KR102615926B1 - Nozzle for forming shielding dam, EMI shielding structure, and method for EMI shielding structure - Google Patents

Abstract

A nozzle for forming a shielding dam, an electromagnetic wave shielding structure formed using the same, and a method of manufacturing the electromagnetic wave shielding structure are disclosed. The disclosed electromagnetic wave shielding structure includes a plurality of elements mounted on a printed circuit board; an insulating molding member covering the plurality of elements; a conductive shielding dam formed along a side of the insulating molding member; and a conductive shielding member formed on the upper surface of the insulating molding member.

Description

Nozzle for forming shielding dam, electromagnetic wave shielding structure and method for manufacturing electromagnetic wave shielding structure using the same {Nozzle for forming shielding dam, EMI shielding structure, and method for EMI shielding structure}

The present invention relates to a nozzle for forming a shielding dam and a method of manufacturing an electromagnetic wave shielding structure using the same. In particular, a nozzle for forming a shielding dam that forms an insulating molding member using a mold and forms a shielding material covering the insulating molding member and an electromagnetic wave shielding structure using the same. It relates to a manufacturing method of a shielding structure.

Recently, the demand for portable devices has been rapidly increasing in the electronics market, and along with this, there has been a continuous demand for miniaturization and weight reduction of portable devices for easy portability. In order to make portable devices smaller and lighter, not only technologies that reduce the individual sizes of electronic components included in portable devices, but also packaging technologies that integrate multiple circuit elements mounted on a printed circuit board into one package are required. In particular, semiconductor packages that handle high-frequency signals are required to be equipped with various electromagnetic wave shielding structures in order to not only miniaturize but also achieve excellent electromagnetic interference or electromagnetic wave immunity characteristics.

For this purpose, the conventional electromagnetic wave shielding structure covers various circuit elements with a shield can made of pressed metal, forms a shielding dam made of conductive material to surround the circuit elements, and inserts an insulator inside the shielding dam. It is a structure that covers each circuit element by injection and then forms a shielding layer on top.

In a shielding structure using a shield can, the shield can must be formed with a certain thickness to maintain its shape, and a certain distance must be maintained from each circuit element to avoid short circuiting with the circuit element. Due to the thickness of the shield can and the gap between the shield can and the circuit elements, there is a limit to lowering the height of the shield can. This limitation is a factor that hinders miniaturization of the shielding structure. Additionally, an air gap is formed between the shield can and the circuit element. The air gap acts as an insulator to prevent heat dissipation from circuit elements. To facilitate heat dissipation, ventilation holes should be formed on the top or side of the shield can. However, there is a problem in that electromagnetic waves leak through the ventilation holes formed in the shield can, so the electromagnetic wave shielding effect is reduced.

Additionally, as technology develops, the use of high-density packaging is increasing. In this case, since the spacing between circuit elements is set very narrow, it is very difficult to form a shielding dam that satisfies the required aspect ratio using existing processes.

In order to solve the above problem, the present invention provides a nozzle for forming a shielding dam that can be applied to a printed circuit board on which circuit elements are mounted at high density by forming a shielding dam relying on an insulating molding member covering the circuit elements, and an electromagnetic wave shielding structure using the same. The purpose is to provide a manufacturing method.

In addition, another object of the present invention is to provide a mold sealing method that can prevent the insulating material injected into the mold from leaking between the mold and the printed circuit board, and a method of manufacturing an electromagnetic wave shielding structure using the same.

In order to achieve the above object, the present invention includes a plurality of elements mounted on a printed circuit board; an insulating molding member covering the plurality of elements; a conductive shielding dam formed along a side of the insulating molding member; and a conductive shielding member formed on the upper surface of the insulating molding member.

The shielding dam may have an “L” shaped longitudinal cross-section that covers a portion of the side and top surfaces of the insulating molding member.

The aspect ratio of the shielding dam may be 1:3 or more. In this case, the viscosity of the material forming the shielding dam may be 20,000 cps or more.

The mounting gap between the devices may be 0.8 mm or less.

The inner surface of the shielding dam may be the same as the slope of the side of the insulating molding member. The slope of the inner side of the shielding dam may be the same as the slope of the side of the insulating molding member. The inner surface of the shield dam may be formed vertically or inclined.

The conductive shielding member may be a conductive shielding film attached to the upper surface of the insulating molding member.

The conductive shielding member may be made of a liquid conductive shielding material that is discharged by a nozzle and coated on the upper surface of the insulating molding member.

The present invention may further include an edge bridge having electrical conductivity that covers a portion where the electrical shielding dam and the conductive shielding member contact each other.

The lower end of the shield dam may be electrically connected to ground formed on the printed circuit board.

In order to achieve the above object, the present invention includes a plurality of elements mounted on a printed circuit board; a mold mounted on the printed circuit board to surround the plurality of elements; an insulating molding member that is injected into the mold and then molded to cover the plurality of elements; a conductive shielding dam formed along the side of the mold; and a conductive shielding member covering the upper surface of the mold and the upper surface of the insulating molding member. It is possible to provide an electromagnetic wave shielding structure including a.

The shielding dam may have an “L” shaped longitudinal cross-section that covers the side and top surfaces of the mold.

A sealant may be disposed between the bottom of the mold and the top surface of the printed circuit board.

In addition, in order to achieve the above object, the present invention includes the steps of providing a liquid sealant to a mold; Setting the mold so that the liquid sealant comes into contact with a printed circuit board on which circuit elements are mounted; Forming an insulating molding member covering the circuit element by injecting an insulating material into the mold; separating the mold from the printed circuit board; and forming a conductive shield covering the insulating molding member.

In addition, in order to achieve the above object, the present invention includes the steps of setting a mold to be spaced apart from a printed circuit board on which a circuit element is mounted; Injecting a liquid sealant between the mold and the printed circuit board; Forming an insulating molding member covering the circuit element by injecting an insulating material into the mold; separating the mold from the printed circuit board; and forming a conductive shield covering the insulating molding member.

In addition, in order to achieve the above object, the present invention includes the steps of setting a mold with a sealant attached at the bottom to a printed circuit board on which a circuit element is mounted; Forming an insulating molding member covering the circuit element by injecting an insulating material into the mold; A method of manufacturing an electromagnetic wave shielding structure can be provided, including forming a conductive shield that covers the mold and the insulating molding member together.

In addition, in order to achieve the above object, the present invention provides a nozzle that discharges a conductive material to form a shielding dam, comprising: an outlet through which the conductive material is discharged; and a guide portion extending from a portion of the discharge port along the longitudinal direction of the nozzle.

Figure 1a is a cross-sectional view showing an electromagnetic wave shielding structure according to an embodiment of the present invention.
1B and 1C are diagrams showing a structure in which the inner surface of a shielding dam is formed vertically or inclinedly.
FIG. 2 is a diagram showing the manufacturing process of the electromagnetic wave shielding structure shown in FIG. 1.
Figure 3 is a diagram showing an example of forming a shielding dam on the side of a nozzle insulating molding member on a printed circuit board on which circuit elements are highly integrated.
Figure 4 is a block diagram showing a material ejection device for forming a shielding structure.
Figure 5 is a diagram showing the movement path of the nozzle input through the input unit provided in the material discharge device.
Figure 6 is a diagram showing the nozzle of the material discharge device.
Figure 7 is a cross-sectional view showing an electromagnetic wave shielding structure according to another embodiment of the present invention.
FIG. 8 is a diagram showing the process of the electromagnetic wave shielding structure shown in FIG. 7.
FIG. 9 is a cross-sectional view showing an example of forming a shielding bridge that electrically connects a shielding dam and a shielding film in the electromagnetic wave shielding structure shown in FIG. 7.
Figure 10 is a schematic diagram showing an example of coating a shielding member on the upper surface of an insulating molding member.
Figure 11 is a schematic diagram showing an example of forming a shielding dam and a shielding member through a coating method.
FIG. 12 is a diagram illustrating a phenomenon that may appear in the insulating molding member when an insulating molding member is formed by applying a sealing member made of rubber to the bottom of the mold.
Figure 13 is a diagram showing the state of moving to a tray filled with liquid sealant in order to apply liquid sealant to the bottom of the mold.
Figure 14 shows a manufacturing process of an electromagnetic wave shielding structure according to another embodiment of the present invention, and is a diagram showing an example of vaporizing a liquid sealant.
Figure 15 shows the manufacturing process of an electromagnetic wave shielding structure according to another embodiment of the present invention, and is a diagram showing an example of removing the liquid sealant by post-processing.
Figure 16 shows the manufacturing process of an electromagnetic wave shielding structure according to another embodiment of the present invention, and is a diagram showing an example of injecting a liquid sealant between the mold and the printed circuit board after setting the mold.
Figure 17 shows the manufacturing process of an electromagnetic wave shielding structure according to another embodiment of the present invention, and shows an example of injecting liquid sealant between the mold and the printed circuit board after setting the mold and removing the liquid sealant through post-processing. am.
Figure 18 shows the manufacturing process of an electromagnetic wave shielding structure according to another embodiment of the present invention. When forming a plurality of shielding structures, the height of the insulating molding member is differentially controlled by controlling the amount of insulating material injected into the mold. This is a drawing showing an example.
Figures 19 and 20 respectively show the manufacturing process of an electromagnetic wave shielding structure according to still other embodiments of the present invention, and are diagrams showing an example of including the mold in the shielding structure without removing it.
Figure 21 is a perspective view showing a mobile phone terminal to which an electromagnetic wave shielding structure according to an embodiment of the present invention is applied.
Figure 22 is a perspective view showing a smart watch to which an electromagnetic wave shielding structure is applied according to an embodiment of the present invention.

In order to fully understand the configuration and effects of the present invention, preferred embodiments of the present invention will be described with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms and various changes can be made. However, the description of the present embodiments is provided to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the present invention of the scope of the invention. In the attached drawings, the components are enlarged in size for convenience of explanation, and the proportions of each component may be exaggerated or reduced.

When a component is described as being “on” or “adjacent to” another component, it should be understood that it may be in direct contact with or connected to the other component, but that another component may exist in between. something to do. On the other hand, when a component is described as being “right above” or “directly in contact” with another component, it can be understood that there is no other component in the middle. Other expressions that describe relationships between components, such as “between” and “directly between” can be interpreted similarly.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms may be used only for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, the second component may also be named a first component without departing from the scope of the present invention.

Singular expressions include plural expressions unless the context clearly dictates otherwise. Terms such as “comprises” or “has” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, including one or more other features or numbers, It can be interpreted that steps, operations, components, parts, or combinations of these can be added.

Unless otherwise defined, terms used in the embodiments of the present invention may be interpreted as meanings commonly known to those skilled in the art.

Electromagnetic wave shielding structures according to embodiments of the present invention can be applied to smart phones, display devices, wearable devices, etc.

The electromagnetic wave shielding structure according to embodiments of the present invention uses a mold to form an insulating molding member, and a nozzle is moved along the side of the insulating molding member to form a shielding dam. Since the shielding dam is formed by relying on the side of the insulating molding member, it can be molded while maintaining a high aspect ratio. In this way, by forming a shielding dam along the side of the insulating molding member, the width of the area where the material is discharged from the nozzle can be narrowed, so it can be applied to highly integrated mounting boards where the spacing between circuit elements is very narrow.

Additionally, the electromagnetic wave shielding structure according to embodiments of the present invention may apply a liquid sealant to prevent the insulating material injected into the mold from leaking through a gap that may be formed between the mold and the printed circuit board. Depending on the material, the liquid sealant can be vaporized at a temperature higher than the curing temperature of the insulating molding member and removed from the printed circuit board. If it is made of a material that does not vaporize, it can be removed from the printed circuit board through post-processing after the insulating molding member has hardened. It can be.

In addition, the electromagnetic wave shielding structure according to embodiments of the present invention is described as shielding a plurality of circuit elements, but is not limited thereto and may be formed to shield only a single circuit element.

Hereinafter, with reference to the attached drawings, the structure of the above-described nozzle, the process of forming a shielding dam using this nozzle, and an example of using a liquid sealant when forming an insulating molding member will be described in detail.

Figure 1a is a cross-sectional view showing an electromagnetic wave shielding structure according to an embodiment of the present invention.

Referring to FIG. 1A , the electromagnetic wave shielding structure 100 may include a printed circuit board 110 and a plurality of circuit elements 115, 117, and 119 mounted on the printed circuit board 110. Here, the plurality of circuit elements are heterogeneous circuit elements and may be IC chips, passive elements, and heterogeneous components. For example, IC chips may be APs (application processors), memory, RF (Radio Frequency) chips, etc., passive elements may be resistors, condensers, coils, etc., and the heterogeneous parts may be connectors, card sockets, and electromagnetic waves. It may be a shielding part, etc.

A first connection pad 111 and a second connection pad 112 to which a plurality of circuit elements 115, 117, and 119 are electrically connected, respectively, may be patterned on the upper surface of the printed circuit board 110. There may be multiple first and second connection pads 111 and 112. The first and second connection pads 111 and 112 may be formed to ground the plurality of circuit elements 115, 117, and 119 or to transmit signals.

The printed circuit board 110 may have a ground pad 114 patterned. The ground pad 114 may be formed inside the printed circuit board 110 with the top surface of the ground pad 114 exposed so as not to protrude from the top surface of the printed circuit board 110 . In this case, the ground pad 114 may be formed integrally with the ground layer (not shown) formed within the printed circuit board 110.

The ground pad 114 may be formed to ground the plurality of circuit elements 115, 117, and 119 or to transmit signals. When the shield dam 130, which will be described later, is formed on the printed circuit board 110, it can be grounded by electrically contacting the ground pad 114 formed along the formation path of the shield dam or in part of the formation path. .

The circuit element 115 may include a plurality of connection terminals 116 electrically connected to the first connection pad 111 of the printed circuit board 110. The plurality of connection terminals 116 may be formed, for example, in a BGA (ball grid array) method, such as a solder ball. However, these connection terminals 116 are not limited to the BGA type, and can be used in various ways depending on the lead shape of the element 115, for example, QFN (Quad Flat No Lead), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Of course, it can be done in various ways, such as Package), SOP (Small Out Line Package), and TSOP/SSOP/TSSOP (Thin/Shrink/Thin Shrink SOP).

The remaining circuit elements 117 and 119 may include at least one connection terminal (not shown) electrically connected to the second connection pad 112 of the printed circuit board 110. When the plurality of circuit elements 117 and 119 are mounted on the printed circuit board 110, their height may be smaller or larger than that of the circuit element 115 described above. Each of the circuit elements 115, 117, and 119 is arranged at predetermined intervals so as not to contact the shield dam 130.

Referring to FIG. 1, the electromagnetic wave shielding structure 100 according to an embodiment of the present invention includes an insulating molding member 120 covering a plurality of circuit elements 115, 117, and 119, and an insulating molding member 120 formed along the side of the insulating molding member 120. It may include a shielding dam 130 and a shielding member 140 formed on the upper surface of the insulating molding member 120.

The insulating molding member 120 insulates between each circuit element 115, 117, and 119, between each circuit element 115, 117, and 119 and the shielding dam 130, and between each circuit element and the shielding member 140.

The insulating molding member 120 may be formed by injecting an insulating material into the mold 10 and then curing it. At this time, the insulating material can be in close contact with the outer surface of the circuit elements 115, 117, and 119, and can be made of a material that has fluidity so that it can enter the gap formed between each circuit element 115, 117, and 119 and the printed circuit board. The insulating molding member 120 may be hardened through various curing treatments such as room temperature curing, heat curing, and UV curing.

The insulating material may be a flowable thixotropic material or a phase change (thermoplastic, thermosetting) material.

Thixotropic materials include synthetic fine silica, bentonite, fine particle surface-treated calcium carbonate, hydrogenated castor oil, metal stone gum, aluminum stearate, polyimide wax, oxidized polyethylene, and linseed. It may contain at least one of polymerized oils. For example, the metal stone sword system may include aluminum stearate.

Phase change materials include polyurethane, polyurea, polyvinyl chloride, polystyrene, acrylonitrile butadiene styrene, polyamide, acrylic, and epoxy ( It may include at least one of epoxy), silicone, and PBTP (polybutylene terephthalate).

The shielding dam 130 is molded along the side of the hardened insulating molding member 120. In this case, the shielding dam 130 is formed while resting on the side of the insulating molding member 120 and covers a portion of the side and top surface of the insulating molding member 120. In this way, when the shielding dam 130 is formed relying on a predetermined structure such as the insulating molding member 120, it is more likely to be formed in a free standing type that forms its own shape without relying on a separate structure. Can be formed with higher aspect ratios. Here, the aspect ratio of the shield dam is the height of the shield dam 130 divided by the width of the shield dam. In the case of the shielding dam 130 formed by relying on the side of the insulating molding member 120 as described above, if the viscosity is about 20,000 cps or more, it may be formed to have an aspect ratio of 1:3 or more. Meanwhile, in the case of a shielding dam formed by the free standing method, if the viscosity is about 80,000 cps or more, a dam with an aspect ratio of 1:2 or more can be formed. Therefore, when forming the shielding dam 130 by relying on the side of the insulating molding member 120 as in the present embodiment, even if it is formed of a material with a lower viscosity compared to the shielding dam formed through the free standing method, the high viscosity is higher. It can be formed to have an aspect ratio.

The shielding dam 130 may be made of a conductive material with electromagnetic wave shielding properties that can prevent electromagnetic interference (EMI). Accordingly, the shielding dam 130 can prevent EMI that may affect other electronic components in an electronic device including the electromagnetic wave shielding structure 100 by shielding electromagnetic waves generated from the plurality of circuit elements 115, 117, and 119. there is. By fundamentally blocking interference such as electromagnetic noise or malfunction in an electronic device including the electromagnetic wave shielding structure 100, it is possible to prevent the reliability of the product from deteriorating. In this way, the shielding dam 130 can prevent electromagnetic waves inevitably generated during the operation of the circuit elements 115, 117, and 119 from influencing the outside.

The conductive material is formed with a high aspect ratio (r) when forming the shielding dam 130 and may have a high viscosity (more than 100,000 cP) that can maintain the discharged shape without flowing down after discharge. In this way, when the material has high viscosity, the aspect ratio of the shielding dam 130 can be increased and the height of the shielding dam can be formed high.

In addition, when a high-viscosity conductive material is used, if the printed circuit board is a double-sided board, even if the printed circuit board is turned over to form a shielding dam on the back immediately after forming a shielding dam on the front, the shielding dam formed on the front does not flow down. It can maintain its shape. Therefore, there is an advantage in that the overall work process can proceed quickly.

Specifically, the conductive material forming the shielding dam 130 may be made of an electrically conductive material having an electrical conductivity of 1.0E+04 S/m or more. Such electrically conductive materials may include electrically conductive filler and binder resin.

As electrically conductive fillers, metals such as Ag, Cu, Ni, Al, Sn, or conductive carbon such as carbon black, carbon nanotubes (CNT), and graphite are used. Alternatively, metal coated materials such as Ag/Cu, Ag/Glass fiber, and Ni/Graphite may be used, or conductive polymer materials such as polypyrrole and polyaniline may be used. Additionally, the electrically conductive filler may be made of any one or a mixture of flake type, sphere type, rod type, and dendrite type.

Silicone resin, epoxy resin, urethane resin, alkyd resin, etc. can be used as the binder resin. The material forming the shielding dam 130 may additionally contain additives (thickeners, antioxidants, polymer surfactants, etc.) and solvents (water, alcohol, etc.) to improve other performance.

Meanwhile, the shielding dam 130 is formed in a state that rests on the side of the insulating molding member 120, as described above, and covers a portion of the side and top surface of the insulating molding member 120. Accordingly, as shown in Figure 1b, the longitudinal cross-section of the shielding dam 130 may be approximately 'L' shaped. In this case, the slope of the inner surface 130c of the shielding dam 130 may be formed to be the same as the slope of the side surface 120c of the insulating molding member 120. As shown in FIG. 1B, when the side surface 120c of the insulating molding member 120 is formed at a right angle to the upper surface of the printed circuit board 110, the inner surface 130c of the shielding dam 130 may be formed vertically. In addition, as shown in FIG. 1C, when the side surface 120d of the insulation molding member 120 is formed to be inclined as the lower part of the insulation molding member 120 is formed longer than the upper part, the inner surface 130d of the shielding dam 130 is insulated. It may have the same inclination as the inclination of the side surface 120d of the molding member 120. Meanwhile, when the shielding dam is formed in a free-standing manner (a method in which the shielding dam is formed to have a predetermined aspect ratio on its own without relying on a separate structure), the lower width of the shielding dam is formed to be wider than the upper width. Accordingly, the inclination direction of the inner surface 130d of the shield dam 130 of the present embodiment of the free-standing shielding dam is reversed.

Referring to Figure 1b, the shielding dam 130 is formed on the upper side of the insulating molding member 120 by contacting the edge portion 140e of the shielding member 140 with the upper end 130e of the insulating molding member 120. It can completely cover the outer surface of (120). In this case, a portion of the upper end 130e of the shielding dam 130 may be covered by the edge portion 140e of the shielding member 140.

The shielding member 140 is made of a conductive material with fluidity like the shielding dam 130, and may be made of the same material as the material forming the shielding dam 130 described above.

The shielding member 140 is formed on the upper surface of the insulating molding member 120. When the shielding dam 130 is molded along the side of the insulating molding member 120, the upper end 131 of the shielding dam 130 protrudes higher than the upper surface of the insulating molding member 120. Accordingly, a space that can be filled with the shielding member 140 may be provided on the upper surface of the insulating molding member 120.

The shielding member 140 may be electrically connected while contacting the upper end 131 of the shielding dam 130 when the upper surface of the insulating molding member 120 is filled. Accordingly, the shielding dam 130 and the shielding member 140 completely surround the outside of the insulating molding member 120, so that an optimal shielding structure can be achieved.

Hereinafter, the manufacturing process of the electromagnetic wave shielding structure 100 according to an embodiment of the present invention will be sequentially described with reference to FIG. 2.

Figure 2 is a diagram sequentially showing the manufacturing process of an electromagnetic wave shielding structure according to an embodiment of the present invention, and Figure 3 shows a shielding dam formed on the side of an insulating molding member using a nozzle on a printed circuit board on which circuit elements are highly integrated. This is a drawing showing an example of formation.

First, when the printed circuit board 110 on which a plurality of circuit elements 115, 117, and 119 are mounted as shown in FIG. 2(a) is loaded into the working position, the mold 10 is placed on the printed circuit board 110 as shown in FIG. 2(b). It is placed at a position where the insulating molding member 120 will be formed.

Subsequently, after injecting a fluid insulating material into the inside 11 of the mold 10 as shown in FIG. 2(c), the printed circuit board 110 is placed in an oven (not shown) for a preset time to cure the insulating material. ) and heat to a predetermined temperature. The insulating material hardened on the inside 11 of the mold 10 becomes the insulating molding member 120.

When the insulating molding member 120 is formed, the printed circuit board 110 is taken out of the oven, and then the mold 10 is separated from the printed circuit board 110 as shown in FIG. 2(d).

Subsequently, as shown in FIG. 2(e), a certain amount of conductive material is continuously discharged along the side of the insulating molding member 120 to cover a portion (rim) of the side and upper surface of the insulating molding member 120. ) is formed. The conductive material is discharged from a nozzle 216 (see FIG. 3) that moves along the side of the insulating molding member 120.

Referring to FIG. 3, the nozzle 216 has a discharge port 216a formed at the bottom, and a guide portion 216b extends a predetermined length from one side of the discharge port 216a along the longitudinal direction of the nozzle 216. In this case, the discharge port 216a of the nozzle 216 is disposed at a higher position than the upper surface of the insulating molding member 120, and the guide portion 216b is connected to the side of the insulating molding member 120 and a predetermined circuit element 20. ) can be arranged so that it can pass between. The guide portion 216b guides the material discharged from the discharge port 216a to face the side of the insulating molding member 120.

The shape of the part of the nozzle 216 where the material is discharged is designed to allow the nozzle 216 to be moved smoothly even on a highly integrated printed circuit board. That is, in the case of a highly integrated printed circuit board, the gap g1 between the circuit element 115 and the circuit element 20 is designed to be very narrow, at 0.8 mm or less. Assuming that the spacing (g1) between elements is 0.8 mm, the outer diameter (D) of the nozzle 216 can be set to 0.9 mm, the thickness (t) is 0.1 mm, and the inner diameter (d) can be set to 0.8 mm. Here, the inner diameter (d) of the nozzle 216 is the same as the diameter of the discharge port (216a). The guide portion 216b extending downward from the discharge port 216a may have a predetermined length (L) and width (w). In this case, the width (w) of the guide portion 216b is determined between one side of the guide portion 216b and the insulating molding member when the guide portion 216b is located between the side of the insulating molding member 120 and the circuit element 20. It is sufficient as long as a gap is maintained between the sides of the guide portion 216b and the circuit element 20 is maintained. For example, if the distance g2 between the other side of the guide portion 216b and the side of the insulating molding member 120 is 0.5 mm, the gap between one side of the guide portion 216b and the side of the insulating molding member 120 (g3) can be maintained at 0.1mm.

Some of the material discharged through the discharge port 216a is discharged while contacting the guide portion 216b. At this time, the part of the material that is in contact with the guide portion (216b) is in contact with the inner surface of the guide portion (216b), and frictional resistance is generated between the material and the guide portion (216b), so that the remaining portion of the material is not in contact with the guide portion (216b). Since the frictional resistance caused by the silver guide portion 216b does not act or is hardly affected, the discharge speed becomes somewhat faster.

In this way, a phenomenon occurs in which a speed difference occurs as materials simultaneously discharged through the discharge port 216a exit the discharge port 216a. Considering this phenomenon, the length (L) of the guide portion 216b can be set. For example, when the nozzle 216 continues to move along the side of the insulating molding member 120 at a constant speed and discharges the material through the discharge port 216a, if the length of the guide portion 216b is too long, the discharge port 216a Among the materials discharged from ), a portion of the material adjacent to the guide portion 216b moves toward the insulating molding member 120 before being guided to the bottom of the guide portion 216b. As a result, the lower part of the shielding dam 130 may be thinner than the upper part or may not cover the lower side of the insulating molding member 120. Additionally, if the length of the guide portion 216b is too short, the lower portion of the shield dam 130 may be thicker than the upper portion or may not cover the upper side of the shield dam 130. Accordingly, the length L of the guide portion 216b may affect the shaping of the shielding dam 130 and can be formed appropriately by considering the height of the insulating molding member 120.

Meanwhile, when the nozzle 216 moves along the insulating molding member 120 to form the shielding dam 130, the guide portion 216b is used to attach the material discharged through the discharge port 216a to the insulating molding member 120. The inner surface is disposed to face the insulating molding member 120.

Figure 4 is a block diagram showing a material ejection device for forming a shielding structure, Figure 5 is a diagram showing the movement path of the nozzle input through the input unit provided in the material ejection device, and Figure 6 is a diagram showing the nozzle of the material ejection device. This is a drawing that represents.

To form the electromagnetic wave shielding structure according to this embodiment, the material ejection device may be a 3D printer.

The material discharge device 200 is described as an example in which there is only one nozzle 216, but it is not limited to this and may be provided with a plurality of nozzles. In particular, in order to form the shielding dam 130 having different heights on the side of the insulating molding member 120, a plurality of different nozzles with different lengths of the guide portion 216b may be provided.

Referring to FIG. 4 , the material discharging device 200 may include a dispenser 212 for discharging a predetermined amount of material. The dispenser 212 may include a storage chamber 211 for storing the material, and a nozzle 216 for discharging the material supplied from the storage chamber 211.

In addition, the dispenser 212 includes an X-Y-Z axis moving unit 231 for moving the nozzle 216 in the It may include a rotation drive unit 219 that can be stopped. The X-Y-Z axis moving unit 231 may be provided with a plurality of motors (not shown) for moving the nozzle 216 to the It is connected to a nozzle mounting unit (not shown) where a nozzle is mounted for delivery. The rotation driver 219 may include a motor (not shown) that provides rotational power, and an encoder (not shown) for controlling the rotation angle of the nozzle 216 by detecting the number of rotations of the motor. The X-Y-Z axis moving unit 231 and the rotation driving unit 219 are electrically connected to the control unit 250 and are controlled by the control unit 250.

The material discharge device 200 may include an input unit 253 through which the user can directly input the movement path of the nozzle 216.

The input unit 253 may be formed as a touch screen capable of touch input or may be formed as a typical keypad. The user can input the nozzle path through the input unit 253. This nozzle path is input once, and the nozzle path data input in this way is stored in the memory 251. Of course, it is possible to modify the nozzle path data in the future. The process of inputting the nozzle path through the input unit 253 is as follows.

First, photograph at least two reference marks displayed on the printed circuit board loaded into the working position through a vision camera, measure the distance between the two reference marks, and then calculate the distance value between the images of each reference and the two reference marks. is stored in memory 251. If the printed circuit board is rectangular, two reference marks may be displayed on the upper left and lower right sides of the printed circuit board. In this case, the distance between the two reference marks may approximately represent the straight line length in the diagonal direction of the printed circuit board.

Specifically, when the printed circuit board is loaded to the working position, the user moves the vision camera to the position where the first reference mark is located in the upper left corner through the forward, backward, left, and right movement buttons provided on the input unit 253 (e.g., After moving to the center of the first reference mark (based on the center of the first reference mark or a portion of the first reference mark) and pressing the save button provided on the input unit 253, the control unit 250 moves to the preset origin (0,0,0). By calculating the distance away from the first reference mark, the coordinates (X1, Y1, Z1) of the first reference mark are obtained and stored in the memory. The shooting position of the vision camera that moves with the nozzle is offset at a certain distance from the center of the nozzle. Accordingly, the coordinates (X1, Y1, Z1) of the first reference mark are calculated by the control unit 250 by calculating the offset value. Additionally, when the user presses the capture button, the image of the first reference mark is stored in the memory 251.

Next, the user uses the forward, backward, left, and right movement buttons provided on the input unit 253 to move the vision camera to the location where the second reference mark is at the bottom right (for example, the center of the second reference mark or the second reference mark). After moving a portion of the mark (based on a portion of the mark) and pressing the save button provided on the input unit 253, the control unit 250 calculates the distance the second reference mark is from the preset origin (0,0,0). Then, the coordinates (X2, Y2, Z2) of the second reference mark are obtained and stored in memory. Additionally, when the user presses the photographing button, the image of the second reference mark is stored in the memory 251. The coordinates (X2, Y2, Z2) of the second reference mark are calculated by calculating the offset value by the control unit 250, similar to the process of calculating the coordinates (X1, Y1, Z1) of the first reference mark described above.

The control unit 250 uses the positions of the first and second reference marks detected as described above to calculate the gap between the two positions and stores it in the memory 251.

Next, the user uses the forward, backward, left, and right movement buttons on the input unit 253 to move the vision camera along the path of the shielding dam to be formed on the printed circuit board, while viewing the real-time image captured by the vision camera with the naked eye. As you check, enter multiple coordinates located on the nozzle's movement path. The coordinates are input by pressing the coordinate input button provided on the input unit 253 when the vision camera is located at a point on the nozzle's movement path. The coordinates input in this way are stored in the memory 251.

The plurality of coordinates are as follows: the coordinates of the point where the nozzle starts discharging the material (Ap, see Figure 5), the coordinates of the point where the nozzle finishes discharging (if the shielding dam forms a closed curve, the starting point (Ap) and can be placed almost adjacently), and are angular coordinates for points at which the nozzle must change direction during movement (Bp, Cp, Dp, Ep, Fp, see FIG. 5).

In addition, in order to program the nozzle's movement path, the input unit 253 includes a movement button to move the nozzle to a designated coordinate, a line button to issue a command to move the nozzle while discharging material, and a line button to change the direction of movement of the nozzle. Various command buttons, such as a rotation button, may be provided. The user can create the nozzle's movement path by matching the command buttons with the coordinates and rotation angle.

If the nozzle's movement path is programmed by the user as described above, the control unit 250 can automatically form a shielding dam on the printed circuit board by discharging the material while moving the nozzle along the movement path.

In this way, the nozzle path data input through the input unit 253 may be stored in the memory 251. The control unit 250 operates the X-Y-Z axis moving unit 231 and the rotation driving unit 219 according to the nozzle path data stored in the memory 251 to move the nozzle along a pre-entered path. The nozzle path data includes the distance by which the nozzle 216 moves in a straight line along the upper surface of the printed circuit board 110, and the rotation direction and angle of the nozzle 216.

Meanwhile, in this embodiment, it has been explained that the user directly inputs the nozzle's movement path through the input unit 253, but the nozzle movement path is not limited to this and can be stored in advance in the memory 251. In this case, it may vary depending on the product. A plurality of nozzle movement paths corresponding to each pattern can be stored in advance to correspond to the pattern of the shielding dam that is formed. Additionally, in addition to the movement path of the nozzle, calibration information, reference position information of the nozzle, PCB reference position information, PCB reference height information, etc., in addition to the movement path of the nozzle, can be stored in advance in the memory 251 through the input unit 253.

Figure 5 is a diagram showing the movement path of the nozzle input through the input unit provided in the material discharge device.

The nozzle 216 can move along a path to form a shielding dam based on the nozzle path data, and a specific example will be described with reference to FIG. 5.

The nozzle 216 is set at coordinates corresponding to the starting point (Ap). At this time, the control unit 250 determines the direction in which the molding member 120 is disposed and operates the rotation drive unit 219 so that the inner surface of the guide part 216b faces the side of the insulating molding member 120 to form the nozzle 216. ) is rotated at a predetermined angle.

In this way, the nozzle 216 set at the coordinates corresponding to the starting point (Ap) moves linearly by section A in the +Y axis direction by the X-Y-Z axis moving unit 231. Next, the nozzle 216 moves along the section where the path bends (a section including the point (Bp) connecting section A and section B). In this case, the nozzle 261 is moved along the nozzle path by the ) rotates.

When the nozzle 216 passes a section where the path is bent, it moves linearly in the -X-axis direction as much as section B by the X-Y-Z axis moving unit 231. In this way, the nozzle 216 returns to the starting point (Ap) by repeating linear movement and rotation in the remaining sections B, C, D, E, and F sequentially by the rotation driving unit 219 and the X-Y-Z axis moving unit 231. The path movement of the nozzle 216 is completed. FIG. 6 is a diagram showing a discharge port through which the material for forming a shielding dam is discharged through the nozzle of the material discharge device.

Referring to FIG. 6, the nozzle 216 moves by the

The discharge port 216a is formed toward the lower side of the nozzle 216, and the guide portion 216b is formed to extend downward from the bottom of the discharge port 216a along the longitudinal direction of the nozzle 216.

When the nozzle 216 is set to a position for discharging the material as shown in FIG. 3 in order to form the shielding dam 130 along the side of the insulating molding member 120, the discharge port 216a is the material in the insulating molding member ( A partial area is located on the upper surface of the insulating molding member 120 so as to cover a portion (rim) of the upper surface of the insulating molding member 120. The guide portion 216b is disposed between the insulating molding member 120 and the circuit element 20, and is disposed so as not to interfere with the insulating molding member 120 and the circuit element 20 when the nozzle 216 moves.

The guide portion 216b guides the material discharged from the discharge port 216a to move to the lower side of the insulating molding member 120 and prevents the material from spreading in a direction away from the insulating molding member 120, thereby maintaining the insulating molding member 120. Guides you to attach it toward .

The nozzle 216 moves along a preset path to form the shield dam 130 on the side and top surfaces of the insulating molding member 120, and at the same time contacts the ground pad 114. Guide the material to the ground pad (114).

The above-described electromagnetic wave shielding structure 100 forms the shielding member 140 by injecting a conductive material with fluidity into the upper surface of the insulating molding member 120, thereby shielding the upper surface of the insulating molding member 120. Hereinafter, a structure for shielding the upper surface of the insulating molding member 120 by attaching a film-type shielding member 140 will be described.

Figure 7 is a cross-sectional view showing an electromagnetic wave shielding structure according to another embodiment of the present invention;

FIG. 8 is a diagram showing the process of the electromagnetic wave shielding structure shown in FIG. 7.

The electromagnetic wave shielding structure 100a shown in FIG. 7 is the same as the electromagnetic wave shielding structure 100 described above in which the insulating molding member 120 is formed using the mold 10, and the conductive shielding film 150 is used. The fact that the shielding dam 130 is formed after forming the conductive shielding film 150 is somewhat different from the electromagnetic wave shielding structure 100 described above.

Hereinafter, the manufacturing process of the electromagnetic wave shielding structure 100a according to another embodiment of the present invention will be sequentially described with reference to FIG. 8.

First, when the printed circuit board 110 on which a plurality of circuit elements are mounted as shown in FIG. 8(a) is loaded into the working position, the mold 10 is insulated and molded on the printed circuit board 110 as shown in FIG. 8(b). It is placed at the position where the member 120 will be formed.

Subsequently, after injecting a fluid insulating material into the inside 11 of the mold 10 as shown in FIG. 8(c), the printed circuit board 110 is placed in an oven (not shown) for a preset time to cure the insulating material. ) and heat to a predetermined temperature. The insulating material hardened on the inside 11 of the mold 10 becomes the insulating molding member 120.

When the insulating molding member 120 is formed, the printed circuit board 110 is taken out of the oven, and then the mold 10 is separated from the printed circuit board 110 as shown in FIG. 8(d).

Next, the conductive shielding film 150 is attached to the upper surface of the insulating molding member 120 as shown in FIG. 8(e). In this case, the size of the conductive shielding film 150 may be the same as the size of the upper surface of the insulating molding member 120. This is to ensure that the upper part 131 of the shielding dam 130 overlaps the upper part of the conductive shielding film 150 during the subsequent process of forming the shielding dam 130, thereby realizing complete shielding without a gap. Meanwhile, the size of the conductive shielding film 150 may be somewhat smaller than the size of the upper surface of the insulating molding member 120. In this case, it is necessary to mold the upper end 131 of the shielding dam 130 to a length that can cover the edge portion of the conductive shielding film 150.

After attaching the conductive shielding film 150 to the upper surface of the insulating molding member 120, the nozzle 216 moves along the side of the insulating molding member 120 and continuously discharges a certain amount of conductive material to form the insulating molding member 120. A shielding dam 130 covering the side of 120 and a portion (rim) of the conductive shielding film 150 is formed.

FIG. 9 is a cross-sectional view showing an example of forming a shielding bridge that electrically connects a shielding dam and a conductive shielding film in the electromagnetic wave shielding structure shown in FIG. 7.

If the size of the conductive shielding film 150 is smaller than the size of the upper surface of the insulating molding member 120, the conductive shielding film 150 cannot cover the edge of the upper surface of the insulating molding member 120 and the upper portion of the shielding dam 130 ( 131) and the conductive shielding film 150 may have a gap, and electromagnetic waves may leak through this gap, thereby reducing the shielding efficiency.

In this case, as shown in Figure 9, in order to fill the gap between the upper part 131 of the shielding dam 130 and the conductive shielding film 150, the edge bridge 160 is connected to the upper part 131 of the shielding dam 130 and the conductive shielding film 150. It is formed to simultaneously overlap the shielding film 150. The edge bridge 160 may be made of a conductive material with the same fluidity as the material forming the shielding dam 130. Since the material forming the edge bridge 160 has fluidity, it can effectively fill the gap between the upper end 131 of the shielding dam 130 and the conductive shielding film 150.

The edge bridge 160 is in electrical contact with the shielding dam 130 and the conductive shielding film 150, and covers the gap between the upper part 131 of the shielding dam 130 and the conductive shielding film 150, thereby improving shielding efficiency. This deterioration can be prevented.

Figure 10 is a schematic diagram showing an example of coating a shielding member on the upper surface of an insulating molding member.

Meanwhile, as described above, the conductive shielding film 150 may be attached to the upper surface of the insulating molding member 120, but is not limited to this and the shielding member may be formed on the upper surface of the insulating molding member through a coating method.

That is, the electromagnetic wave shielding structure 100' forms the insulating molding member 120 using the mold 10, and the process of forming the shielding dam 130 on the side of the insulating molding member 120 is the electromagnetic wave shielding described above. Same as structure (100). After forming the shielding dam 130, the spray nozzle 190 is moved along the upper side of the insulating molding member 120 as shown in FIG. 10(a), and an electrically conductive material is applied to the insulating molding member 120 from the spray nozzle 190. ) can be used to form a shielding member 150' of a predetermined thickness as shown in Figure 10(b). In this case, the amount of spraying the material is sufficient as long as the insulating molding member 120 is not exposed.

When spraying the electrically conductive material, it can be sprayed to cover the top of the shielding dam 130 to prevent a gap between the shielding member 150' and the shielding dam 130, thereby achieving complete shielding.

In the above, it has been described that the shielding member 150' is coated after forming the shielding dam 130, but this is not limited to this, and the shielding member 150' is first coated on the upper surface of the insulating molding member 120, Of course, it is also possible to form a shielding dam 130.

Additionally, the shielding member 150' may be coated on the upper surface of the insulating molding member 120 using various methods such as screen printing and ink jetting instead of the spraying method described above.

Although not shown in the drawing, it is of course possible to coat the upper surface of the insulating molding member 120 with the shielding member 150' and then form the shielding dam 130 along the side of the insulating molding member 120.

In this case, the viscosity of the material forming the shielding member 150' may be about 10,000 cps or more to prevent the shielding member 150' from flowing down from the upper surface of the insulating molding member 120. Figure 11 is a schematic diagram showing an example of forming a shielding dam and a shielding member through a coating method.

The electromagnetic wave shielding structure 100'' is the same as the electromagnetic wave shielding structure 100 described above in that the insulating molding member 120 is formed using the mold 10. After forming the insulating molding member 120, move the spray nozzle 190 along the upper side of the insulating molding material 120 as shown in FIG. 11(a) and apply an electrically conductive material from the spray nozzle 190 to the ground pad 114. ) and spraying on the side and upper surfaces of the insulating molding member 120, the shielding dam 130" and the shielding member 150" can be formed together as shown in FIG. 11(b). At this time, the shielding dam 130" may be formed to have the same or similar thickness as the shielding member 150", and may be formed to have a thinner thickness than the aforementioned shielding dam 130'.

The shielding dam 130" and the shielding member 150" are coated on the insulating molding member 120 in one process through a spraying method, so the process time can be reduced, and the shielding member 130" and the shielding dam 150" can be coated on the insulating molding member 120 in one process. ") There is little risk of a gap forming between the liver.

In addition, the shielding dam 130" and the shielding member 150" are formed on the upper surface of the insulating molding member 120 using various methods such as conventional screen printing and ink jetting instead of the spraying method described above. can be coated on FIG. 12 is a diagram illustrating a phenomenon that may appear in the insulating molding member when an insulating molding member is formed by applying a sealing member made of rubber to the bottom of the mold.

When forming the insulating molding member 120 on the printed circuit board 110, if the bottom of the mold 10 is not completely adhered to the upper surface of the printed circuit board 110, the bottom of the mold 10 and the printed circuit board The insulating material injected into the inside 11 of the mold 10 may leak through a gap formed between the upper surfaces of 110.

To prevent this, a sealing member 12 made of a rubber material is used in conjunction with the bottom of the mold 10. In this case, when the mold 10 is placed on the printed circuit board 110, the sealing member 12 is elastic and is in close contact with the printed circuit board 110, so that the insulating material injected into the inside 11 of the mold 10 is There is no leakage to the outside of the mold (10).

However, since the elasticity of the sealing member 12 decreases when used for a long time, both sides of the sealing member 12 are deformed to protrude to the inside and outside of the mold 10, respectively, as shown in FIG. 12(a). The lower side of the insulating molding member 120 is hardened with a concave groove 120a formed by the side portion 12a of the sealing member 12 protruding toward the inner side 11 of the mold 10. However, if the side of the insulating molding member 120 is not formed to be flat, it may be difficult to mold the shielding dam 130 on the side of the insulating molding member 120 with a preset aspect ratio. This may cause product defects, such as a portion of the conductive material discharged in a certain amount from the nozzle 216 to form the shielding dam 130, flowing into the groove 120a, lowering the height of the shielding dam 130. .

In addition, after curing the insulating molding member 120 as shown in FIG. 12(b), when the mold 10 is removed from the printed circuit board 110, the sealing member protrudes toward the inner side 11 of the mold 10. A portion of the side of the insulating molding member 120 is pulled in the direction of separating the mold 10 by the side portion 12a of (12), and the bottom portion 120b of the insulating molding member 120 is pulled to the upper surface of the printed circuit board 110 ( It can be separated from 110a).

In order to prevent this problem, it is inconvenient to replace the deformed sealing member 12 with a new sealing member 12, and there is a problem in that the process must be stopped while replacing the sealing member 12.

The present invention can solve the above problems caused by applying the sealing member 12 made of rubber to the mold 10 using a liquid sealant. Liquid sealant can replace the sealing member 12, and does not deform the side of the insulating molding member 120 because the insulating material injected into the mold 10 is completely hardened and then vaporized. Additionally, when the mold 10 is separated from the printed circuit board 110 after the insulating molding member 120 is completely cured, the liquid sealant has already evaporated and disappeared, so it does not affect the insulating molding member 120.

The liquid sealant must be made of a material that does not miscible with the liquid insulating material injected into the inner axis of the mold (10), and has good wettability (or spreadability) to prevent separation from the bottom (15) of the mold (10). It must have low spreadability so that it can maintain the desired shape, can be easily removed by post-processing under the curing conditions of the molding member or after releasing the mold, and must not leave any residue. For this purpose, the liquid sealant must have weaker applicability and spreadability on the surface of the printed circuit board than on the surface of the mold.

Here, spreadability refers to the property of maintaining the form of a continuous film by burying the liquid sealant on the bottom 15 of the mold 10. Spreadability refers to the extent to which the shape of the film maintains the wall shape and does not form a thin and wide coating. The unit of measurement for spreadability and spreadability can be expressed as contact angle (the angle formed when a liquid is thermodynamically balanced on a solid surface). Additionally, the unit of measurement for applicability and spreadability can be expressed as the surface tension of the liquid sealant or the surface energy of the mold and printed circuit board.

Additionally, the liquid sealant must have a boiling point higher than the curing temperature of the insulating material so that the liquid sealant can be evaporated and removed at the curing temperature of the insulating material. If the boiling point of the liquid sealant is near the curing temperature of the insulating material, there is a high possibility that defects will occur due to bubbles generated by boiling during curing of the insulating material. In addition, the liquid sealant must have a low vapor pressure at room temperature, a vaporization rate that is slower than the curing rate of the insulating molding member 120, and must be a material that does not melt or change the insulating molding member.

The liquid sealant that satisfies these conditions may be a single substance or a water-based mixed substance. When the liquid sealant is a single substance, it contains Diethylene Glycol Monobutyl Ether, Diethylene Glycol Diethyl Ether, Ethylene Glycol Monobutyl Ether, and Triethylene Glycol Mono. It may be Triethylene Glycol Monobutyl Ether, Diethylene Glycol Monomethyl Ether, Ethylene Glycol Monomethyl Ether, Triethylene Glycol Monomethyl Ether, etc. .

Liquid sealants are water-based when mixed, and additives to control wettability include methoxy propanol, isopropyl alcohol (IPA), ethanol, methanol, and anionic surfactants. Surfactant, cationic surfactant, nonionic surfactant, etc., and additives for controlling evaporation include glycerin, ethylene glycol, diethylene glycol, Triethylene Glycol, Propylene Glycol, Dipropylene Glycol, Hexylene Glycol, 1, 3-Butanediol, 1, 4-Butanediol ( 1, 4-Butanediol), 1, 5-Pentanediol, 2-Butane-1, 4-Diol, 2-methyl-2 -It may be pentanediol (2-Metyle-2-Pentanediol), etc.

Liquid sealant can be formulated by mixing water and additives for controlling wettability. Additionally, the liquid sealant may be formulated by mixing water, an additive for controlling wettability, and an additive for controlling evaporation. The composition ratio of these components can be set in various ways depending on the material.

Hereinafter, various embodiments of forming the insulating molding member 120 using a liquid sealant will be described. Figure 13 is a diagram showing the state of moving to a tray filled with liquid sealant in order to apply liquid sealant to the bottom of the mold, and Figure 14 shows the manufacturing process of an electromagnetic wave shielding structure according to another embodiment of the present invention, where liquid sealant is applied. This is a diagram showing an example of vaporization.

Referring to FIG. 13, the mold 10 is connected to the robot arm 50 (or held by the robot arm 50) and is insulated from the tray 31 containing the liquid sealant 30 and the printed circuit board. It may be moved to a molding position to form member 120. Before the mold 10 is seated on the printed circuit board 110, it is moved to the upper side of the tray 31 by the robot arm 50 and then applied to the bottom 15 of the mold 10 with the liquid sealant 30. Descend.

The mold 10 is moved to the molding position by the robot arm 50 with the liquid sealant 30 smeared along the bottom 15 as shown in FIG. 14(a), and then placed on the printed circuit board as shown in FIG. 14(b). It is seated on the (110) phase. Since the liquid sealant 30 has excellent adhesion to the surface of the printed circuit board 110, the insulating material injected into the inside of the mold 10 as shown in FIG. 14(c) does not leak between the mold 10 and the printed circuit board. No.

After injecting the insulating material into the mold 10, the printed circuit board 110 is placed in an oven and set to a predetermined temperature, so that the insulating material is cured at the first temperature, and the temperature in the oven is lower than the curing temperature of the insulating material. When the vaporization temperature of the liquid sealant rises to a high level, the liquid sealant 30 vaporizes. Accordingly, the liquid sealant 30 disappears and an empty space is formed between the mold 10 and the printed circuit board 110, as shown in FIG. 14(d).

In this state, when the mold 10 is separated from the printed circuit board 110 as shown in FIG. 14(e), the insulating molding member 120 is not damaged by the mold 10 or the sealing member 12. The side surface of (120) may be formed as a plane. The subsequent process is not shown in the drawings, but after releasing the mold 10 as described above, the nozzle 216 can be driven to form the shielding dam 130 along the side of the insulating molding member 120 ( 2(e)), and then the shielding member 140 can be formed by injecting a conductive material into the upper surface of the insulating molding member 120 (see FIG. 2(f)).

Meanwhile, after separating the mold 10 from the printed circuit board 110 as shown in FIG. 14(e), the shielding film 150 is attached to the upper surface of the insulating molding member 120 as described above (see FIG. 8e). , the nozzle 216 can be driven to form a shielding dam 130 along the side of the insulating molding member 120 (see FIG. 8(f)).

Figure 15 shows the manufacturing process of an electromagnetic wave shielding structure according to another embodiment of the present invention, and is a diagram showing an example of removing the liquid sealant by post-processing.

Since the processes shown in FIGS. 15(a) to 15(c) are the same as the processes shown in FIGS. 14(a) to 14(c) of the above-described embodiment, description thereof will be omitted, and the processes will be described later.

Referring to FIG. 15(d), the liquid sealant 30 may be made of a material that does not vaporize during the process of curing the insulating molding member 120 in an oven. In this case, after separating the mold 10 from the printed circuit board 110, the liquid sealant 30 is scraped off using a predetermined peeling tool and completely removed from the printed circuit board 110 as shown in FIG. 15(e). .

In this case, the liquid sealant 30 remaining on the printed circuit board 110 may be removed by heating at a high temperature without using a peeling tool. Specifically, the temperature range between the curing temperature of the insulating molding member 120 and the boiling point of the liquid sealant 30, or the curing temperature of the insulating molding member 120 and the heat resistant temperature of the insulating molding member 120. The liquid sealant 30 remaining on the printed circuit board 110 can be removed by heating in a temperature range between the two. At this time, the process conditions can be set to two stages: the temperature change in the curing furnace (not shown), the curing temperature of the insulating molding member 120, and the temperature at which the liquid sealant 30, which is at a higher temperature, can be evaporated and removed. .

Figure 16 shows the zero process of an electromagnetic wave shielding structure according to another embodiment of the present invention, and is a diagram showing an example of injecting a liquid sealant between the mold and the printed circuit board after setting the mold.

The mold 10 moves to the molding position as shown in FIG. 16(b) without applying a separate liquid sealant 30 to the lower end 15 as shown in 16(a). In this case, the mold 10 is supported by the robot arm 50 and placed at a predetermined distance from the printed circuit board 110. Liquid sealant 30 is injected into the space between the mold 10 and the printed circuit board 110, as shown in FIG. 16(c). When injection of the liquid sealant 30 is completed, an insulating material is injected into the inside of the mold 10 as shown in FIG. 16(d). In this case, the insulating material does not leak between the mold 10 and the printed circuit board due to the liquid sealant 30.

After injecting the insulating material into the mold 10, the printed circuit board 110 is placed in an oven and set to a predetermined temperature. The insulating material is cured at the predetermined temperature, and the liquid sealant 30 gradually evaporates at the curing temperature. Alternatively, when the temperature inside the oven rises to the vaporization temperature of the liquid sealant, which is higher than the curing temperature of the insulating material, the liquid sealant 30 vaporizes. Accordingly, the liquid sealant 30 disappears and an empty space is formed between the mold 10 and the printed circuit board 110, as shown in FIG. 16(e).

In this state, when the mold 10 is separated from the printed circuit board 110 as shown in FIG. 16(f), the insulating molding member 120 is not damaged by the mold 10 or the sealing member 12. The side surface of (120) may be formed as a plane.

Figure 17 shows the manufacturing process of an electromagnetic wave shielding structure according to another embodiment of the present invention, and shows an example of injecting liquid sealant between the mold and the printed circuit board after setting the mold and removing the liquid sealant through post-processing. am.

Since the processes shown in FIGS. 17(a) to 17(d) are the same as the processes shown in FIGS. 16(a) to 16(d) of the above-described embodiment, description thereof will be omitted and the processes will be described later.

Referring to FIG. 17(e), the liquid sealant 30 may be made of a material that does not vaporize during the process of curing the insulating molding member 120 in an oven. In this case, after separating the mold 10 from the printed circuit board 110, the liquid sealant 30 is scraped off using a predetermined peeling tool and completely removed from the printed circuit board 110 as shown in FIG. 17(f). .

Figure 18 shows the manufacturing process of an electromagnetic wave shielding structure according to another embodiment of the present invention. When forming a plurality of shielding structures, the height of the insulating molding member is differentially controlled by controlling the amount of insulating material injected into the mold. This is a drawing showing an example.

Referring to FIG. 18(a), three molds 10-1, 10-2, and 10-3 are disposed on the printed circuit board 110. In this case, the height of the circuit elements mounted in each shielding area is different, and the injection into each mold (10-1, 10-2, and 10-3) is based on the maximum height of the circuit elements mounted in each shielding area. Vary the amount of insulating material. That is, the amount of insulating material injected into the mold 10-1 placed on the left is greater than the amount of insulating material injected into the mold 10-1 placed in the center, but the amount of insulating material injected into the mold 10-1 placed on the right is larger. It is less than the amount of insulating material injected into. In this case, the three molds 10-1, 10-2, and 10-3 can be formed as one piece and can be moved simultaneously by one robot arm 50.

When the injection of different amounts of the insulating material into each mold (10-1, 10-2, and 10-3) is completed, the printed circuit board 110 is placed in an oven and the insulating material is cured to cure each insulating molding member (120- 1,120-2,120-3). In this process, the liquid sealant 30 is vaporized, but if the liquid sealant 30 is a non-vaporized material, each mold (10-1, 10-2, 10-3) is released and then printed circuit board (printed circuit board) using a tool. 110).

Referring to FIG. 18(b), when the insulating molding members 120-1, 120-2, and 120-3 of different heights are formed, the insulating molding members 120-1, 120-2, and 120-3 are formed as shown in FIG. 18(c). A shielding dam (130-1,130-2,130-3) is formed along the side of. In this case, each shielding dam 130-1, 130-2, and 130-3 is formed to have a different height corresponding to the height of each insulating molding member 120-1, 120-2, and 120-3. Nozzles with different guide portion lengths are provided depending on the length of each shield dam (130-1, 130-2, 130-3) to form shield dams (130-1, 130-2, 130-3).

After forming the shielding dam (130-1,130-2,130-3), the upper surface of each insulating molding member (120-1,120-2,120-3) can be filled with a conductive material to form the shielding member (140-1,140-2,140-3). there is. According to this embodiment, there is an advantage that a plurality of shielding structures can be manufactured simultaneously.

In the above embodiments, an insulating molding member is formed using a mold, the mold is removed, and then the shielding dam and shielding member are formed. Below, an embodiment that forms part of the shielding structure without removing the mold will be described.

Figures 19 and 20 respectively show the manufacturing process of an electromagnetic wave shielding structure according to still other embodiments of the present invention, and are diagrams showing an example of including the mold in the shielding structure without removing it.

Referring to FIG. 19(a), the mold 10 is coupled with a sealant 30' at the bottom. Since the sealant 30' is not removed from the mold 10, it does not need to be a vaporizable liquid material; a solid sealant with elasticity is sufficient.

Referring to FIG. 19(b), the mold 10 is moved to the molding position by the robot arm 50 and then placed on the printed circuit board 110 as shown in FIG. 19(b). The sealant 30' may be in close contact with the surface of the printed circuit board 110 by elastic force.

Referring to FIG. 19(c), while the sealant 30' is in close contact with the printed circuit board 110, an insulating material is injected into the mold 10 to form an insulating molding member 120. In this case, the liquid insulating material has fluidity, but does not leak between the mold 10 and the printed circuit board 110 due to the sealant 30'. The insulating material injected into the mold 10 is filled up to the upper surface 13a of the mold 10 by controlling the injection amount, and then cured.

Next, as shown in FIG. 19(d), the nozzle 216 is driven to form a shielding dam 130 along the side of the insulating molding member 120 (see FIG. 2(e)). In this case, the upper end 131 of the shielding dam 130 may be formed to cover the upper surface 13a of the mold 10.

Thereafter, as shown in FIG. 19(e), an electrically conductive material is discharged onto the upper surface of the mold 10 and the insulating molding member 120 to form the shielding member 140 and then cured. In this case, the electrically conductive material discharged from the nozzle is discharged in an amount that does not flow beyond the upper end 131 of the shielding dam 130.

In this way, the mold 10 may be used as a member to form a shielding structure without being removed during the process. In this case, the mold 10 may be made of an electrically conductive or insulating material.

Figure 20 is an example of forming a shielding structure without removing the mold, similar to the example shown in Figure 19.

As shown in FIG. 20(a), the mold 10 with the sealant 30' attached to the bottom is moved to the molding position by the robot arm 50 as shown in FIG. 20(b) and then moved to the molding position as shown in FIG. 20(b). It is seated on the printed circuit board 110.

In this state, as shown in FIG. 20(c), an insulating material is injected into the inside of the mold 10 and then cured to form the insulating molding member 120.

Subsequently, as shown in Figure 20(d), after attaching the electrically conductive shielding film 150 to the upper surface of the mold 10 and the upper surface of the insulating molding member 120, as shown in Figure 20(e), the nozzle 216 is driven to form a shielding dam 130 along the side of the insulating molding member 120. In this case, the upper end 131 of the shielding dam 130 covers the upper edge portion of the electrically conductive shielding film 150, thereby forming an electrical connection with the electrically conductive shielding film 150.

Electromagnetic wave shielding structures having various structures described above can be applied to various electronic devices. In other words, the electromagnetic wave shielding structure may be placed inside the smart phone 310 as shown in FIG. 21, and may be placed inside the smart watch 320 as shown in FIG. 22.

As described above, although the present invention has been described with limited embodiments and drawings, the present invention is not limited thereto, and the technical idea of the present invention and the following will be understood by those skilled in the art. Of course, various modifications and variations are possible within the scope of equivalency of the patent claims described in .

10: mold
30: Liquid sealant
110: printed circuit board
120: Insulating molding member
130: shielding dam
140: Shielding member
150: shielding film
160: edge bridge
200: material discharge device
216: nozzle
216a: discharge port
216b: Guide unit

Claims (43)

delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete Applying liquid sealant along the bottom of the mold;
Setting the mold so that the liquid sealant comes into contact with a printed circuit board on which circuit elements are mounted;
Injecting an insulating molding member covering the circuit element into the mold;
curing the insulating molding member at a certain temperature;
curing the insulating molding and evaporating the liquid sealant at the constant temperature by applying the liquid sealant whose vaporization rate is slower than the curing rate of the insulating molding member at the constant temperature;
separating the mold from the printed circuit board; and
A method of manufacturing an electromagnetic wave shielding structure comprising: forming a conductive shield covering the insulating molding member. According to clause 17,
The step of forming the conductive shield is,
forming a shielding dam covering a portion of the side and top surface of the insulating molding member by discharging an electrically conductive material from a moving nozzle; and
Injecting an electrically conductive material into the upper surface of the insulating molding member to form a shielding member electrically connected to the shielding dam. According to clause 17,
The step of forming the conductive shield is,
Attaching a conductive shielding film to the upper surface of the insulating molding member; and
Discharging an electrically conductive material from a moving nozzle to cover a portion of the side and top surface of the insulating molding member and forming a shielding dam electrically connected to the shielding film. According to clause 19,
The step of forming the conductive shield is,
A method of manufacturing an electromagnetic wave shielding structure, further comprising coating a shielding member with an electrically conductive material on the upper surface of the insulating molding member and the upper surface of the shielding dam. According to clause 17,
The step of forming the conductive shield is,
A method of manufacturing an electromagnetic wave shielding structure comprising: coating a ground pad formed on the printed circuit board and a side and top surface of the insulating molding member with an electrically conductive material. delete delete According to clause 17,
After separating the mold from the printed circuit board,
A method of manufacturing an electromagnetic wave shielding structure, further comprising: removing the liquid sealant from the printed circuit board. delete According to clause 17,
The liquid sealant is a material having a boiling point higher than the curing temperature of the material forming the insulating molding member, or an electromagnetic wave shielding structure made of a material having a boiling point equal to the curing temperature of the material forming the insulating molding member. Manufacturing method. According to clause 17,
The liquid sealant includes Diethylene Glycol Monobutyl Ether, Diethylene Glycol Diethyl Ether, Ethylene Glycol Monobutyl Ether, and Triethylene Glycol Monobutyl Ether. Electromagnetic wave shielding, any one of Glycol Monobutyl Ether, Diethylene Glycol Monomethyl Ether, Ethylene Glycol Monomethyl Ether, and Triethylene Glycol Monomethyl Ether Method of manufacturing the structure. According to clause 17,
The liquid sealant is based on water, and additives for controlling wettability include methoxy propanol, isopropyl alcohol (IPA), ethanol, methanol, anionic surfactant, and cation. A method of manufacturing an electromagnetic wave shielding structure comprising any one of a surfactant (cationic surfactant) and a nonionic surfactant. According to clause 28,
The liquid sealant contains glycerin, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, and dipropylene glycol as additives for controlling evaporation. Dipropylene Glycol, Hexylene Glycol, 1, 3-Butanediol, 1, 4-Butanediol, 1, 5-Pentanediol ), 2-Butene-1, 4-Diol, and 2-Metyle-2-Pentanediol. A method of manufacturing an electromagnetic wave shielding structure. According to clause 17,
A method of manufacturing an electromagnetic wave shielding structure, wherein the material forming the insulating molding member is made of a material that does not physically mix with the liquid sealant. According to clause 30,
A method of manufacturing an electromagnetic wave shielding structure, wherein the material forming the insulating molding member is a flowable thixotropic material or a phase change (thermoplastic, thermosetting) material. According to clause 31,
The thixotropic materials include synthetic fine silica, bentonite, fine particle surface-treated calcium carbonate, hydrogenated castor oil, metal stone gum, aluminum stearate, polyimide wax, oxidized polyethylene, and flax. A method of manufacturing an electromagnetic wave shielding structure comprising at least one of phosphorus polymerization oils. According to clause 31,
The phase change materials include polyurethane, polyurea, polyvinyl chloride, polystyrene, acrylonitrile butadiene styrene, polyamide, acrylic, and epoxy. A method of manufacturing an electromagnetic wave shielding structure comprising at least one of (epoxy), silicone, and PBTP (polybutylene terephthalate). delete delete delete delete delete delete delete delete delete delete

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