KR102555300B1 - Lighting apparatus - Google Patents

Lighting apparatus Download PDF

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Publication number
KR102555300B1
KR102555300B1 KR1020160047002A KR20160047002A KR102555300B1 KR 102555300 B1 KR102555300 B1 KR 102555300B1 KR 1020160047002 A KR1020160047002 A KR 1020160047002A KR 20160047002 A KR20160047002 A KR 20160047002A KR 102555300 B1 KR102555300 B1 KR 102555300B1
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KR
South Korea
Prior art keywords
light
phosphor layer
conversion unit
housing
opening
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Application number
KR1020160047002A
Other languages
Korean (ko)
Other versions
KR20170119170A (en
Inventor
박진경
김원진
이인재
Original Assignee
엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020160047002A priority Critical patent/KR102555300B1/en
Priority to EP17166686.0A priority patent/EP3239595B1/en
Priority to CN201710249667.9A priority patent/CN107448852B/en
Priority to US15/488,621 priority patent/US10208939B2/en
Publication of KR20170119170A publication Critical patent/KR20170119170A/en
Application granted granted Critical
Publication of KR102555300B1 publication Critical patent/KR102555300B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/16—Laser light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/176—Light sources where the light is generated by photoluminescent material spaced from a primary light generating element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/32—Optical layout thereof
    • F21S41/33—Multi-surface reflectors, e.g. reflectors with facets or reflectors with portions of different curvature
    • F21S41/338—Multi-surface reflectors, e.g. reflectors with facets or reflectors with portions of different curvature the reflector having surface portions added to its general concavity
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
    • F21S41/37—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors characterised by their material, surface treatment or coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/06—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters for filtering out ultraviolet radiation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/40—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters with provision for controlling spectral properties, e.g. colour, or intensity
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/12—Combinations of only three kinds of elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/30—Semiconductor lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0087—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for illuminating phosphorescent or fluorescent materials, e.g. using optical arrangements specifically adapted for guiding or shaping laser beams illuminating these materials

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Semiconductor Lasers (AREA)

Abstract

실시 예는 배광 조절 특성 및 방열 성능이 개선된 조명 장치에 관한 것으로, 광원; 상기 레이저 광의 출광 방향에 배치되며, 상기 레이저 광에 의해 여기되는 변환 광을 생성하는 형광체층을 포함하는 광 변환부; 및 상기 형광체층의 측면에 밀착되도록 상기 광 변환부의 전면에 배치되며, 상기 형광체층의 광 방출면을 노출시키는 개구부와 복수 개의 슬릿을 포함하는 하우징을 포함한다.Embodiments relate to a lighting device having improved light distribution control characteristics and heat dissipation performance, including a light source; a light conversion unit including a phosphor layer disposed in an emission direction of the laser light and generating converted light excited by the laser light; and a housing disposed on the front surface of the light conversion unit so as to come into close contact with a side surface of the phosphor layer, and including an opening exposing a light emitting surface of the phosphor layer and a plurality of slits.

Description

조명 장치{LIGHTING APPARATUS}Lighting device {LIGHTING APPARATUS}

본 발명 실시 예는 조명 장치에 관한 것으로, 구체적으로, 차량용 램프에 사용될 수 있는 조명 장치에 관한 것이다.An embodiment of the present invention relates to a lighting device, and more specifically, to a lighting device that can be used for a lamp for a vehicle.

최근 전기자동차 및 하이브리드 전기자동차 시장이 확대되면서, 필라멘트를 사용하지 않는 저전력 및 고효율 차량용 광원들의 개발이 활발하게 이루어지고 있다. As the market for electric vehicles and hybrid electric vehicles has recently expanded, low-power and high-efficiency vehicle light sources that do not use filaments have been actively developed.

그러나 상기 저전력 및 고효율 광원들은 상대적으로 얇은 스펙트럼 폭으로 발광 되는 저파장 광원을 형광체(phosphor)를 이용하기 때문에, 실제 사용을 위해서는 백색 광으로 변환해야 한다. 그리고, 이러한 변환 과정에서 고온/고집적 저파장 광에 의해 형광체가 열화 및 변질되는 신뢰성적 문제가 발생할 수 있다.However, since the low-power and high-efficiency light sources use a phosphor for a low-wavelength light source that emits light with a relatively narrow spectral width, white light must be converted to white light for actual use. In addition, during this conversion process, a reliability problem may occur in that the phosphor is deteriorated and deteriorated by high temperature/high concentration low wavelength light.

상기와 같은 문제점을 해결하기 위하여, 광원과 형광체를 서로 이격 배치할 수 있는 형광체에 대한 연구 필요성이 대두되고 있다. 형광체는 신뢰성 향상에 유리한 장점이 있으나, 변환 광이 사방으로 발산되는 특성으로 인하여, 광 효율이 떨어지는 문제점이 있어 개선이 요구된다. 더욱이, 방열을 위해 광원과 형광체를 이격 배치할수록 조명 장치를 소형화하는데 한계가 있다.In order to solve the above problems, there is a need for research on a phosphor capable of disposing a light source and a phosphor spaced apart from each other. Phosphor has an advantage in improving reliability, but has a problem in that light efficiency is lowered due to the characteristic that converted light is emitted in all directions, and improvement is required. Moreover, as the light source and the phosphor are spaced apart for heat dissipation, miniaturization of the lighting device is limited.

본 발명이 이루고자 하는 기술적 과제는 배광 조절 특성 및 방열 성능이 개선된 조명 장치를 제공하는데 있다.A technical problem to be achieved by the present invention is to provide a lighting device having improved light distribution control characteristics and heat dissipation performance.

본 발명의 실시 예의 조명 장치는 레이저 광을 발생시키는 광원; 상기 레이저 광의 출광 방향에 배치되며, 상기 레이저 광에 의해 여기되는 변환 광을 생성하는 형광체층을 포함하는 광 변환부; 및 상기 형광체층의 측면에 밀착되도록 상기 광 변환부의 전면에 배치되며, 상기 형광체층의 광 방출면을 노출시키는 개구부와 복수 개의 슬릿을 포함하는 하우징을 포함한다.A lighting device according to an embodiment of the present invention includes a light source generating laser light; a light conversion unit including a phosphor layer disposed in an emission direction of the laser light and generating converted light excited by the laser light; and a housing disposed on the front surface of the light conversion unit so as to come into close contact with a side surface of the phosphor layer, and including an opening exposing a light emitting surface of the phosphor layer and a plurality of slits.

본 발명의 조명 장치는 배광을 조절하기 위한 하우징이 복수 개의 슬릿을 포함하여 이루어져, 하우징을 통해 방열 성능이 향상될 수 있다. 이에 따라, 광원과 광 변환부를 인접하게 배치시켜 시준기와 집광부를 제거할 수 있으므로, 조명 장치의 소형화를 구현하고 제조 비용을 절감할 수 있다.In the lighting device of the present invention, since a housing for controlling light distribution includes a plurality of slits, heat dissipation performance can be improved through the housing. Accordingly, since the collimator and the light concentrator can be removed by arranging the light source and the light conversion unit adjacently, miniaturization of the lighting device can be realized and manufacturing cost can be reduced.

도 1은 본 발명 제 1 실시 예의 조명 장치의 단면도이다.
도 2는 일반적인 조명 장치의 광 방출을 도시한 단면도이다.
도 3은 본 발명 제 2 실시 예의 조명 장치의 단면도이다.
도 4a 내지 도 4c는 본 발명의 제 3 실시 예의 조명 장치의 단면도이다.1 is a cross-sectional view of a lighting device according to a first embodiment of the present invention.
2 is a cross-sectional view illustrating light emission of a general lighting device.
3 is a cross-sectional view of a lighting device according to a second embodiment of the present invention.
4A to 4C are cross-sectional views of a lighting device according to a third embodiment of the present invention.

본 발명은 다양한 변경을 가할 수 있고 여러 가지 실시 예를 가질 수 있는 바, 특정 실시 예들을 도면에 예시하고 설명하고자 한다. 그러나, 이는 본 발명을 특정한 실시 형태에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물 내지 대체물을 포함하는 것으로 이해되어야 한다. Since the present invention can make various changes and have various embodiments, specific embodiments will be illustrated and described in the drawings. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

제 1, 제 2 등과 같이 서수를 포함하는 용어는 다양한 구성요소들을 설명하는데 사용될 수 있지만, 상기 구성요소들은 상기 용어들에 의해 한정되지는 않는다. 상기 용어들은 하나의 구성요소를 다른 구성요소로부터 구별하는 목적으로 사용된다. 예를 들어, 본 발명의 권리 범위를 벗어나지 않으면서 제2 구성요소는 제1 구성요소로 명명될 수 있고, 유사하게 제1 구성요소도 제2 구성요소로 명명될 수 있다. 및/또는 이라는 용어는 복수의 관련된 기재된 항목들의 조합 또는 복수의 관련된 기재된 항목들 중의 어느 항목을 포함한다. Terms including ordinal numbers, such as first and second, may be used to describe various components, but the components are not limited by the terms. These terms are used for the purpose of distinguishing one component from another. For example, a second element may be termed a first element, and similarly, a first element may be termed a second element, without departing from the scope of the present invention. The terms and/or include any combination of a plurality of related recited items or any of a plurality of related recited items.

어떤 구성요소가 다른 구성요소에 "연결되어" 있다거나 "접속되어" 있다고 언급된 때에는, 그 다른 구성요소에 직접적으로 연결되어 있거나 또는 접속되어 있을 수도 있지만, 중간에 다른 구성요소가 존재할 수도 있다고 이해되어야 할 것이다. 반면에, 어떤 구성요소가 다른 구성요소에 "직접 연결되어" 있다거나 "직접 접속되어" 있다고 언급된 때에는, 중간에 다른 구성요소가 존재하지 않는 것으로 이해되어야 할 것이다. It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when an element is referred to as “directly connected” or “directly connected” to another element, it should be understood that no other element exists in the middle.

본 출원에서 사용한 용어는 단지 특정한 실시 예를 설명하기 위해 사용된 것으로, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 출원에서, "포함하다" 또는 "가지다" 등의 용어는 명세서 상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

다르게 정의되지 않는 한, 기술적이거나 과학적인 용어를 포함해서 여기서 사용되는 모든 용어들은 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 일반적으로 이해되는 것과 동일한 의미를 가지고 있다. 일반적으로 사용되는 사전에 정의되어 있는 것과 같은 용어들은 관련 기술의 문맥 상 가지는 의미와 일치하는 의미를 가지는 것으로 해석되어야 하며, 본 출원에서 명백하게 정의하지 않는 한, 이상적이거나 과도하게 형식적인 의미로 해석되지 않는다.Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

이하, 첨부된 도면을 참조하여 실시 예를 상세히 설명하되, 도면 부호에 관계없이 동일하거나 대응하는 구성 요소는 동일한 참조 번호를 부여하고 이에 대한 중복되는 설명은 생략하기로 한다.Hereinafter, the embodiment will be described in detail with reference to the accompanying drawings, but the same or corresponding components regardless of reference numerals are given the same reference numerals, and overlapping descriptions thereof will be omitted.

이하, 첨부된 도면을 참조하여 실시 예의 조명 장치를 상세히 설명하면 다음과 같다.Hereinafter, a lighting device according to an embodiment will be described in detail with reference to the accompanying drawings.

도 1은 본 발명 실시 예의 조명 장치의 단면도이다.1 is a cross-sectional view of a lighting device according to an embodiment of the present invention.

도 1과 같이, 본 발명 실시 예의 조명 장치는 광원(10), 광원(10)에서 방출되는 광이 진행하는 방향에 배치되어 광원(10)에서 방출되는 광을 변환시키는 광 변환부(20), 광 변환부(20) 전면에 배치되어 광 변환부(20)를 통과한 광이 방출되도록 광 변환부(20)의 방출면에 형성된 개구부(30a)를 포함하는 하우징(30)을 포함하며, 하우징(30)은 복수 개의 슬릿(30b)을 포함한다.As shown in FIG. 1, the lighting device according to an embodiment of the present invention includes a light source 10, a light conversion unit 20 disposed in a direction in which light emitted from the light source 10 travels and converting the light emitted from the light source 10, A housing 30 disposed on the front surface of the light conversion unit 20 and including an opening 30a formed on an emission surface of the light conversion unit 20 so that light passing through the light conversion unit 20 is emitted; (30) includes a plurality of slits (30b).

광원(10)은 블루 파장대의 레이저 광을 발생시킬 수 있다. 광원(10)에서 발생되는 레이저 광은 약 450㎚ 대역의 파장을 가지는 레이저 광일 수 있다. The light source 10 may generate laser light in a blue wavelength range. The laser light generated from the light source 10 may be a laser light having a wavelength of about 450 nm.

광 변환부(20)는 레이저 광의 출광 방향에 배치되고 형광체층(24)을 포함하여 이루어져, 광원(10)에서 출광되는 블루 파장대의 레이저 광과 반응하여 하우징(30)의 개구부(30a)로 백색 광을 출력할 수 있다. 광 변환부(20)는 광원(10)에서 출광되는 블루 파장대의 레이저 광의 일부는 투과시키고, 일부는 변환시켜 옐로우 파장대의 변환 광을 형성할 수 있다. 광변환부(20)는 레이저 광과 변환 광의 조합을 통하여 백색 광을 생성할 수 있으며, 백색 광은 하우징(30)의 개구부(30a)를 통해 출광될 수 있다.The light conversion unit 20 is disposed in the emission direction of the laser light and includes the phosphor layer 24, reacts with the laser light of the blue wavelength range emitted from the light source 10, and emits white light through the opening 30a of the housing 30. light can be emitted. The light conversion unit 20 may transmit some of the blue wavelength laser light emitted from the light source 10 and convert some of it to form converted light of the yellow wavelength range. The light conversion unit 20 may generate white light through a combination of laser light and converted light, and the white light may be emitted through the opening 30a of the housing 30 .

광 변환부(20)는 기판(21), 반사 방지막(22), 단파장 필터(23) 및 형광체층(24)을 포함할 수 있다.The light conversion unit 20 may include a substrate 21 , an antireflection film 22 , a short wavelength filter 23 and a phosphor layer 24 .

기판(21)은 사파이어를 포함할 수 있으며, 이에 한정하지 않는다. 기판(21)은 광원에서 방출된 광이 광 변환부(20)를 통과하거나 광원(10)의 구동 시 발생하는 열을 전달 및 배출하는 방열 기능을 수행할 수 있다. 기판(21)의 배면에 코팅된 반사 방지막(22)은 광원(10)에서 방출되는 광이 기판(21)으로 입사될 때 광이 기판(21) 표면에서 반사되는 것을 방지하여 기판(21)으로 입사되는 광을 최대화하기 위한 것이다.The substrate 21 may include sapphire, but is not limited thereto. The substrate 21 may perform a heat dissipation function of transmitting and discharging heat generated when light emitted from the light source passes through the light conversion unit 20 or when the light source 10 is driven. The antireflection film 22 coated on the back surface of the substrate 21 prevents the light emitted from the light source 10 from being reflected from the surface of the substrate 21 when the light emitted from the light source 10 is incident on the substrate 21. This is to maximize the incident light.

기판(21)의 전면에는 단파장 필터(23)가 배치되며, 단파장 필터(23)는 특정 파장대의 광을 차단하기 위한 것이다. 예를 들어, 단파장 필터(23)는 500㎚ 이상의 파장의 광을 차단할 수 있다. 단파장 필터(23)는 기판(21)과 형광체층(24) 사이에 마련될 수 있으며 형광체층(24)에서 변환된 백색 광 중 형광체층(24)의 광 방출면이 아닌 기판(21) 방향으로 진행하는 광을 광 방출면 방향으로 되반사 시킬 수 있다.A short wavelength filter 23 is disposed on the front surface of the substrate 21, and the short wavelength filter 23 blocks light of a specific wavelength range. For example, the short wavelength filter 23 may block light having a wavelength of 500 nm or more. The short-wavelength filter 23 may be provided between the substrate 21 and the phosphor layer 24, and among the white light converted by the phosphor layer 24 is directed toward the substrate 21, not the light emitting surface of the phosphor layer 24. The traveling light may be reflected back toward the light emitting surface.

형광체층(24)는 하우징(30)과 접하는 면에 마련될 수 있으며, 흡수한 광을 다른 파장의 광으로 바꾸어 방출할 수 있다. 형광체층(24)은 입사되는 레이저 광을 옐로우 파장 대역의 광으로 변환하여 변환 광을 생성시키게 되고, 변환 광은 형광체층(24)을 통과하는 레이저 광과 합쳐져 백색 광을 형성하게 된다. 상기와 같은 형광체층(24)과 단파장 필터(23) 사이에는 접착층(25)이 더 배치되어, 단파장 필터(23)와 형광체층(24)의 밀착력을 향상시킬 수 있다.The phosphor layer 24 may be provided on a surface in contact with the housing 30, and may change the absorbed light into light of a different wavelength and emit it. The phosphor layer 24 converts incident laser light into light of a yellow wavelength band to generate converted light, and the converted light is combined with the laser light passing through the phosphor layer 24 to form white light. An adhesive layer 25 is further disposed between the phosphor layer 24 and the short wavelength filter 23 as described above, so that adhesion between the short wavelength filter 23 and the phosphor layer 24 can be improved.

하우징(30)은 광 방출면 측에서 광 변환부(20)와 결합되며, 형광체층(24)의 광 방출면을 노출시키는 개구부(30a)를 포함할 수 있다. 예를 들어, 개구부(30a)는 형광체층(24)의 일부를 노출시키며, 개구부(30a)를 통해 백색 광이 방출될 수 있다.The housing 30 may include an opening 30a coupled to the light conversion unit 20 on the light emitting surface side and exposing the light emitting surface of the phosphor layer 24 . For example, the opening 30a exposes a portion of the phosphor layer 24, and white light may be emitted through the opening 30a.

도 2는 일반적인 조명 장치의 광 방출을 도시한 단면도이다.2 is a cross-sectional view illustrating light emission of a general lighting device.

도 2와 같이, 광원(도 1의 10)에서 방출되어 광 변환부(20)로 입사되는 레이저 광 중 광 변환부(20)를 투과하는 블루 파장대의 레이저 광은 가우시안 분포(Gaussian distribution)에 따라 배광 영역(a1)을 형성한다. 그리고, 형광체층(도 1의 24)에 의하여 변환된 변환 광은 램버시안 분포(Lambertian distribution)에 따라 배광 영역(a2)을 형성한다.As shown in FIG. 2, among the laser light emitted from the light source (10 in FIG. 1) and incident to the light conversion unit 20, the laser light in the blue wavelength band passing through the light conversion unit 20 follows a Gaussian distribution. A light distribution area a1 is formed. And, the converted light converted by the phosphor layer (24 in FIG. 1) forms a light distribution area a2 according to a Lambertian distribution.

즉, 가우시안 분포에 따른 블루 파장대의 레이저 광과 램버시안 분포에 따른 옐로우 광이 겹치는 영역에서는 백색 광이 형성되나, 가우시안 분포를 벗어난 영역(A)에서는 옐로우 파장 대역의 광이 그대로 출광된다. 이러한 옐로우 파장 대역의 광은 조명 장치로부터 출력되는 광의 전체적인 색 편차를 증가시키며 백색 광의 주변에서 옐로우 계열의 광을 발생 시킨다.That is, white light is formed in the area where the laser light of the blue wavelength band according to the Gaussian distribution overlaps the yellow light according to the Lambertian distribution, but the light of the yellow wavelength band is emitted as it is in the area (A) outside the Gaussian distribution. Light in the yellow wavelength band increases overall color deviation of light output from the lighting device and generates yellow light around white light.

따라서, 다시 도 1을 참조하면, 본 발명 실시 예의 조명 장치는 하우징(30)의 개구부(30a)가 형광체층(24)의 광 방출면에 대해 90°이하의 경사각(θ)을 갖도록 기울어진 구조로 형성되며, 개구부(30a)를 제외한 형광체층(24)의 상부면 및 측면까지 감싸도록 배치된다. 이 때, 하우징(30)은 방열을 위해 열전도가 우수한 금속 물질인 알루미늄(Al), 구리(Cu) 등과 같은 물질을 포함할 수 있다. 예를 들어, 하우징(30)은 히트 싱크(Heat sink)일 수 있다.Therefore, referring to FIG. 1 again, in the lighting device according to the embodiment of the present invention, the opening 30a of the housing 30 is tilted to have an inclination angle θ of 90° or less with respect to the light emitting surface of the phosphor layer 24. , and is arranged to cover the top and side surfaces of the phosphor layer 24 except for the opening 30a. In this case, the housing 30 may include a material such as aluminum (Al) or copper (Cu), which is a metal material having excellent thermal conductivity, for heat dissipation. For example, the housing 30 may be a heat sink.

광원에서 방출된 광이 광 변환부(20)를 통과하거나 광원(10)의 구동 시 열이 발생한다. 상술한 바와 같이, 방열을 위해 사파이어를 포함하는 기판(21)을 배치한ㄷ. 그러나, 기판(21)은 형광체층(24)과 광원(10) 사이에 배치되므로, 형광체층(24) 주변에서 발생하는 열의 방열을 어렵다. 특히, 형광체층(24)은 전면뿐만 아니라, 측면에서도 광이 방출되므로, 개구부(30a)를 통해 방출되는 광량을 증가시키기 형광체층(24)의 측면은 차폐하는 것이 바람직하다.Heat is generated when light emitted from the light source passes through the light conversion unit 20 or when the light source 10 is driven. As described above, arrange the substrate 21 containing sapphire for heat dissipation c. However, since the substrate 21 is disposed between the phosphor layer 24 and the light source 10, it is difficult to dissipate heat generated around the phosphor layer 24. In particular, since light is emitted not only from the front side of the phosphor layer 24 but also from the side surface, it is preferable to shield the side surface of the phosphor layer 24 to increase the amount of light emitted through the opening 30a.

이를 위해, 일반적인 조명 장치는 형광체층(24)의 측면에 백색 실리콘을 포함하는 백색 몰딩(white molding)을 형성한다. 그런데, 백색 실리콘은 실리콘 수지와 TiO2 등이 혼합된 유기물이므로, 금속에 비해 열 안정성 및 신뢰성이 낮다. 더욱이, 형광체층(24) 측면을 감싸도록 백색 실리콘을 도포한 후 이를 경화시키는 공정을 실시해야 하므로 공정이 복잡하며, 경화 전 백색 실리콘이 흘러내려 불량이 발생할 수 있다. To this end, a general lighting device forms white molding containing white silicon on the side of the phosphor layer 24 . However, since white silicon is an organic material in which a silicone resin and TiO 2 are mixed, thermal stability and reliability are lower than those of metal. Furthermore, since white silicone is applied to cover the side surface of the phosphor layer 24 and then cured, the process is complicated, and defects may occur because the white silicone flows down before curing.

반면에, 본 발명 실시 예는 하우징(30)이 개구부(30a)를 제외한 형광체층(24)의 상부면 및 측면까지 감싸도록 광 변환부(20)와 결합되며, 하우징(30)은 방열을 위해 열전도가 우수한 금속 물질로 이루어질 수 있다. 특히, 하우징(30)은 형광체층(24)의 상부면 및 측면까지 덮는 일체형으로 이루어져, 상술한 백색 몰딩을 제거할 수 있다. 더욱이, 하우징(30)이 금속 물질을 포함하므로, 형광체층(24)의 측면을 통해 방출되는 광을 용이하게 반사시켜 개구부(30a)로 진행시킬 수 있다.On the other hand, in the embodiment of the present invention, the housing 30 is coupled to the light conversion unit 20 so as to cover the top and side surfaces of the phosphor layer 24 except for the opening 30a, and the housing 30 is for heat dissipation. It may be made of a metal material having excellent thermal conductivity. In particular, the housing 30 is integrally formed to cover the top and side surfaces of the phosphor layer 24, so that the aforementioned white molding can be removed. Moreover, since the housing 30 includes a metal material, light emitted through the side surface of the phosphor layer 24 can be easily reflected and directed to the opening 30a.

또한, 하우징(30)은 효율적인 방열을 위해 복수 개의 슬릿(30a)을 포함하므로, 슬릿(30b)에 의해 광 방출 면적이 증가하여 조명 장치의 열 방출 효율이 향상될 수 있다. 도면에서는 복수 개의 슬릿이 직선 형태인 것을 도시하였으나, 광 방출 면적을 증가시키기 위해, 슬릿은 곡선을 포함할 수 있으며, 이에 한정하지 않는다.In addition, since the housing 30 includes a plurality of slits 30a for efficient heat dissipation, a light radiating area is increased by the slits 30b, thereby improving heat dissipation efficiency of the lighting device. Although the drawings show that the plurality of slits are linear, the slits may include curved lines in order to increase a light emission area, but are not limited thereto.

하우징(30)과 광 방출부(20)의 결합력을 향상시키기 위해, 하우징(30)과 형광체층(24)의 계면에 도전성의 접착물질인 금속 페이스트(metal paste)(100)가 형성될 수 있으며, 하우징(30)의 내측면에 은(Ag), 구리(Cu) 등과 같은 금속 페이스트(100)를 형성한 후, 하우징(30)과 광 방출부(20)를 체결할 수 있다. 이 경우, 체결력 향상뿐만 아니라 금속 페이스트(100)에 의해 형광체층(24) 측면에서의 광 반사효율도 더욱 향상될 수 있다.In order to improve bonding strength between the housing 30 and the light emitting portion 20, a metal paste 100, which is a conductive adhesive material, may be formed at the interface between the housing 30 and the phosphor layer 24. , After forming a metal paste 100 such as silver (Ag) or copper (Cu) on the inner surface of the housing 30, the housing 30 and the light emitting portion 20 may be fastened. In this case, not only the fastening force but also the light reflection efficiency on the side of the phosphor layer 24 can be further improved by the metal paste 100 .

하우징(30)의 개구부(30a)에서 노출된 형광체층(24)의 광 방출면과 하우징(30)과 밀착된 형광체층(24)의 표면은 평균 거칠기(Roughness average; Ra)가 상이하다. 예를 들어, 하우징(30)의 개구부(30a)에서 노출된 형광체층(24)의 광 방출면에 요철 구조(24a)가 형성되어, 형광체층(24)의 광 방출면의 평균 거칠기가 하우징(30)과 밀착되는 표면의 평균 거칠기보다 크다. 요철 구조(24a)의 평균 거칠기(Roughness average; Ra)는 0.05㎛ 이하일 수 있으며, 이에 한정하지 않는다.The light emitting surface of the phosphor layer 24 exposed through the opening 30a of the housing 30 and the surface of the phosphor layer 24 in close contact with the housing 30 have different roughness averages (Ra). For example, the concavo-convex structure 24a is formed on the light emitting surface of the phosphor layer 24 exposed through the opening 30a of the housing 30, so that the average roughness of the light emitting surface of the phosphor layer 24 is the housing ( 30) is greater than the average roughness of the surface in close contact with it. The roughness average (Ra) of the uneven structure 24a may be 0.05 μm or less, but is not limited thereto.

따라서, 요철 구조(24a)에 의해 개구부(30a)에서 방출되는 광의 확산 및 산란 효과는 향상되며, 하우징(30)과 형광체층(24)의 밀착력은 향상될 수 있다.Accordingly, diffusion and scattering effects of light emitted from the opening 30a may be enhanced by the concavo-convex structure 24a, and adhesion between the housing 30 and the phosphor layer 24 may be improved.

그리고, 광원(10)과 광 변환부(20) 사이에는 시준기(40) 및 집광부(50)가 더 배치될 수 있다. 이 때, 시준기(40)는 집광부(50)보다 광원(10)과 더 인접할 수 있다.In addition, a collimator 40 and a light collecting unit 50 may be further disposed between the light source 10 and the light conversion unit 20 . In this case, the collimator 40 may be closer to the light source 10 than the light collecting unit 50 .

시준기(40)는 광원(10)에서 방출되는 레이저 광을 평행광선으로 출광하며, 집광부(50)는 시준기(40)를 통해 출광되는 평행광선을 집광한다. 집광부(50)는 시준기(40)를 통과한 레이저 광을 굴절시켜 광 변환부(20)로 입사시킬 수 있다. 집광부(50)는 집광렌즈로 구성될 수 있으며 평행광으로 입사되는 레이저 광을 광 변환부(20)의 중심 방향으로 굴절시켜 입사시킬 수 있다.The collimator 40 emits the laser light emitted from the light source 10 as a parallel beam, and the concentrating unit 50 collects the parallel beam emitted through the collimator 40 . The light collecting unit 50 may refract the laser light passing through the collimator 40 and make it incident to the light conversion unit 20 . The concentrating unit 50 may be composed of a condensing lens, and may refract laser light incident as parallel light toward the center of the light conversion unit 20 to be incident thereto.

도 3은 본 발명 제 2 실시 예의 조명 장치의 단면도이다.3 is a cross-sectional view of a lighting device according to a second embodiment of the present invention.

도 3과 같이, 본 발명 제 2 실시 예의 조명 장치는 시준기(40)와 집광부(50)를 제거하여, 광원(10)과 광 변환부(20) 사이의 거리(d2)를 도 1의 광원(10)과 광 변환부(20) 사이의 거리(d1)보다 감소시켜 조명 장치의 박형화를 실현할 수 있다.As shown in FIG. 3 , in the lighting device according to the second embodiment of the present invention, the distance d2 between the light source 10 and the light conversion unit 20 is determined by removing the collimator 40 and the light concentrating unit 50. By reducing the distance d1 between (10) and the light conversion unit 20, the thickness of the lighting device can be realized.

일반적으로, 광원(10)과 광 변환부(20) 사이가 너무 가까우면, 기판(10)만으로 광원(10)의 구동에 의해 발생하는 열을 방열시키기 어렵다. 그러나, 본 발명 실시 예는 상술한 바와 같이 하우징(20)이 복수 개의 슬릿(30b)을 포함하여 이루어져, 광원(10)을 광 변환부(20)와 인접하게 배치시키더라도 방열 성능이 향상될 수 있다. 따라서, 시준기(40)와 집광부(50)를 제거함으로써, 조명 장치의 소형화를 구현하고 제조 비용을 절감할 수 있다.In general, when the light source 10 and the light conversion unit 20 are too close, it is difficult to dissipate heat generated by driving the light source 10 using only the substrate 10 . However, in the embodiment of the present invention, as described above, the housing 20 includes the plurality of slits 30b, so that the heat dissipation performance can be improved even if the light source 10 is disposed adjacent to the light conversion unit 20. there is. Therefore, by removing the collimator 40 and the light concentrating part 50, the lighting device can be miniaturized and the manufacturing cost can be reduced.

도 4a 내지 도 4c는 본 발명의 제 3 실시 예의 조명 장치의 단면도이다.4A to 4C are cross-sectional views of a lighting device according to a third embodiment of the present invention.

도 4a 내지 도 4c와 같이, 인접한 두 개의 광원(10)이 하우징(30)을 공유할 수 있다.As shown in FIGS. 4A to 4C , two adjacent light sources 10 may share the housing 30 .

구체적으로, 도 4a 및 도 4b와 같이, 인접한 두 개의 광원(10)이 하우징(30)을 공유할 수 있으며, 이 경우, 개별적으로 하우징(30)을 형성하는 경우보다 공정이 단순화된다. 특히, 도 4a와 같이, 광 변환부(20)가 광원(10)에 각각 대응되거나, 도 4b와 같이, 광 변환부(20)가 일체형으로 형성될 수도 있다.Specifically, as shown in FIGS. 4A and 4B, two adjacent light sources 10 may share the housing 30, and in this case, the process is simplified compared to the case of individually forming the housing 30. In particular, as shown in FIG. 4A, each light conversion unit 20 may correspond to the light source 10, or as shown in FIG. 4B, the light conversion unit 20 may be integrally formed.

도 4c와 같이, 광원(10)에서 방출되는 광은 반사갓(200)에서 반사되어 특정 방향으로 반사될 수 있으며, 도면에서는 수직 방향(y)의 광이 수평 방향(x)으로 반사되는 것을 도시하였다.As shown in FIG. 4C, the light emitted from the light source 10 may be reflected from the reflector 200 and reflected in a specific direction, and the figure shows that light in the vertical direction (y) is reflected in the horizontal direction (x). .

특히, 광원(10)과 광 변환부(20) 사이에 시준기(40) 및 집광부(50)를 더 포함하는 도 4a 및 도 4b에 비해 시준기(40)와 집광부(50)가 제거되어 광원(10)과 광 변환부(20) 사이의 거리가 인접한 도 4c는 소형화가 용이하다. In particular, compared to FIGS. 4A and 4B, which further include the collimator 40 and the light concentrating part 50 between the light source 10 and the light conversion part 20, the collimator 40 and the light concentrating part 50 are removed and the light source 4C, in which the distance between 10 and the light conversion unit 20 is close, it is easy to miniaturize.

따라서, 도 4c는 반사갓(50)을 포함하는 반사형 조명 장치에 적용하기 용이하며, 도 4a 및 도 4b는 광원(10)에서 방출되는 광이 수평 방향(x)으로 진행하는 직하형 조명 장치에 적용하는 것이 바람직하나, 이에 한정하지 않는다.Therefore, FIG. 4c is easily applied to a reflective lighting device including a reflector 50, and FIGS. 4a and 4b are a direct type lighting device in which light emitted from the light source 10 travels in the horizontal direction (x). It is preferable to apply, but is not limited thereto.

상기와 같은 본 발명 실시 예의 조명 장치는 배광을 조절하여 옐로우 파장 대역의 광에 의한 색 특성 저하를 방지하는 하우징(30)이 형광체층(24)의 측면까지 감싸며, 동시에 복수 개의 슬릿(30b)을 포함하여 이루어져, 방열 성능이 향상된다.As described above, in the lighting device according to the embodiment of the present invention, the housing 30 for preventing color characteristic deterioration due to light in the yellow wavelength band by controlling light distribution covers up to the side surface of the phosphor layer 24, and at the same time has a plurality of slits 30b. Including, the heat dissipation performance is improved.

이상에서 설명한 본 발명은 상술한 실시 예 및 첨부된 도면에 한정되는 것이 아니고, 실시 예의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능하다는 것이 본 발명이 속하는 기술분야에서 종래의 지식을 가진 자에게 있어 명백할 것이다.The present invention described above is not limited to the above-described embodiments and accompanying drawings, and various substitutions, modifications, and changes are possible within a range that does not depart from the technical spirit of the embodiments. It will be clear to those who have knowledge.

10: 광원 20: 광 변환부
21: 기판 22: 반사 방지막
23: 단파장 필터 24: 형광체층
24a: 요철 구조 25: 접착층
30: 하우징 30a: 개구부
30b: 슬릿 40: 시준기
50: 집광부 100: 금속 페이스트
200: 반사갓10: light source 20: light conversion unit
21: substrate 22: antireflection film
23: short wavelength filter 24: phosphor layer
24a: uneven structure 25: adhesive layer
30: housing 30a: opening
30b: slit 40: collimator
50: light collector 100: metal paste
200: reflector

Claims (8)

광을 발생시키는 광원;
상기 광의 출광 방향에 배치되며, 상기 광에 의해 여기되는 변환 광을 생성하는 형광체층을 구비하는 광 변환부; 및
상기 형광체층의 측면을 에워싸며 상기 형광체층의 광 방출 방향을 따라 나란하게 형성된 복수의 제 1 핀, 상기 형광체층의 광 방출면 외측에서 상기 형광체층의 광 방출면의 일부 영역을 노출시키는 개구부, 및 상기 개구부를 에워싸도록 상기 복수의 제 1 핀과 교차하는 방향으로 나란하게 형성된 복수의 제 2 핀을 포함하는 하우징을 포함하는 조명 장치.a light source that generates light;
a light conversion unit including a phosphor layer disposed in a light emission direction of the light and generating converted light excited by the light; and
A plurality of first pins surrounding the side surface of the phosphor layer and formed in parallel along the light emission direction of the phosphor layer, an opening exposing a partial region of the light emission surface of the phosphor layer from the outside of the light emission surface of the phosphor layer, and a housing including a plurality of second pins formed in parallel in a direction crossing the plurality of first pins to surround the opening. 삭제delete 제 1 항에 있어서,
상기 광 변환부는
기판;
상기 기판 배면에 코팅된 반사 방지막; 및
상기 기판 전면과 상기 형광체층 사이에 배치된 단파장 필터를 더 포함하고,
상기 형광체층의 전체 측면과 상기 복수의 제 1 핀이 형성된 상기 하우징 사이 및 상기 형광체층의 광 출사면의 일부 영역과 상기 복수의 제 2 핀 사이에 배치된 금속 페이스트를 더 포함하는 조명 장치.According to claim 1,
the light conversion unit
Board;
an antireflection film coated on the back surface of the substrate; and
Further comprising a short wavelength filter disposed between the entire surface of the substrate and the phosphor layer,
and a metal paste disposed between an entire side surface of the phosphor layer and the housing where the plurality of first pins are formed and between a partial region of a light exit surface of the phosphor layer and the plurality of second pins. 삭제delete 제 3 항에 있어서,
상기 하우징의 개구부를 통해 노출된 상기 형광체층의 광 방출면의 평균 거칠기와 상기 형광체층의 측면의 평균 거칠기는 상이한 조명 장치.According to claim 3,
An average roughness of a light emitting surface of the phosphor layer exposed through the opening of the housing is different from an average roughness of a side surface of the phosphor layer. 삭제delete 제 1 항에 있어서,
상기 광원과 상기 광 변환부 사이에 배치된 시준기 및 집광부를 더 포함하며,
상기 시준기가 상기 집광부보다 상기 광원과 더 인접한 조명 장치.According to claim 1,
Further comprising a collimator and a light collecting unit disposed between the light source and the light conversion unit,
The lighting device according to claim 1 , wherein the collimator is closer to the light source than the light collecting part. 제 1 항에 있어서,
상기 하우징의 개구부는 상기 광 변환부의 상기 광 방출면에 대해 90°이하의 경사각을 가지며, 상기 복수의 제 2 핀에 의해 형성되는 슬릿의 경사각은 상기 개구부의 경사각과 동일한 조명 장치.According to claim 1,
The opening of the housing has an inclination angle of 90° or less with respect to the light emitting surface of the light conversion unit, and an inclination angle of the slits formed by the plurality of second pins is equal to an inclination angle of the opening.
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