KR102610117B1 - EMI shielding structure and manufacturing method as the same - Google Patents

Abstract

An electromagnetic wave shielding structure is disclosed. The disclosed electromagnetic wave shielding structure includes a shielding dam formed to form a closed loop with respect to adjacent shielding areas on a printed circuit board; an insulating member that fills the shielding area defined by the shielding dam and covers circuit elements located in each shielding area; and a shielding member covering an upper surface of the insulating member, wherein the shielding dam may include a border portion forming an outline of the shielding area and a partition portion disposed inside the border portion.

Description

Electromagnetic wave shielding structure and manufacturing method {EMI shielding structure and manufacturing method as the same}

The present invention relates to an electromagnetic wave shielding structure and a manufacturing method thereof, and particularly to an electromagnetic wave shielding structure and a manufacturing method thereof that can increase the mounting area of a printed circuit board by eliminating the gap between adjacent shielding areas.

Recently, the demand for portable devices has been rapidly increasing in the electronics market, and along with this, there has been a continuous demand for miniaturization and weight reduction of portable devices for easy portability. In order to make portable devices smaller and lighter, not only technologies that reduce the individual sizes of electronic components included in portable devices, but also packaging technologies that integrate multiple circuit elements mounted on a printed circuit board into one package are required. In particular, semiconductor packages that handle high-frequency signals require an electromagnetic wave shielding structure to not only miniaturize but also achieve excellent electromagnetic interference and electromagnetic wave immunity characteristics.

The conventional electromagnetic wave shielding structure is a structure that covers circuit elements mounted on a printed circuit board with a shield can made of pressed metal.

When using a shield can to cover and shield adjacent shielding areas, one shield can is used for each shielding area. At this time, the shield cans are placed at predetermined intervals when mounted on the printed circuit board, and the sides of each shield can adjacent to each other are maintained at a predetermined interval. This spacing is inevitably required to secure each shield can to the printed circuit board. Therefore, the area for mounting circuit elements is reduced by the distance secured to install each shield can adjacent to the printed circuit board. Therefore, the electromagnetic wave shielding structure using a conventional shield can has the problem of lowering the high integration rate of circuit elements.

In addition, the conventional electromagnetic wave shielding structure requires separate press processing to manufacture the shield can, and the materials that make up the shield can are expensive, which causes a problem of increasing the unit price of the product.

In order to solve the above problems, the present invention relates to an electromagnetic wave shielding structure and a manufacturing method thereof that can eliminate the gap between adjacent shielding areas, minimize dam forming and processing time, and increase the mounting area of a printed circuit board.

In addition, the present invention relates to an electromagnetic wave shielding structure and a method of manufacturing the same that can reduce material costs by omitting the shield can and forming the shielding structure through shaping and molding.

In order to achieve the above object, the present invention includes a shielding dam formed to form a closed loop with respect to adjacent shielding areas on a printed circuit board; an insulating member that fills the shielding area defined by the shielding dam and covers circuit elements located in each shielding area; and a shielding member covering an upper surface of the insulating member, wherein the shielding dam includes a border portion forming an outline of the shielding area and a partition portion disposed inside the border portion. Provides structure.

The boundary portion and the partition portion may be formed continuously by an electrically conductive material continuously discharged through a nozzle.

The boundary portion may be formed in plural pieces. At least a portion of the plurality of boundaries may be in contact with each other.

The boundary portion may be formed discontinuously with the partition portion.

It may further include an additional boundary portion that surrounds a shielding area adjacent to one side of the partition portion and is formed discontinuously with the partition portion.

The end portion of the boundary portion may overlap with the outside of a portion of another previously formed boundary portion or a portion of a previously formed partition portion.

It may further include a dummy member disposed on the printed circuit board and forming a shielding structure together with the shielding dam. The dummy member may include at least one support surface on which a portion of the shield dam is supported. The support surface may be flat or curved. The support surface may be formed perpendicular or inclined with respect to one surface of the printed circuit board.

In addition, in order to achieve the above object, the present invention includes the steps of continuously discharging an electrically conductive material through a nozzle to form a shielding dam forming a closed loop while dividing shielding areas on a printed circuit board; forming an insulating member by filling the shielding area defined by the shielding dam with an insulating material to cover the circuit elements located in each shielding area; and forming a shielding member covering the shielding dam by injecting an electrically conductive material into the upper surface of the insulating member.

In the step of forming the shielding dam, a boundary portion of the shielding dam forming the outer edge of each shielding area is formed, and is disposed inside the boundary portion to partition each shielding area, and can be formed continuously at the boundary portion by a one-time material discharge operation. there is.

Forming the shielding dam includes stopping the nozzle, which moves while discharging the electrically conductive material, at a certain distance from a portion of the previously formed shielding dam; ejecting the material toward a portion of the previously formed partition to fill the gap between the portion of the previously formed partition and the nozzle; and discharging the electrically conductive material while moving the nozzle.

In addition, forming the shielding dam includes stopping the nozzle, which moves while discharging the electrically conductive material, at a certain distance from a portion of the previously formed shielding dam; Positioning the nozzle adjacent to a portion of the previously formed partition; and moving the nozzle while discharging the material toward a portion of the previously formed partition.

In addition, forming the shielding dam includes moving the nozzle, which moves while discharging the electrically conductive material, at a first speed to a certain position close to a portion of the previously formed partition; and moving upward from a certain position close to a portion of the previously formed partition to a position higher than the portion of the previously formed partition at a second speed slower than the first speed.

The nozzle may discharge the material in contact with at least two parts of the previously formed partition while moving from the starting point to the ending point of the shielding dam.

Before the step of forming the shield dam, the method may further include arranging at least one dummy member on the movement path of the nozzle. In the shield dam forming step, the nozzle may move while discharging the electrically conductive material toward one surface of the dummy member. In the shielding dam forming step, the nozzle may move upward along the inclined surface of the dummy member while discharging the electrically conductive material toward the inclined surface.

In addition, in order to achieve the above object, the present invention includes the steps of controlling a nozzle to form a shielding dam forming a closed loop while dividing shielding areas on a printed circuit board by discharging an electrically conductive material; Controlling a nozzle to discharge an insulating material into a shielding area defined by the shielding dam to form an insulating member to cover circuit elements located in each shielding area; and controlling the nozzle to discharge an electrically conductive material on the upper surface of the insulating member to form a shielding member covering the shielding dam.

1 is a plan view showing an electromagnetic wave shielding structure according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. 1.
Figure 3 is a diagram showing shielding areas adjacent to each other to be formed on a printed circuit board.
Figure 4 is a block diagram showing a material ejection device for forming a shielding structure.
Figure 5 is a diagram showing a nozzle movement path input through an input unit provided in a material discharge device to form a shielding dam in adjacent shielding areas.
FIG. 6 is a diagram showing a nozzle of the material ejection device shown in FIG. 4.
FIG. 7 is a diagram showing a shielding dam formed on a printed circuit board by discharging an electrically conductive material along the moving path of the nozzle shown in FIG. 6.
FIG. 8 is a diagram illustrating a method of forming a shielding dam in part VIII shown in FIG. 7.
Figure 9 is a diagram illustrating another method of forming a shielding dam in part VIII shown in 7.
FIG. 10 is a diagram illustrating a method of forming a shielding dam at part X shown in FIG. 7.
FIG. 11 is a diagram illustrating another method of forming a shielding dam at part X shown in FIG. 7.
Figure 12 is a diagram showing various nozzle movement paths for forming a shielding dam along the outer edges of two adjacent shielding areas by a single material discharge operation.
Figure 13 is a diagram showing various nozzle movement paths for forming a shielding dam along the outer edges of three adjacent shielding areas by a two-time material discharge operation.
Figure 14 is a diagram showing the nozzle movement path for forming a shielding dam along the outer edges of three adjacent shielding areas by a single material discharge operation.
Figures 15a and 15b are perspective views showing a dummy member onto which an electrically conductive material discharged from a nozzle is applied when forming a shielding dam.
Figure 16 is a diagram showing a method of forming a shielding dam using a dummy member.
Figure 17 is a diagram showing an example of two dummy members arranged at different positions when forming a shielding dam along the outer edges of two adjacent shielding areas.
Figures 18 and 19 are perspective views respectively showing the two dummy members shown in Figure 17.
FIG. 20 is a diagram showing a method of forming a part of a shielding dam using the dummy member shown in FIG. 19.
Figure 21 is a diagram showing an example of arranging one dummy member at a portion where the shielding dams intersect when forming a shielding dam along the outer edges of three adjacent shielding areas.
Figure 22 is a perspective view showing the dummy member shown in Figure 21.

In order to fully understand the configuration and effects of the present invention, preferred embodiments of the present invention will be described with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms and various changes can be made. However, the description of the present embodiments is provided to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the present invention of the scope of the invention. In the attached drawings, the components are enlarged in size for convenience of explanation, and the proportions of each component may be exaggerated or reduced.

When a component is described as being “on” or “adjacent to” another component, it should be understood that it may be in direct contact with or connected to the other component, but that another component may exist in between. something to do. On the other hand, when a component is described as being “right above” or “directly in contact” with another component, it can be understood that there is no other component in the middle. Other expressions that describe relationships between components, such as “between” and “directly between” can be interpreted similarly.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms may be used only for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, the second component may also be named a first component without departing from the scope of the present invention.

Singular expressions include plural expressions unless the context clearly dictates otherwise. Terms such as “comprises” or “has” are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, including one or more other features or numbers, It can be interpreted that steps, operations, components, parts, or combinations of these can be added.

Unless otherwise defined, terms used in the embodiments of the present invention may be interpreted as meanings commonly known to those skilled in the art.

Electromagnetic wave shielding structures according to embodiments of the present invention can be applied to smart phones, display devices, wearable devices, etc.

Embodiments of the present invention described below can maximize the mounting area of circuit elements on a printed circuit board by eliminating the gap between adjacent shielding areas. In addition, embodiments of the present invention can shorten the work time by forming a shielding dam forming adjacent shielding areas with a minimum number of material discharge operations, and in this case, the amount of material required can be minimized.

Hereinafter, with reference to the attached drawings, an electromagnetic wave shielding structure according to an embodiment of the present invention will be described in detail.

Figure 1 is a plan view showing an electromagnetic wave shielding structure according to an embodiment of the present invention, Figure 2 is a cross-sectional view taken along line II-II shown in Figure 1, and Figure 3 shows adjacent shielding areas to be formed on a printed circuit board. This is the drawing shown.

Referring to FIG. 1, the electromagnetic wave shielding structure 100 according to an embodiment of the present invention is formed on the printed circuit board 110 and largely shields two shielding areas (A1 and A2, see FIG. 3). In this case, the two shielding areas are partitioned by the second part 132 of the shielding dam 130. The second part 132 is formed integrally with the first part 131 and the third part 133 of the shielding dam 130. The first and third portions 131 and 133 are border portions that form the outside of the shielding areas, and the second portion 132 is a partition portion that is formed inside the border portion and divides the two shielding areas. am. The shielding dam 130 is formed by sequentially continuing the first, second, and third parts 131, 132, and 133 without interruption through a single material discharge operation. Here, “compartment” refers to a state in which a single closed loop is divided into two complete closed loops, or a state in which only two regions are partially divided without being divided into two complete closed loops. In addition, the "one-time material discharge operation" is when the nozzle (216, see Figure 6) moves from the nozzle's standby position to the printed circuit board to form a shielding dam, finishes forming the shield dam, and then moves back to the nozzle's standby position. This means the work up to. In addition, “one-time material discharge operation” may mean an operation until the material for forming a shielding dam is continuously discharged from the nozzle without interruption, forming a closed loop that is divided into at least two shielding areas.

Before explaining the method of forming the shielding dam, the overall configuration of the electromagnetic wave shielding structure 100 according to an embodiment of the present invention will first be described.

The electromagnetic wave shielding structure 100 according to an embodiment of the present invention divides the plurality of circuit elements 115, 117, and 119 mounted on the printed circuit board 110 into two areas (A1 and A2) and shields them, as shown in FIG. 3. . Here, the circuit elements are heterogeneous circuit elements and may be IC chips, passive elements, or heterogeneous components mounted on a board. For example, the IC chip may be an application processor (AP), a memory, a radio frequency (RF) chip, etc., the passive element may be a resistor, a condenser, a coil, etc., and the unusual component may be a connector or a card socket. , electromagnetic wave shielding parts, etc.

A first connection pad 111 and a second connection pad 112 to which a plurality of circuit elements 115, 117, and 119 are electrically connected, respectively, may be patterned on the upper surface of the printed circuit board 110. There may be multiple first and second connection pads 111 and 112. The first and second connection pads 111 and 112 may be formed to ground the plurality of circuit elements 115, 117, and 119 or to transmit signals.

The printed circuit board 110 may have a ground pad 114 patterned. The ground pad 114 may be formed inside the printed circuit board 110 with the top surface of the ground pad 114 exposed so as not to protrude from the top surface of the printed circuit board 110 . In this case, the ground pad 114 may be formed integrally with the ground layer 113 formed within the printed circuit board 110.

The ground pad 114 may be formed to ground the plurality of circuit elements 115, 117, and 119 or to transmit signals. When the shield dam 130, which will be described later, is formed on the printed circuit board 110, it can be grounded by electrically contacting the ground pad 114 formed along the formation path of the shield dam or in part of the formation path. .

The circuit element 115 may include a plurality of connection terminals 116 electrically connected to the first connection pad 111 of the printed circuit board 110. The plurality of connection terminals 116 may be formed, for example, in a BGA (ball grid array) method, such as a solder ball. However, these connection terminals 116 are not limited to the BGA type, and can be used in various ways depending on the lead shape of the element 115, for example, QFN (Quad Flat No Lead), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Out Line Package), TSOP/SSOP/TSSOP (Thin/Shrink/Thin Shrink SOP), etc.

The remaining circuit elements 117 and 119 may include at least one connection terminal (not shown) electrically connected to the second connection pad 112 of the printed circuit board 110. When the plurality of circuit elements 117 and 119 are mounted on the printed circuit board 110, their height may be smaller or larger than that of the circuit element 115 described above. Each of the circuit elements 115, 117, and 119 is arranged at predetermined intervals so as not to contact the shield dam 130.

Referring to FIG. 2, the electromagnetic wave shielding structure 100 according to an embodiment of the present invention includes an insulating member 120 covering a plurality of circuit elements 115, 117, and 119, and an insulating material so that the insulating member 120 can be injected. It may include a shielding dam 130 forming an inflow area and a shielding member 150 formed on the upper surface of the insulating member 120.

The insulating member 120 may be formed by being injected into the material injection space formed by the shielding dam 130 and then hardened. The insulating member 120 includes first and second insulating members 121 and 123 formed by injecting into each of the shielding areas A1 and A2. The first and second insulating members 121 and 123 are between each circuit element (115, 117, 119) in each shielding area (A1, A2), between each circuit element (115, 117, 119) and the shielding dam 130, and between each circuit element and the shielding member ( 150) and insulate between them.

The insulating material making up the insulating member 120 can be in close contact with the outer surface of the circuit elements 115, 117, and 119, and has fluidity so that it can enter the gap formed between each circuit element 115, 117, 119 and the printed circuit board 110. It can be made of materials. The insulating member 120 may be hardened through various curing treatments such as room temperature curing, heat curing, and UV curing.

The insulating material may be a fluid material or a phase change (thermoplastic, thermosetting) material. In this case, the phase change materials are polyurethane, polyurea, polyvinyl chloride, polystyrene, acrylonitrile butadiene styrene, polyamide, acrylic, It may include one of epoxy, silicone, and polybutylene terephthalate (PBTP).

The shielding dam 130 is formed to form a closed loop that defines the two shielding areas (A1 and A2) while forming the entire outer perimeter of the two adjacent shielding areas (A1 and A2). In this case, the shielding dam 130 can be formed in a free standing type that forms its own shape without relying on a separate structure. However, the present invention is not limited thereto, and the shield dam 130 may be manufactured in a state in which a portion of the shield dam (such as a starting portion, an ending portion, and an intersection portion of the shield dam) is supported by a dummy member, which will be described later.

The height of the shielding dam 130 is preferably formed in consideration of the height of the insulating member 120 that can cover all of the plurality of circuit elements 115, 117, and 119.

The shielding dam 130 may have an aspect ratio greater than its width. Here, the aspect ratio of the shield dam is the height of the shield dam 130 divided by the width of the shield dam. The aspect ratio of the shielding dam 130 is determined by the width and height of the discharge port that discharges the material formed in the nozzle 216. The structure of the nozzle 216 will be described later.

The shielding dam 130 may be made of a conductive material with electromagnetic wave shielding properties that can prevent electromagnetic interference (EMI). Accordingly, the shielding dam 130 can prevent EMI that may affect other electronic components in an electronic device including the electromagnetic wave shielding structure 100 by shielding electromagnetic waves generated from the plurality of circuit elements 115, 117, and 119. there is. By fundamentally blocking interference such as electromagnetic noise or malfunction in an electronic device including the electromagnetic wave shielding structure 100, it is possible to prevent the reliability of the product from deteriorating. In this way, the shielding dam 130 can prevent electromagnetic waves inevitably generated during the operation of the circuit elements 115, 117, and 119 from influencing the outside.

The conductive material is preferably formed at a high aspect ratio when forming the shielding dam 130 and has a high viscosity (more than 100,000 cP) to maintain the discharged shape without flowing down after being discharged from the nozzle 216. In this way, when the material has a high viscosity, the shielding dam 130 can be formed with a high aspect ratio, so that the height of the shielding dam 130 can be formed high.

In this way, a material with high viscosity may be made of a thixotropic material with fluidity. Such thixotropic materials include synthetic fine silica, bentonite, fine particle surface-treated calcium carbonate, hydrogenated castor oil, metal stone gum, aluminum stearate, polyimide wax, oxidized polyethylene, and It may contain one of linseed polymerized oils. For example, the metal stone sword system may include aluminum stearate.

In addition, when using a high-viscosity electrically conductive material, if the printed circuit board is a double-sided board, the shielding dam formed on the front side will not flow down even if the printed circuit board is turned over to form a shielding dam on the back side immediately after forming the shielding dam on the front side. and can maintain its shape. Therefore, there is an advantage in that the overall work process can proceed quickly.

Specifically, the electrically conductive material forming the shielding dam 130 may be made of an electrically conductive material having an electrical conductivity of 1.0E+04 S/m or more. Such electrically conductive materials may include electrically conductive filler and binder resin.

As electrically conductive fillers, metals such as Ag, Cu, Ni, Al, Sn, or conductive carbon such as carbon black, carbon nanotubes (CNT), and graphite are used. Alternatively, metal coated materials such as Ag/Cu, Ag/Glass fiber, and Ni/Graphite may be used, or conductive polymer materials such as polypyrrole and polyaniline may be used. Additionally, the electrically conductive filler may be made of one or a mixture of flake type, sphere type, rod type, and dendrite type.

Silicone resin, epoxy resin, urethane resin, alkyd resin, etc. can be used as the binder resin. The material forming the shielding dam 130 may additionally contain additives (thickeners, antioxidants, polymer surfactants, etc.) and solvents (water, alcohol, etc.) to improve other performance.

The shielding member 150 is made of a conductive material with fluidity like the shielding dam 130, and may be made of the same material as the material forming the shielding dam 130 described above.

The shielding member 150 is formed on the upper surface of the insulating member 120. After the shield dam 130 is formed, the injection height of the insulating material injected into the shield dam 130 is set to be somewhat lower than the top of the shield dam 130. Accordingly, a space that can be filled with the shielding member 150 may be provided on the upper surface of the insulating member 120.

When the shielding member 150 is filled with the upper surface of the insulating member 120, the shielding member 150 may be electrically connected while contacting the upper end of the shielding dam 130. Accordingly, the shielding dam 130 and the shielding member 150 completely surround the outside of the insulating member 120, so that an optimal shielding structure can be achieved.

Below, the material discharge device 200 for forming the shield dam 130 will be described. The material ejection device 200 according to this embodiment may be, for example, a 3D printer.

Figure 4 is a block diagram showing a material ejection device for forming a shielding structure.

The material discharge device 200 is described as an example in which there is only one nozzle 216, but it is not limited to this and may be provided with a plurality of nozzles.

Referring to FIG. 4 , the material discharging device 200 may include a dispenser 212 for discharging a predetermined amount of material. The dispenser 212 may include a storage chamber 211 for storing the material, and a nozzle 216 for discharging the material supplied from the storage chamber 211.

In addition, the dispenser 212 includes an X-Y-Z axis moving unit 231 for moving the nozzle 216 in the It may include a rotation drive unit 219 that can be stopped. The X-Y-Z axis moving unit 231 may be provided with a plurality of motors (not shown) for moving the nozzle 216 to the It is connected to a nozzle mounting unit (not shown) where a nozzle is mounted for delivery. The rotation driver 219 may include a motor (not shown) that provides rotational power, and an encoder (not shown) for controlling the rotation angle of the nozzle 216 by detecting the number of rotations of the motor. The X-Y-Z axis moving unit 231 and the rotation driving unit 219 are electrically connected to the control unit 250 and are controlled by the control unit 250.

The material discharge device 200 may include an input unit 253 through which the user can directly input the movement path of the nozzle 216.

The input unit 253 may be formed as a touch screen capable of touch input or may be formed as a regular keypad. The user can input the nozzle path through the input unit 253. This nozzle path is input once, and the nozzle path data input in this way is stored in the memory 251. Of course, it is possible to modify the nozzle path data in the future. The process of inputting the nozzle path through the input unit 253 is as follows.

First, photograph at least two reference marks displayed on the printed circuit board loaded into the working position through a vision camera, measure the distance between the two reference marks, and then calculate the distance value between the images of each reference and the two reference marks. is stored in memory 251. If the printed circuit board is rectangular, two reference marks may be displayed on the upper left and lower right sides of the printed circuit board. In this case, the distance between the two reference marks may approximately represent the straight line length in the diagonal direction of the printed circuit board.

Specifically, when the printed circuit board is loaded to the working position, the user moves the vision camera to the position where the first reference mark is located in the upper left corner through the forward, backward, left, and right movement buttons provided on the input unit 253 (e.g., After moving to the center of the first reference mark (based on the center of the first reference mark or a portion of the first reference mark) and pressing the save button provided on the input unit 253, the control unit 250 moves to the preset origin (0,0,0). By calculating the distance away from the first reference mark, the coordinates (X1, Y1, Z1) of the first reference mark are obtained and stored in the memory. The shooting position of the vision camera that moves with the nozzle is offset at a certain distance from the center of the nozzle. Accordingly, the coordinates (X1, Y1, Z1) of the first reference mark are calculated by the control unit 250 by calculating the offset value. Additionally, when the user presses the capture button, the image of the first reference mark is stored in the memory 251.

Next, the user uses the forward, backward, left, and right movement buttons provided on the input unit 253 to move the vision camera to the location where the second reference mark is at the bottom right (for example, the center of the second reference mark or the second reference mark). After moving a portion of the mark (based on a portion of the mark) and pressing the save button provided on the input unit 253, the control unit 250 calculates the distance the second reference mark is from the preset origin (0,0,0). Then, the coordinates (X2, Y2, Z2) of the second reference mark are obtained and stored in the memory. Additionally, when the user presses the photographing button, the image of the second reference mark is stored in the memory 251. The coordinates (X2, Y2, Z2) of the second reference mark are calculated by calculating the offset value by the control unit 250, similar to the process of calculating the coordinates (X1, Y1, Z1) of the first reference mark described above.

The control unit 250 uses the positions of the first and second reference marks detected as described above to calculate the gap between the two positions and stores it in the memory 251.

Next, the user uses the forward, backward, left, and right movement buttons on the input unit 253 to move the vision camera along the path of the shielding dam to be formed on the printed circuit board, while viewing the real-time image captured by the vision camera with the naked eye. As you check, enter multiple coordinates located on the nozzle's movement path. The coordinates are input by pressing the coordinate input button provided on the input unit 253 when the vision camera is located at a point on the nozzle's movement path. The coordinates input in this way are stored in the memory 251.

The plurality of coordinates include the coordinates of the point (S) where the nozzle starts discharging the material, the coordinates of the point (E) where the nozzle finishes discharging the material, and the points (R1, R2, R3) at which the nozzle must change direction during movement. ,R4,R5,R6).

In addition, in order to program the nozzle's movement path, the input unit 253 includes a movement button to move the nozzle to a designated coordinate, a line button to issue a command to move the nozzle while discharging material, and a line button to change the direction of movement of the nozzle. Various command buttons, such as a rotation button, may be provided. The user can create the nozzle's movement path by matching the command buttons with the coordinates and rotation angle.

If the nozzle's movement path is programmed by the user as described above, the control unit 250 can automatically form a shielding dam on the printed circuit board by discharging the material while moving the nozzle along the movement path.

In this way, the nozzle path data input through the input unit 253 may be stored in the memory 251. The control unit 250 operates the X-Y-Z axis moving unit 231 and the rotation driving unit 219 according to the nozzle path data stored in the memory 251 to move the nozzle along a pre-entered path. The nozzle path data includes the distance by which the nozzle 216 moves in a straight line along the upper surface of the printed circuit board 110, and the rotation direction and angle of the nozzle 216.

Meanwhile, in this embodiment, it has been explained that the user directly inputs the nozzle's movement path through the input unit 253, but the nozzle movement path is not limited to this and can be stored in advance in the memory 251. In this case, it may vary depending on the product. A plurality of nozzle movement paths corresponding to each pattern can be stored in advance to correspond to the pattern of the shielding dam that is formed. Additionally, in addition to the movement path of the nozzle, calibration information, reference position information of the nozzle, PCB reference position information, PCB reference height information, etc., in addition to the movement path of the nozzle, can be stored in advance in the memory 251 through the input unit 253.

Figure 5 is a diagram showing a nozzle movement path input through an input unit provided in a material discharge device to form a shielding dam in adjacent shielding areas.

The nozzle 216 can move along a path to form a shielding dam based on the nozzle path data, and a specific example will be described with reference to FIG. 5.

The nozzle 216 is set at the coordinates corresponding to the starting point (S), and moves linearly by section A in the -X axis direction by the X-Y-Z axis moving unit 231. The nozzle 216 is rotated 90 degrees counterclockwise by the rotation drive unit 219 at the end point (R1) of section A and then moves straight in the -Y axis direction as much as section B by the X-Y-Z axis moving unit 231. . The nozzle 216 is rotated 90 degrees counterclockwise by the rotation drive unit 219 at the end point (R2) of section B and then moves straight in the +X axis direction by section C by the X-Y-Z axis moving unit 231. . Here, the parts formed in sections A, B, and C correspond to the first part 131 of the shielding dam 130.

The nozzle 216 is rotated 90 degrees counterclockwise by the rotation drive unit 219 at the end point (R4) of the D section and then moves straight in the +Y axis direction as much as D section by the X-Y-Z axis moving unit 231. . The shielding dam formed so far surrounds one of the two shielding areas (A1 and A2) (A1) in a closed loop. The part formed in section D corresponds to the second part 132 of the shielding dam 130 and divides it into two shielding areas A1 and A2.

Subsequently, the nozzle 216 is rotated 90 degrees clockwise by the rotation drive unit 219 at the end point (R4) of section D and then moved in a straight line in the E section in the +X axis direction by the X-Y-Z axis moving unit 231. move The nozzle 216 is rotated 90 degrees clockwise by the rotation drive unit 219 at the end point (R5) of the E section and then moves linearly in the -Y axis direction by the F section by the X-Y-Z axis moving unit 231. The nozzle 216 is rotated 90 degrees clockwise by the rotation drive unit 219 at the end point (R6) of the F section and then moves linearly in the -X axis direction by the G section by the X-Y-Z axis moving unit 231. In this case, the end point of section G corresponds to the end point (E) of the shielding dam. Here, the parts formed in sections E, F, and G correspond to the third part 133 of the shielding dam 130.

As such, in this embodiment, the shielding dam 130 can be formed in two shielding areas through a one-time material discharge operation in which the material is continuously discharged from the nozzle without interruption. Through this, the molding time of the shielding dam 130 can be reduced.

Figure 6 is a diagram showing a discharge port through which material for forming a shielding dam is discharged through a nozzle of the material discharge device.

Referring to FIG. 6, the nozzle 216 has a first discharge port 216a on the lower side of the nozzle 216 so that the material is simultaneously discharged while moving and rotating by the and a second discharge port 216b is formed on the bottom of the nozzle 216. The first and second discharge ports 216a and 216b are connected to each other, so that the material can be simultaneously discharged through the first and second discharge ports 216a and 216b.

In this way, the first discharge port 216a has a rectangular shape similar to the final cross section of the shield dam 130 in order to form the shield dam 130 with a large ratio of height (h) to width (w) (hereinafter referred to as aspect ratio). It can be done. In this embodiment, the aspect ratio of the first outlet 216a represents the height (h) of the first outlet 216a divided by the width (w) of the first outlet 216a.

The shielding dam 130 may have a high aspect ratio structure with a thinner thickness and a higher height as the aspect ratio of the first outlet 216a increases. Here, the height h of the first discharge port 216a may be set to correspond to the height of the shielding dam 130, respectively.

As described above, the nozzle 216 may form the shielding dam 130 by simultaneously discharging onto the ground pad 114 through the first and second discharge holes 216a and 216b while moving along a preset path.

Hereinafter, the method of forming the shielding dam 130 will be described in detail with reference to FIGS. 7 to 11.

FIG. 7 is a diagram showing a shielding dam formed on a printed circuit board by discharging an electrically conductive material along the moving path of the nozzle shown in FIG. 6. FIG. 8 is a diagram illustrating a method of forming a shielding dam in part VIII shown in FIG. 7. Figure 9 is a diagram illustrating another method of forming a shielding dam in part VIII shown in 7. FIG. 10 is a diagram illustrating a method of forming a shielding dam at part X shown in FIG. 7. FIG. 11 is a diagram illustrating another method of forming a shielding dam at part X shown in FIG. 7.

Referring to FIG. 7, the shielding dam 130 can be formed through a one-time material discharge operation for two shielding areas (A1 and A2, see FIG. 3) set on the printed circuit board 110.

As described above with reference to FIG. 5 , the shielding dam 130 is composed of first to third parts 131, 132, and 133, and forms an overall closed loop and can be divided into two shielding areas A1 and A2. One shielding area (A1) forms a closed loop by the first and second parts (131 and 132), and the remaining shielding area (A2) forms a closed loop by the second and third parts (132 and 133). In this case, the second part 132 becomes the boundary of each shielding area A1 and A2.

In this way, this embodiment can divide the two shielding areas (A1, A2) only with the second part 132, so unlike the shielding structure using the conventional shield can, there is no need for space for the gap between each shield can. . Therefore, since this space can be omitted, more mounting area for circuit elements can be secured. In addition, the process of manufacturing a separate shield can before forming the shielding structure can be omitted, and there is no need to use an expensive shield cam, which has the advantage of reducing the unit cost of the product. In addition, even if the design of the shielding area (for example, the outline of the shielding area) is different, the movement path of the nozzle can be changed to correspond to the design of the shielding area through the input unit 253 of the material discharge device 200. Work flexibility can be maximized.

Meanwhile, when the shielding dam 130 is formed in the shielding areas A1 and A2 adjacent to each other, each part 131, 132, and 133 of the shielding dam 130 forms a completely closed loop to prevent electromagnetic waves from being emitted from the shielding area. It must be blocked. For this purpose, in this embodiment, when forming the shielding dam 130 in the two shielding areas (A1 and A2) with a single material discharge operation, the point where the first and later molded parts of the shield dam 130 meet A gap may be formed at a predetermined interval (see FIGS. 8(a) and 10(b)).

In this embodiment, in order to prevent such gaps from forming, various shielding dam forming methods are presented as follows.

First, the gap that occurs at part VIII shown in FIG. 7, that is, at the starting point (S, see FIG. 5) of the first part 131 and the point connecting the second and third parts 132 and 133 (R4, see FIG. 5). Let's first look at how to prevent it.

As shown in Figure 5, the nozzle 216 starts from the starting point (S) and continuously discharges the material while moving to sections A, B, C, and D to cover the first and second parts 131 and 132 of the shielding dam 130. can be formed.

The nozzle 216, which has reached the end of section D, rotates as shown in Figure 8(a). At this time, the nozzle 216 pushes the shielding dam 131 formed at the starting point (S) to prevent the shape from being deformed. Since the movement path of the nozzle 216 is set in consideration of the outer diameter of the nozzle 216, a gap may be formed at the starting point (S) and the point R4.

In order to eliminate this gap, the nozzle 216 has a point approximately coaxial (L1) with the shielding dam 131 formed in section A and a predetermined distance (g) from the nozzle 216 and the starting point (S). It stops at a location where another point intersects. In this case, the first discharge port 216a of the nozzle 216 is arranged to face the starting point S of the first portion 131.

Next, the material 133a is discharged toward the starting point S as shown in FIG. 8(b). Accordingly, the material 132a previously discharged from the nozzle 216 as shown in FIG. 8(a) is pushed toward the starting point S by the material 133a discharged from the nozzle 216 as shown in FIG. 8(b). As it comes into close contact with the first part 131, the gap between the starting point (S) and point R4 is filled.

When the gap is filled, the nozzle 216 moves along a preset nozzle movement path to form the third part 133 while discharging the material 133b, as shown in FIG. 8(c).

Additionally, another method for bridging the gap between the starting point (S) and point R4 will be described with reference to FIG. 9.

As shown in Figure 9 (a), the nozzle 216 is approximately coaxial with the shielding dam 131 formed in section A and has a predetermined distance (g) from a point and the nozzle 216 and the starting point (S). It stops at a location where another point intersects. In this case, the first discharge port 216a of the nozzle 216 is arranged to face the starting point S of the first portion 131.

Next, as shown in FIG. 9(b), the nozzle 216 moves a predetermined distance toward the starting point (S). At this time, the nozzle 216 can move until just before it reaches the starting point (S). Accordingly, as shown in FIG. 9(a), the material 132a previously discharged from the nozzle 216 is pushed toward the starting point S by the nozzle 216 as shown in FIG. 9(b), thereby forming the first portion 131. It adheres closely to one side. In this state, the nozzle 216 moves along a preset nozzle movement path to mold the third part 133 while discharging the material 133b, as shown in FIG. 9(c). In this case, the material 133b discharged from the nozzle 133b comes into close contact with the first part 131 corresponding to the starting point S, thereby filling the gap between the starting point S and point R4.

Next, the gap that occurs at the part A method for preventing will be described with reference to FIG. 10.

Figure 10(a) is a plan view of the part where point R3 and the end point (E) are connected, and Figure 10(b) is a view where point R3 and the end point (E) are connected in the direction B shown in Figure 10(a). This is a drawing looking at the part that is being done.

Referring to FIG. 10(b), the nozzle 216 forms the third part 133 and when it reaches the end point (E), it pushes the first part 131 of the previously formed shielding dam 130 to form the first part 131. ) (or point R3) is moved to a position slightly higher than the height of the shield dam 130 so that its shape is not deformed.

In this case, when the nozzle 216 moves upward at the same speed as when forming the third part 133, a predetermined space 135 is created between point R3 and the end point (E) as shown in Figure 10(b). can be formed. In order to eliminate this space 135, if the moving speed of the nozzle () in the section (C2) including point R3 and the end point (E) is slower than the moving speed in the section (C1) where the third part (133) is formed, The space 135 can be filled with the material 133d discharged from the nozzle 216.

In this case, an example of filling the space 135 by controlling the moving speed of the nozzle has been described, but this is not limited to this, and even if the nozzle is moved at the same speed but the material discharge amount in the C2 section is increased compared to the C1 section, the space ( 135) can be filled.

Additionally, another method for eliminating the gap between point R3 and the end point (E) will be described with reference to FIG. 11.

Referring to FIG. 11(a), the nozzle 216 moves toward the end point (E) and then moves to one side of point R3 (outside of the first portion 131) at the same height at which it is currently moving. When the nozzle 216 forms the third part 133, the first discharge port 216a moves in the opposite direction to the nozzle moving direction, and then moves to one side of the R3 point and moves toward one side of the first part 131. Rotate counterclockwise to discharge 133e). The direction of the first discharge port 216a can be changed by driving the rotation driver 219 of the material discharge device 200.

Figures 12(a) to 12(e) are diagrams showing various nozzle movement paths for forming a shielding dam along the outer edges of two adjacent shielding areas by a single material discharge operation.

The nozzle movement path shown in FIG. 12(a) is an example for sequentially forming the first part 131, the second part 132, and the third part 133 of the shielding dam 130.

The nozzle movement path shown in FIG. 12(b) continuously forms the first part 131 and the third part 133 of the shielding dam 130, and then finally connects the second part 132 to the third part. This is an example to form following (133).

The nozzle movement path shown in FIG. 12(c) first forms the second part 132 of the shielding dam 130, and then forms the second part 132, followed by the first part 131 and the third part 133. This is an example of forming continuously. In this case, it is of course possible to modify the nozzle movement path to continuously form the third part 133 and the first part 131 following the second part 132.

Figures 12(d) and 12(e) respectively show nozzle movement paths that prevent the second part 132 from forming independent closed loops between the two shielding areas A1 and A2. In this way, in the case where the shielding dam can be formed so that the two shielding areas (A1, A2) are not completely divided, the electromagnetic waves generated from the circuit elements mounted on each shielding area (A1, A2) are transmitted to each shielding area (A1, A2). A2) This may apply to cases where it does not have a significant effect on the liver.

Figures 13(a) to 13(d) are diagrams showing various nozzle movement paths for forming a shielding dam along the outer edges of three adjacent shielding areas by a two-time material discharge operation.

The nozzle movement path when shielding three adjacent shielding areas arranged in a straight line is from the first starting point (S1) to the first ending point (E1) during the first material discharge operation, as shown in Figures 13(a) to 13(c). You can move up to and form a shielding dam to surround the two shielding areas. Subsequently, in order to partition one of the two shielding areas, the nozzle may be moved from the second starting point (S2) to the second ending point (E2) during the second material discharge operation to form a shielding dam.

In addition, the nozzle movement path according to Figure 13(d) moves from the first starting point (S1) to the first ending point (E1) during the first material discharge operation, forms a shielding dam to surround the two shielding areas, and then moves to the first end point (E1) during the first material discharge operation. During the material discharge operation, a shielding dam may be formed on one side of one of the two shielding areas by moving from the second starting point (S2) to the second ending point (E2).

If the three shielding areas are not arranged in a straight line as described above but are roughly L-shaped, a shielding dam can be formed through a single material discharge operation as shown in FIG. 14.

Figure 14 is a diagram showing the nozzle movement path for forming a shielding dam along the outer edges of three adjacent shielding areas by a single material discharge operation.

According to the nozzle movement path shown in FIG. 14, the shielding dam of the first shielding area is formed from the starting point (S), the outer perimeter of the second and third shielding areas is formed, and then the shielding dam dividing the second and third shielding areas is formed. You can. In this case, the ends of the two parts corresponding to the section dividing the three shielding areas are in contact with each other.

Below, an example in which parts of the shielding dam (such as the beginning, end, and intersection of the shielding dam) is supported on a dummy member will be described.

Figures 15A and 15B are perspective views showing a dummy member on which an electrically conductive material discharged from a nozzle is applied when forming a shielding dam, and Figure 16 is a diagram showing a method of forming a shielding dam using a dummy member.

Referring to FIG. 15A, the dummy member 300 may be mounted on the printed circuit board 110 through a reflow process. That is, the dummy member 300 may be mounted on the printed circuit board by melting the solder due to high heat while being seated on the solder formed on the printed circuit board 110.

Additionally, as shown in FIG. 15B, the dummy member 300' may be provided with two lead wires 331 and 333. In this case, the dummy member 300' can be any structure that can be fixed to the printed circuit board 110 instead of a lead wire (for example, a screw part (not shown) combined or a normal clamping structure (not shown)). do.

Hereinafter, the dummy member is mounted on the printed circuit board 110 through a reflow process without the lead wires 331 and 333 as an example.

The dummy member 300 may form a shielding structure together with a shielding dam, and in this case, it is preferably made of a material capable of shielding electromagnetic waves to perform an electromagnetic wave shielding function. For example, it may be manufactured separately using a metal material capable of shielding electromagnetic waves or a material forming the aforementioned shielding dam.

The material discharged from the nozzle may be supported (or pasted) on one surface of the dummy member 300. To this end, the dummy member 300 may be formed with at least one support surface 311 or a plurality of support surfaces 311 and 313 on which the material is supported.

When forming a shielding dam using such a dummy member 300, the first discharge port 216a of the nozzle 216 is connected to the dummy member 300 fixed to the printed circuit board 110, as shown in FIG. 16(a). ) is set to face the support surface (311). Next, as shown in FIG. 16(b), the nozzle 216 is moved in a direction away from the dummy member 300 while discharging the material toward the support surface 311 of the dummy member 300 to form the shielding dam 131. You can. In this case, the starting portion of the shielding dam 131 is raised by the support surface 311 of the dummy member 300, so it can be formed firmly.

Figure 17 is a diagram showing an example of two dummy members placed in different positions when forming a shielding dam along the outer edges of two adjacent shielding areas, and Figures 18 and 19 show the two dummy members shown in Figure 17. These are perspective views showing each, and FIG. 20 is a diagram showing a method of forming a part of a shielding dam using the dummy member shown in FIG. 19.

Referring to FIG. 17, when forming a shielding dam through a single material discharge operation for two adjacent shielding areas, two dummy members can be used. The first dummy member 400 may be located at a starting point on the nozzle movement path, and the second dummy member 500 may be located at an ending point on the nozzle movement path.

As shown in FIG. 18 , the first dummy member 400 may have a substantially flat first support surface 411 and a curved second support surface 413 . In this case, the first and second support surfaces 411 and 413 may be arranged approximately perpendicular to the upper surface of the printed circuit board 110.

The first support surface 411 of the first dummy member 400 supports the material first ejected from the nozzle in one material ejection operation, and the second support surface 413 of the first dummy member 400 is positioned at point R4. The material discharged from the nozzle is supported. So that the material discharged from the nozzle can be supported on the second support surface 413 of the first dummy member 400, the nozzle passing through point R4 has a first discharge port 216a connected to the second support surface 413 of the first dummy member 400. It is desirable to move while rotating toward the support surface 413.

As shown in FIG. 19 , the second dummy member 500 may have a first support surface 511 formed as a curved surface and a second support surface 513 may be formed as a flat surface. In this case, the first support surface 511 may be arranged approximately perpendicular to the upper surface of the printed circuit board 110, and the second support surface 513 may be positioned at a predetermined angle ( It can be arranged inclined at θ).

The first support surface 511 of the second dummy member 500 supports the material discharged from the nozzle at point R3. In this case, so that the material discharged from the nozzle can be supported on the first support surface 511 of the second dummy member 500, the nozzle passing through point R3 has a first discharge port 216a of the second dummy member 500. It is desirable to move while rotating toward the first support surface 511.

As shown in FIG. 20, the second support surface 513 of the second dummy member 500 forms the third part 133, and when the end point E is reached, the second support surface 513 of the second dummy member 500 is formed. 2 Moves upward along the support surface 513. At this time, the material discharged from the nozzle is formed on the second support surface 513 of the second dummy member 500. In this case, even if the nozzle 216 discharges the material while moving at the same speed without having to change the moving speed for each section as shown in FIG. 10(c), the space 135 is not formed.

Figure 21 is a diagram showing an example of one dummy member placed at a portion where the shielding dams intersect when forming a shielding dam along the outer edges of three adjacent shielding areas, and Figure 22 shows the dummy member shown in Figure 21. It is a perspective view.

Referring to FIG. 21, when forming a shielding dam through a single material discharge operation for three adjacent shielding areas arranged in an L shape, one dummy member can be used. The dummy member 600 is preferably disposed at a location where ends of the sections J and P that separate the shielding areas adjacent to the nozzle movement path are in contact with each other.

The dummy member 600 may have first and second support surfaces 611 and 613 formed as curved surfaces on both sides, respectively, as shown in FIG. 22 . The first and second support surfaces 611 and 613 of the dummy member 600 may be arranged approximately perpendicular to the upper surface of the printed circuit board 110.

The first support surface 611 of the dummy member 600 supports the material discharged from the nozzle at point R7, and the second support surface 613 supports the material discharged from the nozzle at point R8. In this case, the nozzle passing through points R7 and R8 has a first discharge port 216a connected to the first dummy member so that the material discharged from the nozzle can be supported on the first and second support surfaces 611 and 613 of the dummy member 600, respectively. It is preferable that it rotates and moves toward the first and second support surfaces 611 and 613 of 400, respectively.

As described above, in this embodiment, by forming the shielding dam using a dummy member, the shielding dam can be formed more robustly.

As described above, although the present invention has been described with limited embodiments and drawings, the present invention is not limited thereto, and the technical idea of the present invention and the following will be understood by those skilled in the art. Of course, various modifications and variations are possible within the scope of equivalency of the patent claims described in .

110: printed circuit board
120: insulation member
130: shielding dam
150: Shielding member
200: material discharge device
216: nozzle
300, 400, 500, 600: No dummy member

Claims (21)

A shielding dam formed to form a closed loop with respect to adjacent shielding areas on a printed circuit board;
an insulating member that fills the shielding area defined by the shielding dam and covers circuit elements located in each shielding area; and
a shielding member covering the upper surface of the insulating member; and
At least one dummy member mounted on the printed circuit board and integrated with the shield dam;
The shielding dam includes a border portion forming an exterior of the shielding area and a partition portion disposed inside the border portion,
The at least one dummy member is,
at least one support surface on which a portion of the shield dam is supported; and
An electromagnetic wave shielding structure comprising a lead wire for fixing the dummy member to the printed circuit board. delete delete According to paragraph 1,
An electromagnetic wave shielding structure wherein the support surface is a flat or curved surface. According to paragraph 1,
An electromagnetic wave shielding structure in which the support surface is formed vertically or inclinedly with respect to one surface of the printed circuit board. ◈Claim 6 was abandoned upon payment of the setup registration fee.◈ According to paragraph 1,
An electromagnetic wave shielding structure in which the boundary portion and the partition portion are formed continuously by an electrically conductive material continuously discharged through a nozzle. ◈Claim 7 was abandoned upon payment of the setup registration fee.◈ According to paragraph 1,
An electromagnetic wave shielding structure in which the boundary portion is formed in plural pieces. ◈Claim 8 was abandoned upon payment of the setup registration fee.◈ In clause 7,
An electromagnetic wave shielding structure wherein at least a portion of the plurality of boundaries are in contact with each other. According to paragraph 1,
An electromagnetic wave shielding structure wherein the boundary portion is formed discontinuously with the partition portion. According to paragraph 1,
An electromagnetic wave shielding structure surrounding a shielding area adjacent to one side of the partition, and further comprising an additional boundary portion formed discontinuously with the partition. According to paragraph 1,
An electromagnetic wave shielding structure wherein the end portion of the boundary portion overlaps with the outside of a portion of another pre-formed boundary portion or a portion of a partition portion. Forming a shielding dam forming a closed loop by continuously discharging an electrically conductive material through a nozzle to partition shielding areas on a printed circuit board;
forming an insulating member by filling the shielding area defined by the shielding dam with an insulating material to cover the circuit elements located in each shielding area;
forming a shielding member covering the shielding dam by injecting an electrically conductive material into the upper surface of the insulating member; and
It includes; disposing at least one dummy member on the movement path of the nozzle,
In the shielding dam forming step, the nozzle moves while discharging the electrically conductive material toward one surface of the dummy member. According to clause 12,
In the step of forming the shielding dam, a boundary portion of the shielding dam forming the outer edge of each shielding area is formed, disposed inside the boundary portion to partition each shielding area, and continuously formed on the boundary portion by a one-time material discharge operation. Manufacturing method of electromagnetic wave shielding structure. ◈Claim 14 was abandoned upon payment of the setup registration fee.◈ According to clause 12,
The step of forming the shield dam is,
stopping the nozzle, which moves while discharging the electrically conductive material, at a certain distance from a portion of a previously formed shielding dam;
ejecting the material toward a portion of the previously formed partition to fill the gap between the portion of the previously formed partition and the nozzle; and
A method of manufacturing an electromagnetic wave shielding structure comprising: discharging the electrically conductive material while moving the nozzle. ◈Claim 15 was abandoned upon payment of the setup registration fee.◈ According to clause 12,
The step of forming the shield dam is,
stopping the nozzle, which moves while discharging the electrically conductive material, at a certain distance from a portion of a previously formed shielding dam;
Positioning the nozzle adjacent to a portion of the previously formed partition; and
A method of manufacturing an electromagnetic wave shielding structure comprising: moving the nozzle while discharging the material toward a portion of the partition formed first. ◈Claim 16 was abandoned upon payment of the setup registration fee.◈ According to clause 12,
The step of forming the shield dam is,
moving the nozzle while discharging the electrically conductive material at a first speed to a predetermined position close to a portion of a previously formed partition; and
A method of manufacturing an electromagnetic wave shielding structure comprising: moving upward from a certain position close to a portion of a previously formed partition to a position higher than a portion of a previously formed partition at a second speed slower than the first speed. ◈Claim 17 was abandoned upon payment of the setup registration fee.◈ According to clause 12,
A method of manufacturing an electromagnetic wave shielding structure, wherein the nozzle discharges the material so as to contact at least two parts of the previously formed partition while moving from the starting point to the ending point of the shielding dam. delete delete According to clause 12,
In the shielding dam forming step, if one surface of the dummy member is an inclined surface, the nozzle moves upward along the inclined surface while discharging the electrically conductive material toward the inclined surface of the dummy member. A method of manufacturing an electromagnetic wave shielding structure. Controlling the nozzle to eject an electrically conductive material to form a shielding dam forming a closed loop while dividing shielding areas on a printed circuit board;
Controlling a nozzle to discharge an insulating material into a shielding area defined by the shielding dam to form an insulating member to cover circuit elements located in each shielding area; and
Controlling a nozzle to discharge an electrically conductive material on the upper surface of the insulating member to form a shielding member covering the shielding dam; and
It includes; disposing at least one dummy member on the movement path of the nozzle,
A computer-readable recording medium that records a program for executing the nozzle to move while discharging the electrically conductive material toward one surface of the dummy member in the shielding dam forming step.

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