KR102543845B1 - A cooling apparatus for electronic elements - Google Patents

Abstract

The present invention relates to a heat dissipation device for an electronic device, and more particularly, a first chamber in which a printed circuit board on which a heat generating element is mounted is disposed, a spray unit for spraying a refrigerant, and a refrigerant supply unit for supplying the refrigerant to the spray unit. , A second chamber for exchanging heat with heat transferred from the first chamber, disposed between the first chamber and the second chamber, receiving heat from the heating elements of the first chamber and supplying it to the second chamber and a condensing unit for condensing the refrigerant injected into the second chamber, wherein the surface of the heat transfer unit exposed to the second chamber has a zigzag pattern downward after the liquid refrigerant sprayed by the spraying unit is adsorbed. Since a plurality of evaporation inducing ribs are formed to flow down along the wavy flow passage, heat dissipation performance can be improved without size expansion.

Description

Heat dissipation device for electronic devices {A COOLING APPARATUS FOR ELECTRONIC ELEMENTS}

The present invention relates to a heat dissipation device for an electronic device, and more particularly, to a heat dissipation device for an electronic device for effectively dissipating heat generated from a heat source such as an antenna element mounted on a printed circuit board.

Wireless communication technology, for example, MIMO (Multiple Input Multiple Output) technology, is a technology that dramatically increases data transmission capacity by using multiple antennas. A transmitter transmits different data through each transmit antenna, and a receiver is a spatial multiplexing technique that distinguishes transmitted data through appropriate signal processing.

Therefore, as the number of transmit/receive antennas is simultaneously increased, the channel capacity increases, allowing more data to be transmitted. For example, if the number of antennas is increased to 10, about 10 times the channel capacity is secured using the same frequency band compared to the current single-antenna system.

Up to 8 antennas are used in 4G LTE-advanced, products equipped with 64 or 128 antennas are currently being developed in the pre-5G stage, and base station equipment with a much larger number of antennas is expected to be used in 5G , this is called Massive MIMO technology. While the current cell operation is 2-Dimension, if Massive MIMO technology is introduced, 3D-Beamforming becomes possible, so it is also called FD-MIMO (Full Dimension).

In Massive MIMO technology, as the number of ANTs increases, the number of transmitters and filters also increases accordingly. Nevertheless, due to the lease cost or space constraints of the installation location, making the RF parts (Antenna/Filter/Power Amplifier/Transceiver etc.) small, light, and inexpensive is necessary for Massive MIMO to expand its coverage. Power consumption and calorific value caused by this are negative factors in reducing weight and size.

In particular, when a MIMO antenna in which modules implemented with RF elements and digital elements are combined in a stacked structure is installed in a limited space, compaction and The need for miniaturization design is emerging, and in this case, a design for a new heat dissipation structure for heat generated from a communication component mounted on a plurality of layers is required.

Republic of Korea Patent Publication No. 10-2019-0118979 (2019.10.21. Publication date) (hereinafter referred to as 'prior art') applies a heat dissipation structure for compaction and miniaturization design for a plurality of layers constituting a MIMO antenna. A 'multiple input/output antenna device' is disclosed.

The prior art includes a heat dissipation body provided with a heat dissipation fin protruding, and a plurality of unit heat dissipation bodies installed on the heat dissipation body. One end of the plurality of unit radiators is provided to contact the heating element of the antenna substrate, and the other end is provided with a plurality of sub-radiation fins for dissipating heat conducted from the heating element to the outside.

However, in the prior art, since the structure for dissipating heat of the heating element has only a mechanical structure, which is an air-cooled heat dissipation structure through heat exchange with outside air, not only is it difficult to quickly dissipate heat, but also more Since a mechanical heat dissipation structure is required, there is a problem in that the size increases.

Republic of Korea Patent Publication No. 10-2019-0118979 (published on October 21, 2019)

The present invention has been made to solve the above technical problem, and an object of the present invention is to provide a heat dissipation device for an electric device in which heat dissipation performance is improved while preventing size expansion.

In addition, the present invention provides a heat dissipation device for an electronic device capable of dissipating heat generated from the heating element quickly by spraying a refrigerant to one side of a space in which a heating element is disposed and quickly evaporating the sprayed refrigerant. to do for a different purpose.

In addition, the present invention actively pumps and sprays the stored refrigerant through the refrigerant supply unit inside the second chamber, which actually serves to dissipate heat, and condenses the refrigerant through the outside air by using the blower unit outside the second chamber. It is another object of the present invention to provide a heat dissipation device for electric devices that improves efficiency.

The objects of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

In one embodiment of the heat dissipation device of an electronic device according to the present invention, a first chamber in which a printed circuit board on which a heat generating element is mounted is disposed, a spray unit for spraying refrigerant, and a refrigerant supply unit for supplying the refrigerant to the spray unit are disposed. and a second chamber for exchanging heat with the heat transferred from the first chamber, disposed between the first chamber and the second chamber to receive heat from the heat generating elements of the first chamber and into the second chamber. A heat transfer unit for supplying and a condensing unit for condensing the refrigerant injected into the second chamber, wherein the surface of the heat transfer unit exposed to the second chamber absorbs the liquid refrigerant sprayed by the spray unit and then moves downward in a zigzag pattern. A plurality of evaporation inducing ribs are formed to induce the liquid to flow down in the direction.

Here, the plurality of evaporation induction ribs are disposed adjacent to the spraying part, vertically arranged refrigerant inlet, one inclined part bent and extended obliquely downward to one side from the lower end of the refrigerant inlet, and the lower end of the one inclined part. Including the other inclined portion bent and extended obliquely downward on the other side, the one side inclined portion and the other inclined portion may be repeatedly formed.

In addition, the plurality of evaporation inducing ribs protrude from the first chamber in a direction in which the second chamber is provided to adsorb the refrigerant sprayed from the injection unit, and exchange heat with the heat of the heating element transmitted from the first chamber. A zigzag-shaped passage may be formed to increase a heat exchange area and adsorption time.

In addition, the heat transfer unit is formed to protrude from one surface exposed toward the first chamber among a partition plate part arranged to partition between the first chamber and the second chamber and both surfaces of the partition plate part, and contact the printed circuit board. It may include a plurality of contact protrusions, and the plurality of evaporation inducing ribs may be integrally formed to protrude from one surface of both surfaces of the partition plate part exposed toward the second chamber.

In addition, the second chamber may be formed by covering and coupling a heat dissipation plate constituting the condensation part to a rear side of the partition plate part as a space recessed forward from an edge end of the partition plate part.

In addition, the plurality of contact protrusions may be designed in shape by considering the amount of heat generated according to the mounting position of the heating element mounted on the printed circuit board.

In addition, the condensation unit is formed to protrude toward the rear side of the heat dissipation plate part constituting a part of the space of the second chamber and the heat dissipation plate part constituting the outer appearance of the rear side of the second chamber, so that a part of the space of the second chamber is expanded. It is formed to be recessed in the space of the second chamber and includes a plurality of condensation ribs formed in multiple stages in the vertical direction of the heat dissipation plate unit, and the plurality of condensation ribs may be formed such that a vertical cross-sectional area gradually decreases toward the rear side of the heat dissipation plate unit. .

In addition, the second chamber may be formed by covering and coupling a partition plate constituting the heat transfer unit to a front of the heat dissipation plate as a space recessed backward from an edge end of the heat dissipation plate.

In addition, the plurality of condensation ribs may be formed such that an inner upper surface is inclined downward to the rear and an inner lower surface is inclined upward to the rear.

In addition, an upward inclination angle of the inner lower surface with respect to an arbitrary horizontal surface may be greater than or equal to a downward inclination angle of the inner upper surface with respect to an arbitrary horizontal surface.

In addition, the inner surfaces of the plurality of condensation ribs may be formed to have a plurality of minutely stepped portions.

The condensation unit may further include a plurality of support bars provided to support a front end of the plurality of condensation ribs and a rear surface of the partition plate unit disposed to partition between the first chamber and the second chamber.

In addition, a radome panel disposed to form a front side outer appearance of the first chamber is further included, the first chamber is formed between the radome and a partition plate constituting the heat transfer unit, and the second chamber is the partition plate part And it may be formed between the heat dissipation plate portion of the condensation portion constituting the rear side outer appearance of the second chamber.

The heat dissipation plate unit may further include a mounting bracket that surrounds a rear side of the heat dissipation plate unit, fixes a left end portion and a right end portion to the partition plate portion of the heat transfer unit, and mediates coupling to a predetermined portion.

The method may further include a shielding sealer interposed along an edge between the partition plate unit and the heat dissipation plate unit to shield and seal the second chamber and an external space.

In addition, the heat transfer unit is configured such that the amount of heat transferred from the first chamber to the second chamber is mutually exchanged through total heat of the refrigerant, and the refrigerant stored in the second chamber is sensible heat. ) and enthalpy change of latent heat, phase changes of evaporation and condensation may be made, and heat transfer may be performed from the first chamber to the second chamber.

In addition, a blower provided behind the condensing unit and blowing outside air toward the condensing unit may be further included.

In addition, the blower unit mediates coupling of a plurality of blowers vertically arranged in multiple stages on the rear side of the condensing unit and the plurality of blowers to the plurality of condensing ribs, and simultaneously blows air blown by the plurality of blowers to the side. It may include a pair of guide bracket panels for guiding.

In addition, the blower unit may further include a blower control printed circuit board provided on any one of the pair of guide bracket panels to control the operation of the plurality of blowers.

In addition, a pair of blowers provided at both left and right ends of the condensation unit and blowing outside air in horizontal horizontal directions may further include a pair of blowers.

In addition, the refrigerant supply unit is provided with a refrigerant supply pump located in the lower part of the second chamber, and the injection unit is located in the upper part of the second chamber and injects the refrigerant pumped and supplied by the refrigerant supply unit. It is provided as a refrigerant injection nozzle, and the refrigerant supply pump and the refrigerant injection nozzle may be connected by a refrigerant flow pipe.

In addition, the refrigerant flow pipe is vertically fixed to the left end or the right end of the partition plate part, and the refrigerant injection nozzle is connected to the upper end of the refrigerant flow pipe in communication with the upper end of the partition plate part. , and a plurality of spray nozzle holes for discharging the refrigerant downward may be formed in the refrigerant spray nozzle to be spaced apart in left and right directions.

In addition, a pair of pairs disposed to pass through the heat transfer unit between the first chamber and the second chamber and provided to electrically communicate the printed circuit board in the first chamber and the refrigerant supply pump in the second chamber. A connecting pin may be further included.

In addition, a pressure controller for regulating the pressure in the second chamber may be further included.

In addition, the heating element may include at least one of an antenna element and a radio signal processing unit (RU: Radio Unit).

According to an embodiment of the heat dissipation device for an electronic device according to the present invention, the injection unit injects the refrigerant supplied by the refrigerant supply unit into the second chamber, and the heat transfer unit transfers the amount of heat transferred from the first chamber to the second chamber by transferring heat of the refrigerant ( It is configured to mutual heat exchange through total heat, and the refrigerant stored in the second chamber undergoes a phase change of evaporation and condensation due to enthalpy changes of sensible heat and latent heat, and in the first chamber It is provided to transfer heat to the second chamber and has an effect of quickly dissipating heat generated from a heating element mounted on a printed circuit board disposed in the first chamber through a phase change of a refrigerant.

In addition, according to an embodiment of the heat dissipation device for an electronic device according to the present invention, the condenser for phase change of the refrigerant is effectively cooled by using the blower, thereby significantly improving heat dissipation performance.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1A and 1B are perspective views showing a heat dissipation device for an electronic device according to an embodiment of the present invention;
2a and 2b are perspective views showing a heat dissipation device for an electronic device according to another embodiment of the present invention;
Figure 3 is an exploded perspective view showing the installation state of the radome panel of the configuration of Figures 2a and 2b,
4a and 4b are exploded perspective views of FIGS. 1a and 1b, respectively;
Figure 5 is an exploded perspective view of Figure 2a,
6 is a cross-sectional view taken along line AA of FIG. 1A,
7 is a cutaway perspective view taken along line BB of FIG. 1A and a partially enlarged view thereof;
8 is a cutaway perspective view showing a part of the rear surface of the heat transfer unit and a partially enlarged view thereof;
9a and 9b are exploded perspective views showing a heat transfer unit and a condensation unit;
10A and 10B are exploded perspective views showing each air blower among configurations of a heat dissipation device for an electronic device according to an embodiment and another embodiment of the present invention;
11 is a rear perspective view showing a modified example of a blowing unit among configurations of a heat dissipation device for an electronic device according to another embodiment of the present invention;
Figure 12 is an exploded perspective view of Figure 2b,
FIG. 13 is a partially cut-away perspective view taken along line BB of FIG. 12 .

Hereinafter, a heat dissipation device for an electronic device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

In adding reference numerals to components of each drawing, it should be noted that the same components have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing an embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function hinders understanding of the embodiment of the present invention, the detailed description will be omitted.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature or sequence of the corresponding component is not limited by the term. In addition, unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in this application, they should not be interpreted in an ideal or excessively formal meaning. don't

1A and 1B are perspective views showing a heat dissipation device for an electrical device according to an embodiment of the present invention, and FIGS. 2A and 2B are perspective views showing a heat dissipation device for an electronic device according to another embodiment of the present invention, and FIG. 3 is an exploded perspective view showing the installation of the radome panel among the configurations of FIGS. 2A and 2B, FIGS. 4A and 4B are exploded perspective views of FIGS. 1A and 1B, and FIG. 5 is an exploded perspective view of FIG. 2A.

As shown in FIGS. 1A to 4B, the heat dissipation device 1 of the electronic device according to the present invention transfers from the first chamber C1 where the printed circuit board 30 is disposed and the first chamber C1. A second chamber C2 disposed to be partitioned from the first chamber C1 to cool the generated heat, and a heat transfer unit 110 configured to transfer heat from the first chamber C1 to the second chamber C2, , and a condensing unit 140 condensing the refrigerant injected into the second chamber C2.

A printed circuit board 30 may be disposed in the first chamber C1. A plurality of heating elements 31 may be mounted on the printed circuit board 30 . The plurality of heating elements 31 may be mounted on the front surface of both sides of the printed circuit board 30 . However, the plurality of heating elements 31 are not necessarily limited to being mounted only on the front surface of the printed circuit board 30, and may be mounted on both sides of the printed circuit board 30, as well as the printed circuit board ( 30) can be mounted on the rear side. In particular, in the case of the heating element 31 with a relatively large amount of heat generated, it is mounted on the rear surface of the printed circuit board 30, and directly surface-contacts with the front surface of the heat transfer unit 110 to be described later, so that heat can be dissipated in a direct heat conduction method.

Meanwhile, the first chamber C1 may be in a non-vacuum state. In addition, the second chamber (C2) may be a space in which the pressure can be adjusted by the pressure controller 90 to be described later.

That is, a pressure regulator 90 capable of adjusting the pressure inside the second chamber C2 may be further provided above or below the second chamber C2. The pressure regulator 90 is provided to be automatically adjusted according to the internal pressure of the second chamber C2, as well as provided in a manual opening/closing manner so that the user can manually adjust the internal pressure of the second chamber C2 to arbitrarily adjust the heat dissipation performance. Of course it can be adjusted.

As shown in FIG. 3 , the partition plate unit 10 is formed so that the edge 11 protrudes forward to form the space of the first chamber C1, and the edge 11 of the partition plate unit 10 has A radome panel 20 may be attached. Accordingly, the first chamber C1 may be defined as an inner space shielded by the partition plate unit 10 and the radome panel 20 .

A spraying unit 83 and a refrigerant supplying unit 81 may be disposed in the second chamber C2. The spraying unit 83 may spray refrigerant. Here, the refrigerant supply unit 81 may be provided with a refrigerant supply pump located in the lower part of the second chamber C2. In addition, the spraying unit 83 may be provided as a refrigerant spray nozzle located at an upper part of the second chamber C2 and spraying the refrigerant pumped and supplied by the refrigerant supply unit 81 . The refrigerant supply pump, which is the refrigerant supply unit 81, and the refrigerant spray nozzle, which is the spray unit 83, may be connected by a refrigerant flow pipe 85. A specific coupling relationship between the refrigerant supply unit 81, the refrigerant flow pipe 85, and the spray unit 83 and the refrigerant supply structure will be described in detail later.

The heat transfer unit 110 may be disposed between the first chamber C1 and the second chamber C2. Therefore, the front surface of the partition plate part 10 serves to collect the heat generated from the first chamber C1, and the rear surface of the partition plate part 10 is formed integrally therewith with a plurality of evaporation inducing ribs 15 to be described later. It serves to dissipate heat transferred from the first chamber C2 through the partition plate unit 10 to the second chamber C2.

The heat transfer unit 110 as described above serves to transfer the heat generated from the first chamber C1 to the second chamber C2 in a direct heat conduction manner and at the same time exchanges heat with the refrigerant sprayed into the second chamber C2. play a role That is, the refrigerant supplied by the refrigerant supply unit 81 through the injection unit 83 is adsorbed on the rear surface of the second chamber C2 side of the heat transfer unit 110 and evaporated from the first chamber C1 using latent heat. The sensible heat generated from the heating elements 31 of the printed circuit board 30 is cooled, and the refrigerant may be evaporated.

As such, the heat transfer unit 110 is configured such that the amount of heat transferred from the first chamber C1 to the second chamber C2 is mutually exchanged through the total heat of the refrigerant, and the second chamber ( The refrigerant stored in C2) undergoes a phase change of evaporation and condensation due to enthalpy changes of sensible heat and latent heat, and transfers heat from the first chamber C1 to the second chamber C2. may be provided.

The condensing unit 140, as referenced in FIGS. 1A to 4B , is provided with a thermally conductive material and constitutes a part of the space of the second chamber C2 while constituting the outer appearance of the rear side of the second chamber C2. It is formed to protrude toward the heat sink unit 40 and the rear side of the heat sink unit 40, but is formed to be recessed in the space of the second chamber C2 so that a part of the space of the second chamber C2 expands, and the heat sink unit 40 It may include a plurality of condensation ribs 45 formed in multiple stages in the vertical direction of the.

As described above, the condensation unit 140 is a liquid phase sprayed through the spray unit 83 according to the principle of sensible heat and latent heat in the second chamber C2 through the rear surface of the heat transfer unit 110 as described above. After the refrigerant is vaporized, it is condensed again to liquefy. The specific condensation principle and structure of the condensation unit 140 will be described in detail later.

As referenced to FIGS. 1A and 1B , the heat dissipation device 1 of an electronic device according to an embodiment of the present invention is connected to a mounting bracket 60 coupled to a rear side of a heat dissipation plate unit 40 to be described later. It may be fixedly installed to a predetermined portion such as a holding pole (not shown).

However, it is not necessarily fixed to the holding pole (not shown) via the mounting bracket 60, and the heat dissipation device 1 of the electronic device according to another embodiment of the present invention as referred to in FIGS. 2A and 2B As in, as well as mediating coupling to a holding pole (not shown), tilting or rotating rotation is possible, and as a heating element 31, the orientation of an antenna device including an electric component such as an antenna element is set It is also possible to be coupled via the clamping device 200 for ease.

As shown in FIG. 2B, the clamping device 200 includes a tilting unit 210 coupled to the rear surface of the heat dissipation plate unit 40 and tilted and rotated in an up and down direction around a left and right tilting axis (reference numeral not indicated), and a tilting unit Mediating the tilting coupling of the 210 and mediating the rotating coupling of the rotating unit 220 and the rotating unit 220 rotating in the left and right directions around an up and down rotating axis (reference numeral not indicated), and It may include a coupling part 230 that mediates coupling.

The clamping device 200 is provided with a tilting rotation motor (not shown) and a rotating rotation motor (not shown) that are electrically driven therein, so that the tilting rotation and rotating rotation operation can be remotely controlled. can

Meanwhile, as shown in FIG. 1A , the first chamber C1 may be defined as a space formed by a partition plate unit 10 described later and a radome panel 20 coupled to the front end thereof.

Here, the radome panel 20 may be coupled in a screw fixing method by fastening with fixing screws (not shown) to the edge end 11 of the partition plate unit 10 .

However, the radome panel 20 does not necessarily have to be coupled in a screw fixing manner, and as referenced in FIGS. 2a and 2b and FIG. 3, the radome panel 20 has a plurality of It can be coupled in a clip fixing method via the clip member 25. To this end, the front end hooking part 25a of the clip is formed on the edge of the radome panel 20, and the rear hooking part 25b of the clip is formed on the edge of the partition plate 10, so that a plurality of clip members 25 Each of the front and rear ends may be elastically deformed and fixed to the clip front end hooking part 25a and the clip rear end hooking part 25b.

Meanwhile, as referred to in FIGS. 4A and 4B , the second chamber C2 may be defined as a space formed between a front end of the heat dissipation plate unit 40 and a rear space of the partition plate unit 10 to be described later.

More specifically, as shown in FIG. 4B, a predetermined space is formed on the rear surface of the partition plate unit 10 in a recessed state by a predetermined depth from the rear end to the front, and the heat dissipation plate unit 40 is located at the rear end of the partition plate unit 10. It is combined with a covering in the form of covering to form the space of the above-described second chamber (C2). Here, the front ends of the plurality of condensation ribs 45 among the condensation units 140 provided in the heat dissipation plate unit 40 may be set to the same position as the front ends of the heat dissipation plate unit 40 .

However, the second chamber C2 is not necessarily defined as shown in FIGS. 4A and 4B , and as referred to in FIG. 5 , the rear end of the heat transfer unit 110 formed on the rear surface of the partition plate unit 10 It is set to the same position as the rear end of the partition plate unit 10, and the front ends of the plurality of condensation ribs 45 of the condensation unit 140 are set to be located at a predetermined depth backward from the front end of the heat sink unit 40 (FIG. 5 Referring to the reference numeral D1 in ), it is also possible to define that the second chamber C2 is substantially formed on the side of the heat dissipation plate 40 by covering and coupling the partition plate unit 10 to the front of the heat dissipation plate unit 40 . At this time, the heat dissipation plate unit 40 may have a meaning as a condensing unit 140 integrated heat dissipation housing.

Meanwhile, the heat dissipation device 1 of the electronic device according to an embodiment of the present invention may further include a blower 150 as referred to in FIGS. 1A to 4B .

The blowing unit 150 is provided on the rear side of the condensing unit 140 and blows outside air so that the evaporated refrigerant inside the second chamber C2 is more quickly condensed by the condensing unit 140 made of a metal material. play a role The specific blowing principle and structure of the blower 150 will be described in more detail later.

FIG. 6 is a cross-sectional view taken along line A-A of FIG. 1A, FIG. 7 is a cutaway perspective view taken along line B-B of FIG. 1A and a partially enlarged view thereof, and FIG. It is also

A heat dissipation device 1 for an electronic device according to an embodiment of the present invention may include a first chamber C1 and a second chamber C2 as shown in FIGS. 6 and 7 . In the first chamber (C1), the printed circuit board 30 is disposed vertically in the vertical direction, and at least one of the front or rear surface of the printed circuit board 30 is electrically driven to generate a plurality of heating elements 31 can be mounted. In this embodiment, the heating elements 31 are mounted on the front of both sides of the printed circuit board 30, and the rear of the both sides of the printed circuit board 30 has a plurality of contact protrusions ( 13) is employed to form a plurality of heat transfer grooves 33 that are inserted and interviewed.

The heating element 31 mounted on the front surface of the printed circuit board 30 may include at least one of an antenna element and a radio signal processing unit (RU: Radio Unit). The antenna element may transmit and receive radio signals. The wireless signal processing unit may process a wireless signal.

In this way, when the heating element 31 is composed of an antenna element, the heat dissipation device 1 for an electronic device according to an embodiment of the present invention may be a multi-input/output antenna device of a communication service provider installing a base station.

In addition, when the heating element 31 is composed of a wireless signal processing unit, the heat dissipation device 1 of the electronic device according to the embodiment of the present invention may be a wireless signal processing device of a network equipment manufacturer that makes a base station.

As shown in FIGS. 6 and 7 , the first chamber C1 and the second chamber C2 may be partitioned from each other forward and backward by the heat transfer unit 110 .

More specifically, the heat transfer unit 110 includes a partition plate unit 10 provided to partition between the first chamber C1 and the second chamber C2, and the first chamber (of both sides of the partition plate unit 10) It may include a plurality of contact protrusions 13 formed to protrude from one surface exposed to the C1) side and contacting the printed circuit board 30 .

In addition, the heat transfer unit 110 may further include a plurality of evaporation inducing ribs 15 integrally formed on the rear surface corresponding to the second chamber C2 side. Here, it is preferable that the partition plate unit 10, the plurality of contact protrusions 13, and the plurality of evaporation induction ribs 15 are integrally formed and formed of a metal material having excellent thermal conductivity.

The partition plate unit 10 is formed so that the edge 11 protrudes forward to form the space of the first chamber C1, and the radome panel 20 is attached to the edge 11 of the partition plate unit 10. can Accordingly, the first chamber C1 may be defined as an inner space shielded by the partition plate unit 10 and the radome panel 20 . However, the first chamber (C1) does not necessarily need to be defined as described above, and although not shown in the drawings, the rim portion of the radome panel 20 extends rearward to form a substantial space of the first chamber (C1). It goes without saying that it can be defined to

The printed circuit board 30 is disposed between the partition plate part 10 constituting the first chamber C1 and the radome panel 20, and the partition plate part is formed in the heat transfer groove 33 formed on the rear surface of the printed circuit board 30. It is preferable that the plurality of contact protrusions 13 formed on the front surface of (10) are installed in close contact with the partition plate unit 10 so that each is inserted and interviewed. However, when the heat transfer groove 33 is not separately provided on the rear surface of the printed circuit board 30 and the heating element 31 is directly mounted, the plurality of contact protrusions 13 are directly on the rear surface of the heating element 31. It goes without saying that the surface can be in thermal contact. Here, the size and shape of the heat transfer groove 33 and the size and shape of the plurality of contact protrusions 13 formed to come into contact therewith are the amount of heat generated according to the mounting position of the heating element 31 mounted on the front surface of the printed circuit board 30. It can be designed in consideration of the shape.

The plurality of evaporation induction ribs 15 formed on the rear surface of both sides of the partition plate unit 10 exposed to the second chamber C2 side, as referred to in the enlarged views of FIGS. 7 and 8 , the second chamber C2 A refrigerant inlet 16 disposed close to the injection unit 83 provided on the upper side of the refrigerant inlet 16 arranged vertically and vertically, and one inclined portion bent and extended obliquely from the lower end of the refrigerant inlet 16 downward to one side. (17), and the other side inclined portion 18 bent and extended obliquely from the lower end of the one side inclined portion 17 to the other downwardly. In addition, as referenced in the enlarged view of FIG. 5, the plurality of evaporation induction ribs 15 end in a repeating shape of one inclined portion 17 and the other inclined portion 18 toward the lower side of the second chamber C2. It may further include a refrigerant outlet 19 extending a predetermined length in the up and down vertical direction in the portion.

In this way, the evaporation induction rib 15 formed on the rear surface of the partition plate unit 10 is formed by repeating one inclined part 17 and the other inclined part 18 long in the vertical direction, and at the same time, the adjacent evaporation formed in the same way. A plurality of wave-patterned refrigerant passages may be formed between the induction ribs 15 in a zigzag shape through which the liquid refrigerant may flow while being adsorbed. The repeated formation of one side inclined portion 17 and the other side inclined portion 18 is to increase the total heat exchange surface area of the plurality of evaporation inducing ribs 15 as much as possible. As such, the plurality of evaporation induction ribs 15 serve to increase the heat exchange area of the heat transferred from the heating element 31 and the adsorption time of the refrigerant.

That is, the plurality of evaporation inducing ribs 15 are in a gaseous state by the heat transferred from the first chamber C1 when the sprayed liquid refrigerant sprayed by the injection unit 83 is adsorbed from the upper part of the second chamber C2. , and the remaining liquid refrigerant that is not evaporated flows zigzag downward along the refrigerant flow path, helping to evaporate at a faster rate.

In addition, the heat transfer unit 110 is configured to exchange heat with each other using the principle of sensible heat transferred from the first chamber C1 to the second chamber C2 and the latent heat of refrigerant evaporating from the liquid phase. can be defined More specifically, the heat transfer unit 110 is configured so that the amount of heat transferred from the first chamber C1 to the second chamber C2 is mutually exchanged through the total heat of the refrigerant, and the second chamber The refrigerant filled in (C2) achieves a phase change of evaporation and condensation due to enthalpy changes of sensible heat and latent heat of the refrigerant, and heat is transferred from the first chamber (C1) to the second chamber (C2). It may be a configuration provided to be made.

On the other hand, the condensing unit 140, as referenced in FIGS. 6 and 7, constitutes the outer appearance of the rear side of the second chamber C2 and the heat dissipation plate unit 40 constituting a part of the space of the second chamber C2. And, it is formed to protrude toward the rear side of the heat dissipation plate unit 40, and is formed to be recessed backward in the space of the second chamber C2 so that a part of the space of the second chamber C2 is expanded, and the top and bottom of the heat dissipation plate unit 40 It may include a plurality of condensation ribs 45 formed in multiple stages in a direction.

Here, the condenser 140 may perform a role of condensing the liquid refrigerant by exchanging heat with the gaseous refrigerant evaporated by the plurality of evaporation inducing ribs 15 .

The plurality of condensation ribs 45 are formed to protrude a predetermined length toward the rear side of the heat dissipation plate 40 while forming an empty space communicating with the second chamber C2 by penetrating the heat dissipation plate 40, respectively, and approximately left and right. It may be formed to have a long rectangular vertical cross section.

More specifically, as shown in FIGS. 6 and 7 , the plurality of condensation ribs 45 may be formed such that their vertical cross-sectional area gradually decreases toward the rear side of the heat dissipation plate unit 40 . Here, each of the plurality of condensation ribs 45 may be formed such that an inner upper surface is downwardly inclined backward and an inner lower surface is inclined upwardly backward.

Therefore, when the liquid refrigerant is condensed (condensed) on the inner surface of the plurality of condensation ribs 45 inside the second chamber C2, it flows down in the direction of gravity along the inclined inner upper surface or the inclined inner lower surface, thereby flowing down the second chamber. The liquid refrigerant can be easily collected on the lower space of (C2).

Preferably, the plurality of condensation ribs 45 are formed so that the upward inclination angle of the inner lower surface with respect to any horizontal plane is greater than or equal to the downward inclination angle of the inner upper surface with respect to any horizontal plane to the lower side of the second chamber C2. of the liquid refrigerant can be more easily collected.

In addition, the inner surfaces of the plurality of condensation ribs 45 may be formed to have a plurality of minutely stepped portions 46 . This is to shorten the condensation (condensation) time of the vaporized refrigerant in a gaseous state by increasing the surface area of the plurality of condensation ribs 45 . That is, the recovery amount of the refrigerant is increased by improving the hydrophobicity of the surface through surface treatment of the plurality of condensation ribs 45 . Therefore, the vaporized refrigerant evaporated inside the second chamber (C2) transfers heat to the plurality of condensation ribs 45 while exchanging heat with the plurality of condensation ribs 45, and at the same time quickly spreads to the plurality of finely stepped portions 46. It may be condensed (condensed) through the increased surface area and flowed down to the lower space of the second chamber C2 to be collected.

That is, the condensing unit 140 may be defined as a configuration provided to mutually exchange heat using the principle of latent heat in which the sensible heat of the outside air and the refrigerant are condensed in the second chamber C2 in the gas phase.

In addition, as referenced to FIGS. 5 and 6 , the condensation unit 140 has a plurality of support bars provided to support the front end of the plurality of condensation ribs 45 and the rear surface of the partition plate unit 10, respectively. (48) may be further included. A plurality of support bars 48, by supporting the front end of the plurality of condensation ribs 45 spaced back and forth in a plurality of places to form the second chamber (C2), serves to prevent shape deformation caused by external force. carry out

On the other hand, the edge portion 11 of the partition plate unit 10 of the configuration of the heat transfer unit 110 is coupled to the edge portion of the heat dissipation plate unit 40 of the configuration of the condensation unit 140 so as to be interviewed, and the partition plate unit 10 and A shield sealer 70 may be interposed along an edge between the heat dissipation plate unit 40 to shield and seal the second chamber C2 and the external space.

The shield sealer 70 is made of a rubber material, so that when the partition plate part 10 of the heat transfer part 110 and the heat dissipation plate part 40 of the condensation part 140 are coupled by a coupling force by a plurality of assembling screws, each compartment By being tightly coupled between the rear surface of the plate unit 10 and the front surface of the heat sink unit 40, it serves to completely seal between the second chamber C2 and the external space. Therefore, it is possible to prevent the refrigerant filled between the second chambers C2 from leaking to the outside.

9A and 9B are exploded perspective views showing a heat transfer unit and a condensation unit, and FIGS. 10A and 10B are exploded perspective views showing each blower unit among configurations of a heat dissipation device for an electronic device according to one embodiment and another embodiment of the present invention, 11 is a rear perspective view showing a modified example of a blower unit among configurations of a heat dissipation device for an electronic device according to another embodiment of the present invention, FIG. 12 is an exploded perspective view of FIG. 2B, and FIG. 13 is taken along line B-B of FIG. It is a partial cutaway perspective view taken.

9A and 9B, the refrigerant supply unit 81 is provided in the lower part of the space of the second chamber C2, and the spray unit 83 is provided in the upper part of the space of the second chamber C2. can

Here, the refrigerant supply unit 81 is provided with a refrigerant supply pump located in the lower part of the second chamber C2, and the injection unit 83 is located in the upper part of the second chamber C2, and the refrigerant supply unit 81 ) may be provided as a refrigerant injection nozzle for spraying the liquid refrigerant supplied by the pump in a spray form.

In addition, the refrigerant supply pump and the refrigerant injection nozzle may be interconnected by a refrigerant flow pipe 85 .

More specifically, the refrigerant flow pipe 85 may be vertically fixed to either the left end or the right end of the partition plate unit 10 vertically, as shown in FIGS. 6 and 9B . A lower end of the refrigerant flow pipe 85 may be connected to a refrigerant supply pump, and an upper end of the refrigerant flow pipe 85 may be connected to a refrigerant injection nozzle.

Meanwhile, the refrigerant injection nozzle is connected in communication with the upper end of the refrigerant flow pipe 85, and may be horizontally fixed to the upper end of the partition plate unit 10. In the refrigerant spray nozzle, a plurality of spray nozzle holes 84 for discharging the refrigerant downward may be formed spaced apart in left and right directions.

Therefore, when the refrigerant supply unit 81 provided as a refrigerant supply pump pumps the liquid refrigerant collected in the lower space of the second chamber C2, the liquid refrigerant flows through the refrigerant flow pipe 85 to the second chamber C2. is supplied to the upper space of the refrigerant and is sprayed downward in the upper space of the second chamber C2 by the spraying unit 83 provided as a refrigerant spray nozzle, and the partition plate unit 10 of the configuration of the heat transfer unit 110 ) Is adsorbed on the plurality of evaporation inducing ribs 15 formed on the rear surface, evaporates into a gaseous state, and then is condensed into a liquid state through the plurality of condensing ribs 45 of the condensation unit 140, and then returns to the second chamber C2. It is possible to more quickly dissipate heat from the first chamber C1 while repeating being collected into the lower space of the.

Here, the refrigerant supply pump, which is the refrigerant supply unit 81, may be fixed to the liquid refrigerant storage rib 43 formed larger than the plurality of condensation ribs 45 in the lower space of the second chamber C2. The liquid refrigerant condensed and liquefied by the plurality of condensation ribs 45 is usually stored in the liquid refrigerant storage rib 43 so that at least the inlet of the refrigerant suction pipe (not shown) of the refrigerant supply pump is locked.

In addition, the refrigerant supply pump may be electrically communicated with the printed circuit board 30 of the first chamber C1 via a pair of connecting pins 87 as shown in FIG. 6 . More specifically, as referenced in FIG. 6 , the pair of connecting pins 87 are the heat transfer unit 110 between the first chamber C1 and the second chamber C2 (ie, the partition plate unit 10). ), and serves to connect the printed circuit board 30 in the first chamber C1 and the refrigerant supply pump in the second chamber C2 to electrically communicate with each other. One of the pair of connecting pins 87 plays a role corresponding to the negative power terminal, and the other of the pair of connecting pins 87 plays a role corresponding to the positive power terminal, so that the refrigerant supply pump Supply and cut-off of operating power can be controlled.

Referring to FIGS. 9A and 9B and 10A , the blower 150 includes a plurality of blowers 51 vertically arranged in multiple stages on the rear side of the condensing unit 140, and a plurality of blowers 51 of the plurality of blowers 51. It may include a pair of guide bracket panels 53a and 53b for laterally guiding the air blown by the plurality of blowers 51 while mediating coupling to the condensation rib 45 .

That is, the plurality of blowers 51 may serve to blow air between the plurality of condensing ribs 45 by blowing outside air from the rear. Therefore, the outside air blown by the plurality of blowers 51 is blown and supplied to the outside of the plurality of condensation ribs 45, thereby shortening the condensation time of the gaseous refrigerant present in the second chamber C2.

Here, the pair of guide bracket panels 53a and 53b are a plurality of blowers disposed in the middle of the rear surface of the plurality of condensation ribs 45 of the configuration of the condensation unit 140, as shown in FIG. 51) by blocking the left part and the right part, respectively, it serves to allow the outside air introduced by the plurality of blowers 51 to flow sideways through the plurality of condensing ribs 45.

On the other hand, a pair of guide bracket panels 53a and 53b of the configuration of the blower 150 serve to guide the blowing direction by the plurality of blowers 51, as shown in FIG. 10B, and at the same time, A plurality of heat dissipation fins 54 are formed to protrude from the rear surface, and heat transmitted through the front ends of the plurality of condensation ribs 45 can be absorbed and dissipated.

In addition, as shown in FIG. 10A, the heat dissipation device of the electronic device according to an embodiment of the present invention adopts a method in which a plurality of blowers 51 are directly assembled to a pair of guide brackets 53a and 53b, respectively. However, as shown in FIG. 10B, the plurality of blowers 51 are first fixed to the blower bracket 52 so as to mediate the coupling to the pair of guide brackets 53a and 53b, and then integrally A method of assembling the pair of guide brackets 53a and 53b is also acceptable. Here, the blower 150 may further include a bracket cover panel 57 covering the front of the blower bracket 52, as shown in FIG. 10B. The bracket cover panel 57 is preferably formed in the form of a grill through which outside air from the rear by the blower 51 can be introduced.

In addition, the blower 150 is provided on any one 53a of a pair of guide bracket panels 53a and 53b to control the operation of the plurality of blowers 51, as shown in FIGS. 9A to 10A. A printed circuit board 55 for a blower may be further included. Although the printed circuit board 55 for the blower is not shown in the drawings, it is provided to conduct electricity with the printed circuit board 30 located inside the first chamber C1, or the printed circuit board of the first chamber C1 ( 30), it is possible to independently receive power and control to supply operating power to the plurality of blowers 51.

Meanwhile, as shown in FIG. 11 , the blowing units 150a and 150b may be provided as a pair at both left and right ends of the condensing unit 140, respectively. Here, the blowing units 150a and 150b may be set to have different blowing directions according to the heights of the plurality of condensing ribs 45 . For example, as shown in FIG. 11, the blower 51 provided at the top of the condensing unit 140 passes between at least three condensing ribs 45 and blows in any one of the left and right horizontal directions. And, the blower 51 located below it is provided so that the blowing direction is repeatedly reversed, such as passing between at least three of the plurality of condensing ribs 45 and being installed to blow in the other one of the left and right horizontal directions. It can be.

Here, as referenced in FIG. 12, when the blower 150 is provided with only a single number vertically long at the center of the rear surface of the condensing unit 140, the rear end of the plurality of condensing ribs 45 is attached to the blower 51. It may be provided in the form of a spiky rib 45' so that blowing resistance by the air can be minimized. The spiky ribs 45' are formed so that their ends converge toward the rear to have a triangular cross section, thereby minimizing blowing resistance when blowing between the plurality of condensing ribs 45 by the blower 51.

On the other hand, as shown in FIGS. 7 and 10A, in the heat dissipation device 1 of the electronic device according to an embodiment of the present invention, the left end and the right end respectively transfer heat while wrapping the rear side of the heat dissipation plate unit 40. A mounting bracket 60 fixed to the partition plate unit 10 of the unit 110 and mediating coupling to a predetermined unit may be further included.

For example, as shown in FIGS. 7 and 10A, the mounting bracket 60 is a holding pole (not shown) provided at an installation location for antenna devices (reference numerals not shown) in which antenna elements are mounted on the printed circuit board 30. ) plays a role in mediating the binding to predetermined parts such as

The left end 61a and the right end 61b of the mounting bracket 60 each extend a predetermined length forward from the rear side of the air blower 150 toward the left and right sides of the heat dissipation plate 40, and the partition plate 10 ) The fixing screws (not shown) temporarily assembled to the screw coupling parts (12, see FIG. 2a) provided at the left end (61a) and the right end (61b) of the screw seating groove (63) in the form of opening from the bottom to the top After it is seated by the seating operation, fixation can be completed by solid fastening of the fixing screw.

The left end 61a and the right end 61b of the mounting bracket 60 are connected through the bracket body panel 62, and the bracket body panel 62 is fixed to a predetermined portion such as the above-mentioned holding pole, thereby present embodiment The heat dissipation device 1 of the electronic device according to the example may be fixed.

However, it is not necessary that the mounting bracket 60 be provided for the installation of the heat dissipation device 1 of the electronic device on the holding pole, and as another embodiment of the present invention, as shown in FIGS. 10B and 11 to 13 As such, when installed on the holding pole via the clamping device 200, the coupling flange 211 at the tip of the tilting portion 210 of the configuration of the clamping device 200 directly connects the plurality of condensing ribs 45. It is also possible to be provided so as to be coupled to the rear end.

In this case, the tilting unit 210 is coupled in a form surrounding the blowing unit 150 from the rear, and the pair of guide bracket panels 53a and 53b have a coupling flange 211 formed at the tip of the tilting unit 210 Avoidance cutouts 58a and 58b having a predetermined portion cut out may be formed so that each is directly coupled to the rear end of the plurality of condensation ribs 45 by bolting or screwing without interference.

On the other hand, as shown in FIG. 13, a plurality of support bars 48 may be integrally formed at the front end of the plurality of condensation ribs 45 of the configuration of the condensation unit 140, and the front end thereof is the partition plate portion. Screw coupling by the assembly screw 49 to the rear surface of (10) may be possible. However, the plurality of support bars 48 do not necessarily have to be integrally formed with the plurality of condensation ribs 45, and although not shown in the drawings, they are provided in a separate bar shape, and the front and rear ends are respectively assembled screws 49, It is also possible to be screwed by (not shown).

In the above, an embodiment of a heat dissipation device for an electronic device according to the present invention has been described in detail with reference to the accompanying drawings. However, it should be taken for granted that the embodiments of the present invention are not necessarily limited by the above-described embodiment, and various modifications and implementation within the equivalent range are possible by those skilled in the art to which the present invention belongs. will be. Therefore, it will be said that the true scope of the present invention is determined by the claims described later.

1: Heat dissipation device of electrical element 10: Partition plate
11: border of partition plate 12: screw coupling
13: contact protrusion 15: evaporation induction rib
16: refrigerant inlet 17: one side slope
18: other inclined portion 19: refrigerant outlet
20: radome panel 30: printed circuit board
31: heating element 33: heat transfer groove
40: heat sink unit 43: refrigerant storage rib
45: condensation rib 46: fine step portion
51: blower 53a, 53b: guide bracket panel
55: printed circuit board for blower 60: mounting bracket
61a: left end 61b: right end
63: seating groove 70: shielding sealer
81: refrigerant supply unit 83: injection unit
85: refrigerant flow pipe 87: connecting pin
90: pressure regulator 110: heat transfer unit
140: condensation unit 150: blowing unit
C1: first chamber C2: second chamber

Claims (25)

A first chamber in which a printed circuit board on which a heating element is mounted is disposed;
a second chamber for exchanging heat with heat transferred from the first chamber, having a dispensing unit dispensing refrigerant and a refrigerant supply unit supplying the refrigerant to the dispensing unit;
a heat transfer unit disposed between the first chamber and the second chamber to receive heat from the heating elements of the first chamber and supply the heat to the second chamber; and
a condensing unit condensing the refrigerant injected into the second chamber; including,
The condensation part,
a heat dissipation plate part constituting a part of the space of the second chamber while constituting an exterior of the rear side of the second chamber; and
a plurality of condensation ribs protruding toward the rear side of the heat dissipation plate and being recessed in the space of the second chamber to expand a portion of the space of the second chamber, and formed in multiple stages in the vertical direction of the heat dissipation plate; Including, the heat dissipation device of the electronic device. The method of claim 1,
A plurality of evaporation induction ribs are formed on the surface of the heat transfer unit exposed to the second chamber, which guides the liquid refrigerant injected by the injection unit to flow downward in a zigzag direction after being adsorbed,
The plurality of evaporation induction ribs,
a refrigerant inlet disposed close to the spraying unit and arranged vertically vertically;
one side inclined portion bent and extended obliquely downward from the lower end of the refrigerant inlet; and
The other side inclined portion bent and extended obliquely from the lower end of the one side inclined portion to the lower side of the other side; including,
A heat dissipation device for an electronic device, in which the one side inclined portion and the other side inclined portion are repeatedly formed. The method of claim 1,
The plurality of evaporation induction ribs,
Protrudes from the first chamber in a direction in which the second chamber is provided to adsorb the refrigerant injected from the ejection unit, and to increase a heat exchange area and adsorption time for heat exchange with heat of the heating element transferred from the first chamber A heat dissipation device for electronic devices in which a zigzag-shaped flow path is formed. The method of claim 1,
The heat transfer unit,
a partition plate part disposed to partition between the first chamber and the second chamber; and
a plurality of contact protrusions protruding from one surface of both surfaces of the partition plate part exposed toward the first chamber and contacting the printed circuit board; including,
The plurality of evaporation induction ribs are integrally formed to protrude from one side of both sides of the partition plate part exposed toward the second chamber. The method of claim 4,
The second chamber is formed by covering and coupling the heat dissipation plate constituting the condensation part to the rear of the partition plate part as a space recessed forward from the edge end of the partition plate part. The method of claim 4,
The plurality of contact protrusions are designed in shape in consideration of the amount of heat generated according to the mounting position of the heating element mounted on the printed circuit board. The method of claim 1,
The plurality of condensation ribs are formed so that the vertical cross-sectional area gradually decreases toward the rear side of the heat sink unit. The method of claim 7,
The second chamber is formed by covering and coupling a partition plate constituting the heat transfer unit to a front of the heat dissipation plate as a space recessed backward from an edge end of the heat dissipation plate. The method of claim 7,
The plurality of condensation ribs are formed so that the inner upper surface is downwardly inclined backward and the inner lower surface is inclined upwardly backward. The method of claim 9,
An upward inclination angle of the inner lower surface with respect to an arbitrary horizontal surface is greater than or equal to a downward inclination angle of the inner upper surface with respect to an arbitrary horizontal surface. The method of claim 7,
An inner surface of the plurality of condensation ribs is formed to have a plurality of minutely stepped portions. The method of claim 7,
The condensation part,
a plurality of support bars provided to support a front end of the plurality of condensation ribs and a rear surface of the partition plate part disposed to partition between the first chamber and the second chamber; Further comprising a heat dissipation device of the electronic device. The method of claim 1,
a radome arranged to form a front side outer shape of the first chamber; Including more,
The first chamber is formed between the radome and the partition plate constituting the heat transfer unit,
The second chamber is formed between the partition plate part and the heat dissipation plate part of the condensation part constituting the outer shape of the rear side of the second chamber. The method of claim 13,
a mounting bracket that encloses a rear side of the heat dissipation plate unit and fixes left and right ends to the partition plate part of the heat transfer unit, respectively, and mediates coupling to a predetermined unit; Further comprising a heat dissipation device of the electronic device. The method of claim 13,
a shield sealer interposed along an edge between the partition plate unit and the heat dissipation plate unit to shield and seal the second chamber and an external space; Further comprising a heat dissipation device of the electronic device. The method of claim 1,
The heat transfer unit is configured such that the amount of heat transferred from the first chamber to the second chamber is mutually exchanged through total heat of the refrigerant, and the refrigerant stored in the second chamber is sensible heat and A heat dissipation device for an electronic device, provided so that phase changes of evaporation and condensation are made by enthalpy change of latent heat, and heat is transferred from the first chamber to the second chamber. The method of claim 7,
a blower provided behind the condensing unit and blowing outside air toward the condensing unit; Further comprising a heat dissipation device of the electronic device. The method of claim 17
the blower,
a plurality of blowers vertically arranged in multiple stages on the rear side of the condensing unit; and
a pair of guide bracket panels for mediating coupling of the plurality of blowers to the plurality of condensing ribs and guiding the air blown by the plurality of blowers in a lateral direction; Including, the heat dissipation device of the electronic device. The method of claim 18
the blower,
a printed circuit board for blowing control provided on any one of the pair of guide bracket panels to control the operation of the plurality of blowers; Further comprising a heat dissipation device of the electronic device. The method of claim 7,
a pair of blowers provided at both left and right ends of the condensing unit and blowing outside air in horizontal directions; Further comprising a heat dissipation device of the electronic device. The method of claim 4,
The refrigerant supply unit is provided with a refrigerant supply pump located in the lower part of the second chamber,
The injection unit is located in an upper part of the second chamber and is provided with a refrigerant injection nozzle for spraying the refrigerant pumped and supplied by the refrigerant supply unit,
Wherein the refrigerant supply pump and the refrigerant injection nozzle are connected by a refrigerant flow pipe. The method of claim 21,
The refrigerant flow pipe is vertically fixed to the left end or the right end of the partition plate part,
The refrigerant injection nozzle is connected in communication with the upper end of the refrigerant flow pipe and is horizontally fixed to the upper end of the partition plate part,
In the refrigerant spray nozzle, a plurality of spray nozzle holes for discharging the refrigerant downward are formed to be spaced apart in the left and right directions. The method of claim 21,
A pair of connecting pins disposed to pass through the heat transfer unit between the first chamber and the second chamber, and provided to electrically communicate the printed circuit board in the first chamber and the refrigerant supply pump in the second chamber. ; Further comprising a heat dissipation device of the electronic device. The method of claim 1,
a pressure regulator for regulating the pressure in the second chamber; Further comprising a heat dissipation device of the electronic device. The method of claim 1,
The heating element includes at least one of an antenna element and a radio signal processing unit (RU: Radio Unit).

Images