KR102629710B1 - Cavity formation method of printed circuit board - Google Patents

Abstract

Disclosed is a method of forming a cavity in a printed circuit board that can prevent movement of the printed circuit board during processing by fixing the printed circuit board at a plurality of positions and prevent overprocessing due to incorrect input of processing path information.
The method of forming a cavity in a printed circuit board includes the steps of supplying a printed circuit board to a table, fixing the printed circuit board on the table, forming a processing boundary on the printed circuit board, and forming a cavity in the printed circuit board. Includes.

Description

Cavity formation method of printed circuit board}

The present invention relates to a method of forming a cavity in a printed circuit board.

In general, a multilayer printed circuit board is a board in which a printed circuit board including a prepreg formed by impregnating glass fiber with epoxy resin and a copper foil circuit formed on the surface of the prepreg is laminated in multiple layers.

Separate mounting components, such as chips, are connected to the multilayer printed circuit board. In this case, there is room for the mounting components to protrude outside the multilayer printed circuit board.

Accordingly, a concave cavity is formed in the multilayer printed circuit board at a portion where mounting components are connected.

Through this, the mounting components can be stably accommodated in the concave cavity without protruding to the outside of the multilayer circuit board.

Meanwhile, in the past, laser light was irradiated to a printed circuit board, and a portion of the printed circuit board was cut through this to form a cavity.

However, when forming a cavity through laser processing, there was a problem in that the prepreg was melted and settled due to the heat generated during laser processing, causing the printed circuit board to be deformed or damaged.

Additionally, conventionally, a cavity was formed in a printed circuit board using CNC-type printed circuit board processing equipment.

However, when forming a cavity on a printed circuit board using printed circuit board processing equipment, a tool with a relatively large diameter is rotated and transported at high speed for fast processing, which results in a large load on the printed circuit board during processing. There was a problem of cracks occurring or being damaged due to this application.

In addition, the conventional printed circuit board processing equipment does not completely fix the printed circuit board seated on the table, so there is a problem in that the printed circuit board flows during cavity processing, resulting in processing defects.

Meanwhile, the printed circuit board processing equipment processes the cavity while moving along a path set based on pre-entered processing data.

However, in the past, when machining path information is entered incorrectly into printed circuit board processing equipment and the cavity is processed beyond the set size, there is no separate means to limit machining, so incorrect input of machining path information There was a problem in that the incidence of defects was high, and as a result, printed circuit boards were used up and manufacturing costs increased.

Registered Patent Publication No. 10-0333627

The present invention was devised to solve the above problems. The purpose of the present invention is to prevent deformation of the printed circuit board due to high heat generated during processing by cutting the cavity, and to process the cavity step by step with a plurality of machining bits. To provide a method of forming a cavity of a printed circuit board that can be processed.

Another object of the present invention is to provide a method of forming a cavity of a printed circuit board that can prevent the flow of the printed circuit board during processing by fixing the printed circuit board at a plurality of positions and prevent overprocessing due to incorrect input of processing path information. It is provided.

The object of the present invention is not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

A method of forming a cavity of a printed circuit board according to an embodiment of the present invention to solve the above problem includes a table on which a printed circuit board is placed, a PCB transfer unit that transfers the printed circuit board to the table, and accommodation inside the table. an adsorption unit that generates a suction force to adsorb and support the printed circuit board, a substrate fixing jig disposed at each corner of the table along the circumference of the table to secure the printed circuit board, and a circumference of the table. A plurality of over-processing prevention units are arranged along the printed circuit board and form a processing boundary on the upper part of the printed circuit board, a processing unit with a processing bit mounted on an end and rotating the processing bit, and a processing unit that transfers the processing unit in horizontal and vertical directions. A cavity forming method of a printed circuit board using a PCB processing device including a processing transfer unit for forming a cavity in the printed circuit board with the processing bit, comprising: supplying the printed circuit board to the table; fixing the printed circuit board on the table; forming the processing boundary on the printed circuit board; and forming the cavity on the printed circuit board.

Forming a cavity in the printed circuit board includes transferring a first hole machining bit to the upper part of the machining start point; forming first guide holes of a preset depth on the printed circuit board by rotating and vertically lowering the first hole processing bit while moving along a preset processing path; Replacing the first hole-making bit with a first cutting bit having the same diameter as the first hole-making bit; Rotate the first cutting bit to insert the first cutting bit into the first guide hole formed at the machining start point to a first set depth, and then cut the printed circuit board while moving along the processing path. forming a portion of the cavity; Replacing the first cutting bit with a second hole-making bit having a larger diameter than the first hole-making bit; forming second guide holes by expanding the first guide holes with the second hole processing bit while moving along the processing path; Replacing the second hole-making bit with a second cutting bit having the same diameter as the second hole-making bit; and rotating the second cutting bit to insert the second cutting bit into the second guide hole formed at the machining start point to a second set depth, and then cutting the printed circuit board while moving along the processing path. It may include a step of forming the remaining part of the cavity.

The first hole-making bit rotates and descends at a faster speed than the second hole-making bit, and the first cutting bit may rotate at a faster speed than the second cutting bit.

The step of supplying a printed circuit board to the table includes: transferring the printed circuit board to a set position through a first PCB transfer unit when the printed circuit board is not placed on the table; and when the printed circuit board is transferred to the set position, adsorbing the printed circuit board through a second PCB transfer unit and transferring it to the upper part of the table.

The step of fixing the printed circuit board on the table includes placing a back up board having communication holes on the table; Placing the printed circuit board on the backup board; activating the adsorption unit to adsorb the back-up board placed on the table, and adsorbing the printed circuit board placed on the back-up board through the communication holes; and operating the substrate fixing jigs to support and fix the top and side surfaces of the printed circuit board at each corner of the printed circuit board.

The substrate fixing jig includes a lifting cylinder unit disposed on the table and configured to expand and contract along a vertical direction; It is disposed on the upper part of the lifting cylinder unit, extends along the horizontal direction, partially overlaps the upper part of the edge of the printed circuit board, and is lowered by the lifting cylinder unit to press and support the upper surface of the edge of the printed circuit board. a first cylinder unit; It is disposed between the lifting cylinder unit and the first cylinder unit, and when the first cylinder unit supports the upper surface of the corner of the printed circuit board, it extends in the horizontal direction to press and support the side of the corner of the printed circuit board. a second cylinder unit; It is disposed on the first cylinder unit, and when the first cylinder unit presses the upper surface of the corner of the printed circuit board, the reaction force of the printed circuit board is sensed and the pressing force of the first cylinder unit applied to the printed circuit board is a first load cell configured to measure; And disposed on the second cylinder unit, when the second cylinder unit presses the side of the edge of the printed circuit board, the reaction force of the printed circuit board is sensed and the pressing force of the second cylinder unit applied to the printed circuit board is applied to the printed circuit board. It may include a second load cell configured to measure.

The first cylinder unit includes: a first cylinder body coupled to and supported by an upper surface of the second cylinder unit and configured to expand and contract along a horizontal direction; A first jig coupled to the first cylinder body, having a first slide groove formed along a vertical direction therein, and having the first load cell disposed on an inner surface; It is accommodated in the first slide groove and can slide in the vertical direction along the inner surface of the first jig, and the upper surface of the corner of the printed circuit board is pressed by the first cylinder body or spaced apart from the printed circuit board. first pressure plate; and is disposed between the first load cell and the first pressure plate to elastically support the first pressure plate, and when the first pressure plate presses the upper surface of the corner of the printed circuit board, the first pressure plate and a first elastic member that transmits the reaction force of the printed circuit board transmitted through the first load cell, wherein the second cylinder unit is disposed between the first cylinder body and the lifting cylinder unit, and is located in a horizontal direction. a second cylinder body configured to expand and contract along; a second jig coupled to the second cylinder body, having a second slide groove formed therein along a horizontal direction, and having the second load cell disposed on an inner surface; It is accommodated in the second slide groove and can slide horizontally along the inner surface of the second jig, and presses the side of the corner of the printed circuit board by the second cylinder body or is spaced apart from the printed circuit board. a second pressure plate; and is disposed between the second load cell and the second pressure plate to elastically support the second pressure plate, and when the second pressure plate presses the side of the edge of the printed circuit board, the second pressure plate It may include a second elastic member that transmits the reaction force of the printed circuit board transmitted through the second load cell.

The step of operating the substrate fixing jigs to support and fix the top and side surfaces of the printed circuit board at each corner of the printed circuit board includes extending the lifting cylinder unit to position the first cylinder unit at a higher position than the printed circuit board. placing; extending the first cylinder unit and arranging the first pressure plate to overlap a corner of the printed circuit board; Pressing the upper surface of a corner of the printed circuit board with the first pressure plate while contracting the lifting cylinder unit; stopping contraction of the lifting cylinder unit when the reaction force of the printed circuit board detected by the first load cell reaches a preset value; Pressing a side edge of the printed circuit board with the second pressure plate while extending the second cylinder unit; and stopping the extension of the second cylinder unit when the reaction force of the printed circuit board detected by the second load cell reaches a preset value.

The over-processing prevention unit is disposed on the upper part of the printed circuit board and forms the processing boundary along the processing path, and when an external force is applied along the horizontal direction, it transmits a stop command signal to the processing unit to prevent the rotation of the processing bit. a sensing bar configured to stop; a first bar transfer unit rotatably coupled to the sensing bar and configured to transport the sensing bar in left and right directions; a bar rotation control motor supported by the first bar transfer unit and coupled to the sensing bar, and generating rotational force to control rotation of the sensing bar; and a second bar transfer unit configured to support the first bar transfer unit and transfer the first bar transfer unit in the forward and backward directions.

The step of forming a processing boundary on the printed circuit board includes confirming the processing path of the position where the sensing bar is to be placed, and controlling the bar rotation control motor to move the sensing bar to a processing path corresponding to the positioning of the sensing bar. placing at an angle; and controlling the first bar transfer unit and the second bar transfer unit to transfer the sensing bar to a position corresponding to the processing path.

The sensing bar includes a bracket portion rotatably coupled to an end of the first bar transfer unit and rotationally controlled by the bar rotation control motor; a bar housing coupled to and supported by the bracket unit and having an enclosure structure with one side open; a first detection sensor disposed inside the bar housing and configured to detect an external force applied in a horizontal direction; a movable bar that is slidably coupled to the inner surface of the bar housing, a portion of which is exposed to the outside through one surface of the bar housing, and is inserted into the interior of the bar housing when an external force is applied in the horizontal direction; It is accommodated inside the bar housing and disposed between the first detection sensor and the moving bar, and when the moving bar is inserted into the inside of the bar housing, it is pressed and compressed by the moving bar and presses the first detection sensor, An elastic support unit that restores the moving bar to its original state by pressing the moving bar and restoring it by elastic force when the external force applied to the moving bar is released; and bit support rollers that are rotatably coupled to the moving bar, a portion of which is exposed to the outside of the moving bar, and are rotated by the machining bit when the machining bit contacts them to distribute the load of the machining bit. there is.

According to an embodiment of the present invention, since the cavity is cut using a machining bit, deformation of the printed circuit board due to high heat generated during machining can be prevented.

In addition, by gradually forming cavities in the printed circuit board by applying multiple hole processing bits and multiple cutting bits with different diameters in stages, the load applied to the printed circuit board during processing can be minimized. This can prevent cracks and damage to printed circuit boards.

In addition, since the printed circuit board is fixed in multiple positions through board fixing jigs, the printed circuit board is completely fixed on the table, preventing movement of the printed circuit board during processing, thereby preventing processing defects due to movement of the printed circuit board. can be prevented.

In addition, by forming a processing boundary through the over-processing prevention unit, it is possible to prevent over-processing of the processing bit beyond the set area due to incorrect input of processing path information, thereby reducing component consumption due to incorrect processing of the printed circuit board. This can reduce manufacturing costs.

The effects according to the present invention are not limited to the details exemplified above, and further various effects are included within the present invention.

1 is a front view schematically showing a PCB processing device according to an embodiment of the present invention.
Figure 2 is a plan view schematically showing substrate fixing jigs and an overprocessing prevention unit according to an embodiment of the present invention.
Figure 3 is a front view schematically showing a first cylinder unit according to an embodiment of the present invention.
Figure 4 is a front view schematically showing a second cylinder unit according to an embodiment of the present invention.
Figure 5 is a diagram schematically showing the internal structure of a sensing bar according to an embodiment of the present invention.
6 to 11 are flowcharts showing a method of forming a cavity of a printed circuit board according to an embodiment of the present invention.
Figure 12 is a diagram schematically showing the process of forming a cavity in a printed circuit board according to an embodiment of the present invention.

Hereinafter, embodiments will be described in detail with reference to the attached drawings. However, various changes can be made to the embodiments, so the scope of the patent application is not limited or limited by these embodiments. It should be understood that all changes, equivalents, or substitutes for the embodiments are included in the scope of rights.

Specific structural or functional descriptions of the embodiments are disclosed for illustrative purposes only and may be modified and implemented in various forms. Accordingly, the embodiments are not limited to the specific disclosed form, and the scope of the present specification includes changes, equivalents, or substitutes included in the technical spirit.

Terms such as first or second may be used to describe various components, but these terms should be interpreted only for the purpose of distinguishing one component from another component. For example, a first component may be named a second component, and similarly, the second component may also be named a first component.

When a component is referred to as being “connected” to another component, it should be understood that it may be directly connected or connected to the other component, but that other components may exist in between.

The terms used in the examples are for descriptive purposes only and should not be construed as limiting. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as “comprise” or “have” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the technical field to which the embodiments belong. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless explicitly defined in the present application, should not be interpreted in an ideal or excessively formal sense. No.

In addition, when describing with reference to the accompanying drawings, identical components will be assigned the same reference numerals regardless of the reference numerals, and overlapping descriptions thereof will be omitted. In describing the embodiments, if it is determined that detailed descriptions of related known technologies may unnecessarily obscure the gist of the embodiments, the detailed descriptions are omitted.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims.

In the embodiments of the present invention, unless otherwise defined, all terms used herein, including technical or scientific terms, are the same as those commonly understood by a person of ordinary skill in the technical field to which the present invention pertains. It has meaning. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless clearly defined in the embodiments of the present invention, have an ideal or excessively formal meaning. It is not interpreted as

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are illustrative, and the present invention is not limited to the matters shown. Additionally, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

When an element or layer is referred to as “on” another element or layer, it includes instances where the element or layer is directly on top of or intervening with another element. Like reference numerals refer to like elements throughout the specification.

The size and thickness of each component shown in the drawings are shown for convenience of explanation, and the present invention is not necessarily limited to the size and thickness of the components shown.

Each feature of the various embodiments of the present invention can be partially or fully combined or combined with each other, and as can be fully understood by those skilled in the art, various technical interconnections and operations are possible, and each embodiment may be implemented independently of each other. It may be possible to conduct them together due to a related relationship.

Figure 1 is a front view schematically showing a PCB processing device according to an embodiment of the present invention, and Figure 2 is a plan view schematically showing substrate fixing jigs and an overprocessing prevention unit according to an embodiment of the present invention.

Referring to Figures 1 and 2, the method of forming a cavity (C) of a printed circuit board (PCB) according to an embodiment of the present invention (hereinafter referred to as the 'cavity (C) forming method') uses a PCB processing device 1000. It is carried out through

The PCB processing device 1000 includes a table 1 on which a printed circuit board (PCB) is placed, and a PCB transfer unit 2 that transfers the printed circuit board (PCB) to the table 1.

The PCB transfer unit 2 may include a first PCB transfer unit 21 and a second PCB transfer unit 22.

The first PCB transfer unit 21 transfers the printed circuit board (PCB) to the set position when the printed circuit board (PCB) is not placed on the table (1), and when the printed circuit board (PCB) is placed on the table (1) Stop the transfer.

For example, the first PCB transfer unit 21 includes a plurality of drive rollers arranged along the transfer direction of the printed circuit board (PCB), a roller drive motor that is coupled to one of the drive rollers to rotate the drive roller, and a drive motor that rotates the drive roller. It may include a power transmission chain that connects the rollers to rotate the driving rollers, and a substrate transport belt that is coupled to the outer surface of the driving rollers and rotates by the driving rollers to transport a printed circuit board (PCB).

When the printed circuit board (PCB) is transferred to the set position, the second PCB transfer unit 22 can adsorb the printed circuit board (PCB) and transfer it to the upper part of the table (1).

For example, the second PCB transfer unit 22 includes a robot arm formed in a multi-joint structure, an adsorption unit that is coupled to the end of the robot arm and generates a suction force to adsorb the printed circuit board (PCB), and the adsorption unit. It may include an elevating unit for elevating.

In addition, the PCB processing device 1000 further includes an adsorption unit 3 that is accommodated inside the table 1 and generates a suction force to adsorb and support the printed circuit board (PCB) and the backup board (BB).

In addition, the PCB processing device 1000 is disposed at each corner of the table 1 along the circumference of the table 1 and supports the top and side surfaces of the printed circuit board (PCB) to secure the printed circuit board (PCB). It further includes fixing jigs (4).

The substrate fixing jig 4 may include a lifting cylinder unit 41, a first cylinder unit 42, a second cylinder unit 43, a first load cell 44, and a second load cell 45.

The lifting cylinder unit 41 is disposed on the table 1 and may be configured to expand and contract along the vertical direction. For example, the lifting cylinder unit 41 is coupled to a body part configured to expand and contract its length through electricity or fluid, and an end of the body part to support the second cylinder unit 43, and the second cylinder unit 43 ) may include a lifting block unit that raises and lowers.

The first cylinder unit 42 may be disposed on the upper part of the lifting cylinder unit 41.

When the printed circuit board (PCB) is placed on the upper surface of the backup board (BB), the first cylinder unit 42 extends in the horizontal direction and partially overlaps the upper edge of the printed circuit board (PCB), and is a lifting cylinder unit. It can be lowered by (41) to press and support the upper surface of the corner of the printed circuit board (PCB).

Figure 3 is a front view schematically showing a first cylinder unit according to an embodiment of the present invention.

Referring to FIG. 3 , the first cylinder unit 42 may include a first cylinder body 421, a first jig 422, a first pressure plate 423, and a first elastic member 424.

The first cylinder body 421 is coupled to and supported on the upper surface of the second cylinder unit 43, and may be configured to expand and contract along the horizontal direction. For example, the first cylinder body 421 may be configured to expand and contract through electricity or fluid.

The first jig 422 may be coupled to the first cylinder body 421.

A first slide groove 422A may be formed inside the first jig 422 along the vertical direction.

A first load cell 44 may be disposed on the inner surface of the first jig 422.

The first pressure plate 423 is accommodated in the first slide groove 422A and can slide in the vertical direction along the inner surface of the first jig 422, and is moved to a printed circuit board (PCB) by the first cylinder body 421. ) can be pressed on the upper surface of the corner or separated from the printed circuit board (PCB).

The first elastic member 424 is disposed between the first load cell 44 and the first pressure plate 423 to elastically support the first pressure plate 423, and the first pressure plate 423 is a printed circuit. When the upper surface of the edge of the PCB is pressed, the reaction force of the printed circuit board (PCB) transmitted through the first pressure plate 423 can be transmitted to the first load cell 44.

Referring to FIG. 1, the second cylinder unit 43 is disposed between the lifting cylinder unit 41 and the first cylinder unit 42, and the first cylinder unit 42 is located at the corner of the printed circuit board (PCB). When the upper surface is supported, it expands in the horizontal direction to press and support the sides of the corners of the printed circuit board (PCB).

Figure 4 is a front view schematically showing a second cylinder unit according to an embodiment of the present invention.

Referring to FIG. 4 , the second cylinder unit 43 may include a second cylinder body 431, a second jig 432, a second pressure plate 433, and a second elastic member 434.

The second cylinder body 431 is disposed between the first cylinder body 421 and the lifting cylinder unit 41 and may be configured to expand and contract along the horizontal direction. For example, the second cylinder body 431 may be configured to expand and contract through electricity or fluid.

The second jig 432 may be coupled to the second cylinder body 431.

A second slide groove 432A may be formed inside the second jig 432 along the horizontal direction.

A second load cell 45 may be disposed on the inner surface of the second jig 432.

The second pressure plate 433 is accommodated in the second slide groove 432A and can slide in the horizontal direction along the inner surface of the second jig 432, and is moved to a printed circuit board (PCB) by the second cylinder body 431. ) can be pressed on the side of the corner or spaced apart from the printed circuit board (PCB).

The second elastic member 434 is disposed between the second load cell 45 and the second pressure plate 433 to elastically support the second pressure plate 433, and the second pressure plate 433 is connected to the printed circuit. When the side of the edge of the board (PCB) is pressed, the reaction force of the printed circuit board (PCB) transmitted through the second pressure plate 333 can be transmitted to the second load cell 35.

Referring to FIG. 3, the first load cell 44 is disposed on the first cylinder unit 42, and when the first cylinder unit 42 presses the upper surface of the corner of the printed circuit board (PCB), the printed circuit board (PCB) ) may be configured to measure the pressing force of the first cylinder unit 42 applied to the printed circuit board (PCB) by detecting the reaction force. For example, the first load cell 44 may be implemented as a regular load cell.

Referring to FIG. 4, the second load cell 45 is disposed on the second cylinder unit 43, and when the second cylinder unit 43 presses the side of the edge of the printed circuit board (PCB), the printed circuit board (PCB) ) may be configured to measure the pressing force of the second cylinder unit 43 applied to the printed circuit board (PCB) by detecting the reaction force. For example, the second load cell 45 may be implemented as a regular load cell.

Referring to FIGS. 1 and 2 , the PCB processing device 1000 may further include an overprocessing prevention unit 5 .

The overprocessing prevention portion 5 is arranged in plural numbers along the circumference of the table 1 and forms a processing boundary (PB) on the upper part of the printed circuit board (PCB).

The over-processing prevention unit 5 may include a sensing bar 51, a first bar transfer unit 52, a bar rotation control motor 53, and a second bar transfer unit 54.

Figure 5 is a diagram schematically showing the internal structure of a sensing bar according to an embodiment of the present invention.

Referring to Figures 2 and 5, the sensing bar 51 is placed on the upper part of the printed circuit board (PCB) to form a processing boundary (PB) along the processing path, and when an external force is applied along the horizontal direction, the processing unit 6 ) can be configured to stop the rotation of the machining bit (B) by transmitting a stop command signal.

The detection bar 51 may include a bracket part 511, a bar housing 512, a first detection sensor 513, a moving bar 514, an elastic support part 515, and bit support rollers 516. .

The bracket portion 511 is rotatably coupled to the end of the first bar transfer unit 52 and can be rotationally controlled by the bar rotation control motor 53.

The bar housing 512 is supported by being coupled to the bracket portion 511 and may be formed as a housing structure with one side open.

The first detection sensor 513 is disposed inside the bar housing 512 and can detect an external force applied in the horizontal direction and transmit a stop command signal to the processing unit 6. For example, the first detection sensor 513 may be implemented as a load cell or pressure sensor.

The movable bar 514 is slidably coupled to the inner surface of the bar housing 512 so that a portion of it is exposed to the outside through one side of the bar housing 512, and when an external force is applied in the horizontal direction, the inside of the bar housing 512 It can be inserted as .

The elastic support portion 515 may be accommodated inside the bar housing 512 and disposed between the first detection sensor 513 and the moving bar 514.

When the moving bar 514 is inserted into the bar housing 512, the elastic support portion 515 is pressed and compressed by the moving bar 514, pressuring the first detection sensor 513, and applying pressure to the moving bar 514. When the external force is released, the moving bar 514 can be restored to its original state by pressing it while being restored by elastic force.

The bit support rollers 516 are rotatably coupled to the moving bar 514 so that a portion is exposed to the outside of the moving bar 514, and when the machining bit B touches the machining bit B, it is rotated and processed. The load of the bit (B) can be distributed.

The first bar transfer unit 52 is rotatably coupled to the sensing bar 51 at an end and may be configured to transport the sensing bar 51 in the left and right directions.

For example, the first bar transfer unit 52 may be implemented as a multi-stage cylinder unit that is arranged parallel to the left and right directions and can be expanded and contracted to a preset length.

The bar rotation control motor 53 is supported by the first bar transfer unit 52 and coupled to the sensing bar 51, and generates rotational force to control the rotation of the sensing bar 51.

The second bar transfer unit 54 supports the first bar transfer unit 52 and may be configured to transfer the first bar transfer unit 52 in the forward and backward directions.

For example, the second bar transfer unit 54 includes a plurality of support units arranged along the front-back direction, a screw shaft rotatably coupled to the support units, and a shaft coupled to the end of the screw shaft to rotate the screw shaft. A transfer nut that is coupled to the drive motor and the screw shaft to support the first bar transfer unit 52 and moves along the outer surface of the screw shaft when the screw shaft is rotated to transfer the first bar transfer unit 52 in the front and rear directions, and It may include a guide shaft coupled to the support units and disposed on one side of the screw shaft, and coupled to the transfer nut to enable sliding movement in the front-back direction.

Referring to FIG. 1, the PCB processing device 1000 further includes a processing unit 6, a processing transfer unit 7, and a control unit (not shown).

The processing unit 6 is equipped with a processing bit (B) at its end, and the processing bit (B) can be rotated.

The processing unit 6 can be transferred horizontally and vertically by the transfer unit 7.

For example, the processing unit 6 includes a chuck to which the processing bit B is detachably coupled, a spindle rotatably coupled to the transfer unit 7, and a spindle accommodated in the transfer unit 7 and generating a rotational force through the spindle. It may include a motor that transmits rotational force to the chuck to rotate the processing bit (B).

The processing transfer unit 7 transfers the processing unit 6 in horizontal and vertical directions to form a cavity (C) in the printed circuit board (PCB) with a processing bit (B).

The control unit (not shown) is electrically connected to each component of the PCB processing device 1000 and can control each component of the PCB processing device 1000.

The control unit may transmit control commands to each component of the PCB processing device 1000 based on processing data transmitted from the input device and perform processing through this.

Below, the method of forming the cavity (C) will be described.

6 to 11 are flowcharts showing a method of forming a cavity of a printed circuit board according to an embodiment of the present invention.

Referring to FIGS. 1 and 6 , the PCB processing device 1000 supplies a printed circuit board (PCB) to the table 1 (S110).

Specifically, referring to FIGS. 1 and 8 , when a printed circuit board (PCB) is not placed on the table 1, the PCB processing device 1000 transfers the printed circuit board (PCB) through the first PCB transfer unit 21. Transfer to the set position (S111). When the printed circuit board (PCB) is transferred to the set position of the first PCB transfer unit 21, the PCB processing device 1000 adsorbs the printed circuit board (PCB) through the second PCB transfer unit 22 to the table (1). Transfer to the upper part (S112).

Referring to FIGS. 1 and 6 , when a printed circuit board (PCB) is supplied to the table 1, the printed circuit board (PCB) is fixed on the table 1 (S120).

Specifically, referring to FIGS. 1 and 9, the PCB processing apparatus 1000 places a back up board (BB) having communication holes (BB1) on the table (1) (S121). For example, the backing board BB may be made of wood. When the backup board (BB) is placed on the table (1), the PCB processing device 1000 places a printed circuit board (PCB) on the backup board (BB) (S122). When a printed circuit board (PCB) is placed on the back-up board (BB), the PCB processing device 1000 operates the adsorption unit 3 to adsorb the back-up board (BB) placed on the table 1 and connects the The printed circuit board (PCB) placed on the backup board (BB) is adsorbed through the holes (BB1) (S123). When the backup board (BB) and the printed circuit board (PCB) are adsorbed, the PCB processing device 1000 operates the substrate fixing jigs 4 to secure the printed circuit board (PCB) at each corner of the printed circuit board (PCB). Support and fix the top and sides (S124).

The process by which the board fixing jigs 4 support and fix the top and side surfaces of the printed circuit board (PCB) at each corner of the printed circuit board (PCB) will be described in more detail.

1 to 4 and 10, when the backup board (BB) and the printed circuit board (PCB) are adsorbed, the PCB processing device 1000 extends the lifting cylinder unit 41 to form the first cylinder unit 42. ) is placed at a higher position than the printed circuit board (PCB) (S1241). When the first cylinder unit 42 is placed at a higher position than the printed circuit board (PCB), the PCB processing device 1000 extends the first cylinder unit 42 to apply the first pressure plate 423 to the printed circuit board ( Arrange so that it overlaps on the edge of the PCB (S1242). When the first pressure plate 423 is disposed to overlap the edge of the printed circuit board (PCB), the PCB processing device 1000 contracts the lifting cylinder unit 41 and presses the printed circuit board with the first pressure plate 423. Press the upper surface of the (PCB) (S1243). When the upper surface of the printed circuit board (PCB) is pressed by the first pressure plate 423, the PCB processing device 1000 receives the reaction force of the printed circuit board (PCB) detected by the first load cell 44 in real time, When the reaction force of the printed circuit board (PCB) detected by the first load cell 44 reaches a preset value, the contraction of the lifting cylinder unit 41 is stopped (S1244). When the contraction of the lifting cylinder unit 41 is stopped, the PCB processing device 1000 expands the second cylinder unit 43 and presses the edge side of the printed circuit board (PCB) with the second pressure plate 433. (S1245). When the side of the edge of the printed circuit board (PCB) is pressed by the second pressure plate 433, the PCB processing device 1000 receives the reaction force of the printed circuit board (PCB) detected by the second load cell 45 in real time. And, when the reaction force of the printed circuit board (PCB) detected by the second load cell 45 reaches a preset value, the expansion of the second cylinder unit 43 is stopped (S1246).

Referring to FIGS. 1, 2, and 6, when the printed circuit board (PCB) is fixed on the table 1, the PCB processing device 1000 forms a processing boundary (PB) on the printed circuit board (PCB). Do it (S130).

Specifically, referring to FIGS. 1, 2, and 11, the PCB processing device 1000 checks the processing path of the position where the sensing bar 51 is to be placed, and controls the bar rotation control motor 53 to control the sensing bar. (51) is placed at an angle corresponding to the processing path at the position where the sensing bar 51 will be placed (S131).

When the sensing bar 51 is placed at an angle corresponding to the processing path, the PCB processing device 1000 processes the sensing bar 51 by controlling the first bar transfer unit 52 and the second bar transfer unit 54. It is transferred to a position corresponding to the path to form a processing boundary (PB) (S132).

Figure 12 is a diagram schematically showing the process of forming a cavity in a printed circuit board according to an embodiment of the present invention.

Referring to FIGS. 1 and 6 , when the processing boundary (PB) is formed, the PCB processing apparatus 1000 forms a cavity (C) in the printed circuit board (PCB) (S140).

Specifically, referring to FIGS. 1, 7, and 12, the PCB processing device 1000 transfers the first hole processing bit B1 (eg, drill) to the upper part of the processing start point (S141). Next, the CB processing device 1000 rotates and vertically lowers the first hole processing bit (B1) while moving along a preset processing path to create first guide holes (GH1) of a preset depth in the printed circuit board (PCB). ) to form (S142). Next, the CB machining device 1000 exchanges the first hole processing bit (B1) with a first cutting bit (B2) (e.g., end mill) having the same diameter as the first hole processing bit (B1) (e.g., end mill) ( S143). Next, the CB processing device 1000 rotates the first cutting bit (B2) and inserts the first cutting bit (B2) into the first guide hole (GH1) formed at the machining start point to the first set depth. Then, while moving along the processing path, the printed circuit board (PCB) is cut to form a portion of the cavity (C) (S144). Next, the CB machining device 1000 exchanges the first cutting bit (B2) with a second hole-making bit (B3) having a larger diameter than the first hole-making bit (B1) (S145). Next, the CB processing device 1000 moves along the processing path and expands the first guide holes GH1 with the second hole processing bit B3 to form second guide holes GH2 (S146) . Next, the CB processing device 1000 exchanges the second hole processing bit (B3) with a second cutting bit (B4) having the same diameter as the second hole processing bit (B3) (S147). Next, the CB machining device 1000 rotates the second cutting bit (B4) and inserts the second cutting bit (B4) into the second guide hole (GH2) formed at the machining start point to the second set depth. Next, the printed circuit board (PCB) is cut while moving along the processing path to form the remaining part of the cavity (C) (S148).

At this time, the first hole processing bit (B1) rotates and descends at a faster speed than the second hole processing bit (B3), and the first cutting bit (B2) moves faster than the second cutting bit (B4). It can rotate at high speed.

According to this embodiment of the present invention, the cavity (C) is cut using the machining bit (B), thereby preventing deformation of the printed circuit board (PCB) due to high heat generated during machining.

In addition, since a cavity (C) is gradually formed in the printed circuit board (PCB) by applying a plurality of hole processing bits and a plurality of cutting bits with different diameters in stages, no damage is applied to the printed circuit board (PCB) during processing. The load can be minimized, thereby preventing cracks and damage to the printed circuit board (PCB).

In addition, since the printed circuit board (PCB) is fixed at multiple positions through the board fixing jigs (4), the printed circuit board (PCB) is completely fixed on the table (1) and the printed circuit board (PCB) is completely fixed during processing. It prevents the flow, and through this, processing defects due to the flow of the printed circuit board (PCB) can be prevented.

In addition, since a machining boundary (PB) is formed through the over-processing prevention unit 5, it is possible to prevent the machining bit (B) from being over-processed beyond the set area due to incorrect input of machining path information, thereby preventing printing. Manufacturing costs can be reduced by preventing component consumption due to incorrect processing of the circuit board (PCB).

Although embodiments of the present invention have been described in more detail with reference to the accompanying drawings, the present invention is not necessarily limited to these embodiments, and various modifications may be made without departing from the technical spirit of the present invention. . Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but are for illustrative purposes, and the scope of the technical idea of the present invention is not limited by these embodiments. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

Therefore, other implementations, other embodiments, and equivalents of the claims also fall within the scope of the following claims.

1000. PCB processing equipment
1. Table
2. PCB transfer part
21. 1st PCB transfer unit
22. 2nd PCB transfer unit
3. Suction part
4. Board fixing jig
41. Elevating cylinder unit
42. First cylinder unit
421. First cylinder body
422. 1st jig
422A. 1st slide home
423. First pressurizing plate
424. First elastic member
43. Second cylinder unit
431. Second cylinder body
432. Second jig
432A. 2nd slide home
433. Second pressurizing plate
434. Second elastic member
44. First load cell
45. Second load cell
5. Over-processing prevention unit
P.B. processing border
51. Detection bar
511. Bracket part
512. Bar housing
513. First detection sensor
514. Moving bar
515. Elastic support
516. Bit support roller
52. 1st bar transfer unit
53. Bar rotation control motor
54. Second bar transfer unit
6. Processing department
B. Processing bit
B1. 1st hole processing bit
B2. 1st cutting bit
B3. 2nd hole processing bit
B4. Second cutting bit
7. Processing transfer unit
PCB. printed circuit board
C. Cavity
GH1. 1st guide hall
GH2. 2nd guide hall
B.B. Backup board
BB1. flue holes

Claims (11)

A table on which a printed circuit board is placed, a PCB transfer part that transfers the printed circuit board to the table, an adsorption part accommodated inside the table and generating a suction force to adsorb and support the printed circuit board, and the table Board fixing jigs arranged at each corner of the table along the circumference to fix the printed circuit board, and a plurality of overprocessing prevention units arranged along the circumference of the table and forming a processing boundary on the upper part of the printed circuit board. A PCB processing device including a processing unit equipped with a processing bit at an end and rotating the processing bit, and a processing transfer section that transfers the processing unit in horizontal and vertical directions to form a cavity in the printed circuit board with the processing bit. As a method of forming a cavity of a printed circuit board using,
supplying the printed circuit board to the table;
fixing the printed circuit board on the table;
forming the processing boundary on the printed circuit board; and
Comprising: forming the cavity in the printed circuit board,
The step of forming a cavity in the printed circuit board is,
Transferring the first hole machining bit to the upper part of the machining start point;
forming first guide holes of a preset depth on the printed circuit board by rotating and vertically lowering the first hole processing bit while moving along a preset processing path;
Replacing the first hole-making bit with a first cutting bit having the same diameter as the first hole-making bit;
Rotate the first cutting bit to insert the first cutting bit into the first guide hole formed at the machining start point to a first set depth, and then cut the printed circuit board while moving along the processing path. forming a portion of the cavity;
Replacing the first cutting bit with a second hole-making bit having a larger diameter than the first hole-making bit;
forming second guide holes by expanding the first guide holes with the second hole processing bit while moving along the processing path;
Replacing the second hole-making bit with a second cutting bit having the same diameter as the second hole-making bit; and
Rotate the second cutting bit to insert the second cutting bit into the second guide hole formed at the machining start point to a second set depth, and then cut the printed circuit board while moving along the processing path. A method of forming a cavity of a printed circuit board, comprising: forming a remaining portion of the cavity. delete According to paragraph 1,
The first hole processing bit rotates and descends at a faster speed than the second hole processing bit,
The first cutting bit is rotated at a faster speed than the second cutting bit. According to paragraph 1,
The step of supplying a printed circuit board to the table is,
When the printed circuit board is not placed on the table, transferring the printed circuit board to a set position through a first PCB transfer unit; and
When the printed circuit board is transferred to the set position, adsorbing the printed circuit board through a second PCB transfer unit and transferring the printed circuit board to the upper part of the table. According to clause 4,
The step of fixing the printed circuit board on the table is,
Placing a back up board having communication holes on the table;
Placing the printed circuit board on the backup board;
activating the adsorption unit to adsorb the back-up board placed on the table, and adsorbing the printed circuit board placed on the back-up board through the communication holes; and
Operating the substrate fixing jigs to support and fix the top and side surfaces of the printed circuit board at each corner of the printed circuit board. According to clause 5,
The substrate fixing jig is,
a lifting cylinder unit disposed on the table and configured to expand and contract along a vertical direction;
It is disposed on the upper part of the lifting cylinder unit, extends along the horizontal direction, partially overlaps the upper part of the edge of the printed circuit board, and is lowered by the lifting cylinder unit to press and support the upper surface of the edge of the printed circuit board. a first cylinder unit;
It is disposed between the lifting cylinder unit and the first cylinder unit, and when the first cylinder unit supports the upper surface of the corner of the printed circuit board, it extends in the horizontal direction to press and support the side of the corner of the printed circuit board. a second cylinder unit;
It is disposed on the first cylinder unit, and when the first cylinder unit presses the upper surface of the corner of the printed circuit board, the reaction force of the printed circuit board is sensed and the pressing force of the first cylinder unit applied to the printed circuit board is a first load cell configured to measure; and
It is disposed on the second cylinder unit, and when the second cylinder unit presses the side of the edge of the printed circuit board, the reaction force of the printed circuit board is sensed and the pressing force of the second cylinder unit applied to the printed circuit board is A method of forming a cavity of a printed circuit board, including a second load cell configured to measure. According to clause 6,
The first cylinder unit,
a first cylinder body coupled to and supported by the upper surface of the second cylinder unit and configured to expand and contract along a horizontal direction;
A first jig coupled to the first cylinder body, having a first slide groove formed along a vertical direction therein, and having the first load cell disposed on an inner surface;
It is accommodated in the first slide groove and can slide in the vertical direction along the inner surface of the first jig, and the upper surface of the corner of the printed circuit board is pressed by the first cylinder body or spaced apart from the printed circuit board. first pressure plate; and
It is disposed between the first load cell and the first pressure plate to elastically support the first pressure plate, and when the first pressure plate presses the upper surface of the corner of the printed circuit board, pressure is applied through the first pressure plate. It includes a first elastic member that transmits the reaction force of the printed circuit board to the first load cell,
The second cylinder unit,
a second cylinder body disposed between the first cylinder body and the lifting cylinder unit and configured to expand and contract along a horizontal direction;
a second jig coupled to the second cylinder body, having a second slide groove formed therein along a horizontal direction, and having the second load cell disposed on an inner surface;
It is accommodated in the second slide groove and can slide horizontally along the inner surface of the second jig, and presses the side of the corner of the printed circuit board by the second cylinder body or is spaced apart from the printed circuit board. a second pressure plate; and
It is disposed between the second load cell and the second pressure plate to elastically support the second pressure plate, and when the second pressure plate presses the side of the edge of the printed circuit board, pressure is applied through the second pressure plate. A method of forming a cavity of a printed circuit board comprising; a second elastic member that transmits the reaction force of the printed circuit board to the second load cell. In clause 7,
The step of operating the board fixing jigs to support and fix the top and side surfaces of the printed circuit board at each corner of the printed circuit board,
extending the lifting cylinder unit to place the first cylinder unit at a higher position than the printed circuit board;
extending the first cylinder unit and arranging the first pressure plate to overlap a corner of the printed circuit board;
pressing the upper surface of a corner of the printed circuit board with the first pressure plate while contracting the lifting cylinder unit;
stopping contraction of the lifting cylinder unit when the reaction force of the printed circuit board detected by the first load cell reaches a preset value;
pressing a side edge of the printed circuit board with the second pressure plate while extending the second cylinder unit; and
A method of forming a cavity of a printed circuit board comprising: stopping the extension of the second cylinder unit when the reaction force of the printed circuit board detected by the second load cell reaches a preset value. According to paragraph 1,
The overprocessing prevention unit,
A sensing bar is disposed on the upper part of the printed circuit board and forms the processing boundary along the processing path, and is configured to stop rotation of the processing bit by transmitting a stop command signal to the processing unit when an external force is applied along the horizontal direction. ;
a first bar transfer unit rotatably coupled to the sensing bar and configured to transport the sensing bar in left and right directions;
a bar rotation control motor supported by the first bar transfer unit and coupled to the sensing bar, and generating rotational force to control rotation of the sensing bar; and
A method of forming a cavity of a printed circuit board comprising; a second bar transfer unit configured to support the first bar transfer unit and transfer the first bar transfer unit in a forward and backward direction. According to clause 9,
The step of forming a processing boundary on the printed circuit board,
Confirming the processing path of the position where the sensing bar will be placed, and controlling the bar rotation control motor to place the sensing bar at an angle corresponding to the processing path of the position where the sensing bar will be placed; and
Controlling the first bar transfer unit and the second bar transfer unit to transfer the sensing bar to a position corresponding to the processing path. According to clause 10,
The detection bar is,
A bracket portion rotatably coupled to an end of the first bar transfer unit and rotationally controlled by the bar rotation control motor;
a bar housing coupled to and supported by the bracket unit and having an enclosure structure with one side open;
a first detection sensor disposed inside the bar housing and configured to detect an external force applied in a horizontal direction;
a movable bar that is slidably coupled to the inner surface of the bar housing, a portion of which is exposed to the outside through one surface of the bar housing, and is inserted into the interior of the bar housing when an external force is applied in the horizontal direction;
It is accommodated inside the bar housing and disposed between the first detection sensor and the moving bar, and when the moving bar is inserted into the inside of the bar housing, it is pressed and compressed by the moving bar and presses the first detection sensor, When the external force applied to the moving bar is released, it is restored by elastic force and pressurizes the moving bar to restore it to its original state; and
Bit support rollers rotatably coupled to the moving bar, a portion of which is exposed to the outside of the moving bar, and rotated by the machining bit when the machining bit contacts them to distribute the load of the machining bit. Printing comprising a. Method of forming a cavity on a circuit board.

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