present invention

Example 1

The surface of the aluminum plate was chromated and then a 40 μm thick PO film was laminated to produce a support plate. The PO film was graft-polymerized to PE by adding a compatibilizer containing a maleic anhydride functional group. The lower part of the heat dissipation plate formed by pressure press molding was overlapped on the surface of the support plate on which the PO film was laminated, and then the support plate was heated and pressed to 150° C. to ensure that the heat dissipation plate and the support plate were adhered. It was confirmed that an air space was formed between the upper part of the heat dissipation plate and the support plate and in the gap between the heat dissipation plate unit and the unit.

Example 2

It was prepared in the same manner as Example 1 except that a PO film with a thickness of 60 μm was used.

Example 3

It was prepared in the same manner as Example 1 except that an 80 μm thick PO film was used.

Example 4

It was prepared in the same manner as Example 1, except that a PO film with a thickness of 160 μm was used.

Example 5

After the surface of the aluminum plate was chromated, a 5-10 μm thick primer layer containing a TPO-based component was formed, and a 40 μm thick PO film was laminated.

Comparative Example 1

It was prepared in the same manner as Example 5, except that a primer containing an epoxy-based component was used.

Comparative Example 2

It was prepared in the same manner as Example 5, except that a primer containing a rubber-based component was used.

Experimental Example 1: Heat dissipation performance evaluation

In order to evaluate the performance of the cooling plate of the present invention as a heat dissipation material, the thermal conductivity of the above example was measured using a UNITHERM ^™ (ANTER) thermal conductivity meter. The measurement results were as shown in Table 1 below.

division PO film thickness (μm) Thermal conductivity (W/mK) Example 1 40 5.4365 Example 2 60 3.3520 Example 3 80 2.3895

As shown in Table 1, the thinner the PO film, the higher the thermal conductivity, which is advantageous for heat dissipation performance, so it can be seen that it is appropriate to manufacture the PO film in a way that reduces its thickness.

Experimental Example 2: Adhesion evaluation (1)

To evaluate the adhesion between the metal plate of the cooling plate of the present invention and the hot melt resin, the T Peel Test of Examples 1 to 4 was performed. Only when the average adhesion was 200 N/10 mm or more was it evaluated as having an adhesion suitable for actual use. The measurement results were as shown in Table 2 below. Figure 3 is a photograph of a peeled specimen after the T Peel Test.

division PO film thickness (μm) average adhesion
(N/10 mm) performance indicators note Example 1 40 65 incongruity Delamination occurs on aluminum surfaces Example 2 60 101 incongruity Delamination occurs on aluminum surfaces Example 3 80 130 incongruity Delamination occurs on aluminum surfaces Example 4 160 169 incongruity Delamination occurs on aluminum surfaces

As shown in Table 2 and Figure 3, the thicker the PO film, the greater the adhesion, but even when the PO film was 160 μm thick, the adhesion did not exceed 200 N/10 mm. In addition, as shown in Experimental Example 1, the PO film must be thin to maintain heat dissipation performance due to high thermal conductivity. Therefore, it can be seen that the formation of a primer layer is necessary as in Experimental Example 3, which will be described later.

Experimental Example 3: Adhesion evaluation (2)

To evaluate the adhesion between the hot melt resin and the metal plate of the cooling plate to which the primer layer was introduced, the T Peel Test of the above examples and comparative examples was performed. Only when the average adhesion was 200 N/10 mm or more was it evaluated as having an adhesion suitable for actual use. The measurement results were as shown in Table 3 below.

division PO film thickness (μm) primer ingredients Adhesion (N/10 mm) performance indicators Example 1 40 - 65 incongruity Example 2 60 - 101 incongruity Example 3 80 - 130 incongruity Example 4 160 - 169 incongruity Example 5 40 TPO 271 fitness Comparative Example 1 40 epoxy 174 incongruity Comparative Example 2 40 rubber 190 incongruity

As shown in Table 3, the cooling plate of Example 5, in which a TPO-based primer layer was additionally formed in the middle, had an adhesion strong enough to satisfy the performance index, but also had excellent thermal conductivity due to its thin thickness of 40 μm. As shown in Table 4 and Figure 4, the T Peel Test after the room temperature, high temperature and high humidity test and the thermal shock test of Example 5 all maintained an acceptable level, and the heat resistance was also excellent. Figure 4 includes a photograph of the peeled specimen of Example 5.

item Measurement value (N/10 mm) Judgment room temperature adhesion 271 pass high temperature and humidity
(40℃/95%Rh,4days) 270 pass Thermal shock test
(10 ℃ (30 minutes) -> 65 ℃ (30 minutes)/10 cycle) 267 pass

Experimental Example 4: Temperature change at the bottom of the battery pack over time

In order to measure the temperature change at the bottom of the battery pack over time with respect to the heat dissipation plate made only of pure aluminum alloy and Example 5, the pouch starting temperature was set to 100 ° C. and the heat dissipation plate made only of pure aluminum alloy and Example 5 were measured. The temperature of the cooling plate was set at 0 °C.

The change in temperature of the pouch over time was measured, and the resulting graph is shown in Figure 5. Accordingly, after a certain time, the cooling plate manufactured according to Example 5 compared to the cooling plate manufactured with heat dissipation fins made only of pure aluminum alloy by extrusion method. As the temperature at the bottom of the pouch of the plate was lowered, it can be seen that the heat dissipation performance of Example 5 was superior.

In the above, the description has been made focusing on the embodiments of the present invention, but this is only an example and does not limit the present invention, and those skilled in the art will understand the present invention without departing from the essential characteristics of the embodiments of the present invention. It will be apparent that various modifications and applications not illustrated above are possible. For example, each component specifically shown in the embodiments of the present invention can be modified and implemented. And these variations and differences in application should be construed as being included in the scope of the present invention as defined in the appended claims.

100: Cooling plate
10: support plate
20: heat dissipation plate
21: Top of heat dissipation plate
22: air layer space
23: air layer space
30: primer layer
40: Hot melt resin layer

Claims (7)

(a) chromate-treating a surface of a metal plate;
(b) forming a primer layer containing a thermoplastic olefin (TPO)-based resin to a thickness of 5 to 10 μm on one side of the chromated metal plate;
(c) manufacturing a support plate by forming a hot melt resin layer with a thickness of 160 μm or less on one surface of the metal plate on which the primer layer is formed;
(d) a heat dissipation plate in which the first lower part, the first inclined part, the upper part, the second inclined part, and the second lower part are sequentially formed to form one unit, and a plurality of the units are formed into a wrinkled shape that is continuously repeated; , overlapping the lower part of the heat dissipation plate to be in contact with the hot melt resin layer of the support plate; and
(e) comprising the step of heating the heat dissipation plate and the overlapping support plate to 100-300° C. to adhere them to each other.
Method for manufacturing a cooling plate. delete In claim 1
The heat dissipation plate is
Including those molded from metal plates,
The thickness is less than 2mm,
The wrinkle shape is
The first direction cross section of each unit is ' ' Including things that are shapes,
The inclined portion and upper portion of each unit include a curvature in a second direction perpendicular to the first direction.
Method for manufacturing a cooling plate. The method of any one of claims 1 and 3,
The metal includes one or more selected from the group consisting of aluminum, aluminum alloy, iron, copper, and stainless steel,
Method for manufacturing a cooling plate. delete It includes a support plate and a heat dissipation plate that are overlapped and attached to each other,
The support plate is,
metal plate; and
A primer layer containing a thermoplastic olefin (TPO)-based resin with a thickness of 5 to 10 μm on one surface of the metal plate;
A hot melt resin layer having a thickness of 160 μm or less disposed on one side of the metal plate including the primer layer,
The heat dissipation plate is
At least a portion of the first lower part, the first inclined part, the upper part, the second inclined part, and the second lower part are sequentially formed to form one unit, and a plurality of the units include a wrinkle shape that is continuously repeated,
The support plate is attached to the lower part of the heat dissipation plate,
An air layer space formed between the upper part of the heat dissipation plate and the support plate and an air layer space formed according to the standard spacing between units of the heat dissipation plate are defined.
Cooling plate. In claim 6,
A cooling plate that satisfies the following (1) to (4).
(1) Adhesion: 200 N/10 mm or more
(2) Thermal conductivity: 3 W/mK or more
(3) Thickness of hot melt resin layer: 160 μm or less
(4) Thickness of heat dissipation plate: 2mm or less