KR102554964B1 - Heat-resistant resin composition and manufacturing method of heat-resistant resin products using the same - Google Patents
Heat-resistant resin composition and manufacturing method of heat-resistant resin products using the same Download PDFInfo
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- KR102554964B1 KR102554964B1 KR1020230065834A KR20230065834A KR102554964B1 KR 102554964 B1 KR102554964 B1 KR 102554964B1 KR 1020230065834 A KR1020230065834 A KR 1020230065834A KR 20230065834 A KR20230065834 A KR 20230065834A KR 102554964 B1 KR102554964 B1 KR 102554964B1
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- heat
- polyamide
- resistant resin
- weight
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- 229920006015 heat resistant resin Polymers 0.000 title claims abstract description 19
- 239000011342 resin composition Substances 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000835 fiber Substances 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- -1 poly(phenylene ether) Polymers 0.000 claims abstract description 25
- 239000006229 carbon black Substances 0.000 claims abstract description 11
- 229920000642 polymer Polymers 0.000 claims abstract description 7
- 239000004952 Polyamide Substances 0.000 claims description 24
- 239000003063 flame retardant Substances 0.000 claims description 24
- 229920002647 polyamide Polymers 0.000 claims description 24
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 14
- 239000002952 polymeric resin Substances 0.000 claims description 10
- 229920003002 synthetic resin Polymers 0.000 claims description 10
- 239000008188 pellet Substances 0.000 claims description 9
- 229920000877 Melamine resin Polymers 0.000 claims description 6
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 229910001385 heavy metal Inorganic materials 0.000 claims description 2
- 239000012796 inorganic flame retardant Substances 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 47
- 239000004917 carbon fiber Substances 0.000 description 47
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 39
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 36
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 30
- 238000010438 heat treatment Methods 0.000 description 30
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 28
- 229910021389 graphene Inorganic materials 0.000 description 28
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 18
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 18
- 239000011247 coating layer Substances 0.000 description 18
- 229910052760 oxygen Inorganic materials 0.000 description 18
- 239000001301 oxygen Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 13
- 239000002243 precursor Substances 0.000 description 10
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 10
- 229920002302 Nylon 6,6 Polymers 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 9
- 239000006185 dispersion Substances 0.000 description 9
- 229920001955 polyphenylene ether Polymers 0.000 description 9
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000002216 antistatic agent Substances 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 8
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical group [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 8
- 239000012299 nitrogen atmosphere Substances 0.000 description 8
- 229920002239 polyacrylonitrile Polymers 0.000 description 8
- 229920002292 Nylon 6 Polymers 0.000 description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000005809 transesterification reaction Methods 0.000 description 7
- VGLVSMNWXDHPHX-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5-decamethylpentasilolane Chemical compound C[Si]1(C)[Si](C)(C)[Si](C)(C)[Si](C)(C)[Si]1(C)C VGLVSMNWXDHPHX-UHFFFAOYSA-N 0.000 description 6
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000009832 plasma treatment Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- XGPWXVYPYPCYQE-UHFFFAOYSA-N 1-[[ethyl-bis(trimethylsilyloxy)silyl]oxy-dimethylsilyl]-N-methylmethanamine Chemical compound CC[Si](O[Si](C)(C)C)(O[Si](C)(C)C)O[Si](C)(C)CNC XGPWXVYPYPCYQE-UHFFFAOYSA-N 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 4
- 229920000572 Nylon 6/12 Polymers 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000003599 detergent Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000002841 Lewis acid Substances 0.000 description 3
- 239000004697 Polyetherimide Substances 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 229920006121 Polyxylylene adipamide Polymers 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 150000007517 lewis acids Chemical class 0.000 description 3
- 238000010422 painting Methods 0.000 description 3
- 229920006122 polyamide resin Polymers 0.000 description 3
- 229920001601 polyetherimide Polymers 0.000 description 3
- 229920006380 polyphenylene oxide Polymers 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 2
- 101000576320 Homo sapiens Max-binding protein MNT Proteins 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000299 Nylon 12 Polymers 0.000 description 2
- 229920000393 Nylon 6/6T Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241001247482 Amsonia Species 0.000 description 1
- 241000894006 Bacteria Species 0.000 description 1
- 229920001081 Commodity plastic Polymers 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 241000192125 Firmicutes Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 229920006864 PPE/PS Polymers 0.000 description 1
- 229920006100 Vydyne® Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- GTZOYNFRVVHLDZ-UHFFFAOYSA-N dodecane-1,1-diol Chemical compound CCCCCCCCCCCC(O)O GTZOYNFRVVHLDZ-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920006131 poly(hexamethylene isophthalamide-co-terephthalamide) Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
본 발명은 내열수지 조성물 및 이를 이용한 내열수지 제품의 제조방법에 관한 것이다.The present invention relates to a heat-resistant resin composition and a method for manufacturing a heat-resistant resin product using the same.
플라스틱 소재는 금속이나 세라믹 소재에 비하여 내열성, 난연성 등의 특성이 떨어지는 반면, 가볍고 가공성이 우수하여 생활용품, 자동차, 전기, 전자 및 산업용 분야 등에 걸쳐 광범위하게 사용되고 있다.While plastic materials are inferior in heat resistance and flame retardancy compared to metal or ceramic materials, they are light and have excellent workability, and are widely used in household goods, automobiles, electricity, electronics, and industrial fields.
예컨대, 폴리아미드(polyamide, PA) 수지는 아미드 결합(-CO-NH-)의 반복이 주쇄를 이루는 선상의 고분자 물질로서, 나일론 수지라고도 불리며, 기계적 성질, 특히 내약품성, 내충격성, 내마모성 등이 우수하여 일반 범용 플라스틱(commodity plastics)보다 특성이 우수한 엔지니어링 플라스틱(engineering plastics) 중에서도 많이 사용된다.For example, polyamide (PA) resin is a linear polymer material in which repetition of amide bonds (-CO-NH-) forms the main chain, and is also called nylon resin, and has mechanical properties, particularly chemical resistance, impact resistance, and abrasion resistance. It is excellent and is widely used among engineering plastics with excellent properties than general commodity plastics.
또한, 폴리페닐렌에테르(polyphenylene ether, PPE) 또는 이와 와 같은 뜻인 폴리페닐렌옥사이드(polyphenylene oxide, PPO) 도 열변형온도(heat deformation temperature, HDT)가 높고 치수안정성, 난연성, 전기적 특성 및 기계적 물성이 우수하여, 엔지니어링 플라스틱의 소재로 많이 사용된다.In addition, polyphenylene ether (PPE) or polyphenylene oxide (PPO), which has the same meaning, has a high heat deformation temperature (HDT), dimensional stability, flame retardancy, electrical properties and mechanical properties. Because of its excellent properties, it is widely used as a material for engineering plastics.
상기 플라스틱 수지, 특히 PPE 또는 PPO 수지는 단독으로 사용하는 경우보다 다른 플라스틱 소재와 함께 사용하는 경우 특성이 우수하다. 이처럼 다른 수지들과 함께 사용하는 경우 각 구성 수지들의 단점을 보완하여 목적하는 용도에 따라 요구되는 물성을 충족시킬 수 있다.The plastic resin, in particular PPE or PPO resin, has better properties when used together with other plastic materials than when used alone. In this way, when used together with other resins, it is possible to compensate for the disadvantages of each constituent resin to satisfy the physical properties required according to the intended use.
예를 들면, PPE를 폴리스티렌(PS), 폴리아미드(PA) 등의 수지들과 함께 사용하는 경우에는 PPE의 물성 외에도 PS, PA의 내충격성, 내화학성 등의 물성까지 얻을 수 있다. 특히, PPE/PA의 조합은 내열성, 내충격성, 내화학성 및 치수안정성 등의 물성이 균형있게 발현될 수 있는 것으로 알려져 있어, 골프 카트, 오토바이, 자동차 등의 외장재, 전기 전자 제품의 하우징 등에 적용되어 사용중이다.For example, when PPE is used together with resins such as polystyrene (PS) and polyamide (PA), physical properties such as impact resistance and chemical resistance of PS and PA can be obtained in addition to the physical properties of PPE. In particular, the combination of PPE/PA is known to be able to express physical properties such as heat resistance, impact resistance, chemical resistance and dimensional stability in a balanced way, and is applied to exterior materials such as golf carts, motorcycles, automobiles, housings of electric and electronic products, etc. in use
그러나, 이러한 장점들에도 불구하고 기존의 플라스틱 소재 자체가 갖는 내열적 한계 때문에, PPE/PS 및 PPE/PA혼합 수지는 185℃ 이상 또는 195℃ 이상의 고온에서 수행되는 공정, 예컨대, 온라인 페인팅(on-line painting) 공정에 적용하기 어려울 뿐만 아니라, 적용된다 하더라도 상기 온도보다 낮은 온도에서 공정을 수행하여야 하는 문제가 있다(한국 공개특허 제2016-0121383호).However, despite these advantages, due to the heat resistance limitations of the existing plastic materials themselves, PPE/PS and PPE/PA blend resins are used in processes performed at high temperatures of 185 ° C or higher or 195 ° C or higher, such as online painting (on-line painting). It is not only difficult to apply to the line painting) process, but even if applied, there is a problem in that the process must be performed at a temperature lower than the above temperature (Korean Patent Publication No. 2016-0121383).
따라서, 보다 높은 내열성을 가져 다양한 용도에 적용될 수 있는 플라스틱 소재에 대한 연구가 필요한 실정이다. 또한, 우수한 기계적 강도를 동시에 나타내는 경우 다양한 환경에 적용할 수 있을 것이다.Therefore, there is a need for research on plastic materials that have higher heat resistance and can be applied to various uses. In addition, if it exhibits excellent mechanical strength at the same time, it will be applicable to various environments.
본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로서, 본 발명의 목적은 폴리페닐렌에테르의 특성을 유지하되 높은 내열성을 가질 수 있으며, 우수한 인장강도, 신율, 굴곡강도, 굴곡탄성율, 충격강도를 가지는 내열수지 조성물을 공하는 것이다.The present invention has been made to solve the above problems, and an object of the present invention is to maintain the characteristics of polyphenylene ether, but to have high heat resistance, and to have excellent tensile strength, elongation, flexural strength, flexural modulus, and impact strength. To provide a heat-resistant resin composition having a.
본 발명의 과제는 이상에서 언급한 과제들로 제한되지 않으며, 언급되지 않은 또 다른 과제들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The object of the present invention is not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.
상기 목적을 달성하기 위하여 본 발명은In order to achieve the above object, the present invention
폴리페닐렌에테르(PPE) 수지, 영구대전방지제(IDP), 카본블랙 및 전도성 섬유를 포함하는 내열수지 조성물을 제공한다.A heat-resistant resin composition comprising a polyphenylene ether (PPE) resin, a permanent antistatic agent (IDP), carbon black, and conductive fibers is provided.
또한, 상기 내열수지 조성물은,In addition, the heat-resistant resin composition,
폴리페닐렌에테르(poly(phenylene ether), PPE) 수지, 폴리아미드(polyamide, PA) 수지, 하기 화학식 1로 표시되는 고분자 수지, 영구대전방지제(inherently dissipative polymer, IDP), 난연제, 카본블랙 및 전도성 섬유 또는 유리섬유를 포함하고,Poly(phenylene ether) (PPE) resin, polyamide (PA) resin, polymer resin represented by Formula 1 below, inherently dissipative polymer (IDP), flame retardant, carbon black and conductivity Contains fibers or glass fibers;
상기 난연제는 마그네슘 디하이드록사이드(magnesium dihydroxide, MDH), 멜라민(melamine), 데카브로모 디페닐 에탄(decabromo diphenyl ethane, DBPE), 삼산화안티몬(Sb2O3, antimony trioxide, ATO), 비스페놀-A 비스디페닐포스페이트(bisphenol-A bis diphenyl phosphate, BDP) 및 레졸시놀 비스디페닐포스페이트(resorcinol bis diphenyl phosphate, RDP)로 이루어지는 군으로부터 선택되는 1종 이상인 것을 특징으로 한다.The flame retardant is magnesium dihydroxide (MDH), melamine, decabromo diphenyl ethane (DBPE), antimony trioxide (Sb 2 O 3 , antimony trioxide, ATO), bisphenol- It is characterized in that at least one selected from the group consisting of bisphenol-A bis diphenyl phosphate (BDP) and resorcinol bis diphenyl phosphate (RDP).
<화학식 1><Formula 1>
(상기 화학식 1에서, n은 50-500이고, m은 25-30이다.)(In Formula 1, n is 50-500 and m is 25-30.)
또한, 상기 전도성 섬유는 탄소섬유 및 상기 탄소섬유 표면에 코팅된 코팅층을 포함하고,In addition, the conductive fiber includes carbon fiber and a coating layer coated on the surface of the carbon fiber,
상기 탄소섬유는,The carbon fiber,
폴리아크릴로나이트릴(PAN) 섬유를 질소분위기에서 1-2℃/분의 승온속도로 300-400℃의 온도까지 승온시킨 후 2-4시간 동안 1차 열처리하여 탄소섬유 전구체를 제조하는 단계; 상기 탄소섬유 전구체를 질소분위기에서 4-6℃/분의 승온속도로 700-800℃의 온도까지 승온시킨 후 0.5-2시간 동안 2차 열처리하여 탄소섬유를 제조하는 단계; 상기 탄소섬유를 이용하여 산소플라즈마 처리하는 단계; 카르복시기를 포함하는 그래핀 산화물과 10 중량%의 황산 수용액을 준비하여, 상기 황산 수용액 100 중량부에 대하여 상기 그래핀 산화물을 1 중량부 포함하는 분산액을 제조한 후, 상기 분산액에 산소플라즈마 처리된 탄소섬유를 침지한 후, 40-60℃의 온도에서 6-10시간 동안 반응시켜 산소플라즈마 처리된 탄소섬유를 그래핀 산화물로 코팅하는 단계; 및 그래핀 산화물이 코팅된 탄소섬유를 물 및 에탄올을 1:1의 중량비율로 포함하는 세정제를 이용하여 세척하는 단계;를 수행하여 제조된 것이고,Preparing a carbon fiber precursor by heating a polyacrylonitrile (PAN) fiber to a temperature of 300-400 ° C at a heating rate of 1-2 ° C / min in a nitrogen atmosphere and then performing a primary heat treatment for 2-4 hours; Preparing a carbon fiber by heating the carbon fiber precursor to a temperature of 700-800° C. at a heating rate of 4-6° C./min in a nitrogen atmosphere and then subjecting the carbon fiber precursor to a secondary heat treatment for 0.5-2 hours; Oxygen plasma treatment using the carbon fiber; A dispersion containing 1 part by weight of graphene oxide based on 100 parts by weight of the aqueous sulfuric acid solution was prepared by preparing a graphene oxide containing a carboxy group and a 10% by weight sulfuric acid aqueous solution, and then the dispersion was treated with oxygen plasma. After immersing the fibers, reacting at a temperature of 40-60 ° C. for 6-10 hours to coat the carbon fibers treated with oxygen plasma with graphene oxide; and washing the graphene oxide-coated carbon fiber with a detergent containing water and ethanol in a weight ratio of 1:1;
상기 코팅층은,The coating layer,
하기 화학식 2로 표시되는 폴리실록산-실라잔 공중합체 23-27 중량부, 3-에틸메틸아미노-3-(트리메틸실록시)-1,1,1,5,5,5-헥사메틸트리실록산 3-7 중량부, 데카메틸싸이클로펜타실란(Decamethyl cyclopentasilane) 1-5 중량부 및 디부틸에테르 65-69 중량부를 포함하는 코팅층 형성용 조성물로부터 형성된 것을 특징으로 한다.23-27 parts by weight of a polysiloxane-silazane copolymer represented by Formula 2 below, 3-ethylmethylamino-3-(trimethylsiloxy)-1,1,1,5,5,5-hexamethyltrisiloxane 3- It is characterized in that it is formed from a composition for forming a coating layer containing 7 parts by weight, 1-5 parts by weight of decamethyl cyclopentasilane and 65-69 parts by weight of dibutyl ether.
<화학식 2><Formula 2>
(상기 화학식 2에서 a는 1-20이고, b는 1-20이고, p는 1-20이고, q는 1-5이고, r은 1-10이다.)(In Formula 2, a is 1-20, b is 1-20, p is 1-20, q is 1-5, and r is 1-10.)
또한, 본 발명은In addition, the present invention
폴리페닐렌에테르(poly(phenylene ether), PPE) 수지, 폴리아미드(polyamide, PA) 수지, 하기 화학식 1로 표시되는 고분자 수지, 영구대전방지제(inherently dissipative polymer, IDP), 난연제, 카본블랙 및 전도성 섬유를 혼합하고, 압출기로 압출하여 펠릿으로 제조하는 단계; 및Poly(phenylene ether) (PPE) resin, polyamide (PA) resin, polymer resin represented by Formula 1 below, inherently dissipative polymer (IDP), flame retardant, carbon black and conductivity Mixing the fibers and extruding them with an extruder to form pellets; and
상기 펠릿을 건조한 후, 사출기로 사출하는 단계;를 포함하고,After drying the pellets, injecting them into an extruder; Including,
상기 난연제는 마그네슘 디하이드록사이드(magnesium dihydroxide, MDH), 멜라민(melamine), 데카브로모 디페닐 에탄(decabromo diphenyl ethane, DBPE), 삼산화안티몬(Sb2O3, antimony trioxide, ATO), 비스페놀-A 비스디페닐포스페이트(bisphenol-A bis diphenyl phosphate, BDP) 및 레졸시놀 비스디페닐포스페이트(resorcinol bis diphenyl phosphate, RDP)로 이루어지는 군으로부터 선택되는 1종 이상인 것을 특징으로 하는 내열수지 조성물을 포함하는 제품의 제조방법을 제공한다.The flame retardant is magnesium dihydroxide (MDH), melamine, decabromo diphenyl ethane (DBPE), antimony trioxide (Sb 2 O 3 , antimony trioxide, ATO), bisphenol- A heat-resistant resin composition comprising at least one selected from the group consisting of bisphenol-A bis diphenyl phosphate (BDP) and resorcinol bis diphenyl phosphate (RDP) Provides a manufacturing method for the product.
<화학식 1><Formula 1>
(상기 화학식 1에서, n은 50-500이고, m은 25-30이다.)(In Formula 1, n is 50-500 and m is 25-30.)
본 발명에 따른 내열수지 조성물은 폴리페닐렌에테르의 특성을 유지하되 높은 내열성을 가질 수 있으며, 우수한 인장강도, 신율, 굴곡강도, 굴곡탄성율, 충격강도를 나타낸다.The heat-resistant resin composition according to the present invention maintains the characteristics of polyphenylene ether, but can have high heat resistance, and exhibits excellent tensile strength, elongation, flexural strength, flexural modulus, and impact strength.
이하에서는 첨부된 도면을 참조하여 다양한 실시예를 보다 상세하게 설명한다. 본 명세서에 기재된 실시예는 다양하게 변형될 수 있다. 특정한 실시예가 도면에서 묘사되고 상세한 설명에서 자세하게 설명될 수 있다. 그러나 첨부된 도면에 개시된 특정한 실시 예는 다양한 실시예를 쉽게 이해하도록 하기 위한 것일 뿐이다. 따라서 첨부된 도면에 개시된 특정 실시예에 의해 기술적 사상이 제한되는 것은 아니며, 발명의 사상 및 기술 범위에 포함되는 모든 균등물 또는 대체물을 포함하는 것으로 이해되어야 한다.Hereinafter, various embodiments will be described in more detail with reference to the accompanying drawings. The embodiments described in this specification may be modified in various ways. Certain embodiments may be depicted in the drawings and described in detail in the detailed description. However, specific embodiments disclosed in the accompanying drawings are only intended to facilitate understanding of various embodiments. Therefore, the technical idea is not limited by the specific embodiments disclosed in the accompanying drawings, and it should be understood to include all equivalents or substitutes included in the spirit and technical scope of the invention.
1차, 2차, 제1, 제2 등과 같이 서수를 포함하는 용어는 다양한 구성요소들을 설명하는데 사용될 수 있지만, 이러한 구성요소들은 상술한 용어에 의해 한정되지는 않는다. 상술한 용어는 하나의 구성요소를 다른 구성요소로부터 구별하는 목적으로만 사용된다.Terms including ordinal numbers such as primary, secondary, first, and second may be used to describe various elements, but these elements are not limited by the above-mentioned terms. The terminology described above is only used for the purpose of distinguishing one component from another.
본 명세서에서, '포함한다' 또는 '가지다' 등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다. 어떤 구성요소가 다른 구성요소에 '연결되어' 있다거나 '접속되어' 있다고 언급된 때에는, 그 다른 구성요소에 직접적으로 연결되어 있거나 또는 접속되어 있을 수도 있지만, 중간에 다른 구성요소가 존재할 수도 있다고 이해되어야 할 것이다. 반면에, 어떤 구성요소가 다른 구성요소에 '직접 연결되어' 있다거나 '직접 접속되어' 있다고 언급된 때에는, 중간에 다른 구성요소가 존재하지 않는 것으로 이해되어야 할 것이다.In this specification, terms such as 'comprise' or 'having' are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded. It is understood that when a component is referred to as being 'connected' or 'connected' to another component, it may be directly connected or connected to the other component, but other components may exist in the middle. It should be. On the other hand, when a component is referred to as being 'directly connected' or 'directly connected' to another component, it should be understood that no other component exists in the middle.
그 밖에도, 본 발명을 설명함에 있어서, 관련된 공지 기능 혹은 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우, 그에 대한 상세한 설명은 축약하거나 생략한다.In addition, in describing the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be abbreviated or omitted.
본 발명은the present invention
폴리페닐렌에테르(PPE) 수지, 영구대전방지제(IDP), 카본블랙 및 전도성 섬유 또는 유리섬유를 포함하는 내열수지 조성물을 제공한다.Provided is a heat-resistant resin composition comprising a polyphenylene ether (PPE) resin, a permanent antistatic agent (IDP), carbon black, and conductive fibers or glass fibers.
이하, 본 발명에 따른 내열수지 조성물에 대하여 상세히 설명한다.Hereinafter, the heat-resistant resin composition according to the present invention will be described in detail.
상기 폴리페닐렌에테르 수지의 예로는 폴리(2, 6-디메틸-1, 4-페닐렌)에테르, 폴리(2, 6-디에틸-1, 4-페닐렌)에테르, 폴리(2, 6-디프로필-1, 4-페닐렌)에테르, 폴리(2-메틸-6-에틸-1, 4-페닐렌)에테르, 폴리(2-메틸6-프로필-1, 4-페닐렌)에테르, 폴리(2-에틸-6-프로필-1, 4-페닐렌)에테르, 폴리(2, 6-디페닐-1, 4-페닐 렌)에테르, 폴리(2, 6-디메틸-1, 4-페닐렌)에테르와 폴리(2, 3, 6-트리메틸-1, 4-페닐렌)에테르와의 공중 합체, 및 폴리(2, 6-디메틸-1, 4-페닐렌)에테르와 폴리(2, 3, 6-트리메틸-1, 4-페닐렌)에테르와의 공중합체가 있다. 이중에서 폴리(2, 6-디메틸-1, 4-페닐렌)에테르와 폴리(2, 3, 6-트리메틸-1, 4-페닐렌)에테르 와의 공중합체, 및 폴리(2, 6-디메틸-1, 4-페닐렌)에테르가 바람직하며, 폴리(2, 6-디메틸-1, 4-페닐렌)에 테르가 더 바람직하다. Examples of the polyphenylene ether resin include poly(2,6-dimethyl-1,4-phenylene) ether, poly(2,6-diethyl-1,4-phenylene) ether, poly(2,6- Dipropyl-1,4-phenylene) ether, poly(2-methyl-6-ethyl-1,4-phenylene) ether, poly(2-methyl6-propyl-1,4-phenylene) ether, poly (2-ethyl-6-propyl-1, 4-phenylene) ether, poly(2, 6-diphenyl-1, 4-phenylene) ether, poly(2, 6-dimethyl-1, 4-phenylene) ) copolymers of ether with poly(2,3,6-trimethyl-1,4-phenylene)ether, and poly(2,6-dimethyl-1,4-phenylene)ether with poly(2,3, There are copolymers with 6-trimethyl-1,4-phenylene) ether. Among them, copolymers of poly(2,6-dimethyl-1,4-phenylene) ether and poly(2,3,6-trimethyl-1,4-phenylene) ether, and poly(2,6-dimethyl- 1,4-phenylene)ether is preferred, and poly(2,6-dimethyl-1,4-phenylene)ether is more preferred.
상기 영구대전방지제는 폴리에테르이미드, 폴리에테르이미드아미드, 폴리에테르에스테르아미드계 대전방지제 등을 사용할 수 있으며, 바람직하게는 폴리에테르이미드계 영구대전방지제를 적용한다.As the permanent antistatic agent, polyetherimide, polyetherimideamide, polyetheresteramide-based antistatic agent, etc. may be used, and polyetherimide-based permanent antistatic agent is preferably applied.
또한, 상기 내열수지 조성물은 폴리페닐렌에테르(poly(phenylene ether), PPE) 수지 38-42 중량부, 폴리아미드(polyamide, PA) 수지 13-17 중량부, 하기 화학식 1로 표시되는 고분자 수지 13-17 중량부, 영구대전방지제(inherently dissipative polymer, IDP) 13-17 중량부, 난연제 3-7 중량부, 카본블랙 3-7 중량부 및 전도성 섬유 3-7 중량부를 포함하는 것이 바람직하고, 폴리페닐렌에테르(poly(phenylene ether), PPE) 수지 39-41 중량부, 폴리아미드(polyamide, PA) 수지 14-16 중량부, 하기 화학식 1로 표시되는 고분자 수지 14-16 중량부, 영구대전방지제(inherently dissipative polymer, IDP) 14-16 중량부, 난연제 4-6 중량부, 카본블랙 4-6 중량부 및 전도성 섬유 4-6 중량부를 포함하는 것이 더욱 바람직하다.In addition, the heat-resistant resin composition includes 38-42 parts by weight of a poly(phenylene ether) (PPE) resin, 13-17 parts by weight of a polyamide (PA) resin, and a polymer resin 13 represented by Formula 1 below. -17 parts by weight, 13-17 parts by weight of an inherently dissipative polymer (IDP), 3-7 parts by weight of a flame retardant, 3-7 parts by weight of carbon black, and 3-7 parts by weight of conductive fibers are preferably included, and poly 39-41 parts by weight of phenylene ether (poly (phenylene ether), PPE) resin, 14-16 parts by weight of polyamide (PA) resin, 14-16 parts by weight of a polymer resin represented by Formula 1 below, permanent antistatic agent (inherently dissipative polymer, IDP) 14-16 parts by weight, flame retardant 4-6 parts by weight, carbon black 4-6 parts by weight, and conductive fibers 4-6 parts by weight are more preferably included.
상기 폴리아미드(polyamide, PA) 수지는 폴리아미드 6, 폴리아미드 66, 폴리아미드 46, 폴리아미드 11, 폴리아미드 12, 폴리아미드 610, 폴리아미드 612, 폴리아미드 6/66, 폴리아미드 6/612, 폴리아미드 MXD6, 폴리아미드 6/MXD6, 폴리아미드 66/MXD6, 폴리아미드 6T, 폴리아미드 6I, 폴리아미드 6/6T, 폴리아미드 6/6I, 폴리아미드 66/6T, 폴리아미드 66/6I, 폴리아미드 6/6T/6I, 폴리아미드 66/6T/6I, 폴리아미드 9T, 폴리아미드 9I, 폴리아미드 6/9T, 폴리아미드 6/9I, 폴리아미드 66/9T, 폴리아미드 6/12/9T, 폴리아미드 66/12/9T, 폴리아미드6/12/9I 및 폴리아미드 66/12/6I 중 1종 이상을 적용할 수 있으며, 상기 폴리아미드 수지를 적용하여 가격 경쟁력, 가공성(사출성, 압출성 등)을 향상시킬 수 있다.The polyamide (PA) resin is polyamide 6, polyamide 66, polyamide 46, polyamide 11, polyamide 12, polyamide 610, polyamide 612, polyamide 6/66, polyamide 6/612, Polyamide MXD6, Polyamide 6/MXD6, Polyamide 66/MXD6, Polyamide 6T, Polyamide 6I, Polyamide 6/6T, Polyamide 6/6I, Polyamide 66/6T, Polyamide 66/6I, Polyamide 6/6T/6I, Polyamide 66/6T/6I, Polyamide 9T, Polyamide 9I, Polyamide 6/9T, Polyamide 6/9I, Polyamide 66/9T, Polyamide 6/12/9T, Polyamide At least one of 66/12/9T, polyamide 6/12/9I, and polyamide 66/12/6I can be applied, and by applying the polyamide resin, price competitiveness and processability (injection, extrusion, etc.) can improve
<화학식 1><Formula 1>
(상기 화학식 1에서, n은 50-500이고, m은 25-30이다.)(In Formula 1, n is 50-500 and m is 25-30.)
상기 화학식 1로 표시되는 고분자 수지는 방향족 폴리아미드 단위와 폴리페닐렌에테르 단위로 이루어지고, 증량제로 도데칸디올을 이용하여 중축합 반응을 통해 제조될 수 있다. 상기 고분자 수지는 165-175℃의 유리전이온도(Tg)와 265-275℃의 용융온도(Tm)을 가지는 소재로, 이를 이용하여 내열수지 조성물을 제조함으로써 높은 내열성과 기계적 물성을 동시에 확보할 수 있다.The polymer resin represented by Chemical Formula 1 is composed of an aromatic polyamide unit and a polyphenylene ether unit, and may be prepared through a polycondensation reaction using dodecanediol as an extender. The polymer resin is a material having a glass transition temperature (T g ) of 165-175 ° C and a melting temperature (T m ) of 265-275 ° C, and high heat resistance and mechanical properties are secured at the same time by preparing a heat-resistant resin composition using the same. can do.
상기 난연제는 무기계 난연제, 인계 난연제, 할로겐 계난연제, 중금속계 난연제, 멜라민계 난연제 및 실리콘계 난연제 등을 사용할 수 있고, 일례로, 마그네슘 디하이드록사이드(magnesium dihydroxide, MDH), 멜라민(melamine), 데카브로모 디페닐 에탄(decabromo diphenyl ethane, DBPE), 삼산화안티몬(Sb2O3, antimony trioxide, ATO), 비스페놀-A 비스디페닐포스페이트(bisphenol-A bis diphenyl phosphate, BDP) 및 레졸시놀 비스디페닐포스페이트(resorcinol bis diphenyl phosphate, RDP) 등을 사용할 수 있다. 바람직하게는, 삼산화안티몬(Sb2O3, antimony trioxide, ATO)을 적용하되, 실란 표면처리된 삼산화안티몬을 적용하는 것이 더욱 바람직하다. 상기 실란 표면처리된 삼산화안티몬은 난연제로 적용되어 내열성 및 난연성을 향상시킨다. The flame retardant may include inorganic flame retardants, phosphorus-based flame retardants, halogen-based flame retardants, heavy metal-based flame retardants, melamine-based flame retardants, and silicon-based flame retardants. For example, magnesium dihydroxide (MDH), melamine, decabromo diphenyl ethane (DBPE), antimony trioxide (Sb 2 O 3 , antimony trioxide (ATO)), bisphenol-A bis diphenyl phosphate (BDP) and resorcinol bisdi Phenyl phosphate (resorcinol bis diphenyl phosphate, RDP) and the like can be used. Preferably, antimony trioxide (Sb 2 O 3 , antimony trioxide, ATO) is applied, but it is more preferable to apply silane surface-treated antimony trioxide. The silane surface-treated antimony trioxide is applied as a flame retardant to improve heat resistance and flame retardancy.
상기 전도성 섬유는 탄소섬유 및 상기 탄소섬유 표면에 코팅된 코팅층을 포함하는 것이 바람직하다.The conductive fiber preferably includes carbon fiber and a coating layer coated on the surface of the carbon fiber.
상기 탄소섬유는, 폴리아크릴로나이트릴(PAN) 섬유를 질소분위기에서 1-2℃/분의 승온속도로 300-400℃의 온도까지 승온시킨 후 2-4시간 동안 1차 열처리하여 탄소섬유 전구체를 제조하는 단계; 상기 탄소섬유 전구체를 질소분위기에서 4-6℃/분의 승온속도로 700-800℃의 온도까지 승온시킨 후 0.5-2시간 동안 2차 열처리하여 탄소섬유를 제조하는 단계; 상기 탄소섬유를 이용하여 산소플라즈마 처리하는 단계; 카르복시기를 포함하는 그래핀 산화물과 10 중량%의 황산 수용액을 준비하여, 상기 황산 수용액 100 중량부에 대하여 상기 그래핀 산화물을 1 중량부 포함하는 분산액을 제조한 후, 상기 분산액에 산소플라즈마 처리된 탄소섬유를 침지한 후, 40-60℃의 온도에서 6-10시간 동안 반응시켜 산소플라즈마 처리된 탄소섬유를 그래핀 산화물로 코팅하는 단계; 및 그래핀 산화물이 코팅된 탄소섬유를 물 및 에탄올을 1:1의 중량비율로 포함하는 세정제를 이용하여 세척하는 단계;를 수행하여 제조된 것을 사용한다.The carbon fiber is a carbon fiber precursor by heating polyacrylonitrile (PAN) fibers to a temperature of 300-400 ° C. at a heating rate of 1-2 ° C./min in a nitrogen atmosphere and then performing primary heat treatment for 2-4 hours. Preparing; Preparing a carbon fiber by heating the carbon fiber precursor to a temperature of 700-800° C. at a heating rate of 4-6° C./min in a nitrogen atmosphere and then subjecting the carbon fiber precursor to a secondary heat treatment for 0.5-2 hours; Oxygen plasma treatment using the carbon fiber; A dispersion containing 1 part by weight of graphene oxide based on 100 parts by weight of the aqueous sulfuric acid solution was prepared by preparing a graphene oxide containing a carboxy group and a 10% by weight sulfuric acid aqueous solution, and then the dispersion was treated with oxygen plasma. After immersing the fibers, reacting at a temperature of 40-60 ° C. for 6-10 hours to coat the carbon fibers treated with oxygen plasma with graphene oxide; and washing the graphene oxide-coated carbon fiber with a detergent containing water and ethanol in a weight ratio of 1:1.
먼저, 폴리아크릴로나이트릴(PAN) 섬유를 질소분위기에서 1-2℃/분의 승온속도로 300-400℃의 온도까지 승온시킨 후 2-4시간 동안 1차 열처리하여 탄소섬유 전구체를 제조한다. 바람직하게는 1-2℃/분의 승온속도로 330-370℃의 온도까지 승온시킨 후 2.5-3.5시간 동안 1차 열처리한다.First, a polyacrylonitrile (PAN) fiber is heated to a temperature of 300-400 ° C at a heating rate of 1-2 ° C / min in a nitrogen atmosphere, and then subjected to a primary heat treatment for 2-4 hours to prepare a carbon fiber precursor . Preferably, the temperature is raised to a temperature of 330-370 ° C at a heating rate of 1-2 ° C / min, and then the first heat treatment is performed for 2.5-3.5 hours.
다음, 상기 탄소섬유 전구체를 질소분위기에서 4-6℃/분의 승온속도로 700-800℃의 온도까지 승온시킨 후 0.5-2시간 동안 2차 열처리하여 탄소섬유를 제조한다. 바람직하게는 5℃/분의 승온속도로 730-770℃의 온도까지 승온시킨 후 0.8-1.2시간 동안 1차 열처리한다.Next, the carbon fiber precursor is heated up to a temperature of 700-800° C. at a heating rate of 4-6° C./min in a nitrogen atmosphere and subjected to secondary heat treatment for 0.5-2 hours to prepare carbon fibers. Preferably, the temperature is raised to a temperature of 730-770 ° C at a heating rate of 5 ° C / min, and then the first heat treatment is performed for 0.8-1.2 hours.
다음, 상기 탄소섬유를 이용하여 산소플라즈마 처리한다. 상기 산소플라즈마 처리를 통해 탄소섬유 표면에 균일한 작용기를 도입할 수 있다. 이는 후단에서 그래핀 산화물을 용이하게 코팅하기 위한 전처리 공정이다.Next, an oxygen plasma treatment is performed using the carbon fiber. A uniform functional group can be introduced to the carbon fiber surface through the oxygen plasma treatment. This is a pretreatment process for easily coating graphene oxide at a later stage.
다음, 카르복시기를 포함하는 그래핀 산화물과 10 중량%의 황산 수용액을 준비하여, 상기 황산 수용액 100 중량부에 대하여 상기 그래핀 산화물을 1 중량부 포함하는 분산액을 제조한 후, 상기 분산액에 산소플라즈마 처리된 탄소섬유를 침지한 후, 40-60℃의 온도에서 6-10시간 동안 반응시켜 산소플라즈마 처리된 탄소섬유를 그래핀 산화물로 코팅한다.Next, a dispersion containing 1 part by weight of the graphene oxide based on 100 parts by weight of the aqueous sulfuric acid solution is prepared by preparing graphene oxide containing a carboxyl group and a 10% sulfuric acid aqueous solution, and then treating the dispersion with oxygen plasma. After immersing the carbon fiber, the carbon fiber treated with oxygen plasma is coated with graphene oxide by reacting at a temperature of 40-60 ° C. for 6-10 hours.
산소플라즈마 처리된 탄소섬유는 히드록시기 등의 작용기를 포함하고 있기 때문에, 그래핀 산화물에 포함된 카르복시기와 탈수축합반응하기에 용이하다.Since the carbon fiber treated with oxygen plasma contains a functional group such as a hydroxy group, it is easy to undergo a dehydration condensation reaction with a carboxyl group included in graphene oxide.
또한, 상기 그래핀 산화물에 포함된 카르복시기는 산 촉매 존재 하에서 탄소섬유에 포함되어 있는 히드록시기와 반응하여 새로운 공유결합을 형성할 수 있다.In addition, the carboxyl group included in the graphene oxide may react with the hydroxyl group included in the carbon fiber in the presence of an acid catalyst to form a new covalent bond.
탄소섬유의 표면에 그래핀 산화물이 코팅된 후에도, 그래핀 산화물에 포함된 적어도 일부의 카르복시기는 반응에 참여하지 않은 상태로 남아있게 된다. 또한, 대기 조건에서 상술한 작용기들은 산소분자와 반응하여 쉽사리 라디칼화 되며 활성 산소종을 생성한다. 그 결과, 섬유의 표면에서 그램 음성 세균 혹은 그램 양성 세균이 번식하는 것을 지연시키거나 방지할 수 있다.Even after the graphene oxide is coated on the surface of the carbon fiber, at least some carboxy groups included in the graphene oxide remain in a state that does not participate in the reaction. In addition, the functional groups described above react with oxygen molecules in atmospheric conditions to easily become radicals and generate active oxygen species. As a result, the propagation of gram-negative bacteria or gram-positive bacteria on the surface of the fiber can be delayed or prevented.
이와 같은 반응은 달리 트랜스-에스테리피케이션(trans-esterification) 반응이라 칭해질 수 있으며, 에스테르기 또는 히드록시기가 교환되는 반응에 해당한다. 따라서, 그래핀 산화물의 코팅은 산 촉매 조건에서 섬유의 표면에 위치한 작용기 및 그래핀 산화물의 작용기 사이의 트랜스-에스테리피케이션(trans-esterification) 반응에 의하여 수행된 것이 바람직하다.Such a reaction may otherwise be referred to as a trans-esterification reaction, and corresponds to a reaction in which an ester group or a hydroxy group is exchanged. Therefore, the coating of graphene oxide is preferably performed by a trans-esterification reaction between a functional group located on the surface of the fiber and a functional group of graphene oxide under an acid catalyst condition.
전술한 바와 같은 트랜스-에스테리피케이션은 그래핀 산화물 분산액에 섬유를 침지하고 촉매인 산을 첨가함으로써 수행될 수 있다. 이 때, 산이란 루이스 산(Lewis acid)를 의미한다. 루이스 산은 전자를 공여받을 수 있는 종으로서, 황산, 질산, 염산 외에도 금속염을 포함하는 개념이며, 아연 양이온, 이리듐 양이온 등을 포함한다.Trans-esterification as described above can be performed by immersing the fiber in a graphene oxide dispersion and adding an acid as a catalyst. At this time, the acid means a Lewis acid (Lewis acid). A Lewis acid is a species capable of donating electrons, and is a concept including metal salts in addition to sulfuric acid, nitric acid, and hydrochloric acid, and includes zinc cations, iridium cations, and the like.
또한, 상기 트랜스-에스테리피케이션은 40-60℃의 온도조건에서 6-10시간 동안 수행되는 것이 바람직하다. 온도조건이 40℃ 미만이거나 반응시간이 6시간 미만이 경우에는 트랜스-에스테리피케이션이 충분히 진행되지 아니할 가능성이 상당하고, 온도조건이 60℃를 초과하거나 반응시간이 10시간을 초과하는 경우에는 섬유의 훼손이 문제될 수 있다.In addition, the trans-esterification is preferably performed at a temperature of 40-60°C for 6-10 hours. If the temperature condition is less than 40 ℃ or the reaction time is less than 6 hours, there is a significant possibility that the trans-esterification will not proceed sufficiently, and if the temperature condition exceeds 60 ℃ or the reaction time exceeds 10 hours, the fiber damage can be a problem.
다음, 그래핀 산화물이 코팅된 탄소섬유를 물 및 에탄올을 1:1의 중량비율로 포함하는 세정제를 이용하여 세척한다.Next, the carbon fibers coated with graphene oxide are washed with a detergent containing water and ethanol in a weight ratio of 1:1.
상기 탄소섬유로 그래핀 산화물이 코팅된 탄소섬유를 적용하여 전도성 섬유로서 전도성, 내구성 등의 성능이 더욱 우수하다.By applying carbon fiber coated with graphene oxide as the carbon fiber, performance such as conductivity and durability is more excellent as a conductive fiber.
상기 코팅층은 하기 화학식 2로 표시되는 폴리실록산-실라잔 공중합체 23-27 중량부, 3-에틸메틸아미노-3-(트리메틸실록시)-1,1,1,5,5,5-헥사메틸트리실록산 3-7 중량부, 데카메틸싸이클로펜타실란(Decamethyl cyclopentasilane) 1-5 중량부 및 디부틸에테르 65-69 중량부를 포함하는 코팅층 형성용 조성물로부터 형성된 것이 바람직하고, 하기 화학식 2로 표시되는 폴리실록산-실라잔 공중합체 24-26 중량부, 3-에틸메틸아미노-3-(트리메틸실록시)-1,1,1,5,5,5-헥사메틸트리실록산 4-6 중량부, 데카메틸싸이클로펜타실란(Decamethyl cyclopentasilane) 2-4 중량부 및 디부틸에테르 66-68 중량부를 포함하는 코팅층 형성용 조성물로부터 형성된 것이 더욱 바람직하다.The coating layer contains 23-27 parts by weight of a polysiloxane-silazane copolymer represented by Formula 2 below, 3-ethylmethylamino-3-(trimethylsiloxy)-1,1,1,5,5,5-hexamethyltri It is preferably formed from a composition for forming a coating layer containing 3-7 parts by weight of siloxane, 1-5 parts by weight of decamethyl cyclopentasilane and 65-69 parts by weight of dibutyl ether, polysiloxane represented by the following formula (2) Silazane copolymer 24-26 parts by weight, 3-ethylmethylamino-3-(trimethylsiloxy)-1,1,1,5,5,5-hexamethyltrisiloxane 4-6 parts by weight, decamethylcyclopenta It is more preferably formed from a composition for forming a coating layer containing 2-4 parts by weight of silane (Decamethyl cyclopentasilane) and 66-68 parts by weight of dibutyl ether.
<화학식 2><Formula 2>
(상기 화학식 2에서 a는 1-20이고, b는 1-20이고, p는 1-20이고, q는 1-5이고, r은 1-10이다.)(In Formula 2, a is 1-20, b is 1-20, p is 1-20, q is 1-5, and r is 1-10.)
상기 코팅층 형성용 조성물은 상기 화학식 2로 표시되는 폴리실록산-실라잔 공중합체를 포함한다. 상기 코팅층 형성용 조성물로 폴리실록산-실라잔 공중합체를 포함하여 코팅층이 용이하게 형성되며 내용매성, 기계적 물성이 우수하다. 상기 화학식 2에서 a는 5-15이고, b는 5-15이고, p는 5-15이고, q는 2-4이고, r은 3-7인 것이 더욱 바람직하다.The composition for forming the coating layer includes the polysiloxane-silazane copolymer represented by Chemical Formula 2 above. The composition for forming the coating layer includes a polysiloxane-silazane copolymer to easily form a coating layer and has excellent solvent resistance and mechanical properties. In Formula 2, a is 5-15, b is 5-15, p is 5-15, q is 2-4, and r is more preferably 3-7.
상기 코팅층 형성용 조성물은 3-에틸메틸아미노-3-(트리메틸실록시)-1,1,1,5,5,5-헥사메틸트리실록산 4-6 중량부를 포함하는 것이 더욱 바람직하다. 상기 코팅층 형성용 조성물로 상기 3-에틸메틸아미노-3-(트리메틸실록시)-1,1,1,5,5,5-헥사메틸트리실록산을 포함하여 코팅층이 용이하게 형성되며 수축률, 밀착성이 우수하다. The composition for forming the coating layer more preferably includes 4-6 parts by weight of 3-ethylmethylamino-3-(trimethylsiloxy)-1,1,1,5,5,5-hexamethyltrisiloxane. The coating layer is easily formed by including the 3-ethylmethylamino-3-(trimethylsiloxy)-1,1,1,5,5,5-hexamethyltrisiloxane as the composition for forming the coating layer, and the shrinkage rate and adhesion are excellent. great.
상기 코팅층 형성용 조성물은 데카메틸싸이클로펜타실란(Decamethyl cyclopentasilane) 2-4 중량부를 포함하는 것이 더욱 바람직하다. 상기 코팅층 형성용 조성물로 상기 데카메틸싸이클로펜타실란을 포함하여 코팅층이 용이하게 형성되며 수축률, 밀착성이 우수하다.The composition for forming the coating layer more preferably includes 2-4 parts by weight of decamethyl cyclopentasilane. The coating layer is easily formed by including the decamethylcyclopentasilane as the composition for forming the coating layer, and the shrinkage rate and adhesion are excellent.
또한, 본 발명은In addition, the present invention
폴리페닐렌에테르(poly(phenylene ether), PPE) 수지, 폴리아미드(polyamide, PA) 수지, 하기 화학식 1로 표시되는 고분자 수지, 영구대전방지제(inherently dissipative polymer, IDP), 난연제, 카본블랙 및 전도성 섬유를 혼합하고, 압출기로 압출하여 펠릿으로 제조하는 단계; 및Poly(phenylene ether) (PPE) resin, polyamide (PA) resin, polymer resin represented by Formula 1 below, inherently dissipative polymer (IDP), flame retardant, carbon black and conductivity Mixing the fibers and extruding them with an extruder to form pellets; and
상기 펠릿을 건조한 후, 사출기로 사출하는 단계;를 포함하고,After drying the pellets, injecting them into an extruder; Including,
상기 난연제는 마그네슘 디하이드록사이드(magnesium dihydroxide, MDH), 멜라민(melamine), 데카브로모 디페닐 에탄(decabromo diphenyl ethane, DBPE), 삼산화안티몬(Sb2O3, antimony trioxide, ATO), 비스페놀-A 비스디페닐포스페이트(bisphenol-A bis diphenyl phosphate, BDP) 및 레졸시놀 비스디페닐포스페이트(resorcinol bis diphenyl phosphate, RDP)로 이루어지는 군으로부터 선택되는 1종 이상인 것을 특징으로 하는 내열수지 조성물을 포함하는 제품의 제조방법을 제공한다.The flame retardant is magnesium dihydroxide (MDH), melamine, decabromo diphenyl ethane (DBPE), antimony trioxide (Sb 2 O 3 , antimony trioxide, ATO), bisphenol- A heat-resistant resin composition comprising at least one selected from the group consisting of bisphenol-A bis diphenyl phosphate (BDP) and resorcinol bis diphenyl phosphate (RDP) Provides a manufacturing method for the product.
<화학식 1><Formula 1>
(상기 화학식 1에서, n은 50-500이고, m은 25-30이다.)(In Formula 1, n is 50-500 and m is 25-30.)
이하, 본 발명을 하기의 실시예에 의해 보다 상세하게 설명한다.Hereinafter, the present invention will be described in more detail by the following examples.
단, 하기 실시예는 본 발명의 내용을 예시하는 것일 뿐 발명의 범위가 실시예 및 실험예에 의해 한정되는 것은 아니다.However, the following examples are merely illustrative of the content of the present invention, but the scope of the invention is not limited by the examples and experimental examples.
<제조예 1> 전도성 섬유의 제조<Preparation Example 1> Preparation of conductive fibers
폴리아크릴로나이트릴(PAN) 섬유를 질소분위기에서 1℃/분의 승온속도로 350℃의 온도까지 승온시킨 후 3시간 동안 1차 열처리하여 탄소섬유 전구체를 제조하였다. 상기 탄소섬유 전구체를 질소분위기에서 5℃/분의 승온속도로 750℃의 온도까지 승온시킨 후 1시간 동안 열처리하여 탄소섬유를 제조하였다. Polyacrylonitrile (PAN) fibers were heated up to 350° C. at a heating rate of 1° C./min in a nitrogen atmosphere and then subjected to primary heat treatment for 3 hours to prepare a carbon fiber precursor. The carbon fiber precursor was heated to a temperature of 750° C. at a heating rate of 5° C./min in a nitrogen atmosphere and then heat-treated for 1 hour to prepare a carbon fiber.
상기 탄소섬유 표면에 균일한 작용기를 도입하기 위하여 플라즈마 장치를 이용하여 산소플라즈마 처리된 탄소섬유를 제조하였다.Oxygen plasma-treated carbon fibers were prepared using a plasma device in order to introduce uniform functional groups to the surface of the carbon fibers.
상기 플라즈마 장치는 감압 펌프, 알루미늄 합금 반응기, 가스 유량 조절기, 전원 공급기 등으로 구성되어 있으며, 상기 탄소섬유 1 g을 니켈 보트에 넣은 후 산소플라즈마 처리를 진행하였다. 감압 펌프를 이용하여 플라즈마 반응기 내부를 진공 상태로 전환하였다. 이후, 산소 가스 주입 유량을 40 sccm으로 하여 플라즈마 처리를 실시하였다. 이때 그 반응시간은 10분, 전력은 50 W, 주파수는 50 kHz로 수행하였다.The plasma device is composed of a pressure reducing pump, an aluminum alloy reactor, a gas flow controller, a power supply, and the like, and after putting 1 g of the carbon fiber into a nickel boat, oxygen plasma treatment was performed. The inside of the plasma reactor was converted to a vacuum state using a vacuum pump. Thereafter, plasma treatment was performed with an oxygen gas injection flow rate of 40 sccm. At this time, the reaction time was 10 minutes, the power was 50 W, and the frequency was 50 kHz.
카르복시기를 포함하는 그래핀 산화물과 10 중량%의 황산 수용액을 준비하여, 상기 황산 수용액 100 중량부에 대하여 상기 그래핀 산화물을 1 중량부 포함하는 분산액을 제조하였다. 상기 분산액에 상기 산소플라즈마 처리된 탄소섬유를 침지한 후, 50℃의 온도에서 8시간 동안 반응시켜 산소플라즈마 처리된 탄소섬유의 표면에 위치한 작용기 및 그래핀 산화물의 작용기 사이의 트랜스-에스테리피케이션(trans-esterification) 반응을 유도하여 산소플라즈마 처리된 탄소섬유를 그래핀 산화물로 코팅하였다. 이후, 그래핀 산화물이 코팅된 탄소섬유를 물 및 에탄올을 1:1의 중량비율로 포함하는 세정제를 이용하여 세척하여 그래핀 산화물이 코팅된 탄소섬유를 제조하였다.A dispersion containing 1 part by weight of the graphene oxide based on 100 parts by weight of the aqueous sulfuric acid solution was prepared by preparing graphene oxide containing a carboxyl group and a 10% by weight aqueous solution of sulfuric acid. After immersing the oxygen plasma-treated carbon fiber in the dispersion, the reaction is performed at a temperature of 50 ° C. for 8 hours to cause trans-esterification between the functional group located on the surface of the oxygen plasma-treated carbon fiber and the functional group of graphene oxide ( A carbon fiber treated with oxygen plasma was coated with graphene oxide by inducing a trans-esterification reaction. Thereafter, the graphene oxide-coated carbon fibers were washed with a detergent containing water and ethanol in a weight ratio of 1:1 to prepare graphene oxide-coated carbon fibers.
상기 화학식 2로 표시되는 폴리실록산-실라잔 공중합체 25 중량부, 3-에틸메틸아미노-3-(트리메틸실록시)-1,1,1,5,5,5-헥사메틸트리실록산 5 중량부, 데카메틸싸이클로펜타실란(Decamethyl cyclopentasilane) 3 중량부 및 디부틸에테르 67 중량부를 혼합하여 코팅층 형성용 조성물을 제조하였다. 화학식 2에서 n은 10이고, m은 10이고, p는 10이고, q는 3이고, r은 5이다.25 parts by weight of the polysiloxane-silazane copolymer represented by Formula 2, 5 parts by weight of 3-ethylmethylamino-3-(trimethylsiloxy)-1,1,1,5,5,5-hexamethyltrisiloxane, A composition for forming a coating layer was prepared by mixing 3 parts by weight of decamethyl cyclopentasilane and 67 parts by weight of dibutyl ether. In Formula 2, n is 10, m is 10, p is 10, q is 3, and r is 5.
상기 그래핀 산화물이 코팅된 탄소섬유 표면에 상기 코팅층 형성용 조성물을 도포한 후, 90℃의 온도에서 5분 동안 열처리하여 전도성 섬유를 제조하였다.After applying the composition for forming a coating layer on the surface of the graphene oxide-coated carbon fiber, heat treatment was performed at a temperature of 90° C. for 5 minutes to prepare a conductive fiber.
<실시예 1-2 및 비교예 1-2><Example 1-2 and Comparative Example 1-2>
하기 표 1의 각 성분을 균일하게 분산시키기 위하여, 먼저 폴리페닐렌에테르 수지(PPE, Bluestar사), 폴리아미드 수지(Vydyne, Ascend사, 폴리아미드 66), 상기 화학식 1로 표시되는 고분자 수지(화학식 1에서 a는 100이고, b는 28), 영구대전방지제로 폴리에테르이미드, 난연제로 실란 표면처리된 삼산화안티몬(Sb2O3), 카본블랙, 탄소섬유 또는 상기 제조예 1에서 제조된 전도성 섬유를 혼합하고, 압출기로 압출(압출온도 310-330℃, 스크류 회전수 200-250 rpm)압출하여 펠릿으로 제조하였다. 상기 펠릿을 90℃에서 4시간 제습 건조한 후, 사출기에서 성형온도 310-330℃, 금형온도 150℃의 조건으로 사출하여 시편을 제조하였다.In order to uniformly disperse each component of Table 1 below, first, a polyphenylene ether resin (PPE, Bluestar), a polyamide resin (Vydyne, Ascend, polyamide 66), a polymer resin represented by Formula 1 (Formula 1) In 1, a is 100 and b is 28), polyetherimide as a permanent antistatic agent, antimony trioxide (Sb 2 O 3 ) treated with silane as a flame retardant, carbon black, carbon fiber or the conductive fiber prepared in Preparation Example 1 above. were mixed and extruded with an extruder (extrusion temperature 310-330 ° C., screw rotation speed 200-250 rpm) to produce pellets. After dehumidifying and drying the pellets at 90 ° C. for 4 hours, specimens were prepared by injecting the pellets at a molding temperature of 310-330 ° C. and a mold temperature of 150 ° C.
<실험예 1> 기계적 물성 분석<Experimental Example 1> Analysis of mechanical properties
상기 실시예 1-2 및 비교예 1-2에서 제조된 시편에 대하여 하기의 시험방법으로 물성을 측정하고, 그 결과를 하기 표 2에 나타내었다.The physical properties of the specimens prepared in Example 1-2 and Comparative Example 1-2 were measured by the following test method, and the results are shown in Table 2 below.
- 인장강도 및 신율 : ASTM D638 - Tensile strength and elongation: ASTM D638
- 굴곡강도, 굴곡탄성율 : ASTM D790- Flexural strength, flexural modulus: ASTM D790
- 아이조드 충격강도(1/4 및 1/8 노치) : ASTM D256 - Izod impact strength (1/4 and 1/8 notch): ASTM D256
(kg/cm2)tensile strength
(kg/cm 2 )
(%)elongation
(%)
(kg/cm2)flexural strength
(kg/cm 2 )
(kg/cm2)flexural modulus
(kg/cm 2 )
충격강도
(kgf·cm/cm)Izod
impact strength
(kgf cm/cm)
상기 표 1에 나타낸 바와 같이, 본 발명에 따른 내열수지 조성물의 경우 우수한 인장강도, 굴곡강도, 굴곡탄성율, 충격강도 등의 기계적 물성을 나타냄을 확인할 수 있었다. 특히 전도성 섬유로 제조예 1에서 제조된 전도성 섬유을 사용한 경우 매우 우수한 기계적 물성을 나타낸다.As shown in Table 1, it was confirmed that the heat-resistant resin composition according to the present invention exhibits excellent mechanical properties such as tensile strength, flexural strength, flexural modulus, and impact strength. In particular, when the conductive fiber prepared in Preparation Example 1 is used as a conductive fiber, it exhibits very good mechanical properties.
<실험예 2> 내열성 분석<Experimental Example 2> Heat resistance analysis
상기 실시예 1-2 및 비교예 1-2에서 제조된 조성물 또는 시편에 대하여 하기의 시험방법으로 흡습률, 저하중 열변형온도, 국소가열시 열변형온도를 측정하고, 그 결과를 하기 표 3에 나타내었다.For the compositions or specimens prepared in Example 1-2 and Comparative Example 1-2, the moisture absorption, low-load heat deflection temperature, and heat deflection temperature during local heating were measured by the following test methods, and the results are shown in Table 3 below. shown in
저하중 열변형 온도(heat deformation temperature ; HDT)는 각각의 수지 조성물을 170톤 전동식 사출기를 이용하여, 300℃의 사출온도 및 100℃의 금형 온도 조건에서 사출 성형하여 ASTM D648 기준, Edgewise, 6.4mm*128mm 시편에 대해, 하중 4.6kgf 조건에서 저하중 열변형온도를 측정하였다.The low load heat deformation temperature (HDT) was measured by injection molding each resin composition using a 170-ton electric injection molding machine at an injection temperature of 300 ° C and a mold temperature of 100 ° C. ASTM D648 standard, Edgewise, 6.4 mm * For the 128mm specimen, the low-load heat deflection temperature was measured under the condition of a load of 4.6kgf.
국소 가열시 열변형온도는 상기 저하중 열변현온도와 동일한 실험방법을 사용하였지만, 가열부분을 직경 10mm의 화염을 형성하는 토치를 이용하여 실험하였다.The heat distortion temperature at the time of local heating was tested using the same experimental method as the low-load heat distortion temperature, but the heating part was tested using a torch that forms a flame with a diameter of 10 mm.
흡습률은 상기와 동일한 방법으로 사출 성형하여 ISO62 기준, 시편 크기 60mm*60mm*2mm (가로*세로*두께), 온도 23℃, 상대습도 50% 조건에서 흡습률을 측정하였다.The moisture absorption rate was measured by injection molding in the same manner as above under the ISO62 standard, specimen size 60mm * 60mm * 2mm (width * length * thickness), temperature 23 ℃, relative humidity 50% conditions.
상기 표 3에 나타난 바와 같이, 본 발명에 따른 내열수지 조성물의 경우 230℃ 이상의 저하중 HDT를 나타내는 것으로 나타났다. 특히 전도성 섬유로 제조예 1에서 제조된 전도성 섬유을 사용한 경우 그 저하중지수 뿐만 아니라 국소가열에도 높은 저하중 열변형온도를 보이는 것으로 나타나 국소가열을 동반하는 고온공정에도 사용될 수 있는 것으로 나타났다.As shown in Table 3, in the case of the heat-resistant resin composition according to the present invention, it was found to exhibit a low load HDT of 230 ° C or higher. In particular, when the conductive fiber prepared in Preparation Example 1 was used as a conductive fiber, it was found to show a high low load heat deflection temperature even under local heating as well as its low load index, indicating that it could be used in a high temperature process accompanied by local heating.
Claims (2)
상기 펠릿을 건조한 후, 사출기로 사출하는 단계;를 포함하고,
상기 난연제는 무기계 난연제, 인계 난연제, 할로겐 계난연제, 중금속계 난연제, 멜라민계 난연제 및 실리콘계 난연제로 이루어지는 군으로부터 선택되는 1종 이상인 것을 특징으로 하는 내열수지 조성물을 포함하는 제품의 제조방법:
<화학식 1>
(상기 화학식 1에서, n은 50-500이고, m은 25-30이다).Poly(phenylene ether) (PPE) resin, polyamide (PA) resin, polymer resin represented by Formula 1 below, inherently dissipative polymer (IDP), flame retardant, carbon black and conductivity Mixing the fibers and extruding them with an extruder to form pellets; and
After drying the pellets, injecting them into an extruder; Including,
The flame retardant is at least one selected from the group consisting of inorganic flame retardants, phosphorus-based flame retardants, halogen-based flame retardants, heavy metal-based flame retardants, melamine-based flame retardants and silicon-based flame retardants Manufacturing method of a product containing a heat-resistant resin composition:
<Formula 1>
(In Formula 1, n is 50-500 and m is 25-30).
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KR20130058983A (en) * | 2011-11-28 | 2013-06-05 | 롯데케미칼 주식회사 | Enhanced dimensional stability of modified polyphenylene ether/carbon fiber and manufacturing method the same |
KR20150058883A (en) * | 2013-11-21 | 2015-05-29 | 한국화학연구원 | polymer blend composition with highly electrical conductivity and method of manufacturing the same |
KR20160121383A (en) | 2015-04-10 | 2016-10-19 | 롯데첨단소재(주) | Electroconductive polyamide/polyphenylene ether resin composition and molded product for vehicle using the same |
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KR20130058983A (en) * | 2011-11-28 | 2013-06-05 | 롯데케미칼 주식회사 | Enhanced dimensional stability of modified polyphenylene ether/carbon fiber and manufacturing method the same |
KR20150058883A (en) * | 2013-11-21 | 2015-05-29 | 한국화학연구원 | polymer blend composition with highly electrical conductivity and method of manufacturing the same |
KR20160121383A (en) | 2015-04-10 | 2016-10-19 | 롯데첨단소재(주) | Electroconductive polyamide/polyphenylene ether resin composition and molded product for vehicle using the same |
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