KR102513524B1 - Heat dissipation structure of camera - Google Patents

Abstract

According to the disclosure, the heat generated from the image sensor is absorbed by the heat absorbing part of the thermoelectric element for cooling the sensor, so that the low temperature operating condition of the image sensor is maintained, and at the same time, the heat emitted from the heat generating part of the thermoelectric element for cooling the sensor is discharged to the outside of the camera housing. As it is efficiently dissipated, for example, it relates to a heat dissipation structure of a camera so that accuracy and durability for use purposes such as semiconductor inspection can be improved.
Disclosed is a camera housing in which a lens unit is coupled to the lower end and an upper and front side are formed open, an image sensor provided in the lower part of the camera housing, a sensor cooling thermoelectric element installed to face the upper surface of the image sensor, and , A heat dissipation member installed in the camera housing and having first and second heat dissipation plates having different areas are alternately arranged and coupled, the lower end of which is in contact with the upper surface of the thermoelectric element for cooling the sensor, and the heat dissipation member in the camera housing an internal heat dissipation housing installed to surround the heat dissipation member and forming a heat dissipation flow path connecting the upper end and the front side of the camera housing around the heat dissipation member; and a heat dissipation flow path provided on the top of the camera housing and formed by the inner heat dissipation housing. A heat dissipation structure of a camera including a heat dissipation fan for forcibly flowing external air into the camera housing and a control board for controlling the operation of the image sensor, the thermoelectric element for cooling the sensor, and the heat dissipation fan, arranged in the camera housing, is presented as an embodiment. do.

Description

Heat dissipation structure of camera {HEAT DISSIPATION STRUCTURE OF CAMERA}

The disclosed subject matter relates to a camera, such as a semiconductor inspection camera, that inspects whether a semiconductor device such as a wafer or a semiconductor chip is defective through image acquisition and image processing.

Unless otherwise indicated herein, material described in this section is not prior art to the claims in this application, and inclusion in this section is not an admission that it is prior art.

In general, semiconductor devices such as wafers and semiconductor chips repeat processing processes such as oxidation process, etching process, diffusion process, and metal process to form a specific circuit pattern, followed by various subsequent processes such as wire bonding process and molding process. manufactured through

Since semiconductor devices manufactured through such a manufacturing process are highly integrated, there is a very high possibility of defects occurring during the manufacturing process. These defects appear inside as well as outside the package in various forms, for example, dust or foreign matter surface adhesion or scratches, etc., and adversely affect the performance of the package.

Therefore, for semiconductor devices manufactured through a series of manufacturing processes, internal defects must be checked through electrical operation inspection, and at the same time, exterior inspection is performed using a camera including an image sensor to detect dust or foreign matter surface adhesion or scratches. Check for defects.

As an example of a camera that inspects defects in the manufacture of semiconductor devices such as wafers and semiconductor chips through image acquisition and image processing, Korean Patent Publication No. 10-2009-0039490 (published on April 22, 2009) Or, in a camera comprising a main body equipped with a lens to photograph a still wafer, and a CCD sensor provided inside the main body to sense a light source passing through the lens and store information about an image as an electrical signal, wherein the The CCD sensor is an area sensor in which the number of pixels in the horizontal line is 1024 bytes or more and the number of pixels in the vertical line is 1024 bytes or more. It includes a driver, an A/D converter that converts image information stored in the area sensor from an analog signal to a digital signal, and a signal controller that generates all signals for the area sensor to operate or controls signals to be delayed. , The signal controller includes a signal generator for generating a signal so that the area sensor operates in an area mode or a TDI line mode, a sensor delay for delaying the operation of the area sensor, and an A for delaying the operation of the A/D converter. A /D converter, an image processor for converting the signal converted by the A/D converter into an image file in advance, and a memory for temporarily storing the image file converted by the image processor. A camera for wafer inspection is disclosed.

When such a camera operates, heat is generated from the image sensor. If this heat is not effectively emitted to the outside, the accuracy of the image sensor decreases and the service life is shortened. A heat dissipation structure is required.

As an example of a heat dissipation structure of such a camera, Korean Patent Publication No. 10-2020-0090016 (published on July 28, 2020) includes a lens module, an imaging unit provided with an imaging device, and a heat dissipation module. As a camera assembly for vision inspection, The heat dissipation module may include: a thermoelectric cooler (TEC) disposed close to the rear surface of the imaging unit to constantly adjust the temperature of the imaging device; and a heat dissipation body in which the thermoelectric element is disposed on the front surface and dissipates heat of the thermoelectric element.

In addition, Korean Patent Registration No. 10-0950386 (published on March 29, 2010) discloses a camera equipped with a cooling device for dissipating heat generated when external light is irradiated on an image sensor, as a hollow casing, an image sensor casing on the upper surface of which a light-transmitting member for allowing external light to enter the casing is disposed, and an image sensor disposed inside the casing at a position opposite to the light-transmitting member; a first thermoelectric element disposed in contact with the inner surface of the image sensor casing, the high-temperature generator, and disposed in thermal contact with the image sensor; and a second thermoelectric element disposed in contact with the outer surface of the image sensor casing, the high temperature generating unit facing the outside, wherein the light transmitting member is in thermal contact with the image sensor casing, and A second temperature sensor disposed to enable heat transfer to sense the temperature of the light transmitting member is provided, and the temperature data measured by the second temperature sensor is transmitted to a controller, which controls the first thermoelectric element and the second thermoelectric element. Disclosed is a camera equipped with an image sensor cooling device using a thermoelectric element, characterized in that the temperature of the light-transmitting member is adjusted by controlling the amount of current applied to the element.

In the case of the conventional heat dissipation structure of the camera as described above, a configuration for cooling the image sensor through the heat absorbing portion of the thermoelectric element is disclosed, but the heat emitted from the heat generating portion of the thermoelectric element is not efficiently discharged to the outside of the camera housing. Due to the structure, thermal damage is applied to the substrate in the camera housing as well as the image sensor, resulting in a decrease in accuracy in inspection and a shortened service life.

1. Korean Patent Publication No. 10-2009-0039490 (published on April 22, 2009) 2. Korean Patent Publication No. 10-2020-0090016 (published on July 28, 2020) 3. Republic of Korea Patent Registration No. 10-0950386 (2010.03.29. Notice)

The heat generated from the image sensor is absorbed by the heat absorbing part of the sensor cooling thermoelectric element to maintain the low temperature operating condition of the image sensor, and at the same time, the heat emitted from the heat generating part of the sensor cooling thermoelectric element is efficiently dissipated to the outside of the camera housing. As (放散), for example, to provide a heat dissipation structure of a camera so that the accuracy and durability for the purpose of use, such as semiconductor inspection, can be improved.

In addition, it is not limited to the technical problems as described above, and it is obvious that other technical problems may be derived from the following description.

Disclosed is a camera housing in which a lens unit is coupled to the lower end and an upper and front side are formed open, an image sensor provided in the lower part of the camera housing, a sensor cooling thermoelectric element installed to face the upper surface of the image sensor, and , A heat dissipation member installed in the camera housing and having first and second heat dissipation plates having different areas are alternately arranged and coupled, the lower end of which is in contact with the upper surface of the thermoelectric element for cooling the sensor, and the heat dissipation member in the camera housing an internal heat dissipation housing installed to surround the heat dissipation member and forming a heat dissipation flow path connecting the upper end and the front side of the camera housing around the heat dissipation member; and a heat dissipation flow path provided on the top of the camera housing and formed by the inner heat dissipation housing. A heat dissipation structure of a camera including a heat dissipation fan for forcibly flowing external air into the camera housing and a control board for controlling the operation of the image sensor, the thermoelectric element for cooling the sensor, and the heat dissipation fan, arranged in the camera housing, is presented as an embodiment. do.

According to a preferred feature of the disclosure, the heat dissipation member is interposed between the second heat dissipation plates and has a first contact protrusion in contact with the upper surface of the thermoelectric element for cooling the sensor at the lower end thereof, corresponding to the inner space of the inner heat dissipation housing. A first heat dissipation plate having a cross-sectional area and a second contact protrusion interposed between the first heat dissipation plates and having a lower end in contact with the upper surface of the thermoelectric element for cooling the sensor, and having an upper end such that the heat dissipation passage is formed between the first heat dissipation plates. It includes a second heat dissipation plate curvedly cut from the top toward the front side, and a side closing plate that closes both side surfaces of the heat dissipation member.

According to a preferred feature of the disclosure, the control board is formed of a plurality of board members electrically connected by cables, and the plurality of board members are separately arranged on the inner wall surface of the camera housing.

According to the heat dissipation structure of the camera according to the disclosed embodiment, the heat generated from the image sensor is absorbed by the heat absorbing part of the thermoelectric element for cooling the sensor, and the heat emitted from the heat emitting part of the thermoelectric element for cooling the sensor is absorbed through the heat dissipating member. It can be efficiently dissipated to the outside of the camera housing by the air flow, and through this efficient heat dissipation, the low-temperature operating conditions of the image sensor are maintained, improving accuracy for purposes such as semiconductor inspection, for example, and image There is an advantage in that the durability of components including sensors is also improved.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a perspective view of a heat dissipation structure of a camera according to an embodiment of the present disclosure;
2 is an exploded perspective view of a heat dissipation structure of a camera according to an embodiment of the present disclosure;
3 is a cross-sectional view of a heat dissipation structure of a camera according to an embodiment of the present disclosure;
4 is a partially exploded perspective view of a heat dissipation member in a heat dissipation structure of a camera according to an embodiment of the disclosed subject matter;
5 is an installation structure diagram of a control board in a heat dissipation structure of a camera according to an embodiment of the disclosed subject matter;
6 is a diagram illustrating a heat dissipation operation by a heat dissipation structure of a camera according to an embodiment of the disclosed subject matter;

Hereinafter, with reference to the accompanying drawings, look at the configuration and operational effects of the preferred embodiment. For reference, in the drawings below, each component is omitted or schematically illustrated for convenience and clarity, and the size of each component does not reflect the actual size. In addition, like reference numerals refer to like components throughout the specification, and reference numerals for like components in individual drawings will be omitted.

1 is a perspective view of a heat dissipation structure of a camera according to an embodiment of the disclosed subject matter, FIG. 2 is an exploded perspective view of a heat dissipation structure of a camera according to an embodiment of the disclosed subject matter, and FIG. 3 is a perspective view according to an embodiment of the disclosed subject matter. This is a cross-sectional view of the heat dissipation structure of the camera.

As shown in FIGS. 1 to 3, the heat dissipation structure of the camera according to an embodiment of the disclosed subject matter includes a camera housing 10, an image sensor 20, a sensor cooling thermoelectric element 30, a heat dissipation member 40, an internal It includes a heat dissipation housing 50, a heat dissipation fan 60 and a control board 70.

Here, the camera housing 10 corresponds to a body frame of a camera such as a semiconductor inspection camera that inspects defects through image acquisition and image processing when manufacturing semiconductor devices such as wafers and semiconductor chips. , Has a rectangular parallelepiped shape as a whole, and a lens coupling unit 11 to which a lens unit (not shown) is coupled is formed at the lower end.

In addition, the top of the camera housing 10 to which the heat dissipation fan 60 to be described later is coupled and the front side of the camera housing 10 to which the heat dissipation member 40 to be described later is exposed are open to allow heat dissipation by the flow of outside air. is formed At this time, the top of the camera housing 10 corresponds to an inlet through which external air is sucked, and the front side of the camera housing 10 corresponds to an exhaust through which external air that has undergone heat exchange with the heat dissipation member 40 is discharged to the outside. Depending on the embodiment, the front side of the camera housing 10 corresponds to an inlet through which external air is sucked, and the upper end of the camera housing 10 corresponds to an exhaust port through which external air that has undergone heat exchange with the heat dissipation member 40 is discharged to the outside. You may.

A first heat dissipation fin 13 is provided at an upper end of the aforementioned camera housing 10 . The first heat dissipation fin 13 serves to increase the contact area of the camera housing 10 in contact with external air so that internal heat of the camera housing 10 can be efficiently dissipated. It is formed by grooves that are recessed at regular intervals.

In addition, the camera housing 10 may be provided with connection terminals connected to the power supply cable and the output cable.

An image sensor 20 is provided below the camera housing 10 described above. The image sensor 20 corresponds to a kind of imaging element component that detects the intensity and color of the image (light) incident through the lens unit, converts it into digital image data, and displays it in the form of an image, CCD (Charge Coupled Device) image It can be formed as a sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

Among them, the CCD image sensor generates electrons according to the amount of light when light shines on a large number of photodiode elements integrated at high density, and an image (image) is output according to the amount of electrons generated. It is characterized by low noise and excellent image quality. In addition, the CMOS image sensor converts the generated electrons into voltage and outputs them. Because of its fast processing speed and low power consumption, it is suitable for portable terminals such as mobile phones and digital cameras, and its production cost is low, and it is integrated by on-chip. On the other hand, there are characteristics that the device itself is easily unstable in low light conditions and noise increases in a captured image.

A thermoelectric element 30 for sensor cooling is installed on the upper surface of the image sensor 20 described above. The thermoelectric element 30 for sensor cooling absorbs heat generated from the image sensor 20 and maintains the low-temperature operating condition of the image sensor 20 to improve the accuracy and durability of the image sensor 20, A P-type semiconductor and an N-type semiconductor form a Peltier element forming a closed circuit having two contacts.

The Peltier element uses the principle of using the energy possessed by the metal to move electrons between two metals with a potential difference. Conversely, a heating part is formed. The structure of a thermoelectric element for cooling using a Peltier element is already known, and further detailed description thereof will be omitted herein.

A heat dissipation member 40 is installed in the camera housing 10 described above. The heat dissipation member 40 corresponds to a kind of air-cooled heat exchanger that forms a heat dissipation flow path for air cooling and at the same time dissipates heat emitted from the heating part of the thermoelectric element 30 for sensor cooling through heat exchange with external air. The lower end is in contact with the upper surface of the thermoelectric element 30 for sensor cooling.

4 is a partially exploded perspective view of such a heat dissipation member.

As shown in FIG. 4 , the heat dissipation member 40 has a structure in which first and second heat dissipation plates 41 and 43 having different areas are alternately arranged and coupled.

The first heat dissipation plate 41 is a heat dissipation plate having a relatively large cross-sectional area corresponding to the inner space of the internal heat dissipation housing 50, which will be described later, and is interposed between the second heat dissipation plates 43 having a relatively small cross-sectional area, and a sensor cooling is provided at the lower end. A first contact protrusion 41a in contact with the upper surface of the thermal element 30 is provided. The first heat dissipation plate 41 is preferably formed of a copper material, but may also be formed of other metal plates.

The second heat dissipation plate 43 is interposed between the first heat dissipation plates 41 and has a cross section smaller than that of the first heat dissipation plate 41 by having an upper end curvedly cut from the top toward the front so as to form a heat dissipation passage between the first heat dissipation plates 41 . It has an area and is provided with a second contact protrusion 43a in contact with the upper surface of the thermoelectric element 30 for sensor cooling at the lower end. The first heat dissipation plate 41 is preferably formed of a copper material, but may also be formed of other metal plates.

The heat dissipation member 40 in which the first and second heat dissipation plates 41 and 43 having different areas are alternately arranged and coupled forms a heat dissipation flow path curved from the top to the front side in the camera housing 10, thereby dissipating heat. After the air flow for the camera is introduced into the camera housing 10 from the top of the camera housing 10, the direction is naturally switched to the front side without any additional resistance and is induced to flow.

In addition, the heat dissipation member 40 in which the first and second heat dissipation plates 41 and 43 having different areas are alternately arranged are coupled with both side surfaces closed by the side closing plates 45 . The side closing plate 45 is preferably formed of a heat insulating material so that the heat transferred from the image sensor 20 to the heat dissipating member 40 through the sensor cooling thermoelectric element 30 is not transferred to the inner heat dissipating housing 50 side. .

In addition, at the rear edges of the first heat sink 41, the second heat sink 43, and the side closing plate 45 forming the heat dissipation member 40, there is a coupling groove 49 into which a common transverse connector 47 can be inserted. are formed by incorporating each The transverse connector 47 serves as a fastening plate for fastening and fixing the heat radiating member 40 to the rear lower end of the inner heat radiating housing 50, and at the same time is formed of a heat insulating material. It serves to prevent the heat transferred to the heat dissipating member 40 via 30 from being directly transferred to the inner heat dissipating housing 50 side.

In the camera housing 10 described above, an internal heat dissipation housing 50 is installed to surround the heat dissipation member 40 described above. The internal heat dissipation housing 50 serves to form a heat dissipation passage connecting the upper end and the front side of the camera housing 10 with the heat dissipation member 40 as the center, and at the same time, thermal damage of the control board 70 to be described later. plays a role in preventing

The inner heat dissipation housing 50 is formed so that the upper surface and the front surface are open to communicate with each other to form a heat dissipation flow path, and the lower surface is opened to accommodate the heat dissipation member 40, and at the same time, the inner heat dissipation member 40 can be accommodated therein. A space is formed, and the lower end is fixedly coupled in the camera housing 10 .

In addition, a second heat dissipation fin 51 is provided on the rear upper side of the inner heat dissipation housing 50 . The second heat dissipation fin 51 allows the inner heat dissipation housing 50 itself to act as another air-cooled heat dissipation member, and is formed protruding toward the inner side of the inner heat dissipation housing 50 on the rear upper side of the inner heat dissipation housing 50. do. In the second heat dissipation fin 51, heat generated from the substrate member 73 for central processing arranged on the rear inner surface of the camera housing 10 among the control boards 70 to be removed later flows through the second heat dissipation fin 51. It serves to be cooled by the air current.

In addition, insulation plates 53 are coupled to both sides of the internal heat dissipation housing 50 . The heat insulation plate 53 is the internal heat dissipation housing in the process of dissipating heat generated from the image sensor 20 and the like along the heat dissipation passage formed in the camera housing 10 by the heat dissipation member 40 and the internal heat dissipation housing 50. It serves to block radiation through both sides of (50), and is formed of a normal plate-shaped heat insulating material.

A heat dissipation fan 60 is provided above the camera housing 10 described above. The heat dissipation fan 60 forcibly flows external air into the heat dissipation passage formed in the camera housing 10 by the heat dissipation member 40 and the internal heat dissipation housing 50 so that heat dissipation is achieved through air cooling. It can be formed as a cooling fan for small electronic devices.

A control board 70 is arranged in the camera housing 10 described above. The control board 70 serves to control the operation of the image sensor 20, the thermoelectric element 30 for sensor cooling, and the heat dissipation fan 60. 5 shows an installation structure diagram of such a control board.

The control board 70 is not formed as a single integrated board, but as shown in FIG. 5, a plurality of boards electrically connected by a cable 70a and separated and arranged on the inner wall surface of the camera housing 10. It is preferable to form a member.

As shown in FIG. 2, the control board 70 includes a substrate member 71 for an image sensor arranged on the lower inner surface of the camera housing 10 and a central processing arranged on the rear inner surface of the camera housing 10. A board member 73 for a thermoelectric element arranged on an inner surface of one side of the camera housing 10, and a substrate member 77 for power supply arranged on an inner surface of one side of the camera housing 10 and a substrate member 79 for driving a fan arranged on an inner surface of an upper end of the camera housing 10 .

At this time, a through hole 71a for direct contact between the image sensor 20 and the thermoelectric element 30 for cooling the sensor is formed through the center of the substrate member 71 for the image sensor. The central portion of the substrate member 71 for an image sensor having such a through hole 71a serves as a seat for mounting and installing the thermoelectric element 30 for cooling the sensor.

In addition, the board member 71 for image sensor, the board member 73 for central processing, the board member 75 for thermoelectric element, the board member 77 for power supply, and the board member 79 for fan drive are conventional printed circuits. It may be formed as a substrate, but it is particularly preferable to be formed as a rigid flexible circuit board (RF-PCB).

In addition, the cable 70a connects the substrate member 71 for the image sensor, the substrate member 75 for the thermoelectric element, the substrate member 77 for power supply, and the substrate member 79 for driving the fan to the substrate member 73 for central processing. As electrically connected to, it may be formed of a normal connector-integrated cable, but it is preferable to be formed of a flexible printed circuit board (FPCB) that can be flexibly bent.

6 is a diagram illustrating a heat dissipation operation by a heat dissipation structure of a camera according to an exemplary embodiment of the present disclosure. Hereinafter, an operation of a heat dissipation structure of a camera according to an embodiment of the disclosure will be described with reference to FIGS. 1 to 6 .

First of all, in the heat dissipation structure of the camera according to the disclosed embodiment, the thermoelectric element 30 for sensor cooling is interviewed on the top of the image sensor 20, and the first and The heat dissipation member 40 in which the second heat dissipation plates 41 and 43 are alternately arranged is interviewed, and an internal heat dissipation housing 50 forming a heat dissipation flow path while surrounding the heat dissipation member 40 is installed in the camera housing 10 It has a structure in which a heat dissipation fan 60 is installed on top of the camera housing 10 to flow external air along a heat dissipation passage formed by the internal heat dissipation housing 50 .

Therefore, when the heat dissipation fan 60 is driven, outside air flows into the camera housing 10 from the top of the camera housing 10 and flows through the first heat dissipation fin 51 and the heat dissipation member 40 of the internal heat dissipation housing 50. After being discharged through the front side of the camera housing 10, air cooling is performed via the heat dissipating member 40 and the internal heat dissipating housing 50. At this time, the airflow for heat dissipation flows into the interior of the camera housing 10 from the top of the camera housing 10, and then naturally changes direction to the front side without additional resistance by the heat dissipating member 40 and flows.

At the same time, the heat generated from the image sensor 20 is absorbed by the heat absorbing part of the thermoelectric element 30 for sensor cooling, and the heat emitted from the heat emitting part of the thermoelectric element 30 for sensor cooling is absorbed by the heat dissipating member 40. As the airflow through the camera is efficiently dissipated to the outside of the camera housing 10, the low-temperature operating condition of the image sensor 20 is maintained, and the accuracy for the purpose of use, such as semiconductor inspection, for example, is improved, and the image sensor 20 is maintained. Durability of components including the sensor 20 may also be improved.

In addition, the control board 70 is not formed as a single integrated board, but is electrically connected by a cable 70a and at the same time, a plurality of board members separately arranged on the inner wall surface of the camera housing 10, that is, a board for an image sensor. member 71, a substrate member for central processing 73, a substrate member for thermoelectric element 75, a substrate member for power supply 77, and a substrate member for driving a fan 79, so that within the camera housing 10 The installation space of the heat dissipation component for forming the low temperature operating condition of the image sensor 20 and the formation space of the heat dissipation passage can be easily configured.

On the other hand, for example, in a camera such as a semiconductor inspection camera, the image sensor 20 installed on the lower side and the substrate member 73 for central processing installed on the rear side generate a relatively large amount of heat. In the heat dissipation structure of the camera according to an embodiment, the heat dissipation member 40 mainly dissipates the heat of the image sensor 20 through air cooling, and the internal heat dissipation mainly dissipates the heat of the central processing board member 73 through air cooling. As the housing 50 is implemented so that mutual heat transfer is prevented by the transverse connecting rod 47 and the insulating plate 53 made of insulating material, heat dissipation of the image sensor 20 and the control board 70, especially the central processing board member The heat dissipation of (73) is done separately from each other.

Although the preferred embodiments of the present invention have been described with reference to the accompanying drawings, the embodiments described in this specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention and represent all the technical ideas of the present invention. Since it is not, it should be understood that there may be various equivalents and modifications that can replace them at the time of this application. Therefore, the embodiments described above should be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the claims to be described later rather than the detailed description, and the meaning and scope of the claims and their All changes or modified forms derived from equivalent concepts should be construed as being included in the scope of the present invention.

10: Camera housing
11: lens coupling part
13: first heat dissipation fin
20: image sensor
30: thermoelectric element for sensor cooling
40: heat dissipation member
41: first heat sink
41a: first contact protrusion
43: second heat sink
43a: second contact protrusion
45: side closing plate
47: transverse connector
49: coupling groove
50: internal heat dissipation housing
51: second heat dissipation fin
53: insulation plate
60: heat dissipation fan
70: control board
70a: cable
71: substrate member for image sensor
71a: through hole
73: substrate member for central processing
75: substrate member for thermoelectric element
77: board member for power supply
79: board member for fan drive

Claims (10)

A camera housing in which a lens unit is coupled to a lower end and an upper end and a front side are formed open;
an image sensor provided under the camera housing;
a thermoelectric element for sensor cooling installed on an upper surface of the image sensor to be interviewed;
a heat dissipation member installed in the camera housing and having first and second heat dissipation plates having different areas alternately arranged and coupled, and having a lower end in contact with an upper surface of the thermoelectric element for cooling the sensor;
an internal heat dissipation housing installed in the camera housing to surround the heat dissipation member and forming a heat dissipation passage curved from an upper portion to a front side around the heat dissipation member;
a heat dissipation fan provided on an upper portion of the camera housing and forcibly flowing external air through a heat dissipation passage formed by the internal heat dissipation housing; and
A control board arranged in the camera housing and controlling the operation of the image sensor, a thermoelectric element for cooling the sensor, and a heat dissipation fan;
The heat dissipation member is interposed between the second heat dissipation plates, has a first contact protrusion in contact with the upper surface of the thermoelectric element for sensor cooling, and has a cross-sectional area corresponding to the inner space of the inner heat dissipation housing; , It is interposed between the first heat sink and has a second contact protrusion in contact with the upper surface of the thermoelectric element for cooling the sensor at the lower end, and the upper end is cut curved from the top toward the front side so that the heat dissipation passage is formed between the first heat sink. A heat dissipation structure of a camera including a second heat dissipation plate and a side closing plate closing both sides of the heat dissipation member. The method of claim 1,
A heat dissipation structure of a camera, characterized in that a first heat dissipation fin is provided at the top of the camera housing. delete The method of claim 1,
The heat dissipation structure of the camera, characterized in that the rear edge of the first heat sink, the second heat sink and the side closing plate are respectively recessed coupling grooves into which a common transverse connector can be inserted. The method of claim 1,
The heat dissipation structure of the camera, characterized in that the first heat sink and the second heat sink are formed of a copper material. The method of claim 1,
A heat dissipation structure of a camera, characterized in that a second heat dissipation fin is provided on the rear upper side of the inner heat dissipation housing. The method of claim 1,
The heat dissipation structure of the camera, characterized in that the insulation plate is coupled to both sides of the inner heat dissipation housing. The method of claim 1,
The camera housing has a rectangular parallelepiped shape,
The control board is formed of a plurality of board members electrically connected by cables, and the plurality of board members are separately arranged on the inner wall surface of the camera housing. The method of claim 8,
The control board includes a substrate member for an image sensor arranged on an inner surface of the lower end of the camera housing and through which a through hole for direct contact between the image sensor and the thermoelectric element for cooling the sensor is formed in the center, and a rear inner surface of the camera housing. A substrate member for central processing arranged on the inner surface of one side of the camera housing, a substrate member for a thermoelectric element arranged on an inner surface of one side of the camera housing, a substrate member for power supply arranged on an inner surface of one side of the camera housing, and an inner top of the camera housing. A heat dissipation structure of a camera comprising a substrate member for driving a fan arranged on a side surface. The method of claim 8,
The substrate member is formed of a rigid flexible circuit board (RF-PCB), and the cable is a heat dissipation structure of a camera, characterized in that formed of a flexible printed circuit board (FPCB).

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