KR102506535B1 - Heat sink package device to maximize the power generation efficiency of solar power generation system - Google Patents

Abstract

In the present invention, a heat sink package device is disclosed. The heat sink package device utilizes a multi-layer carbon-core package substrate to absorb and dissipate the heat generated from the solar cell to suppress the increase in the temperature of the solar cell and prevent the decrease in power generation efficiency. It can be prevented.

Description

Heat sink package device to maximize the power generation efficiency of solar power generation system}

The present invention relates to a heat sink package device, and more particularly, to achieve high power generation efficiency (>35%) using a multi-junction compound semiconductor solar cell due to highly concentrated sunlight. It relates to a performance heat-sink package device that effectively dissipates heat generated from a semiconductor solar cell to optimally operate.

The heat dissipation method of a general multi-junction (multi-junction) solar cell package uses a copper clad ceramic substrate, which is referred to as a direct bonded copper (DBC) package substrate or a direct plated copper (DPC) package substrate. . Alumina (Al 2 O 3 ), aluminum nitride (AlN), beryllium oxide (BeO), and the like, which are raw materials of the package substrate, generally have good physical stability and thermal conductivity.

The DBC substrate is made by fusion bonding copper foil to a ceramic substrate, and the DPC substrate is made by plating a ceramic substrate with copper foil.

A copper circuit providing electrical connection to the solar cell is formed on the surface of the substrate through a photo-lithography process.

The solar cell is placed in a predetermined position, and an electrical connection between the solar cell and the substrate is completed with an Au wire.

The heat generated during the operation of the solar cell is transferred to the heat sink of the solar cell module or the solar cell through the heat conduction of the thermal interface material (TIM: Thermal Interface Material) used to fix the solar cell chip, the copper foil circuit, and the ceramic material itself. It transmits and emits to the frame of the receiver (Solar Receiver).

In this way, it is possible to prevent a decrease in light conversion efficiency of the solar cell through heat dissipation and to maintain power generation capacity within a stable range.

However, in the case of such a DBC package and DPC package, the substrate material is expensive and the thermal resistance is relatively high, and the thermal conductivity exceeds 24 W/mK.

Therefore, it is known that it is not sufficient for heat dissipation of a high-efficiency solar cell package of a concentrator photo-voltaic power generation system.

Figure 1 shows a typical example of the components of the DBC package and after assembly.

In addition, various packages with better heat dissipation characteristics exist, but due to high manufacturing costs, their commercial value is low and they are not widely used. Patent Documents 10-1465628, 10-2012-0111585, and 10-0720926 disclose other heat dissipation packages.

In addition, in the case of a concentrating type (CPV) solar power generation system using multi-junction solar cells, heat is generated from the solar cells due to the high concentration of light. Power generation efficiency is significantly lowered.

Therefore, in order to solve the heating problem, it is necessary to effectively design and build the heat dissipation package structure of individual CPV solar cells.

The technical problem to be achieved by the present invention is to solve the conventional problems, and to effectively absorb and dissipate heat generated from the solar cell by utilizing a multi-layer carbon-core package substrate, An object of the present invention is to provide a heat sink package device that suppresses an increase in temperature and prevents a decrease in power generation efficiency.

The heat sink package device according to the features of the present invention for solving these problems is,

A heat sink package device in which a solar cell is mounted inside and a heat sink is formed at the bottom,

a thin first copper foil layer 210;

a first electrical insulator layer 220 formed under the first copper foil layer 210 and made of a composite material in which laminate, glass fiber, and epoxy resin are combined;

a second copper foil layer 230 formed under the first electrical insulator layer 220;

A first prepreg layer 240 formed under the second copper foil layer 230 and made of a composite material of glass fiber and semi-cured epoxy to bond the upper and lower layers, and becomes an electrical insulator when cured;

a third copper foil layer 250 formed under the first prepreg layer 240;

an electrical conductor layer 260 formed under the third copper foil layer 250 and made of a composite material in which a carbon core, carbon fiber, and epoxy resin are combined;

a fourth copper foil layer 270 formed under the electrical conductor layer 260;

A second prepreg layer 280 formed under the fourth copper foil layer 270 and made of a composite material of glass fiber and semi-cured epoxy as a bonding material that bonds upper and lower layers, and becomes an electrical insulator when cured;

a fifth copper foil layer 290 formed under the second prepreg layer 280;

a second electrical insulator layer 300 formed under the fifth copper foil layer 290 and formed of a composite material in which laminate, glass fiber, and epoxy resin are combined;

A sixth copper foil layer 310 formed between the upper part of the heat sink and the lower part of the second electrical insulator layer 300,

The central portions of the first electrical insulator layer 220, the second copper foil layer 230, and the first prepreg layer 240 are removed,

Characterized in that the solar cell is mounted on the upper portion of the third copper foil layer 250 through the removed central portion,

It is characterized in that a plurality of thermal via holes are formed from the bottom of the solar cell module toward the heat sink.

A plurality of plated through-via holes are formed on one side of the first copper foil layer 210 to the sixth copper foil layer 310 to transfer heat to the heat sink.

The electrical conductor layer 260 is a carbon core CCL layer 101, and is composed of a carbon fabric core layer impregnated with resin and 18 μm Cu Foil on the upper and lower surfaces, and improves heat dissipation characteristics.

A plurality of blind via holes are formed between the first copper foil layer 210 and the second copper foil layer 230 to transmit electric energy generated by the solar cell.

In an embodiment of the present invention, a multilayer carbon-core package substrate is used to absorb and dissipate heat generated from a solar cell to suppress an increase in the temperature of a solar cell and prevent a decrease in power generation efficiency. It is possible to provide a heat sink package device that does.

1 is a view showing the components of a general DBC package and a state after assembly.
2 shows a stacked configuration diagram of a heat sink package device according to an embodiment of the present invention.
3 shows a cross-sectional configuration diagram in which a multi-component solar cell is mounted on a heat sink package device according to an embodiment of the present invention.
4 shows a heat dissipation passage of a carbon core package substrate of a heat sink package device according to an embodiment of the present invention.
5 and 6 are exemplary views and test samples of a heat sink package device according to an embodiment of the present invention in which a solar cell is mounted.
7 is a schematic diagram of a thermal via disposed directly below a solar cell chip in a heat sink package device according to an embodiment of the present invention.
8 is a schematic diagram showing a solar cell module (5 Receiver Module) to which a heat sink package device according to an embodiment of the present invention is applied.
9 is a view showing a concentrating solar power panel (CPV Array Panel) to which a heat sink package device according to an embodiment of the present invention is applied.
10 is an example of one CPV power generator in which a heat sink package device according to an embodiment of the present invention is installed.
11 presents a characteristic table of Carbon Core CCL products and a comparison table with other heat dissipation materials.
12 is a CPV solar cell heat dissipation package comparison table.
13 is a table showing changes in solar cell efficiency according to temperature rise. Temperature rise lowers solar cell efficiency (0.13~0.14%/℃)
14 illustrates manufacturing drawings for each process of the embodiment.
15 explains the thermal via formation applied to the above embodiment.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. And in order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

Throughout the specification, when a part includes a certain component, this means that it may further include other components without excluding other components unless otherwise stated.

2 shows a stacked configuration diagram of a heat sink package device according to an embodiment of the present invention.

3 shows a cross-sectional configuration diagram in which a multi-component solar cell is mounted on a heat sink package device according to an embodiment of the present invention.

4 shows a heat dissipation passage of a carbon core package substrate of a heat sink package device according to an embodiment of the present invention.

5 and 6 are exemplary views and test samples of a heat sink package device according to an embodiment of the present invention in which a solar cell is mounted.

7 is a schematic diagram of a thermal via disposed directly below a solar cell chip in a heat sink package device according to an embodiment of the present invention.

8 is a schematic diagram showing a solar cell module (5 Receiver Module) to which a heat sink package device according to an embodiment of the present invention is applied.

9 is a view showing a concentrating solar power panel (CPV Array Panel) to which a heat sink package device according to an embodiment of the present invention is applied.

10 is an example of one CPV power generator in which a heat sink package device according to an embodiment of the present invention is installed.

11 is a characteristic table of Carbon Core CCL products and a comparison table with other heat dissipation materials.

12 is a CPV solar cell heat dissipation package comparison table.

13 is a table showing changes in solar cell efficiency with temperature rise.

2 to 4, a heat sink package device according to an embodiment of the present invention,

A heat sink package device in which a solar cell is mounted inside and a heat sink is formed at the bottom,

a thin first copper foil layer 210;

a first electrical insulator layer 220 formed under the first copper foil layer 210 and made of a composite material in which laminate, glass fiber, and epoxy resin are combined;

a second copper foil layer 230 formed under the first electrical insulator layer 220;

A first prepreg layer 240 that is formed under the second copper foil layer 230 and is an electrical insulator when cured as a bonding material that bonds upper and lower layers with a composite material of glass fiber and semi-cured epoxy;

a third copper foil layer 250 formed under the first prepreg layer 240;

an electrical conductor layer 260 formed under the third copper foil layer 250 and made of a composite material in which a carbon core, carbon fiber, and epoxy resin are combined;

a fourth copper foil layer 270 formed under the electrical conductor layer 260;

A second prepreg layer 280 formed under the fourth copper foil layer 270 and made of a composite material of glass fiber and semi-cured epoxy as a bonding material that bonds upper and lower layers, and becomes an electrical insulator when cured;

a fifth copper foil layer 290 formed under the second prepreg layer 280;

a second electrical insulator layer 300 formed under the fifth copper foil layer 290 and formed of a composite material in which laminate, glass fiber, and epoxy resin are combined;

A sixth copper foil layer 310 formed between the upper part of the heat sink and the lower part of the second electrical insulator layer 300,

The central portions of the first electrical insulator layer 220, the second copper foil layer 230, and the first prepreg layer 240 are removed,

Characterized in that the solar cell is mounted on the upper portion of the third copper foil layer 250 through the removed central portion,

It is characterized in that a plurality of thermal via holes 103 are formed from the bottom of the solar cell module toward the heat sink.

A plurality of plated through-via holes 104 are formed on one side of the first copper foil layer 210 to the sixth copper foil layer 310 to transfer heat to the heat sink.

The electrical conductor layer 260 is a carbon core CCL layer 101, and is composed of a carbon fabric core layer impregnated with resin and 18 μm Cu Foil on the upper and lower surfaces, and improves heat dissipation characteristics.

A plurality of blind via holes 100 are formed between the first copper foil layer 210 and the second copper foil layer 230 to transmit electric energy generated by the solar cell.

The TIM 102 (Thermal Interface Material) uses a product with heat dissipation and electrical conductivity.

14 illustrates manufacturing drawings for each process of the embodiment.

15 explains the thermal via formation applied to the above embodiment.

In the present invention, the heat generated from the solar cell by the high concentration of sunlight is reduced by the high performance heat-sink package (PHP) technology developed using the multilayer carbon-core package substrate. It absorbs and dissipates heat to prevent the power generation efficiency from falling as the temperature of the solar cell increases.

A high-performance heat dissipation package device according to an embodiment of the present invention uses a high heat dissipation multi-layer carbon core substrate and thermal via technology to mount a solar cell on a carbon core substrate having a plurality of thermal vias. Thus, a solar cell package having excellent heat dissipation characteristics can be manufactured.

A high-performance heat dissipation package device according to an embodiment of the present invention uses thermal via technology to efficiently transfer heat generated from a solar cell in a vertical direction by arranging a plurality of thermal vias directly under a solar cell. use the extraction technique.

A high-performance heat dissipation package device according to an embodiment of the present invention combines a multi-layer carbon core substrate and a thermal via technology to promote vertical heat transfer through a thermal via and simultaneously transfer the transferred heat to the carbon-core layer. It also promotes horizontal heat transfer. Through this, the in-plane thermal conductivity through the carbon core layer reaches 250 W/mK, and the composite thermal conductivity of the completed high-performance heat sink package (PHP) reaches 60 W/mK.

In addition, blind via holes are placed as much as possible in other areas so that heat on the package surface can be well transmitted and released through the copper layer.

The electrical conductor layer 260, which is the carbon core layer, has a low coefficient of thermal expansion (CTE) of 5 to 7 ppm/℃, which ensures that stress due to thermal expansion of the entire multi-junction solar cell package is minimized, which helps the life of the solar chip. .

The carbon core substrate is a typical method in which a prepreg layer made by combining carbon fiber with a resin having a high glass transition temperature (Tg> 170 ° C) and a copper foil layer having a predetermined thickness (> 25 μm) are compressed at high temperature and pressure. Manufactured with Printed Circuit board manufacturing technology.

2 to 4, a high-performance heat dissipation package device according to an embodiment of the present invention, which is a multi-layer carbon fiber core substrate made by a printed circuit board manufacturing technology, is a circular or A rectangular multi-stage cavity (mounting groove) is formed in the inner center.

In addition, the high-performance heat dissipation package device according to an embodiment of the present invention has a copper foil circuit for electrical connection between the surface and the inside, and a plurality of thermal via holes, through via holes, and blind via holes plated with copper.

A wire bonding pad or pad ring serving to electrically connect the solar cell chip to the outside is formed in the inner center cavity of the high-performance heat dissipation package device according to an embodiment of the present invention. The pad or pad ring is surface treated with gold plating to ensure wire bonding.

Copper-plated holes are divided into through holes and blind via holes (non-through holes with one side blocked).

Blind holes are composed and distributed like a net in the area directly below the solar cell chip, and thermal vias are used as passages through which heat generated from the solar cell chips effectively escapes in the vertical direction, and blinds used for electrical connection in other areas. There are blind vias for heat dissipation formed as needed in areas other than vias and cavities.

The through hole provides a passage through which heat generated from the entire surface of the solar cell package escapes and at the same time provides a passage through which the solar cell is electrically connected, and is called a plated through hole (PTH).

A solar cell is placed on the bottom of the cavity with an electrically conductive thermal interface material (TIM), and an electric circuit is formed by wire bonding with an Au wire using a semiconductor mounting technology.

Referring to FIG. 5 or 6, when a heat sink or a flat plate heat sink having a heat radiation fin is attached under a solar cell package substrate on which a solar cell is mounted, using a heat radiating adhesive or a metal screw, the solar cell package on which the solar cell is mounted is completed. do.

Referring to FIG. 7, a schematic diagram of a thermal via disposed directly under a solar cell chip is shown.

Referring to FIG. 8, several (5 to 6) hybrid TIR Fresnel condensing lenses are arranged at predetermined positions, and an upper surface lens plate and a heat sink package corresponding to each condensing lens are arranged at predetermined positions. When the lower surface package arrangement plate arrayed and fixed is connected and fixed with a fixed frame having a predetermined standard, the concentrating solar cell module is completed.

If the concentrating solar cell module of the present invention is connected in an array with a predetermined number of modules as needed to make a power generation panel, and the power generation panel is mounted on a solar tracker and operated, high-efficiency power generation is possible quickly by installing it in a necessary place. will do

Again, if a plurality of modules are connected and arranged to make a panel of a predetermined shape, a CPV array panel is made. This is shown in Figure 9.

After electrically connecting the required number of photovoltaic panels, placing them on the upper surface of the solar tracker, assembling them, and electrically connecting them, one CPV power generator is completed. This is shown in Figure 10.

In particular, the new concentrating high-performance heat sink package (PHP) of the present invention has excellent heat dissipation effect and condensing light because numerous thermal vias existing directly below the solar cell directly emit heat generated from the solar cell in the vertical direction. Minimizes the degradation of the power generation efficiency of the solar cell module and increases the durability of the power generation system. That is, the new concentrating solar cell module manufactured using the high-performance heat sink package (PHP) of the present invention has the following advantages in terms of heat dissipation.

1) High (60W/mK) complex thermal conductivity of the completed high-performance heat sink package (PHP)

2) Good CTE matching of multi-junction solar cell chip and carbon core substrate

3) Electrical connection and heat dissipation using blind vias and through holes

4) Direct heat dissipation in the vertical direction from the bottom of the solar cell using thermal vias

The table of FIG. 11 shows a comparison between the general concentrating solar cell heat dissipation package and the heat dissipation package of the present invention.

The high-performance heat sink heat dissipation package (PHP) using the carbon core mounted substrate of the present invention is excellent in mass productivity and manufacturing cost because it uses a general printed circuit board (PCB) manufacturing line as well as heat dissipation.

For reference, a comparison of heat dissipation and related characteristics of industrial heat dissipation materials including carbon core materials is presented in the table of FIG. 12 .

Referring to FIG. 12, it can be seen that the PHP package device of the present invention using a carbon fiber core material is excellent in terms of characteristics, mass productivity and manufacturing cost.

13 is a table showing changes in solar cell efficiency with temperature rise.

Although the embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention defined in the following claims are also made according to the present invention. falls within the scope of the rights of

Claims (3)

A heat sink package device in which a solar cell is mounted inside and a heat sink is formed at the bottom,
a thin first copper foil layer 210;
a first electrical insulator layer 220 formed under the first copper foil layer 210 and made of a composite material in which laminate, glass fiber, and epoxy resin are combined;
a second copper foil layer 230 formed under the first electrical insulator layer 220;
A first prepreg layer 240 that is formed under the second copper foil layer 230 and is an electrical insulator when cured as a bonding material that bonds upper and lower layers with a composite material of glass fiber and semi-cured epoxy;
a third copper foil layer 250 formed under the first prepreg layer 240;
an electrical conductor layer 260 formed under the third copper foil layer 250 and made of a composite material in which a carbon core, carbon fiber, and epoxy resin are combined;
a fourth copper foil layer 270 formed under the electrical conductor layer 260;
A second prepreg layer 280 formed under the fourth copper foil layer 270 and made of a composite material of glass fiber and semi-cured epoxy as a bonding material that bonds upper and lower layers, and becomes an electrical insulator when cured;
a fifth copper foil layer 290 formed under the second prepreg layer 280;
a second electrical insulator layer 300 formed under the fifth copper foil layer 290 and formed of a composite material in which laminate, glass fiber, and epoxy resin are combined;
A sixth copper foil layer 310 formed between the upper part of the heat sink and the lower part of the second electrical insulator layer 300,
The central portions of the first copper foil layer 210, the first electrical insulator layer 220, the second copper foil layer 230, and the first prepreg layer 240 are removed,
Characterized in that the solar cell module is mounted on the upper portion of the third copper foil layer 250 through the removed central portion,
Characterized in that a plurality of thermal via holes are formed from the bottom of the solar cell module in the direction of the heat sink,
A plurality of plated through-via holes are formed on one side of the first copper foil layer 210 to the sixth copper foil layer 310 to transfer heat to the heat sink,
A plurality of blind via holes are formed between the first copper foil layer 210 and the second copper foil layer 230 to transmit electrical energy generated by the solar cell,
The electrical conductor layer 260 is a carbon core CCL layer 101, which is composed of a carbon fabric core layer impregnated with resin and 18㎛ Cu Foil on the upper and lower surfaces.
The electrical conductor layer 260 has a coefficient of thermal expansion (CTE) of 5 to 7 ppm / ° C,
The heat sink package device, characterized in that the first prepreg layer 240 and the second prepreg layer 280 are made by combining carbon fiber with a resin having a glass transition temperature of 170 ° C or higher. delete delete

Images