KR102622684B1 - Overcoating composition and conductive layer manufactured using the same - Google Patents
Overcoating composition and conductive layer manufactured using the same Download PDFInfo
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- KR102622684B1 KR102622684B1 KR1020160174849A KR20160174849A KR102622684B1 KR 102622684 B1 KR102622684 B1 KR 102622684B1 KR 1020160174849 A KR1020160174849 A KR 1020160174849A KR 20160174849 A KR20160174849 A KR 20160174849A KR 102622684 B1 KR102622684 B1 KR 102622684B1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L1/00—Compositions of cellulose, modified cellulose or cellulose derivatives
- C08L1/02—Cellulose; Modified cellulose
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Abstract
본 발명은 대면적의 디스플레이에 포함된 투명 전극으로 사용되는 도전막의 자외선 안정성을 높일 수 있는 오버코팅 조성물에 관한 것이다.The present invention relates to an overcoating composition that can increase the ultraviolet ray stability of a conductive film used as a transparent electrode included in a large-area display.
Description
본 발명은 대면적의 디스플레이 제조과정에서 투명 도전막을 제조하는데 사용되는 오버코팅 조성물에 관한 것이다.The present invention relates to an overcoating composition used to manufacture a transparent conductive film in the manufacturing process of a large-area display.
대면적의 디스플레이에서는 빛을 투과하여 이미지를 전달하고 전류를 발생시키는 투명 도전막(즉, 투명 전극)이 핵심 부품 중 하나로, 상기 투명 도전막은 화학적으로 안정해야 하고, 평활성, 도전성이 우수하며 높은 투과도를 갖는 것이 요구된다. 이러한 투명 도전막의 재료로는 인듐주석 산화물(ITO, indium tin oxide), 불소도핑 산화주석(fluorinedoped tin oxide)과 같은 산화물, 도전성 고분자, 금속 나노와이어 등이 사용되고 있다.In large-area displays, a transparent conductive film (i.e., transparent electrode) that transmits light to transmit images and generates current is one of the key components. The transparent conductive film must be chemically stable, have excellent smoothness and conductivity, and have high transmittance. It is required to have. Materials for such transparent conductive films include oxides such as indium tin oxide (ITO) and fluorine-doped tin oxide, conductive polymers, and metal nanowires.
상기 인듐주석 산화물(Indium Tin Oxide, ITO)은 높은 투과도를 가지며 도전성이 우수하여 투명 도전막 제조 시 가장 널리 사용되고 있다. 그러나, 인듐주석 산화물은 제한된 매장량으로 인해 투명 도전막의 제조 비용이 상승하는 문제점이 있다.The indium tin oxide (ITO) has high transmittance and excellent conductivity, so it is most widely used in manufacturing transparent conductive films. However, indium tin oxide has a problem in that the manufacturing cost of a transparent conductive film increases due to limited reserves.
상기 도전성 고분자는 인듐주석 산화물을 대체할 수 있는 재료이지만, 용해도가 낮아 이를 이용한 투명 도전막의 제조 공정이 까다로우며 에너지 밴드갭이 3eV 이하로 색을 띄기 때문에 투명 도전막의 투과도가 떨어지는 문제점이 있다.The conductive polymer is a material that can replace indium tin oxide, but the manufacturing process of a transparent conductive film using it is difficult due to its low solubility, and because the energy band gap is 3 eV or less and it is colored, there is a problem in that the transmittance of the transparent conductive film is low.
상기 금속 나노와이어를 이용하여 제조된 투명 도전막은 인듐주석 산화물로 제조된 투명 도전막과 유사한 표면 저항을 나타낼 수 있지만, 자외선에 매우 취약하여 사용과정에서 표면 저항이 급격히 높아지는 문제점이 있다. 즉, 금속 나노와이어로 투명 도전막 형성 시 바인더 재료로 고분자 화합물이 사용되는데, 상기 고분자 화합물이 자외선에 의해 광 해리됨에 따라 산소를 발생하게 되고, 발생된 산소에 의해 금속 나노와이어가 산화됨에 따라 투명 도전막의 표면 저항이 급격히 높아지게 된다.The transparent conductive film manufactured using the metal nanowire can exhibit surface resistance similar to that of the transparent conductive film made of indium tin oxide, but it is very vulnerable to ultraviolet rays and has a problem in that the surface resistance increases rapidly during use. That is, when forming a transparent conductive film with metal nanowires, a polymer compound is used as a binder material. As the polymer compound is photodissociated by ultraviolet rays, oxygen is generated, and the metal nanowire is oxidized by the generated oxygen, making it transparent. The surface resistance of the conductive film increases rapidly.
본 발명은 도전막의 자외선 안정성을 높일 수 있는 오버코팅 조성물을 제공하고자 한다.The present invention seeks to provide an overcoating composition that can increase the ultraviolet ray stability of a conductive film.
또한, 본 발명은 상기 오버코팅 조성물로 형성된 코팅층을 포함하는 도전막을 제공하고자 한다.Additionally, the present invention seeks to provide a conductive film including a coating layer formed from the overcoating composition.
상기 과제를 해결하기 위해 본 발명은, 금속 원소와 리간드가 결합된 유기 금속 화합물을 포함하고, 상기 리간드가 트랜스-1,2-디아미노시클로헥세인테트라아세트산(trans-1,2-Diaminocyclohexanetetraacetic acid), 또는 비스-(아미노에틸)글리콜에테르-N,N,N',N'-테트라아세트산(bis-(Aminoethyl)glycolether-N,N,N',N'-tetraacetic acid)인 것인 오버코팅 조성물을 제공한다.In order to solve the above problem, the present invention includes an organometallic compound in which a metal element and a ligand are combined, and the ligand is trans-1,2-Diaminocyclohexanetetraacetic acid. , or an overcoating composition that is bis-(Aminoethyl)glycolether-N,N,N',N'-tetraacetic acid. provides.
또한 본 발명은, 도전층; 및 상기 도전층 상에 구비되고, 상기 오버코팅 조성물로 형성된 코팅층을 포함하는 도전막을 제공한다.Additionally, the present invention provides a conductive layer; and a coating layer provided on the conductive layer and formed of the overcoating composition.
본 발명의 오버코팅 조성물은 특정 리간드가 결합된 유기 금속 화합물을 포함하기 때문에 이를 이용하여 도전막을 제조할 경우 자외선에 대한 안정성이 높아 낮은 표면 저항을 유지할 수 있고 높은 투과도를 나타낼 수 있는 도전막을 제공할 수 있다.Since the overcoating composition of the present invention contains an organometallic compound to which a specific ligand is bound, when a conductive film is manufactured using it, it provides a conductive film that has high stability against ultraviolet rays, can maintain low surface resistance, and can exhibit high transmittance. You can.
이하 본 발명을 설명한다.The present invention will be described below.
1. 오버코팅 조성물1. Overcoating composition
본 발명의 오버코팅 조성물은 유기 금속 화합물을 포함한다.The overcoating composition of the present invention includes an organometallic compound.
본 발명의 오버코팅 조성물에 포함되는 유기 금속 화합물은 도전막의 자외선 안정성을 높이는 역할을 하는 것으로, 금속 원소와 리간드가 결합된 착화합물(complex compound)이다. 여기서 상기 리간드는 트랜스-1,2-디아미노시클로헥세인테트라아세트산(trans-1,2-Diaminocyclohexanetetraacetic acid, DCTA), 또는 비스-(아미노에틸)글리콜에테르-N,N,N',N'-테트라아세트산(bis-(Aminoethyl)glycolether-N,N,N',N'-tetraacetic acid, EGTA)으로, 이러한 리간드에 의해 본 발명은 도전막의 자외선 안정성을 보다 높일 수 있다.The organometallic compound included in the overcoating composition of the present invention serves to increase the ultraviolet ray stability of the conductive film and is a complex compound in which a metal element and a ligand are combined. Here, the ligand is trans-1,2-Diaminocyclohexanetetraacetic acid (DCTA), or bis-(aminoethyl)glycol ether-N,N,N',N'- Tetraacetic acid (bis-(Aminoethyl)glycolether-N,N,N',N'-tetraacetic acid, EGTA). By using this ligand, the present invention can further increase the ultraviolet ray stability of the conductive film.
구체적으로, 상기 유기 금속 화합물은 자외선에 의해 후술되는 도전층에 포함된 고분자 화합물(예를 들어, PET 또는 고분자 첨가제)이 광 해리되어 발생하는 산소 라디칼과 결합하여 도전층에 포함된 금속 나노와이어의 산화를 막을 수 있다. 이때, 상기 유기 금속 화합물은 상기 리간드(DCTA 또는 EGTA)가 결합된 착화합물임에 따라 다른 리간드가 결합된 착화합물에 비해 보다 많은 산소 라디칼과 결합할 수 있어 도전층에 포함된 금속 나노와이어의 산화를 보다 효율적으로 제어할 수 있으며, 이로 인해 도전막의 자외선 안정성을 높이고 면저항을 낮출 수 있다.Specifically, the organometallic compound combines with oxygen radicals generated by photodissociation of a polymer compound (e.g., PET or polymer additive) included in the conductive layer, which will be described later, by ultraviolet rays, thereby forming the metal nanowire included in the conductive layer. Oxidation can be prevented. At this time, since the organometallic compound is a complex compound to which the ligand (DCTA or EGTA) is bound, it can bind to more oxygen radicals than a complex compound to which other ligands are bound, thereby reducing the oxidation of the metal nanowires included in the conductive layer. It can be controlled efficiently, which can increase the ultraviolet ray stability of the conductive film and lower the sheet resistance.
상기 리간드에 결합된 금속 원소는 특별히 한정되지 않으나, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu 및 Zn으로 이루어진 군에서 선택된 1종 이상인 것이 바람직하다.The metal element bound to the ligand is not particularly limited, but is preferably at least one selected from the group consisting of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, and Zn.
이러한 유기 금속 화합물의 함량은 특별히 한정되지 않으나, 오버코팅 조성물 100 중량부를 기준으로 0.005 내지 0.1 중량부인 것이 바람직하다. 상기 유기 금속 화합물의 함량이 0.005 중량부 미만일 경우에는 도전막의 자외선 안정성이 저하될 수 있으며, 0.1 중량부를 초과할 경우에는 도전막의 광특성이 저하될 수 있다.The content of this organometallic compound is not particularly limited, but is preferably 0.005 to 0.1 parts by weight based on 100 parts by weight of the overcoating composition. If the content of the organometallic compound is less than 0.005 parts by weight, the ultraviolet ray stability of the conductive film may decrease, and if it exceeds 0.1 part by weight, the optical characteristics of the conductive film may decrease.
한편, 본 발명의 오버코팅 조성물은 아크릴계 수지 및 광개시제를 더 포함할 수 있다.Meanwhile, the overcoating composition of the present invention may further include an acrylic resin and a photoinitiator.
본 발명의 오버코팅 조성물에 더 포함되는 아크릴계 수지는 오버코팅 조성물에 의해 형성되는 코팅층의 내열성, 접착성 등을 높이는 역할을 한다. 이러한 아크릴계 수지는 당 업계에 공지된 것이라면 특별히 한정되지 않는다.The acrylic resin further included in the overcoating composition of the present invention serves to increase heat resistance, adhesion, etc. of the coating layer formed by the overcoating composition. These acrylic resins are not particularly limited as long as they are known in the art.
상기 아크릴계 수지의 함량은 특별히 한정되지 않으나, 오버코팅 조성물 100 중량부를 기준으로 0.1 내지 5 중량부인 것이 바람직하다. 상기 아크릴계 수지의 함량이 0.1 중량부 미만일 경우에는 코팅층의 내열성, 접착성 등이 저하될 수 있고, 5 중량부를 초과할 경우에는 코팅층의 경화밀도가 높아져 내크랙성, 내구성 등이 저하될 수 있다.The content of the acrylic resin is not particularly limited, but is preferably 0.1 to 5 parts by weight based on 100 parts by weight of the overcoating composition. If the content of the acrylic resin is less than 0.1 parts by weight, the heat resistance and adhesiveness of the coating layer may decrease, and if it exceeds 5 parts by weight, the cured density of the coating layer increases, which may decrease crack resistance and durability.
본 발명의 오버코팅 조성물에 더 포함되는 광개시제는 상기 아크릴계 수지의 경화 반응을 매개하는 역할을 한다. 이러한 광개시제는 특별히 한정되지 않으나, 1-하이드록시시클로헥실페닐케톤, 2,4,6-트리메틸 벤조일-디페닐 포스핀 옥사이드, 2-하이드록시-2-메틸-1-페닐프로판-1-페논, 2-하이드록시-2-메틸-1-페닐-1-프로판온, 1-(4-이소프로필페닐)-2-하이드록시-2-메틸-1-온, 1-[4-(2-하이드록시에톡시)페닐]-2-하이드록시-2-메틸-프로판-1-온, 2,2-디에톡시-1-페닐-에타논, 트리메틸벤조페논, 또는 4-메틸벤조페논 등을 들 수 있다.The photoinitiator further included in the overcoating composition of the present invention serves to mediate the curing reaction of the acrylic resin. This photoinitiator is not particularly limited, but includes 1-hydroxycyclohexylphenylketone, 2,4,6-trimethyl benzoyl-diphenyl phosphine oxide, 2-hydroxy-2-methyl-1-phenylpropane-1-phenone, 2-Hydroxy-2-methyl-1-phenyl-1-propanone, 1-(4-isopropylphenyl)-2-hydroxy-2-methyl-1-one, 1-[4-(2-hyde oxyethoxy)phenyl]-2-hydroxy-2-methyl-propan-1-one, 2,2-diethoxy-1-phenyl-ethanone, trimethylbenzophenone, or 4-methylbenzophenone, etc. there is.
상기 광개시제의 함량은 특별히 한정되지 않으나, 오버코팅 조성물 100 중량부를 기준으로, 0.1 내지 1 중량부인 것이 바람직하다. 상기 광개시제의 함량이 0.1 중량부 미만일 경우에는 오버코팅 조성물의 미경화로 인해 코팅층의 외관 불량 및 물성 저하 등이 유발될 수 있으며, 1 중량부를 초과할 경우에는 미반응된 광개시제가 잔류되어 코팅층의 내크랙성, 접착성 등이 저하될 수 있다.The content of the photoinitiator is not particularly limited, but is preferably 0.1 to 1 part by weight based on 100 parts by weight of the overcoating composition. If the content of the photoinitiator is less than 0.1 part by weight, uncured overcoating composition may cause poor appearance and deterioration of physical properties of the coating layer, and if it exceeds 1 part by weight, unreacted photoinitiator may remain, resulting in cracking of the coating layer. Performance, adhesion, etc. may decrease.
또한 본 발명의 오버코팅 조성물은 점도를 조절하는 용매를 더 포함할 수 있다. 이때, 용매는 당 업계에 공지된 것이라면 특별히 한정되지 않는다.Additionally, the overcoating composition of the present invention may further include a solvent that adjusts viscosity. At this time, the solvent is not particularly limited as long as it is known in the art.
이외에도 본 발명의 오버코팅 조성물은 그 물성에 영향을 미치지 않는 범위 내에서 당 업계에 공지된 첨가제(제1 첨가제)(예를 들어, 소포제, 분산제, 접착증진제 등)를 더 포함할 수 있다.In addition, the overcoating composition of the present invention may further include additives (first additives) known in the art (e.g., anti-foaming agents, dispersants, adhesion promoters, etc.) to the extent that they do not affect the physical properties.
2. 2. 도전막conductive film
본 발명은 도전층 및 코팅층을 포함하는 도전막을 제공한다.The present invention provides a conductive film including a conductive layer and a coating layer.
본 발명의 도전막에 포함되는 도전층은 열전도 또는 전기전도가 이루어지는 층이다. 이러한 도전층은 당 업계에 공지된 조성물로 형성될 수 있으나, 도전성을 고려할 때, 금속 나노와이어 및 바인더를 포함하는 도전성 조성물로 형성되는 것이 바람직하다.The conductive layer included in the conductive film of the present invention is a layer that conducts heat or electricity. This conductive layer may be formed of a composition known in the art, but when considering conductivity, it is preferably formed of a conductive composition containing metal nanowires and a binder.
상기 도전성 조성물에 포함되는 금속 나노와이어는 도전성 조성물에 도전성을 부여하는 역할을 한다. 이러한 금속 나노와이어는 특별히 한정되지 않으나, 도전성이 우수하고 전기적 안정성이 높은 은 나노와이어, 금 나노와이어 및 백금 나노와이어로 이루어진 군에서 선택된 1종 이상인 것이 바람직하다.The metal nanowires included in the conductive composition serve to provide conductivity to the conductive composition. These metal nanowires are not particularly limited, but are preferably at least one selected from the group consisting of silver nanowires, gold nanowires, and platinum nanowires, which have excellent conductivity and high electrical stability.
상기 금속 나노와이어의 직경은 특별히 한정되지 않으나, 20 ㎚ 이하인 것인 바람직하고, 10 내지 20 ㎚인 것이 더욱 바람직하다. 상기 금속 나노와이어의 직경이 20 ㎚를 초과할 경우에는 Milky 현상이 발생하여 도전막이 적용된 디스플레이의 시인성을 저하시킬 수 있다.The diameter of the metal nanowire is not particularly limited, but is preferably 20 nm or less, and more preferably 10 to 20 nm. If the diameter of the metal nanowire exceeds 20 nm, a milky phenomenon may occur, which may reduce the visibility of the display to which the conductive film is applied.
이러한 금속 나노와이어의 함량은 특별히 한정되지 않으나, 도전성 조성물 100 중량부를 기준으로 0.05 내지 0.2 중량부인 것이 바람직하다. 상기 금속 나노와이어의 함량이 0.05 중량부 미만일 경우에는 도전성 조성물의 도전성이 저하될 수 있으며, 0.2 중량부를 초과할 경우에는 필요 이상으로 사용되어 경제성이 저하될 수 있다. The content of these metal nanowires is not particularly limited, but is preferably 0.05 to 0.2 parts by weight based on 100 parts by weight of the conductive composition. If the content of the metal nanowire is less than 0.05 parts by weight, the conductivity of the conductive composition may decrease, and if it exceeds 0.2 parts by weight, it may be used more than necessary, reducing economic efficiency .
상기 도전성 조성물에 포함되는 바인더는 금속 나노와이어를 분산 및 상호 연결된 상태로 고정시키는 매트릭스 역할을 한다. 이러한 바인더는 특별히 한정되지 않으나, 셀룰로오스계 고분자인 것이 바람직하다. 상기 셀룰로오스계 고분자를 바인더로 사용할 경우, 도전막이 고 투과도를 유지하는 범위 내에서 일정 점도 유지 및 고정 매트릭스 역할을 할 수 있다. The binder included in the conductive composition serves as a matrix that fixes the metal nanowires in a dispersed and interconnected state. This binder is not particularly limited, but is preferably a cellulose-based polymer. When the cellulose-based polymer is used as a binder, it can maintain a certain viscosity and serve as a fixing matrix within the range where the conductive film maintains high permeability .
상기 셀룰로오스계 고분자는 특별히 한정되지 않으나, 메틸셀룰로오스, 에틸셀룰로오스, 히드록시에틸셀룰로오스, 히드록시메틸셀룰로오스, 히드록시프로필메틸셀룰로오스, 니트로셀룰로오스 및 카르복시메틸셀룰로오스로 이루어진 군에서 선택된 1종 이상인 것이 바람직하다.The cellulose-based polymer is not particularly limited, but is preferably at least one selected from the group consisting of methylcellulose, ethylcellulose, hydroxyethylcellulose, hydroxymethylcellulose, hydroxypropylmethylcellulose, nitrocellulose, and carboxymethylcellulose.
이러한 바인더의 함량은 특별히 한정되지 않으나, 도전성 조성물 100 중량부를 기준으로 0.05 내지 1 중량부인 것이 바람직하다. 상기 바인더의 함량이 0.05 중량부 미만일 경우에는 금속 나노와이어의 분산 및 상호 연결성이 저하될 수 있고, 1 중량부를 초과할 경우에는 도전막의 Yellow index 값이 상승하여 도전막이 적용된 디스플레이의 시인성을 저하시킬 수 있다. The content of this binder is not particularly limited, but is preferably 0.05 to 1 part by weight based on 100 parts by weight of the conductive composition. If the content of the binder is less than 0.05 parts by weight, the dispersion and interconnectivity of the metal nanowires may be reduced, and if it exceeds 1 part by weight, the yellow index value of the conductive film may increase and reduce the visibility of the display to which the conductive film is applied. there is .
한편 상기 도전성 조성물은 그 물성을 높이기 위해 증점제, 표면장력조절제 및 접착증진제로 이루어진 군에서 선택된 1종 이상의 첨가제(제2 첨가제)를 더 포함할 수 있다. 이러한 첨가제의 함량은 특별히 한정되지 않으나, 도전성 조성물 100 중량부를 기준으로, 0.005 내지 0.1 중량부인 것이 바람직하다.Meanwhile, the conductive composition may further include at least one additive (second additive) selected from the group consisting of a thickener, a surface tension control agent, and an adhesion promoter in order to increase its physical properties. The content of these additives is not particularly limited, but is preferably 0.005 to 0.1 parts by weight based on 100 parts by weight of the conductive composition.
구체적으로, 상기 증점제는 도전성 조성물의 점도를 상승시켜 도전성 조성물의 코팅성을 높이는 역할을 한다. 이러한 증점제는 당 업계에 공지된 것을 사용할 수 있다.Specifically, the thickener serves to increase the coatability of the conductive composition by increasing the viscosity of the conductive composition. These thickeners may be those known in the art.
상기 표면장력조절제는 도전성 조성물의 코팅성을 상승시켜 도전층의 성형성을 높이는 역할을 한다. 이러한 표면장력조절제는 특별히 한정되지 않으나, 과불소알킬 카르복시산염, 과불소화 설폰산염, 과불소화 황산염, 과불소화 인산염 등의 불소계 화합물(불소계 계면활성제)을 들 수 있다.The surface tension control agent serves to increase the moldability of the conductive layer by increasing the coating properties of the conductive composition. These surface tension regulators are not particularly limited, but include fluorinated compounds (fluorinated surfactants) such as perfluoroalkyl carboxylate, perfluorinated sulfonate, perfluorinated sulfate, and perfluorinated phosphate.
상기 표면장력조절제의 함량은 특별히 한정되지 않으나, 도전성 조성물 100 중량부를 기준으로, 0.001 내지 0.01 중량부인 것이 바람직하다. 상기 표면장력조절제의 함량이 0.001 중량부 미만일 경우에는 도전성 조성물의 표면장력이 높아 도전층의 성형성이 저하될 수 있고, 0.01 중량부를 초과할 경우에는 도전성 조성물의 기포발생 제어효과가 떨어지고 경제성이 저하될 수 있다.The content of the surface tension regulator is not particularly limited, but is preferably 0.001 to 0.01 parts by weight based on 100 parts by weight of the conductive composition. If the content of the surface tension regulator is less than 0.001 part by weight, the surface tension of the conductive composition is high and the formability of the conductive layer may be reduced, and if it exceeds 0.01 part by weight, the bubble generation control effect of the conductive composition is reduced and economic feasibility is reduced. It can be.
상기 접착증진제는 도전성 조성물을 기재에 코팅하여 도전층 형성 시 기재와 도전층의 접착력을 높이는 역할을 한다. 이러한 접착증진제는 특별히 한정되지 않으나, 에폭시계 수지, 아크릴계 수지, 우레탄계 수지 등을 들 수 있다.The adhesion promoter serves to increase the adhesion between the substrate and the conductive layer when forming a conductive layer by coating the conductive composition on the substrate. These adhesion promoters are not particularly limited, but include epoxy resins, acrylic resins, and urethane resins.
상기 접착증진제의 함량은 특별히 한정되지 않으나, 도전성 조성물 100 중량부를 기준으로, 0.005 내지 0.1 중량부인 것이 바람직하다. 상기 접착증진제의 함량이 0.005 중량부 미만일 경우에는 기재와 도전층의 접착력이 저하될 수 있고, 0.1 중량부를 초과할 경우에는 도전층이 절연층으로 작용하여 도전막의 면저항을 상승시킬 수 있다.The content of the adhesion promoter is not particularly limited, but is preferably 0.005 to 0.1 parts by weight based on 100 parts by weight of the conductive composition. If the content of the adhesion promoter is less than 0.005 parts by weight, the adhesion between the substrate and the conductive layer may decrease, and if it exceeds 0.1 part by weight, the conductive layer may act as an insulating layer and increase the sheet resistance of the conductive film.
이외에도 상기 도전성 조성물은 그 물성에 영향을 미치지 않는 범위 내에서 당 업계에 공지된 용매, 안정제, 분산제, 환원제, 습윤제, 소포제, 커플링제 등을 더 포함할 수 있다.In addition, the conductive composition may further include solvents, stabilizers, dispersants, reducing agents, wetting agents, anti-foaming agents, coupling agents, etc. known in the art to the extent that they do not affect the physical properties.
본 발명의 도전막에 포함되는 코팅층은 상기 도전층의 상에 구비되어 도전층의 자외선 안정성을 높이는 층이다. 이러한 코팅층은 상술한 오버코팅 조성물로 형성됨에 따라 도전층에 포함된 금속 나노와이어의 산화를 방지할 수 있어, 이를 포함하는 도전막의 자외선 안정성을 높이고 면저항을 낮출 수 있다.The coating layer included in the conductive film of the present invention is a layer provided on the conductive layer to increase the ultraviolet ray stability of the conductive layer. As this coating layer is formed with the above-described overcoating composition, it can prevent oxidation of the metal nanowires included in the conductive layer, thereby increasing the ultraviolet ray stability of the conductive film containing it and lowering the sheet resistance.
한편, 본 발명의 도전막은 상기 도전층의 하에 구비되는 기재층을 더 포함할 수 있다. 상기 기재층은 도전막의 베이스 역할을 하는 층으로, 그 성분은 당 업계에 공지된 성분으로 이루어질 수 있다. 구체적으로 기재층은 폴리이미드(PI), 폴리에틸렌테레프탈레이트(PET), 폴리에테르술폰(PES), 나일론(Nylon), 폴리테트라플루오로에틸렌(PTFE), 폴리에테르에테르케톤(PEEK), 폴리카보네이트(PC), 폴리아릴레이트(PAR) 등과 같은 투명 수지 필름; 또는 유리 기판 등으로 이루어질 수 있다.Meanwhile, the conductive film of the present invention may further include a base layer provided under the conductive layer. The base layer is a layer that serves as a base for the conductive film, and its components may be composed of components known in the art. Specifically, the base layer is polyimide (PI), polyethylene terephthalate (PET), polyethersulfone (PES), nylon, polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), and polycarbonate ( Transparent resin films such as PC), polyarylate (PAR), etc.; Alternatively, it may be made of a glass substrate, etc.
상술한 본 발명의 도전막을 제조하는 방법은 특별히 한정되지 않으나, 기재에 상술한 도전성 조성물을 코팅하고 건조시켜 도전층을 형성한 후, 형성된 도전층 상에 상술한 오버코팅 조성물을 코팅하고 건조 및 경화시켜 코팅층을 형성시키는 과정을 거쳐 제조할 수 있다.The method of manufacturing the conductive film of the present invention described above is not particularly limited, but after coating the above-described conductive composition on a substrate and drying it to form a conductive layer, the above-described overcoating composition is coated on the formed conductive layer, dried, and cured. It can be manufactured through a process of forming a coating layer.
상기 도전성 조성물과 상기 오버코팅 조성물을 코팅하는 방법은 특별히 한정되지 않으나, 스핀(spin) 코팅, 롤(roll) 코팅, 바(bar) 코팅, 스프레이 코팅, 딥(dip) 코팅, 잉크젯 프린팅, 옵셋 프린팅, 스크린 프린팅, 패드(pad) 프린팅, 그라비아 프린팅, 플렉소(flexography) 프린팅, 스텐실 프린팅, 임프린팅(imprinting) 등을 들 수 있다.The method of coating the conductive composition and the overcoating composition is not particularly limited, but includes spin coating, roll coating, bar coating, spray coating, dip coating, inkjet printing, and offset printing. , screen printing, pad printing, gravure printing, flexography printing, stencil printing, imprinting, etc.
상기 도전성 조성물을 코팅한 후 건조하는 조건은 특별히 한정되지 않으나, 건조 온도는 100 내지 120 ℃이고, 건조 시간은 3 내지 10분일 수 있다. 또한 상기 오버코팅 조성물을 코팅한 후 건조 및 경화하는 조건은 특별히 한정되지 않으나, 건조 온도는 100 내지 120 ℃이고, 건조 시간은 3 내지 10분이고, 경화 시 광(자외선) 조사량은 400 내지 600 mJ일 수 있다.Conditions for drying after coating the conductive composition are not particularly limited, but the drying temperature may be 100 to 120° C. and the drying time may be 3 to 10 minutes. In addition, the conditions for drying and curing after coating the overcoating composition are not particularly limited, but the drying temperature is 100 to 120 ℃, the drying time is 3 to 10 minutes, and the amount of light (ultraviolet rays) irradiation during curing is 400 to 600 mJ. You can.
이와 같이 제조된 도전막의 두께는 특별히 한정되지 않으나, 100 내지 200 ㎚인 것이 바람직하다.The thickness of the conductive film manufactured in this way is not particularly limited, but is preferably 100 to 200 nm.
이상의 본 발명에 따른 도전막은 도전성, 투명성과 더불어 자외선에 대한 안정성이 우수하기 때문에 전기 및 전자 기기에 다양하게 적용될 수 있으며, 특히, 실외에서 사용되는 대면적의 디스플레이에 포함된 투명 전극으로써 유용하게 적용될 수 있다.Since the conductive film according to the present invention has excellent conductivity and transparency as well as stability against ultraviolet rays, it can be applied to various electrical and electronic devices. In particular, it can be usefully applied as a transparent electrode included in a large-area display used outdoors. You can.
이하 본 발명을 실시예를 통하여 상세히 설명하면 다음과 같다. 단, 하기 실시예는 본 발명을 예시하는 것일 뿐, 본 발명이 하기 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail through examples. However, the following examples are merely illustrative of the present invention, and the present invention is not limited by the following examples.
[[ 실시예Example 1, 2 및 1, 2 and 비교예Comparative example 1 내지 3] 1 to 3] 도전막conductive film 제조 manufacturing
a) a) 도전층conductive layer 형성 formation
#12호 바코터(bar coater)를 이용하여 PET 기재 상에 도전성 조성물을 코팅하고 120 ℃에서 5분 동안 건조하여 도전층을 형성하였다. 이때, 도전성 조성물로는 은 나노와이어(입경: 15 ㎚) 0.2 중량%, 히드록시프로필메틸셀룰로오스 0.2 중량%, 불소계 표면장력조절제 0.05 중량% 및 잔량의 이온수로 이루어진 것을 사용하였다.#12 A conductive composition was coated on a PET substrate using a bar coater and dried at 120° C. for 5 minutes to form a conductive layer. At this time, the conductive composition was used as a conductive composition consisting of 0.2% by weight of silver nanowires (particle diameter: 15 nm), 0.2% by weight of hydroxypropylmethylcellulose, 0.05% by weight of a fluorine-based surface tension regulator, and the remaining amount of ionized water.
b) 코팅층 형성b) Formation of coating layer
#10호 바코터를 이용하여 형성된 도전층 상에 오버코팅 조성물을 코팅하고 100 ℃에서 3분 동안 건조시켰다. 이후 500 mJ의 자외선을 조사하여 경화시킴으로써 코팅층을 형성하였다. 이때, 사용된 오버코팅 조성물은 하기 표 1과 같다.The overcoating composition was coated on the formed conductive layer using a #10 bar coater and dried at 100°C for 3 minutes. Afterwards, a coating layer was formed by curing by irradiating 500 mJ of ultraviolet rays. At this time, the overcoating composition used is shown in Table 1 below.
AA-401NATCO company
AA-401
EGTA: bis-(Aminoethyl)glycolether-N,N,N',N'-tetraacetic acid
NTA: Nitrilotriacetic acid
HALS: Hindered Amine Light Stabilizer
IPA: Isopropyl alcoholDCTA: trans-1,2-Diaminocyclohexanetetraacetic acid
EGTA: bis-(Aminoethyl)glycolether-N,N,N',N'-tetraacetic acid
NTA: Nitrilotriacetic acid
HALS: Hindered Amine Light Stabilizer
IPA: Isopropyl alcohol
[[ 실험예Experiment example ]]
제조된 도전막의 물성을 다음과 같은 방법으로 평가하였으며, 그 결과를 하기 표 2에 나타내었다.The physical properties of the manufactured conductive film were evaluated by the following method, and the results are shown in Table 2 below.
1. 면저항(Resistivity): 일렉트로닉 디자인 투 마켓, 인크(Electronic Design To Market, Inc.)(오하이오 톨레도)(Toledo, OH)사의 R-CHEK 모델 RC2175 표면 저항률 미터를 사용하여 측정하였다.1. Sheet resistance (Resistivity): Measured using a R-CHEK model RC2175 surface resistivity meter from Electronic Design To Market, Inc. (Toledo, OH).
2. 투과도 및 Haze: NIPPON DENSHUKU사의 NDH5000를 사용하여 측정하였다.2. Transmittance and Haze: Measured using NDH5000 from NIPPON DENSHUKU.
상기 표 2를 참조하면, 본 발명에 따른 도전막은 특정 리간드(DCTA 또는 EGTA)가 결합된 유기 금속 화합물이 함유된 코팅층을 포함함에 따라 면저항의 증가율이 낮고, 투과도 및 Haze가 우수한 것을 확인할 수 있다.Referring to Table 2, it can be seen that the conductive film according to the present invention has a low increase rate in sheet resistance and excellent transmittance and haze as it includes a coating layer containing an organometallic compound bound to a specific ligand (DCTA or EGTA).
Claims (14)
상기 리간드가 비스-(아미노에틸)글리콜에테르- N,N,N',N'-테트라아세트산(bis-(Aminoethyl)glycolether-N,N,N',N'-tetraacetic acid)이고,
상기 금속 원소가 Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu 및 Zn으로 이루어진 군에서 선택된 1종 이상인 것인 오버코팅 조성물.Contains an organometallic compound in which a metal element and a ligand are combined,
The ligand is bis-(Aminoethyl)glycolether-N,N,N',N'-tetraacetic acid,
An overcoating composition wherein the metal element is one or more selected from the group consisting of Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, and Zn.
아크릴계 수지 및 광개시제를 더 포함하는 오버코팅 조성물.In claim 1,
An overcoating composition further comprising an acrylic resin and a photoinitiator.
상기 유기 금속 화합물의 함량이 오버코팅 조성물 100 중량부를 기준으로 0.005 내지 0.1 중량부인 것인 오버코팅 조성물.In claim 1,
An overcoating composition in which the content of the organometallic compound is 0.005 to 0.1 parts by weight based on 100 parts by weight of the overcoating composition.
상기 도전층 상에 구비되고, 청구항 1, 3, 4 중 어느 한 항의 오버코팅 조성물로 형성된 코팅층을 포함하는 도전막.conductive layer; and
A conductive film provided on the conductive layer and including a coating layer formed of the overcoating composition of any one of claims 1, 3, and 4 .
상기 도전층은 금속 나노와이어 및 바인더를 포함하는 도전성 조성물로 형성된 것인 도전막.In claim 5,
The conductive layer is a conductive film formed of a conductive composition containing metal nanowires and a binder.
상기 금속 나노와이어가 은 나노와이어, 금 나노와이어 및 백금 나노와이어로 이루어진 군에서 선택된 1종 이상인 것인 도전막.In claim 6,
A conductive film wherein the metal nanowire is one or more selected from the group consisting of silver nanowires, gold nanowires, and platinum nanowires.
상기 금속 나노와이어의 직경이 20 ㎚ 이하인 것인 도전막.In claim 6,
A conductive film wherein the diameter of the metal nanowire is 20 nm or less.
상기 바인더가 셀룰로오스계 고분자인 것인 도전막.In claim 6,
A conductive film wherein the binder is a cellulose-based polymer.
상기 셀룰로오스계 고분자는 메틸셀룰로오스, 에틸셀룰로오스, 히드록시에틸셀룰로오스, 히드록시메틸셀룰로오스, 히드록시프로필메틸셀룰로오스, 니트로셀룰로오스 및 카르복시메틸셀룰로오스로 이루어진 군에서 선택된 1종 이상인 것인 도전막.In claim 9,
A conductive film wherein the cellulose polymer is at least one selected from the group consisting of methylcellulose, ethylcellulose, hydroxyethylcellulose, hydroxymethylcellulose, hydroxypropylmethylcellulose, nitrocellulose, and carboxymethylcellulose.
상기 도전성 조성물이 증점제, 표면장력조절제 및 접착증진제로 이루어진 군에서 선택된 1종 이상의 첨가제를 더 포함하는 것인 도전막.In claim 6,
A conductive film wherein the conductive composition further includes at least one additive selected from the group consisting of a thickener, a surface tension regulator, and an adhesion promoter.
상기 표면장력조절제가 불소계 화합물인 것인 도전막.In claim 11,
A conductive film wherein the surface tension control agent is a fluorine-based compound.
상기 도전층 하에 구비되는 기재층을 더 포함하는 것인 도전막.In claim 5,
A conductive film further comprising a base layer provided under the conductive layer.
디스플레이에 포함된 투명 전극인 것인 도전막.In claim 5,
A conductive film that is a transparent electrode included in the display.
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