KR102622091B1 - Test handler including nozzle assembly - Google Patents

Abstract

The test handler is initiated. The test handler includes a test chamber for electrically testing semiconductor packages, an inner chamber connected to the test chamber to pre-regulate the temperature of the semiconductor packages, and an inner chamber for pre-regulating the temperature of the semiconductor packages, and adjusting the temperature of the semiconductor packages to room temperature after testing the semiconductor packages. a de-sock chamber for recovering the inner chamber, a circulation pipe for circulating the air inside the inner chamber, a fan for circulating the air through the circulation pipe, and spraying cooling gas to control the temperature inside the inner chamber. Includes a nozzle assembly. The nozzle assembly includes a first injection port for spraying the cooling gas in the same direction as the air flow direction by the fan, and a second injection port for spraying the cooling gas in a direction opposite to the air flow direction. do.

Description

Test handler including nozzle assembly}

Embodiments of the present invention relate to a test handler including a nozzle assembly. More specifically, it relates to a test handler including a nozzle assembly that sprays cooling gas to control the internal temperature of an inner chamber for pre-regulating the temperature of semiconductor packages.

In general, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as above are packaged into semiconductor packages through a dicing process, bonding process, and packaging process. can be manufactured.

Semiconductor packages manufactured as described above may be determined to be good or defective through electrical performance tests. The test process may be performed using a test handler that handles the semiconductor packages and a tester that provides inspection signals to inspect the semiconductor packages.

The test process may be performed after storing the semiconductor package in insert assemblies mounted on a test tray and electrically connecting the tester to external connection terminals of the semiconductor packages stored in the insert assembly. An interface board for connecting the semiconductor packages and the tester may be provided in the test chamber for performing the test process, and socket boards for connection with the semiconductor packages may be placed on the interface board. .

Meanwhile, the test tray containing the semiconductor packages may be transferred to the test chamber through a soak chamber, and taken out through a de-soak chamber after the test process is completed. Subsequently, semiconductor packages for which the test process has been completed may be classified from the test trays to customer trays according to test results.

The test process can be divided into a high temperature test process and a low temperature test process depending on the temperature, and accordingly, the interior of the test chamber can be maintained at a high or low temperature. The inner chamber may be provided for preheating or precooling the semiconductor packages, and the inner chamber may be provided to restore the temperature of the semiconductor packages to room temperature.

In particular, in the case of a low-temperature test process, the internal temperature of the inner chamber can be controlled by cooling gas. For example, liquefied nitrogen (LN2) gas may be used as the cooling gas, and a nozzle assembly for spraying the cooling gas may be provided inside the inner chamber. However, because the temperature of the cooling gas is very low, approximately -190°C, condensation may occur around the nozzle assembly, and further, freezing may occur around the nozzle assembly.

Republic of Korea Patent Publication No. 10-0714106 (Registration date: April 26, 2007) Republic of Korea Patent Publication No. 10-1173391 (Registration date: August 6, 2012)

The purpose of embodiments of the present invention is to provide a test handler including a nozzle assembly that can prevent condensation caused by injection of cooling gas.

According to some embodiments of the present invention, there is provided a test chamber for electrically testing semiconductor packages, an inner chamber connected to the test chamber and configured to pre-regulate the temperature of the semiconductor packages, and, after testing the semiconductor packages, the semiconductor package. A de-sock chamber for restoring the temperature of the packages to room temperature, a circulation pipe for circulating the air inside the inside chamber, a fan for circulating the air through the circulation pipe, and a device for controlling the temperature inside the inside chamber. In the test handler including a nozzle assembly for spraying a cooling gas, the nozzle assembly includes a first injection port for spraying the cooling gas in the same direction as the air flow direction by the fan, and the air flow direction It may be provided with a second injection port that sprays the cooling gas in the opposite direction.

According to some embodiments of the present invention, the nozzle assembly includes a plurality of third injection holes disposed around the first injection hole and spraying a second gas to prevent condensation caused by the cooling gas, It is disposed around the second injection hole and may further include a plurality of fourth injection holes for spraying the second gas.

According to some embodiments of the present invention, nitrogen gas may be used as the cooling gas, and dry air may be used as the second gas.

According to some embodiments of the present invention, the nozzle assembly includes an inner nozzle connected to the first injection port and the second injection port and for supplying the cooling gas, an internal space in which the inner nozzle is disposed, and the first injection port. and an outer nozzle having second injection nozzles.

According to some embodiments of the present invention, the outer nozzle is disposed around the first injection hole, is connected to the internal space, and includes a plurality of nozzles that spray a second gas to prevent condensation caused by the cooling gas. It may further include three injection holes and a plurality of fourth injection holes disposed around the second injection hole and connected to the internal space for spraying the second gas, and the nozzle assembly is connected to the inner nozzle. It may further include a first pipe for supplying the cooling gas, and a second pipe connected to the internal space and configured to surround the first pipe and for supplying the second gas to the internal space.

According to some embodiments of the present invention, the nozzle assembly may have a streamlined outer surface disposed in the air flow direction.

According to some embodiments of the present invention, the nozzle assembly may include a propeller arranged to surround the second nozzle and rotatable by the air flow.

According to the embodiments of the present invention as described above, the nozzle assembly can spray cooling gas in the direction of the air flow by the fan through the first injection hole, and can also spray the cooling gas in the direction of the air flow by the fan through the second injection hole. The cooling gas may be sprayed in a direction opposite to the flow direction. Additionally, the nozzle assembly may inject a second gas for preventing condensation in the direction of the air flow through the third injection openings, and may spray the second gas in a direction opposite to the direction of the air flow through the fourth injection openings. Gas can be sprayed.

As a result, a vortex may be formed in the area in front of the second injection port and the fourth injection port, and the vortex causes a Condensation and freezing phenomena can be sufficiently reduced. Additionally, since the inner nozzle and the first pipe for supplying the cooling gas can be located within the supply passage of the second gas, condensation and freezing phenomena on the outer surfaces of the nozzle assembly can be further reduced.

1 is a schematic configuration diagram for explaining a test handler according to an embodiment of the present invention.
FIG. 2 is a schematic diagram for explaining the inner chamber shown in FIG. 1.
FIG. 3 is a schematic cross-sectional view illustrating a nozzle assembly that supplies cooling gas to control the temperature inside the inner chamber shown in FIG. 1.
FIG. 4 is a schematic cross-sectional view illustrating another example of the nozzle assembly shown in FIG. 3.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention does not have to be configured as limited to the embodiments described below and may be embodied in various other forms. The following examples are not provided to fully complete the present invention, but rather are provided to fully convey the scope of the present invention to those skilled in the art.

In embodiments of the present invention, when one element is described as being disposed or connected to another element, the element may be directly disposed or connected to the other element, and other elements may be interposed between them. It could be. Alternatively, if one element is described as being placed directly on or connected to another element, there cannot be another element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and/or parts, but the items are not limited by these terms. won't

Technical terms used in the embodiments of the present invention are merely used for the purpose of describing specific embodiments and are not intended to limit the present invention. Additionally, unless otherwise limited, all terms, including technical and scientific terms, have the same meaning that can be understood by a person skilled in the art. The above terms, as defined in common dictionaries, will be construed to have meanings consistent with their meanings in the context of the relevant art and description of the invention, and unless explicitly defined, ideally or excessively by superficial intuition. It will not be interpreted.

Embodiments of the invention are described with reference to schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, for example changes in manufacturing methods and/or tolerances, are fully to be expected. Accordingly, the embodiments of the present invention are not intended to be described as limited to the specific shapes of the regions illustrated but are intended to include deviations in the shapes, and the elements depicted in the drawings are entirely schematic and represent their shapes. is not intended to describe the exact shape of the elements nor is it intended to limit the scope of the present invention.

FIG. 1 is a schematic diagram illustrating a test handler according to an embodiment of the present invention, and FIG. 2 is a schematic diagram illustrating the inner chamber shown in FIG. 1 .

Referring to FIGS. 1 and 2 , a test handler 100 according to an embodiment of the present invention may be used to perform an electrical test process of semiconductor packages 10 . The test handler 100 is connected to a test chamber 110 for electrically testing the semiconductor packages 10, and is connected to the test chamber 110 to set the temperature of the semiconductor packages 10 to the test temperature in advance. It may include an inner chamber 120 for controlling the inner chamber 120 and a inner chamber 130 for restoring the temperature of the semiconductor packages 10 to room temperature after testing the semiconductor packages 10 .

The semiconductor packages 10 may be transferred from the customer tray 30 to the test tray 20, and the test tray 20 may be transferred to the test chamber 110 via the inner chamber 120. You can. In particular, while the test tray 20 passes through the inner chamber 120, the temperature of the semiconductor packages 10 stored in the test tray 20 may be adjusted in advance. For example, in the case of a low-temperature test process, the internal temperature of the inner chamber 120 may be maintained at about -25°C to pre-control the temperature of the semiconductor packages 10. In particular, the air inside the inner chamber 120 may be circulated through the circulation pipe 122, and a fan 124 for circulation of the air is provided at the connection portion between the inner chamber 120 and the circulation pipe 122. ; see FIG. 3) may be arranged.

Although not shown, an interface board for transmitting electrical test signals to the semiconductor packages 10 may be disposed in the test chamber 110, and an interface board with the semiconductor packages 10 may be placed on the interface board. Socket boards for direct connection may be placed. In addition, within the test chamber 110, a match plate equipped with pushers for bringing the semiconductor packages 10 stored in the test tray 20 into close contact with the socket boards and a driver for driving the match plate are provided. can be placed.

After the test process is completed, the temperature of the semiconductor packages 10 may be restored to room temperature while the test tray 20 passes through the disk chamber 130, and the test tray 20 is transferred from the disk chamber 130. After the 20 is shipped out, the semiconductor packages 10 may be classified into a plurality of customer trays 30 according to the results of the test process.

FIG. 3 is a schematic cross-sectional view illustrating a nozzle assembly that supplies cooling gas to control the temperature inside the inner chamber shown in FIG. 1.

Referring to FIG. 3, a nozzle assembly 200 may be disposed inside the inner chamber 120 to face the fan 124, and the nozzle assembly 200 may direct cooling gas (cooling gas) toward the fan 124. C) can be sprayed. For example, the nozzle assembly 100 may spray liquefied nitrogen gas as a cooling gas (C) to pre-cool the semiconductor packages 10, and the nitrogen gas may be sprayed by the fan 124. It may be supplied into the inner chamber 120 through the circulation pipe 122.

According to one embodiment of the present invention, the nozzle assembly 200 has a first injection hole for spraying the cooling gas (C) in the same direction as the flow direction of the air (A) by the fan 124. 202) and a second injection hole 204 for spraying the cooling gas (C) in a direction opposite to the flow direction of the air (A). In particular, the second injection hole 204 can spray the cooling gas (C) in a direction opposite to the flow of the air (A), so the front portion of the second injection hole 204, that is, the second injection hole 204 ) A vortex may be formed due to a collision between the cooling gas (C) and the air (A) on the upstream side, and thus condensation and freezing on the surfaces of the nozzle assembly 200 can be prevented. .

As an example, the nozzle assembly 200 is connected to the first injection hole 202 and the second injection hole 204 and includes an inner nozzle 210 for supplying the cooling gas (C), and the inner nozzle ( It may include an inner space 222 where 210 is disposed and an outer nozzle 220 having the first and second injection nozzles 202 and 204. In particular, the outer nozzle 220 is disposed around the first injection hole 202, is connected to the internal space 222, and contains a second gas (D) to prevent condensation caused by the cooling gas (C). ) and a fourth injection hole disposed around the second injection hole 204 and connected to the internal space 222 and for spraying the second gas (D). Fields 208 may be provided.

The third injection holes 206 may spray the second gas D in the same direction as the flow direction of the air A, and the fourth injection holes 208 may spray the second gas D in the same direction as the flow direction of the air A. The second gas (D) may be injected in the opposite direction. The nozzle assembly 200 is connected to the inner nozzle 210 and has a first pipe 230 for supplying the cooling gas (C), and is connected to the internal space 222 and the first pipe 230. ) and may include a second pipe 232 for supplying the second gas D to the internal space 222.

As an example, dry air may be used as the second gas (D). In particular, the cooling gas (C) may have a temperature lower than the target temperature of the inner chamber 120, for example, about -25°C, and the second gas (D) is applied to the cooling gas (C). The temperature may be above room temperature to prevent condensation. As an example, the temperature of the liquefied nitrogen gas used as the cooling gas (C) may be about -190°C, and the temperature of the dry air used as the second gas (D) may be about 30°C. In addition, the dry air D preferably has a dew point lower than the internal temperature of the inner chamber 120. As an example, the dry air (D) may have a dew point of about -70°C. However, the temperatures of the cooling gas (C) and the second gas (D) and the dew point of the second gas (D) are described as examples only, and various changes are possible. Accordingly, the scope of the present invention will not be limited by the temperature of the cooling gas (C) and the second gas (D) and the dew point of the second gas (D).

According to one embodiment of the present invention, the second and fourth injection holes are sprayed by the cooling gas (C) and the second gas (D) injected through the second injection hole 204 and the fourth injection hole 208. A vortex may be formed in the front portion of (204, 208), that is, on the upstream side of the second and fourth injection holes (204, 208), and the cooling gas (C) and the second gas (D) are mixed. In this state, it may flow along the outer surface of the nozzle assembly 200. In particular, the nozzle assembly 200 may have a streamlined outer surface disposed in the flow direction of the air A to reduce condensation on the outer surface. For example, as shown, the outer nozzle 220 may have an oval cross-sectional shape, and the first and second injection holes 202 and 204 may be disposed in the long axis direction of the outer nozzle 220. You can. As a result, the cooling gas C can flow quickly without being stagnant on the outer surface of the nozzle assembly 200, so condensation and freezing phenomena on the outer surfaces of the nozzle assembly 200 can be reduced. In addition, as shown, the inner nozzle 210 and the first pipe 230 through which the cooling gas (C) is supplied may be disposed within the flow path through which the second gas is supplied, so that condensation by the cooling gas (C) occurs. And freezing phenomenon can be further reduced.

FIG. 4 is a schematic cross-sectional view illustrating another example of the nozzle assembly shown in FIG. 3.

Referring to FIG. 4 , the nozzle assembly 200 may further include a propeller 240 disposed on the outer peripheral surface of the outer nozzle 220 to surround the second injection hole 204. The propeller 240 may be configured to be rotatable by a bearing and may be configured to be rotatable by the flow of the air (A). In particular, the propeller 240 may be used to prevent the flow of air (A) from stagnating on the outer surface of the nozzle assembly 200, and may be rotated by the flow of air (A), as shown. Although it is not possible, it can be forcibly rotated by a separate driving unit.

According to the embodiments of the present invention as described above, the nozzle assembly 200 can spray the cooling gas (C) in the direction of the flow of the air (A) by the fan 124, and the air ( The cooling gas (C) may be sprayed in a direction opposite to the flow direction of A). In addition, the nozzle assembly 200 may spray a second gas (D) for preventing condensation in the flow direction of the air (A), and may also spray the second gas (D) in a direction opposite to the flow direction of the air (A). Gas (D) can be sprayed.

As a result, a vortex may be formed in the front portion of the second and fourth injection holes 204 and 208, that is, on the upstream side of the nozzle assembly 200, and the vortex may form a vortex facing the flow of air A. Condensation and freezing phenomenon can be sufficiently reduced in the area where the second injection hole 204 and the fourth injection hole 208 are located. In addition, the inner nozzle 210 and the first pipe 230 for supplying the cooling gas (C) may be located within the supply passage of the second gas (D), so that the outer surfaces of the nozzle assembly 200 Condensation and freezing can be further reduced.

Although the present invention has been described above with reference to preferred embodiments, those skilled in the art may make various modifications and changes to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will be able to understand that it exists.

10: semiconductor package 20: test tray
30: Customer Tray 100: Test Handler
110: test chamber 120: inner chamber
122: circulation pipe 124: fan
130: Disock chamber 200: Nozzle assembly
202: first nozzle 204: second nozzle
206: third nozzle 208: fourth nozzle
210: inner nozzle 220: outer nozzle
222: Internal space 230: First pipe
232: second pipe 240: propeller

Claims (8)

A test chamber for electrically testing semiconductor packages, an inner chamber connected to the test chamber and for pre-regulating the temperature of the semiconductor packages, and a inner chamber for restoring the temperature of the semiconductor packages to room temperature after testing the semiconductor packages. A chamber, a circulation pipe for circulating the air inside the inner chamber, a fan for circulating the air through the circulation pipe, and a nozzle assembly for spraying cooling gas to control the temperature inside the inner chamber. In the test handler,
The nozzle assembly includes an inner nozzle for supplying the cooling gas, an inner space in which the inner nozzle is disposed, and an outer nozzle having a streamlined outer surface disposed in the direction of the air flow by the fan,
The outer nozzle includes a first injection port for spraying the cooling gas in the same direction as the air flow direction, a second injection port for spraying the cooling gas in a direction opposite to the air flow direction, and the first injection port. a plurality of third injection nozzles arranged around the second gas to prevent condensation caused by the cooling gas, and a plurality of third nozzles disposed around the second nozzle for injecting the second gas. Equipped with 4 nozzles,
The inner nozzle is connected to the first injection port and the second injection port to supply the cooling gas, the inner space is connected to the third injection port and the fourth injection port, and the second gas is connected to the inner space. A test handler, characterized in that the supply is supplied to the third injection port and the fourth injection port through the test handler. delete The test handler according to claim 1, wherein nitrogen gas is used as the cooling gas, and dry air is used as the second gas. delete The method of claim 1, wherein the nozzle assembly:
A first pipe connected to the inner nozzle and supplying the cooling gas,
A test handler connected to the internal space and configured to surround the first pipe, and further comprising a second pipe for supplying the second gas to the internal space. delete The test handler according to claim 1, wherein the nozzle assembly further includes a propeller disposed to surround the second nozzle and rotatable by the air flow. The method of claim 1, wherein the nozzle assembly includes a propeller configured to rotate while surrounding the second nozzle, and the propeller rotates to prevent the air flow from stagnating on the outer surface of the nozzle assembly. A test handler further comprising a driving unit that commands.

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