KR102511671B1 - Solder welding composition with pink gold color and precious metal solder welding method using the same - Google Patents
Solder welding composition with pink gold color and precious metal solder welding method using the same Download PDFInfo
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- KR102511671B1 KR102511671B1 KR1020220111999A KR20220111999A KR102511671B1 KR 102511671 B1 KR102511671 B1 KR 102511671B1 KR 1020220111999 A KR1020220111999 A KR 1020220111999A KR 20220111999 A KR20220111999 A KR 20220111999A KR 102511671 B1 KR102511671 B1 KR 102511671B1
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- 229910001112 rose gold Inorganic materials 0.000 title claims abstract description 62
- 239000010970 precious metal Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 126
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 15
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
Abstract
Description
본 발명은 핑크골드 색상이 구현되는 땜 용접 조성물 및 이를 이용한 귀금속 땜 용접방법에 관한 것으로서, 더욱 상세하게는 핑크골드 모재와 색상이 동일하여 색상 이질감이 없고 모재와 일체형으로 구현가능하며 젖음성 및 경도가 우수한 핑크골드 색상이 구현되는 땜 용접 조성물 및 이를 이용한 귀금속 땜 용접방법에 관한 것이다.The present invention relates to a solder welding composition that realizes a pink gold color and a precious metal solder welding method using the same, and more particularly, since the color is the same as that of a pink gold base material, there is no color heterogeneity, it can be implemented integrally with the base material, and wettability and hardness are improved. It relates to a solder welding composition that realizes an excellent pink gold color and a noble metal solder welding method using the same.
장신구 시장에서는 전통적으로 옐로우, 화이트 골드가 가장 큰 시장을 형성하고 있었으나, 최근에는 소비자의 다양한 니즈에 따라 레드-핑크 계열의 금합금재가 출시되었으며, 현재는 가장 큰 시장 점유율을 보이고 있다.In the jewelry market, yellow and white gold have traditionally formed the largest market, but recently, red-pink gold alloy materials have been released in accordance with various needs of consumers, and currently have the largest market share.
예를 들어, 금반지와 같이 귀금속을 주재료로 한 장신구는 액세사리로서 많은 사람들이 착용을 원하고 있으며, 사용되는 금 합금은 주로 색상구현, 내구성의 향상 목적을 위해 귀금속인 금(Au) 이외에, 은(Ag)이나 구리(Cu) 등이 합금되고 있다.For example, jewelry made of precious metals, such as gold rings, is wanted by many people as accessories, and the gold alloy used is mainly gold (Au), which is a precious metal, for the purpose of implementing color and improving durability, as well as silver ( Ag) or copper (Cu) are being alloyed.
한편, 일반적으로 장신구 제품 제작을 위해서는 요소 간 접합이나 표면에 생긴 기포 등을 메우기 위한 땜공정이 필수적으로 동반되는데, 이때 사용되는 땜 용접 조성물은, 일반적으로 1) 모재와 성분의 함량이 동일하고, 2) 모재와의 육안상 색상 구별이 어려워야 하며, 3) 모재보다 약 50℃ 이상 낮은 융점을 가져야 하고, 4) 젖음성이 우수하여 모재의 틈으로 솔더재의 융액이 잘 흘러 들어가며, 5) 충분한 내구성이 확보되어야 할 필요가 있다.On the other hand, in general, in order to manufacture jewelry products, a soldering process for bonding between elements or filling air bubbles formed on the surface is necessarily accompanied. 2) It must be difficult to distinguish the color from the parent material with the naked eye, 3) It must have a melting point that is about 50℃ lower than that of the parent material, 4) Excellent wettability allows the solder melt to flow well through the cracks of the parent material, 5) Sufficient durability This needs to be secured.
종래 장신구용 금합금재는 기본적으로 Au-Ag-Cu 삼원합금을 주로 사용하며, 이때 땜 소재는 Au를 제외한 Ag, Cu 등과 같은 기타 합금원소를 약 10wt% 정도 Cd로 대체하여 융점을 낮추고 젖음성을 향상시킨 합금재를 사용하였다.Conventional gold alloy materials for jewelry mainly use Au-Ag-Cu ternary alloys. At this time, the solder material is about 10 wt% of other alloy elements such as Ag and Cu, excluding Au, replaced with Cd to lower the melting point and improve wettability. alloy material was used.
그러나 종래 장신구용 금합금재와 같이 Cd 원소가 다량 포함된 땜 용접 조성물이 핑크골드를 용접하기 위하여 사용되는 경우, Cu의 함량 저하에 따라 육안상 색상의 차이가 크게 발생하고, 인체에 유해하여 장신구로써 사용 도중 땀 등에 의한 용출로 인체에 흡수되어 질병의 원인이 될 수 있는 문제가 있다.However, when a soldering welding composition containing a large amount of Cd elements, such as a conventional gold alloy material for jewelry, is used to weld pink gold, a large difference in color occurs with the naked eye as the content of Cu decreases, and it is harmful to the human body, so it is used as an accessory. During use, there is a problem that it can be absorbed into the human body due to elution by sweat or the like, which can cause disease.
따라서 핑크골드 색상을 구현하기 위한 조건을 충족하면서 인체에 무해하고 물성이 우수한 핑크골드용 땜 용접 조성물에 관한 기술 개발이 요청되고 있는 실정이다.Therefore, there is a demand for technical development of a solder welding composition for pink gold that is harmless to the human body and has excellent physical properties while satisfying the conditions for realizing a pink gold color.
본 발명이 해결하고자 하는 과제는, 핑크골드 모재와 색상이 동일하여 색상 이질감이 없고 모재와 일체형으로 구현가능하며 젖음성 및 경도가 우수한 핑크골드 색상이 구현되는 땜 용접 조성물 및 이를 이용한 귀금속 땜 용접방법을 제공하는데 있다.The problem to be solved by the present invention is to provide a solder welding composition that has the same color as the pink gold base material, so there is no color heterogeneity, can be implemented integrally with the base material, and realizes a pink gold color with excellent wettability and hardness, and a precious metal solder welding method using the same is in providing
또한, 본 발명이 해결하고자 하는 다른 과제는, 핑크골드 색상을 구현하기 위한 조건을 충족하면서 인체에 무해하고 물성이 우수한 핑크골드 색상이 구현되는 땜 용접 조성물 및 이를 이용한 귀금속 땜 용접방법을 제공하는데 있다.In addition, another problem to be solved by the present invention is to provide a solder welding composition that is harmless to the human body and has excellent physical properties while satisfying the conditions for implementing a pink gold color and a noble metal solder welding method using the same .
본 발명이 해결하고자 하는 다양한 과제들은 이상에서 언급한 과제들에 제한되지 않으며, 언급되지 않은 또 다른 과제들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.Various problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.
본 발명의 기술적 사상의 일 실시예에서는 핑크골드 색상이 구현되는 땜 용접 조성물을 개시한다.In one embodiment of the technical idea of the present invention, a solder welding composition in which a pink gold color is implemented is disclosed.
상기 핑크골드 색상이 구현되는 땜 용접 조성물은 금(Au), 은(Ag), 구리(Cu), 아연(Zn), 나트륨(Na), 규소(Si), 황(S), 칼슘(Ca) 및 철(Fe)로 이루어진다.The solder welding composition realizing the pink gold color is gold (Au), silver (Ag), copper (Cu), zinc (Zn), sodium (Na), silicon (Si), sulfur (S), calcium (Ca) and iron (Fe).
또한, 본 발명의 기술적 사상의 다른 실시예에서는 핑크골드 색상이 구현되는 땜 용접 조성물을 이용한 귀금속 땜 용접방법을 개시한다.In addition, another embodiment of the technical idea of the present invention discloses a noble metal solder welding method using a solder welding composition that implements a pink gold color.
상기 핑크골드 색상이 구현되는 땜 용접 조성물을 이용한 귀금속 땜 용접방법은, 귀금속 모재의 땜소재로 사용되는 땜 용접 조성물을 준비하는 땜 용접 조성물 준비 단계(S100); 상기 준비된 땜 용접 조성물을 일정한 중량 비율로 계량하여 혼합하는 혼합 단계(S200); 상기 혼합된 땜 용접 조성물에 열을 가하여 용융시킴으로써 용융된 땜소재를 제조하는 용융 단계(S300); 상기 용융된 땜소재를 냉각시키는 냉각 단계(S400); 상기 냉각된 땜소재가 용접될 귀금속 모재를 준비하는 귀금속 모재 준비 단계(S500); 상기 냉각된 땜소재를 상기 귀금속 모재에 용접하는 땜소재 용접 단계(S600); 상기 땜소재가 용접된 귀금속 모재를 세척액에 침지하여 세척하는 귀금속 모재 세척 단계(S700); 및 상기 땜소재가 용접된 후 세척된 귀금속 모재에 반응 가스를 가하여 질화층을 형성함으로써 용접된 핑크골드 귀금속을 제조하는 표면처리 단계(S800)를 포함한다.The noble metal solder welding method using the solder welding composition realizing the pink gold color includes a solder welding composition preparation step (S100) of preparing a solder welding composition used as a solder material for a noble metal base material; A mixing step (S200) of weighing and mixing the prepared solder welding composition at a constant weight ratio; a melting step (S300) of preparing a molten solder material by applying heat to the mixed solder welding composition and melting it; a cooling step (S400) of cooling the molten solder material; A noble metal base material preparation step (S500) of preparing a noble metal base material to be welded with the cooled solder material; a solder material welding step (S600) of welding the cooled braze material to the noble metal base material; a precious metal base material washing step (S700) of washing the noble metal base material welded with the brazing material by immersing it in a cleaning solution; and a surface treatment step (S800) of producing a welded pink gold noble metal by forming a nitride layer by applying a reactive gas to the noble metal base material cleaned after the solder material is welded.
기타 실시예들의 구체적인 사항들은 상세한 설명에 포함되어 있다.Details of other embodiments are included in the detailed description.
본 발명의 기술적 사상의 다양한 실시예에 의한 핑크골드 색상이 구현되는 땜 용접 조성물은, 핑크골드 모재와 색상이 동일하여 색상 이질감이 없고 모재와 일체형으로 구현가능하며 젖음성 및 경도가 우수하다.According to various embodiments of the technical concept of the present invention, the solder welding composition in which pink gold color is realized has the same color as the pink gold base material, so there is no color difference, it can be implemented integrally with the base material, and it has excellent wettability and hardness.
또한, 본 발명의 기술적 사상의 다양한 실시예에 의한 핑크골드 색상이 구현되는 땜 용접 조성물은, 핑크골드 색상을 구현하기 위한 조건을 충족하면서 인체에 무해하고 물성이 우수하다.In addition, the solder welding composition in which pink gold color is realized according to various embodiments of the technical idea of the present invention satisfies the conditions for implementing pink gold color, is harmless to the human body, and has excellent physical properties.
본 발명의 기술적 사상의 다양한 실시예는, 구체적으로 언급되지 않은 다양한 효과를 제공할 수 있다는 것이 충분히 이해될 수 있을 것이다.It will be fully understood that various embodiments of the technical idea of the present invention can provide various effects not specifically mentioned.
도 1은 본 발명의 기술적 사상의 일 실시예에 따른 핑크골드 색상이 구현되는 땜 용접 조성물을 이용한 귀금속 땜 용접방법을 설명하기 위한 순서도이다.
도 2는 실시예와 비교예에 따라 용접된 핑크골드 귀금속이 부착된 핑크골드 색상을 차이를 보여주는 사진으로, A 부분은 종래 핑크골드 모재 부분이고, B 부분은 실시예에 따른 조성물을 이용하여 용접된 핑크골드 귀금속 부분이며, C 부분은 비교예에 따른 조성물을 이용하여 용접된 핑크골드 귀금속을 보여주는 사진이다.
도 3은 실시예에 따른 땜 용접 조성물의 젖음각(wetting angle)을 나타내는 도면이다.
도 4는 비교예에 따른 땜 용접 조성물의 젖음각(wetting angle)을 나타내는 도면이다.1 is a flowchart illustrating a noble metal solder welding method using a solder welding composition in which a pink gold color is realized according to an embodiment of the technical idea of the present invention.
Figure 2 is a photograph showing the difference in the color of pink gold with pink gold precious metal welded according to Examples and Comparative Examples, in which part A is a conventional pink gold base material part and part B is welded using the composition according to the example It is a pink gold precious metal part, and part C is a photograph showing the pink gold precious metal welded using the composition according to the comparative example.
3 is a view showing a wetting angle of a solder welding composition according to an embodiment.
4 is a view showing a wetting angle of a solder welding composition according to a comparative example.
본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 상세하게 후술되어 있는 실시예를 참조하면 명확해질 것이다. 그러나 본 발명은 여기서 설명되는 실시예들에 한정되지 않고 다른 형태로 구체화될 수도 있다. 오히려, 여기서 소개되는 실시예들은 개시된 내용이 철저하고 완전해질 수 있도록 그리고 당업자에게 본 발명의 사상이 충분히 전달될 수 있도록 하기 위해 제공되는 것이다.The advantages and features of the present invention, and how to achieve them, will become clear with reference to the detailed description of the embodiments below. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed content will be thorough and complete and the spirit of the present invention will be sufficiently conveyed to those skilled in the art.
본 출원에서 사용한 용어는 단지 특정한 실시예를 설명하기 위해 사용된 것으로, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다.Terms used in this application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.
다르게 정의되지 않는 한, 기술적이거나 과학적인 용어를 포함해서 여기서 사용되는 모든 용어들은 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 일반적으로 이해되는 것과 동일한 의미가 있다. 일반적으로 사용되는 사전에 정의되어 있는 것과 같은 용어들은 관련 기술의 문맥상 가지는 의미와 일치하는 의미가 있는 것으로 해석되어야 하며, 본 출원에서 명백하게 정의하지 않는 한, 이상적이거나 과도하게 형식적인 의미로 해석되지 않는다.Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with the meanings in the context of the related art, and unless explicitly defined in this application, they should not be interpreted in ideal or excessively formal meanings. don't
이하, 본 발명의 기술적 사상의 일 실시예에 따른 핑크골드 색상이 구현되는 땜 용접 조성물에 대하여 바람직한 실시예를 들어 상세하게 설명한다.Hereinafter, a solder welding composition having a pink gold color according to an embodiment of the technical idea of the present invention will be described in detail with a preferred embodiment.
본 발명의 기술적 사상의 일 실시예에 따른 핑크골드 색상이 구현되는 땜 용접 조성물은 금(Au), 은(Ag), 구리(Cu), 아연(Zn), 나트륨(Na), 규소(Si), 황(S), 칼슘(Ca) 및 철(Fe)로 이루어질 수 있다.The solder welding composition realizing a pink gold color according to an embodiment of the technical idea of the present invention includes gold (Au), silver (Ag), copper (Cu), zinc (Zn), sodium (Na), and silicon (Si) , sulfur (S), calcium (Ca) and iron (Fe).
또한, 본 발명의 기술적 사상의 일 실시예에 따른 핑크골드 색상이 구현되는 땜 용접 조성물은 금(Au) 45 내지 47 중량부, 은(Ag) 15 내지 17 중량부, 구리(Cu) 30 내지 32 중량부, 아연(Zn) 1 내지 3 중량부, 나트륨(Na) 0.01 내지 0.1 중량부, 규소(Si) 0.01 내지 0.1 중량부, 황(S) 0.01 내지 0.05 중량부, 칼슘(Ca) 0.005 내지 0.05 중량부 및 철(Fe) 0.005 내지 0.05 중량부의 중량 비율로 이루어질 수 있다.In addition, the solder welding composition realizing a pink gold color according to an embodiment of the technical idea of the present invention contains 45 to 47 parts by weight of gold (Au), 15 to 17 parts by weight of silver (Ag), and 30 to 32 parts by weight of copper (Cu). parts by weight, zinc (Zn) 1 to 3 parts by weight, sodium (Na) 0.01 to 0.1 parts by weight, silicon (Si) 0.01 to 0.1 parts by weight, sulfur (S) 0.01 to 0.05 parts by weight, calcium (Ca) 0.005 to 0.05 parts by weight It may be made in a weight ratio of 0.005 to 0.05 parts by weight and iron (Fe).
또한, 본 발명의 기술적 사상의 일 실시예에 따른 핑크골드 색상이 구현되는 땜 용접 조성물은 18K 핑크골드 귀금속 모재의 땜소재 또는 14K 핑크골드 귀금속 모재의 땜소재로 사용될 수 있다.In addition, the solder welding composition realizing a pink gold color according to an embodiment of the technical idea of the present invention can be used as a brazing material for a 18K pink gold precious metal base material or a 14K pink gold noble metal base material brazing material.
이하, 첨부된 도면을 첨부하여 본 발명의 기술적 사상의 일 실시예에 따른 핑크골드 색상이 구현되는 땜 용접 조성물을 이용한 귀금속 땜 용접방법에 대하여 바람직한 실시예를 들어 더욱 구체적으로 설명한다.Hereinafter, a noble metal solder welding method using a solder welding composition realizing a pink gold color according to an embodiment of the technical idea of the present invention will be described in more detail with reference to preferred embodiments with accompanying drawings.
도 1은 본 발명의 기술적 사상의 일 실시예에 따른 핑크골드 색상이 구현되는 땜 용접 조성물을 이용한 귀금속 땜 용접방법을 설명하기 위한 순서도이다.1 is a flowchart illustrating a noble metal solder welding method using a solder welding composition in which a pink gold color is realized according to an embodiment of the technical idea of the present invention.
도 1을 참조하면, 본 발명의 기술적 사상의 일 실시예에 따른 핑크골드 색상이 구현되는 땜 용접 조성물을 이용한 귀금속 땜 용접방법은 땜 용접 조성물 준비 단계(S100), 혼합 단계(S200), 용융 단계(S300), 냉각 단계(S400), 귀금속 모재 준비 단계(S500), 땜소재 용접 단계(S600), 귀금속 모재 세척 단계(S700) 및 표면처리 단계(S800)를 포함한다.Referring to FIG. 1 , a noble metal solder welding method using a solder welding composition realizing a pink gold color according to an embodiment of the technical idea of the present invention includes a solder welding composition preparation step (S100), a mixing step (S200), and a melting step. (S300), a cooling step (S400), a noble metal base material preparation step (S500), a solder material welding step (S600), a noble metal base material cleaning step (S700), and a surface treatment step (S800).
1. 땜 용접 조성물 준비 단계(S100)1. Preparing a Solder Welding Composition (S100)
상기 땜 용접 조성물 준비 단계(S100)는 귀금속 모재의 땜소재로 사용되는 땜 용접 조성물을 준비하는 단계이다.The preparation of the solder welding composition (S100) is a step of preparing a solder welding composition used as a brazing material for a noble metal base material.
상기 땜 용접 조성물 준비 단계(S100)에서 상기 귀금속 모재의 땜소재로 사용되는 땜 용접 조성물로는 금(Au), 은(Ag), 구리(Cu), 아연(Zn), 나트륨(Na), 규소(Si), 황(S), 칼슘(Ca) 및 철(Fe)로 이루어진 조성물이 준비될 수 있다.In the preparation of the solder welding composition (S100), the solder welding composition used as a solder material for the noble metal base material includes gold (Au), silver (Ag), copper (Cu), zinc (Zn), sodium (Na), silicon A composition consisting of (Si), sulfur (S), calcium (Ca) and iron (Fe) may be prepared.
2. 혼합 단계(S200)2. Mixing step (S200)
상기 혼합 단계(S200)는 상기 준비된 땜 용접 조성물을 일정한 중량 비율로 계량하여 혼합하는 단계이다.The mixing step (S200) is a step of weighing and mixing the prepared solder welding composition at a constant weight ratio.
상기 혼합 단계(S200)에서는 상기 준비된 땜 용접 조성물을 금(Au) 45 내지 47 중량부, 은(Ag) 15 내지 17 중량부, 구리(Cu) 30 내지 32 중량부, 아연(Zn) 1 내지 3 중량부, 나트륨(Na) 0.01 내지 0.1 중량부, 규소(Si) 0.01 내지 0.1 중량부, 황(S) 0.01 내지 0.05 중량부, 칼슘(Ca) 0.005 내지 0.05 중량부 및 철(Fe) 0.005 내지 0.05 중량부의 중량 비율로 계량하여 혼합할 수 있다.In the mixing step (S200), the prepared solder welding composition is mixed with 45 to 47 parts by weight of gold (Au), 15 to 17 parts by weight of silver (Ag), 30 to 32 parts by weight of copper (Cu), and 1 to 3 parts by weight of zinc (Zn). parts by weight, sodium (Na) 0.01 to 0.1 parts by weight, silicon (Si) 0.01 to 0.1 parts by weight, sulfur (S) 0.01 to 0.05 parts by weight, calcium (Ca) 0.005 to 0.05 parts by weight, and iron (Fe) 0.005 to 0.05 parts by weight It may be weighed and mixed in a weight ratio of parts by weight.
3. 용융 단계(S300)3. Melting step (S300)
상기 용융 단계(S300)는 상기 혼합된 땜 용접 조성물에 열을 가하여 용융시킴으로써 용융된 땜소재를 제조하는 단계이다.The melting step (S300) is a step of preparing a molten solder material by applying heat to the mixed solder welding composition and melting it.
상기 용융 단계(S300)에서는 상기 혼합된 땜 용접 조성물에 1,000 내지 1,200℃ 온도의 열원을 가하여 용융시킴으로써 땜 용접 조성물이 균일하게 혼합되어 용융된 땜소재를 제조할 수 있다.In the melting step (S300), a heat source having a temperature of 1,000 to 1,200° C. is applied to the mixed solder welding composition to melt it, so that the solder welding composition is uniformly mixed to prepare a molten brazing material.
4. 냉각 단계(S400)4. Cooling step (S400)
상기 냉각 단계(S400)는 상기 용융된 땜소재를 냉각시키는 단계이다.The cooling step (S400) is a step of cooling the molten solder material.
상기 냉각 단계(S400)에서는 상기 용융된 땜소재를 냉각시킴으로써 귀금속 모재 표면에 부착될 때 젖음성을 향상시킬 수 있는데, 예를 들어, 상기 냉각 단계(S400)는 상기 용융된 땜소재를 830 내지 870℃ 온도로 냉각시킴으로써 진행될 수 있다.In the cooling step (S400), wettability may be improved when the molten braze material is attached to the surface of the precious metal base material by cooling the molten braze material. It can be carried out by cooling to a temperature.
5. 귀금속 모재 준비 단계(S500)5. Precious metal base material preparation step (S500)
상기 귀금속 모재 준비 단계(S500)는 상기 냉각된 땜소재가 용접될 귀금속 모재를 준비하는 단계이다.The noble metal base material preparation step (S500) is a step of preparing a noble metal base material to be welded with the cooled braze material.
상기 귀금속 모재 준비 단계(S500)에서 상기 귀금속 모재로는 연결부위 또는 이음매가 필요한 핑크골드 모재가 준비될 수 있는데, 예를 들어, 상기 귀금속 모재로는 18K 핑크골드 귀금속 모재 또는 14K 핑크골드 귀금속 모재가 사용될 수 있다.In the precious metal base material preparation step (S500), a pink gold base material requiring a connection or a joint may be prepared as the precious metal base material. can be used
6. 땜소재 용접 단계(S600)6. Solder material welding step (S600)
상기 땜소재 용접 단계(S600)는 상기 냉각된 땜소재를 상기 귀금속 모재에 용접하는 단계이다.The solder material welding step (S600) is a step of welding the cooled braze material to the noble metal base material.
상기 땜소재 용접 단계(S600)에서는 상기 냉각된 땜소재를 연결부위 또는 이음매가 필요하거나 외력에 의해 분리된 귀금속 모재를 용접하여 결합함으로써 진행될 수 있는데, 상기 땜소재 용접 단계(S600)에서 땜소재를 이용하여 용접하는 구성은 공지의 기술인바, 설명의 편의 및 본 발명의 기술적 사상의 명확성을 위하여 이에 대한 구체적인 설명은 생략하기로 한다.In the solder material welding step (S600), the cooled braze material may be performed by welding and combining noble metal base materials that require a joint or joint or are separated by external force. In the braze material welding step (S600), Since the welding configuration is a well-known technique, a detailed description thereof will be omitted for convenience of description and clarity of the technical idea of the present invention.
7. 귀금속 모재 세척 단계(S700)7. Precious metal base material cleaning step (S700)
상기 귀금속 모재 세척 단계(S700)는 상기 땜소재가 용접된 귀금속 모재를 세척액에 침지하여 세척하는 단계이다.The noble metal base material cleaning step (S700) is a step of washing the noble metal base material welded with the brazing material by immersing it in a cleaning solution.
상기 귀금속 모재 세척 단계(S700)에서는 상기 땜소재가 용접된 귀금속 모재를 세척액에 침지하여 세척함으로써 상기 귀금속 모재에 부착되어 있는 이물질이나 용접 잔류물을 제거함과 동시에 내식성, 내구성, 내마모성 등의 물성이 향상된 귀금속 모재를 제조할 수 있는데, 상기 세척액은 티오요소류 화합물, 과산화수소, 아미노산, 킬레이트제, 분산안정화제, 계면활성제 및 탈이온수를 포함한다.In the noble metal base material cleaning step (S700), the noble metal base material to which the brazing material is welded is immersed in a cleaning solution to wash, thereby removing foreign substances or welding residues attached to the noble metal base material, and at the same time improving physical properties such as corrosion resistance, durability, and wear resistance A noble metal matrix may be prepared, and the washing solution includes a thiourea compound, hydrogen peroxide, an amino acid, a chelating agent, a dispersion stabilizer, a surfactant and deionized water.
또한, 상기 세척액은 티오요소류 화합물 1 내지 3 중량%, 과산화수소 2 내지 4 중량%, 아미노산 1 내지 3 중량%, 킬레이트제 0.1 내지 0.3 중량%, 분산안정화제 0.05 내지 0.15 중량%, 계면활성제 0.1 내지 0.3 중량% 및 100 중량%를 만족하는 잔량의 탈이온수를 포함한다.In addition, the washing solution contains 1 to 3% by weight of thiourea compounds, 2 to 4% by weight of hydrogen peroxide, 1 to 3% by weight of amino acids, 0.1 to 0.3% by weight of chelating agents, 0.05 to 0.15% by weight of dispersion stabilizers, and 0.1 to 0.1% by weight of surfactants. 0.3% by weight and the remaining amount of deionized water to satisfy 100% by weight.
상기 티오요소류 화합물은 땜소재가 용접된 귀금속 모재를 세척할 때 세척액이 안정적으로 유지될 수 있도록 하기 위하여 포함될 수 있는데, 상기 티오요소류 화합물은 티오요소 (NH2)2CS 또는 일반식 (R1R2N)(R3R4N)C=S(여기서, R1, R2, R3, R4는 각각 독립적으로 수소 원자, 에틸기 또는 메틸기에서 선택되는 어느 하나임)로 표현되는 티오요소 유도체를 포함할 수 있다.The thiourea compound may be included so that the cleaning solution can be stably maintained when the noble metal base material to which the solder material is welded is washed. The thiourea compound is thiourea (NH 2 ) 2 CS or the general formula (R1R2N ) (R3R4N)C=S (where R1, R2, R3, R4 are each independently selected from a hydrogen atom, an ethyl group, or a methyl group).
상기 과산화수소는 산화제로 사용되는 물질로, 상기 과산화수소는 세척이 용이하게 수행될 수 있도록 하는 역할을 수행할 수 있다.The hydrogen peroxide is a material used as an oxidizing agent, and the hydrogen peroxide may play a role in enabling cleaning to be easily performed.
상기 아미노산은 산도 변화에 대한 완충 작용과 아울러 금속 이온의 봉쇄제 역할을 수행할 수 있는데, 예를 들어, 상기 아미노산은 탄소수 3 내지 10의 아미노산으로, 상기 아미노산은 이소류신, 아르기닌, 프롤린, 티로신, 글루탐산, 글루타민 및 글리신으로 이루어진 군에서 선택된 어느 하나 이상이 사용될 수 있다.The amino acid may act as a buffer for acidity change and also serve as a sequestering agent for metal ions. For example, the amino acid is an amino acid having 3 to 10 carbon atoms, and the amino acid is isoleucine, arginine, proline, tyrosine, glutamic acid , At least one selected from the group consisting of glutamine and glycine may be used.
상기 킬레이트제는 세척액의 세척 능력 저하 현상을 방지하고, 이물질이나 금속이온이 화학결합을 통해 재흡착되는 것을 방지하기 위하여 첨가될 수 있는데, 예를 들어, 상기 킬레이트제로는 디에틸렌트리니트릴로펜타아세트산(diethylene trinitrilo pentaacetic acid ; DTPA) 및 글루타믹엑시드-2-아세틱엑시드가 1:1의 중량 비율로 혼합되어 사용될 수 있다.The chelating agent may be added to prevent deterioration of the cleaning ability of the cleaning solution and to prevent re-adsorption of foreign substances or metal ions through chemical bonding. For example, the chelating agent is diethylene trinitrilopentaacetic acid. (diethylene trinitrilo pentaacetic acid; DTPA) and glutamic acid-2-acetic acid may be mixed in a weight ratio of 1:1.
상기 분산안정화제는 상기 티오요소류 화합물, 과산화수소, 아미노산, 킬레이트제 등의 조성물을 안정화시키고 허니컴 담체 계면을 보호하기 위하여 사용될 수 있는데, 예를 들어, 상기 분산안정화제는 하기의 [화학식 1]로 나타내는 물질이 사용될 수 있다.The dispersion stabilizer may be used to stabilize the composition of the thiourea compound, hydrogen peroxide, amino acid, chelating agent, etc. and to protect the honeycomb carrier interface. For example, the dispersion stabilizer is represented by the following [Formula 1]: Indicated materials may be used.
[화학식 1][Formula 1]
상기 계면활성제는 세척액 조성물의 땜소재가 용접된 귀금속 모재에 대한 침투력을 향상시키고, 땜소재가 용접된 귀금속 모재 표면으로 에칭액 조성물이 용이하게 유동될 수 있도록 하기 위하여 첨가될 수 있다.The surfactant may be added to improve penetration of the cleaning liquid composition into the noble metal base material welded to the brazing material and to allow the etchant composition to easily flow to the surface of the noble metal base material to which the brazing material is welded.
상기 계면활성제는 글리세롤(glycerol), 트리에틸렌 글리콜(triethylene glycol) 및 폴리에틸렌 글리콜(polyethylene glycol)로 이루어진 군에서 선택되는 어느 하나 이상을 사용할 수 있는데, 바람직하게는 상기 계면활성제로 트리에틸렌글리콜이 사용될 수 있다.As the surfactant, one or more selected from the group consisting of glycerol, triethylene glycol, and polyethylene glycol may be used. Preferably, triethylene glycol may be used as the surfactant. there is.
상기 탈이온수는 물속의 이온이 제거된 것으로, 상기 탈이온수는 비저항값이 18MΩ·cm 이상인 탈이온수를 사용하는 것이 바람직하다.The deionized water is deionized water from which ions in water are removed, and it is preferable to use deionized water having a resistivity value of 18 MΩ·cm or more.
8. 표면처리 단계(S800)8. Surface treatment step (S800)
상기 표면처리 단계(S800)는 상기 땜소재가 용접된 후 세척된 귀금속 모재에 반응 가스를 가하여 질화층을 형성함으로써 용접된 핑크골드 귀금속을 제조하는 단계이다.The surface treatment step (S800) is a step of manufacturing a welded pink gold precious metal by applying a reactive gas to the noble metal base material washed after the solder material is welded to form a nitride layer.
상기 표면처리 단계(S800)에서는 암모니아(NH3)로 이루어진 반응 가스를 일정한 온도로 가열한 후 일정 시간 동안 상기 땜소재가 용접된 후 세척된 귀금속 모재로 분사함으로써 질화층을 형성할 수 있는데, 상기 표면처리 단계(S800)에서는 공지된 반응 챔버를 이용하여 암모니아(NH3)로 이루어진 반응 가스를 450 내지 550℃ 온도로 가열한 후, 상기 가열된 반응 가스를 300 내지 500m/s의 분사 속도로 상기 땜소재가 용접된 후 세척된 귀금속 모재로 분사함으로써 진행될 수 있다.In the surface treatment step (S800), a nitride layer may be formed by heating a reaction gas made of ammonia (NH 3 ) to a certain temperature and then spraying the braze material to the noble metal base material washed after welding the braze material for a certain time. In the surface treatment step (S800), a reaction gas made of ammonia (NH 3 ) is heated to a temperature of 450 to 550 ° C using a known reaction chamber, and then the heated reaction gas is sprayed at a spray speed of 300 to 500 m / s. It can be carried out by spraying the noble metal base material cleaned after the solder material has been welded.
이때, 상기 암모니아(NH3)로 이루어진 반응 가스는 2NH3 ⇔ 3H2 + 2N의 반응이 일어나며, 그 결과 질소 원자가 땜소재가 용접된 후 세척된 귀금속 모재의 표면에서 질화 과정을 일으켜 질화층을 형성함으로써 내식성, 내구성, 내마모성 등 물성이 우수한 용접된 핑크골드 귀금속을 제조할 수 있다.At this time, the reaction gas composed of ammonia (NH 3 ) causes a reaction of 2NH 3 ⇔ 3H 2 + 2N, and as a result, nitrogen atoms cause a nitridation process on the surface of the noble metal base material washed after the solder material is welded to form a nitride layer. By doing so, it is possible to manufacture a welded pink gold noble metal having excellent physical properties such as corrosion resistance, durability, and wear resistance.
이하, 첨부된 도면을 참조하여 본 발명의 기술적 사상의 일 실시예에 따른 핑크골드 색상이 구현되는 땜 용접 조성물을 이용한 귀금속 땜 용접방법에 대한 실시예를 들어 구체적으로 설명하기로 한다. 하기의 실시예는 본 발명을 예시하기 위한 것으로서 본 발명은 하기 실시예에 한정되지 않으며, 다양하게 수정 및 변경될 수 있다.Hereinafter, a noble metal solder welding method using a solder welding composition realizing a pink gold color according to an embodiment of the technical idea of the present invention will be described in detail with reference to the accompanying drawings. The following examples are intended to illustrate the present invention, and the present invention is not limited to the following examples, and may be variously modified and changed.
< 실시예 >< Example >
먼저, 금(Au), 은(Ag), 구리(Cu), 아연(Zn), 나트륨(Na), 규소(Si), 황(S), 칼슘(Ca) 및 철(Fe)로 이루어진 땜 용접 조성물을 준비한 후, 상기 금(Au) 45.99 중량부, 은(Ag) 15.58 중량부, 구리(Cu) 30.48 중량부, 아연(Zn) 1.7 중량부, 나트륨(Na) 0.041 중량부, 규소(Si) 0.037 중량부, 황(S) 0.029 중량부, 칼슘(Ca) 0.012 중량부 및 철(Fe) 0.011 중량부의 중량 비율로 혼합하였다.First, solder welding made of gold (Au), silver (Ag), copper (Cu), zinc (Zn), sodium (Na), silicon (Si), sulfur (S), calcium (Ca) and iron (Fe) After preparing the composition, 45.99 parts by weight of gold (Au), 15.58 parts by weight of silver (Ag), 30.48 parts by weight of copper (Cu), 1.7 parts by weight of zinc (Zn), 0.041 part by weight of sodium (Na), and silicon (Si) 0.037 parts by weight, sulfur (S) 0.029 parts by weight, calcium (Ca) 0.012 parts by weight, and iron (Fe) 0.011 parts by weight were mixed in a weight ratio.
다음으로, 상기 혼합된 땜 용접 조성물에 1,100℃ 온도의 열원을 가하여 용융시킴으로써 용융된 땜소재를 제조하였고, 상기 용융된 땜소재를 850℃ 온도로 냉각시켰다.Next, a molten brazing material was prepared by applying a heat source of 1,100°C to the mixed solder welding composition and melting it, and the molten brazing material was cooled to a temperature of 850°C.
그 다음으로, 상기 냉각된 땜소재를 이음매가 필요한 18K 핑크골드 귀금속 모재에 용접하였고, 상기 땜소재가 용접된 귀금속 모재를 세척액에 침지하여 세척하였다.Next, the cooled braze material was welded to an 18K pink gold noble metal base material requiring a joint, and the noble metal base material to which the braze material was welded was immersed in a cleaning solution and washed.
이때, 상기 세척액은 티오요소류 화합물 2 중량%, 과산화수소 3 중량%, 아미노산 2 중량%, 킬레이트제 0.2 중량%, 분산안정화제 0.1 중량%, 계면활성제 0.2 중량% 및 100 중량%를 만족하는 잔량의 탈이온수로 이루어졌다.At this time, the washing solution contains 2% by weight of thiourea compound, 3% by weight of hydrogen peroxide, 2% by weight of amino acid, 0.2% by weight of chelating agent, 0.1% by weight of dispersion stabilizer, 0.2% by weight of surfactant, and the remaining amount satisfying 100% by weight It was made with deionized water.
이어서, 상기 세척된 귀금속 모재에 암모니아(NH3)로 이루어진 반응 가스를 500℃ 온도로 가열한 후, 상기 가열된 반응 가스를 400m/s의 분사 속도로 가하여 질화층을 형성함으로써 용접된 핑크골드 귀금속을 제조하였다.Subsequently, a reaction gas made of ammonia (NH 3 ) is heated to a temperature of 500 ° C to the washed precious metal base material, and then a nitride layer is formed by applying the heated reaction gas at a spray speed of 400 m / s. Pink gold precious metal welded was manufactured.
< 비교예 ><Comparative Example>
먼저, 금(Au), 은(Ag), 구리(Cu) 중량부 및 아연(Zn)으로 이루어진 땜 용접 조성물을 준비한 후, 상기 금(Au) 48.32 중량부, 은(Ag) 12.31 중량부, 구리(Cu) 38.32 중량부 및 아연(Zn) 3.51 중량부의 중량 비율로 혼합하였다.First, after preparing a soldering welding composition composed of gold (Au), silver (Ag), copper (Cu) parts by weight, and zinc (Zn), 48.32 parts by weight of gold (Au), 12.31 parts by weight of silver (Ag), copper (Cu) 38.32 parts by weight and zinc (Zn) 3.51 parts by weight were mixed in a weight ratio.
다음으로, 상기 혼합된 땜 용접 조성물에 1,100℃ 온도의 열원을 가하여 용융시킴으로써 용융된 땜소재를 제조하였고, 상기 용융된 땜소재를 850℃ 온도로 냉각시켰다.Next, a molten brazing material was prepared by applying a heat source of 1,100°C to the mixed solder welding composition and melting it, and the molten brazing material was cooled to a temperature of 850°C.
그 다음으로, 상기 냉각된 땜소재를 이음매가 필요한 18K 핑크골드 귀금속 모재에 용접하였고, 상기 땜소재가 용접된 귀금속 모재를 탈이온수에 침지하여 냉각 및 세척함으로써 용접된 핑크골드 귀금속을 제조하였다.Next, the cooled braze material was welded to an 18K pink gold precious metal base material that required a joint, and the noble metal base material welded to the braze material was immersed in deionized water to cool and wash, thereby manufacturing a welded pink gold precious metal.
1. 육안 색상 확인1. Visual color check
육안 색상 확인을 위해 상기 실시예에 따른 조성물을 이용하여 용접된 핑크골드 귀금속과 비교예에 따른 조성물을 이용하여 용접된 핑크골드 귀금속을 종래 핑크골드 모재에 부착한 후 육안으로 색상을 확인하였다.In order to confirm the color with the naked eye, after attaching the pink gold precious metal welded using the composition according to the embodiment and the pink gold precious metal welded using the composition according to the comparative example to the conventional pink gold base material, the color was visually confirmed.
도 2는 실시예와 비교예에 따라 용접된 핑크골드 귀금속이 부착된 핑크골드 색상을 차이를 보여주는 사진으로, A 부분은 종래 핑크골드 모재 부분이고, B 부분은 실시예에 따른 조성물을 이용하여 용접된 핑크골드 귀금속 부분이며, C 부분은 비교예에 따른 조성물을 이용하여 용접된 핑크골드 귀금속을 보여주는 사진이다.Figure 2 is a photograph showing the difference in the color of pink gold with pink gold precious metal welded according to Examples and Comparative Examples, in which part A is a conventional pink gold base material part and part B is welded using the composition according to the example It is a pink gold precious metal part, and part C is a photograph showing the pink gold precious metal welded using the composition according to the comparative example.
도 2를 참조하면, 실시예에 따른 조성물을 이용하여 용접된 핑크골드 귀금속 부분이 핑크골드 모재와 색상이 동일하여 색상 이질감이 없고 모재와 일체형으로 구현가능함을 확인할 수 있다.Referring to FIG. 2, it can be seen that the pink gold precious metal part welded using the composition according to the embodiment has the same color as the pink gold base material, so there is no color heterogeneity and it can be implemented integrally with the base material.
2. 젖음성 확인2. Check wettability
실시예에 따른 땜 용접 조성물과 비교예에 따른 땜 용접 조성물의 젖음성을 확인하기 위해, 평판 석고틀 상부에 각각 0.40g의 땜합금재를 넣고 대기로(㈜써모텍사 SK1700-B30모델)를 이용하여 10℃/min의 승온속도로 1200℃-10분 간 유지하여 용융 후, 냉각시켜 석고에 접촉된 반구형 고상 시료를 확보하였다.In order to check the wettability of the solder welding composition according to the examples and the comparative example, 0.40 g of brazing material was placed on top of the flat plaster mold, and an air furnace (Thermotech Co., Ltd. SK1700-B30 model) was used to confirm the wettability. After melting by maintaining the temperature at a heating rate of 10 ° C / min at 1200 ° C for 10 minutes, it was cooled to secure a hemispherical solid sample in contact with the gypsum.
이후, 고상 시료의 후면부 조명을 사용한 암시야 광학이미지를 확보하고 Image J 프로그램을 이용하여 젖음각(wetting angle)을 계산하였다.Thereafter, a dark field optical image was obtained using backside illumination of the solid sample, and a wetting angle was calculated using the Image J program.
도 3은 실시예에 따른 땜 용접 조성물의 젖음각(wetting angle)을 나타내는 도면이고, 도 4는 비교예에 따른 땜 용접 조성물의 젖음각(wetting angle)을 나타내는 도면이다.3 is a view showing a wetting angle of a solder welding composition according to an embodiment, and FIG. 4 is a view showing a wetting angle of a solder welding composition according to a comparative example.
도 3 및 도 4를 참조하면, 실시예에 따른 땜 용접 조성물의 젖음각은 55.1°이고, 비교예에 따른 땜 용접 조성물의 젖음각은 85°임을 확인하였다.Referring to FIGS. 3 and 4 , it was confirmed that the wetting angle of the solder welding composition according to Example was 55.1° and that of the solder welding composition according to Comparative Example was 85°.
통상 주조용 재료로는 70°미만의 접촉각을 나타내어야 건전한 젖음이 가능한데, 실시예에 따른 땜 용접 조성물의 젖음각은 55.1°로 젖음성이 우수함을 확인할 수 있다.In general, casting materials require a contact angle of less than 70° to achieve sound wetting, but the solder welding composition according to the Example had a wetting angle of 55.1°, indicating excellent wettability.
이상, 첨부된 도면을 참조하여 본 발명의 바람직한 일 실시예를 설명하였지만, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 본 발명이 그 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 일 실시예는 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.In the above, a preferred embodiment of the present invention has been described with reference to the accompanying drawings, but those skilled in the art to which the present invention pertains may change the technical spirit or essential characteristics of the present invention in other specific forms. It will be appreciated that this can be implemented. Therefore, one embodiment described above should be understood as illustrative in all respects and not limiting.
Claims (5)
Gold (Au) 45.99 parts by weight, silver (Ag) 15.58 parts by weight, copper (Cu) 30.48 parts by weight, zinc (Zn) 1.7 parts by weight, sodium (Na) 0.041 parts by weight, silicon (Si) 0.037 parts by weight, sulfur ( S) 0.029 parts by weight, calcium (Ca) 0.012 parts by weight and iron (Fe) in a weight ratio of 0.011 parts by weight, characterized in that the pink gold color realized soldering welding composition.
상기 준비된 땜 용접 조성물을 금(Au) 45.99 중량부, 은(Ag) 15.58 중량부, 구리(Cu) 30.48 중량부, 아연(Zn) 1.7 중량부, 나트륨(Na) 0.041 중량부, 규소(Si) 0.037 중량부, 황(S) 0.029 중량부, 칼슘(Ca) 0.012 중량부 및 철(Fe) 0.011 중량부의 중량 비율로 계량하여 혼합하는 혼합 단계(S200);
상기 혼합된 땜 용접 조성물에 열을 가하여 용융시킴으로써 용융된 땜소재를 제조하는 용융 단계(S300);
상기 용융된 땜소재를 냉각시키는 냉각 단계(S400);
상기 냉각된 땜소재가 용접될 귀금속 모재를 준비하는 귀금속 모재 준비 단계(S500);
상기 냉각된 땜소재를 상기 귀금속 모재에 용접하는 땜소재 용접 단계(S600);
상기 땜소재가 용접된 귀금속 모재를 티오요소류 화합물 2 중량%, 과산화수소 3 중량%, 아미노산 2 중량%, 킬레이트제 0.2 중량%, 분산안정화제 0.1 중량%, 계면활성제 0.2 중량% 및 100 중량%를 만족하는 잔량의 탈이온수로 이루어진 세척액에 침지하여 세척하는 귀금속 모재 세척 단계(S700); 및
상기 땜소재가 용접된 후 세척된 귀금속 모재에 반응 가스를 가하여 질화층을 형성함으로써 용접된 핑크골드 귀금속을 제조하는 표면처리 단계(S800)를 포함하는 것을 특징으로 하는 핑크골드 색상이 구현되는 땜 용접 조성물을 이용한 귀금속 땜 용접방법.
It is a solder welding composition used as a solder material for noble metal base materials. Gold (Au), silver (Ag), copper (Cu), zinc (Zn), sodium (Na), silicon (Si), sulfur (S), calcium (Ca ) and iron (Fe) preparing a solder welding composition (S100);
The prepared solder welding composition was 45.99 parts by weight of gold (Au), 15.58 parts by weight of silver (Ag), 30.48 parts by weight of copper (Cu), 1.7 parts by weight of zinc (Zn), 0.041 parts by weight of sodium (Na), and silicon (Si) A mixing step (S200) of weighing and mixing 0.037 parts by weight, 0.029 parts by weight of sulfur (S), 0.012 parts by weight of calcium (Ca) and 0.011 parts by weight of iron (Fe);
a melting step (S300) of preparing a molten solder material by applying heat to the mixed solder welding composition and melting it;
a cooling step (S400) of cooling the molten solder material;
A noble metal base material preparation step (S500) of preparing a noble metal base material to be welded with the cooled solder material;
a solder material welding step (S600) of welding the cooled braze material to the noble metal base material;
The noble metal base material to which the solder material is welded contains 2% by weight of a thiourea compound, 3% by weight of hydrogen peroxide, 2% by weight of an amino acid, 0.2% by weight of a chelating agent, 0.1% by weight of a dispersion stabilizer, 0.2% by weight of a surfactant, and 100% by weight. A noble metal base material washing step (S700) of washing by immersing in a washing solution consisting of a satisfactory remaining amount of deionized water; and
A surface treatment step (S800) of manufacturing a welded pink gold noble metal by applying a reactive gas to the noble metal base material washed after the solder material is welded to form a nitride layer Solder welding that realizes a pink gold color Precious metal solder welding method using the composition.
상기 용융 단계(S300)에서는 상기 혼합된 땜 용접 조성물에 1,100℃ 온도의 열원을 가하여 용융시킴으로써 진행되고,
상기 냉각 단계(S400)는 상기 용융된 땜소재를 850℃ 온도로 냉각시킴으로써 진행되며,
상기 귀금속 모재 준비 단계(S500)에서 상기 귀금속 모재로는 18K 핑크골드 귀금속 모재 또는 14K 핑크골드 귀금속 모재가 사용되는 것을 특징으로 하는 핑크골드 색상이 구현되는 땜 용접 조성물을 이용한 귀금속 땜 용접방법.According to claim 3,
In the melting step (S300), the mixed solder welding composition is melted by applying a heat source at a temperature of 1,100 ° C,
The cooling step (S400) is performed by cooling the molten brazing material to a temperature of 850 ° C.
In the noble metal base material preparation step (S500), a 18K pink gold noble metal base material or a 14K pink gold noble metal base material is used as the noble metal base material.
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