KR102549927B1 - Method for forming adhesive layer of the copper foil surface-treated by click reaction - Google Patents
Method for forming adhesive layer of the copper foil surface-treated by click reaction Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
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- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
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- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/40—Introducing phosphorus atoms or phosphorus-containing groups
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
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Abstract
본 발명은 동박 표면의 접착층 형성방법에 관한 것으로, 더욱 구체적으로는 클릭 반응을 이용하여 동박 표면에 접착층을 형성하는 방법에 관한 것이다. 기존과 차별화된 신개념 접착소재에 관한 것으로서, 저조도 동박과 저유전 고분자 간의 낮은 접착성을 해결함과 동시에 유전손실률을 최소화시킬 수 있다.The present invention relates to a method of forming an adhesive layer on the surface of copper foil, and more particularly, to a method of forming an adhesive layer on the surface of copper foil using a click reaction. It is about a new concept adhesive material differentiated from the existing one, and it can solve the low adhesion between low-illuminance copper foil and low-dielectric polymer and at the same time minimize dielectric loss.
Description
본 발명은 동박 표면의 접착층 형성방법에 관한 것으로, 더욱 구체적으로는 클릭 반응을 이용하여 동박 표면에 접착층을 형성하는 방법에 관한 것이다.The present invention relates to a method of forming an adhesive layer on the surface of copper foil, and more particularly, to a method of forming an adhesive layer on the surface of copper foil using a click reaction.
기존 FCCL 접합기술은 동박층과 유전체의 접착력을 높이기 위해 접착제를 사용하는데, 구리 전도층의 표면에 거칠기를 주어서 접착제와의 밀착력을 증가시켜 접착력을 향상하는 데 중점을 두고 있음에도 불구하고 접착력이 낮으며, 표면의 조도가 높아짐에 따라 신호 전송 거리가 멀어져 전송손실이 커지는 문제가 있다. 또한, 접착제를 사용함에 따라 내열도 및 내습성에 대한 신뢰성의 문제와 유전손실 및 FCCL 자체의 두께가 증가하여 성능이 급격하게 떨어진다는 치명적인 문제가 발생하기 때문에 고주파 영역에 적용하기 어렵다.Existing FCCL bonding technology uses an adhesive to increase the adhesive strength between the copper foil layer and the dielectric. Although the focus is on improving the adhesive strength by increasing the adhesive strength by giving roughness to the surface of the copper conductive layer, the adhesive strength is low. However, as the surface roughness increases, the signal transmission distance increases, resulting in increased transmission loss. In addition, as the adhesive is used, it is difficult to apply it to the high frequency area because of the reliability problem of heat resistance and moisture resistance, dielectric loss, and the fatal problem that the thickness of FCCL itself increases and the performance rapidly deteriorates.
게다가 고주파 대응을 위해 FCCL 제조공정에서 동박의 표면 조도를 낮추는 기술이 중요한 비중을 차지하고 있으므로 저유전 고분자와의 접착력은 더욱 나빠질 가능성이 커지고 있어 이에 대한 접착기술의 개발이 저조도 구리 극박 소재 기반의 5G 대응 차세대 통신기술의 구현 가능성을 높이는 데 결정적인 역할을 할 수 있다.In addition, since the technology to lower the surface roughness of copper foil plays an important role in the FCCL manufacturing process to respond to high frequencies, the possibility of further deterioration of adhesion with low dielectric polymers is increasing. It can play a decisive role in increasing the possibility of implementing next-generation communication technologies.
이에 본 발명자들은 종래의 동박과 절연기재와의 접착력에 있어서의 문제점을 해결하기 위해, 동박으로부터 용출된 Cu를 촉매로 활용하기 위한 동박 표면에서의 Cu를 용출시킬 수 있는 반응 조건을 탐색하고, Cu 용출에 따른 동박 표면에서 in-situ 고분자 접착층 형성 기술을 개발하고 본 발명을 완성하였다.Therefore, in order to solve the problem of adhesion between the conventional copper foil and the insulating substrate, the present inventors explored reaction conditions capable of eluting Cu from the surface of the copper foil to utilize Cu eluted from the copper foil as a catalyst, and Cu The present invention was completed by developing a technology for forming an in-situ polymer adhesive layer on the surface of copper foil according to elution.
상기한 배경기술로서 설명된 사항들은 본 발명의 배경에 대한 이해증진을 위한 것일 뿐, 이 기술분야에서 통상의 지식을 가진 자에게 이미 알려진 종래기술에 해당함을 인정하는 것으로 받아들여져서는 안 될 것이다.The matters described as the above background art are only for improving understanding of the background of the present invention, and should not be taken as an admission that they correspond to prior art already known to those skilled in the art.
상기한 종래 기술의 문제점을 해결하기 위하여, 본 발명은 클릭 반응을 이용하여 동박 표면에 접착층을 형성하는 방법을 제공하는 것을 목적으로 한다.In order to solve the problems of the prior art, an object of the present invention is to provide a method of forming an adhesive layer on the surface of copper foil using a click reaction.
또한, 본 발명은 in-situ 공정에 적용가능한 5G FCCL용 저유전손실 접착층 형성방법을 제공하는 것을 목적으로 한다.In addition, an object of the present invention is to provide a method for forming a low dielectric loss adhesive layer for 5G FCCL applicable to an in-situ process.
본 발명의 다른 목적 및 이점은 하기의 발명의 상세한 설명, 청구범위 및 도면에 의해 더욱 명확하게 된다.Other objects and advantages of the present invention will become more apparent from the following detailed description, claims and drawings.
상기한 기술적 과제를 해결하기 위하여, 본 발명에서는 동박으로부터 구리를 용출시키는 단계; 및 상기 동박에서 용출된 구리를 촉매로 하고, azide-alkyne의 클릭반응(click reaction)에 의해 고분자 접착층을 형성하는 단계를 포함하는 동박 표면의 접착층 형성방법을 제공한다.In order to solve the above technical problem, in the present invention, the step of eluting copper from the copper foil; and forming a polymer adhesive layer by a click reaction of azide-alkyne using copper eluted from the copper foil as a catalyst.
본 발명에서, 상기 접착층을 형성하는 단계는 30 mN/m 이하의 표면에너지를 가지는 고분자 접착층을 형성하는 것을 특징으로 한다.In the present invention, the forming of the adhesive layer is characterized by forming a polymer adhesive layer having a surface energy of 30 mN/m or less.
본 발명에서, 상기 접착층을 형성하는 단계에서 고분자 접착층은 아크릴 고분자 접착층인 것을 특징으로 한다.In the present invention, in the step of forming the adhesive layer, the polymer adhesive layer is characterized in that the acrylic polymer adhesive layer.
본 발명은 동박 표면에서 용출된 구리의 촉매 작용을 통한 in-situ 표면 유도 중합기술로서 저조도 극박과 저유전 고분자 간의 낮은 접착성을 해결할 수 있는 저유전손실 분자 접착 기술을 제공한다.The present invention is an in-situ surface-induced polymerization technology through the catalytic action of copper eluted from the copper foil surface, and provides a low dielectric loss molecular adhesion technology that can solve the low adhesion between a low-illumination ultra-thin and a low-k polymer.
본 발명은 추가 표면처리 또는 후처리 공정 없이 수십 나노 수준의 박형 접착층을 실시간으로 코팅할 수 있다.The present invention can coat a thin adhesive layer at the level of several tens of nanometers in real time without additional surface treatment or post-treatment process.
본 발명은 구리의 촉매 활성 가능성을 검증하기 위하여 용액 상에서 azide와 alkyne 기를 가지는 저분자량의 고분자 또는 올리고머와 구리 촉매를 혼합하여 고분자 중합반응을 수행하고, 반응이 성공적으로 진행될 수 있는 조건을 확립하였다.In the present invention, in order to verify the catalytic activity of copper, a polymer polymerization reaction was performed by mixing a low molecular weight polymer or oligomer having an azide and alkyne group with a copper catalyst in a solution phase, and conditions for the reaction to proceed successfully were established.
본 발명에서, 접착성 고분자 단량체는 말레산 무수물(Maleic anhydride), 실란(Silane), 폴리이미드(Polyimide), POSS(Polyhedral Oligomeric Silsesquioxane)를 사용할 수 있다.In the present invention, maleic anhydride, silane, polyimide, or polyhedral oligomeric silsesquioxane (POSS) may be used as the adhesive polymer monomer.
본 발명에서, azide, alkyne의 두 반응기를 지닌 반응성 고분자가 구리층 표면에서 구리 촉매 때문에 표면 반응을 거치면 동박 표면에서 접착층 고분자막이 형성될 것으로 예측가능하므로, 향후 동박과 저유전체를 합지하여 적층판을 제조하는 경우 동박과 저유전체와의 접착력 향상을 기대할 수 있을 것이다.In the present invention, when a reactive polymer having two reactive groups, azide and alkyne, undergoes a surface reaction on the surface of the copper layer due to the copper catalyst, it is predicted that a polymer film for the adhesive layer will be formed on the surface of the copper foil. In this case, it is possible to expect improved adhesion between the copper foil and the low dielectric.
본 발명에서, 동박(원박)의 종류에는 특별히 제한은 없지만, 압연 동박 및 전해 동박을 적합하게 사용 가능하다. 동박에는 순동박 및 구리합금박이 포함되며, 회로 형성 용도로서 공지된 임의의 조성으로 할 수 있다. 또한, 동박은 캐리어, 박리층, 극박구리층을 이 순서대로 캐리어 부착 동박의 극박구리층이어도 되고, 표면처리의 대상이 되는 동박은 캐리어를 가져도 된다. 상술한 캐리어 부착 동박, 캐리어에는 어떠한 캐리어 부착 동박, 캐리어를 이용해도 되며, 공지된 캐리어 부착 동박, 캐리어를 이용할 수 있다.In the present invention, the type of copper foil (original foil) is not particularly limited, but rolled copper foil and electrodeposited copper foil can be suitably used. The copper foil includes pure copper foil and copper alloy foil, and may have any composition known for use in circuit formation. In addition, the copper foil may be an ultra-thin copper layer of copper foil with a carrier including a carrier, a peeling layer, and an ultra-thin copper layer in this order, and the copper foil used as a target of surface treatment may have a carrier. Any copper foil with a carrier and carrier may be used for the copper foil with a carrier and the carrier described above, and known copper foil with a carrier and carrier can be used.
본 발명과 관련되는 동박의 표면처리면을 절연기재와 맞붙임으로써 동박 적층판을 형성 가능하다. 절연기재가 단층인 단층 동장적층판으로 해도 되고, 절연기재가 2층 이상인 다층 동장적층판으로 해도 된다. 동박 적층판은 플렉시블 및 리지드 중 어느 쪽으로 해도 가능하다. A copper-clad laminate can be formed by bonding the surface-treated surface of the copper foil according to the present invention to an insulating substrate. It may be a single-layer copper-clad laminate in which the insulating base material is a single layer, or a multi-layer copper-clad laminate in which the insulating base material is two or more layers. A copper clad laminated board can be either flexible or rigid.
본 발명에서 상기 절연기재는 특별히 제한은 없지만, 에폭시 수지, 페놀 수지, 폴리이미드 수지, 폴리이미드아미드 수지, 폴리에스텔 수지, 폴리페닐렌설파이드 수지, 폴에테르이미드 수지, 불소 수지, 액정폴리머(LCP) 및 그들을 혼합시킨 것을 들 수 있다. 이 밖에, 글라스 클로스(glass cloth)에 에폭시 수지, 비스말레이미드트리아진 수지 또는 폴리이미드 수지 등을 함침시킨 절연기재를 들 수 있다.특히, 액정 폴리머는 저유전율, 저유전정접, 저흡수성, 상기 특성의 변화가 적은, 나아가서는 치수 변화가 적다는 큰 이점을 가져 고주파 용도에 적합하다.In the present invention, the insulating substrate is not particularly limited, but epoxy resin, phenol resin, polyimide resin, polyimide amide resin, polyester resin, polyphenylene sulfide resin, polyetherimide resin, fluorine resin, liquid crystal polymer (LCP) and those in which they were mixed. In addition, an insulating substrate obtained by impregnating a glass cloth with an epoxy resin, a bismaleimide triazine resin, or a polyimide resin may be used. In particular, the liquid crystal polymer has low dielectric constant, low dielectric loss tangent, low water absorption, It is suitable for high-frequency applications because it has a great advantage that there is little change in characteristics and even less dimensional change.
본 발명은 기존과 차별화된 신개념 접착소재에 관한 것으로서, 저조도 동박과 저유전 고분자 간의 낮은 접착성을 해결함과 동시에 유전손실률을 최소화시킬 수 있다.The present invention relates to an adhesive material of a new concept differentiated from the existing ones, and can solve low adhesion between a low-illuminance copper foil and a low-dielectric polymer and at the same time minimize dielectric loss.
또한, 본 발명은 유전손실을 최소화한 5G용 FCCL 필름을 연속공정으로 구현할 수 있다.In addition, the present invention can implement a 5G FCCL film with minimal dielectric loss through a continuous process.
도 1은 본 발명에 따른 동박 용출 Cu 매개 고분자 중합기술을 적용한 접착층 형성방법을 개략적으로 나타내는 것이다.
도 2는 본 발명에 따른 중합기술을 이용한 in-situ 동박 제조공정을 개략적으로 나타내는 것이다.1 shows a method for forming an adhesive layer using copper foil elution Cu-mediated polymer polymerization technology according to the present invention. is shown schematically.
2 schematically shows an in-situ copper foil manufacturing process using polymerization technology according to the present invention.
이하, 첨부된 도면을 참조로 본 발명의 바람직한 실시예를 더욱 상세히 설명하고자 한다. 이들 실시예는 오로지 본 발명을 보다 구체적으로 설명하기 위한 것으로, 본 발명의 요지에 따라 본 발명의 범위가 이들 실시예에 의해 제한되지 않는다는 것은 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 있어서 자명할 것이다.Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. These examples are only for explaining the present invention in more detail, and it is to those skilled in the art that the scope of the present invention is not limited by these examples according to the gist of the present invention. It will be self-evident.
본 발명의 특징들은 이하의 실시예를 통해서 더욱 명확히 설명될 수 있다. Features of the present invention can be more clearly explained through the following examples.
[실시예 1] azide copolymer 합성[Example 1] Synthesis of azide copolymer
alkyne과 반응성을 지닌 azide acrylate 공중합 고분자를 합성한다.Synthesis of azide acrylate copolymer polymer that is reactive with alkyne.
methyl methacrylate (thickness, hardness 등의 물성 향상), R1기 달린 acrylate (낮은 표면에너지), 2-hydroxyethyl methacrylate (가교반응 및 접착력 향상), methacrylic acid (접착력 향상) 단량체를 공중합하여 azide copolymer를 합성한다.An azide copolymer is synthesized by copolymerizing methyl methacrylate (improvement of properties such as thickness and hardness), acrylate with R1 group (low surface energy), 2-hydroxyethyl methacrylate (improvement of cross-linking reaction and adhesion), and methacrylic acid (improvement of adhesion) monomers.
상기 R1기로는 낮은 표면에너지를 가지는 long alkyl hydrocarbon chain 또는 polydimethylsiloxane(PDMS)를 사용할 수 있다.As the R1 group, a long alkyl hydrocarbon chain or polydimethylsiloxane (PDMS) having a low surface energy can be used.
본 발명에서는 Free radical 중합반응을 이용하여 azide 고분자를 합성한다.In the present invention, the azide polymer is synthesized using free radical polymerization.
상기 azide acrylate : R1기 달린 acrylate : methyl methacrylate : methacrylic acid : 2-hydroxyethyl methacrylate의 몰비는 9:2:2:2:4로 하고, 개시제로서 AIBN을 사용 (monomer의 양 대비 4 wt%)하고, 용매로 THF를 사용(60 wt% 용액 제조)한다. The molar ratio of the azide acrylate: R1 grouped acrylate: methyl methacrylate: methacrylic acid: 2-hydroxyethyl methacrylate was 9:2:2:2:4, and AIBN was used as an initiator (4 wt% relative to the amount of monomer), THF is used as the solvent (to prepare a 60 wt% solution).
상기 용매에 monomer들과 개시제를 녹인 후 60℃에서 18시간 동안 반응시킨 후 메탄올을 이용하여 합성된 고분자를 분리한다.After dissolving the monomers and the initiator in the solvent, reacting at 60 ° C. for 18 hours, and then separating the synthesized polymer using methanol.
[실시예 2] azide-alkyne reaction[Example 2] azide-alkyne reaction
R2기 달린 저분자량 alkyne을 azide copolymer와 반응시켜 click chemistry에 의한 azide-alkyne reaction 을 유도한다.A low molecular weight alkyne with an R2 group is reacted with an azide copolymer to induce an azide-alkyne reaction by click chemistry.
상기 R2기로는 long alkyl hydrocarbon chain 또는 polydimethylsiloxane(PDMS)를 사용할 수 있다.As the R2 group, a long alkyl hydrocarbon chain or polydimethylsiloxane (PDMS) may be used.
azide-alkyne의 click chemistry를 이용한다.Use the click chemistry of azide-alkyne.
상기 azide copolymer : alkyne group : Cu catalyst의 몰비는 5:5:1 로 하되, 표면에너지 값 제어에 따라 함량비 조절이 가능하다.The molar ratio of the azide copolymer: alkyne group: Cu catalyst is 5:5:1, but the content ratio can be adjusted according to the control of the surface energy value.
용매로 DMF 혹은 DMSO (85 wt% 용액 제조)에 azide 고분자와 alkyne 화합물을 용해시킨 후 동박을 침지시켜 동박 표면에서 고분자 접착층이 형성되도록 상온에서 반응시킨다.After dissolving an azide polymer and an alkyne compound in DMF or DMSO (85 wt% solution) as a solvent, the copper foil is immersed and reacted at room temperature to form a polymer adhesive layer on the surface of the copper foil.
상기 반응 종료 후 아세톤과 THF로 세척하여 미반응물을 제거한다.After completion of the reaction, unreacted materials are removed by washing with acetone and THF.
이상으로 본 발명의 특정한 부분을 상세히 기술하였는바, 통상의 기술자에게 있어서 이러한 구체적인 기술은 단지 바람직한 구현 예일 뿐이며, 이에 본 발명의 범위가 제한되는 것이 아닌 점은 명백하다. 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이거나 사전적인 의미로 한정해서 해석되어서는 아니되며, 발명자는 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다. 따라서, 본 발명의 실질적인 범위는 첨부된 청구항과 그의 등가물에 의하여 정의된다고 할 것이다.Since specific parts of the present invention have been described in detail above, it is clear that these specific techniques are only preferred embodiments for those skilled in the art, and the scope of the present invention is not limited thereto. Terms or words used in this specification and claims should not be construed as being limited to ordinary or dictionary meanings, and the inventor may appropriately define the concept of terms in order to explain his or her invention in the best way. It should be interpreted as a meaning and concept consistent with the technical idea of the present invention based on the principle that there is. Accordingly, the substantial scope of the present invention will be defined by the appended claims and equivalents thereof.
Claims (1)
아자이드 아크릴레이트(azide acrylate), polydimethylsiloxane(PDMS)를 R1기로 하는 아크릴레이트(acrylate), 메타크릴산메틸(methyl methacrylate), 메타크릴산(methacrylic acid) 및 2-하이드록시에틸 메타크릴산(2-hydroxyethyl methacrylate) 단량체를 공중합하여 아자이드 고분자(azide copolymer)를 합성하는 단계; 및
상기 동박에서 용출된 구리를 촉매로 하고, 알킨(alkyne)과 상기 아자이드 고분자(azide copolymer)를 반응시켜 azide-alkyne의 클릭반응(click reaction)에 의해 고분자 접착층을 형성하는 단계를 포함하는 것을 특징으로 하는 동박 표면의 접착층 형성방법.Eluting copper from the copper foil;
Azide acrylate, acrylate with polydimethylsiloxane (PDMS) as R1 group, methyl methacrylate, methacrylic acid and 2-hydroxyethyl methacrylic acid (2 synthesizing an azide polymer by copolymerizing a -hydroxyethyl methacrylate monomer; and
Using copper eluted from the copper foil as a catalyst and reacting an alkyne with the azide polymer to form a polymer adhesive layer by a click reaction of the azide-alkyne. A method of forming an adhesive layer on the surface of copper foil.
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| JP2018184472A (en) | 2013-02-08 | 2018-11-22 | シーカ・テクノロジー・アーゲー | Synthesize of polyurethane polymer by copper azide-alkyne click chemistry for coating agent, adhesive, sealant and elastomer |
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| JP2018184472A (en) | 2013-02-08 | 2018-11-22 | シーカ・テクノロジー・アーゲー | Synthesize of polyurethane polymer by copper azide-alkyne click chemistry for coating agent, adhesive, sealant and elastomer |
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