KR102602171B1 - Electroluminesence display - Google Patents

Abstract

This application relates to a touch panel-integrated electroluminescent display device. An electroluminescent display device according to an embodiment of the present application includes a substrate, a touch electrode, an inspection pad, and a switching element. The substrate includes a display area and a non-display area surrounding the display area. The touch electrode is disposed on the light emitting element within the display area. The inspection pad is disposed in the non-display area and is connected to the light emitting element and the touch electrode. The switching element is disposed in the non-display area and selectively connects the inspection pad to one of the light emitting element and the touch electrode.

Description

ELECTROLUMINESENCE DISPLAY}

This application relates to an electroluminescent display device. In particular, the present application relates to an electroluminescent display device having a narrow-bezel structure that reduces the area of the non-display area by common use of touch electrodes and pads for inspecting the display area, and including a touch layer.

Among display devices, electroluminescent displays are self-luminous, have excellent viewing angles and contrast ratios, do not require a separate backlight, can be lightweight and thin, and have advantages in low power consumption. In particular, among electroluminescent display devices, organic light emitting display devices have the advantages of being capable of driving at low direct current voltages, fast response speeds, and low manufacturing costs.

An electroluminescent display device includes a plurality of electroluminescent diodes. An electroluminescent diode includes an anode electrode, a light-emitting layer formed on the anode electrode, and a cathode electrode formed on the light-emitting layer. When a high potential voltage is applied to the anode electrode and a low potential voltage is applied to the cathode electrode, holes are moved to the anode electrode and electrons are moved to the cathode electrode, respectively, to the light emitting layer. When holes and electrons combine in the light-emitting layer, excitons are formed during the excitation process, and light is generated due to the energy from the excitons. An electroluminescent display device displays images by electrically controlling the amount of light generated from the light-emitting layer of a plurality of electroluminescent diodes individually divided by banks.

In addition, there is a demand for the development of an ultra-thin display device equipped with an input means by embedding a touch input panel in the display device. Since electroluminescent displays can be implemented in an ultra-thin form, they are attracting attention as they can be applied to a wide variety of fields when a touch panel is built in or manufactured as an integrated device. In the case of a touch-integrated display device, there is a limit to reducing the bezel area because the pad terminal for touch recognition and the pad terminal for the display panel are placed together.

In providing an electroluminescent display device, the technical task of this application is to achieve a narrow-bezel structure. In this application, the pad for inspecting the touch electrode and the pixel driving electrode is commonly used, but the touch electrode inspection and the pixel driving electrode inspection are selectively performed alternately using a switching element, thereby reducing the space of the inspection pad and narrowing the bezel. A technical task is to provide an electroluminescent display device having a structure.

An electroluminescent display device according to an embodiment of the present application includes a substrate, a touch electrode, an inspection pad, and a switching element. The substrate includes a display area and a non-display area surrounding the display area. The touch electrode is disposed on the light emitting element within the display area. The inspection pad is disposed in the non-display area and is connected to the light emitting element and the touch electrode. The switching element is disposed in the non-display area and selectively connects the inspection pad to one of the light emitting element and the touch electrode.

For example, the switching element includes a first switching element and a second switching element. The first switching element connects the light emitting element and the inspection pad. The second switching element connects the touch electrode and the inspection pad. In addition, it further includes a first active signal pad, a second active signal pad, a common connection wire, a first connection wire, and a second connection wire. The first active signal pad is connected to the first switching element. The second active signal pad is connected to the second switching element. The common connection wire connects the first switching element and the second switching element to the inspection pad. The first connection wire connects the first switching element and the light emitting element. The second connection wire connects the second switching element and the touch electrode.

For example, the inspection pad, the first active signal pad, and the second active signal pad are arranged adjacent to each other in the non-display area.

For example, the first switching element includes a first gate electrode connected to a first active signal pad, a first source electrode connected to a test pad, and a first drain electrode connected to a first connection wire. The second switching element includes a second gate electrode connected to a second active signal pad, a second source electrode connected to a test pad, and a second drain electrode connected to a second connection wire.

For example, the light emitting element includes a pixel driving electrode, a light emitting layer, and a common electrode. The pixel drive electrodes are arranged in a matrix manner within the display area. The light emitting layer is laminated on the pixel driving electrode. The common electrode is laminated on the light emitting layer. In addition, it further includes an encapsulation layer and an upper protective film. The encapsulation layer is laminated on the common electrode. The upper protective film is laminated on the encapsulation layer. The touch electrode is laminated on the upper protective film.

For example, the touch electrode includes a first touch electrode layer extending in a first direction on a substrate, a dielectric layer covering the first touch electrode layer, and a second touch electrode layer extending in a second direction different from the first direction on the dielectric layer.

For example, it is disposed in the non-display area and further includes a dam structure surrounding the display area. The inspection pad is placed outside the dam structure.

For example, it further includes a driving signal input pad and a touch signal input pad. The driving signal input pad is connected to the light emitting element and is disposed adjacent to the inspection pad. The touch signal input pad is connected to the touch electrode and is disposed adjacent to the driving signal input pad.

Additionally, the electroluminescence display device according to the present application includes a display area and a non-display area. The display area includes pixel electrodes and touch electrodes. The non-display area is provided with an inspection pad and selection means. The selection means connects the test pad with one of the pixel electrode and the touch electrode.

In one example, the selection means connects the test pad with the pixel electrode for a first period of time. The test pad is connected to the touch electrode during a second period that is different from the first period.

For example, a pixel electrode inspection signal is applied to the inspection pad during the first period. During the second period, a touch electrode test signal is applied to the test pad.

In one example, the selection means includes a first active signal pad, a second active signal pad, a first switching element and a second switching element. The first switching element connects the pixel electrode and the inspection pad. The second switching element connects the touch electrode and the test pad. The first active signal pad is connected to the first switching element. The second active signal pad is connected to the second switching element.

For example, during the first period in which an active signal is applied to the first active signal pad, the first switching element transmits the signal applied to the test pad to the pixel electrode. During the second period in which the active signal is applied to the second active signal pad, the second switching element transmits the signal applied to the test pad to the touch electrode.

In one example, the first period does not overlap with the second period.

For example, during the first period, a first activation signal activating the first switching element is applied to the first activation signal pad, and a pixel electrode inspection signal is applied to the inspection pad. During the second period, a second activation signal for activating the second switching element is applied to the second active signal pad, and a touch electrode inspection signal is applied to the inspection pad.

The electroluminescent display device according to the present application can reduce the number of pads by half by using the touch electrode inspection pad and the pixel electrode inspection pad in common. Accordingly, the area of the non-display area where the pads are arranged can be minimized, making it easy to achieve a narrow-bezel structure.

In addition to the effects of the present application mentioned above, other features and advantages of the present application are described below, or can be clearly understood by those skilled in the art from such description and description.

1 is a plan view showing an electroluminescence display device according to the present application.
Figure 2 is a plan view showing a structure in which a pixel driving layer and a touch electrode layer are connected to an inspection pad in an electroluminescence display device according to a preferred embodiment of the present application.
FIG. 3 is a cross-sectional view taken along line II' of FIG. 1 showing the structure of an electroluminescent display device according to an embodiment of the present application.
4A to 4C are plan views showing the shape of an inspection pad in an electroluminescence display device according to an embodiment of the present application.
Figure 5 is a cross-sectional view showing a stacked structure of an inspection pad in an electroluminescent display device according to an embodiment of the present application.

The advantages and features of the present application and methods for achieving them will become clear by referring to examples described in detail below along with the accompanying drawings. However, the present application is not limited to the examples disclosed below and will be implemented in various different forms, and only the examples of the present application ensure that the disclosure of the present application is complete, and are commonly used in the technical field to which the invention of the present application pertains. It is provided to fully inform those with knowledge of the scope of the invention, and the invention of this application is only defined by the scope of the claims.

The shape, size, ratio, angle, number, etc. disclosed in the drawings for explaining an example of the present application are illustrative, and the present application is not limited to the matters shown. Like reference numerals refer to like elements throughout the specification. Additionally, in describing examples of the present application, if it is determined that detailed descriptions of related known technologies may unnecessarily obscure the gist of the present application, the detailed descriptions will be omitted.

When 'includes', 'has', 'consists of', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the plural is included unless specifically stated otherwise.

When interpreting a component, it is interpreted to include the margin of error even if there is no separate explicit description.

In the case of a description of a positional relationship, for example, if the positional relationship of two parts is described as 'on top', 'on the top', 'on the bottom', 'next to', etc., 'immediately' Alternatively, there may be one or more other parts placed between the two parts, unless 'directly' is used.

In the case of a description of a temporal relationship, for example, if a temporal relationship is described as 'after', 'successfully after', 'after', 'before', etc., 'immediately' or 'directly' Unless used, non-consecutive cases may also be included.

Although first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are merely used to distinguish one component from another. Accordingly, the first component mentioned below may also be the second component within the technical spirit of the present application.

The term “at least one” should be understood to include all possible combinations from one or more related items. For example, “at least one of the first, second, and third items” means each of the first, second, or third items, as well as two of the first, second, and third items. It can mean a combination of all items that can be presented from more than one.

Each feature of the various examples of the present application can be combined or combined with each other partially or entirely, and various technological interconnections and operations are possible, and each example can be implemented independently of each other or together in a related relationship. .

Hereinafter, an example of an electroluminescent display device according to the present application will be described in detail with reference to the attached drawings. In adding reference numerals to components in each drawing, identical components may have the same reference numerals as much as possible even if they are shown in different drawings.

1 is a plan view showing an electroluminescence display device according to the present application. Referring to FIG. 1, the electroluminescent display device according to the present application includes a substrate (SUB), a pixel (P), a pixel array layer 120, a touch electrode layer 150, a common power line (CPL), and a gate driving circuit 200. ), a dam structure (DM), and a driving unit (PP, 200, 300).

The substrate (SUB) is a base substrate (or base layer) and includes a plastic material or a glass material. In particular, in the case of a foldable display device, it is desirable to make it from a plastic material with excellent flexibility. However, even if it is made of glass, a foldable display device can be implemented by forming it into an ultra-thin shape.

The substrate SUB according to one example may have a square shape in plan, a square shape in which each corner is rounded with a constant radius of curvature, or a non-square shape with at least six sides. Here, the substrate SUB having a non-rectangular shape may include at least one protrusion or at least one notch portion.

The substrate SUB according to one example may be divided into a display area AA and a non-display area IA. The display area AA is provided in the middle area of the substrate SUB and may be defined as an area for displaying an image. The display area AA according to one example may have a rectangular shape in plan, a rectangular shape in which each corner is rounded to have a constant radius of curvature, or a non-rectangular shape with at least six sides. Here, the display area AA having a non-rectangular shape may include at least one protrusion or at least one notch.

The non-display area IA is provided at an edge area of the substrate SUB to surround the display area AA, and may be defined as an area in which an image is not displayed or a peripheral area. The non-display area (IA) according to an example includes a first non-display area (IA1) provided on the first edge of the substrate (SUB), and a second edge of the substrate (SUB) parallel to the first non-display area (IA1). A second non-display area (IA2), a third non-display area (IA3) provided on the third edge of the substrate SUB, and a fourth non-display area provided on the fourth edge of the substrate SUB parallel to the third non-display area. It may include an area (IA4). For example, the first non-display area IA1 is the upper (or lower) edge area of the substrate SUB, the second non-display area IA2 is the lower (or upper) edge area of the substrate SUB, and the third non-display area IA1 is the upper (or upper) edge area of the substrate SUB. The non-display area (IA3) may be the left (or right) edge area of the substrate (SUB), and the fourth non-display area (IA4) may be the right (or left) edge area of the substrate (SUB), but is not necessarily limited thereto. No.

The pixel P may be provided on the display area AA of the substrate SUB. According to one example, a plurality of pixels P may be arranged in a matrix array and may be arranged in the display area AA of the substrate SUB. A pixel (P) may be defined by a scan line (SL), a data line (DL), and a pixel driving power line (PL).

The scan lines SL extend long along the first direction (X) and are arranged at regular intervals along the second direction (Y) that intersects the first direction (X). The display area AA of the substrate SUB includes a plurality of scan lines SL parallel to the first direction X and spaced apart from each other along the second direction Y. Here, the first direction (X) may be defined as the horizontal direction of the substrate (SUB), and the second direction (Y) may be defined as the vertical direction of the substrate (SUB), but is not necessarily limited thereto and is defined in the opposite direction. It could be.

The data line DL extends long along the second direction (Y) and is arranged at regular intervals along the first direction (X). The display area AA of the substrate SUB includes a plurality of data lines DL parallel to the second direction Y and spaced apart from each other along the first direction X.

The pixel driving power line PL is disposed on the substrate SUB to be parallel to the data line DL. The display area AA of the substrate SUB includes a plurality of pixel driving power lines PL parallel to the data lines DL. Optionally, the pixel driving power line PL may be arranged parallel to the scan line SL.

The pixel P according to one example may be arranged to have a stripe structure on the display area AA. In this case, one unit pixel may include a red pixel, a green pixel, and a blue pixel, and one unit pixel may further include a white pixel.

The pixel P according to another example may be arranged to have a pentile structure on the display area AA. In this case, one unit pixel may include at least one red pixel, at least two green pixels, and at least one blue pixel arranged in a planar polygonal shape. For example, one unit pixel with a pentile structure may be arranged so that one red pixel, two green pixels, and one blue pixel have an octagonal shape on a two-dimensional surface, and in this case, the blue pixel is relatively the largest. It may have a large aperture area (or light emitting area), and the green pixel may have a relatively small aperture area.

The pixel (P) includes a pixel circuit (PC) electrically connected to the scan wire (SL), data wire (DL), and pixel driving power wire (PL), and a light emitting element (ED) electrically connected to the pixel circuit (PC). It can be included.

The pixel circuit (PC) generates a light emitting element (ED) from the pixel driving power line (PL) based on the data voltage supplied from the adjacent data line (DL) in response to the scan signal supplied from the at least one adjacent scan line (SL). Controls the current (Ied) flowing through.

The pixel circuit (PC) according to one example may include at least two thin film transistors and one capacitor. For example, the pixel circuit (PC) according to one example drives a driving thin film transistor that supplies a data current (Ied) based on a data voltage to the light emitting element (ED), and a data voltage supplied from the data line (DL). It may include a switching thin film transistor that supplies the thin film transistor, and a capacitor that stores the gate-source voltage of the driving thin film transistor.

A pixel circuit (PC) according to another example may include at least three thin film transistors and at least one capacitor. For example, the pixel circuit (PC) according to one example may include a current supply circuit, a data supply circuit, and a compensation circuit according to the operation (or function) of each of at least three thin film transistors. Here, the current supply circuit may include a driving thin film transistor that supplies a data current (Ied) based on the data voltage to the light emitting device (ED). The data supply circuit may include at least one switching thin film transistor that supplies the data voltage supplied from the data line DL to the current supply circuit in response to at least one scan signal. The compensation circuit may include at least one compensation thin film transistor that compensates for changes in characteristic values (threshold voltage and/or mobility) of the driving thin film transistor in response to at least one scan signal.

The light emitting element (ED) emits light by the data current (Ied) supplied from the pixel circuit (PC) and emits light with a brightness corresponding to the data current (Ied). In this case, the data current Ied may flow from the pixel driving power line PL to the common power line CPL through the driving thin film transistor and the light emitting element ED.

The light emitting device (ED) according to one example includes a pixel driving electrode (or first electrode or anode) electrically connected to the pixel circuit (PC), a light emitting layer formed on the pixel driving electrode, and a common electrode (or a first electrode) electrically connected to the light emitting layer. 2 electrode or cathode) (CE).

The common power line CPL is disposed on the non-display area IA of the substrate SUB and is electrically connected to the common electrode CE disposed on the display area AA. The common power wiring (CPL) according to an example has a constant wiring width and is disposed along the second to fourth non-display areas (IA2, IA3, IA4) adjacent to the display area (IA) of the substrate (SUB), It surrounds the remaining portion except for a portion of the display area (AA) adjacent to the first non-display area (IA1) of (SUB). One end of the common power line (CPL) may be disposed on one side of the first non-display area (IA1), and the other end of the common power line (CPL) may be disposed on the other side of the first non-display area (IA1). Additionally, the area between one end and the other end of the common power line (CPL) may be arranged to surround the second to fourth non-display areas (IA2, IA3, IA4). Accordingly, the common power line CPL according to one example may have a '∩' shape with one side open corresponding to the first non-display area IA1 of the substrate SUB in plan view.

Pixels (P) are made by stacking several thin film layers. The pixel array layer 120 includes thin film layers in which components included in the pixel P are formed. The detailed structure of the pixel array layer 120 will be described later with reference to FIG. 3 .

Although not shown in FIG. 1, an encapsulation layer is stacked on the pixel array layer 120. The encapsulation layer may be formed on the substrate SUB to surround the top and side surfaces of the display area AA and the common power line CPL. Meanwhile, the encapsulation layer may expose one end and the other end of the common power line CPL in the first non-display area IA1. The encapsulation layer can prevent oxygen or moisture from penetrating into the light emitting element (ED) provided in the display area (AA). The encapsulation layer according to one example may include at least one inorganic film. An encapsulation layer according to another example may include a plurality of inorganic films and an organic film between the plurality of inorganic films.

The touch electrode layer 150 is formed directly on the encapsulation layer. To this end, before forming the touch electrode layer 150, an upper protective film may first be formed on the encapsulation layer. The touch electrode layer 150 may have a different structure depending on the self capacitance type (Self Capacitance Type) and the mutual capacitance type (Mutual Capacitance Type). For example, in the case of the self-capacitance method, it may include a wiring layer, an insulating layer, and an electrode layer. As another example, in the case of a mutual capacitance method, it may include a first electrode layer, an insulating layer, and a second electrode layer.

The electroluminescent display device according to an embodiment of the present application may further include a pad portion (PP), a gate driving circuit 200, a driving integrated circuit 300, and a test pad portion (TEP).

The pad portion PP may include a plurality of pads provided in the non-display area IA of the substrate SUB. The pad portion PP according to an example includes a plurality of common power supply pads, a plurality of data input pads, a plurality of power supply pads, and a plurality of control signal input pads provided in the first non-display area IA1 of the substrate SUB. It may include etc.

The gate driving circuit 200 is provided in the third non-display area (IA3) and/or the fourth non-display area (IA4) of the substrate SUB and is connected one-to-one with the scan wires (SL) provided in the display area (AA). do. The gate driving circuit 200 is integrated into the third non-display area IA3 and/or fourth non-display area IA4 of the substrate SUB along with the manufacturing process of the pixel P, that is, the manufacturing process of the thin film transistor. . The gate driving circuit 200 generates a scan signal based on the gate control signal supplied from the driving integrated circuit 300 and outputs it in a certain order, thereby driving each of the plurality of scan lines SL in a certain order. The gate driving circuit 200 according to one example may include a shift register.

The dam structure DM is provided in the first non-display area IA1, the second non-display area IA2, the third non-display area IA3, and the fourth non-display area IA4 of the substrate SUB. (AA) It may have a closed curve structure surrounding the periphery. For example, the dam structure DM may be disposed outside the common power line CPL and thus may be located at the outermost portion of the substrate 200 . The pad portion PP and the driving integrated circuit 300 are preferably disposed in an outer area of the dam structure DM.

Although Figure 1 illustrates the case where the dam structure (DM) is placed at the outermost edge, it is not limited to this. As another example, the dam structure DM may be disposed between the common power line CPL and the gate driving circuit 200. As another example, the dam structure DM may be disposed between the display area AA and the gate driving circuit 200.

The driving integrated circuit 300 is mounted on the chip mounting area defined in the first non-display area IA1 of the substrate SUB through a chip mounting (or bonding) process. The input terminals of the driving integrated circuit 300 are electrically connected to the pad portion PP, and the input terminals of the driving integrated circuit 300 drive a plurality of data lines DL and a plurality of pixels provided in the display area AA. It is electrically connected to the power wiring (PL). The driving integrated circuit 300 receives various power sources, timing synchronization signals, and digital image data input from the display driving circuit unit (or host circuit) through the pad unit PP, and sends a gate control signal according to the timing synchronization signal. It generates and controls the operation of the gate driving circuit 200, and at the same time, digital image data is converted into an analog pixel data voltage and supplied to the corresponding data line DL.

The test pad portion TEP may be disposed in the first non-display area IA1. In particular, it is desirable to minimize the area occupied by the first non-display area IA1 by placing it around the driving integrated circuit 300. The test pad portion (TEP) is commonly connected to the pixel array layer 120 and the touch electrode layer 150. The test pad portion (TEP) is described in detail below.

Hereinafter, with reference to FIG. 2, the structure in which the pixel array layer and the touch electrode layer are connected to the inspection pad in the electroluminescence display device according to the preferred embodiment of the present application will be described in detail. Figure 2 is a plan view showing a structure in which a pixel array layer and a touch electrode layer are connected to an inspection pad in an electroluminescence display device according to a preferred embodiment of the present application.

Referring to FIG. 2, the electroluminescent display device according to a preferred embodiment of the present application includes a substrate (SUB), a pixel array layer 120, an encapsulation layer 130, a touch electrode layer 150, and a test pad portion (TEP). Includes. Since the substrate (SUB), pixel array layer 120, encapsulation layer 130, and touch electrode layer 150 are the same as previously described, unnecessary description will be omitted.

A pixel array layer 120 is formed on the substrate SUB. The pixel array layer 120 includes a scan line (SL), a data line (DL), a pixel power line (PL), a pixel driving circuit (PC), and a light emitting element (ED). The pixel array layer 120 includes a display area AA.

An encapsulation layer 130 is stacked on the pixel array layer 120. The encapsulation layer 130 is intended to protect the light emitting device (ED). The touch electrode layer 150 is formed directly on the encapsulation layer 130. The touch electrode layer 150 includes a touch electrode (TE) and a touch wire (TL). A plurality of touch electrodes TE may be spaced apart at regular intervals and may be arranged in a matrix manner corresponding to the display area AA. One touch wire (TL) may be assigned to each touch electrode (TE) and extend into the first non-display area (IA1). Since one touch wire (TL) must be disposed on one touch electrode (TE), an insulating film may be further included between the touch wire (TL) and the touch electrode (TE).

The test pad portion TEP may be disposed in the first non-display area IA1. The test pad unit (TEP) includes an array switching element (TAP), a touch switching element (TTC), a first active signal pad (E1), a second active signal pad (E2), and test pads (TP).

One data line DL disposed on the pixel array layer 120 may be connected to one test pad TP. When an inspection signal is applied to the inspection pad TP, the inspection signal is applied to the pixel driving electrode disposed on the pixel array layer 120 through the data line DL to check the pixel state.

Since the test signal is used only in the test process, it is desirable that the signal is not applied from the outside through the test pad (TP) after the test process. Therefore, it is desirable to place a switching element between the test pad TP and the data line DL so that the test signal is transmitted to the data line DL only when necessary. An array switching element (TAP) may be disposed between the data line (DL) and the test pad (TP).

The array switching element (TAP) may be similar or identical to the thin film transistor formed in the pixel array layer 120. The array switching element (TAP) is in the on state, and the test signal transmitted to the test pad (TP) is transmitted to the data line (DL). When the array switching element (TAP) is in an off state, no signal transmitted to the test pad (TP) is transmitted to the data line (DL). In this way, a signal for putting the array switching device (TAP) in an active or inactive state can be transmitted to the array switching device (TAP) through the first active signal pad (E1). For example, as shown in FIG. 2, the first active signal pad E1 may be connected to the gate electrode of the array switching element TAP.

One touch wire (TL) disposed on the touch electrode layer 150 may be connected to one test pad (TP). When an inspection signal is applied to the inspection pad TP, the inspection signal is applied to the touch electrode disposed on the touch electrode layer 150 through the touch wire TL, thereby allowing the status of the touch electrode to be checked.

Since the test signal is used only in the test process, it is desirable that the signal is not applied from the outside through the test pad (TP) after the test process. Therefore, it is desirable to place a switching element between the test pad (TP) and the touch wire (TL) so that the test signal is transmitted to the touch wire (TL) only when necessary. A touch switching element (TTC) may be disposed between the touch wire (TL) and the test pad (TP).

The touch switching element (TTC) may be similar to or identical to the array switching element (TAP). The touch switching element (TTC) is on, and the test signal transmitted to the test pad (TP) is transmitted to the touch wire (TL). When the touch switching element (TTC) is in an off state, no signal transmitted to the test pad (TP) is transmitted to the touch wire (TL). In this way, a signal for putting the touch switching device (TTC) in an active or inactive state can be transmitted to the touch switching device (TTC) through the second activation signal pad (E2). For example, as shown in FIG. 2, the second active signal pad E2 may be connected to the gate electrode of the touch switching element TTC.

The electroluminescent display device according to the present application achieves a narrow-bezel structure by minimizing the number of inspection pads. Accordingly, the test pad TP for the pixel array layer 120 and the test pad TP for the touch electrode layer 150 are configured in common. That is, the array switching element (TAP) and the touch switching element (TTC) may be connected to the same test pad (TP).

To be more specific, one end of the first data line DL1 is connected to the drain electrode of the first array switching element TA1, and the first test pad TP1 is connected to the drain electrode of the first array switching element TA1. It can be connected to the source electrode. Additionally, the first active signal pad E1 may be connected to the gate electrode of the first array switching element TA1.

One end of the first touch wire TL1 may be connected to the drain electrode of the first touch switching element TT1, and the first test pad TP1 may be connected to the source electrode of the first touch switching element TT1. Additionally, the second active signal pad E2 may be connected to the gate electrode of the first touch switching element TA1.

In the same way, the second data line DL2 and the second touch line TL2 are common to the second test pad TP2 through the second array switching element TA2 and the second touch switching element TT2, respectively. It can be connected to . In addition, the third data line DL3 and the third touch line TL3 are commonly connected to the third test pad TP3 through the third array switching element TA3 and the third touch switching element TT3, respectively. You can. And the fourth data line DL4 and the fourth touch line TL4 may be commonly connected to the fourth test pad TP4 through the fourth array switching element TA4 and the fourth touch switching element TT4, respectively. there is.

At the same time, the gate electrodes of the first to fourth array switching elements TA1, TA2, TA3, and TA4 may all be connected to the first active signal pad E1. Meanwhile, gate electrodes of the first to fourth touch switching elements TT1, TT2, TT3, and TT4 may all be connected to the second active signal pad E2.

In this connected state, a signal for inspecting the pixel driving electrode is applied to the inspection pad TP. At the same time, an activation signal is applied to the first activation signal pad E1. Then, the array switching elements TAP are turned on, and the test signal applied to the test pad TP is applied to the data lines DL to check the state of the pixel driving electrode. At this time, no signal is applied to the second active signal pad E2.

On the other hand, a signal for inspecting the touch electrode is applied to the test pad (TP). At the same time, an activation signal is applied to the second activation signal pad E2. Then, the touch switching elements (TTC) are turned on, and the test signal applied to the test pad (TP) is applied to the touch wires (TL), so that the state of the touch electrode can be confirmed. At this time, no signal is applied to the first active signal pad E1.

Hereinafter, with reference to FIG. 3, the cross-sectional structure of the electroluminescence display device according to a preferred embodiment of the present application will be described in detail. FIG. 3 is a cross-sectional view taken along line II' of FIG. 1 showing the structure of an electroluminescent display device according to an embodiment of the present application.

The electroluminescent display device according to an embodiment of the present application includes a substrate (SUB), a pixel array layer 120, a spacer (SP), an encapsulation layer 130, a dam structure (DM), a touch electrode layer 150, and a touch switching device. It may include a device (TTC) and a test pad (TP). Although not shown in FIG. 3, it may further include an array switching element (TAP), a first active signal pad (E1), and a second active signal pad (E2), but they are not shown in the cross-sectional view.

The substrate (SUB) is a base layer and includes plastic or glass. The substrate (SUB) according to one example may include an opaque or colored polyimide material. For example, a polyimide substrate (SUB) may be a cured polyimide resin coated to a certain thickness on the entire surface of a release layer provided on a relatively thick carrier substrate. In this case, the carrier glass substrate is separated from the substrate (SUB) by releasing the release layer using a laser release process. The substrate SUB according to this example further includes a back plate coupled to the rear surface of the substrate SUB in the thickness direction Z. The back plate maintains the substrate (SUB) in a flat state. The back plate according to one example may include a plastic material, for example, polyethylene terephthalate. This back plate may be laminated on the rear side of the substrate (SUB) separated from the carrier glass substrate.

The substrate (SUB) according to another example may be a flexible glass substrate. For example, the glass substrate (SUB) may be a thin glass substrate with a thickness of 100 micrometers or less, or a carrier glass substrate etched to have a thickness of 100 micrometers or less through a substrate etching process.

Most preferably, the substrate (SUB) is preferably made of a material with excellent flexibility that can be freely folded or unfolded. The substrate SUB may include a display area AA and a non-display area IA surrounding the display area AA.

A buffer film (not shown) may be formed on the upper surface of the substrate SUB. The buffer film is formed on one side of the substrate (SUB) to block moisture penetrating into the pixel array layer 120 through the substrate (SUB), which is vulnerable to moisture permeation. A buffer film according to one example may be composed of a plurality of inorganic films stacked alternately. For example, the buffer layer may be formed as a multilayer in which one or more inorganic layers of silicon oxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiON) are alternately stacked. The buffer film may be omitted.

The pixel array layer 120 may include a thin film transistor layer, a planarization layer (PLN), a bank pattern (BN), and a light emitting element (ED).

The thin film transistor layer is provided in each of the plurality of pixels P defined in the display area AA of the substrate SUB and the gate driving circuit 200 defined in the fourth non-display area IA4 of the substrate SUB. .

The thin film transistor layer according to one example includes a thin film transistor (T), a gate insulating layer (GI), and an interlayer insulating layer (ILD). Here, the thin film transistor T shown in FIG. 3 may be a driving thin film transistor electrically connected to the light emitting device ED.

The thin film transistor (T) includes a semiconductor layer (A), a gate electrode (G), a source electrode (S), and a drain electrode (D) formed on a substrate (SUB) or a buffer film. In FIG. 3, the thin film transistor (T) shows a top gate (top gate) structure in which the gate electrode (G) is located on top of the semiconductor layer (A), but it is not necessarily limited to this. As another example, the thin film transistor (T) has a bottom gate structure in which the gate electrode (G) is located at the bottom of the semiconductor layer (A), or the gate electrode (G) is located at the top and the bottom of the semiconductor layer (A). It may have a double gate structure located all at the bottom.

The semiconductor layer (A) may be formed on a substrate (SUB) or a buffer film. The semiconductor layer (A) may include a silicon-based semiconductor material, an oxide-based semiconductor material, or an organic-based semiconductor material, and may have a single-layer structure or a multi-layer structure. A light blocking layer may be additionally formed between the buffer film and the semiconductor layer (A) to block external light incident on the semiconductor layer (A).

The gate insulating film GI may be formed on the entire substrate SUB to cover the semiconductor layer A. The gate insulating layer GI may be formed of an inorganic layer, for example, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof.

The gate electrode (G) may be formed on the gate insulating film (GI) to overlap the semiconductor layer (A). The gate electrode (G) may be formed together with the scan line (SL). The gate electrode (G) according to one example is made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It can be formed as a single layer or multiple layers made of any one or an alloy thereof.

The interlayer insulating layer (ILD) may be formed on the entire substrate (SUB) to cover the gate electrode (G) and the gate insulating layer (GI). The interlayer insulating layer (ILD) provides a flat surface on the gate electrode (G) and the gate insulating layer (GI).

The source electrode (S) and the drain electrode (D) may be formed on the interlayer insulating layer (ILD) to overlap the semiconductor layer (A) with the gate electrode (G) interposed therebetween. The source electrode (S) and the drain electrode (D) may be formed together with the data line (DL), the pixel driving power line (PL), and the common power line (CPL). That is, each of the source electrode (S), drain electrode (D), data line (DL), pixel driving power line (PL), and common power line (CPL) is formed simultaneously by a patterning process for the source and drain electrode material.

Each of the source electrode S and the drain electrode D may be connected to the semiconductor layer A through an electrode contact hole penetrating the interlayer insulating layer ILD and the gate insulating layer GI. The source electrode (S) and drain electrode (D) are made of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). ) may be formed as a single layer or multiple layers made of any one or an alloy thereof. Here, the source electrode (S) of the thin film transistor (T) shown in FIG. 2 may be electrically connected to the pixel driving power line (PL).

In this way, the thin film transistor T provided in the pixel P of the substrate SUB constitutes the pixel circuit PC. Additionally, the gate driving circuit 200 disposed in the fourth non-display area (IA4) of the substrate (SUB) may include a thin film transistor that is the same as or similar to the thin film transistor (T) provided in the pixel (P).

The planarization layer (PLN) is formed on the entire substrate (SUB) to cover the thin film transistor layer. The planarization layer (PLN) provides a planar surface on the thin film transistor layer. The planarization layer (PLN) according to one example is an organic material such as acryl resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. It can be formed into a membrane.

The planarization layer (PLN) according to another example may include a pixel contact hole (PH) for exposing the drain electrode (D) of the driving thin film transistor provided in the pixel (P).

The bank BN is disposed on the planarization layer PLN and defines an opening area (or light-emitting area) within the pixel P of the display area AA. This bank BN may also be expressed as a pixel defining layer.

The light emitting element (ED) includes a pixel driving electrode (AE), a light emitting layer (EL), and a common electrode (CE). The pixel driving electrode (AE) is formed on the planarization layer (PLN) and is electrically connected to the drain electrode (D) of the driving thin film transistor through the pixel contact hole (PH) provided in the planarization layer (PLN). In this case, the edge portion excluding the middle portion of the pixel driving electrode AE that overlaps the opening area of the pixel P may be covered by the bank BN. The bank BN may define the opening area of the pixel P by covering the edge of the pixel driving electrode AE.

The pixel driving electrode AE according to one example may include a metal material with high reflectivity. For example, the pixel driving electrode (AE) has a stacked structure of aluminum (Al) and titanium (Ti) (Ti/Al/Ti), a stacked structure of aluminum (Al) and ITO (ITO/Al/ITO), and APC ( It is formed in a multi-layer structure such as Ag/Pd/Cu) alloy, and a laminated structure of APC alloy and ITO (ITO/APC/ITO), or silver (Ag), aluminum (Al), molybdenum (Mo), and gold (Au) , it may include a single-layer structure made of any one material selected from magnesium (Mg), calcium (Ca), or barium (Ba), or an alloy material of two or more materials.

The light emitting layer EL is formed over the entire display area AA of the substrate SUB to cover the pixel driving electrode AE and the bank BN. The light emitting layer (EL) according to one example may include two or more light emitting units vertically stacked to emit white light. For example, the light emitting layer EL according to one example may include a first light emitting unit and a second light emitting unit for emitting white light by mixing the first light and the second light. Here, the first light emitting part emits the first light and may include any one of a blue light emitting part, a green light emitting part, a red light emitting part, a yellow light emitting part, and a yellow green light emitting part. The second light emitter may include a blue light emitter, a green light emitter, a red light emitter, a yellow light emitter, and a light emitter that emits second light that can optically compensate for the first light of yellow green.

The light emitting layer EL according to another example may include any one of a blue light emitting part, a green light emitting part, and a red light emitting part for emitting color light corresponding to the color set in the pixel P. For example, the light emitting layer (EL) according to another example may include any one of an organic light emitting layer, an inorganic light emitting layer, and a quantum dot light emitting layer, or may include a stacked or mixed structure of an organic light emitting layer (or an inorganic light emitting layer) and a quantum dot light emitting layer.

Additionally, the light emitting device (ED) according to one example may further include a functional layer to improve the luminous efficiency and/or lifespan of the light emitting layer (EL).

The common electrode (CE) is formed to be electrically connected to the light emitting layer (EL). The common electrode CE is formed throughout the display area AA of the substrate SUB to be commonly connected to the light emitting layer EL provided in each pixel P.

The common electrode (CE) according to one example may include a transparent conductive material or a translucent conductive material that can transmit light. When the common electrode (CE) is formed of a transflective conductive material, the emission efficiency of light emitted from the light emitting device (ED) can be increased through a micro cavity structure. The transflective conductive material according to one example may include magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). Additionally, a capping layer may be further formed on the common electrode (CE) to improve light emission efficiency by adjusting the refractive index of light emitted from the light emitting device (ED).

The spacers SP may be dispersedly disposed in the opening area of the display area AA, that is, in the area where the light emitting element ED is not disposed. The spacer SP may be used to prevent the screen mask and the substrate from directly contacting each other during the process of depositing the light emitting layer EL. The spacers (SP) may have a pillar shape of the bank (BN) and may be arranged to be distributed only to a portion of the bank (BN). Even if the light emitting layer (EL) and the common electrode (CE) cannot pass over the spacer (SP), they are not disconnected by the spacer (SP) and have a structure in which they are connected throughout the substrate (SUB). Since the light emitting layer EL and the common electrode CE are not disconnected by the spacer SP, the spacer SP may have a positive taper shape or a reverse taper shape.

The encapsulation layer 130 is formed to surround both the top and side surfaces of the pixel array layer 120. The encapsulation layer 130 serves to prevent oxygen or moisture from penetrating into the light emitting device (ED).

The encapsulation layer 130 according to an example includes a first inorganic encapsulation layer (PAS1), an organic encapsulation layer (PCL) on the first inorganic encapsulation layer (PAS1), and a second inorganic encapsulation layer (PAS2) on the organic encapsulation layer (PCL). may include. The first inorganic encapsulation layer (PAS1) and the second inorganic encapsulation layer (PAS2) serve to block penetration of moisture or oxygen. According to one example, the first inorganic encapsulation layer (PAS1) and the second inorganic encapsulation layer (PAS2) are made of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. It may be made of inorganic materials. The first inorganic encapsulation layer (PAS1) and the second inorganic encapsulation layer (PAS2) may be formed by a chemical vapor deposition process or an atomic layer deposition process.

The organic encapsulation layer (PCL) is surrounded by the first inorganic encapsulation layer (PAS1) and the second inorganic encapsulation layer (PAS2). The organic encapsulation layer (PCL) is relatively thick compared to the first inorganic encapsulation layer (PAS1) and/or the second inorganic encapsulation layer (PAS2) to adsorb and/or block particles that may occur during the manufacturing process. It can be formed as The organic encapsulation layer (PCL) may be made of an organic material such as silicon oxycarbon (SiOCz) acrylic or epoxy-based resin. The organic encapsulation layer (PCL) may be formed by a coating process, for example, an inkjet coating process or a slit coating process.

The electroluminescent display device according to an embodiment of the present application may further include a dam structure (DM). The dam structure DM is disposed in the non-display area IA of the substrate SUB to prevent the organic encapsulation layer PCL from overflowing.

The dam structure (DM) according to an example is located outside the display area (AA), the gate driving circuit 200 disposed outside the display area (AA), and the common power line (CPL) disposed outside the gate driving circuit 200. can be placed in In some cases, the dam structure DM may be arranged to overlap the outer portion of the common power line CPL. In this case, the bezel width can be reduced by reducing the width of the non-display area (IA) where the gate driving circuit 200 and the common power line (CPL) are disposed.

The dam structure DM according to a preferred embodiment of the present application may have a triple-layer structure formed perpendicular to the substrate SUB. For example, it may include a first layer formed of a planarization layer (PLN), a second layer formed of a bank pattern (BN), and a third layer formed of a spacer (SP).

The first layer may have a trapezoidal cross-sectional structure patterned as a planarization layer (PLN). The second layer may have a trapezoidal cross-sectional structure stacked on top of the first layer. The third layer may have a trapezoidal cross-sectional structure stacked on top of the second layer. If the thickness of the organic encapsulation layer (PCL) is thin and it is easy to control the spreadability of the organic encapsulation layer (PCL), the height of the dam structure DM may not be high enough. In this case, the third layer may be omitted.

The dam structure DM is entirely covered by the first inorganic encapsulation layer PAS1 and/or the second inorganic encapsulation layer PAS2. The organic encapsulation layer (PCL) may contact a portion of the inner wall of the dam structure (DM). For example, the height from the edge area of the organic encapsulation layer (PCL) to the upper surface may be higher than the height of the first layer of the dam structure (DM) and lower than the height of the second layer. Alternatively, the height from the edge area of the organic encapsulation layer (PCL) to the upper surface may be higher than the height of the second layer of the dam structure (DM) and lower than the height of the third layer.

It is preferable that the height from the edge area of the organic encapsulation layer (PCL) to the upper surface is lower than the overall height of the dam structure (DM). As a result, the dam structure DM has a structure in which the first inorganic encapsulation layer PAS1 and the second inorganic encapsulation layer PAS2 are in surface contact with each other on the upper surface and the outer side wall.

An upper protective film (PAS) is applied on the second inorganic encapsulation layer (PAS2) laminated on the top of the encapsulation layer 130. The upper protective film (PAS) is a protective film further laminated on the second inorganic encapsulation layer (PAS2) to protect the lower element layers when patterning the touch electrode layer 150 formed thereon.

A touch electrode layer 150 is stacked on the upper protective film (PAS). The touch electrode layer 150 includes a touch wire (TL), an insulating film (INS), a touch electrode (TE), and a touch protective film (UP).

The touch wire TL includes a transparent conductive material and extends from the display area AA to the first non-display area IA1. In particular, the touch wire TL may be connected to the touch switching element TTC disposed in the first non-display area IA1.

The touch switching element (TTC) may be the same as or similar to the thin film transistor (T) formed in the display area (AA). For example, the touch switching element (TTC) includes a touch gate electrode (TG), a touch semiconductor layer (TA), a touch source electrode (TS), and a touch drain electrode (TD). The touch wire (TL) may be connected to the touch drain electrode (TD).

The touch switching element (TTC) may be covered by the first inorganic encapsulation layer (PAS1), the second inorganic encapsulation layer (PAS2), and the upper protective film (PAS) of the encapsulation layer 130. For convenience, Figure 3 shows a case where only the upper protective film (PAS) covers the touch switching element (TTC). The touch wire TL may be connected to the touch drain electrode TD through a contact hole exposing the drain electrode TD of the touch switching element TTC.

The touch source electrode (TC) of the touch switching element (TTC) may be connected to the test pad (TP). The test pad (TP) may be formed of a separate metal material. Alternatively, it may be formed together with the same material as the touch wiring TL. FIG. 3 shows a test pad (TP) formed on the same layer and made of the same material as the touch wire (TL).

An insulating film (INS) is stacked on the touch wiring (TL) to cover the entire surface of the substrate (SUB). In particular, it is preferable to extend to the first non-display area IA1 and expose the test pad TP.

A touch electrode (TE) is formed on the insulating film (INS). The touch electrode TE is disposed in the display area AA. For example, one touch electrode (TE) can be formed to cover about 9 to 16 pixel areas. One touch electrode (TE) is connected to one touch wire (TL). For example, the touch wire TL and the touch electrode TE may be connected through a contact hole that penetrates the insulating film INS and exposes a portion of the touch wire TL.

A touch protective film UP is laminated on the upper surface of the touch electrode TE to cover the entire surface of the substrate SUB. Here, the touch protection film UP may expose a portion of the test pad TP.

Although not shown in the cross-sectional view, it may further include an array switching element (TAP), a first active signal pad (E1), and a second active signal pad (E2). The array switching element (TAP) may have the same structure as the touch switching element (TTC). The first active signal pad E1 and the second active signal pad E2 may be formed on the same layer and made of the same material as the test pad TP. The first active signal pad E1 may be connected to the gate electrode through a connection wire formed on the same layer and made of the same material as the gate electrode of the array switching element TAP. The second active signal pad E2 may be connected to the touch gate electrode TG of the touch switching element TTC through a connection wire formed on the same layer and made of the same material.

With reference to the drawings below, various embodiments of the test pad in the electroluminescent display device according to the present application will be described. First, the shape of the test pad according to an embodiment of the present application will be described with reference to FIGS. 4A to 4C. 4A to 4C are plan views showing the shape of a test pad in an electroluminescence display device according to an embodiment of the present application.

Referring to FIG. 4A, the test pad TP of the electroluminescence display device according to an embodiment of the present application may have a rectangular shape with each corner cut out. In the previous explanation, the test pad (TP) was described as having a rectangular shape. However, it is not limited to this, and may have a square-chamfered shape as shown in FIG. 4A. Alternatively, it may have a rectangular shape with rounded corners as shown in Figure 4b.

As another example, as shown in FIG. 4C, the test pad TP of the electroluminescence display device according to an embodiment of the present application may have a circular shape. Although not illustrated in the drawing, it may have a polygonal shape close to a circle. In some cases, it may have an oval shape with long sides arranged in the longitudinal direction.

Next, with reference to FIG. 5 , the stacked structure of the test pad TP according to an embodiment of the present application will be described. Figure 5 is a cross-sectional view showing a stacked structure of a test pad in an electroluminescence display device according to an embodiment of the present application.

Referring to FIG. 3 , only the case where the test pad (TP) described above is formed of the same material on the same layer as the touch wire (TL) has been described. However, it is not limited to this, and may have a structure in which different metal layers constituting the display device are stacked.

For example, referring to FIG. 5, the pad uses the metal layer used for the gate electrode (G) as the first layer (M1), and the metal layer used for the source electrode (S) and drain electrode (D) as the second layer (M1). M2), and the uppermost layer may have a multi-layer structure in which the metal layer used for the touch wiring TL is the third layer M3. In this case, the first metal layer (M1) is formed on the substrate and is made of the same material as the gate electrode (G). The second metal layer (M2) is in contact with the first metal layer (M1) through a contact hole penetrating the interlayer insulating layer (ILD). The second metal layer (M2) is made of the same material as the source electrode (S). A third metal layer (M3) is in contact with the second metal layer (M2) through a contact hole penetrating the upper protective film (PAS). The third metal layer M3 is made of the same material as the touch wiring TL.

Although not shown in the drawings, the overall structure of the electroluminescent display device according to the embodiments of the present application described above is summarized as follows.

The electroluminescence display device according to the present application includes a substrate, and the substrate has a display area and a non-display area surrounding the display area. The display area includes pixel electrodes and touch electrodes. The touch electrode may be disposed in another layer above the pixel electrode. The non-display area is provided with an inspection pad and selection means. The selection means may connect the test pad with either the pixel electrode or the touch electrode for a predetermined period of time.

The selection means connects the test pad with the pixel electrode during a first period. Additionally, the test pad is connected to the touch electrode during the second period. Here, it is preferable that the first period and the second period are different periods that do not overlap with each other. During the first period, a signal for inspecting the pixel electrode is applied to the inspection pad. During the second period, a signal for testing the touch electrode is applied to the test pad.

The selection means may include a first active signal pad, a second active signal pad, a first switching element and a second switching element. One end of the first switching element is connected to a pixel electrode, and the other end is connected to a test pad. One end of the second switching element is connected to a touch electrode, and the other end is connected to a test pad. The first active signal pad is connected to the first switching element and can be selectively turned on/off. The second active signal pad is connected to the second switching element and can be selectively turned on/off.

During the first period in which the activation signal is applied to the first active signal pad, the first switching element may transmit the signal applied to the test pad to the pixel electrode to check the state of the pixel electrode. During the second period in which the active signal is applied to the second active signal pad, the second switching element may confirm the state of the touch electrode by transmitting the signal applied to the test pad to the touch electrode.

During the first period, a first activation signal for activating the first switching element is applied to the first activation signal pad, and a pixel electrode inspection signal is applied to the inspection pad. That is, during the first period, the pixel electrode inspection signal is transmitted only to the pixel electrode. Additionally, during the second period, a second activation signal for activating the second switching element is applied to the second active signal pad, and a touch electrode inspection signal is applied to the inspection pad. That is, during the second period, the touch electrode inspection signal is transmitted only to the touch electrode.

The electric field display device according to an example of this application is an electronic notebook, an e-book, a Portable Multimedia Player (PMP), a navigation device, an Ultra Mobile PC (UMPC), a smart phone, a mobile communication terminal, a mobile phone, and a tablet. Portable electronic devices such as personal computers (PCs), smart watches, watch phones, or wearable devices, as well as televisions, laptops, monitors, refrigerators, microwave ovens, washing machines, cameras, etc. It can be applied to a variety of products.

The features, structures, effects, etc. described in the various embodiments of the present application described above are included in at least one example of the present application and are not necessarily limited to only one example. Furthermore, the features, structures, effects, etc. exemplified in at least one example of the present application can be combined or modified for other examples by those skilled in the art to which the present application pertains. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present application.

The present application described above is not limited to the above-described embodiments and the accompanying drawings, and it is common in the technical field to which this application belongs that various substitutions, modifications, and changes are possible without departing from the technical details of the present application. It will be clear to those who have the knowledge of. Therefore, the scope of the present application is indicated by the claims described later, and the meaning and scope of the claims and all changes or modified forms derived from the equivalent concept should be interpreted as being included in the scope of the present application.

SUB: Substrate T: Thin film transistor
PLN: Flattening layer BN: Bank pattern
SP: Spacer DM: Dam structure
200: gate driving circuit 300: driving integrated circuit
120: Pixel array layer 130: Encapsulation layer
ED: Light emitting element AE: Pixel driving electrode
EL: light-emitting layer CE: common electrode
CPL: Common power wiring

Claims (15)

A substrate including a display area and a non-display area surrounding the display area;
a touch electrode disposed on a light emitting device within the display area;
an inspection pad disposed in the non-display area and connected to the light emitting element and the touch electrode; and
It is disposed in the non-display area and includes a switching element that selectively connects the inspection pad to one of the light emitting element and the touch electrode,
The switching element is,
a first switching element connecting the light emitting element and the inspection pad in response to a first activation signal; and
Provided with a second switching element connecting the touch electrode and the inspection pad in response to a second activation signal;
a first active signal pad connected to a first gate electrode of the first switching element to apply the first active signal to the gate electrode of the first switching element;
An electroluminescent display device comprising a second active signal pad connected to a second gate electrode of the second switching element to apply the second active signal to the gate electrode of the second switching element.
According to claim 1,
The switching element is,
a common connection wire connecting the first switching element and the second switching element to the inspection pad;
a first connection wire connecting the first switching element and the light emitting element; and
The electroluminescent display device further includes a second connection wire connecting the second switching element and the touch electrode.
According to claim 2,
The inspection pad, the first active signal pad, and the second active signal pad are arranged adjacent to each other in the non-display area.
According to claim 2,
The first switching element is,
the first gate electrode connected to the first active signal pad;
a first source electrode connected to the inspection pad; and
It includes a first drain electrode connected to the first connection wire,
The second switching element is,
the second gate electrode connected to the second active signal pad;
a second source electrode connected to the inspection pad; and
An electroluminescent display device including a second drain electrode connected to the second connection wire.
According to claim 1,
The light emitting device is,
pixel driving electrodes arranged in a matrix manner within the display area;
a light emitting layer stacked on the pixel driving electrode; and
Includes a common electrode stacked on the light emitting layer;
an encapsulation layer laminated on the common electrode; and
It further includes an upper protective film laminated on the encapsulation layer,
The touch electrode is an electroluminescent display device stacked on the upper protective film.
According to claim 1,
The touch electrode is,
a first touch electrode layer extending in a first direction on the substrate;
a dielectric layer covering the first touch electrode layer;
An electroluminescent display device comprising a second touch electrode layer stacked on the dielectric layer and extending in a second direction different from the first direction.
According to claim 1,
Further comprising a dam structure disposed in the non-display area and surrounding the display area,
The inspection pad is an electroluminescent display device disposed outside the dam structure.
According to claim 1,
a driving signal input pad connected to the light emitting device and disposed adjacent to the inspection pad; and
The electroluminescent display device further includes a touch signal input pad connected to the touch electrode and disposed adjacent to the driving signal input pad.
A display area where pixel electrodes and touch electrodes are arranged; and
a non-display area where a test pad and a plurality of switching elements and active signal pads are arranged;
The plurality of switching elements include at least a first switching element and a second switching element,
Connecting the test pad to the pixel electrode through the first switching element during a first period,
An electroluminescence display device connecting the inspection pad to the touch electrode through the second switching element during a second period.
delete According to clause 9,
A pixel electrode test signal is applied to the test pad during the first period,
An electroluminescent display device in which a touch electrode test signal is applied to the test pad during the second period.
According to clause 9,
The plurality of active signal pads include at least a first active signal pad and a second active signal pad,
The first active signal pad is connected to the first switching element,
The second active signal pad is connected to the second switching element.
According to claim 12,
During the first period in which an active signal is applied to the first active signal pad, the first switching element transmits the signal applied to the test pad to the pixel electrode,
During the second period in which the active signal is applied to the second active signal pad, the second switching element transmits the signal applied to the test pad to the touch electrode.
According to claim 13,
The electroluminescent display device wherein the first period does not overlap with the second period.
According to claim 14,
During the first period, a first activation signal for activating the first switching element is applied to the first activation signal pad, and a pixel electrode inspection signal is applied to the inspection pad,
During the second period, a second activation signal for activating the second switching element is applied to the second active signal pad, and a touch electrode inspection signal is applied to the inspection pad.

Images