KR102635680B1 - Heat exchanger and manufacturing method for manufacturing the same - Google Patents

Abstract

The present invention provides a first header tank and a second header tank arranged to face each other and spaced apart from each other, and a plurality of devices disposed between the first header tank and the second header tank and connecting the first header tank and the second header tank. A microtube and a first plate and a second plate supporting the first header tank and the second header tank disposed on both sides of the microtube, wherein the first plate has at least one first buffer groove, A heat exchanger is provided, wherein at least one second buffer groove is disposed on the second plate.

Description

Heat exchanger and manufacturing method for manufacturing the same}

The embodiment relates to a heat exchanger and a manufacturing method for manufacturing the same. More specifically, it relates to a heat exchanger that increases heat exchange efficiency using microtubes and a manufacturing method for manufacturing the same.

In general, a heat exchanger is a device that absorbs heat from one side and releases heat from the other between two environments with temperature differences. When it absorbs heat from inside the room and releases it to the outside, it acts as a cooling system and absorbs heat from the outside to the inside. When released, it acts as a heating system.

1 is a diagram showing the structure of a conventional heat exchanger.

Referring to FIG. 1, a conventional heat exchanger includes a pair of header tanks (11, 12) formed in parallel with a certain distance apart, and both ends fixed to the pair of header tanks (11, 12) to form a heat exchange medium flow path. It is formed to include a plurality of tubes 13 and a plurality of fins 14 formed to be interposed between the tubes 13.

The pair of header tanks 11 and 12 allow the heat exchange medium to flow in or out, and the tube 13 forms a heat exchange medium flow path through which the heat exchange medium flows.

The fin 14 may be formed in a corrugated shape between the tubes 13, and is assembled between the tubes 13 and then joined by brazing. The fins 14 increase the contact area with the air passing between the tubes 13, thereby increasing the heat exchange efficiency between the heat exchange medium flowing along the inside of the tubes 13 and the surrounding air.

In addition, the heat exchanger 10 has a pair of supports 15 disposed on the outermost sides of the tubes 13 in the direction in which the tubes 13 are arranged, and the supports 15 are a pair of header tanks in the same way as the tubes 13. It is coupled to (11, 12).

However, this conventional heat exchanger has a limited location within the air conditioning device to form a flow path, and must have a minimum space. In this case, it is difficult to pursue the direction of air flow due to the shape and structure of the standardized tube and fin of the existing heat exchanger.

Additionally, if the air inflow path is not in the width direction of the tube, the flow resistance increases significantly, which may lead to a high pressure drop and adversely affect heat dissipation performance.

In addition, when placing a heat exchanger on the ceiling, there was a limitation of using unnecessary space to form a flow path despite changes in the structure due to the difficulty of reflecting the existing flow characteristics.

Republic of Korea Patent Publication No. 2018-0093285.

The purpose of the embodiment is to provide a heat exchanger with increased design freedom and heat exchange efficiency using microtubes.

In addition, the purpose is to increase heat exchange efficiency by changing the arrangement structure of the baffle to form the flow path.

The problem to be solved by the present invention is not limited to the problems mentioned above, and other problems not mentioned here will be clearly understood by those skilled in the art from the description below.

An embodiment of the present invention includes a first header tank 100 and a second header tank 200 that are spaced apart and face each other; A plurality of microtubes 300 disposed between the first header tank 100 and the second header tank 200 and connecting the first header tank 100 and the second header tank 200; and a first plate 150 and a second plate 170 supporting the first header tank 100 and the second header tank 200 disposed on both sides of the microtube 300, A heat exchanger is provided, wherein at least one first buffer groove 151 is disposed on the first plate 150.

Preferably, the second plate 170 may have at least one second buffer groove 171 disposed.

Preferably, each of the first buffer groove 151 and the second buffer groove 171 includes a pair of cut grooves 151a and 171a, and the cut grooves 151a and 171a have opposite openings. It may be characterized as being arranged to face a direction.

Preferably, the cutting grooves 151a and 171a may be arranged to be horizontal to each other.

Preferably, the cutting grooves 151a and 171a may be arranged to have an inclination.

Preferably, at least one support plate for adjusting the spacing of the microtubes 300 is disposed in one area in the longitudinal direction of the plurality of microtubes 300, and the center lines of the cut grooves 151a and 171a The fixing lines of the support plate 310 may intersect each other.

Preferably, the first buffer groove 151 and the second buffer groove 171 may be arranged in different numbers.

Preferably, the three support plates 310 are arranged to be spaced apart, and three second buffer grooves 171 are formed in the second plate 170, with the second buffer groove 171 disposed in the center. The center line of the support plate 310 is arranged to intersect on the second plate 170, and the center line of the second buffer groove 171 disposed on both sides is the fixed line of the support plate 310 disposed on both sides. It may be characterized as being arranged more externally.

Preferably, the support plates 310 disposed on both sides may be characterized as having a symmetrical structure with respect to the support plate 310 disposed in the center.

Preferably, the microtube 300 may be characterized as having a cylindrical structure.

Preferably, the microtube 300 may have a diameter of 1 to 2 mm.

Preferably, the microtube 300 may have a thickness of 0.1 to 0.3 mm.

Another embodiment of the present invention is a first header tank 100 and a second header tank 200 arranged to be spaced apart from each other, between the first header tank 100 and the second header tank 200. A plurality of microtubes 300 are disposed on and connect the first header tank 100 and the second header tank 200, and are disposed on both sides of the microtubes 300, and at least one buffer groove is formed. Component assembly step of assembling the first plate 150 and the second plate 170; and a brazing welding step of brazing the component parts, wherein when the microtube expands in the brazing welding step, the buffer groove reacts to relieve deformation of the microtube. to provide.

Preferably, after the brazing and welding step, it includes a cooling step of cooling the component parts, wherein the buffer groove reacts to shrinkage of the microtube when the temperature decreases in the cooling step to relieve deformation of the microtube. can do.

According to the embodiment, there is an effect of increasing heat exchange efficiency by changing the installation angle and position of the baffle.

The various and beneficial advantages and effects of the present invention are not limited to the above-described content, and may be more easily understood through description of specific embodiments of the present invention.

1 is a diagram showing the structure of a conventional heat exchanger.
Figure 2 is a perspective view of a heat exchanger according to an embodiment of the present invention;
Figure 3 is a diagram showing the air flow according to the arrangement structure of the microtubes, which are components of Figure 2;
Figure 4 is a diagram showing the detailed configuration of the arrangement structure of the microtubes, which are components of Figure 2;
Figure 5 is a perspective view of the heat exchanger showing the state in which the conductor, which is a component of the present invention, is disposed;
Figure 6 is an enlarged view showing the spiral conductor arrangement structure, which is a component of Figure 5;
Figure 7 is a first embodiment showing the arrangement structure of the conductor, which is a component of Figure 5,
Figure 8 is a second embodiment showing the arrangement structure of the conductor, which is a component of Figure 5,
Figure 9 is another embodiment of the conductor that is a component of Figure 5;
Figure 10 is a cross-sectional view showing the arrangement of Figure 9.
Figure 11 is a diagram showing the arrangement structure of a general beple;
Figure 12 is a side view of Figure 11,
Figure 13 is a first embodiment of the arrangement structure of the baffle of Figure 11;
Figure 14 is a second embodiment of the arrangement structure of the baffle of Figure 11;
Figure 15 is a third embodiment of the arrangement structure of the baffle of Figure 11;
Figure 16 is a graph comparing the heat dissipation performance according to the baffle arrangement structure of Figure 11 and the embodiment of the present invention that blocks the air flow area,
Figure 17 is a perspective view showing the structure of the first plate and the second plate of the present invention,
Figure 18 is an enlarged view showing the structure of the first plate of Figure 17,
Figure 19 is an enlarged view showing the structure of the second plate of Figure 17,
Figure 20 is another embodiment of the first plate and second plate shown in Figure 17;
Figure 21 is a diagram showing the first plate and the second plate shown in Figure 20,
Figure 22 is a diagram showing the shape of the first or second buffer groove configured in Figure 17;
Figure 23 is a flow chart showing a manufacturing method for manufacturing the heat exchanger of Figure 17.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

However, the technical idea of the present invention is not limited to some of the described embodiments, but may be implemented in various different forms, and as long as it is within the scope of the technical idea of the present invention, one or more of the components may be optionally used between the embodiments. It can be used by combining and replacing.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless explicitly specifically defined and described, are generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as meaning, and the meaning of commonly used terms, such as terms defined in a dictionary, can be interpreted by considering the contextual meaning of the related technology.

Additionally, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In this specification, the singular may also include the plural unless specifically stated in the phrase, and when described as “at least one (or more than one) of A and B and C”, it is combined with A, B, and C. It can contain one or more of all possible combinations.

Additionally, when describing the components of an embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used.

These terms are only used to distinguish the component from other components, and are not limited to the essence, sequence, or order of the component.

And, when a component is described as being 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to that other component, but also is connected to that component. It can also include cases where other components are 'connected', 'combined', or 'connected' due to another component between them.

Additionally, when described as being formed or disposed “above” or “below” each component, “above” or “below” refers not only to cases where two components are in direct contact with each other, but also to one This also includes cases where another component described above is formed or placed between two components. In addition, when expressed as “top (above) or bottom (bottom)”, it can include not only the upward direction but also the downward direction based on one component.

Hereinafter, embodiments will be described in detail with reference to the attached drawings, but identical or corresponding components will be assigned the same reference numbers regardless of the reference numerals, and overlapping descriptions thereof will be omitted.

1 to 22 clearly show only the main features in order to clearly understand the present invention conceptually, and as a result, various modifications of the illustration are expected, and the scope of the present invention is limited by the specific shape shown in the drawings. It doesn't have to be.

Figure 2 is a perspective view of a heat exchanger according to an embodiment of the present invention.

A heat exchanger according to an embodiment of the present invention may include a first header tank 100, a second header tank 200, and a microtube 300.

The first header tank 100 may be provided with an inflow passage 101 and an outflow passage 103 through which refrigerant flows in and out.

The first header tank 100 may be divided into a plurality of passages through a partition wall, and the refrigerant may flow into the inflow passage 101, undergo heat exchange with the outside air, and then be discharged through the outflow passage 103.

The second header tank 200 is arranged to be spaced apart from the first header tank 100, and the refrigerant can move. Like the first header tank 100, the second header tank 200 may also be divided into a plurality of flow paths through a partition wall.

The microtubes 300 are arranged in plural numbers and can connect the first header tank 100 and the second header tank 200. The purpose of the present invention is to increase heat exchange efficiency by omitting fins from the fin-tube combination structure used in the structure of a conventional heat exchanger and using a plurality of microtubes 300.

The microtube 300 may be joined to the first header tank 100 and the second header tank 200 through brazing welding or bonding, and may be modified using various fixing methods.

In one embodiment, the microtube 300 may have a diameter of 1 to 2 mm. If the diameter of the microtube is more than 2mm, the number of tubes within the limited area of the heat exchanger decreases, which causes a problem in that the amount of heat dissipation decreases. If the diameter is less than 1mm, the flow rate of the refrigerant moving through the microtube 300 decreases, reducing the efficiency of heat exchange. There is a problem with falling.

Additionally, the microtube 300 may have a thickness of 0.1 to 0.3 mm. If the thickness of the microtube 300 is less than 0.1mm, cracks will occur in the microtube 300, and if it is more than 0.3mm, there is a problem in that the number of tubes decreases due to an increase in volume.

The diameter and thickness of the microtube 300 are not limited to the above embodiment, and may be modified in various ways depending on the size of the heat exchanger.

The arrangement structure of the microtube 300 and heat exchange with external air will be described again below.

Additionally, at least one support plate 310 supporting the microtubes 300 may be disposed in one area in the longitudinal direction of the plurality of microtubes 300 . In the case of the microtube 300, the diameter is very small and the individual support force is very weak. Therefore, even if it is connected to the first header tank 100 and the second header tank 200, problems such as bending or misalignment may occur when supporting the weight of the bending header tank 110. To prevent this problem, a plurality of support plates 310 may be disposed.

The plurality of support plates 310 have a structure through which the microtubes 300 penetrate, and the position of the microtubes 300 can be fixed using the through structure.

Additionally, when a plurality of support plates 310 are arranged, they are arranged to be spaced apart at regular intervals to increase support force.

FIG. 3 is a diagram showing the air flow according to the arrangement structure of the microtube 300, which is a component of FIG. 2, and FIG. 4 is a diagram showing the detailed configuration of the arrangement structure of the microtube 300, which is a component of FIG. 2. .

Referring to FIGS. 3 and 4 , external air flowing into the plurality of microtubes 300 may be arranged to be discharged in a direction different from the inflow direction.

As shown in FIG. 3, a plurality of microtubes 300 may be arranged in a plurality of rows. In this case, the outside air passes through the space between the plurality of microtubes 300 arranged in the first row, and the incoming outside air collides with the microtubes 300 and moves in a different direction.

In other words, when looking at the outside air flowing into the space between the microtubes 300 from the front, the microtubes 300 can be arranged so that the outside air is not discharged along the same line.

In one embodiment, the microtubes 300 are arranged to have a plurality of rows, and the microtubes 300 arranged in even rows may be arranged in the space between the microtubes 300 arranged in odd rows.

At this time, the distance d1 between the microtubes 300 arranged in the same row may be smaller than or equal to the diameter D1 of the microtubes 300. This is to prevent outside air from passing directly through the heat exchanger when viewed from the front.

Additionally, the distance d2 between the microtubes 300 in the row in which the microtubes 300 are arranged may be arranged to be equal to or smaller than the diameter D1 of the microtubes 300. This has the same purpose as the arrangement structure of the microtubes 300 in the row.

In this way, the microtubes 300 having rows and columns may be arranged identically when viewed from the front and from the side.

The plurality of microtubes 300 may be arranged so that all sides of the microtubes 300 are in contact with external air. In a conventional heat exchanger, the direction of heat exchange as air flows in and out is limited by the direction (front direction) of the tubes and fins.

However, in the present invention, by using the structure of the microtube 300, external air can be introduced not only through the front but also through the side without direction restrictions, and no matter which direction the external air enters, it collides with the microtube 300 and exchanges heat. Efficiency can be increased.

The microtube 300 may have a tube structure having a passage for the refrigerant to move through. There is no limit to the shape of the cross section, but it is desirable to have a cylindrical structure to smooth the movement of external air moving between the microtubes 300.

Additionally, a plurality of support members 320 supporting the first header tank 100 and the second header tank 200 may be disposed between the plurality of microtubes 300.

The support member 320 can solve the problem of weakening support when supporting the first header tank 100 and the second header tank 200 with only the microtube 300.

In one embodiment, the support member 320 may have a pillar structure with a filled interior. At this time, the support member 320 may have the same shape and cross-sectional size as the microtube 300, but is not limited thereto, and is larger than the microtube 300 at a radius that does not interfere with the arrangement of the plurality of microtubes 300. It may be provided to have a large diameter.

Additionally, the plurality of support members 320 are arranged at regular intervals between the arrangement of the microtubes 300 to maintain uniform support.

Figure 5 is a perspective view of a heat exchanger showing a state in which the heat conductor 330, which is a component of the present invention, is disposed.

In an embodiment of the present invention, a heat exchanger in which a heat conductor 330 is disposed between microtubes 300 to increase heat exchange efficiency will be described.

The heat exchanger according to an embodiment of the present invention includes a first header tank 100 and a second header tank 200 that are spaced apart to face each other, and is disposed between the first header tank 100 and the second header tank 200. A plurality of microtubes 300 connecting the first header tank 100 and the second header tank 200 and a heat conductor ( 330) may be included.

In this case, the outside air passing between the microtubes 300 may exchange heat with the microtubes 300 and the heat conductor 330 to increase heat exchange efficiency.

The heat conductor 330 contacts the microtube 300 and receives heat from the refrigerant passing through the microtube 300 to exchange heat with the outside air.

The heat conductor 330 may be made of a metal with high thermal conductivity, and a material different from that of the microtube 300 may be used.

FIG. 6 is an enlarged view showing the arrangement of the spiral heat conductor 330, which is a component of FIG. 5, and FIG. 7 is a first embodiment showing the arrangement of the heat conductor 330, which is a component of FIG. 5.

Referring to FIGS. 6 and 7 , the heat conductor 330 may have a spiral structure.

The heat conductor 330 may have the same length as the microtubes 300, and may not only increase heat conduction efficiency but also support the gap between the microtubes 300.

The heat conductor 330 may be arranged between four microtubes 300 to have four contact points per rotation. At this time, the microtubes 300 may be arranged in rows and columns, and at this time, each microtube 300 may contact the two heat conductors 330 to exchange heat.

The heat conductor 330, which has four contact points, can stably support the microtubes 300 by contacting them at 90-degree intervals and simultaneously perform the role of supporting the microtubes 300.

FIG. 8 is a second embodiment showing the arrangement structure of the heat conductor 330, which is a component of FIG. 5.

Referring to FIG. 8, one heat conductor 330 may be placed in contact with one microtube 300. At this time, the microtubes 300 may have an array structure arranged to cross each other, and the heat conductor 330 having a spiral structure may be arranged to have three contact points per rotation. As shown in FIG. 8, the contact point between the heat conductor 330 and the microtube 300 may be arranged to form a triangle, and each microtube 300 may have an arrangement structure in contact with one heat conductor 330. You can.

The arrangement structure of the heat conductor 330 shown in FIGS. 6 to 8 is an embodiment to ensure drainage and heat transfer performance, and the heat conductor 330 is not wrapped around the microtube 300, but around the heat conductor 330. It has a structure surrounded by a microtube 300.

The spiral-shaped heat conductor 330 can provide excellent heat transfer performance in the microtubes 300, but it is difficult to place all of the numerous microtubes 300 and is difficult to apply because it is accompanied by a high pressure drop.

Therefore, the arrangement of the heat conductor 330 can be modified in various ways to minimize the increase in pressure drop and ensure heat transfer efficiency, and the arrangement may vary depending on the size and arrangement of the microtubes 300.

Figure 9 is another example of the heat conductor 330, which is a component of Figure 5, and Figure 10 is a cross-sectional view showing the arrangement structure of Figure 9.

Referring to FIGS. 9 and 10 , one region of the heat conductor 330 may make line contact or surface contact with the microtube 300.

The microtube 300 of the present invention is described based on a structure in which the heat conductor 330, which is a spiral spring structure, is in contact, but is not limited to this and can be modified into various structures to increase the contact area with the microtube 300. It can be implemented.

One region of the heat conductor 330 may have a curved surface that is recessed, and heat conduction efficiency can be increased by contacting one region of the microtube 300. Heat transfer efficiency from the microtube 300 to the heat conductor 330 can be increased through line or surface contact. The microtube 300 can be expected to have a position fixing effect through line or surface contact with one area of the heat conductor 330.

In Figure 10, the heat conductor 330 is shown as an example in contact with three microtubes 300, but it is not limited to this and may have a structure in contact with a various number of microtubes 300. The heat conductor 330 may have a polygonal structure equal to the number of microtubes 300 in contact. In this case, the area of each vertex is formed with an indented curved surface, making line or surface contact with the microtubes 300. Heat exchange efficiency can be increased.

Figure 11 is a diagram showing the arrangement structure of a general baffle 120. Figure 12 is a side view of Figure 11.

Referring to Figures 11 and 12, the header tank of the heat exchanger is provided by combining a header 110 and a tank, and is divided into a first compartment and a second compartment through a partition wall 111. At this time, the baffle 120 closes one area of the compartment to form a flow of refrigerant and guides the movement position of the refrigerant.

At this time, the baffle 120 is inserted and fixed into the insertion hole formed in the header 110. The baffle 120 must be coupled in close contact with the side of the first or second compartment to control the flow of refrigerant.

However, in the case of a heat exchanger using the microtube 300, the microtube 300 penetrates the header 110 of the first header tank 100 and is joined by brazing welding, so the microtube 300 ) The baffle 120 cannot be located in the area where ) is placed.

Therefore, the microtube 300 cannot be placed in the area where the baffle 120 is placed, and a path appears in one area as shown in FIG. 10. This pass has the problem of reducing heat exchange efficiency.

Figure 13 is a first example of the arrangement structure of the baffle 120 according to an embodiment of the present invention, Figure 14 is a second example of the arrangement structure of the baffle 120 according to an embodiment of the present invention, and Figure 15 is a third example of the arrangement structure of the baffle 120 according to an embodiment of the present invention.

Referring to Figures 13 to 15, the heat exchanger according to an embodiment of the present invention includes a first header tank 100 and a second header tank 200, the first header tank 100 and the 2 A plurality of microtubes 300 disposed between the header tanks 200 and connecting the first header tank 100 and the second header tank 200, and a first header tank disposed on both sides of the microtubes 300 ( 100) and the first plate 150 and the second plate 170 supporting the second header tank 200, and at least one of the first header tank 100 and the second header tank 200 is the header 110. It is provided with a partition wall 111 that divides the inside of the tank into a first flow path and a second flow path, and a baffle 120 disposed in at least one of the first flow path and the second flow path, and the baffle 120 is connected to the partition wall 111 and the second flow path. It can be arranged to have an acute angle.

In the present invention, the baffle 120 has a plate structure and can block the arranged flow path to induce a downward or upward flow of refrigerant.

The microtube 300 cannot be placed under the baffle 120, which is disposed at an acute angle. A path is formed in the area of the baffle 120 where the microtube 300 is not disposed.

However, when viewed from the direction in which air flows, no area does not pass through the microtube 300, which can increase heat exchange efficiency.

The angle formed by the baffle 120 and the partition wall 111 is not limited and can be modified in various ways depending on the movement amount and flow of the refrigerant.

Additionally, the baffle 120 may be integrally formed and disposed across the first flow path and the second flow path through the partition wall 111. In this case, the baffle 120 and the partition wall 111 may be provided with grooves (not shown) for mutual coupling, and may be fitted together.

The baffle 120 may be divided into a first baffle 120 disposed in the first flow path and a second baffle 120 disposed in the second flow path. The first baffle 120 and the second baffle 120 may have different arrangements. The first baffle 120 and the second baffle 120 may be arranged to have different angles from the partition wall 111.

In one embodiment, as shown in FIG. 15, the first baffle 120 and the second baffle 120 may have a symmetrical structure with respect to the partition wall 111.

In this way, the end of the baffle 120 arranged to have an acute angle with the partition wall 111 may have the same angle as the acute angle formed by the partition wall 111 and the baffle 120.

This is to increase adhesion and coupling force with the side of each flow path by having the baffle 120 at an angle.

Additionally, the first baffle 120 and the second baffle 120 disposed in each of the first flow path and the second flow path may be arranged on different lines.

As shown in Figure 14. The first baffle 120 and the second baffle 120 may be coupled to the partition wall 111 so as to be close to vertical. In this case, a path may be formed in the first flow path due to the first baffle 120, and a path may be formed in the second flow path due to the second baffle 120.

However, when viewed from the overall air inflow direction, there is no path through which the incoming air passes directly. Through this, the heat exchange efficiency of the microtube 300 can be increased.

FIG. 16 is a graph comparing the heat dissipation performance according to the arrangement structure of the baffle 120 of FIG. 11 and the embodiment of the present invention that blocks the air flow area.

Table 1 is a table comparing the values in FIG. 16.

sample air flow rate Ref.Mass Flow DPair DPref Heat Capacity ( ^m3 /hr) (kg/hr) (Pa) (KPa) (W) first sample 500 120.1 140.96 86.60 4139 450 113.5 115.48 78.57 3924 400 107.2 92.14 68.78 3690 300 86.9 53.38 48.42 2988 200 62.7 25.01 25.92 2163 second sample 500 130.3 219.04 100.31 4505(109%) 450 123.4 179.12 91.49 4271(109%) 400 116.4 144.35 80.72 3999(108%) 300 95.7 83.92 58.21 3312(111%) 200 70.3 39.84 31.58 2421(112%)

Referring to FIG. 16 and Table 1, the first sample is a heat exchanger in which microtubes 300 are generally used, and the second sample is a heat exchanger in which a portion (5.2%) of the air oil area is blocked. It is a heat exchanger. It can be seen that all values increase in the second sample depending on the flow rate, and the heat dissipation performance is improved by about 8 to 12%. In Figures 13 to 15, the baffle 120 causes the microtube ( 300) and an embodiment of the arrangement structure of the baffle 120 to prevent duct flow in which heat exchange does not occur, but it is not limited to this, and various arrangements are made to prevent duct flow occurring in the air inflow direction. Modifications may be made. The above embodiment exemplifies that the first header tank 100 and the second header tank 200 have a plurality of flow paths through a partition, but the first header tank 100 is not limited thereto. A modification is possible in the case where the second header tank 200 has one passage.

In one embodiment, the first header tank 100 and the second header tank 200 are arranged to be spaced apart to face each other, and the first header tank 100 and the second header tank 200 are arranged between the first header tank 100 and the second header tank 200. A plurality of microtubes 300 connecting the tank 100 and the second header tank 200, and at least one of the first header tank 100 and the second header tank 200 is provided with a baffle 120, The baffle 120 may be arranged so that external air flowing toward the microtube 300 collides with at least one microtube 300 by adjusting the arrangement position of the microtube 300 .

In this case, the baffle 120 is arranged to have an inclination to eliminate the pass that occurs when the baffle 12 is placed vertically in the header tank, and to allow the incoming outside air to collide with at least one microtube to improve heat exchange efficiency. It can increase.

FIG. 17 is a perspective view showing the structure of the first plate 150 and the second plate 170 of the present invention, and FIG. 18 is a perspective view showing the structure of the first plate 150 of FIG. 17. This is an enlarged view, and FIG. 19 is an enlarged view showing the structure of the second plate 170 of FIG. 17.

Referring to FIGS. 17 to 19, the heat exchanger according to the embodiment of the present invention includes a first header tank 100 and a second header tank 200, the first header tank 100 and the second header arranged to be spaced apart from each other to face each other. A plurality of microtubes 300 disposed between the tanks 200 and connecting the first header tank 100 and the second header tank 200, and a first header tank disposed on both sides of the plurality of microtubes 300. It includes a first plate 150 and a second plate 170 that support (100) and the second header tank 200, and the first plate 150 has at least one first buffer groove 151, At least one second buffer groove 171 may be disposed in the second plate 170.

In the heat exchanger using the microtube 300, the microtube 300 is joined to the first header tank 100 and the second header tank 200 through brazing welding. A heat exchanger using a plurality of microtubes 300 has the advantage of ensuring sufficient heat dissipation performance, but since the diameter of the microtubes 300 becomes smaller, problems with bending may occur.

If the microtube 300 is bent, not only does a problem occur externally, but the main design dimensions are not reflected in the effective area, and unnecessary air flow resistance increases, so there is a risk that the performance advantage may be reduced.

The cause of this problem is due to the difference in the speed of temperature change between each part during brazing welding. The internal parts of the heat exchanger are made of aluminum and have the same coefficient of thermal expansion, but temperature differences occur for each part within the furnace depending on the volume, shape, and location of the parts.

In the case of the microtube 300, the cross-sectional area of the material is very small, so the speed of temperature change is very fast, and due to lack of rigidity, it shrinks or expands very easily.

In addition, due to the rapid temperature change characteristic, a temperature difference occurs between the microtubes 300, and a larger temperature difference occurs between the first plate 150 and the second plate 170, which must contract or expand in the same direction. do. Due to the temperature difference between the highly rigid first plate 150 and the second plate 170 and the microtube 300, the amount of deformation of the microtube 300 further increases.

In the present invention, in order to solve this problem, buffer grooves were formed on the first plate 150 and the second plate 170, respectively, so that the elongation direction of the microtube 300 can change together.

A plurality of first buffer grooves 151 may be arranged on the first plate 150, and a plurality of second buffer grooves 171 may be arranged on the second plate 170. The first plate 150 may be provided with an inlet flow path and an outlet flow path, and may be connected to a manifold for connection to the outside.

In one embodiment, the first buffer groove 151 and the second buffer groove 171 may be provided to have a width of 0.5 to 2.0 mm to facilitate change and secure support. The buffer groove can be modified to various widths depending on the size of the entire heat exchanger and the degree of support.

As shown in FIGS. 18 and 19, the number of first buffer grooves 151 and second buffer grooves 171 formed on the first plate 150 and the second plate 170 may vary. This may vary depending on the arrangement of components placed on the plate.

Each of the first buffer groove 151 and the second buffer groove 171 may include a pair of cut grooves 151a and 171a.

At this time, the openings of the cutting grooves 151a and 171a may be arranged in opposite directions. The first buffer groove 151 and the second buffer groove 171 can be deformed together when the microtube 300 is deformed through the pair of cut grooves 151a and 171a, and the openings are formed in opposite directions. It can prevent the entire heat exchanger from twisting or bending.

Additionally, the pair of cut grooves 151a and 171a may be arranged horizontally to each other or may be arranged to have an inclination.

The present invention may include at least one support plate 310 to support the microtube 300.

The support plate 310 is disposed in one area in the longitudinal direction of the plurality of microtubes 300 to adjust the spacing between the microtubes 300. The support plate 310 may be inserted and fixed into the first plate 150 and the second plate 170. In one embodiment, the support plate 310 may be inserted and fixed into a plurality of fixing grooves formed in the first plate 150 and the second plate 170.

The fixation line connecting the plurality of fixation grooves and the center line in the width direction of the cut grooves 151a and 171a may be arranged to intersect each other. In other words, the fixed line may be arranged in a direction perpendicular to the first plate 150 or the second plate 170.

In one embodiment, three support plates 310 are arranged to be spaced apart, and three second buffer grooves 171 may be formed in the second plate 170. At this time, the center line of the second buffer groove 171 disposed in the center and the fixed line of the support plate 310 are arranged to intersect on the second plate 170, and the center lines of the second buffer groove 171 disposed on both sides are positioned on both sides. It may be arranged outside of the fixing line of the support plate 310, which is arranged as follows. This is to minimize the positional movement of the support plate 310 when deformation occurs in the second plate 170 due to the buffer groove.

In addition, the plurality of support plates 310 are arranged symmetrically with respect to the support plate 310 disposed in the center, so that the deformation occurring in the microtube 300 can be symmetrically accommodated.

FIG. 20 is another example of the first plate 150 and the second plate 170 shown in FIG. 17, and FIG. 21 is a view showing the first plate 150 and the second plate 170 shown in FIG. 20. am.

20 and 21, the first plate 150 and the second plate 170 have a first buffer groove 151 and a second buffer groove (151) above and below the support plate 310 fixed at the center. 171) can be deployed.

In addition, the first buffer groove 151 formed on the first plate 150 and the second buffer groove 171 formed on the second plate 170 are provided in the same shape, so that the first plate 150 and the second plate 150 (170) can induce deformation to occur at the same location

FIG. 22 is a diagram showing embodiments of the shape of the first buffer groove 151 or the second buffer groove 171 of FIG. 17.

As shown in (a) of FIG. 22, the buffer groove 151 may be arranged in a direction perpendicular to the plate.

As shown in (b) of FIG. 22, the buffer groove 151 may be disposed on the plate, and the cut portion may be disposed on both sides of the diagonal line so that the connection portion appears in one central area.

As shown in (c) of FIG. 22, the buffer groove 151 may be arranged in a diagonal arrangement as described in FIGS. 17 to 21 above.

Figure 22(d) shows a structure in which the size of the buffer groove 151 is increased.

In this way, the buffer groove 151 is transformed into various shapes, arrangements, and widths depending on the arrangement of the support plate 310 connected to the first plate 150 or the second plate 170 or the diameter or thickness of the microtube 300. It can be implemented.

Meanwhile, hereinafter, a method of manufacturing a heat exchanger according to another embodiment of the present invention will be described with reference to the attached drawings. However, the description will be omitted for items that are the same as those described in the heat exchanger according to an embodiment of the present invention.

Figure 23 is a flow chart showing a manufacturing method for manufacturing the heat exchanger of Figure 17. In the description of FIG. 23, the same reference numerals as those of FIGS. 1 to 22 indicate the same members, and detailed description will be omitted.

Referring to FIG. 23, a heat exchanger manufacturing method, which is another embodiment of the present invention, may include a component assembly step (S100), a brazing welding step (S200), and a cooling step (S300).

The component assembly step (S100) is a step of temporarily assembling the component parts of the heat exchanger. The component assembly step (S100) is arranged between the first header tank 100 and the second header tank 200, and the first header tank 100 and the second header tank 200, which are spaced apart to face each other. A plurality of microtubes 300 connecting the first header tank 100 and the second header tank 200, and a first plate disposed on both sides of the microtubes 300 and having at least one buffer groove formed thereon. (150) and the second plate 170 can be provisionally assembled.

At this time, the assembly order of each component is irrelevant and can be modified in various ways to assemble the basic configuration of the heat exchanger, and the configurations of the heat exchanger mentioned above may be additionally included.

The brazing welding step (S200) may braze and weld the components provisionally assembled in the component assembly step (S100). Brazing welding uses capillary action and is a welding method that creates an appropriate joint gap between clads and allows molten filler metal to flow and fill the joint gap by capillary action.

When the temperature rises to a high temperature in the brazing welding step (S200), the microtube 300 may expand. At this time, when the microtube 300 expands, the buffer grooves 151 and 171 formed in at least one of the first plate 150 and the second plate 170 react to alleviate the deformation of the microtube 300. .

The cooling step (S300) is a step in which the microtube 300, which has expanded due to an increase in temperature due to brazing welding, contracts due to a decrease in temperature. The expanded microtube 300 shrinks again when the temperature decreases. At this time, the buffer grooves 151 and 171 may react together when the microtube 300 shrinks to relieve deformation of the microtube.

Above, embodiments of the present invention have been examined in detail with reference to the attached drawings.

The above description is merely an illustrative explanation of the technical idea of the present invention, and various modifications, changes, and substitutions can be made by those skilled in the art without departing from the essential characteristics of the present invention. will be. Accordingly, the embodiments disclosed in the present invention and the attached drawings are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments and the attached drawings. . The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

100: 1st header tank
101: Inflow flow path
103: Outflow flow path
110: header
111: bulkhead
120: Baffle
150: first plate
151: 1st buffer groove
151a, 171a: Cut groove
170: second plate
171: Second buffer groove
200: 2nd header tank
300: fine tube
310: support plate
320: support member
330:Heat conductor

Claims (14)

A first header tank and a second header tank arranged to be spaced apart and face each other;
a plurality of microtubes disposed between the first header tank and the second header tank and connecting the first header tank and the second header tank;
a first plate supporting the first header tank and the second header tank disposed on both sides of the microtube and having a first buffer groove formed thereon, and a second plate having a second buffer groove formed thereon; and
A support plate for adjusting the spacing of the microtubes in one area in the longitudinal direction of the plurality of microtubes;
It includes, wherein the support plate is fixed to fixing grooves formed on the first plate and the second plate, three support plates are arranged to be spaced apart, and three second buffer grooves are formed in the second plate. A center line extending in the longitudinal direction from the center of the second buffer groove disposed in the center and a fixation line connecting the center of the fixation groove disposed in the center are arranged to intersect on the second plate, and second buffers are disposed on both sides. A heat exchanger characterized in that the center line extending longitudinally from the center of the groove is disposed outside the fixed lines connecting the centers of the fixed grooves disposed on both sides. delete According to claim 1,
Each of the first buffer groove and the second buffer groove includes a pair of cut grooves,
A heat exchanger wherein the cut grooves are arranged so that the openings face in opposite directions. According to clause 3,
A heat exchanger, characterized in that the cut grooves are arranged to be horizontal to each other. According to clause 4,
A heat exchanger, characterized in that the cut groove is arranged to be inclined at a predetermined angle with the longitudinal direction of the first plate and the second plate. According to clause 5,
A heat exchanger, wherein a center line extending longitudinally from the center of the cut groove and a fixing line of the support plate intersect each other. According to clause 6,
A heat exchanger, characterized in that the first buffer groove and the second buffer groove are arranged in different numbers. delete According to clause 7,
A heat exchanger, wherein the support plates disposed on both sides have a symmetrical structure with respect to the support plate disposed in the center. The method according to any one of claims 1 or 3 to 7 or 9,
A heat exchanger, characterized in that the microtube has a cylindrical structure. According to claim 10,
A heat exchanger characterized in that the microtubes have a diameter of 1 to 2 mm. According to claim 10,
A heat exchanger, characterized in that the microtube has a thickness of 0.1 to 0.3 mm. delete delete

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