KR102636554B1 - embossed mold module for manufacturing coverlay film of flexible printed circuit board and flexible printed circuit board manufacturing method using the same - Google Patents

Abstract

An embossed mold module for manufacturing a coverlay film for a flexible printed circuit board is disclosed. The embossed mold module for manufacturing a coverlay film for a flexible printed circuit board of the present invention is for manufacturing a coverlay film for a flexible printed circuit board, and includes a base mold fixed to the target surface; A plurality of pinnacle molds having pinnacle blades to form a cutting portion on the coverlay film raw material, and provided on an upper part of the base mold to enable adjustment of the arrangement position; And a gap adjustment fixing part provided on the base mold and the plurality of pinnacle molds to adjust the gap between the plurality of pinnacle molds by fixing or unfixing the plurality of pinnacle molds with respect to the base mold. do. According to the present invention, when the base and the coverlay film are tack-welded, a plurality of exposed portions of the circuit pattern of the base are not exposed to the set standard and an error occurs, that is, when the coverlay film shrinks and the FPCB length increases. If the above error occurs larger due to the following factors, this error can be easily resolved by variably changing the shape of the mold for manufacturing the coverlay film to correspond to the shrinkage rate of the coverlay film.

Description

Embossed mold module for manufacturing coverlay film of flexible printed circuit board and manufacturing method of flexible printed circuit board using the same {embossed mold module for manufacturing coverlay film of flexible printed circuit board and flexible printed circuit board manufacturing method using the same}

The present invention relates to an embossed mold module for manufacturing a coverlay film of a flexible printed circuit board for manufacturing a coverlay film attached to a base (FCCL) and a method of manufacturing a flexible printed circuit board using the same.

Electronic components developed as electronic products became smaller and lighter. They have excellent workability, strong heat and chemical resistance, heat resistance, high durability against repeated bending, high-density wiring, no wiring errors, and easy assembly. The reality is that good and highly reliable flexible printed circuit boards (FPCB) are being widely applied. Specifically, these FPCBs are core components of all electronic products, including cameras, computers and peripheral devices, HAND PHONE, VIDEO & AUDIO devices, and CAMCORDER. It is widely used in printers, DVDs, TFT LCDs, satellite equipment, military equipment, and medical equipment.

Conventionally, in manufacturing a double-sided or single-sided type FPCB, the FCCL supplied in a roll-to-roll method is cut into a set size, and a sheet is cut into a size corresponding to the cut FCCL on one or both sides of the FCCL as described above. ) type coverlay film was laminated using a hot press. At this time, a circuit pattern is formed on the FCCL before the coverlay film is laminated, and pattern holes corresponding to the circuit pattern of the FCCL are formed on the coverlay film before lamination.

However, the conventional method inevitably suffers from the following disadvantages.

Since FCCL and coverlay film raw materials are processed separately in each process, cumulative tolerances occur when tack welding each other. Specifically, when processing FCCL raw materials, that is, forming circuit patterns through via hole processing, exposure, etching, etc., tolerances occur due to FCCL shrinkage.

Additionally, processing tolerances occur during the coverlay film punching process. The tolerance includes the numerical tolerance of mold manufacturing and the tolerance during the punching process.

In addition, when tackling a punched coverlay film, deformation (shrinkage) of the coverlay film occurs due to removal of the release paper. Specifically, a release paper is attached to one side of the coverlay film so that it can be removed when necessary, but when the release paper is removed for tack welding with FCCL, the coverlay film shrinks beyond a certain level.

Additionally, adhesion tolerance occurs when tack welding FCCL and coverlay film. Specifically, an attachment tolerance of approximately 0.1mm to 0.2mm occurs depending on the sheet-type FCCL and coverlay film size (based on 500 There is no outside.

That is, the effect of tension deviation during roll winding for the production of coverlay film raw materials, the effect of moisture absorption of the release paper of the coverlay film, the effect of roll tension/press pressure when punching the coverlay film, and the effect of the coverlay film. Due to various factors, such as the influence of separating the film member and the release paper, attachment tolerance occurs when tack welding the coverlay film to FCCL.

To elaborate, since long-length FPCBs are larger in size (length) than existing IT/Mobile FPCBs, a movement rate occurs within the product, and when tack welding FCCL and coverlay film, attachment position errors occur due to the various factors mentioned above, causing damage to the FCCL's circuit. The phenomenon of shrinkage of the coverlay film, in which the exposed portion of the pattern is not exposed to the set degree and ratio, is bound to occur more significantly.

In other words, as the size (length) of the FPCB product increases, the movement rate occurs during the process of punching and attaching the coverlay film, which is the protective film of the FPCB, and problems continue to arise in the alignment of the attachment position between the FCCL and the coverlay film.

Therefore, even if the behavior rate increases as the length of the FPCB increases, the applicant variably adjusts the shape of the current mold to respond to the shrinkage rate of the coverlay film without the need to replace or manufacture a new mold for manufacturing the coverlay film. We propose a new technology to respond.

Republic of Korea Patent Publication No. 10-2006-0002086 (published on January 9, 2006)

The present invention was developed to solve the above-described conventional problems. When the base and the coverlay film are tack-welded, a plurality of exposed portions of the circuit pattern on the base are not exposed according to the set standard and an error occurs, and the coverlay film is tack-welded. The purpose is to provide an embossed mold module for manufacturing a coverlay film for a flexible printed circuit board that can easily solve such errors by variably deforming the shape of the film manufacturing mold, and a method for manufacturing a flexible printed circuit board using the same.

In addition, the present invention suppresses the occurrence of tolerances between the base and the coverlay film, making flexible printed circuit boards with a longer length (for example, 1 meter or more) than flexible printed circuit boards applied to mobile terminals, etc. stable and high quality. Another purpose is to provide an embossed mold module for manufacturing a coverlay film for a flexible printed circuit board that can be manufactured and a method for manufacturing a flexible printed circuit board using the same.

According to one aspect of the present invention, for manufacturing a coverlay film for a flexible printed circuit board, the base mold is provided to be fixed to the target surface; A plurality of pinnacle molds having pinnacle blades to form a cutting portion on the coverlay film raw material, and provided on an upper part of the base mold to enable adjustment of the arrangement position; And a gap adjustment fixing part provided in the base mold and the plurality of pinnacle molds to adjust the gap between the plurality of pinnacle molds by fixing or unfixing the plurality of pinnacle molds with respect to the base mold, and the cover. The lay film consists of a film member, an adhesive layer, and a release paper, and the cover lay film raw material is a combination of the film member and the adhesive layer. An embossed mold module for manufacturing a cover lay film of a flexible printed circuit board is provided.

The plurality of pinnacle molds may be arranged to be fixed to the base mold after being moved along the horizontal or longitudinal direction of the base mold.

The plurality of pinnacle molds may be arranged to be fixed to the base mold after moving along both the horizontal and vertical directions of the base mold.

Each of the plurality of pinnacle molds may be configured so that the distance between them can be adjusted while the lower surface is in contact with the upper surface of the base mold.

The gap adjustment fixing part includes a plurality of first through holes penetrating the base mold in the thickness direction; a plurality of second through holes each penetrating the plurality of pinnacle molds in a thickness direction so as to communicate with the plurality of first through holes at corresponding positions; And it may include a fixing member fastened to the plurality of first through holes and the second through hole to fix or unfix the plurality of pinnacle molds with respect to the base mold.

The first through hole may have a circular cross-sectional shape, and the second through hole may have a long hole cross-sectional shape.

The fixing member may include a bolt, and an outer surface of the body portion of the bolt may be made to contact the inner walls of the first and second through holes.

The first through hole may have a circular cross-sectional shape, and the second through hole may have a circular cross-sectional shape with a larger diameter than the first through hole.

The fixing member may include a bolt, and the outer surface of the body portion of the bolt may be in contact with the inner wall of the first through hole but not in contact with the inner wall of the second through hole.

A guide part may be provided in the base mold and the plurality of pinnacle molds to guide the lateral or longitudinal movement of the pinnacle mold.

The guide part includes a first guide protrusion formed to protrude from the upper part of the base mold, and a first guide groove formed concavely to insert the first guide protrusion into the lower part of the pinnacle mold, or the lower part of the pinnacle mold. It may include a second guide protrusion formed to protrude, and a second guide groove formed concavely to allow the second guide protrusion to be inserted into the upper part of the base mold.

According to another aspect of the present invention, (a) preparing a base on which a circuit pattern is formed on a copper foil layer; (b) Preparing a coverlay film in which a plurality of opening holes are formed so that the circuit pattern is partially exposed when temporarily bonded to the base using an embossed mold module for manufacturing a coverlay film of the flexible printed circuit board according to claim 1. step; (c) determining whether a plurality of exposed portions of the circuit pattern are exposed according to a set standard when the base and the coverlay film are tack-welded; and (d) if an error occurs in step (c), the current position fixation state of the plurality of pinnacle molds with respect to the base mold is released, and then the distance between the plurality of pinnacle molds is adjusted to adjust the gap between the plurality of pinnacle molds to A method of manufacturing a flexible printed circuit board including the step of repositioning is provided.

In step (d), if an error occurs in the plurality of exposed portions of the circuit pattern along the horizontal or vertical direction of the base, the plurality of pinnacle molds are placed on the base to adjust the spacing between the plurality of pinnacle molds. It can be moved along the horizontal or longitudinal direction of the mold and then fixed to the base mold.

In step (d), if an error occurs in the plurality of exposed portions of the circuit pattern along both the horizontal and vertical directions of the base, the plurality of pinnacle molds are adjusted to adjust the spacing between the plurality of pinnacle molds. It can be moved along both the horizontal and vertical directions of the base mold and then fixed to the base mold.

According to the embossed mold module for manufacturing a coverlay film for a flexible printed circuit board of the present invention described above and a method for manufacturing a flexible printed circuit board using the same, a plurality of exposed portions of the circuit pattern of the base are formed in a state in which the base and the coverlay film are tack-welded. If exposure is not achieved according to the set standard and an error occurs, that is, if the error occurs larger due to factors related to shrinkage of the coverlay film and an increase in the length of the FPCB, a mold for manufacturing the coverlay film is used to respond to the shrinkage rate of the coverlay film. This error can be easily resolved by variably modifying the shape.

In addition, by applying a structure that can variably adjust at least one of the length and width of the current mold without the need to manufacture an additional mold for manufacturing the coverlay film to resolve errors between the base and the coverlay film, it not only provides economic benefits, but also provides economic benefits. It can also improve productivity.

In addition, by effectively preventing the occurrence of tolerances between the base and the coverlay film, there is a further advantage in manufacturing flexible printed circuit boards, especially of long length sizes.

1 is a flow chart sequentially showing a method of manufacturing a flexible printed circuit board according to an embodiment of the present invention;
Figure 2 is a diagram comparing a good tack welding state between the base and the coverlay film and a poor tack welding state due to shrinkage of the coverlay film;
Figure 3 is a view showing a plurality of pinnacle molds capable of moving along the longitudinal direction of the base mold in the embossed mold module for manufacturing a coverlay film for a flexible printed circuit board according to an embodiment of the present invention;
Figure 4 is a view showing a plurality of pinnacle molds capable of moving along the transverse direction of the base mold in the embossed mold module for manufacturing a coverlay film for a flexible printed circuit board according to an embodiment of the present invention;
Figure 5 is a plan view schematically showing how a plurality of pinnacle molds can be moved along both the horizontal and vertical directions of the base mold in the embossed mold module for manufacturing a coverlay film for a flexible printed circuit board according to an embodiment of the present invention;
Figure 6 is a plan view showing a state in which a plurality of pinnacle molds move along the longitudinal direction of the base mold in the embossed mold module for manufacturing a coverlay film for a flexible printed circuit board according to an embodiment of the present invention;
Figure 7 is a plan view showing a state in which a plurality of pinnacle molds move along the transverse direction of the base mold in the embossed mold module for manufacturing a coverlay film for a flexible printed circuit board according to an embodiment of the present invention;
Figure 8 is a cross-sectional view showing the coupling relationship between the base mold and the pinnacle mold in the embossed mold module for manufacturing a coverlay film for a flexible printed circuit board according to an embodiment of the present invention;
Figure 9 is a plan view showing a state in which a plurality of pinnacle molds move along both the horizontal and vertical directions of the base mold in the embossed mold module for manufacturing a coverlay film for a flexible printed circuit board according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. These embodiments only serve to ensure that the disclosure of the present invention is complete and to those skilled in the art to fully convey the scope of the invention. This is provided to inform you. In the drawings, like symbols refer to like elements.

The embossed mold module for manufacturing a coverlay film for a flexible printed circuit board according to a preferred embodiment of the present invention and the method for manufacturing a flexible printed circuit board using the same are based on a standard in which a plurality of exposed portions of the circuit pattern are set in a state in which the base and the coverlay film are tack-welded. If an error occurs due to failure to be exposed, that is, if the error occurs larger due to factors such as shrinkage of the coverlay film and an increase in the length of the FPCB, such error can be prevented by variably changing the shape of the mold for manufacturing the coverlay film. It can be solved easily.

To elaborate, the present invention is economical by applying a structure that can variably adjust at least one of the length and width of the current mold without the need to additionally manufacture a mold for manufacturing the coverlay film to solve the error between the base and the coverlay film. In addition to the benefits, it can also improve productivity.

Hereinafter, the present invention will be described in detail with reference to examples.

As shown in Figure 1, the flexible printed circuit board manufacturing method according to an embodiment of the present invention includes a base preparation step (S100), a coverlay film preparation step (S200), a normal tack welding step (S300), and a coverlay film. It includes a manufacturing embossed mold module adjustment step (S400).

First, the base 100 is prepared by forming a circuit pattern on one or both sides of a flexible copper clad laminate (FCCL) film (S100).

Specifically, prepare a flexible copper clad laminated film in which a copper foil layer is laminated on one or both sides of an insulating film layer (polyimide resin (PI)), and form a through hole in the flexible copper clad laminated film through CNC processing or laser processing. , copper plating is performed to ensure that both sides of the flexible copper clad laminate film are entirely conductive. Next, a photosensitive dry film is laminated and laminated on both sides of the flexible copper clad laminate film, and then sequentially exposed, developed, and etched to form a circuit pattern.

Next, as shown in FIGS. 1 and 2, the cover lay film 200, in which a plurality of opening holes 210 are formed so that the circuit pattern is partially exposed when tack-welding with the base 100, is applied to the cover of the flexible printed circuit board. Prepare using the embossed mold module 300 for manufacturing ray film (S200). Steps S100 and S200 may be performed simultaneously as separate processes.

Specifically, a plurality of opening holes 210 are formed in the coverlay film 200. When the base 100 and the coverlay film 200 are bonded, the circuit pattern of the portion corresponding to the opening hole 210 is It can function as an electrode terminal for electrical connection, and in some cases, it can be applied as a function to easily bend the corresponding part of the flexible self-glazed laminated film.

In addition, with the coverlay film 200 tack-welded to the top of the base 100, the circuit pattern of the base corresponding to the opening hole 210 is exposed to the outside, and the remaining part is covered by the coverlay film 200. It is not exposed to the outside in its current state.

Hereinafter, an embossed mold module 300 (hereinafter referred to as 'embossed mold module') for manufacturing a coverlay film for a flexible printed circuit board according to an embodiment of the present invention will be described.

In an embodiment of the present invention, as shown in Figures 3 and 4, the embossed mold module 300 is for manufacturing a coverlay film for a flexible printed circuit board, and includes one base mold 310 and a plurality of pinnacles. Includes a mold (320, pinnacle mold) and a gap adjustment fixture (330).

The base mold 310 is provided to be fixed to the target surface of a fixture such as a base die or base frame in a workshop.

The pinna Geumgeum 320 is a for forming a plurality of opening holes 210 in the coverline film 200, and specifically, the film member and the adhesive layer of the coverlay film 200 consisting of a film member, an adhesive layer, and a brochure. to form an incision line. Here, the cut lines correspond to the plurality of opening holes 210, and when the combination of the film member and the adhesive layer is separated from the release paper in the subsequent work process, the plurality of opening holes 210 are formed in the combination. The portion filling the inside of the opening hole 210 remains attached to the release paper when the assembly is separated from the release paper.

With the coverlay film 200 in contact with the pinnacle blade at the top of the pinnacle mold 320, the coverlay film 200 is pressed toward the pinnacle mold using a press device, roll press device, power press device, etc., An incision line can be formed on the film member and adhesive layer of the coverlay film 200 using a blade.

That is, as shown in FIGS. 3 and 4, the pinnacle mold 320 has a pinnacle blade 321 to form a cutting portion on the coverlay film raw material, that is, a combination of the film member and the adhesive layer, and the base mold 310 ) is provided in plurality so that the arrangement position can be adjusted at the upper part.

In an embodiment of the present invention, the plurality of pinnacle molds 320 are each configured so that the distance between them can be adjusted while the lower surface is in contact with the upper surface of the base mold 310.

Therefore, as described above, the base 100 and the coverlay film are tack-welded, that is, the coverlay film 200 in which the opening hole 210 is formed by separating the combination of the film member and the adhesive layer from the release paper as described above. In a state in which a defect occurs due to a plurality of exposed portions of the circuit pattern of the base 100 being not exposed to the set standard, as shown in FIG. 2, the plurality of pinnacle molds 320 are This defect can be solved by adjusting the spacing.

In addition, as shown in FIG. 2, if the spacing between a plurality of exposed parts exposed while the coverlay film 200 is tack-welded, the degree of exposure of the circuit pattern, and the exposed area do not meet the set standards, the worker must This defective condition can be solved by moving the plurality of pinnacle molds 320 with respect to the base mold 310 and adjusting the spacing between them.

As shown in FIGS. 3, 4, 6, and 7, as an example, the plurality of pinnacle molds 320 are moved along the horizontal or longitudinal direction of the base mold 310 and then moved to the base mold 310. It can be provided so that it can be fixed to.

Here, the transverse direction of the base mold 310 refers to the direction corresponding to the width direction of the coverlay film 200 wound in a roll when it is unwound and continuously provided to the upper part of the embossed mold module 300. .

In addition, the longitudinal direction of the base mold 310 refers to the direction corresponding to the longitudinal direction of the coverlay film when the coverlay film wound in a roll is unwound and continuously provided to the upper part of the embossed mold module 300.

As shown in Figures 5 and 9, as another example, the plurality of pinnacle molds 320 may be arranged to be fixed to the base mold 310 after moving along both the horizontal and vertical directions of the base mold. .

Therefore, in the present invention, as shown in FIG. 2, the distance between a plurality of exposed portions exposed in a tack-welded state of the coverlay film 200, the degree of exposure of the circuit pattern, and the exposed area are determined by the width of the coverlay film 200. If an error occurs in at least one of the direction and the longitudinal direction, as shown in FIGS. 3 to 5, a plurality of pinnacle molds 320 are installed in the horizontal, vertical, and horizontal directions of the base mold 310. Errors can be resolved by moving them in all directions and adjusting the spacing between them.

Next, as shown in FIGS. 3, 4, 6, 7, and 9, the gap adjustment fixing unit 330 positions or releases a plurality of pinnacle molds 320 with respect to the base mold 310. This adjusts the spacing between the plurality of pinnacle molds 320, and is provided in a state of being coupled to the base mold 310 and the plurality of pinnacle molds 320.

Specifically, the gap adjustment fixing part 330 communicates with a plurality of first through holes 331 penetrating the base mold 310 in the thickness direction and at positions corresponding to the plurality of first through holes 331, respectively. A plurality of second through holes 332 penetrating each of the plurality of pinnacle molds 320 in the thickness direction as much as possible, and a plurality of first through holes 331 and second through holes 332 are connected to the base mold 310. ) and includes a fixing member 333 for fixing or unfixing the plurality of pinnacle molds 320.

A plurality of first through holes 331 may be provided in an area near the edge of the base mold 310, and the second through holes 332 may be formed in a plurality of pinnacle molds so as to communicate with the plurality of first through holes 331, respectively. A plurality may be provided in the area near the edge of 320.

The operator can fixedly couple the pinnacle mold to the base mold by fixing the fixing member 333 to the first through hole and the second through hole. After uncoupling the fixing member, a plurality of pinnacle molds can be connected to the base mold. After adjusting the placement position, the pinnacle mold can be fixedly coupled to the base mold by fastening the fixing member 333 again.

As described above, first, the plurality of pinnacle molds 320 can be movably arranged so that the spacing between them can be adjusted along the horizontal or longitudinal direction of the base mold 310, and second, the plurality of pinnacle molds 320 ) can be movably arranged to adjust the spacing along both the transverse and longitudinal directions of the base mold, and the shapes of the first through hole and the second through hole are applied differently depending on the first and second cases.

First, as shown in FIGS. 3, 4, 6, and 7, when the plurality of pinnacle molds 320 are arranged to be movable along the horizontal or longitudinal direction of the base mold 310, the first penetration The hole 331 has a circular cross-sectional shape, and the second through-hole 332 has a long hole cross-sectional shape.

Here, the second through hole 332 is formed in the form of a long hole that is long along a direction corresponding to the horizontal or longitudinal direction of the base mold 310.

In an embodiment of the present invention, the fixing member 333 includes a bolt 334 and a nut 335, and the outer surface of the body portion of the bolt 334 contacts the inner wall of the first and second through holes 331 and 332. It can be made possible.

The worker fastens the nut 335 to the insertion end while inserting the bolt 334 through the first through hole 331 and the second through hole 332 to prevent the pinnacle mold 320 from moving. If it is necessary to adjust the position of the pinnacle mold, you can adjust the position of the pinnacle mold by uncoupling the nut.

Meanwhile, the outer surface of the body portion of the bolt 334 is made to be in contact with the inner wall of the first and second through holes 331 and 332, so that the plurality of pinnacle molds 320 can be horizontally or vertically connected to the base mold 310. When adjusting the position by moving in one direction, the pinnacle mold moves in an undesirable direction, moves slightly in the left/right/forward/backward direction, and one end and the other end of the pinnacle mold are not horizontal or vertical with respect to the edge of the base mold and rotate in a misaligned state. This can be prevented and it can be made to move only along the lateral or longitudinal direction as accurately as possible.

As described above, when the pinnacle mold is moved with respect to the base mold while the outer surface of the body portion of the bolt 334 is in contact with the inner wall of the first and second through holes 331 and 332, the pinnacle mold is as close to the base mold as possible. Although it may be possible to move along the lateral or longitudinal direction, the pinnacle mold may not move accurately vertically or horizontally to the edge of the base mold due to various factors such as differences in the outer diameters of the plurality of bolts 334 and dimensional errors in the width and length of the long hole. You may not be able to move in the direction and errors may occur.

In order to compensate for this, as shown in FIG. 8, the base mold 310 and the plurality of pinnacle molds 320 are provided with a guide portion 350 to guide the lateral or longitudinal movement of the pinnacle mold 320. It can be.

When a plurality of pinnacle molds 320 are provided to move along the lateral direction of the base mold 310, the guide portion 350 may be formed to be long along the lateral direction of the base mold and the pinnacle mold.

In contrast, when the plurality of pinnacle molds 320 are provided to move along the longitudinal direction of the base mold 310, the guide portion 350 may be formed to be long along the longitudinal direction of the base mold and the pinnacle mold.

In an embodiment of the present invention, as shown in FIG. 8, the guide portion 350 includes a first guide protrusion 351 protruding from the upper part of the base mold 310 and a lower portion of the pinnacle mold 320. It may include a first guide groove 352 that is concavely formed to allow the first guide protrusion 351 to be inserted.

In contrast, although not specifically shown in the drawings, the guide portion has a second guide protrusion (not shown) formed to protrude from the lower part of the pinnacle mold 320 and a second guide protrusion (not shown) inserted into the upper part of the base mold. It may also include a second guide groove (not shown) that is formed as concave as possible.

As the first guide protrusion 351 and the first guide groove 352 are made to have cross-sectional shapes corresponding to each other, the plurality of pinnacle molds 320 are accurately moved along the horizontal or longitudinal direction through the guide portion 350. Since it can be moved, it is possible to prevent movement errors in the mold.

In an embodiment of the present invention, the first guide protrusion 351 may have various shapes, such as square, rectangular, or tapered so that the cross-sectional area gradually decreases from the top to the bottom.

Second, as shown in FIG. 9, when the plurality of pinnacle molds 320 are arranged to be movable along both the horizontal and longitudinal directions of the base mold 310, the first through hole 331 has a circular cross-section. The second through hole 332 has a circular cross-sectional shape with a larger diameter than the first through hole 331.

In an embodiment of the present invention, as shown in FIG. 9, the fixing member 333 includes a bolt 334 and a nut 335, and the outer surface of the body portion of the bolt 334 has a first through hole 331. It may be made to contact the inner wall of the second through hole 332 but not to the inner wall of the second through hole 332. The outer diameter of the nut 335 is larger than the diameter of the second through hole 332.

The worker fastens the nut 335 to the insertion end while inserting the bolt 334 through the first through hole 331 and the second through hole 332 to prevent the pinnacle mold 320 from moving. If the position of the pinnacle mold needs to be adjusted, the nut can be uncoupled to adjust the position of the pinnacle mold along the desired direction among the horizontal and vertical directions of the base mold.

Next, as shown in FIG. 1, in a state in which the base 100 and the coverlay film 200 are tack-welded, it is determined whether a plurality of exposed portions of the circuit pattern are exposed according to a set standard (S300).

Specifically, it is determined through camera shooting, etc. whether the interval between the plurality of exposed parts exposed in the state where the coverlay film 200 is tacked, the degree of exposure of the circuit pattern, and the exposed area meet the set standards.

Next, as shown in FIGS. 1 and 2, if an error occurs because the setting standard is not met in step S300, the current position fixation state of the plurality of pinnacle molds 320 with respect to the base mold 310 is released. Afterwards, the spacing between the plurality of pinnacle molds 320 is adjusted to correspond to the position error that occurs and the positions are fixed again to the base mold (S400).

Afterwards, tack welding between the base and the coverlay film can be performed again.

In step S400, if an error occurs in the plurality of exposed portions of the circuit pattern of the base 100 along the horizontal or longitudinal direction of the base, a plurality of pinnacle molds (320) are used to adjust the spacing between the plurality of pinnacle molds 320. 320) is moved along the horizontal or longitudinal direction of the base mold 310 and then fixed to the base mold 310.

In addition, in step S400, if an error occurs in the plurality of exposed portions of the circuit pattern of the base 100 along both the horizontal and vertical directions of the base 100, the spacing between the plurality of pinnacle molds 320 is adjusted. To do this, the plurality of pinnacle molds 320 are moved along both the horizontal and longitudinal directions of the base mold 310 and then fixed to the base mold. Adjusting the placement position of the pinnacle mold has been described in detail previously, so detailed explanation will be omitted below.

That is, the present invention takes into account the degree of shrinkage of the coverlay film in advance and manufactures the coverlay film by proportionally increasing the gap between the plurality of pinnacle molds 320 to correspond to the shrinkage rate of the coverlay film, and then manufactures the coverlay film using the base (100). ) and tack welding, it is possible to finally solve the problem of attachment tolerance between the base and the coverlay film.

Although the present invention has been shown and described in connection with preferred embodiments for illustrating the principles of the invention, the invention is not limited to the construction and operation as shown and described. Rather, those skilled in the art will understand that numerous changes and modifications can be made to the present invention without departing from the spirit and scope of the appended claims.

100: Base 200: Coverlay Film
210: Opening hole 300: Embossed mold module
310: Base mold 320: Pinnacle mold
330: Gap adjustment fixing part 331: First through hole
332: second through hole 333: fixing member
350: Guide unit

Claims (14)

For manufacturing a coverlay film for flexible printed circuit boards,
A base mold fixed to the target surface;
A plurality of pinnacle molds having pinnacle blades to form a cutting portion on the coverlay film raw material, and provided on an upper part of the base mold to enable adjustment of the arrangement position; and
A gap adjustment fixing part provided on the base mold and the plurality of pinnacle molds to adjust the gap between the plurality of pinnacle molds by fixing or unfixing the plurality of pinnacle molds with respect to the base mold,
The coverlay film is composed of a film member, an adhesive layer, and a release paper, and the coverlay film raw material is a combination of the film member and the adhesive layer. An embossed mold module for manufacturing a coverlay film for a flexible printed circuit board. According to paragraph 1,
An embossed mold module for manufacturing a coverlay film for a flexible printed circuit board, characterized in that the plurality of pinnacle molds are provided so that they can be fixed to the base mold after moving along the transverse or longitudinal direction of the base mold. According to paragraph 1,
An embossed mold module for manufacturing a coverlay film for a flexible printed circuit board, characterized in that the plurality of pinnacle molds are provided so that they can be fixed to the base mold after moving along both the transverse and longitudinal directions of the base mold. According to paragraph 1,
An embossed mold module for manufacturing a coverlay film for a flexible printed circuit board, characterized in that the gap between the plurality of pinnacle molds is adjustable while the lower surface is in contact with the upper surface of the base mold. According to paragraph 1,
The gap adjustment fixing part is,
a plurality of first through holes penetrating the base mold in the thickness direction;
a plurality of second through holes each penetrating the plurality of pinnacle molds in a thickness direction so as to communicate with the plurality of first through holes at corresponding positions; and
Embossed for manufacturing a coverlay film of a flexible printed circuit board, characterized in that it includes a fixing member fastened to the plurality of first through holes and the second through hole to fix or unfix the plurality of pinnacle molds with respect to the base mold. Mold module. According to clause 5,
An embossed mold module for manufacturing a coverlay film for a flexible printed circuit board, wherein the first through hole has a circular cross-sectional shape, and the second through hole has a long hole cross-sectional shape. According to clause 6,
The fixing member includes a bolt, and the outer surface of the body portion of the bolt is made to be in contact with the inner wall of the first and second through holes. According to clause 5,
The first through hole has a circular cross-sectional shape, and the second through hole has a circular cross-sectional shape with a larger diameter than the first through hole. An embossed mold for manufacturing a coverlay film for a flexible printed circuit board. module. According to clause 8,
The fixing member includes a bolt, and the outer surface of the body portion of the bolt contacts the inner wall of the first through hole but does not contact the inner wall of the second through hole. Embossed mold module. According to paragraph 2,
An embossed mold module for manufacturing a coverlay film for a flexible printed circuit board, characterized in that the base mold and the plurality of pinnacle molds are provided with a guide portion to guide the lateral or longitudinal movement of the pinnacle mold. According to clause 10,
The guide part,
It includes a first guide protrusion formed to protrude from the upper part of the base mold, and a first guide groove formed concavely to allow the first guide protrusion to be inserted into the lower part of the pinnacle mold, or
A cover of a flexible printed circuit board comprising a second guide protrusion formed to protrude from the lower part of the pinnacle mold, and a second guide groove formed concavely to insert the second guide protrusion into the upper part of the base mold. Embossed mold module for ray film manufacturing. (a) preparing a base with a circuit pattern formed on a copper foil layer;
(b) Preparing a coverlay film in which a plurality of opening holes are formed so that the circuit pattern is partially exposed when temporarily bonded to the base using an embossed mold module for manufacturing a coverlay film of the flexible printed circuit board according to claim 1. step;
(c) determining whether a plurality of exposed portions of the circuit pattern are exposed according to a set standard when the base and the coverlay film are tack-welded; and
(d) If an error occurs in step (c), the current position fixation state of the plurality of pinnacle molds with respect to the base mold is released, and then the spacing between the plurality of pinnacle molds is adjusted to return the base mold to the base mold. A method of manufacturing a flexible printed circuit board including the step of positioning. According to clause 12,
In step (d), if an error occurs in the plurality of exposed portions of the circuit pattern along the horizontal or vertical direction of the base, the plurality of pinnacle molds are placed on the base to adjust the spacing between the plurality of pinnacle molds. A method of manufacturing a flexible printed circuit board, characterized in that the position can be moved along the horizontal or longitudinal direction of the mold and then fixed to the base mold. According to clause 12,
In step (d), if an error occurs in the plurality of exposed portions of the circuit pattern along both the horizontal and vertical directions of the base, the plurality of pinnacle molds are adjusted to adjust the spacing between the plurality of pinnacle molds. A method of manufacturing a flexible printed circuit board, characterized in that the position can be moved along both the horizontal and longitudinal directions of the base mold and then fixed to the base mold.

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