KR102606877B1 - Wire for Electric Bonding - Google Patents

Abstract

The present invention includes a solder wire and an adhesive composition adjacent to the solder wire, wherein the solder wire is wetted when heat is transferred and the temperature reaches the melting point, and the adhesive composition includes an epoxy resin, It includes a reducing agent and a curing agent, wherein the reducing agent removes metal oxide formed on the surface of the solder wire, and the epoxy resin chemically reacts with the reducing agent and the curing agent at a curing temperature to provide a conductive adhesive wire that is cured.

Description

Conductive bonding wire {Wire for Electric Bonding}

The present invention relates to the composition, form, and manufacturing method of a conductive adhesive wire, and specifically relates to the composition of a conductive adhesive wire that can reduce fume generation without using flux.

In general, Flux Cored Solder Wire (FCW) is a conductive adhesive made by filling the inside of a molded solder steel with flux consisting of rosin-based flux, water-soluble flux, organic flux, activator, solvent, and other additives. It is a dragon wire.

Globally, the usage of flux cored solder wire has been increasing rapidly over the past 25 years, and is expected to continue to grow in the future, reaching a market size of USD 0.5 billion by 2027. It is mainly used in the soldering field of electronic products, but its application is expanding to various industrial fields due to the high productivity and cost effectiveness of flux-cored solder wire.

As heat is applied to this flux-cored solder wire, the metal oxide on the solder surface is removed by the flux composition, the solder tube is melted, and ultimately wetting the target metal surface to perform an electrical connection.

However, flux-cored solder wire generates fume due to flux during the joining process due to heat transfer at high temperatures. Fume is solid fine particles formed through chemical reactions such as condensation or oxidation of metal and/or flux vapor during soldering. All solder fumes have harmful effects on the human body, such as the size of respirable dust that can cause pneumoconiosis or chronic obstructive pulmonary disease, and solder fume itself is designated as a class 1 carcinogen.

Additionally, there are problems such as corrosion of joints due to flux residues after the process. Additionally, due to the nature of the flux material filled inside, flux cored solder wire products have the disadvantage of being vulnerable to moisture absorption during storage.

Accordingly, there is a need to develop a conductive adhesive wire that can suppress fume generation while performing the same function as a conventional flux-cored solder wire.

The present invention is intended to solve the problem of fume generation in conventional flux-cored solder wires and at the same time provide additional functionality. It is based on epoxy resin instead of flux, and is initiated by heat and light to create a fume effect on the solder surface. The purpose is to provide various types of conductive bonding wires that can remove metal oxides, form solder joints, and harden at the same time to protect the joint and improve joint strength.

The problem to be solved by the present invention is not limited to the problems mentioned above, and other problems not mentioned can be clearly understood by those skilled in the art from the description below.

The conductive adhesive wire according to an embodiment of the present invention includes a solder wire and an adhesive composition adjacent to the solder wire, and the solder wire is wetted when heat is transferred and the temperature reaches the melting point. , the adhesive composition includes an epoxy resin, a reducing agent and a curing agent, the reducing agent removes the metal oxide formed on the surface of the solder wire, and the epoxy resin is cured by chemically reacting with the reducing agent and the curing agent at a curing temperature. You can.

The conductive bonding wire according to an embodiment of the present invention includes a solder wire and an bonding composition including an epoxy resin, a curing agent, and a reducing agent, and can replace conventional flux.

Accordingly, in the soldering process using the conductive adhesive wire according to the present invention, fume generation is significantly reduced, a cleaning process due to flux residue is not required, and the adhesive composition remaining around the joint is hardened and performs the function of protecting the joint. do.

The adhesive composition may further include a thermoplastic resin and/or a cationic initiator and/or a (meth)acrylic resin and a radical initiator, and may be initiated by heat or light and partially cured to form a semi-cured body.

Due to the semi-hardening of the adhesive composition, the conductive adhesive wire can be stored and used in various forms. In addition, when the adhesive composition is completely cured after the bonding process, the mechanical, thermal, and chemical reliability of the bond is improved.

Figures 1A and 1B are graphs showing mass changes according to temperature changes of a commercial flux included in a conventional flux-cored solder wire and an adhesive composition included in a conductive adhesive wire according to the present invention.
Figure 2 is a diagram for explaining a conductive bonding wire according to embodiments of the present invention.
FIG. 3A is a cross-sectional view taken along line 1-1' in FIG. 2.
3B to 3C are cross-sectional views of one embodiment in which a solder wire is provided therein.
FIGS. 4A and 4B are diagrams showing a plurality of solder wires in an embodiment in which a plurality of solder wires are provided.
Figure 5a is a view showing a portion of a conductive adhesive wire in which a plurality of solder wires are provided inside a semi-hardened body.
FIG. 5B is a cross-sectional view of the conductive adhesive wire of FIG. 5A taken along line 2-2'.
Figure 5c is a cross-sectional view of a wire further containing a paste-type adhesive composition inside the semi-cured body.
Figure 6 is a diagram showing a solder strip in one embodiment of a method of manufacturing a conductive bonding wire.
Figure 7a is a cross-sectional view showing the solder strip of Figure 6 cut in the 3-3' direction.
7B to 7D are cross-sectional views at each step in an embodiment of the method for manufacturing a conductive adhesive wire according to the present invention.
Figure 8 is a view showing a semi-hardened material coated on a solder strip in one embodiment of the conductive adhesive wire according to the present invention.
Figure 9 is a cross-sectional view taken along line 4-4' in Figure 8.
Figure 10a is a cross-sectional view of a wire manufactured by rolling a solder strip coated with the semi-hardened body in one embodiment of the method for manufacturing a conductive adhesive wire according to the present invention. Figure 10b is a cross-sectional view of a wire manufactured by folding the solder strip coated with the semi-hardened body in one embodiment of the method for manufacturing a conductive adhesive wire according to the present invention.
Figures 11a to 11c are cross-sectional views of the wire showing each step of the method of manufacturing a conductive bonding wire without a solder wire.

In order to fully understand the configuration and effects of the present invention, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

The present invention is not limited to the embodiments disclosed below, but can be implemented in various forms and various modifications and changes can be made. However, the description of this embodiment is provided to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the present invention of the scope of the invention. In the attached drawings, the components are enlarged in size for convenience of explanation, and the thickness or ratio of each component may be exaggerated or reduced.

The terms used in this specification are for describing embodiments and are not intended to limit the invention. Additionally, unless otherwise defined, the terms used in this specification may be interpreted as meanings commonly known to those skilled in the art.

As used herein, singular forms also include plural forms, unless specifically stated otherwise in the context. As used in the specification, 'comprises' and/or 'comprising' refers to the presence of one or more other components, steps, operations and/or elements. or does not rule out addition.

Although terms such as first and second are used in this specification to describe various areas, wires, etc., these areas should not be limited by these terms. These terms are merely used to distinguish one area or wire from another area or wire. Embodiments described and illustrated herein also include complementary embodiments thereof. Parts indicated with the same reference numerals throughout the specification represent the same elements.

Figure 1A is a graph showing the mass change according to temperature change of commercial flux included in a conventional flux cored solder wire. Figure 1B is a graph showing the change in mass of the adhesive composition included in the conductive adhesive wire according to the present invention according to the temperature change. In FIGS. 1A and 1B, the solid line represents mass percent (wt%) and the dotted line represents temperature. The experiment was conducted using TA Instruments' TGA Q50 equipment by heating the sample from room temperature to 240℃ at a temperature increase rate of 120℃ per minute and then maintaining it at 240℃ for 10 minutes. The mass change was the initial mass, not the absolute mass. The final mass was expressed as a percentage. In interpreting the graph, if the mass percentage decreases, it can be interpreted that corresponding fume has been generated.

Referring to Figure 1A, in the case of commercial flux included in a conventional flux cored solder wire, the final mass was reduced by 34.8% compared to the initial mass. In other words, fume was generated equal to the amount of flux (5.245 mg) corresponding to 34.8%. On the other hand, referring to Figure 1B, in the case of the adhesive composition included in the conductive adhesive wire according to the present invention, the final mass decreased by 0.6% compared to the initial mass. In other words, fume generation was significantly reduced.

Figure 2 shows a portion of a cylindrical solder wire provided with a paste-type adhesive composition therein according to an embodiment of the present invention. Figure 3a is a cross-sectional view taken along line 1-1' in Figure 2. Referring to FIGS. 2 and 3A , in one embodiment according to the present invention, a conductive bonding wire may include a solder wire 101 and an adhesive composition 201. The solder wire 101 may be cylindrical or polygonal. The adhesive composition 201 may be in a paste form. An adhesive composition 201 may be provided inside the solder wire 101. The solder wire 101 and the adhesive composition 201 may extend without limitation in the D1 direction.

The solder wire 101 can be easily bent or bent. Although not shown in the drawing, the conductive adhesive wire can be freely bent or bent, so it can be stored and used in various forms.

The conductive bonding wire may be manufactured through a process of injecting the paste-type adhesive composition 201 at the end of the solder wire 101 in a vibration manner, but is not limited to this.

3B and 3C are cross-sectional views of one embodiment in which the solder wire 101 is provided. Referring to FIGS. 3B and 3C, in one embodiment of the present invention, the conductive adhesive wire may have a solder wire 101 provided inside, and an adhesive composition may be provided in a cylindrical shape outside the solder wire 101. It may also be provided in a polygonal cylinder shape. The adhesive composition may be a semi-cured body (202). Accordingly, the conductive adhesive wire can be freely bent or bent. At the same time, the semi-hardened body 202 can maintain the shape surrounding the solder wire 101. Furthermore, a paste-type adhesive composition 201 may be included inside the semi-cured body 202.

FIGS. 4A and 4B are diagrams showing a plurality of solder wires 101 in an embodiment in which a plurality of solder wires 101 are provided. Referring to FIGS. 3A to 3C, 4A, and 4B, the solder wire 101 provided inside the semi-hardened body 202 in FIG. 3B may be a plurality of solder wires 101. In one embodiment, as shown in FIG. 4A, a plurality of solder wires 101 may be adjacent to each other and extended while being twisted in a spiral shape. In one embodiment, as shown in FIG. 4B, a plurality of solder wires 101 may be adjacent to each other and extend in a straight line. Additionally, the shape of the plurality of solder wires 101 may not be limited to a straight line or spiral shape.

FIG. 5A is a diagram showing a portion of a conductive bonding wire in which a plurality of solder wires 101 are provided inside the semi-hardened body 202. Figure 5b is a cross-sectional view of the conductive adhesive wire of Figure 5a taken along the line 2-2'. Figure 5c is a cross-sectional view of a wire containing a paste-type adhesive composition 201 inside a semi-hardened body 202. Referring to FIGS. 5A to 5C, in one embodiment according to the present invention, a plurality of solder wires 101 are provided inside, and a semi-cured adhesive composition, that is, a semi-cured adhesive composition, is applied to the outside of the plurality of solder wires 101. The hardened body 202 may surround it. The semi-hardened body 202 and the plurality of solder wires 101 may extend in the D1 direction. Furthermore, the adhesive composition 201 in the form of a paste may be further included inside the semi-hardened body 202.

The conductive adhesive wire provided with the solder wire 101 inside the semi-hardened body 202 can be freely bent or bent. Likewise, the conductive adhesive wire further containing the paste-type adhesive composition 201 inside the semi-hardened body 202 can also be freely bent or bent. Accordingly, the conductive adhesive wire can be stored and used in any free form.

Figure 6 is a diagram showing the solder strip 102 during the manufacturing process of a conductive bonding wire. The solder strip 102 may be included in the manufacturing process of the conductive adhesive wire according to the present invention. The solder strip 102 may have a flat shape at the beginning of the manufacturing process. Additionally, the solder strip 102 can be freely curved or bent.

Figure 7a is a cross-sectional view showing the solder strip 102 of Figure 6 cut in the 3-3' direction. 7B to 7D are cross-sectional views at each step in an embodiment of the method for manufacturing a conductive adhesive wire according to the present invention.

Referring to FIGS. 7A to 7D , both ends of the solder strip 102 may be formed into a U shape. The adhesive composition 201 in the form of a paste may be filled inside the solder strip 102 formed into the U shape. Afterwards, both ends of the U-shaped solder strip 102 can be rolled so that both ends are adjacent to each other. In the cross section of the solder strip 102, one end is defined as the first end 110, and the opposite end is defined as the second end 120.

In one embodiment, referring to FIG. 7C, the second end 120 may be adjacent to the first end 110, but the second end 120 may be located below the first end 110. That is, the shape of the first end 110 and the second end 120, that is, the seam portion, may overlap, thereby forming the first joint portion CP1. After providing the adhesive composition in the form of a paste to the first joint CP1, it can be semi-cured by applying heat or light. For example, an adhesive composition may be provided on the top of the solder strip 102 adjacent to the second end 120. The adhesive composition may be provided to cover the first end 110. The adhesive composition may be semi-cured to form the semi-cured body 210. Accordingly, the cross section of the wire composed of the solder strip 102 filled with the paste-type adhesive composition 201 and the semi-hardened body 210 may be O-shaped. The adhesive composition 201 filled inside the solder strip 102 by the semi-hardened body 210 may not leak to the outside.

In the process of providing the semi-cured body, the semi-cured body can be obtained by semi-hardening the internal paste-type adhesive composition 201 that flows out of the solder strip.

In another embodiment, referring to FIG. 7D, the second end 120 is adjacent to the first end 110, and the second end 120 may be located next to the first end 110. That is, the joint shape of the first end 110 and the second end 120, that is, the seam portion, may be butt, thereby forming the second joint portion CP2. After providing the adhesive composition in the form of a paste to the second joint CP2, it can be semi-cured by applying heat or light. For example, there may be a gap between the first end 110 and the second end 120, and an adhesive composition in the form of a paste may be provided between the gap or on top of the gap, and may be semi-cured to form a semi-cured body 220. ) can be provided. Accordingly, the cross section of the wire composed of the solder strip 102 filled with the paste-type adhesive composition 201 and the semi-hardened body 220 may be O-shaped. The adhesive composition 201 filled inside the solder strip 102 by the semi-hardened body 220 may not leak to the outside.

In the process of providing the semi-cured body, the semi-cured body can be obtained by semi-hardening the internal paste-type adhesive composition 201 that flows out of the solder strip.

The conductive bonding wires manufactured from the above examples can be freely bent or bent. Accordingly, it can be stored and used freely.

Figure 8 is a representative diagram showing the semi-hardened body 203 coated on the solder strip 102 in one embodiment of the method for manufacturing a conductive adhesive wire according to the present invention. Figure 9 is a cross-sectional view taken along line 4-4' in Figure 8. Referring to Figures 8 and 9, in one embodiment of the method for manufacturing a conductive adhesive wire according to the present invention, the semi-hardened body 203 may be coated on one or both sides of the solder strip 102. The semi-hardened body 203 can be obtained by providing an adhesive composition on the upper part of the solder strip 102 and then semi-curing it. The solder strip 102 and the semi-hardened body 203 can be freely bent or bent.

Figure 10a is a cross-sectional view of a wire manufactured by rolling the solder strip 102 coated with the semi-hardened body 203 in one embodiment of the method for manufacturing a conductive adhesive wire according to the present invention. Referring to FIG. 10A, for example, the semi-hardened body 203 may be coated on one side of the solder strip 102. Afterwards, a wire can be manufactured so that the solder strip 102 can be positioned externally. That is, the solder strip 102 coated with the semi-hardened body 203 can be rolled so that the solder strip 102 is positioned on the outside to form a conductive bonding wire. As another example, a semi-hardened body 203 may be coated on both sides of the solder strip 102, respectively. Likewise, the solder strip 102 coated with the semi-hardened body 203 can be rolled to provide a conductive bonding wire.

Figure 10b is a cross-sectional view of a wire manufactured by folding the solder strip 102 coated with the semi-hardened body 203 in one embodiment of the method for manufacturing a conductive adhesive wire according to the present invention. Referring to FIG. 10b, the solder strip 102 coated with the semi-hardened body 203 can be folded so that the semi-hardened body 203 is located inside. That is, the semi-hardened body 203 can be folded so that the solder strip 102 is located on the outside and there is no empty space on the inside.

FIG. 10C is a cross-sectional view of the wire after the solder strip 102 coated with the semi-hardened body 203 in FIG. 8 is cut into 5-5' and 6-6' lines. Referring to FIGS. 8 and 10C, in one embodiment of the method for manufacturing a conductive adhesive wire according to the present invention, a solder strip coated with the semi-hardened body 203 can be cut to manufacture a conductive adhesive wire. That is, the solder strip coated with the semi-hardened body 203 of FIG. 8 can be cut in the 5-5' and 6-6' line directions, and the cut solder strip 102 and a part of the semi-hardened body 203 are cut into wires. You can use it.

11A to 11C are cross-sectional views of a wire showing each step of a method of manufacturing a conductive bonding wire without a solder wire. Referring to FIGS. 11A to 11C, the method may include maintaining the paste-type adhesive composition 201 in a cylindrical or polygonal cylinder shape. At this time, solder powder 103 may be further included in addition to the paste-type adhesive composition 201. Afterwards, the adhesive composition 201 in the form of a paste exposed to the outside can be semi-cured, as shown in FIG. 11b. That is, the outside of the cylindrical or polygonal cylindrical wire may be a semi-hardened body 202. In addition, as shown in FIG. 11C, the paste-type adhesive composition 201 provided on the wire can be completely semi-cured. For example, the paste-type adhesive composition 201 may not exist inside the semi-hardened body 202 other than the solder powder 103.

After the joining process, the bonded conductors can be electrically connected by the solder powder inside the conductive bonding wire manufactured in the above embodiments. Although not shown in the drawing, the solder powder may not be included inside. In this case, a solder component may be additionally provided on the target metal pad or metal part for conductive bonding, but is not limited thereto.

One embodiment according to the present invention includes replacing flux in a conventional flux-cored solder wire with an adhesive composition containing an epoxy resin. Flux-cored solder wire generates fume due to flux during the joining process through heat transfer. Fume is defined as solid fine particles formed through chemical reactions such as condensation or oxidation of metal vapor during soldering. Fume can be a respirable dust. Accordingly, if a person inhales it, it can cause pneumoconiosis or chronic obstructive pulmonary disease, and the fume itself is designated as a class 1 carcinogen, which has harmful effects on the human body.

One embodiment according to the present invention may include a solder wire and an adhesive composition. The adhesive composition may include at least one of an epoxy resin, a curing agent, a reducing agent, a thermoplastic resin, a cationic initiator, a (meth)acrylic resin, a radical initiator, a catalyst, and solder particles.

The epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol AF type epoxy resin, biphenyl type epoxy resin, naphthalene type. Epoxy resin, fluorene type epoxy resin, trishydroxyphenylmethane type epoxy resin, tetraphenylolethane type epoxy resin, alicyclic epoxy resin, cresol novolac epoxy resin, phenol novolac epoxy resin, bisphenol novolac epoxy resin, Can be selected from monotonin-type epoxy resin, trisglycidyl isocyanurate-type epoxy resin, glycidylamine-type epoxy resin, multifunctional epoxy resin, urethane-modified epoxy resin, phenoxy resin, epoxy siloxane resin, and combinations thereof. However, it is not limited to this.

The curing agent can be used without limitation as long as it is a component that can be cured by chemically reacting with the epoxy resin under curing temperature conditions. For example, the curing agent is diethylenetriamine, triethylenediamine, triethylenetetraamine, tetraethylenepentamine, diethylaminopropyleneamine, aminoethylpiperazine, menthanediamine, isopronediamine, metaphenylenediamine. Amine-based curing agents such as amine, diaminodiphenylmethane, diaminodiphenylsulfone, 2-methyl-4-nitroaniline, and dicyandiamide, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2,4-dimethylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, epoxyimidazole adduct, etc. Latent curing agents such as imidazole-based curing agents, amine adduct-based latent curing agents, dihydrazide-based latent curing agents, dicyandiamide-based latent curing agents, and capsule-type latent curing agents, and pentaerythritol tetrakis (3-mer Captobutyrate), 1,4-bis(3-mercaptobutyryloxy)butane, 1,3,5-tris(3-mercaptobutyryloxyethyl)1,3,5-triazine-2,4 thiol-based curing agents such as 6(1H,3H,5H)-trione, phenol-based curing agents such as phenol novolak resin, and cresol novolak resin; Phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, benzophenonetetracarboxylic dianhydride, maleic anhydride, tetrahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride At least one acid anhydride-based curing agent such as phthalic acid, methylbutenyltetrahydrophthalic anhydride, dodecenylsuccinic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, succinic anhydride, methylcyclohexenedicarboxylic anhydride, and chlorendic anhydride. It may include, and may be selected as a combination thereof, but is not limited thereto.

The reducing agent can be used without limitation as long as it can remove metal oxides formed or formed on the surface of the solder wire, and at the same time, it can chemically react with the epoxy resin and harden it. For example, the reducing agent includes formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, decanoic acid, lauric acid, myristic acid, palmitic acid, stearic acid, oleic acid, linoleic acid, and alpha-linolenic acid. , cyclohexanecarboxylic acid, phenylacetic acid, benzoic acid, chlorobenzoic acid, bromobenzoic acid, nitrobenzoic acid, phthalic acid, isophthalic acid, terephthalic acid, salicylic acid, hydroxybenzoic acid, anthranilic acid, aminobenzoic acid, methoxybenzoic acid, glutaric acid, maleic acid. It may include at least one of acids, carboxylic acids such as azelaic acid, abietic acid, adipic acid, ascorbic acid, acrylic acid, and citric acid, and amino acids, and may be selected from a combination thereof, but is not limited thereto.

The equivalent ratio of the curing agent and the reducing agent to the epoxy resin may be about 0.5 to 1.5, but may not be limited thereto. If the equivalence ratio is less than 0.5, unreacted epoxy resin may exist in the cured product after curing is completed. If the equivalence ratio is 1.5 or more, unreacted curing agent or reducing agent may be present in the cured product after curing is completed. Accordingly, the thermomechanical properties and reliability of the cured product may deteriorate, but are not limited thereto.

The thermoplastic resin is a component for realizing a semi-cured state of the adhesive composition. For example, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, 6 -It may be selected from at least one of nylon, 6,6-nylon, polyamide resin, phenoxy resin, acrylic resin, PET, PBT, saturated polyester resin, polyamidoimide resin, and fluorine resin, or a combination thereof, It is not limited to this.

The weight average molecular weight of the thermoplastic resin may be 10,000 g/mol or more, preferably 20,000 to 2,000,000 g/mol, but may not be limited thereto. The thermoplastic resin may be included in the composition for a conductive adhesive in an amount ranging from 0 to about 40% by weight, but is not limited thereto.

The cationic initiator may be initiated by heat treatment or light irradiation. Accordingly, metal oxide formed or formed on the surface of the solder wire can be removed. At the same time, the epoxy resin can be cured so that the adhesive composition can become a semi-cured product. In other words, any ingredient that can generate an acid according to Brønsted-Lowry's acid/base definition or Lewis' acid/base definition by heat treatment or light irradiation can be used without limitation. For example, ytterbium trifluoromethenesulfonate salt; Samarium trifluoromethenesulfonate salt; Erbium trifloromethenesulfonate salt; Lanthanum trifluoromethenesulfonate salt; Phosphonium-based cationic initiators such as tetrabutylphosphonium metensulfonate salt and ethyltriphenylphosphonium bromide salt, 3-methyl-2-butenyltetramethylenesulfonium hexafluoroantimonate salt, triaryl sulfur Phonium hexafluoroantimonate salt, triarylsulfonium hexafluorophosphate salt, 9-(4-hydroxyethoxyphenyl)cyanthrenenium hexafluorophosphate salt, and 1-(3-methylbut- Sulfonium-based cationic initiators such as 2-enyl) tetrahydro-1H-thiophenium hexafluoroantimonate salt, diphenyldiodonium hexafluoroantimonate salt, and diphenyldiodonium hexafluorophosphate. It may be selected from at least one of salts, iodonium-based cationic initiators such as ditorililiodonium hexafluorophosphate salt, and thermal acid generators, and combinations thereof, but is not limited thereto. The cationic initiator may be added in an amount of 0 to 10 parts by weight based on 100 parts by weight of the epoxy resin, but is not limited thereto.

The (meth)acrylic resin is used together with the radical initiator and can be cured by heat treatment or light irradiation. Accordingly, the adhesive composition can become a semi-cured product. The (meth)acrylic resin may include one or more (meth)acrylic groups per molecule. The (meth)acrylic resin may be included in the composition for a conductive adhesive in an amount ranging from 0 to about 40% by weight, but is not limited thereto.

The radical initiator may be initiated by heat treatment or light irradiation. Accordingly, the (meth)acrylic resin can be cured to form a semi-cured composition for a conductive adhesive. The radical initiator is methyl ethyl ketone peroxide, cumin hydroperoxide, t-butyl perbenzoate, 1,1-di-t-butyl peroxy-3,3,5-trimethyl cyclohexane, and dilauroyl peroxide. Oxide, dibenzoyl peroxide, benzophenone, benzyl ketone, 2-chloro-thioxanthone, 2,4-diethyl-thioxanthone, benzoin ethyl ether, diethoxy acetophenone, benzylmethyl ketal, 2-hydroxy It includes at least one of -2-methyl-1-phenyl-1-propanone and 1-hydroxy-cyclohexylphenylketone, and may be selected from a combination thereof, but is not limited thereto. The radical initiator may be added in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the (meth)acrylic resin, but is not limited thereto.

The catalyst can shorten the curing time of the adhesive composition. The catalyst is 2-methylimidazole, 2-ethyl-4-methylimidazole, 2,4-dimethylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1- Imidazole-based catalysts such as cyanoethyl-2-undecylimidazolium trimellitate and epoxyimidazole adduct, triethylamine, benzyldimethylamine, methylbenzyldimethylamine, 2-(dimethylaminomethyl)phenol, 2 ,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo[5,4,0]undecen-7, 1,5-diazabicyclo[4.3.0]non-5-ene, Tertiary amine catalysts such as boron trichloride and boron trifluoride; Phosphine catalysts such as triphenylphosphine, trimethylphosphine, triethylphosphine, tributylphosphine, tri(p-methylphenyl)phosphine, and tri(nonylphenyl)phosphine, N-4-chlorophenyl-N' ,N'-dimethylurea (monuron), etc. and at least one of urea derivative catalysts, and may be selected from a combination thereof, but is not limited thereto. The catalyst may be added in an amount of 0 to about 10 parts by weight based on 100 parts by weight of the epoxy resin, but is not limited thereto.

The solder particles, the solder wire, and the solder strip are tin (Sn), silver (Ag), copper (Cu), lead (Pb), bismuth (Bi), indium (In), cadmium (Cd), and antimony (Sb). Metals or non-metals such as gallium (Ga), arsenic (As), germanium (Ge), zinc (Zn), aluminum (Al), gold (Au), silicon (Si), nickel (Ni), phosphorus (P), etc. and an alloy selected from a combination thereof, but is not limited thereto. For example, the alloys include 96.5Sn/3.5Ag, 55.5Bi/44.5Pb, 96.5Sn/3.0Ag/0.5Cu, 52Bi/32Pb/16Sn, 58Bi/42Sn, 57Bi/42Sn/1Ag, 50In/50Sn, 33In/ It may be composed of a composition ratio such as 67Bi, 17Sn/26In/57Bi, or 52In/48Sn, but is not limited thereto. The size of the solder particles may be selected in the range of about 5 nm to 5 mm, and may be included in the composition for a conductive adhesive in an amount of 0 to about 60% by volume, but is not limited thereto.

The adhesive composition for implementing the conductive adhesive wire according to the present invention may include the epoxy resin, a curing agent, and a reducing agent. Furthermore, when semi-hardening of the adhesive composition is required, the adhesive composition may further include at least one of the thermoplastic resin, the cationic initiator, the (meth)acrylic resin, and a radical initiator. Additionally, it may be manufactured by selectively including the cationic initiator, catalyst, and solder particles, but is not limited thereto. A solvent may be included to improve the coating properties of the adhesive composition, but is not limited thereto. If the adhesive composition contains a solvent, a drying process to remove the solvent before the semi-curing process may be additionally included, but is not limited thereto.

Throughout the present invention, heat treatment conditions in the curing process may be performed at 50°C to 300°C, and light irradiation may use light with a wavelength of 100 nm to 1.5 μm, but is not limited thereto.

Among the terms used in the present invention, the semi-cured body includes an epoxy resin composition in a semi-cured state. The semi-hardened body may be fixed and at the same time may be flexibly bent or curved. In other words, the semi-hardened body can be folded to a range of 90° or more and 180° or less. The semi-cured body may be a semi-cured product obtained by partially curing the adhesive composition. The semi-curing treatment may include, for example, a method of heating the epoxy resin composition at a temperature of 50°C to 300°C for several milliseconds to 30 minutes, but is not limited to this and may include local heat treatment or light irradiation. You can.

On the other hand, when the adhesive composition is completely cured, the epoxy resin composition may be cured.

The cured epoxy resin composition can be manufactured by subjecting an uncured epoxy resin composition or the semi-cured epoxy resin composition to a curing treatment. The method of the curing treatment can be appropriately selected depending on the composition of the epoxy resin composition, the purpose of the cured epoxy resin composition, etc., and may be performed through heating and pressurization.

For example, a cured epoxy resin composition can be obtained by heating the uncured epoxy resin composition or the semi-cured epoxy resin composition at 50°C to 300°C for 1 hour to 10 hours or at 130°C to 230°C for 1 hour to 8 hours. there is.

The adhesive composition containing the uncured epoxy resin composition may be in the form of a paste. In other words, if the adhesive composition is semi-cured or not hardened, its form can be freely changed.

Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. You will understand that it exists. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

101: solder wire
201: Paste type adhesive composition

Claims (18)

Including an adhesive composition,
The adhesive composition includes an epoxy resin, a reducing agent, and a curing agent,
The epoxy resin chemically reacts with the reducing agent and the curing agent to cure the adhesive composition,
The adhesive composition is a conductive adhesive wire including a semi-cured material exposed to the outside.
According to claim 1;
The adhesive composition is a conductive adhesive wire further comprising at least one of a thermoplastic resin, a cationic initiator, an acrylic resin, and a radical initiator.
According to claim 1;
A conductive bonding wire further comprising a solder wire.
According to claim 1;
A conductive bonding wire further comprising solder powder.
According to clause 1,
The epoxy resin is a conductive adhesive wire containing at least one of bisphenol-type epoxy resin, biphenyl-type epoxy resin, naphthalene-type epoxy, fluorene-type epoxy resin, alicyclic epoxy resin, and novolak epoxy resin.
According to clause 1,
The curing agent is a conductive adhesive wire containing at least one of an amine-based curing agent, an imidazole-based curing agent, a latent curing agent, a thiol-based curing agent, a phenol-based curing agent, and an acid anhydride-based curing agent.
According to clause 1,
The reducing agent is a conductive adhesive wire containing at least one of carboxylic acid and amino acid.
According to clause 3,
A conductive adhesive wire in which the adhesive composition is provided inside the solder wire.
According to clause 3,
The solder wire includes a first end and a second end,
The first end and the second end meet each other to define a junction,
The adhesive composition is a conductive adhesive wire including a semi-cured body provided on the joint to join the first and second ends to each other.
delete According to clause 1,
A conductive adhesive wire in which a solder wire is provided inside the semi-hardened body.
According to clause 1,
A conductive adhesive wire further comprising solder powder inside the semi-hardened body.
According to clause 11,
The solder wire includes a first wire and a second wire,
The first wire and the second wire are arranged in a straight line parallel to each other.
According to clause 11,
The solder wire includes a first wire and a second wire,
The first wire and the second wire are adjacent to each other and have a twisted shape.
Rolling both ends of the solder strip to form a space inside;
Filling the space with an adhesive composition; and
Comprising the step of forming a joint by adjoining both ends of the solder strip,
The adhesive composition includes an epoxy resin, a curing agent, and a reducing agent, and the epoxy resin chemically reacts with the reducing agent and the curing agent to cure the adhesive composition,
A method of manufacturing a conductive adhesive wire wherein the joint further includes a semi-hardened body.
delete According to clause 15,
Both ends of the solder strip include a first end and a second end,
A method of manufacturing a conductive adhesive wire wherein the second stage is located below the first stage.
According to clause 15,
Both ends of the solder strip include a first end and a second end,
A method of manufacturing a conductive adhesive wire wherein the second end is located next to the first end.

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