KR102564348B1 - Organic light emitting display panel and method of manufacturing the same - Google Patents

Abstract

The present invention relates to an organic light emitting display device and a method for manufacturing the same, and more particularly, to an organic light emitting display panel in which a display area flattening film formed in a display area has a thickness greater than a non-display area planarization film formed in a non-display area, and manufacturing the same. It is a technical task to provide a method.

Description

Organic light emitting display panel and its manufacturing method {ORGANIC LIGHT EMITTING DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to an organic light emitting display panel and a manufacturing method thereof.

Flat panel displays include Liquid Crystal Display Device (LCD), Plasma Display Panel Device (PDP), and Organic Light Emitting Display Device (OLED). An electrophoretic display device (EPD) is also widely used.

Among them, organic light emitting display devices are self-emitting devices and have low power consumption, high-speed response speed, high luminous efficiency, high luminance, and wide viewing angle, and thus are attracting attention as next-generation flat panel display devices.

1 is an exemplary view showing a cross-section of the outer edge of a conventional organic light emitting display panel.

As shown in FIG. 1 , the organic light emitting display panel includes a display area A where an image is output and a non-display area B where an image is not output. The non-display area (B) is formed outside the display area (A).

The organic light emitting display panel includes a substrate 11, a gate insulating film 19 formed on the substrate, a driving element 12 formed on the gate insulating film 19, and a protective film 13 covering the driving element 12. ), the planarization film 14 applied to the protective film 13, the anode electrode 15 deposited on the planarization film 14, the organic light emitting layer 16 deposited on the anode electrode, the organic light emitting layer 16 It includes a cathode electrode 17 deposited on and a bank 18 dividing organic light emitting diodes 10 composed of the anode electrode 15, the organic light emitting layer 16, and the cathode electrode 17.

In a conventional organic light emitting display panel, the planarization layer 14 is formed to the same thickness on the entire surface of the substrate 11 as shown in FIG. 1 .

SUMMARY OF THE INVENTION The present invention has been proposed to solve the above problems, and provides an organic light emitting display panel in which the thickness of a display area flattening film formed in a display area is greater than the thickness of a non-display area planarization film formed in a non-display area, and a method for manufacturing the same. to do as a technical task.

An organic light emitting display panel according to the present invention includes a display area in which subpixels made of organic light emitting diodes are arranged; and a non-display area disposed outside the display area and in which metal lines connected to the sub-pixels are disposed, wherein a thickness of a display area planarization film formed in the display area is greater than the thickness of the region planarization film.

In addition, a method of manufacturing an organic light emitting display panel according to the present invention includes forming driving elements on a substrate; covering the driving element with a protective film; applying a planarization material to the passivation layer; A halftone mask capable of differentiating the amount of light transmitted through the planarization material disposed in the non-display area of the substrate and the amount of light transmitted through the planarization material disposed in the display area of the substrate among the planarization materials is provided as the planarization material. placing it on top; exposing the planarization material using the halftone mask; forming a planarization layer on the passivation layer by cleaning the exposed planarization material; and forming an organic light emitting diode on the planarization film, wherein a thickness of a display area planarization film formed in the display area is greater than a thickness of a non-display area planarization film formed in the non-display area.

According to the present invention, flatness in the display area can be increased, and thus, an imbalance in viewing angles can be prevented.

Also, according to the present invention, the thickness of the planarization film in the display area can be increased. In this case, in an organic light emitting display panel in which two subpixels are disposed such that the two anode electrodes formed on the two subpixels overlap one data line formed at the lower end of the planarization layer, the data line and the two anode electrodes Parasitic capacitance between them can be reduced. Accordingly, coupling between the two subpixels caused by the parasitic capacitance may be prevented.

In addition, according to the present invention, since the thickness of the planarization film in the non-display area can be reduced, oxidation of the cathode electrode due to moisture remaining in the planarization film can be prevented. Accordingly, a defect in which the display area gradually decreases can be prevented.

1 is an exemplary view showing a cross-section of the outer edge of a conventional organic light emitting display panel;
2 is an exemplary view showing the configuration of an organic light emitting display panel according to the present invention.
3 is an exemplary view showing the configuration of a unit pixel of an organic light emitting display panel according to the present invention;
FIG. 4 is a cross-sectional view of an embodiment of an organic light emitting display panel cut along line XX′ shown in FIG. 2;
FIG. 5 is a cross-sectional view of an embodiment of an organic light emitting display panel cut along line Y-Y' shown in FIG. 2;
FIG. 6 is a cross-sectional view of one embodiment of an organic light emitting display panel cut along line Z-Z′ shown in FIG. 2;
7 is an exemplary diagram explaining the function of a halftone mask applied to the organic light emitting display panel manufacturing method according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

In the conventional organic light emitting display panel described in the background of the present invention, the planarization film 14 formed in the display area A is formed on a metal line (not shown) formed under the planarization film 14. It performs the function of offsetting the step difference by The planarization layer 14 also extends to the non-display area (B).

When the thickness of the planarization film 14 is small, the flatness of the anode electrode 15 formed on the top of the planarization film 14 is broken due to the step by the metal line, resulting in an imbalance in the viewing angle. It was confirmed that it can Therefore, in order to maintain the flatness of the anode electrode 15, the planarization film 14 is preferably formed thick.

However, when the thickness of the planarization layer 14 is increased, a defect in that the display area A is reduced may occur.

For example, as shown in FIG. 1 , the planarization film 14 formed in the non-display area B includes a metal line 31 connected to the cathode electrode 17 or various other metal lines ( 32) covered by However, the entirety of the planarization layer 14 is not completely covered by metal lines.

In this case, the moisture 20 contained in the planarization layer 14 and the moisture 20 introduced into the planarization layer 14 through gaps between the metal lines in the cleaning process are In a high-temperature, high-humidity environment during use, it may be transferred to the organic light emitting layer 16 and the cathode electrode 17 through the bank 18 .

The cathode electrode 17 may be oxidized by the moisture, and as a result, the cathode electrode 17 formed in the non-display area B and the display area A does not perform a normal function, resulting in display It was confirmed that a defect in which the area A gradually decreases may occur. For example, after the cathode electrode 17 in the non-display area (B) is gradually oxidized, the cathode electrode 17 in the display area (B) adjacent to the non-display area (B) is also gradually oxidized. oxidized Accordingly, the image quality gradually deteriorates from the outer portion of the display area A adjacent to the non-display area B toward the center of the display area A. Accordingly, the size of the display area A where the image is output is gradually reduced.

In order to reduce the amount of moisture 20 remaining in the planarization layer 14, it is effective to make the thickness of the planarization layer 14 formed in the non-display area B as small as possible.

Therefore, it has been confirmed that if the flattening film 14 is formed to the same thickness in the display area and the non-display area as in the prior art, the viewing angle imbalance and the decrease in the display area A cannot be effectively prevented at the same time.

To elaborate, in the conventional organic light emitting display panel, the planarization film 14 is applied to the entire surface of the substrate 11 to the same thickness.

In this case, in order to prevent an imbalance in the viewing angle from occurring in the display area A, when the thickness of the flattening film 14 increases, the display area A where an image is output gradually decreases. It can be.

Conversely, when the thickness of the flattening film 14 is reduced to prevent the reduction of the display area due to the oxidation of the cathode electrode 17, the imbalance of the visual angle in the display area A is severely generated. It can be.

The planarization layer serves to protect driving elements applied to the gate-in-panel method formed in the non-display area. Also, an auxiliary electrode connected to the cathode electrode and an auxiliary electrode connected to the anode electrode are formed in the non-display area, and the planarization layer is formed in the non-display area to protect the electrodes.

2 is an exemplary view showing the configuration of an organic light emitting display panel according to the present invention, and FIG. 3 is an exemplary view showing the configuration of a unit pixel of the organic light emitting display panel according to the present invention.

As shown in FIG. 2 , the organic light emitting display panel according to the present invention includes a display area A in which subpixels composed of organic light emitting diodes are disposed and disposed outside the display area A, and the subpixels are disposed outside the display area A. It includes a non-display area B in which metal lines connected to the pixels are disposed. In particular, the thickness of the display area planarization film formed in the display area (A) is greater than the thickness of the non-display area planarization film formed in the non-display area (B).

In addition, although not shown in FIG. 2, the organic light emitting display panel 100 according to the present invention includes a gate driver supplying scan pulses to a plurality of gate lines formed on the panel 100, the organic light emitting display A data driver for supplying data voltages to a plurality of data lines formed on the panel 100 and a timing controller for controlling the gate driver and the data driver.

The gate driver may be directly formed in the non-display area (B) in a gate-in-panel method, or may be formed of an integrated circuit (IC) and mounted in the non-display area (B). . Also, the gate driver may be implemented in one integrated circuit (IC) together with the data driver and the timing controller.

The data driver may be configured as an integrated circuit (IC) and mounted in the non-display area (B), or may be implemented in one integrated circuit (IC) together with the gate driver and the timing controller.

The gate driver, the data driver, and the timing controller may be implemented in one integrated circuit (IC) as described above. In this case, the integrated circuit (IC) in which the three components are embedded is referred to as a driver. 2 shows an organic light emitting display panel 100 in which the driver 200 is mounted in the non-display area B.

As described above, the organic light emitting display panel 100 includes a display area A where the subpixels 121a, 121b, and 121c composed of organic light emitting diodes are disposed and disposed outside the display area A. and a non-display area B in which metal lines connected to the sub-pixels 121a, 121b, and 121c are disposed.

Each of the subpixels 121a, 121b, and 121c may be a red subpixel 121a outputting red light, a green subpixel 121b outputting green light, or a blue subpixel 121c outputting blue light. .

For example, as shown in FIG. 3 , the red sub-pixel 121a, the green sub-pixel 121b, and the blue sub-pixel 121c are gathered to form one unit pixel 120, and the unit White light may be output through the pixel 120 .

Each of the subpixels 121a, 121b, and 121c may include an organic light emitting diode (OLED), a transistor connected to a data line DL and a gate line to control the organic light emitting diode (OLED), and a storage capacitor. can

The organic light emitting diode includes a first electrode, an organic light emitting layer formed on the first electrode, and a second electrode formed on the organic light emitting layer. Here, the first electrode and the second electrode may be an anode electrode and a cathode electrode.

The anode electrode is connected to a first power source, and the cathode electrode is connected to a second power source. The organic light emitting diode (OLED) outputs light having a luminance corresponding to a current supplied to the organic light emitting diode.

The driving elements formed in each of the subpixels are configured such that, when a scan pulse is supplied to the gate line, a current corresponding to the data voltage supplied to the data line DL can be supplied to the organic light emitting diode. , Controls the amount of current supplied to the organic light emitting diode.

To this end, in each of the subpixels, a driving transistor connected between the first power supply and the organic light emitting diode, a switching transistor connected between the driving transistor, the data line DL, and the gate line, and the driving transistor and a storage capacitor connected between a gate electrode of and the organic light emitting diode. The driving transistor, the switching transistor, and the storage capacitor are collectively referred to as driving elements.

The sub-pixels may be arranged in various forms in the organic light emitting display panel according to the present invention.

For example, as shown in FIG. 3 , among the red sub-pixels 121a, green sub-pixels 121b, and blue sub-pixels 121c constituting the unit pixel 120, two sub-pixels The formed two anode electrodes 115a and 115b may be disposed to overlap one data line DL1 formed at the bottom of the display area planarization layer. In this case, the two sub-pixels may be the red sub-pixel 121a and the green sub-pixel 121b.

In the above example, the anode electrode 115c formed in the other sub-pixel, that is, the blue sub-pixel 121c, may be disposed to overlap another data line DL2 formed below the display area planarization layer.

In this case, the three anode electrodes 115a, 115b, and 115c are disposed on top of the display area planarization layer, and the two data lines DL1 and DL2 are disposed below the display area planarization layer.

In the example, the data line DL1 overlapping the two anode electrodes 115a and 115b may become a green data line supplying a data voltage to the green sub-pixel 121b. In this case, the red data line DL3 supplying the data voltage to the red sub-pixel 121a may be disposed not to overlap with the two anode electrodes 115a and 115b.

However, the data line DL1 overlapping the two anode electrodes 115a and 115b may be a red data line supplying a data voltage to the red sub-pixel 121a. In this case, the green sub-pixel 121a may be provided with a data voltage. The green data line DL3 supplying the data voltage to the pixel 121b may be disposed not to overlap the two anode electrodes 115a and 115b.

In the organic light emitting display panel 100 according to the present invention, the display area planarization film and the non-display area planarization film are integrally formed. In this case, as described above, the thickness of the display area planarization film is greater than that of the non-display area planarization film. In addition, anode electrodes 115a, 115b, and 115c constituting the organic light emitting diodes are disposed on the display area planarization layer, and a cathode electrode commonly connected to the organic light emitting diodes is disposed on the non-display area planarization layer. A metal line connected to is disposed.

A detailed configuration of the organic light emitting display panel according to the present invention described above will be described below with reference to FIGS. 4 to 6 .

FIG. 4 is a cross-sectional view of an embodiment of an organic light emitting display panel cut along line X-X' shown in FIG. 2, and FIG. 5 is a cross-sectional view of an organic light emitting display panel cut along line Y-Y' shown in FIG. 2. FIG. 6 is a cross-sectional view of an embodiment of an organic light emitting display panel cut along line Z-Z′ shown in FIG. 2 .

As shown in FIGS. 3 to 6 , the organic light emitting display panel according to the present invention includes a display area A in which subpixels 115a, 115b, and 115c composed of organic light emitting diodes 110 are disposed and the It is disposed outside the display area (A) and includes a non-display area (B) in which metal lines 131 connected to the sub-pixels are disposed.

Here, the thickness M of the display area flattening film 114a formed in the display area A is greater than the thickness N of the non-display area planarization film 114b formed in the non-display area B. .

The display area planarization layer 114a and the non-display area planarization layer 114b are integrally formed. For example, the display area planarization layer 114a and the non-display area planarization layer 114b may be simultaneously formed through an exposure process using a halftone mask.

Anode electrodes 115 constituting the organic light emitting diodes 110 are disposed on the display area planarization layer 114a.

For example, a plurality of subpixels are disposed in the display area A, and at least one organic light emitting diode 110 is formed in each of the subpixels.

The organic light emitting diode 110 includes an anode electrode 115 formed on the planarization film 114a, an organic light emitting layer 116 formed on the anode electrode 115, and a cathode electrode formed on the organic light emitting layer 116. (117).

Each sub-pixel is divided by a bank 118.

The anode electrode 115 is electrically connected to driving elements that drive the sub-pixel in which the anode electrode 115 is formed, and is driven by the driving elements. Therefore, the anode electrodes 115 are insulated from each other.

The cathode electrode 117 is commonly connected to the organic light emitting diodes 110 formed in the display area A.

A metal line 131 connected to the cathode electrode 117 commonly connected to the organic light emitting diodes is disposed on the non-display area planarization layer 114b.

In addition to the metal line 131 connected to the cathode electrode 117, the non-display area planarization layer 114b includes various electrodes formed in the display area A, for example, a gate line, a data line, a high voltage Various types of metal lines such as a supply line, a low voltage supply line, and a sensing line may be disposed.

In the organic light emitting display panel 100 according to the present invention, the unit pixel may include various types of subpixels, and the subpixels may be arranged in the unit pixel 120 in various forms.

* For example, when the subpixels 121a, 121b, and 121c are configured as shown in FIG. 3, the red subpixel 121a and the green subpixel 121b constituting the unit pixel 120 Among the blue sub-pixels 121c, the two anode electrodes 115a and 115b formed on the two sub-pixels 121a and 121b are connected to one data line ( DL1), and the anode electrode 115c formed on the other sub-pixel 121c may be disposed to overlap another data line DL2 formed below the display area planarization layer 114a.

More specifically, the three anode electrodes 115a, 115b, and 115c are disposed on top of the display area flattening layer 114a, and the data lines DL1, DL2, and DL3 planarize the display area. It is disposed at the bottom of the membrane 114a. The data lines are connected to the driving elements 112 .

The structure of the organic light emitting display panel 110 will be described as follows.

First, driving elements 112 are formed on the substrate 111 . The driving elements 112 are for driving the organic light emitting diode 110 formed in the sub-pixel.

For example, the driving element 112 formed in the display area A may be a driving transistor, a switching transistor, and a storage capacitor formed in each sub-pixel.

The driving element 112 formed in the non-display area B may be various types of capacitors or transistors constituting the gate driver.

In addition, the driving element 112 may be a line connected to various transistors or various capacitors described above.

The driving elements 112 as described above may be spaced apart from each other with various types of insulating films interposed therebetween, or may be formed spaced apart from each other on the same insulating film.

For example, a gate line forming a gate electrode of the switching transistor may be formed on the substrate 111 , and the gate line may be covered by a gate insulating layer 119 . In this case, other components constituting the data line, the high voltage line, the low voltage line, and the switching transistor may be formed on the gate insulating layer 119 . 4 to 6, for convenience of explanation, the driving elements 112 are schematically shown, but the driving elements 112 include various types of insulating films and metal lines. can be configured.

Next, the driving elements 121 are covered by a protective layer 113 . For example, since the driving elements 121 are formed of a metal film, in order to protect the metal film and insulate the metal film from the organic light emitting diode 110, the driving elements 121 are formed by a protective film 113 is covered by

The protective layer 113 may be formed using various types of inorganic materials, such as SiNx or SiOy.

The planarization layer 114 is applied to the passivation layer 113 . The planarization layer 14 is applied on the passivation layer 113 to offset a step difference caused by the driving elements 112 formed under the planarization layer 114 .

The planarization layer 114 may be formed of, for example, an organic material such as acrylate, epoxy polymer, or imide polymer.

The thickness of the planarization layer 114 is formed differently according to the position of the planarization layer 114 .

For example, the thickness M of the display area flattening film 114a formed in the display area A is greater than the thickness N of the non-display area planarization film 114b formed in the non-display area B. is formed

Next, the organic light emitting diodes 110 are formed on the planarization layer 114 .

Finally, a film or resin is applied to the top of the organic light emitting diodes 110, and an encapsulation substrate may be attached to the top of the film or resin.

The unit pixels 120 and the sub-pixels formed in the display area A have the same structure. Therefore, the structure of the cross section in the display area A is the same as shown in FIGS. 4 to 6 .

However, the cross-sectional structure of the non-display area B may be formed in various ways depending on the location of the non-display area B.

For example, FIG. 4 shows left and right outer edges of the organic light emitting display panel 110 shown in FIG. 2 . Among the non-display areas B, the gate driver of the gate-in-panel (GIP) method may be embedded in the non-display areas formed on the left and right sides of the organic light emitting display panel 110 . In this case, driving elements 112a constituting the gate driver may be formed on the protective layer 113 formed in the non-display area B. In addition, a ground electrode 112b connected to the cathode electrode 117 may be formed on the passivation layer 113 formed in the non-display area B.

Also, FIG. 5 shows an upper outer portion of the organic light emitting display panel 110 shown in FIG. 2 . Among the non-display areas B, ground electrodes 112c connected to various electrode lines may be formed in the non-display area formed above the organic light emitting display panel 110 .

Also, FIG. 6 shows the lower outer periphery of the organic light emitting display panel 110 shown in FIG. 2 . The driver 200 may be mounted in a non-display area formed below the organic light emitting display panel 110 among the non-display areas B. Accordingly, various pads connected to the driver 200 and various metal lines 112d connected to the pads may be formed in the non-display area.

7 is an exemplary diagram explaining the function of a halftone mask applied to the method of manufacturing an organic light emitting display panel according to the present invention. Hereinafter, a method of manufacturing an organic light emitting display panel according to the present invention will be described with reference to FIG. 7 .

First, driving elements 112 are formed on the substrate 111 . The driving elements may include various electrodes and electrode lines. The driving elements 112 may include various insulating films. For example, the driving elements 112 may include a gate insulating layer 119 formed on the substrate 111 .

Next, the driving elements 112 are covered by a protective layer 113 .

Next, a planarization material is applied to the passivation layer 113 . The planarization material may be an organic material such as acrylate, epoxy polymer, or imide polymer.

Next, a halftone mask 300 capable of differentiating the amount of light transmitted through the planarization material disposed in the non-display area of the substrate and the amount of light transmitted through the planarization material disposed in the display area of the substrate among the planarization materials. ) is disposed on top of the planarization material.

Next, as shown in FIG. 7 , the planarization material is exposed using the halftone mask 300 .

As shown in FIG. 7 , the halftone mask 300 may be made of materials having different light transmittances.

For example, the halftone mask 300 may include a first region 310 that partially transmits light and a second region 320 that blocks light or has a lower transmittance than the first region 310 . can

In this case, the display area flattening film 114a having a thickness of M may be formed by the second area 320, and the display area having a thickness of N by the first area 310. A planarization layer 114b may be formed.

In particular, when the second region 320 completely blocks light, the thickness of the display area flattening film 114a and the non-display area flattening film 114b is determined by the transmittance of the first area 310. Ratio can be set.

The thickness ratio (M:N) of the display area planarization film 114a and the non-display area planarization film 114b varies depending on the size and resolution of the organic light emitting display panel 100, the type of the planarization material, and the like. can be set to

For example, when the thickness M of the display area planarization layer 114a is 100, the thickness N of the non-display area planarization layer 114b may be approximately 50 to 60.

Next, the planarization layer 114 is formed on the passivation layer 113 by cleaning the exposed planarization material. For example, a portion of the planarization material applied to the non-display area B is removed due to a difference in exposure amount by the halftone mask 300 . Accordingly, the thickness of the planarization material applied to the non-display area B may be reduced. Therefore, among the planarization films 114, the thickness of the display area planarization film 114a formed in the display area A is the thickness of the non-display area planarization film 114b formed in the non-display area B. formed larger.

Next, the organic light emitting diodes 110 are formed on the planarization layer 114 .

In this case, two anode electrodes formed on two sub-pixels among the red sub-pixel, green sub-pixel and blue sub-pixel constituting the unit pixel 120 are formed at the bottom of the display area flattening layer 114a. It may be disposed to overlap one data line DL1, and an anode electrode formed in the other sub-pixel may be disposed to overlap another data line DL2 formed below the display area planarization layer. Among the two subpixels, the remaining subpixels not connected to the data line DL1 are connected to another data line DL3 that does not overlap with the two anode electrodes.

Finally, an encapsulation portion made of a film or resin is formed on an upper end of the organic light emitting diode, and an encapsulation substrate may be attached to the upper end of the encapsulation portion.

The characteristics of the organic light emitting display panel according to the present invention described above are summarized as follows.

According to the present invention, the thickness M of the display area flattening film 114a formed in the display area A can be formed as thick as possible. However, the thickness N of the non-display area flattening film 114b, which is the main cause of moisture permeation, may be formed equal to or smaller than the thickness of the non-display area planarizing film 114b applied to a conventional organic light emitting display panel. . Accordingly, the volume of a space in which moisture may remain or be introduced may be reduced.

To this end, in a photolithography process for forming the planarization layer 114, a half-tone mask capable of adjusting an exposure amount for each region is used. Accordingly, even if the display area planarization film 114a is formed thick, the non-display area planarization film 114b may be formed thinner than the display area planarization film 114b.

Also, as shown in FIGS. 4 and 5 , the non-display area planarization layer 114b may be divided into at least two parts by the metal lines 131 .

For example, in FIGS. 4 and 5 , the non-display area planarization layer 114b is divided into two parts, and the non-display area planarization layer 114b is divided into three parts by the metal lines 131. It may be separated into the above parts.

Also, the boundary between the non-display area planarization layer 114b and the display area planarization layer 114b may be separated from each other. That is, in the present invention, moisture in the non-display area planarization film 114b is transferred from the non-display area planarization film 114b to the display area planarization film 114a, To prevent the cathode electrode from being oxidized, the non-display area planarization layer 114b and the display area planarization layer 114a may be separated from each other, as shown in FIGS. 4 to 6 .

In this case, the non-display area planarization layer 114a serves to protect driving elements formed in the non-display area B, for example, driving elements used in the gate-in-panel method. However, since the drive elements are not formed between the display area planarization film and the non-display area planarization film, the planarization film does not need to be applied between the display area planarization film and the non-display area planarization film. Therefore, as described above, the display area planarization layer and the non-display area planarization layer may be separated from each other.

Accordingly, the absolute amount of moisture flowing into the display area may be reduced.

The effects of the present invention are described in detail as follows.

First, it is advantageous that the display area flattening film 114a applied to the display area A is formed as thick as possible in order to solve the viewing angle imbalance. In the present invention, the planarization layer 114 having different thicknesses may be formed in the display area and the non-display area by the halftone mask 300 as shown in FIG. 7 . Accordingly, the display area flattening film 114a having a thickness capable of resolving the viewing angle imbalance may be formed in the display area A, and the display area flattening film 114a may be thicker than the display area flattening film 114a in the non-display area B. A non-display area planarization layer 114b having a small value may be formed.

Second, the non-display area flattening film 114b applied to the non-display area (B) in order to minimize the moisture content that causes the cathode electrode 117 to be oxidized and the display area (A) to be reduced. It is advantageous to form silver as thin as possible. In the present invention, the planarization layer 114 having different thicknesses may be formed by the halftone mask 300 as shown in FIG. 7 . Accordingly, by adjusting the transmittance of the first region 310 of the halftone mask 300, the non-display region planarization layer 114b having a minimum thickness may be formed in the non-display region B. there is.

Third, in the organic light emitting display panel in which subpixels are arranged as shown in FIG. 3 , the anode electrode 115a of the red subpixel 121a and the anode electrode 115b of the green subpixel 121b and the green subpixel 121b Coupling may occur between the green sub-pixel 121b and the red sub-pixel 121a due to parasitic capacitance between the data lines DL1 of the sub-pixel 121b. In general, capacitance (C) is proportional to permittivity and area, and inversely proportional to the distance (thickness) between electrodes. Therefore, when the distance between the data line DL1 and the anode electrodes 115a and 115b increases, the parasitic capacitance may decrease.

In the present invention, as described above, the thickness M of the display area planarization layer 114a may be formed to be greater than the thickness of the non-display area planarization layer 114b. Therefore, according to the present invention, coupling between the red sub-pixel 121a and the green sub-pixel 121b can be prevented in an organic light emitting display panel having unit pixels in which sub-pixels are arranged as shown in FIG. 3 . .

More specifically, in an organic light emitting display panel in which two subpixels are arranged side by side and the other subpixel is arranged to face the two subpixels, the data line overlapping the two subpixels. Parasitic capacitance between DL1 and two anode electrodes constituting the two sub-pixels may be reduced. Accordingly, coupling between the two subpixels caused by the parasitic capacitance may be prevented.

As described above, according to the present invention, since the display area flattening film 114a is formed thickly, the viewing angle imbalance can be prevented, and the two subpixels 121a and 121b overlapping one data line DL1 ) can be solved. In addition, since the non-display area planarization film 114b is formed thinly, the volume of the non-display area planarization film 114b may be reduced, and thus, moisture remaining in the non-display area planarization film 114b may be reduced. quantity may be reduced. Accordingly, a defect in which an area where an image is output in the display area B is gradually reduced due to the oxidation of the cathode electrode can be prevented.

Those skilled in the art to which the present invention pertains will understand that the present invention may be embodied in other specific forms without changing its technical spirit or essential features. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not limiting. The scope of the present invention is indicated by the following claims rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be construed as being included in the scope of the present invention. do.

100: organic light emitting display panel A: display area
B: non-display area 114a: display area flattening film
114b: non-display area planarization film 115: anode electrode
116: organic light emitting layer 117: cathode electrode
114: planarization film

Claims (16)

an active area in which a plurality of subpixels each including an organic light emitting diode are disposed;
a gate region disposed outside the active region and in which a plurality of metal lines connected to a plurality of subpixels are disposed;
a display area planarization layer disposed in the active area;
a non-display area planarization layer disposed in the gate area; and
a driving element disposed in the active region and the gate region and controlling the organic light emitting diode;
The driving element includes a driving transistor, a switching transistor and a storage capacitor,
At a boundary between the active region and the gate region, the display region planarization layer and the non-display region planarization layer are separated from each other;
wherein the display area planarization layer has a thickness greater than that of the non-display area planarization layer.
According to claim 1,
In the active region and the gate region,
Further comprising a protective film formed on the driving element,
The protective layer is made of an inorganic material such as silicon nitride or silicon oxide.
According to claim 1,
In the gate area,
The organic light emitting display panel, wherein a cathode electrode of the organic light emitting diode is in contact with the plurality of metal lines.
delete According to claim 1,
When the thickness of the display area flattening film is 100,
The thickness of the non-display area planarization layer is any one of 50 to 60, the organic light emitting display panel.
delete According to claim 1,
The non-display area planarization film,
An organic light emitting display panel divided into at least two parts by the plurality of metal lines.
According to claim 1,
An encapsulation unit is further disposed on the organic light emitting diode,
The encapsulation portion is made of a film or resin, an organic light emitting display panel.
According to claim 8,
An organic light emitting display panel further disposed on the encapsulation portion.
According to claim 1,
The organic light emitting display panel further comprises a bank disposed on the display area planarization layer and the non-display area planarization layer to divide each of a plurality of subpixels.
According to claim 10,
In the gate area,
The organic light emitting display panel of claim 1 , wherein the non-display area planarization layer extends further in an outer direction from a boundary between the active area and the gate area than the bank.
According to claim 1,
The plurality of sub-pixels include a plurality of red, green and blue sub-pixels;
A unit pixel is composed of the red, green, and blue sub-pixels,
An organic light emitting display panel in which white light is output through the unit pixel.
According to claim 12,
Among the red, green, and blue sub-pixels constituting the unit pixel,
The two anode electrodes disposed in the two sub-pixels are disposed to overlap one data line formed at the bottom of the display area planarization layer;
The organic light emitting display panel of claim 1 , wherein an anode electrode disposed in the remaining subpixel is disposed to overlap another data line formed at a lower portion of the display area planarization layer.
According to claim 13,
The organic light emitting display panel of claim 1 , wherein an anode electrode of each of the red, green, and blue sub-pixels is disposed on top of the display area planarization layer.
According to claim 1,
anode electrodes constituting the organic light emitting diodes are disposed on the display area planarization layer;
wherein a metal line connected to a cathode electrode commonly connected to the organic light emitting diodes is disposed on the non-display area planarization layer.
According to claim 1,
The organic light emitting display panel of claim 1 , wherein the non-display area planarization layer covers a gate driver of a gate-in-panel method for supplying scan pulses to the plurality of sub-pixels.