KR102503879B1 - Circuit carrier for a sensor unit, corresponding sensor unit and method for assembling such sensor unit - Google Patents

Abstract

The present invention is a circuit carrier (5) for a sensor unit (1) with a printed circuit board (10), said printed circuit board comprising an electronic circuit (16) and a sensor module (40), said sensor module ( 40 ) relates to the circuit carrier 5 , comprising a housing 42 and at least one sensor element 44 disposed within the housing 42 . The invention also relates to a sensor unit with the circuit carrier 5 and a method for assembling the sensor unit. In this case, the printed circuit board 10 comprises the sensor module 40 such that the printed circuit board 10 and the sensor element 44 have a common central vertical axis MA and a common central cross section ME. and a recess 12 suitable for receiving.

Description

Circuit carrier for sensor unit, sensor unit, and assembly method of the sensor unit

The invention relates to a circuit carrier for a sensor unit according to the preamble of claim 1 . A subject of the invention is also a sensor unit with the sensor carrier, and a method of assembling the sensor unit.

Circuit carriers for sensor units are known from the prior art, each having a printed circuit board carrying an electronic circuit and a sensor module. The sensor modules each include a housing and at least one sensor element disposed within the housing. The housing is usually implemented as a standard housing, for example as a DIL (Dual In-line) housing or SMD housing. The sensor element has a preferred measurement plane or preferred measurement direction for detecting at least one corresponding physical size. The sensor module is assembled "on" a printed circuit board. Since usually the alignment of the sensor module and the measurement plane or measurement direction is achieved through the positioning of the printed circuit board, the positioning of the sensor module on the printed circuit board results in additional tolerances, soldering tolerances, etc., these tolerances affect the quality of the sensor signal. can drop

DE 10 2012 204 911 A1 discloses a sensor unit with a protective sleeve, in which at least one measuring cell for detecting the hydraulic pressure of a fluid controlled by a solenoid valve in a vehicle brake system, and said measuring cell A circuit carrier with a printed circuit board lying substantially perpendicular to the cell is placed. The printed circuit board is preferably implemented mountable on both sides and comprises an electronic circuit with at least one electronic and/or electrical component, for example, which carries out amplification and/or processing of the raw signal of the measuring cell. The measuring cell converts the hydraulic pressure into at least one electrical output signal and comprises at least one connection point capable of tapping the at least one electrical output signal of the measuring cell. The circuit carrier includes an inner interface, which taps and applies at least one electrical output signal of the measuring cell to the electronic circuit. Also, the output signal of the electronic circuit can be tapped through an external interface. In this case, the internal interface is formed at the first end of the protective sleeve and the external interface is formed at the second end of the protective sleeve. The protective sleeve protects the inner life of the sensor unit from excessive mechanical load. The support unit for the printed circuit board in the sensor unit has an external interface through which at least one electrical output signal of the printed circuit board can be tapped. The support unit in this case comprises a base body with an outer contour, said base body being embodied as a cylinder and comprising a receiving opening for the printed circuit board. The receiving opening conforms to the outer contour of the printed circuit board and at least partially receives the printed circuit board. The support unit is movably inserted on the second end of the protective sleeve and pushed onto the printed circuit board through the receiving opening. Via the outer contour the support unit supports the printed circuit board against the inner contour of the protective sleeve.

The object of the present invention is that the preferred measuring direction and/or preferred measuring plane of the sensor element can be simply determined, so that the assembly position of the sensor element or sensor unit is adapted to at least one physical size to be detected and a high quality sensor signal is output. It is to provide a circuit carrier for a sensor unit that can be used, and a sensor unit having the circuit carrier.

A circuit carrier for a sensor unit comprising the features of independent claims 1 and 5 and a corresponding sensor unit provided with the circuit carrier, wherein the preferred measurement direction of the sensor element is known if the central axis of the sensor element and the extension of the central cross-section are known. and/or a preferred measurement plane can be simply determined, so that the assembly position of the sensor element or sensor unit is adapted to the at least one physical size to be detected and a high quality sensor signal can be output.

Furthermore, the common central axis and the common central transverse axis of the sensor element and the printed circuit board can be aligned simply by centered placement of the printed circuit board in the protective sleeve of the sensor unit with the central axis and the central cross-section of the entire device. Because of this, since the sensor element, the printed circuit board and the sensor unit have a common central axis and a common central cross-section, the measuring plane or preferred measuring direction of the sensor element is preferably simply detected and can be taken into account when assembling the sensor unit. . Self-centering of the printed circuit board in the upper region of the protective sleeve is possible by means of the support unit plugged onto the printed circuit board. In addition, the printed circuit board or sensor element can be directly aligned by alignment of the housing via the housing of the sensor module embedded into the recess.

By embedding the sensor module in a recess of the printed circuit board, the sensor module preferably comprising a DIL standard housing is assembled as a so-called "dead bug" and lies in the plane of the printed circuit board. Due to this, advantageously no additional measures are required for centering the sensor element in the protective sleeve, since the sensor module and thus the sensor element are simply centered by centering the printed circuit board in the protective sleeve. In addition, the centered arrangement of the printed circuit board in the protective sleeve allows the use of the maximum width of the printed circuit board and optimal utilization of the available installation space. In the case of conventional circuit carriers in which the sensor module is arranged on a printed circuit board, such simple centering of the sensor module and sensor element is not possible without additional measures. That is, in the case of a conventional sensor unit, the printed circuit board must be assembled asymmetrically, for example, in order to align the central axis and central cross-section of the sensor element with the central axis and central cross-section of the sensor unit. Because of this, a full-width printed circuit board cannot be used.

Embodiments of the present invention provide a circuit carrier for a sensor unit having a printed circuit board, the printed circuit board supporting an electronic circuit and a sensor module, the sensor module including a housing and at least one disposed within the housing. It contains a sensor element. In this case, the printed circuit board comprises a recess suitable for receiving the sensor module such that the printed circuit board and the sensor element have a common central vertical axis and a common central cross-section.

In addition, a sensor unit with a protective sleeve is provided, in which at least one sensor module, a circuit carrier with a printed circuit board, and a support unit are disposed, the printed circuit board comprising the electronic circuit and the sensor module. support The circuit carrier forms an inner interface, which taps and applies at least one electrical output signal of the sensor module to an electronic circuit. The support unit closes the protective sleeve at a first end in a joined state and forms an external interface with at least one external contact point. At least one electrical output signal of the electronic circuit can be tapped via the external contact point, and the at least one external contact point is electrically connected to the corresponding contact point of the electronic circuit via an electrical connection.

Furthermore, a method for assembling the sensor unit is provided, in which method a closing element is inserted into the second end of the protective sleeve to close the protective sleeve at the second end. The support unit and the circuit carrier are joined together with the sensor module as a pre-assembled assembly, and the pre-assembled assembly is inserted into the first end of the protective sleeve, so that the sensor module is received in the correct position by the first joint structure of the closing element; The support unit closes the protective sleeve at a first end and supports the printed circuit board against the inner contour of the protective sleeve in a precise position.

Sensor element here means an electrical component that directly or indirectly detects a physical size or a change in a physical size and preferably converts it into an electrical sensor signal. This can be done, for example, through transmission and/or reception of sound or electromagnetic waves and/or through changing a magnetic field or magnetic field.

For example, an optical sensor element including a photo plate and/or a phosphor screen and/or a semiconductor and detecting collision or intensity, wavelength, frequency, angle, etc. of a received wave, such as an infrared sensor element, is possible. In addition, an acoustic sensor element, such as an ultrasonic sensor element and/or a high-frequency sensor element and/or a radar sensor element and/or a sensor element that responds to a magnetic field, such as a Hall sensor element and/or a magnetoresistive sensor element and/or a change in a magnetic field For example, an inductive sensor element that records through a voltage generated by magnetic induction is possible.

The determined sensor signals are evaluated and converted to sensor data by electronic circuitry integrated within the sensor unit, which electronic circuitry includes with the unit a physical size determined from the physical size detected by each sensor unit. In this case, the path change is determined within a certain time window, for example by means of a sensor element, from which the speed and/or acceleration is calculated by means of an electronic circuit. Other calculable physical dimensions are mass, rotational speed, force, energy, and/or other possible dimensions, such as probability of occurrence for a particular event.

Advantageous improvement of the assembly method of the circuit carrier for the sensor unit according to independent claim 1 and the sensor unit according to independent claim 5 and the sensor unit according to claim 13 by means of the measures and improvements specified in the dependent claims. this is possible

It is particularly preferred that the electronic circuit can comprise at least one electrical and/or electronic element and/or at least one conductor track and/or at least one contact point. Due to this, any functions for processing and outputting the sensor signal, such as evaluation, processing, amplification, filtering, etc., are preferably performed. Further, the contact elements of the sensor module can be electrically contacted to corresponding first contact points of the electronic circuit, which first contact points can be arranged on the edge of the recess on the leg of the printed circuit board. The recess and the first contact points can be arranged or formed on the edge of the printed circuit board, for example. The contact elements and the first contact points form an internal interface capable of tapping and applying at least one electrical output signal of the sensor module to an electronic circuit.

In a preferred embodiment of the sensor unit, the closing element can close the protective sleeve at the second end in a mated state. The closing element and the support unit preferably close the protective sleeve on two ends in a fluid-tight manner, so that the sensor unit can also be used in a damp installation environment such as an engine room. Also, the base body of the closing element can preferably form a first joint structure, within which the housing of the sensor module can be positioned in a precise position. The first junction structure can be embodied as a U-shaped support and clamping device adapted to the housing of the sensor module, for example. Due to this, the first bonding structure can accommodate the housing of the sensor module without clearance and at least partially surrounds it in a bonded state.

In another preferred embodiment of the sensor unit, the base body of the closure element can form a second junction structure, which is adapted to the inner contour of the protective sleeve, such that the closure element is centered and positioned within the protective sleeve. are guided

In another preferred embodiment of the sensor unit, the base body of the support unit can comprise an accommodating opening, which conforms to the outer contour of the printed circuit board and at least partially accommodates the printed circuit board. Furthermore, the base body of the support unit forms a third joint structure, which can be fitted to the inner contour of the protective sleeve, so that the support unit and the printed circuit board can be centered and guided within the protective sleeve. Furthermore, the first and second bonding structures of the closing element and the third bonding structures of the support unit interact for precise positioning of the printed circuit board and sensor module within the protective sleeve. Due to this, assembly of the sensor unit can be facilitated in an advantageous manner and carried out more quickly.

In a preferred embodiment of the method for assembling the sensor unit, during bonding of the pre-assembly assembly, the printed circuit board of the circuit carrier can be inserted at least partially into the receiving opening of the base body of the support unit. Also, at least one external contact point may be electrically connected to a corresponding contact point of an electronic circuit on the printed circuit board. The electrical connection between the at least one external contact point of the support unit and the corresponding contact point on the printed circuit board is preferably formed by a soldering process.

Embodiments of the invention are shown in the drawings and described in detail below. In the drawings, components or elements performing the same or similar function are denoted by the same reference numerals.

1 is a schematic perspective view of an embodiment of a sensor unit according to the invention with a protective sleeve shown transparently;
2 is a schematic perspective view of components of the sensor unit according to the invention of FIG. 1 prior to assembly of the sensor unit;
3 is a schematic perspective view of an embodiment of a pre-assembled assembly for the sensor unit according to the present invention of FIGS. 1 and 2;
4 is a schematic perspective view of the pre-assembly of FIG. 3 viewed from below;

1 to 4, the illustrated embodiment of the sensor unit 1 according to the present invention comprises a protective sleeve 20, in which at least one sensor module 40, a printed circuit A circuit carrier 5 with a substrate 10 and a support unit 30 are placed. The printed circuit board 10 supports an electronic circuit 16 and a sensor module 40 . The circuit carrier 5 forms an internal interface 18 . 1 , which taps and applies at least one electrical output signal of the sensor module 40 to the electronic circuit 16 . The support unit 30 closes the protective sleeve 20 at a first end in the bonded state and forms an external interface 18.2 having at least one external contact point 34, via which external contact point the electronic circuit 16 At least one electrical output signal of may be tapped. In this case, at least one external contact point 34 is electrically connected via an electrical connection to a corresponding contact point 16.4 of the electronic circuit 16.

1 to 4 , the circuit carrier 5 for the sensor unit 1 comprises a printed circuit board 10 in the illustrated embodiment, which printed circuit board 10 comprises an electronic circuit 16 and the sensor module 40. The sensor module 40 includes a housing 42 and at least one sensor element 44 disposed within the housing 42 . In this case, the printed circuit board 10 is such that the printed circuit board 10 and the sensor element 44 have a common central vertical axis MA and a common central cross section ME. Seth 12 is included.

As shown in Figure 1, the closure element 50 closes the protective sleeve 20 at the second end in a bonded state. Preferably, the support unit 30 and the closing element 50 close the protective sleeve 20 at the ends in a fluid-tight manner. To this end, the support unit 30 comprises an edge 36 which at a first end projects beyond and covers the edge of the protective sleeve 20 . At the second end the protective sleeve 20 has a second inner diameter larger than the first inner diameter of the rest of the sleeve and has an enlargement embodied as a connecting step 24 . Due to this, a first sealing surface 26 is formed, and a second sealing surface 56 formed on the base body 52 of the closing element 50 contacts the first sealing surface 26 in a sealing manner.

As shown in Figures 1-4, the base body 32 of the support unit 30 has a cylindrical shape and in the illustrated embodiment comprises two shell halves 32.1, 32.2. The cell halves 32.1 and 32.2 each include at least one external contact point 34 of an external interface 18.2. In addition, the base body 32 of the support unit 30 comprises an accommodating opening, which conforms to the outer contour of the printed circuit board 10 and at least partially at one end of the printed circuit board 10. Accept. At least one electrical connection between at least one external contact point 34 of the external interface 18.2 and at least one corresponding second contact point 16.4 of the printed circuit board 10 is at least one electrical connection formed in the base body 32. A through connection is formed through which the through connection is electrically connected to at least one associated contact point 35 in the base body 32 . The contact point 35 is electrically and mechanically connected to the at least one second contact point 16.4 of the printed circuit board 40 via at least one solder connection. In the illustrated embodiment, the support unit 30 comprises four external contact points 34, two external contact points 34 being arranged on each shell half 32.1, 32.2. Furthermore, in the illustrated embodiment of the sensor unit 1 according to the present invention, a spring elastic contact element 38 is arranged on each shell half 32.1, 32.2 of the base body 32 of the support unit 30, On the outer contour 37 of the base body 32 in the joined together two mutually opposed spring elastic contact elements 38 are arranged. In addition, the base body 32 of the support unit 30 has a protruding edge 33, which in the joined state closes the protective sleeve 20 in a fluid-tight manner.

As shown in FIGS. 1 to 4 , a recess 12 is formed at an end of the printed circuit board 10 facing the closing element 50 and facing the support unit 30 . The electronic circuit 16 comprises at least one electrical and/or electronic element 16.1 and/or at least one conductor track 16.2 and/or at least one contact point 16.3, 16.4, which depending on the circuit electrically connected to each other with In the illustrated embodiment, the housing 42 of the sensor module 40 is embodied as a DIL standard housing and comprises eight contact elements 46 embodied as pins. The contact elements 46 of the sensor module 40 are curved and electrically contact the corresponding first contact points 16.3 of the electronic circuit 16, which contact points 16.3 of the printed circuit board 10. It is placed on the edge of the recess 12 on the leg 14 . Thus, the contact elements 46 of the sensor module 40 and the first contact point 16.3 of the printed circuit board form an internal interface 18.1, which internal interface at least one electrical output of the sensor module 40 The signal is tapped and applied to the electronic circuitry 16 .

As shown in FIG. 1 , the base body 52 of the closing element 50 forms a first junction structure 54 within which the housing 42 of the sensor module 40 is positioned at an exact location. The first junction structure 54 is implemented as a U-shaped support and clamping device in the illustrated embodiment, the support and clamping device being fitted to the housing 42 of the sensor module 40 and holding the housing in a joined state. At least partially enclose

As shown in FIGS. 1 and 2 , the base body 52 of the closing element 50 forms a second joint structure 58 , said second joint structure 58 forming the inner contour of the protective sleeve 20 . By fitting at (22), the closing element (50) is centered and guided within the protective sleeve (20). As shown in FIG. 1 , the joining structure 58 comprises two opposing wall segments adapted to the rounding of the protective sleeve 20, the outer contours 58.1 of the wall segments respectively forming the protective sleeve 20. It contacts the inner contour 22 of

As shown in FIG. 1 , the two spring elastic contact elements 38 of the support unit 30 act as a third joint structure 33, through which the third joint structure 33 of the support unit 30 The base body 32 is supported against the inner contour 22 of the protective sleeve 20 and an automatic centering of the support unit 30 and the printed circuit board 10 within the protective sleeve 20 is made possible. As shown in FIG. 1 , the support unit 30 is movably inserted at the first end of the protective sleeve 20 and centered via two spring elastic contact elements 38 to form the inner contour of the protective sleeve 20 ( 22), the inner contour 22 comprising an electrically conductive coating 22.1 or made of an electrically conductive material to form a ground path. Thus, via the spring resilient contact element 38, an electrically conductive connection is formed between the printed circuit board 40 and the protective sleeve 20, which serves as a grounding path.

To carry out the method of assembling the sensor unit 1 , a closing element 50 is inserted into the second end of the protective sleeve 20 and closes the protective sleeve 20 at the second end. Further, the support unit 30 and the circuit carrier 5 are bonded together with the sensor module 40 as a pre-assembled assembly 3 . Upon bonding of the pre-assembly assembly 3, the printed circuit board 10 of the circuit carrier 5 is at least partially inserted into the receiving opening of the base body 32 of the support unit 30, and at least one external contact point ( 34 is electrically connected to the corresponding second contact point 16.4 of the electronic circuit 16 on the printed circuit board 10. Then, the pre-assembly assembly 3 is inserted into the first end of the protective sleeve 20, so that the sensor module 40 is received in the correct position by the first joining structure 54 of the closing element 50, The support unit 30 closes the protective sleeve 20 on a first end and supports the printed circuit board 40 against the inner contour 22 of the protective sleeve 20 in a precise position.

Upon insertion of the pre-assembly assembly 3 into the protective sleeve 20, the first joint structure 54 and the second joint structure 58 of the closing element 50 and the third joint structure 33 of the support unit 30 ) interacts for positioning the exact position of the printed circuit board 10 and the sensor module 40 within the protective sleeve 20 .

1 sensor unit
5 circuit carrier
10 printed circuit board
12 recess
16 electronic circuits
16.1 Electronic Components
16.2 Conductor tracks
16.3, 16.4 contact point
18.1 Internal Interface
18.2 External interface
20 protective sleeve
30 support units
40 sensor module
42 housing
44 sensor element
46 contact elements
50 closed elements
52 bass body
54, 58 junction structure

Claims (14)

delete delete delete delete A sensor unit (1) with a protective sleeve (20), in which at least one sensor module (40), a circuit carrier (5) with a printed circuit board (10) and a support unit 30 is arranged, the printed circuit board 10 supporting the electronic circuit 16 and the sensor module 40, the circuit carrier 5 forming an internal interface 18.1, the internal interface (18.1) taps at least one electrical output signal of the sensor module 40 and applies it to the electronic circuit 16, and the support unit 30 attaches the protective sleeve 20 to the first end in a bonded state. and forms an external interface (18.2) with at least one external contact point (34) through which at least one electrical output signal of the electronic circuit (16) can be tapped; In the sensor unit (1), at least one external contact point (34) is electrically connected via an electrical connection to a corresponding contact point (16.4) of the electronic circuit (16),
the sensor module (40) for the sensor unit (1) comprises a housing (42) and at least one sensor element (44) disposed within the housing (42);
The printed circuit board 10 is configured to accommodate the sensor module 40 such that the printed circuit board 10 and the sensor element 44 have a common central vertical axis MA and a common central cross section ME. a suitable recess (12), wherein the sensor module is directly coupled to the printed circuit board and secured in the recess;
A closing element (50) closes the protective sleeve (20) at the second end in a mated state;
The base body 52 of the closing element 50 forms a first junction structure 54, within which the housing 42 of the sensor module 40 is positioned in the correct position. characterized sensor unit. delete delete 6. Sensor unit according to claim 5, characterized in that the first junction structure (54) is implemented as a U-shaped support and clamping device fitted to the housing (42) of the sensor module (40). 6. The method according to claim 5, wherein the base body (52) of the closing element (50) forms a second joint structure (58), the second joint structure (58) forming the inner contour of the protective sleeve (20) ( 22) so that the closing element (50) is centered and guided within the protective sleeve (20). 6. The method according to claim 5, wherein the base body (32) of the support unit (30) comprises an accommodating opening, which conforms to the outer contour of the printed circuit board (10) and supports the printed circuit board (10). A sensor unit, characterized in that it at least partially houses it. 11. The method of claim 10, wherein the base body (32) of the support unit (30) forms a third junction structure (33), the third junction structure (33) is the inner contour of the protective sleeve (20) ( 22), so that the support unit (30) and the printed circuit board (10) are centered and guided within the protective sleeve (20). 12. The protective sleeve (20) according to claim 11, wherein the first joint structure (54) and the second joint structure (58) of the closing element (50) and the third joint structure (33) of the support unit (30) are connected to the protective sleeve (20). Characterized in that the sensor unit interacts for the positioning of the exact position of the printed circuit board (10) and the sensor module (40) within. A method of assembling a sensor unit (1) formed according to claim 5, comprising:
A closing element 50 is inserted into the second end of the protective sleeve 20 and closes the protective sleeve 20 at the second end, the support unit 30 and the circuit carrier 5 being connected to the sensor module (40) as a pre-assembly assembly (3), which is inserted into the first end of the protective sleeve (20), so that the sensor module (40) is in the correct position and the closing element (50) is received by a first joint structure 54 of the support unit 30 closes the protective sleeve 20 at the first end, and holds the printed circuit board 10 in the correct position with the protective sleeve A method of assembling a sensor unit, characterized in that it is supported against the inner contour (22) of (20). 14. A method according to claim 13, characterized in that, upon bonding of the pre-assembly assembly (3), the printed circuit board (10) of the circuit carrier (52) is at least partially into the receiving opening of the base body (32) of the support unit (30). characterized in that the at least one external contact point (34) is electrically connected to the corresponding contact point (16.4) of the electronic circuit (16) on the printed circuit board (10).

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