KR102596425B1 - Uv curable adhesive composition for micro led display and adhesive sheet using the same - Google Patents

Uv curable adhesive composition for micro led display and adhesive sheet using the same Download PDF

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KR102596425B1
KR102596425B1 KR1020210139349A KR20210139349A KR102596425B1 KR 102596425 B1 KR102596425 B1 KR 102596425B1 KR 1020210139349 A KR1020210139349 A KR 1020210139349A KR 20210139349 A KR20210139349 A KR 20210139349A KR 102596425 B1 KR102596425 B1 KR 102596425B1
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adhesive
micro led
led display
acrylic
curable composition
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KR20230055677A (en
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이기우
반성태
이주란
김건우
김지원
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주식회사 켐코
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/34Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

본 발명은 마이크로 LED 디스플레이용 자외선 경화성 조성물 및 이를 이용한 점착필름에 관한 것으로서, 상기 자외선 경화성 조성물은 수산기를 함유하는 메타크릴산 에스테르 중합체에 아크릴기를 함유하는 모노 이소시아네이트 단량체를 반응시켜 수득되는 수지를 포함하며, 상기 수산기를 함유하는 메타크릴산 에스테르 중합체는 수산기 값이 고형분 기준 10 ~ 100 ㎎KOH/g인 것을 특징으로 한다. The present invention relates to an ultraviolet curable composition for a micro LED display and an adhesive film using the same. The ultraviolet curable composition includes a resin obtained by reacting a methacrylic acid ester polymer containing a hydroxyl group with a monoisocyanate monomer containing an acrylic group, , the methacrylic acid ester polymer containing the hydroxyl group is characterized in that the hydroxyl group value is 10 to 100 mgKOH/g based on solid content.

Description

마이크로 LED 디스플레이용 자외선 경화성 조성물 및 이를 이용한 마이크로 LED 디스플레이용 점착필름.{UV CURABLE ADHESIVE COMPOSITION FOR MICRO LED DISPLAY AND ADHESIVE SHEET USING THE SAME}Ultraviolet curable composition for micro LED displays and adhesive film for micro LED displays using the same. {UV CURABLE ADHESIVE COMPOSITION FOR MICRO LED DISPLAY AND ADHESIVE SHEET USING THE SAME}

본 발명은 마이크로 LED 디스플레이용 자외선 경화성 조성물 및 이를 이용한 마이크로 LED 디스플레이용 점착필름에 관한 것으로서, 더욱 상세하게는, 마이크로 LED 디스플레이 제조공정에 사용되는 점착필름에 적용할 수 있는 자외선 경화성 조성물 및 이를 이용한 점착필름에 관한 것이다.The present invention relates to an ultraviolet curable composition for a micro LED display and an adhesive film for a micro LED display using the same. More specifically, an ultraviolet curable composition applicable to an adhesive film used in the micro LED display manufacturing process and adhesive using the same. It's about film.

마이크로 LED 디스플레이의 제조공정에는 마이크로 LED 웨이퍼 고정용 필름, 캐리어필름, 전사필름 등의 다양한 점착필름이 사용되고 있다. 이러한 점착필름은 반도체 공정용 점착필름과 유사하지만 마이크로 LED는 반도체보다 크기가 작기 때문에 반도체 제조공정용인 다이싱 테이프보다 더 우수한 특성이 요구된다. 즉, 자외선 조사전의 점착력은 반도체 다이싱 테이프보다 높은 점착력을 나타내며 자외선 조사후의 점착력은 반도체 다이싱 테이프보다 더 낮은 비점착 특성이 요구된다.In the manufacturing process of micro LED displays, various adhesive films such as micro LED wafer fixing film, carrier film, and transfer film are used. These adhesive films are similar to adhesive films for semiconductor processing, but because micro LEDs are smaller than semiconductors, they require better properties than dicing tapes for semiconductor manufacturing processes. That is, the adhesive strength before irradiation with ultraviolet rays is higher than that of the semiconductor dicing tape, and the adhesive strength after irradiation with ultraviolet rays requires lower non-adhesive properties than that of the semiconductor dicing tape.

대한민국 등록특허공보 10-2001858호에서는 자외선 경화 후 비점착 특성을 가지는 아크릴 점착제 조성물로서 일반 아크릴 점착제에 다관능기를 가지는 알리파틱 아크릴레이트 올리고머를 공중합시키고 공중합 반응 후 톨루엔 및 디페닐펜타에리스리톨헥사아크릴레이트(DPHA)를 넣어 중량 평균 분자량을 조정함으로써 비점착 특성을 나타내는 점착제의 조성이 제안되고 있다. 그러나 이러한 점착제 조성물은 점착제 자체에 이중결합이 존재하지 않아 자외선 경화 후 저분자량 아크릴 점착제가 피착제에 남아있을 수 있으며 마이크로 LED에 적용할 만큼의 점착력을 얻을 수 없는 문제점이 있다.Republic of Korea Patent Publication No. 10-2001858 discloses an acrylic adhesive composition having non-adhesive properties after UV curing. An aliphatic acrylate oligomer having a multifunctional group is copolymerized with a general acrylic adhesive, and after the copolymerization reaction, toluene and diphenylpentaerythritol hexaacrylate ( A composition of an adhesive that exhibits non-adhesive properties has been proposed by adjusting the weight average molecular weight by adding DPHA). However, these adhesive compositions do not have double bonds in the adhesive itself, so low-molecular-weight acrylic adhesives may remain on the adhesive after UV curing, and there is a problem in that adhesive strength sufficient to be applied to micro LEDs cannot be obtained.

또한, 대한민국 등록특허공보 10-1138796호에서도 역시 이중결합이 없는 아크릴 점착제를 사용하였으며 비반응성 다이메틸실록산 수지를 사용하여 피착물에 전사될 수 있어 마이크로 LED 제조 공정에 사용하기에는 적합하지 않다.In addition, Republic of Korea Patent Publication No. 10-1138796 also used an acrylic adhesive without double bonds and could be transferred to an adherend using a non-reactive dimethylsiloxane resin, so it is not suitable for use in the micro LED manufacturing process.

또한, 대한민국 등록특허공보 10-1019063호에 기재된 아크릴계 점착제는 점착제 폴리머 주쇄에 이중결합이 있어 잔사 문제는 없으나 점착력이 낮고 자외선 조사후 점착력이 높아 마이크로 LED 제조 공정에 사용하기에는 적합하지 않다.In addition, the acrylic adhesive described in Korean Patent Publication No. 10-1019063 has a double bond in the adhesive polymer main chain, so there is no residue problem, but it has low adhesiveness and high adhesiveness after ultraviolet irradiation, so it is not suitable for use in the micro LED manufacturing process.

대한민국 등록특허공보 10-2001858호Republic of Korea Patent Publication No. 10-2001858 대한민국 등록특허공보 10-1138796호Republic of Korea Patent Publication No. 10-1138796 대한민국 등록특허공보 10-1019063호Republic of Korea Patent Publication No. 10-1019063

본 발명은 상기와 같은 종래기술을 감안하여 안출된 것으로서, 마이크로 LED 디스플레이 제조공정에 사용되는 점착필름에 적용할 수 있는 물성을 나타내는 자외선 경화성 조성물을 제공하는 것을 그 목적으로 한다.The present invention was developed in consideration of the above-described prior art, and its purpose is to provide an ultraviolet curable composition that exhibits physical properties applicable to an adhesive film used in the micro LED display manufacturing process.

특히, 자외선 조사 전후의 점착력 차이를 통해 잔사 없이 점착이 가능하도록 한 자외선 경화성 조성물 및 이를 이용한 점착필름을 제공하는 것을 그 목적으로 한다.In particular, the purpose is to provide an ultraviolet curable composition that enables adhesion without residue through the difference in adhesion before and after ultraviolet irradiation, and an adhesive film using the same.

상기와 같은 과제를 해결하기 위한 본 발명의 마이크로 LED 디스플레이용 자외선 경화성 조성물은 수산기를 함유하는 메타크릴산 에스테르 중합체에 아크릴기를 함유하는 모노 이소시아네이트 단량체를 반응시켜 얻어진 것으로 수산기를 함유하는 메타크릴산 에스테르 중합체는 수산기 값이 고형분 기준 10 ~ 100 ㎎KOH/g인 것을 특징으로 한다.The ultraviolet curable composition for a micro LED display of the present invention to solve the above problems is obtained by reacting a monoisocyanate monomer containing an acrylic group with a methacrylic acid ester polymer containing a hydroxyl group. is characterized by a hydroxyl value of 10 to 100 mgKOH/g based on solid content.

이때, 상기 아크릴기를 함유하는 모노 이소시아네이트 단량체는 이소포론 디이소시아네이트(isophorone diisocyanate,IPDI) 및 하이드록시에틸 아크릴레이트(hydroxy ethyl acrylate, HEA)를 반응시켜 제조되는 것으로서 NCO 함량이 11~12%인 것이 바람직하다.At this time, the monoisocyanate monomer containing the acrylic group is prepared by reacting isophorone diisocyanate (IPDI) and hydroxy ethyl acrylate (HEA), and the NCO content is preferably 11 to 12%. do.

또한, 본 발명에 따른 점착필름은 기재 및 상기 기재의 일면에 형성되는 점착제 층, 상기 점착제 층 상에 적층되는 박리필름을 포함하는 것으로서, 상기 점착제 층은 상기 자외선 경화성 조성물, 광 개시제, 및 에폭시 경화제를 포함하는 점착제로 이루어지는 것을 특징으로 한다.In addition, the adhesive film according to the present invention includes a substrate, an adhesive layer formed on one side of the substrate, and a release film laminated on the adhesive layer, wherein the adhesive layer includes the ultraviolet curable composition, a photoinitiator, and an epoxy curing agent. It is characterized by being made of an adhesive containing.

본 발명에 따른 자외선 경화성 조성물은 마이크로 LED 디스플레이 제조공정에 사용되는 점착필름에 적용할 수 있는 물성을 나타내는 것으로서, 특히, 자외선 조사 전후의 점착력 차이를 통해 잔사 없이 점착이 가능하도록 하는 효과를 나타낸다.The ultraviolet curable composition according to the present invention exhibits physical properties that can be applied to the adhesive film used in the micro LED display manufacturing process. In particular, it exhibits the effect of enabling adhesion without residue through the difference in adhesive strength before and after ultraviolet irradiation.

이하 본 발명을 보다 상세히 설명한다. 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다.Hereinafter, the present invention will be described in more detail. Terms or words used in this specification and claims should not be construed as limited to their common or dictionary meanings, and the inventor may appropriately define the concept of terms in order to explain his or her invention in the best way. It must be interpreted with meaning and concept consistent with the technical idea of the present invention based on the principle that it is.

본 발명에 따른 자외선 경화성 조성물은 수산기를 함유하는 메타크릴산 에스테르 중합체에 아크릴기를 함유하는 모노 이소시아네이트 단량체를 반응시켜 얻어진 것으로 수산기를 함유하는 메타크릴산 에스테르 중합체는 수산기 값이 고형분 기준 10 ~ 100 ㎎KOH/g인 것을 특징으로 한다.The ultraviolet curable composition according to the present invention is obtained by reacting a monoisocyanate monomer containing an acrylic group with a methacrylic acid ester polymer containing a hydroxyl group. The methacrylic acid ester polymer containing a hydroxyl group has a hydroxyl value of 10 to 100 mgKOH based on solid content. It is characterized by /g.

상기 수산기 값이 10 ㎎KOH/g 이하이면 모노 이소시아네이트 단량체를 반응시켜 얻은 점착제의 이중결합 함량이 낮아져 자외선 경화 후 점착력이 높아지며, 수산기 값이 100 ㎎KOH/g 이상이면 점착제의 극성이 증대하여 점도가 상승하여 작업성이 저하될수 있으며 높은 점도로 인해 이소시아네이트 반응시 겔화 위험이 있기 때문에 상기 수산기 값의 범위를 충족시키는 메타크릴산 에스테르 중합체를 사용하는 것이 바람직하다.If the hydroxyl value is 10 mgKOH/g or less, the double bond content of the adhesive obtained by reacting monoisocyanate monomers is lowered, thereby increasing the adhesive strength after ultraviolet curing. If the hydroxyl value is 100 mgKOH/g or more, the polarity of the adhesive increases and the viscosity increases. This may result in reduced workability and there is a risk of gelation during isocyanate reaction due to high viscosity, so it is preferable to use a methacrylic acid ester polymer that satisfies the range of the above hydroxyl value.

또한, 상기 아크릴기 함유 모노 이소시아네이트 단량체는 수산기를 포함하는 메타크릴산 에스테르 중합시 사용되어지는 하이드록시 모노머 100당량에 대해 50~90 당량을 사용한다. 바람직하게는 하이드록시 모노머의 80당량을 반응시킬 수 있다. 상기 아크릴기를 함유하는 모노 이소시아네이트 단량체를 적용함으로써 상기 자외선 경화성 조성물은 자외선 조사 전의 점착력이 높으나 자외선 조사 후에는 낮은 비점착 특성을 나타낼 수 있어 마이크로 LED 디스플레이 제조 공정에 사용되는 점착필름에 적용하기 적합한 물성을 나타내게 된다.In addition, the acrylic group-containing monoisocyanate monomer is used in an amount of 50 to 90 equivalents based on 100 equivalents of the hydroxy monomer used when polymerizing methacrylic acid ester containing a hydroxyl group. Preferably, 80 equivalents of hydroxy monomer can be reacted. By applying the monoisocyanate monomer containing the acrylic group, the ultraviolet curable composition has high adhesive strength before ultraviolet irradiation, but can exhibit low non-adhesive properties after ultraviolet irradiation, making it suitable for application to adhesive films used in the micro LED display manufacturing process. It will appear.

즉, 점착제에 의한 잔사를 없앨 수 있도록 수산기를 포함하는 아크릴 점착제를 합성하고 아크릴기를 함유하는 모노 이소시아네이트를 부가 반응시켜 아크릴 점착제 주쇄에 이중결합을 도입한 화학구조를 통해 피착물에 잔사가 없게 할 수 있다. 또한, 자외선 경화 후 점착력 저하가 가능하도록 화학구조를 설계하게 된다. In other words, in order to remove the residue caused by the adhesive, an acrylic adhesive containing a hydroxyl group is synthesized, and a double bond is introduced into the main chain of the acrylic adhesive through an addition reaction with a monoisocyanate containing an acrylic group, thereby creating a chemical structure that leaves no residue on the adherend. there is. In addition, the chemical structure is designed to allow for a decrease in adhesion after UV curing.

구체적으로 상기 아크릴기를 함유하는 모노 이소시아네이트 단량체는 이소포론 디이소시아네이트(isophorone diisocyanate,IPDI) 및 하이드록시에틸 아크릴레이트(hydroxy ethyl acrylate, HEA)를 반응시켜 제조되는 것으로서 NCO 함량이 11~12%인 것이 바람직하다.Specifically, the monoisocyanate monomer containing the acrylic group is prepared by reacting isophorone diisocyanate (IPDI) and hydroxy ethyl acrylate (HEA), and the NCO content is preferably 11 to 12%. do.

상기 이소시아네이트 단량체로는 시판되는 화합물을 사용할 수 있으며, 예를 들어, EVONIC사 VESTANAT EP-DC 1241를 사용할 수도 있다As the isocyanate monomer, a commercially available compound can be used, for example, VESTANAT EP-DC 1241 from EVONIC.

또한, 상기 아크릴기를 함유하는 모노 이소시아네이트 단량체와 함께 다른 종류의 아크릴기를 함유하는 모노 이소시아네이트를 사용하거나 병용할 수도 있다.In addition, other types of monoisocyanates containing acrylic groups may be used or used in combination with the above-mentioned monoisocyanate monomers containing acrylic groups.

다른 종류의 아크릴기를 함유하는 모노 이소시아네이트 단량체로는 2-이소시아네이토에틸 아크릴레이트(2-isocyanatoethyl acrylate), 2-이소시아네이토에틸 메타크릴레이트(2-isocyanatoethyl methacrylate), 1,1-(비스아크릴옥시메틸)에틸 이소시아네이트(1,1-(bisacryloyloxymethyl) ethyl isocyanate), 2-(2-이소시아네이토에톡시)에틸 메타크릴레이트(2-(2-Isocyanatoethoxy)ethyl methacrylate) 중 어느 하나 또는 그 이상을 사용할 수도 있다.Other types of monoisocyanate monomers containing acrylic groups include 2-isocyanatoethyl acrylate, 2-isocyanatoethyl methacrylate, and 1,1-( Any one of 1,1-(bisacryloyloxymethyl) ethyl isocyanate), 2-(2-Isocyanatoethoxy)ethyl methacrylate, or You could use more than that.

또한, 상기 자외선 경화성 조성물을 구성하는 수지로는 수산기를 함유하는 메타크릴산 에스테르 중합체를 사용할 수 있다. 상기 수산기를 함유하는 메타크릴산 에스테르 중합체는 아크릴 단량체를 중합하여 제조할 수 있는데, 이들 중합체는 공중합 모노머 성분의 하나로서 수산기 함유 아크릴계 모노머를 함유한다. 일 실시예에서는 2-에틸헥실아크릴레이트 50 내지 70 중량부, 부틸아크릴레이트 10 내지 20 중량부, 하이드록시에틸 아크릴레이트 10 내지 20 중량부, 아크릴산 1 내지 5 중량부로 이루어진 아크릴 단량체의 혼합물에 중합개시제와 용제를 부가하여 중합함으로써 수산기 값이 48~97 ㎎KOH/g(고형분 기준)의 상기 수지를 제조할 수 있다. 또한, 상기 용제로는 에틸아세테이트, 사이클로헥산, n-헥산, 아세톤, 디메틸카보네이트, 메탄올, 에탄올, 이소프로필알코올 중 어느 하나 또는 이들의 혼합물을 사용할 수 있다. Additionally, a methacrylic acid ester polymer containing a hydroxyl group can be used as the resin constituting the ultraviolet curable composition. The hydroxyl group-containing methacrylic acid ester polymer can be produced by polymerizing acrylic monomers, and these polymers contain a hydroxyl group-containing acrylic monomer as one of the copolymerization monomer components. In one embodiment, a polymerization initiator is added to a mixture of acrylic monomers consisting of 50 to 70 parts by weight of 2-ethylhexyl acrylate, 10 to 20 parts by weight of butyl acrylate, 10 to 20 parts by weight of hydroxyethyl acrylate, and 1 to 5 parts by weight of acrylic acid. The above resin with a hydroxyl value of 48 to 97 mgKOH/g (based on solid content) can be prepared by adding and polymerizing a solvent. Additionally, the solvent may be any one of ethyl acetate, cyclohexane, n-hexane, acetone, dimethyl carbonate, methanol, ethanol, and isopropyl alcohol, or a mixture thereof.

상기 자외선 경화성 조성물에 광 개시제와 에폭시 경화제를 혼합함으로써 점착필름용 점착제를 제조할 수 있다.An adhesive for an adhesive film can be manufactured by mixing a photoinitiator and an epoxy curing agent in the ultraviolet curable composition.

상기 점착필름은 기재 및 상기 기재의 일면에 형성되는 점착제 층, 상기 점착제 층 상에 적층되는 박리필름을 포함하여 구성되는 것으로서, 상기 점착제 층은 박리필름의 성능을 감안하여 건조 후 두께가 10 내지 100㎛가 되도록 형성하는 것이 바람직하다. 더욱 바람직하게는 20 내지 50㎛가 되도록 하는 것이 바람직하다.The adhesive film is composed of a substrate, an adhesive layer formed on one side of the substrate, and a release film laminated on the adhesive layer. The adhesive layer has a thickness of 10 to 100 after drying, considering the performance of the release film. It is desirable to form it to ㎛. More preferably, it is desirable to set it to 20 to 50㎛.

상기 기재로는 폴리에틸렌, 폴리프로필렌, 폴리에틸렌테레프탈레이트, 폴리부텐, 폴리부타디엔, 폴리메틸펜텐, 폴리염화비닐, 염화비닐 공중합체, 폴리우레탄, 폴리스티렌, 폴리카보네이트, 불소수지, 트리아세틸 셀룰로오스에서 선택되는 수지 필름을 사용할 수 있으며, 폴리에틸렌테레프탈레이트(PET) 필름이 바람직하다.The base material includes a resin selected from polyethylene, polypropylene, polyethylene terephthalate, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyurethane, polystyrene, polycarbonate, fluororesin, and triacetyl cellulose. Film can be used, and polyethylene terephthalate (PET) film is preferred.

또한, 이형성을 가지는 박리필름 역시 기재와 동일한 종류의 재질을 적용할 수 있다. 상기 기재는 일반적으로 1 내지 188㎛의 두께의 범위에서 적절히 선택할 수 있으며, 상기 기재의 두께는 사용되는 기재의 재질이나 용도에 따라 바뀔 수 있다.Additionally, the release film having release properties can also be made of the same type of material as the substrate. The substrate can generally be appropriately selected from a thickness range of 1 to 188 ㎛, and the thickness of the substrate may vary depending on the material or purpose of the substrate used.

또한, 상기 점착제 층을 형성할 때 점착제를 상기 기재에 도포하는 데, 이때 도포 작업에 적합한 정도로 점도를 조절할 후 이를 상기 기재 상에 도포하고 경화시킴으로써 점착제 층을 형성할 수 있다. 상기 점착제 층은 바 코트법, 리버스 롤 코트법, 나이프 코트법, 롤 나이프 코트법, 그라비아 코트법, 닥터 블레이드 코트법, 슬롯다이 코트법, 콤마 코트법, 마이크로 그라비아 코트법 등 종래의 점착시트를 제조하는데 쓰이는 방법으로 형성할 수 있으며, 점착제를 도포한 후 건조 및 경화함으로써 점착제 층을 형성할 수 있다.In addition, when forming the adhesive layer, the adhesive is applied to the substrate. At this time, the viscosity is adjusted to a level suitable for the application operation, and then the adhesive layer can be formed by applying it on the substrate and curing. The adhesive layer can be prepared using conventional adhesive sheets such as the bar coat method, reverse roll coat method, knife coat method, roll knife coat method, gravure coat method, doctor blade coat method, slot die coat method, comma coat method, and micro gravure coat method. It can be formed by the method used in manufacturing, and the adhesive layer can be formed by applying the adhesive and then drying and curing it.

이하 실시예를 통하여 본 발명에 따른 효과를 설명한다.The effects according to the present invention will be explained through examples below.

[아크릴기가 있는 모노 이소시아네이트][Mono isocyanate with acrylic group]

a1) 화학식 1로 표시되는 단량체의 합성a1) Synthesis of monomer represented by formula 1

IPDI(isophorone diisocyanate) 222g(1mol)에 2.2g의 BHT, 0.02g의 DBTDL을 넣고 교반하면서 70℃까지 승온하고 HEA(hydroxy ethyl acrylate) 116g(1mol)을 적하한 후 2~4시간 동안 완전히 반응한다. 이 제품의 NCO함량은 11.8%이다.Add 2.2 g of BHT and 0.02 g of DBTDL to 222 g (1 mol) of IPDI (isophorone diisocyanate), raise the temperature to 70°C while stirring, add 116 g (1 mol) of HEA (hydroxy ethyl acrylate) dropwise, and react completely for 2 to 4 hours. . The NCO content of this product is 11.8%.

a2) 시판되는 단량체: EVONIC사 VESTANAT EP-DC 1241(NCO 함량 11.6%, IPDI 함량 0.05 wt. %)a2) Commercially available monomer: VESTANAT EP-DC 1241 from EVONIC (NCO content 11.6%, IPDI content 0.05 wt. %)

[수지 합성][Resin synthesis]

교반기, 환류 냉각기, 질소 도입관, 온도계 및 적하조를 구비한 반응장치를 준비하고, 2-에틸헥실아크릴레이트(2-Ethyl hexyl acrylate ; 2-EHA) 단량체 66g, 부틸아크릴레이트(n-Butyl acrylate ; n-BA) 단량체 15g, 하이드록시에틸 아크릴레이트(2-Hydroxy ethyl acrylate ; 2-HEA) 단량체 15g, 아크릴산(Acrylic acid ; AA) 4g으로 이루어진 아크릴 혼합물 100g을 제조하고, 제조된 상기 아크릴 혼합물 중 30g과 중합 개시제(AIBN,Azobis isobutyronitrile) 0.05g 및 용제(아세트산 에틸) 적량을 반응장치에 투입하여 80℃로 가열하여 반응 개시를 확인하고, 중합 개시제(AIBN, Azobis isobutyronitrile) 0.5g 및 용제(아세트산 에틸) 적량과 상기 아크릴 혼합물의 나머지 70g을 각각 1시간 동안 적하하고 환류상태를 유지한 채 5시간 동안 반응시키고, 반응 종료 후 냉각하여 아세트산 에틸을 혼합하여 불휘발분 30%, 수산기 값 72.5 ㎎KOH/g(고형분 기준)의 메타크릴산 에스테르 중합체를 합성하였다.Prepare a reaction device equipped with a stirrer, reflux cooler, nitrogen introduction tube, thermometer, and dropping tank, and add 66 g of 2-Ethyl hexyl acrylate (2-EHA) monomer and n-Butyl acrylate. 100 g of an acrylic mixture consisting of 15 g of n-BA) monomer, 15 g of 2-Hydroxy ethyl acrylate (2-HEA) monomer, and 4 g of acrylic acid (AA) was prepared, and among the prepared acrylic mixture 30g, 0.05g of polymerization initiator (AIBN, Azobis isobutyronitrile) and an appropriate amount of solvent (ethyl acetate) were added to the reactor and heated to 80°C to confirm the start of the reaction. 0.5g of polymerization initiator (AIBN, Azobis isobutyronitrile) and solvent (acetic acid) were added to the reactor. Appropriate amounts of ethyl) and the remaining 70 g of the acrylic mixture were added dropwise for 1 hour each and reacted for 5 hours while maintaining reflux. After the reaction was completed, cooled and mixed with ethyl acetate to obtain a non-volatile content of 30% and a hydroxyl value of 72.5 mgKOH/ g (based on solid content) of methacrylic acid ester polymer was synthesized.

<실시예 1~3><Examples 1 to 3>

1. 점착제 조성물의 제조 1. Preparation of adhesive composition

얻어진 메타크릴산 에스테르 중합체의 아세트산에틸 용액(불휘발분 농도 30중량%) 100중량부에 대해, 2-하이드록시에틸 아크릴레이트 단위 100당량에 대해 표 1과 같이 아크릴기가 있는 모노 이소시아네이트 80 당량을 가하고, 촉매로서 디부틸주석디라우레이트 0.01중량부를 첨가하고, 50℃에서 5시간 부가 반응시켜 반응성 메타크릴산 에스테르 중합체의 용액을 얻었다.For 100 parts by weight of the ethyl acetate solution (non-volatile matter concentration: 30% by weight) of the obtained methacrylic acid ester polymer, 80 equivalents of monoisocyanate with an acrylic group as shown in Table 1 were added to 100 equivalents of 2-hydroxyethyl acrylate units, 0.01 parts by weight of dibutyltin dilaurate was added as a catalyst, and addition reaction was carried out at 50°C for 5 hours to obtain a solution of reactive methacrylic acid ester polymer.

<비교예 1><Comparative Example 1>

실시예 1과 같이 동일한 방법으로 비교예 1의 중합체 조성물을 얻었다.The polymer composition of Comparative Example 1 was obtained in the same manner as Example 1.

단, 비교예 2의 경우 얻어진 수지에 단순히 디펜타에리스리톨 헥사아크릴레이트(dipentaerythritol hexaacrylate, DPEHA)를 첨가 혼합하여 중합체 조성물을 얻었다. However, in Comparative Example 2, dipentaerythritol hexaacrylate (DPEHA) was simply added and mixed to the obtained resin to obtain a polymer composition.

실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 비교예 1Comparative Example 1 비교예 2Comparative Example 2 수지profit 100100 100100 100100 100100 100100 MOIMOI -- -- 3.43.4 4.84.8 -- a1a1 10.510.5 -- -- -- -- a2a2 -- 10.510.5 3.143.14 -- -- DPEHADPEHA -- -- -- -- 55

표 1에서 MOI는 2-isocyanatoethyl methacrylate이며. a1은 상기 합성된 모노머(NCO 함량 11.8%)이고, a2는 EVONIC사 VESTANAT EP-DC 1241(NCO 함량 11.6%, IPDI 함량 0.05 wt. %)이다.In Table 1, the MOI is 2-isocyanatoethyl methacrylate. a1 is the synthesized monomer (NCO content 11.8%), and a2 is VESTANAT EP-DC 1241 from EVONIC (NCO content 11.6%, IPDI content 0.05 wt. %).

2. 점착제 조성물의 도포 공정2. Application process of adhesive composition

표 1에서 얻어진 중합체에 광개시제 TPO를 1g 과, 2% Epoxy 경화제( N,N,N',-tetraglycidiyl-m-xylenediamine ; 상품명 Tetrad-X) 0.4g을 추가하여 점착제를 제조하였다.An adhesive was prepared by adding 1 g of photoinitiator TPO and 0.4 g of 2% epoxy curing agent (N,N,N',-tetraglycidiyl-m-xylenediamine; brand name Tetrad-X) to the polymer obtained in Table 1.

이어서, 광학 필름 기재로서의 두께 100㎛의 대전처리된 폴리에틸렌테레프탈레이트 필름 위에, 건조 후의 두께가 20㎛가 되도록 나이프식 도공기로 점착제 층을 도포하였다.Next, a pressure-sensitive adhesive layer was applied with a knife-type coater to a 100-μm-thick charged polyethylene terephthalate film as an optical film substrate so that the thickness after drying was 20 μm.

이어서 110℃에서 1분간 건조 처리를 실시하여, 점착제 층을 형성한 후, 얻어진 점착제 층에 박리필름으로서의 대전처리된 두께 50㎛의 폴리에틸렌테레프탈레이트 이형필름을 밀착시킴으로써 적층하여, 기재/점착제 층/박리필름으로 이루어지는 적층체를 얻었다. 이후 43℃의 온도에서 48시간 동안 숙성하여 마이크로 LED 제조공정용 점착필름을 제조하였다.Subsequently, drying treatment was performed at 110°C for 1 minute to form an adhesive layer, and then a charged polyethylene terephthalate release film with a thickness of 50 μm as a release film was laminated by closely adhering to the obtained adhesive layer, resulting in substrate/adhesive layer/release. A laminate consisting of a film was obtained. Afterwards, it was aged at 43°C for 48 hours to prepare an adhesive film for the micro LED manufacturing process.

3. 물성 측정3. Measurement of physical properties

<점착력><Adhesion>

점착력은 KS T 1028에 따라 UTM 장비를 사용하여 측정하였다. 폭 25㎜ 테이프를 SUS304 피착제에 고무롤러(2.0㎏ 하중)를 이용하여 압착한 후 상온에서 30분간 방치하였고, 300㎜/min의 속도로 180° Peel 값을 측정하였다.Adhesion was measured using UTM equipment according to KS T 1028. A 25 mm wide tape was pressed to a SUS304 adherend using a rubber roller (2.0 kg load) and left at room temperature for 30 minutes, and the 180° Peel value was measured at a speed of 300 mm/min.

<자외선 조사 후 점착력 측정><Measurement of adhesion after UV irradiation>

자외선은 광량 600mJ/㎠ 로 조사한 후 점착력을 측정하였다.After irradiating with ultraviolet rays at a light quantity of 600 mJ/cm2, the adhesive strength was measured.

<잔사><residue>

잔사 발생 유무는 박리후 피착제(SUS)를 현미경으로 관찰하여 피착제에 점착성분이 있는가를 판단하였다.The presence or absence of residues was determined by observing the adherend (SUS) under a microscope after peeling to determine whether there was an adhesive component in the adherend.

○ : 박리 후 피착제에 점착성분이 없는 것○: There is no adhesive component on the adherend after peeling.

× : 박리 후 피착제에 점착성분이 조금이라도 있는 것×: After peeling, there is at least some adhesive component in the adherend.

측정결과는 표 2와 같다.The measurement results are shown in Table 2.

실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 비교예 1Comparative Example 1 비교예 2Comparative Example 2 점착력(gf/25㎜)Adhesion (gf/25㎜) 31003100 31503150 30503050 28502850 20502050 UV조사 후 점착력
(gf/25㎜)
Adhesion after UV irradiation
(gf/25㎜)
22 22 33 1515 1313
잔사발생 유.무Whether or not residues are generated ××

표 2의 측정결과로부터 본 발명에 따른 자외선 경화성 조성물을 적용한 점착필름은 자외선 조사 전후의 점착력 차이가 크고 잔사가 발생하지 않아 마이크로 LED 디스플레이 제조공정에 적용하기 적합한 특성을 가지는 것을 확인할 수 있었다.From the measurement results in Table 2, it was confirmed that the adhesive film to which the ultraviolet curable composition according to the present invention was applied had a large difference in adhesive strength before and after ultraviolet irradiation and no residue was generated, making it suitable for application to the micro LED display manufacturing process.

본 발명은 상술한 바와 같이 바람직한 실시예를 들어 설명하였으나, 상기 실시예에 한정되지 아니하며 본 발명의 정신을 벗어나지 않는 범위 내에서 당해 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 다양한 변형과 변경이 가능하다. 그러한 변형예 및 변경예는 본 발명과 첨부된 특허청구범위의 범위 내에 속하는 것으로 보아야 한다.Although the present invention has been described with reference to preferred embodiments as described above, it is not limited to the above embodiments and various modifications and modifications may be made by those skilled in the art without departing from the spirit of the present invention. Change is possible. Such modifications and variations should be considered to fall within the scope of the present invention and the appended claims.

Claims (3)

수산기를 함유하는 메타크릴산 에스테르 중합체에 아크릴기를 함유하는 모노 이소시아네이트 단량체를 반응시켜 수득되는 수지를 포함하며,
상기 수산기를 함유하는 메타크릴산 에스테르 중합체는 수산기 값이 고형분 기준 10 ~ 100 ㎎KOH/g이며,
상기 아크릴기를 함유하는 모노 이소시아네이트 단량체는 이소포론 디이소시아네이트(isophorone diisocyanate,IPDI) 및 하이드록시에틸 아크릴레이트(hydroxy ethyl acrylate, HEA)를 반응시켜 제조되는 것으로서 NCO 함량이 11~12%인 것을 특징으로 하는 마이크로 LED 디스플레이용 자외선 경화성 조성물.
It includes a resin obtained by reacting a methacrylic acid ester polymer containing a hydroxyl group with a monoisocyanate monomer containing an acrylic group,
The methacrylic acid ester polymer containing the hydroxyl group has a hydroxyl value of 10 to 100 mgKOH/g based on solid content,
The monoisocyanate monomer containing the acrylic group is produced by reacting isophorone diisocyanate (IPDI) and hydroxy ethyl acrylate (HEA), and is characterized in that the NCO content is 11 to 12%. Ultraviolet curable composition for micro LED display.
삭제delete 기재 및 상기 기재의 일면에 형성되는 점착제 층, 상기 점착제 층 상에 적층되는 박리필름을 포함하는 점착필름에 있어서,
상기 점착제 층은 청구항 1에 따른 자외선 경화성 조성물, 광 개시제, 및 에폭시 경화제를 포함하는 점착제로 이루어지는 것을 특징으로 하는 마이크로 LED 디스플레이용 점착필름.
An adhesive film comprising a substrate, an adhesive layer formed on one side of the substrate, and a release film laminated on the adhesive layer,
The adhesive layer is an adhesive film for a micro LED display, characterized in that it is made of an adhesive containing the ultraviolet curable composition according to claim 1, a photoinitiator, and an epoxy curing agent.
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Citations (1)

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KR101138796B1 (en) 2008-12-23 2012-04-24 제일모직주식회사 Acrylate-adhesive resin composition comprising and photocurable adhesive composition comprising the same
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KR20110007687A (en) * 2009-07-17 2011-01-25 공주대학교 산학협력단 Acrylic adhesive compositions of non-solvent uv hardening type and fabrication method thereof
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010166089A (en) * 2010-04-14 2010-07-29 Nitto Denko Corp Dicing/die bonding film

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