KR102523881B1 - Flat display panel and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a flat panel display panel and a manufacturing method thereof, and more particularly, to a flat panel display panel driven in an active manner by using a controller without using a switching element composed of thin film transistors, and to a manufacturing method thereof.
In the present invention, a pixel electrode (anode electrode) formed by a thin film process is provided on the upper surface of the lower substrate, and a microcontroller for driving the pixel electrode is provided on the lower side.
The flat panel display panel according to the present invention can be implemented in an active driving method without using a thin film transistor. Therefore, by removing the thin film transistors required for each pixel in the conventional flat panel display panel, the process yield can be increased, and a large-sized, high-definition panel can be provided at a low price.

Description

Flat display panel and manufacturing method thereof {FLAT DISPLAY PANEL AND MANUFACTURING METHOD THEREOF}

The present invention relates to a flat panel display panel and a manufacturing method thereof, and more particularly, to a flat panel display panel driven in an active manner by using a controller without using a switching element composed of thin film transistors, and to a manufacturing method thereof.

As the information society develops, the demand for display devices for displaying images is increasing in various forms. Recently, Liquid Crystal Display (LCD), Organic Light Emitting Display Device (OLED), or an organic light emitting display), various flat panel display devices are being utilized. These various flat display devices include flat display panels suitable for them.

A conventional flat panel display panel has a structure in which thin film transistors are formed in each pixel area, and a specific pixel area in the flat panel display panel is controlled by applying a voltage to a pixel electrode through a current flow of the thin film transistor. A thin film transistor is a semiconductor device composed of a gate and source/drain electrodes.

A liquid crystal display device is a display device using a driving method of injecting liquid crystal between a pixel electrode and a common electrode and turning on/off the liquid crystal using a voltage applied between the pixel electrode and the common electrode.

An organic light emitting display device includes an anode electrode electrically connected to a pixel electrode, a cathode electrode opposite to the anode electrode, an organic light emitting layer formed between the anode electrode and the cathode electrode, and electrons generated from one electrode and When holes generated from the other electrode are injected into the light emitting layer, the injected electrons and holes are combined to generate exciton, and the generated exciton changes from an excited state to a ground state. It is a display device that emits light while falling and displays an image.

1 is a block diagram of a driving circuit of a conventional flat panel display. In a conventional flat panel display device, a plurality of first lines D1 to Dm are formed in a first direction (eg, a vertical direction), and a plurality of second lines HL1 to HLn are formed in a second direction (eg, a horizontal direction). The formed display panel 100, the first driver 220 supplying the first signal to the plurality of first lines D1 to Dm, and the supply of the second signal to the plurality of second lines HL1 to HLn and a timing controller 210 (referred to as 'TCON') that controls the second driving unit 230 and the first driving unit 220 and the second driving unit 230.

The display panel 100 includes a plurality of first lines D1 to Dm formed in a first direction (eg, a vertical direction) and a plurality of second lines HL1 to HLn formed in a second direction (eg, a horizontal direction). A plurality of pixels (P: Pixels) are formed according to the intersection of . Each of the aforementioned first driving unit 220 and second driving unit 230 may include at least one driver IC that outputs a signal for displaying an image.

The plurality of first lines D1 to Dm formed in a first direction on the display panel 100 are, for example, formed in a vertical direction (first direction) to transmit data voltages (first signals) to pixel columns in the vertical direction. The first driver 220 may be a data driver that supplies a data voltage to the data wire. In addition, the plurality of second lines HL1 to HLn formed in the second direction of the display panel 100 are formed in the horizontal direction (second direction) and transmit scan signals (first signals) to pixel columns in the horizontal direction. It may be a wire, and the second driver 230 may be a gate driver that supplies a scan signal to the gate wire. As a recent technology trend, the gate driver is also configured to be included in the display panel 100 in a COG (Chip on Glass) method.

In addition, a pad part is formed in the display panel 100 to be connected to the first driving unit 220 and the second driving unit 230 . When the pad unit supplies the first signal to the plurality of first lines D1 to Dm from the first driving unit 220, it transfers the signal to the display panel 100, and similarly, the second driving unit 230 supplies the plurality of second lines (D1 to Dm). When the second signal is supplied to HL1 to HLn), it is transmitted to the display panel 100 .

Each pixel includes one or more subpixels. The sub-pixel refers to a unit in which a specific type of color filter is formed or an organic light emitting device can emit light of a specific color without a color filter. Colors defined by the sub-pixels may include red (R), green (G), blue (B), and optionally white (W), but the present invention is not limited thereto. Since each sub-pixel includes each thin film transistor and an electrode connected thereto, the sub-pixel constituting the pixel is also referred to as one pixel area.

Meanwhile, organic light emitting display devices include top emission, bottom emission, dual emission, and the like. Regardless of which light emitting method is selected, in a large-area display panel where the display panel increases, a voltage drop of the cathode may occur in the process of forming the cathode on the front surface. can Hereinafter, in the present specification, an organic light emitting display device will be described with a focus on a top emission display device unless otherwise specified, but the embodiments of the present invention are not limited to the top emission device, and all methods for preventing the voltage drop of the cathode are not limited thereto. It can be applied to the structure of a display device.

2 is a cross-sectional view of a conventional liquid crystal display panel. A buffer layer 103 is formed on the lower transparent substrate 101, and a channel region 104 is patterned on the buffer layer 103. A gate insulating layer 105 and a gate electrode 107 are patterned on the upper portion of the channel region 104 . Next, a first interlayer insulating film 110 is formed, and a source electrode 111 and a drain electrode 113 connected through a through hole are formed on the first interlayer insulating film 110 . After the second interlayer insulating film 112 is formed, it is planarized, and a pixel electrode 115 connected through a through hole is formed on the planarized second interlayer insulating film 112 . In a separate process, the upper transparent substrate 150 having the common electrode 119 is formed on the opposite surface facing the lower transparent substrate 101 . After the lower transparent substrate 101 and the upper transparent substrate 150 are laminated and liquid crystal is injected therebetween, the liquid crystal display panel is completed. Since the liquid crystal display panel is a passive light emitting device, the light emitted from the backlight is polarized and used, so the first polarizing plate 301 is formed under the lower transparent substrate 101 and the second polarizing plate 303 is formed on the upper transparent substrate 150. When the is attached, a liquid crystal display panel having a cross-sectional view as shown in FIG. 2 is completed. A color filter layer, a back light unit, and other optical films are attached to the liquid crystal display panel, but these configurations are not related to the characteristics of the present invention, so they will not be described. A common potential is applied to the common electrode 119, and a second signal supplied through the second lines HL1 to HLn of FIG. 1 is applied to the gate electrode 109, and the first lines D1 to Dm of FIG. ) is finally supplied to the pixel electrode 115 through the source electrode 111 . The potential supplied to the source electrode 111 is supplied while changing its polarity every cycle in order to prevent deterioration of the liquid crystal.

In the cross-sectional view of FIG. 2 , it has been described that the pixel electrode 115 connected to the drain electrode 109 through the second interlayer insulating film 112 is formed, but in a practical structure, a third interlayer insulating film is formed on the drain electrode 109, After forming a connection electrode connected to the drain electrode 109 through a through hole on the upper part of the third interlayer insulating film, forming a second layer gun insulating film 112 on the upper part of the third interlayer insulating film and the connecting electrode, the second interlayer insulating film It is common to have a structure in which the pixel electrode 115 is formed on the top after planarizing (112). The pixel electrode 115 and the connection electrode are connected in a conductive state through a through hole formed in the second interlayer insulating film 112 .

Since the liquid crystal display panel uses liquid crystal that does not emit light itself, a light source is supplied through a backlight unit. Therefore, except for a material that cannot be formed as a transmissive type, such as a thin film transistor, the rest of the components must be formed of a transparent material to increase the aperture ratio. Accordingly, the pixel electrode 115 and the common electrode 119 must be formed of a transparent conductive material.

3 is a cross-sectional view of a conventional organic light emitting display panel. A buffer layer 103 is formed on the lower substrate 101, and a channel region 104 is patterned on the buffer layer 103. A gate insulating layer 105 and a gate electrode 107 are patterned on the upper portion of the channel region 104 . Next, a first interlayer insulating film 110 is formed, and a source electrode 111 and a drain electrode 113 connected through a through hole are formed on the first interlayer insulating film 110 . After the second interlayer insulating film 112 is formed, it is planarized, and a pixel electrode 115 connected through a through hole is formed on the planarized second interlayer insulating film 112 . Generally, in an organic light emitting display panel, it is called an anode electrode rather than a pixel electrode. In the present invention, the anode electrode or the pixel electrode 115 will be used interchangeably. An organic light emitting layer 121 is formed on the anode electrode 115 . In order to insulate the organic light emitting layer 121 from the anode electrode 115 constituting the adjacent small electrode, the bank 127 made of an insulating material is formed as an overcoat (OC). When the cathode electrode 119 is formed on the organic light emitting layer 121 and the bank 127, and the moisture barrier layer 307 is formed on the top, manufacturing of the organic light emitting display panel is completed. In the case of an organic light emitting display panel for a large screen used in a TV or the like, it is necessary to maintain a uniform voltage applied to the cathode electrode 119 . In the case of a TV, since a large screen must be configured, a voltage drop problem occurs between the cathode electrode 119 positioned close to the side to which voltage is applied from TCON and the cathode electrode 119 positioned in the center of the screen. In order to solve the problem of cathode voltage drop (in other words, cathode electrode resistance increase), cathode electrodes 119 of neighboring pixels are patterned to be disconnected from each other on the left and right sides of the bank 127 . In addition, a conductive material having a lower resistance than the cathode electrode 119 is formed on the upper part of the bank 127 to electrically connect adjacent cathode electrodes 119 patterned to be disconnected from each other to lower the electrical resistance. Since the configuration for solving the cathode resistance problem and the compensation circuit for compensating the brightness of each pixel are beyond the features of the present invention, a detailed description thereof will be omitted.

In FIG. 3 , the channel region 104 is formed of an oxide semiconductor or low temperature poly-silicon (LTPS). The source electrode 111, the drain electrode 113, and the gate electrode 107 are conductive materials, and may be Cu/MoTi or a Mo/Al/Mo alloy in one embodiment, but are not limited thereto and various materials may be applied. . The anode electrode 115 may use ITO or ITO/Ag/ITO. Alternatively, Cu, Mo, or an alloy thereof may be used. The bank 450 may use an overcoat (OC), and the cathode electrode 119, which is the second electrode, may use ITO, IGZO, IZO, Mg, Ag, or an alloy thereof. As shown in FIG. 3, when forming the top emission type, the cathode electrode 118 should be formed as a transparent electrode, whereas the anode electrode 115 may be formed opaque, so it is generally a conductive material with high conductivity. form with

In the cross-sectional view of FIG. 3, it has been described that the anode electrode 115 connected to the drain electrode 109 is formed through the second interlayer insulating film 112, but in a practical structure, a third interlayer insulating film is formed on the drain electrode 109, After forming a connection electrode connected to the drain electrode 109 through a through hole on the upper part of the third interlayer insulating film, forming a second layer gun insulating film 112 on the upper part of the third interlayer insulating film and the connecting electrode, the second interlayer insulating film It is common to have a structure in which an anode electrode 115 is formed on the top after planarizing (112). The anode electrode 115 and the connection electrode are connected in a conductive state through a through hole formed in the second interlayer insulating film 112 .

In the organic light emitting display panel of FIG. 3, a common potential is applied to the cathode electrode 119, and a second signal supplied through the second lines HL1 to HLn of FIG. 1 is applied to the gate electrode 109. The data signal supplied through the first lines D1 to Dm of 1 is finally supplied to the anode electrode 115 through the source electrode 111 and operated as a display element.

Conventional flat panel display devices are implemented using thin film transistors as shown in FIGS. 2 and 3 . However, since these thin film transistors are implemented using a semiconductor process on a transparent substrate, the defect rate is generally higher than that of the thin film formation process for forming the liquid crystal layer, color filter layer, and organic light emitting layer. is being highlighted as a problem that lowers the For example, since a flat panel display device implementing a Full HD TV (4K) has about 8 million pixels, the same number of thin film transistors must be implemented. Therefore, in order to increase the yield as the high resolution of the large size increases, a flat panel display panel capable of reducing semiconductor processes and a method for manufacturing the same are required.

Korean Patent Publication No. 10-2016-0127197 (published on November 3, 2016)

SUMMARY OF THE INVENTION An object of the present invention is to provide a flat panel display panel that can be implemented in an active driving method without using a thin film transistor process and a manufacturing method thereof.

The above object of the present invention is a lower substrate having a plurality of through holes formed through the thickness direction, a plurality of through electrodes formed of a conductive material applied inside the plurality of through holes, and a plurality of through electrodes formed in a pattern on the upper part of the lower substrate. pixel electrodes, - the number of pixel electrodes and the number of through electrodes are the same, and the through electrodes are electrically connected to corresponding respective pixel electrodes - a pattern is formed on the bottom of the lower substrate to be electrically connected to the plurality of through electrodes and a microcontroller mounted to be connected to the conductive wire and manufactured through a separate semiconductor manufacturing process, characterized in that the voltage supplied to each of the pixel electrodes is controlled through the microcontroller. This can be achieved with a flat display panel.

In addition, a liquid crystal display panel can be formed by filling a liquid crystal between an upper substrate having a common electrode for applying a common potential on the lower surface of the substrate and liquid crystal between the upper substrate and the lower substrate.

Alternatively, an organic light emitting display panel may be formed by providing an organic light emitting layer formed on each pixel electrode and a cathode electrode formed on the organic light emitting layer. When manufacturing an organic light emitting display panel, a bank made of an insulating material should be provided between adjacent pixel electrodes and an organic light emitting layer.

Another object of the present invention is a timing controller (TCON) that receives an externally applied video data signal, generates a timing signal, and outputs the video data signal according to the timing signal, and receives the video data signal from the timing controller. In a flat panel display device including a flat panel display panel, the flat panel display panel includes a lower substrate, and a total of m pixel electrodes are provided on the lower substrate, and the m pixel electrodes are grouped into n adjacent pixel electrodes. It is classified into a plurality of group pixels, - m and n are natural numbers, and m is a larger number than n - A plurality of micro control elements are provided below the lower substrate to apply image data signals to n pixel electrodes of each group pixel It is possible to achieve this in a flat panel display device characterized in that the microcontroller receives image data signals for driving pixel electrodes of corresponding group pixels from the timing controller and then provides them to the pixel electrodes of corresponding group pixels.

Another object of the present invention is a first step of preparing a lower substrate having a plurality of through holes penetrating in a thickness direction, forming a pattern of a plurality of pixel electrodes on the lower substrate, and applying a conductive material to the through holes. A second step of forming through-electrodes, - the through-electrodes are provided in a one-to-one correspondence with the pixel electrodes, and each through-electrode is electrically connected to each pixel electrode - connected to the through-electrode under the lower substrate A third step of forming a lead wire, a fourth step of mounting a micro control element under the lower substrate to be connected to the lead wire, a fifth step of pattern forming an organic light emitting layer on the pixel electrode, and an organic light emitting layer. This can be achieved from a flat panel display panel manufacturing method comprising a sixth step of forming a cathode electrode thereon.

Another object of the present invention is a first step of preparing a lower substrate having a through hole penetrating from the upper surface to the lower surface at a position where a plurality of pixels are placed, patterning a plurality of pixel electrodes on the upper surface of the lower substrate, A second step of forming a through electrode by filling the through hole with a conductive material, a third step of forming a conductive wire connected to the through electrode on the lower surface of the lower substrate, and a second step of mounting a micro control element to be connected to the conductive wire. An organic light emitting display panel manufacturing method comprising four steps, a fifth step of pattern forming an organic light emitting layer on top of the pixel electrode, and a sixth step of forming a cathode electrode on the top of the organic light emitting layer. can be achieved by manufacturing

Another object of the present invention is a lower transparent substrate, a first electrode formed as a front electrode on the lower transparent substrate, an organic light emitting layer and a second electrode sequentially patterned on the first electrode, Forming a through hole in the first interlayer insulating film to be in contact with a first interlayer insulating film formed on the electrode and the second electrode and planarized, and each second electrode, and filling the through hole with a conductive material to form a contact electrode, It is characterized in that it includes a conductive wire contacted with the contact electrode and formed in a pattern on the first interlayer insulating film, and a micro control element manufactured in a separate semiconductor manufacturing process and mounted on the first interlayer insulating film while being connected to the conductive wire. This can also be achieved by an electroluminescent display panel that does.

At this time, the organic light emitting layer and the second electrode are patterned to be spaced apart from the adjacent organic light emitting layer and the second electrode, and it is preferable to form a bank formed of an insulating material to be further provided in the mutually spaced space.

Another object of the present invention is a first step of preparing a lower transparent substrate, a second step of forming a first electrode formed as a front electrode on the upper surface of the lower transparent substrate, and an organic light emitting layer on the top of the first electrode A second step of forming a pattern on the second electrode, a third step of planarizing after forming a first interlayer insulating film covering the first electrode and the second electrode, and contacting the second electrode on the planarized first interlayer insulating film. A fourth step of forming through-holes for processing, filling conductive materials to form contact electrodes, and patterning conductive wires electrically connected to respective contact electrodes on top of the first interlayer insulating film, and a separate semiconductor manufacturing process. This can also be achieved by a method of manufacturing an electroluminescent display panel including a fifth step of locating a microcontroller made of a microcontroller and processing the conductive wire with the wire.

The flat panel display panel according to the present invention can be implemented in an active driving method without using a thin film transistor. Therefore, by removing the thin film transistors required for each pixel in the conventional flat panel display panel, the process yield can be increased, and a large-sized, high-definition panel can be provided at a low price.

In addition, conventional flat panel display panels had to use a heat-resistant substrate to apply a semiconductor process for forming thin film transistors on the lower substrate, but the lower substrate of the flat panel display panel manufactured according to the present invention has pixel electrodes (anode electrodes) and/or Alternatively, since only the cathode electrode can be manufactured through a thin film process, a process temperature that must be endured during manufacturing can be lowered, so there is an advantage in that a low-cost lower substrate can be used.

For example, since a panel known as 8K is implemented with about 33 million pixels, 33 million thin film transistors must be implemented when implemented in an active driving method using conventional thin film transistors. In the case of a general TV, assuming that a TV having 3 or less defective pixels is regarded as a good product, it can be seen that a great process difficulty is required to produce a good product. On the other hand, assuming that the present invention is applied by grouping 100 pixels into one group pixel, for example, it can be implemented with 33 million/100 = 330,000 microcontrollers, and the microcontrollers are produced in a separate semiconductor process. Therefore, the defect rate will be extremely low, and since it has a configuration mounted on the lower surface or upper surface of the lower substrate, the defect rate can be significantly reduced. Therefore, when the present invention is applied, there is an advantage in that a panel with a large screen and high resolution can be more easily implemented.

1 is a block diagram of a driving circuit of a conventional flat panel display;
2 is a cross-sectional view of a conventional liquid crystal display panel;
3 is a cross-sectional view of a conventional organic light emitting display panel;
4 is a block diagram of a driving circuit of a flat panel display device according to the present invention.
5 is a bottom view showing a part of the lower surface of the flat display panel according to the present invention.
6 is a cross-sectional view of a combination of a liquid crystal display panel and a backlight unit according to an embodiment of the present invention.
7 is a cross-sectional view of an organic light emitting display panel according to an embodiment of the present invention.
8 is a plan view of the flat display panel according to the present invention viewed from the top direction;
9 is a cross-sectional view of a liquid crystal display panel according to an embodiment of the present invention.
10 is a cross-sectional view of an organic light emitting display panel according to an embodiment of the present invention.
11 is a cross-sectional view of an organic light emitting display panel according to an embodiment of the present invention.
12 is a cross-sectional view of an organic light emitting display panel equipped with a moisture barrier layer according to an embodiment of the present invention.
13 is a cross-sectional view of an organic light emitting display panel equipped with a moisture permeation barrier according to an embodiment of the present invention.
14 is a cross-sectional view of an organic light emitting display panel equipped with a moisture barrier layer according to an embodiment of the present invention.

Since the present invention can make various changes and have various embodiments, specific embodiments are illustrated in the drawings and described in detail.

This is not intended to limit the present invention to specific embodiments, and should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

4 is a block diagram of a driving circuit of a flat panel display device according to the present invention. In the flat panel display panel 100, six pixels P1, P2, ..., P6 are grouped to form a group pixel PG1, and a plurality of such group pixels are provided. In a conventional flat panel display device, since the timing controller 210 applies data signals to individual pixels, TCON has a first frame buffer for storing the entire screen for the previous frame and a second buffer for storing the entire screen for the current frame. It is common to have a frame buffer and apply a control signal to the flat panel display panel to display only the changed contents of the first frame buffer and the second frame buffer. On the other hand, since the flat panel display device according to the present invention is driven by dividing one entire screen into a plurality of group pixels, the TCON 210 stores images of the previous frame and the current frame for each group pixel and compares them. Therefore, at least two small-sized frame buffers must be provided. That is, the TCON 210 divides the entire screen into a plurality of group pixels and applies a timing control signal and a video data signal corresponding to the divided image to each group pixel. Therefore, the TCON of the flat panel display device according to the present invention has a disadvantage in that circuit logic must be more complicated than the TCON of the conventional flat panel display device.

As shown in FIG. 4, a plurality of pixels P1, P2, ..., P6 are patterned on the upper surface of the lower substrate constituting the flat display panel according to the present invention. A through hole penetrating from the upper surface to the lower surface is formed in a corresponding region of the lower substrate where each pixel P1, P2, ..., P6 is provided, and the through hole is filled with a conductive material to connect the pixel electrode and the through hole of each pixel. will remain in a challenging state. In addition, a micro control element is provided for each group pixel on the lower surface of the lower substrate.

5 is a bottom view showing a part of the lower surface of the flat display panel according to the present invention. In FIG. 5 , P1C, P2C, ..., P6C show a state in which through-holes corresponding to the pixels P1, P2, ..., P6 formed on the upper surface are filled with a conductive material. It can be seen that the conductive wiring 123 is formed in a pattern so that each of the through electrodes P1C, P2C, ..., P6C is independently connected to the micro control element 125. The control signal and the video data signal applied from the TCON are transferred to the microcontroller 125, and the microcontroller 125 is driven in such a way as to supply video signals to each pixel constituting the corresponding group pixel at an appropriate timing.

According to the present invention shown in FIGS. 4 and 5, it is preferable to apply a common potential to the upper surface of the flat panel display panel and apply a video data signal to the lower surface of the flat panel display panel. Driving power must be applied to the microcontroller 125 provided on the lower surface of the flat panel display panel, and this is omitted. Substantially, since there is sufficient space on the lower surface of the flat panel display panel, various wires can be arranged, so there is no major problem.

In addition, in FIGS. 4 and 5, it is suggested that six pixels P1, P2, ..., P6 are grouped to form a group pixel PG1, but this is illustrated for convenience of description. Of course, in actual implementation, various numbers of pixels (for example, 100 pixels) may be defined and implemented as one group pixel.

6 is a cross-sectional view of a combination of a liquid crystal display panel and a backlight unit according to an exemplary embodiment of the present invention. Figure 6 (a) is an embodiment without an interfacial bonding layer, and Figure 6 (b) is a combined cross-sectional view of a liquid crystal display panel and a backlight unit having an interfacial bonding agent. A lower transparent substrate 101 having a through hole 124 penetrating the lower surface of the upper surface of the region where each pixel is placed is provided. A plurality of pixel electrodes 115a and 115b are patterned on the upper surface of the lower transparent substrate 101 . The lower transparent substrate 101 may be formed using glass, quartz, or heat-resistant transparent synthetic resin. Each through hole 124 is filled with a conductive material to maintain a conductive state on the lower surface of the lower transparent substrate 101 through the pixel electrodes 115a and 115b and the through electrodes P1C and P2C. When the conductive wiring 123 as shown in FIG. 5 is patterned on the lower surface of the lower transparent substrate 101 and the micro control element 125 formed through a separate semiconductor process is mounted, the lower transparent substrate 101 can be manufactured. It is completed. Next, the upper transparent substrate 150 provided with the common electrode 119 is formed using a separate process. After combining the upper transparent substrate 150 and the lower transparent substrate 101, liquid crystal 117 is injected therebetween. Next, when the backlight unit 300 is positioned and the first polarizing plate 301 and the second polarizing plate 303 are attached, manufacturing of the liquid crystal display panel according to the present invention is completed. In the case of a conventional liquid crystal display panel, the first polarizer 301 is attached to the lower surface of the lower transparent substrate 150, but in the present invention, since the microcontroller 125 is provided on the lower surface of the lower transparent substrate 150, it cannot be attached. Accordingly, in the present invention, the first polarizing plate 301 is attached to the light exit surface of the backlight unit 300 . Of course, an interfacial adhesive layer 108 may be added as shown in FIG. 6(b) to improve interfacial adhesion between the upper surface of the lower transparent substrate 101 and the pixel electrodes 115a and 115b.

Although a color filter layer and various optical films are attached to the liquid crystal display panel shown in FIG. 6 , these configurations are not related to the characteristics of the present invention and will not be described.

In the configuration of FIG. 6 , it has been described that the microcontroller 125 is manufactured in a separate semiconductor process and then mounted at a predetermined position of the lower transparent substrate 101 . This technology corresponds to a technology already known as COG (Chip On Glass) technology. However, when the microcontroller 125 has a size of 100 μm or less, a separate transfer technique is required to transfer it from the semiconductor wafer to the lower transparent substrate 101 . Such transfer technology may be performed using a known transfer technology such as X-celeprint technology using a stamp method, van der Aals force or MEMS technology, or electromagnetic force.

In the liquid crystal display panel shown in FIG. 6, it is preferable that elements positioned above the backlight unit 300 are made of a transparent material. Therefore, other than the micro control element 125, which is difficult to produce as a transparent element, it is preferable to form the rest of the elements with a transparent material. In addition, setting the mounting position of the microcontroller 125 to the projected vertical lower area of the area where the BM is placed in the color filter layer can improve the aperture ratio.

In the liquid crystal display panel shown in FIG. 6, a common potential is applied to the common electrode 119 formed on the upper surface, and a timing control signal and an image data signal are applied from TCON through the micro control element 125 formed on the lower surface. . The microcontroller 125 analyzes the timing control signal and the image data signal applied from TCON and applies the data signal to the pixel electrodes 115a and 115b of each pixel belonging to the appropriate timing. In this way, the liquid crystal display panel shown in Fig. 6 is driven.

Manufacturing steps of the liquid crystal display panel according to the present invention will be briefly summarized. In the liquid crystal display panel according to the present invention, a first step of preparing a lower substrate having a through hole penetrating from the upper surface to the lower surface at a position where a plurality of pixels are placed, and forming a pattern of a plurality of pixel electrodes on the upper surface of the lower substrate , the second step of forming a through electrode by filling the through hole with a conductive material, the third step of forming a conductive wire connected to the through electrode on the lower surface of the lower substrate, and mounting a micro control element to be connected to the conductive wire The 4th step and the 5th step of preparing an upper substrate having a common electrode on the lower surface in a separate process from the 1st to 4th steps, facing the lower substrate and the upper substrate, and liquid crystal between them. It can be prepared in the sixth step of injecting. Steps 3 and 4 may be performed after any step. For example, steps 1, 3, 4, 2, 5, and 6 may be performed in order. Alternatively, it is okay to proceed in the order of step 1, step 3, step 2, step 4, step 5 and step 6. Alternatively, it is possible to proceed in the order of step 1, step 2, step 5, step 6, step 3 and step 4.

7 is a cross-sectional view of an organic light emitting display panel according to an exemplary embodiment of the present invention. 7(a) is an embodiment without an interfacial adhesion layer, and FIG. 7(b) is a cross-sectional view of an organic light emitting display panel having an interfacial adhesion layer. A lower substrate 101 having a through hole 124 penetrating the lower surface from the upper surface of the region where each pixel is placed is provided. A plurality of anode electrodes 115a and 115b are patterned on the upper surface of the lower substrate 101 . The lower substrate 101 does not need to be formed of a transparent material, and may be formed using glass, quartz, or heat-resistant synthetic resin. Each through hole 124 is filled with a conductive material to maintain a conductive state on the lower surface of the lower substrate 101 through the pixel electrodes 115a and 115b and the through electrodes P1C and P2C. An organic light emitting layer 121 is patterned on the anode electrode 115 . In order to insulate the anode electrode 115 and the organic light emitting layer 121 disposed adjacent to each other, the bank 127 made of an insulating material is formed as an overcoat (OC). When the cathode electrode 119 is formed on the organic light emitting layer 121 and the bank 127, and the moisture barrier layer 307 is formed on the top, manufacturing of the organic light emitting display panel is completed. In the case of an organic light emitting display panel for a large screen used in a TV or the like, it is necessary to maintain a uniform voltage applied to the cathode electrode 119 . In the case of a TV, since a large screen must be configured, the voltage applied to the cathode electrode 119 located close to the side to which the voltage is applied from TCON and the cathode electrode 119 located in the center of the screen is a voltage difference due to the resistance of the cathode electrode 119 A voltage drop problem occurs. In order to solve the problem of cathode voltage drop (in other words, cathode electrode resistance increase), cathode electrodes 119 of neighboring pixels are patterned to be disconnected from each other on the left and right sides of the bank 127 . In addition, a conductive material having a lower resistance than the cathode electrode 119 is formed on the upper part of the bank 127 to electrically connect adjacent cathode electrodes 119 patterned to be disconnected from each other to lower the electrical resistance. Since the configuration for solving the cathode resistance problem and the compensation circuit for compensating the brightness of each pixel are beyond the features of the present invention, a detailed description thereof will be omitted.

In FIG. 7 , the anode electrode 115 may use ITO or ITO/Ag/ITO. Alternatively, Cu, Mo, or an alloy thereof may be used. The bank 450 may use an overcoat (OC), and the cathode electrode 119, which is the second electrode, may use ITO, IGZO, IZO, Mg, Ag, or an alloy thereof. As shown in FIG. 7, when forming the top emission type, the cathode electrode 118 must be formed as a transparent electrode, whereas the anode electrode 115 may use an opaque electrode, so it generally has high conductivity. form with material When the conductive wiring 123 shown in FIG. 5 is patterned on the lower surface of the lower substrate 101 and the micro control device 125 formed through a separate semiconductor process is mounted, the electroluminescence display device is completed. In addition, the mounting position of the microcontroller 125 can improve the aperture ratio by setting the projected vertical lower area of the area where the bank is placed. Of course, an interfacial bonding layer 108 may be added as shown in FIG. 7(b) to improve interfacial adhesion between the upper surface of the lower transparent substrate 101 and the anode electrodes 115a and 115b.

In the electroluminescence display panel shown in FIG. 7, a common potential is applied to the cathode electrode 119 formed on the upper surface, and a timing control signal and an image data signal are applied from TCON through the micro control element 125 formed on the lower surface. receive The microcontroller 125 analyzes the timing control signal and the image data signal applied from the TCON and applies the data signal to the anode electrodes 115a and 115b of each pixel belonging to the appropriate timing. In this way, the electroluminescent display panel shown in FIG. 7 is driven.

In the case of an electroluminescent display panel, the lower substrate 101 does not need to be implemented as transparent. In addition, in the case of a conventional electroluminescent display panel, since thin film transistors must be formed on the lower substrate 101, a heat-resistant substrate (a substrate that can withstand temperatures of about 150° C. or higher) is required. However, in the case of the electroluminescence display panel according to the present invention, since only the conductive line pattern can be formed, there is an advantage that a substrate having low heat resistance can be used.

A manufacturing process of the electroluminescent display device according to the present invention will be briefly summarized. A first step of preparing a lower substrate having a through hole penetrating from the upper surface to the lower surface at a position where a plurality of pixels are placed, forming a pattern of a plurality of pixel electrodes on the upper surface of the lower substrate, and forming a conductive material in the through hole. The second step of filling and forming through electrodes, the third step of forming conductive wires connected to the through electrodes on the lower surface of the lower substrate, the fourth step of mounting micro control elements to be connected to the conductive wires, and the upper part of the pixel electrodes. An electroluminescent display device can be manufactured by a fifth step of forming an organic electroluminescent layer in a pattern and a sixth step of forming a cathode electrode on the organic electroluminescent layer.

In the description so far, it has been described that the micro control element is installed on the lower surface of the lower substrate, but it is also possible to install the micro control element on the upper surface of the lower substrate. Hereinafter, an embodiment in which the microcontroller is provided on the upper surface of the lower substrate will be described, and in particular, an embodiment in which top emission is used in the case of an organic light emitting panel will be described.

8 is a plan view of the flat display panel according to the present invention viewed from the top direction. It can be seen that the micro control element 125 electrically connected to the plurality of pixels P1, P2, ..., P6 through the conductive wires 123 is formed. The control signal and the video data signal applied from the TCON 210 are transmitted to the microcontroller 125, and the microcontroller 125 supplies the video signal to each pixel constituting the corresponding group pixel at an appropriate timing. driven Driving power must be applied to the microcontroller 125 provided in the flat panel display panel, and this is omitted. Practically, since there is sufficient space in the flat panel display panel, various wirings can be arranged, so there is no major problem.

9 is a cross-sectional view of a liquid crystal display panel according to an embodiment of the present invention. FIG. 9 is a cross-sectional view in the direction A-A' of FIG. 8 . A conductive wire 123 for connecting the pixel electrodes 115a and 115b and the micro control element 125 is patterned on the upper surface of the lower transparent substrate 101 . The lower transparent substrate 101 may be formed using glass, quartz, or heat-resistant transparent synthetic resin. Next, after mounting the micro control element 125, it is connected to the conductive wire 123. After forming the first interlayer insulating film 110 on the micro control element 125 and the conductive wire 123, it is planarized. After forming a through hole in the planarized first interlayer insulating film 110, a conductive material is filled to form a contact electrode, and pixel electrodes 115a and 115b are formed on the first interlayer insulating film 110 to maintain a conductive state with the contact electrode. ), the manufacturing of the lower transparent substrate 101 is completed. Next, the upper transparent substrate 150 provided with the common electrode 119 is formed using a separate process. After combining the upper transparent substrate 150 and the lower transparent substrate 101, liquid crystal 117 is injected therebetween. The first polarizing plate 301 and the second polarizing plate 303 are attached to the outer surfaces of the lower transparent substrate 101 and the upper transparent substrate 103 in the same manner as a conventional liquid crystal display panel.

Although a color filter layer and various optical films are attached to the liquid crystal display panel shown in FIG. 9 , these configurations are not related to the characteristics of the present invention and will not be described.

In the liquid crystal display panel shown in FIG. 9 , it is preferable that elements positioned above the backlight unit 300 are made of a transparent material. Therefore, other than the micro control element 125, which is difficult to produce as a transparent element, it is preferable to form the rest of the elements with a transparent material. In addition, setting the mounting position of the microcontroller 125 to the projected vertical lower area of the area where the BM is placed in the color filter layer can improve the aperture ratio.

10 is a cross-sectional view of an organic light emitting display panel according to an embodiment of the present invention. FIG. 10 is a cross-sectional view in the direction A-A' of FIG. 8 . A conductive wire 123 for connecting the anode electrodes 115a and 115b and the micro control element 125 is patterned on the upper surface of the lower substrate 101 . Next, after mounting the micro control element 125, it is connected to the conductive wire 123. After forming the first interlayer insulating film 110 on the micro control element 125 and the conductive wire 123, it is planarized. After forming a through hole in the planarized first interlayer insulating film 110, a conductive material is filled to form a contact electrode, and anode electrodes 115a and 115b are formed on the first interlayer insulating film 110 to maintain a conductive state with the contact electrode. ) to form a pattern. The lower substrate 101 does not need to be formed of a transparent material, and may be formed using glass, quartz, or heat-resistant synthetic resin. The organic light emitting layer 121 is patterned on the anode electrodes 115a and 115b. In order to insulate the adjacent anode electrodes 115a and 115b from the organic light emitting layer 121, the bank 127 made of an insulating material is formed of OC (OverCoat). When the cathode electrode 119 is formed on the organic light emitting layer 121 and the bank 127, and the moisture barrier layer 307 is formed on the top, manufacturing of the organic light emitting display panel is completed.

In FIG. 10, the anode electrodes 115a and 115b may use ITO or ITO/Ag/ITO. Alternatively, Cu, Mo, or an alloy thereof may be used. The bank 450 may use an overcoat (OC), and the cathode electrode 119, which is the second electrode, may use ITO, IGZO, IZO, Mg, Ag, or an alloy thereof. As shown in FIG. 10, in the case of forming a top emission type, the cathode electrode 118 must be formed as a transparent electrode, whereas the anode electrodes 115a and 115b may use an opaque electrode, so generally the conductivity is low. It is made of high conductivity material. In addition, the mounting position of the microcontroller 125 can improve the aperture ratio by setting the projected vertical lower area of the area where the bank is placed. Of course, an interfacial bonding layer 108 may be added as shown in FIG. 7(b) to improve interfacial adhesion between the upper surface of the lower transparent substrate 101 and the anode electrodes 115a and 115b.

If the microcontroller is installed on the upper surface of the lower substrate and the lower surface of the organic light emitting panel uses light emission, the organic light emitting panel can be manufactured with a simpler structure. 11 is a cross-sectional view of an organic light emitting display panel according to an exemplary embodiment of the present invention. FIG. 11 is a cross-sectional view in the direction A-A' of FIG. 8 .

A cathode electrode 118 is patterned on the upper surface of the lower transparent substrate 101 . In the case of the embodiment shown in FIG. 11, since the lower surface emits light, the lower transparent substrate 101 must be formed of a transparent material. As the transparent material, glass, quartz, and heat-resistant synthetic resin may be used. The organic light emitting layer 121 and the anode electrodes 115a and 115b are patterned on the cathode electrode 118 . In order to insulate the adjacent anode electrodes 115a and 115b from the organic light emitting layer 121, the bank 127 made of an insulating material is formed of OC (OverCoat). After forming the first interlayer insulating film 110 on the anode electrodes 115a and 115b and the bank 127, it is planarized. After forming a through hole for contacting each of the anode electrodes 115a and 115b, a conductive material is filled to form a contact electrode, and a conductive material for connecting to the micro control element 125 while maintaining a conductive state with the contact electrode. The wiring 123 is patterned. Next, after mounting the micro control element 125 and connecting it to the conductive wire 123, the electroluminescence display panel is completed. Reference numeral 200 indicates a direction in which light is irradiated. In the embodiment shown in FIG. 11, if the first interlayer insulating film is used as a material having excellent moisture permeation prevention effect, it is not necessary to separately provide a moisture permeation prevention film. However, even if an insulating material with excellent moisture permeation prevention effect is used as the first interlayer insulating film 110, moisture may penetrate at the interface bonding layer between the first interlayer insulating film 110 and the conductive material filled in the through hole in the semiconductor manufacturing process. .

Therefore, in the embodiment shown in FIG. 11, it is preferable to provide the moisture permeation prevention film 307 over the first interlayer insulating film 110, the conductive wiring 123, and the micro control element 125 as illustrated in FIG. 12. . However, in the case of FIG. 12, since the heat generated by the microcontroller 125 cannot be released to the outside, a heat dissipation problem may occur. In order to solve the heat dissipation problem of the micro control element 125, as shown in FIG. 123) may be provided, and most of the micro control element 125 may be implemented in a structure exposed to the air. In another embodiment, as shown in FIG. 14, it can be solved by installing the first interlayer insulating film 110 and the moisture permeation prevention film 307 covering only the portion where the first interlayer insulating film 110 and the conductive wiring 13 are connected. can

In the structure of the embodiment shown in FIGS. 11 to 14, it is okay to form the first interlayer insulating film 110 even in the region where the bank 127 is located without having the bank 127, and the manufacturing process is simpler there is

In the case of an organic light emitting display panel for a large screen used in a TV or the like, it is necessary to maintain a uniform voltage applied to the cathode electrode 119 . In the case of a TV, since a large screen must be configured, the voltage applied to the cathode electrode 119 located close to the side to which the voltage is applied from TCON and the cathode electrode 119 located in the center of the screen is a voltage difference due to the resistance of the cathode electrode 119 A voltage drop problem occurs. In order to solve the problem of the cathode voltage drop (in other words, the cathode electrode resistance increase), the cathode electrode 119 of the neighboring pixel is patterned with a conductive material having higher conductivity than the cathode electrode at the lower part where the bank 127 is located. It is good. Since the configuration for solving the cathode resistance problem and the compensation circuit for compensating the brightness of each pixel are beyond the features of the present invention, a detailed description thereof will be omitted.

Since the embodiments shown in FIGS. 11 to 14 are bottom emission types, the cathode electrode 118 must be formed as a transparent electrode, whereas the anode electrode 115 may be formed using an opaque electrode. It is made of a conductive material with high conductivity. The cathode electrode 115 may be formed using ITO, IGZO, IZO, Mg, Ag, or an alloy thereof. The anode electrodes 115a and 115b may be formed using ITO or ITO/Ag/ITO. Alternatively, Cu, Mo, or an alloy thereof may be used.

In order to improve the interfacial adhesion between the upper surface of the lower transparent substrate 101 and the cathode electrode 118, an interfacial bonding layer 108 may be added as shown in FIG. 7(b).

A manufacturing process of the bottom emission type organic light emitting display panel will be briefly described. A first electrode formed as a front electrode is formed on the upper surface of the lower transparent substrate (first step). An organic light emitting layer and a second electrode are patterned on the first electrode (second step), a first interlayer insulating film covering the first electrode and the second electrode is formed, and then a planarization operation is performed (third step). A through hole for contacting the second electrode is formed on the flattened first interlayer insulating film, a contact electrode is formed by filling the conductive material, and a conductive wire electrically connected to each contact electrode is formed on the first interlayer insulating film. Form a pattern (fourth step). Thereafter, after positioning the microcontroller manufactured in a separate semiconductor manufacturing process, the conductive wiring and wiring are processed (step 5). Finally, when the moisture permeation barrier is formed, manufacturing of the bottom emission type organic light emitting display panel is completed (step 6).

A bank formation step (seventh step) of insulating the second electrode and the adjacent organic light emitting layer patterned between the second step and the third step may be further provided. In this case, the first interlayer insulating film performed in the third step should be formed to cover the upper part of the bank and the second electrode.

In the case of the electroluminescent display panel manufactured according to the present invention, the position of the anode electrode and the cathode electrode may be changed. For example, in the description of FIG. 11, the cathode electrode 118 is formed as a front electrode on the upper surface of the lower transparent substrate 101, but the positions of the anode electrodes 115a and 115b and the cathode electrode 118 are changed, The anode electrodes 115a and 115b may be formed as front electrodes on the upper surface of the lower transparent substrate 101 and the cathode electrode 118 may be patterned. Therefore, in the case of an electroluminescent display panel, it is more preferable to refer to the first electrode and the second electrode rather than to call the anode electrode and the cathode electrode, and to specify the first electrode as an anode electrode or a cathode electrode. there is.

In describing the embodiments of the present specification, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present specification, the detailed description thereof will be omitted.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention. The terms and/or include any combination of a plurality of related recited items or any of a plurality of related recited items.

It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when an element is referred to as “directly connected” or “directly connected” to another element, it should be understood that no other element exists in the middle.

Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "include" or "have" are intended to designate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

In addition, components appearing in the embodiments of the present invention are shown independently to represent different characteristic functions, and do not mean that each component is made of separate hardware or a single software component unit. That is, each component is listed and included as each component for convenience of explanation, and at least two components of each component can be combined to form a single component, or one component can be divided into a plurality of components to perform a function, and each of these components can be divided into a plurality of components. Integrated embodiments and separated embodiments of components are also included in the scope of the present invention as long as they do not depart from the essence of the present invention.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in the present application, they should not be interpreted in an ideal or excessively formal meaning. don't

100: flat display panel 101: lower transparent substrate, lower substrate
103: buffer layer 104: channel region
105: gate insulating film 107: gate electrode
108: interfacial adhesive layer 109: drain electrode
110: first interlayer insulating film 111: source electrode
112: second interlayer insulating film 113: drain electrode
115, 115a, 115b: pixel electrode 117: liquid crystal
118: cathode electrode 119: common electrode
123: conductive wire 124: through hole
125: micro control element
127: bank 150: upper transparent substrate
210: timing controller (TCON) 220: first driving unit
230: second driving unit 300: backlight unit
301: first polarizing plate 303: second polarizing plate
PG1, PG2, ..., PGX: group pixel P1C, P2C, ..., P6C: through electrode

Claims (10)

A lower substrate having a plurality of through-holes formed through the thickness direction;
A plurality of through electrodes formed of a conductive material applied inside the plurality of through holes;
A plurality of pixel electrodes patterned on the lower substrate;
- The number of pixel electrodes and the number of through electrodes are the same, and the through electrodes are electrically connected to the corresponding pixel electrodes -
A lower portion of the lower substrate includes a conductive wire patterned to be electrically connected to the plurality of through electrodes, and a micro control element mounted to be connected to the conductive wire and manufactured through a separate semiconductor manufacturing process,
A flat panel display panel characterized in that a voltage supplied to each of the pixel electrodes is controlled through the micro control element.
According to claim 1,
An upper substrate on which a common electrode for applying a common potential is formed on the lower surface;
A flat panel display comprising liquid crystal filled between the upper substrate and the lower substrate.
According to claim 1,
An organic light emitting layer formed on each of the pixel electrodes;
A flat panel display panel comprising a cathode electrode formed on the organic light emitting layer.
According to claim 3,
A flat panel display panel, characterized in that a bank made of an insulating material is further provided between the adjacent pixel electrode and the organic light emitting layer.
delete A first step of preparing a lower substrate having a plurality of through holes penetrating in the thickness direction;
a second step of pattern-forming a plurality of pixel electrodes on the lower substrate and forming through electrodes by applying a conductive material to the through holes;
- The through electrodes are provided in a one-to-one correspondence with the pixel electrodes, and each through electrode is electrically connected to the respective pixel electrodes -
A third step of pattern-forming a conductive wire connected to the through electrode under the lower substrate;
A fourth step of mounting a micro control element under the lower substrate so as to be connected to the wire wiring;
A fifth step of preparing an upper substrate having a common electrode on the lower surface as a process separate from the first to fourth steps;
and a sixth step of making the lower substrate and the upper substrate face each other and injecting liquid crystal therebetween.
A first step of preparing a lower substrate having a plurality of through holes penetrating in the thickness direction;
a second step of pattern-forming a plurality of pixel electrodes on the lower substrate and forming through electrodes by applying a conductive material to the through holes;
- The through electrodes are provided in a one-to-one correspondence with the pixel electrodes, and each through electrode is electrically connected to the respective pixel electrodes -
A third step of forming a conductive wire connected to the through electrode under the lower substrate;
A fourth step of mounting a micro control element under the lower substrate so as to be connected to the wire wiring;
A fifth step of forming a pattern of an organic electroluminescent layer on the pixel electrode;
and a sixth step of forming a cathode electrode on the organic light emitting layer.
a lower transparent substrate;
A first electrode formed as a front electrode on the lower transparent substrate;
An organic light emitting layer and a second electrode sequentially patterned on the first electrode;
A first interlayer insulating film formed on the first electrode and the second electrode and planarized;
A through hole is formed in the first interlayer insulating film to be in contact with each of the second electrodes, a contact electrode is formed by filling the through hole with a conductive material, and a pattern is formed on the first interlayer insulating film while being in contact with the contact electrode. Conductive wiring that becomes
An electroluminescence display panel comprising a micro control element manufactured through a separate semiconductor manufacturing process and connected to the conductive wire and mounted on the first interlayer insulating film.
According to claim 8,
The organic light emitting layer and the second electrode are patterned to be spaced apart from neighboring organic light emitting layers and the second electrode, and a bank made of an insulating material is further provided in the space spaced apart from each other.
A method for manufacturing a bottom emission type organic light emitting display panel,
A first step of preparing a lower transparent substrate;
A second step of forming a first electrode formed as a front electrode on the upper surface of the lower transparent substrate;
A second step of pattern-forming an organic light emitting layer and a second electrode on the first electrode;
A third step of planarizing after forming a first interlayer insulating film covering upper portions of the first electrode and the second electrode;
A through hole for contacting a second electrode is formed on the flattened first interlayer insulating film, a contact electrode is formed by filling a conductive material, and a conductive wire electrically connected to each contact electrode is formed on the first interlayer insulating film. A fourth step of forming a pattern;
A method of manufacturing an electroluminescent display panel comprising a fifth step of locating a micro control element manufactured in a separate semiconductor manufacturing process and then processing the conductive wire with the wire.

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