KR102502877B1 - Deposition Apparatus - Google Patents

Abstract

A deposition apparatus is disclosed. A deposition apparatus according to an embodiment of the present invention includes a chamber in which a deposition process is performed; a deposition material spraying unit disposed above a deposition target disposed inside the chamber and injecting a deposition material toward the deposition target; and a deposition material flow control and guide unit disposed inside the chamber and guiding a flow direction in which the deposition material sprayed by the deposition material spray unit is exhausted to the outside of the chamber so that the deposition material can be uniformly deposited on the deposition target. .

Description

Deposition apparatus {Deposition Apparatus}

The present invention relates to a deposition apparatus, and more particularly, to depositing materials according to the flow direction while efficiently guiding the flow direction of the deposition material by a simple structure so as to more efficiently deposit the deposition material on a deposition target. It relates to a deposition apparatus capable of uniformly flowing a deposition material in a deposition space by effectively controlling the flow rate of

A secondary cell used in an electric vehicle (EV) or an energy storage system (ESS), which has recently been spotlighted, generally converts chemical energy into electrical energy to supply power to an external circuit. It also refers to a battery that can store electricity by converting electrical energy into chemical energy by receiving external power when it is discharged, and such a secondary battery is also commonly referred to as a capacitor.

Among these secondary batteries, the electrode process for manufacturing electrodes for lithium ion secondary batteries is a process of attaching cathode and anode materials to aluminum and copper foil plates, respectively, and is subdivided into mixing, coating & drying, rolling, slitting, and vacuum drying processes. can do.

Here, as a method of producing an anode material for enhancing the performance of a lithium ion secondary battery, a method of coating carbon (C) on an anode active material may be used.

There are several methods for coating carbon (C) in this way, and one of them is a source gas containing carbon (C) and hydrogen (H), for example, methane (CH4), ethylene Source gas such as (C2H4) or acetylene (C2H2) is injected into the chamber where the deposition target is placed, and high-temperature heat is applied to reach the temperature at which molecules are decomposed. As such, it can be selectively coated on a desired deposition target. Thereafter, hydrogen (H) gas is discharged out of the chamber.

This method is made by heating a specific material used as a source gas from the temperature at which it is pyrolyzed to the temperature at which the material is broken in molecular units. At this time, as a way to reduce the temperature, by lowering the atmospheric pressure to create a vacuum state, the reaction temperature at which pyrolysis is It is advantageous because it is low.

At this time, in the coating of the pyrolyzed material, i.e., deposition, proper temperature and pressure control is important, but controlling the flow direction of the source gas in the chamber and controlling the flow rate of the deposition material along the flow direction is Since it helps to react uniformly throughout the reaction area, it can be an important goal to optimize the deposition process to increase the reaction efficiency and deposit more efficiently.

1 schematically shows a flow direction (a) of a deposition material flowing inside a chamber along a horizontal direction and a flow direction (b) of a deposition material flowing inside a chamber along a vertical direction in a conventional deposition apparatus. it is a drawing

By the way, in the conventional deposition apparatus, as shown in (a) of FIG. 1, in the case of using a horizontal movement method in which the source gas is supplied from one side of the chamber to the opposite side, the surface of the material is mainly There is a problem in that the deposition efficiency decreases due to reaction.

In addition, as shown in (b) of FIG. 1, the source gas must be dispersed and supplied over a wide area for mass deposition. In the case of using a general nozzle, the source gas supplied into the chamber is widely dispersed. There is a problem that cannot be supplied.

And, even if the source gas is supplied to a large area, since the exhaust area for exhausting the source gas is narrow, there is a problem in that the flow of the deposition material inside the chamber is not uniform while the supplied source gas moves to the exhaust port.

Furthermore, although the size of a chamber cannot be easily changed in general, since the desired area for deposition can vary depending on the type and size of the deposition target, a temperature difference occurs for each position inside the chamber, so that the deposition target on which deposition is performed There is a problem in that the temperature is low at a location far away from the evaporation material and a phenomenon in which the deposition material is cooled and piled up occurs.

Republic of Korea Patent Registration No. 10-1016021, (2011.02.23.)

Therefore, the technical problem to be achieved by the present invention is to effectively control the flow rate of the deposition material according to the flow direction while efficiently guiding the flow direction of the deposition material by a simple structure so that the deposition material can be more efficiently deposited on the deposition target. By doing so, it is to provide a deposition apparatus capable of uniformly flowing the deposition material within the deposition space.

According to one aspect of the present invention, the chamber in which the deposition process is in progress; a deposition material spraying unit disposed above a deposition target disposed inside the chamber and injecting a deposition material toward the deposition target; and a deposition material flow control disposed inside the chamber and guiding a flow direction in which the deposition material sprayed by the deposition material injection unit is discharged to the outside of the chamber so that the deposition material can be uniformly deposited on the deposition target. And it can be provided with a deposition apparatus comprising a guide unit.

The deposition material flow control and guide unit is disposed inside the chamber, and controls the deposition material spray unit and the deposition target to guide a flow direction in which the deposition material sprayed from the deposition material spray unit is exhausted to the outside. at least one separation membrane module that is disposed while enclosing and separates a space inside the chamber into a dispersion space, a deposition space, and a discharge space; and a flow control baffle coupled to the separation membrane module to guide a flow direction so that the deposition material flows from the deposition space to the discharge space, and to control a flow amount of the deposition material flowing from the deposition space to the discharge space. can do.

The separation membrane module is disposed along the sides of the deposition material spray unit and the deposition target to form a boundary between the dispersion space and the deposition space, and guides the flow of the deposition material into the dispersion space and the deposition space. Separation membrane module; and a lower separator module disposed below the deposition target and forming a lower boundary of the deposition space.

The upper separator module may include a first upper separator module contacting at least one side of the deposition material spray unit to form the dispersion space; and a second upper separator module connected to a lower portion of the first upper separator module to form the deposition space, separating the dispersion space and the deposition space together with the lower end of the deposition material spray unit, An upper separator module may protrude more from the inner wall of the chamber than the second upper separator module.

The flow control baffles are spaced apart from each other by a predetermined distance and have a plurality of flow guide holes formed therethrough, and are disposed between the upper separator module and the lower separator module in a direction from an upper direction to a lower direction within the deposition space. A flow direction of the deposition material may be guided when the deposition material flowing in the horizontal direction toward the discharge space located on the side of the deposition space.

The plurality of flow guide holes may have different diameters in order to control the flow amount of the deposition material for each flow guide hole.

In the plurality of flow guide holes, a diameter of a flow guide hole in a central area may be smaller than a diameter of flow guide holes in both end areas.

The flow control baffle may further include a flow rate control insertion pipe having a predetermined inner diameter so as to be selectively coupled to the plurality of flow guide holes and to individually control the flow rate of the deposition material at the coupled position.

The deposition material spraying unit may include a dispersing nozzle disposed above the chamber to spray the deposition material toward the bottom and radially dispersing the deposition material; and a spray control module disposed below the dispersing nozzle and spraying the deposition material sprayed from the dispersing nozzle into the deposition space, and controlling a spray amount of the deposition material sprayed toward the deposition target.

The spray control modules may be spaced apart from each other and formed through a plurality of spray guide holes in a vertical direction toward the deposition target to guide the spray direction of the deposition material.

The injection control module may further include at least one injection amount control insertion tube selectively coupled to the plurality of injection guide holes and having a predetermined inner diameter to individually control the injection amount of the deposition material at the coupled position. there is.

The dispersing nozzle may include a nozzle pipe through which the deposition material flows; and a dispersion head connected to the nozzle tube and provided with a plurality of dispersion nozzle holes spaced apart from each other along a circumferential direction and formed through the dispersion nozzle holes.

Embodiments of the present invention, while efficiently guiding the flow direction of the deposition material by a simple structure, by effectively controlling the flow amount of the deposition material according to the flow direction, the deposition material can flow uniformly in the deposition space, so the deposition material can be more efficiently deposited on the deposition target.

1 schematically shows a flow direction (a) of a deposition material flowing inside a chamber along a horizontal direction and a flow direction (b) of a deposition material flowing inside a chamber along a vertical direction in a conventional deposition apparatus. it is a drawing
2 is a schematic cross-sectional view of a deposition apparatus according to an embodiment of the present invention.
FIG. 3 is a perspective view schematically showing the flow control baffle 510 of FIG. 2 , and is a view for explaining flow direction guide and flow amount control by the flow control baffle 510 .
FIG. 4 is a front cross-sectional view (a) and a view (b) viewed from the bottom schematically showing the dispersing nozzle 310 of FIG. 2 .

In order to fully understand the present invention and the advantages in operation of the present invention and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings illustrating preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by describing preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in each figure indicate like members.

2 is a cross-sectional view schematically showing a deposition apparatus according to an embodiment of the present invention, and FIG. 3 is a perspective view schematically showing a portion of the flow control baffle 510 of FIG. It is a view for explaining the guide of the flow direction and the control of the flow amount, and FIG. 4 is a front cross-sectional view (a) schematically showing the dispersing nozzle 310 of FIG. 2 and a view (b) viewed from the bottom.

As shown in these figures, a deposition apparatus according to an embodiment of the present invention includes a chamber 100, a deposition material injection unit 300, and a deposition material flow control and guide unit 500.

First, the chamber 100 is a space in which a deposition process is performed, and a heater (not shown) is provided to provide a place where the deposition target S is placed and to apply high-temperature heat to the source gas injected into the chamber 100. It is provided, and a vacuum pump (not shown) is connected to lower the atmospheric pressure in the chamber to create a vacuum state in order to lower the temperature at which molecules are thermally decomposed.

In general, the size of a chamber cannot be easily changed, but since the desired area for deposition can vary depending on the type and size of the deposition target, a difference in temperature occurs for each position inside the chamber, so that the deposition target is far from the deposition target. As described above, there is a problem that the deposition material is cooled and accumulated at the remote location because the temperature is low.

Therefore, according to an embodiment of the present invention, the space inside the chamber 100 is separated into a dispersion space (Z1), a deposition space (Z2), and a discharge space (Z3) by a separation membrane module 510 to be described later, thereby depositing Since it is possible to prevent the deposition material from flowing to a location far from the deposition target, a phenomenon in which the deposition material is cooled and accumulated at a specific location can be prevented.

On the other hand, the deposition material spray unit 300 is disposed above the deposition target S disposed inside the chamber 100 and serves to spray the deposition material toward the deposition target S, and the dispersion nozzle 310 And, a spray control module 330 is included.

According to the present invention, by providing a deposition material injection unit 300 to directly react while supplying the source gas from top to bottom (downstream flow) to increase the reaction efficiency, as shown in FIG. 1 (a) Likewise, in the case of using a horizontal movement method of moving the source gas from one side of the chamber to the opposite side in supplying the source gas, it is possible to solve the problem of low deposition efficiency by mainly reacting on the surface of the material.

First, the dispersion nozzle 310 is disposed on the upper part of the chamber 100 and sprays the deposition material toward the lower part, serves to radially disperse the deposition material, and separates the nozzle tube 311 and the dispersion head 313. include

The nozzle pipe 311 is a pipe through which deposition materials flow in a straight line and are supplied from the outside of the chamber 100 toward the inside of the chamber 100 .

The dispersion head 313 is connected to the nozzle pipe 311, and a plurality of dispersion nozzle holes 315 formed through and spaced apart from each other along the circumferential direction are provided so that the deposition material flowing straight along the nozzle pipe 311 is dispersed. It serves to disperse toward the space (Z1).

By providing the dispersion nozzle 310 having such a structure, as shown in (b) of FIG. 1, when a general nozzle is used, the problem that the source gas supplied into the chamber cannot be widely dispersed and supplied is solved. As a result, the source gas can be distributed and supplied over a wide area for mass deposition.

The spray control module 330 is disposed under the dispersing nozzle 310 and sprays the depositing material sprayed from the dispersing nozzle 310 to the depositing space Z2, but the spray amount of the depositing material sprayed toward the deposition target S plays a role in regulating

In the spray control module 330, a plurality of spray guide holes 331 are formed that are spaced apart from each other and penetrate in a vertical direction toward the deposition target S to guide the spray direction of the deposition material.

At this time, the plurality of spray guide holes 331 of the spray control module 330 according to an embodiment of the present invention may be provided with different diameters in order to control the flow amount of the deposition material for each spray guide hole, For example, the diameter of the spray guide hole in the central area may be smaller than the diameter of the spray guide hole in the peripheral area.

To explain this in detail, as shown in FIG. 2 , when the dispersion nozzle 310 is provided above the central region of the spray control module 330, the dispersion nozzle 310 primarily distributes the deposition material to the surrounding region. Although it serves to disperse, even so, the deposition material is not completely dispersed inside the dispersion space (Z1), so it passes through the plurality of spray guide holes 331 of the spray control module 330 and deposits space (Z2). ), the amount of flow of the deposition material passing between the central area and the surrounding area may be different.

Therefore, the plurality of spray guide holes 331 formed in the central area and the surrounding area of the spray control module 330 may have different diameters, and due to this difference, the number of spray guide holes 331 passing through each spray guide hole 331 may be different. Since the flow rate of the deposition material can be adjusted for each region, the deposition material sprayed into the deposition space Z2 through the spray control module 330 can be uniformly sprayed.

Unlike this, the spray control module 330 according to another embodiment of the present invention is selectively coupled to the plurality of spray guide holes 331 and has a predetermined inner diameter to individually control the spray amount of the deposition material at the combined position. It may further include at least one injection amount control insertion tube 335 having a.

That is, by manufacturing all the spray guide holes 331 formed in the central area and the surrounding area of the spray control module 330 to have the same diameter and inserting a separate spray amount control insertion tube 335, the spray amount at a desired location. It has the advantage of being individually adjustable.

And in this case, there is an advantage in that the amount of injection can be customized according to various deposition environments.

As a result, by providing the deposition material spraying unit 300 including the dispersing nozzle 310 and the spraying control module 330, the deposition apparatus according to the present invention primarily disperses the chamber 100 by the dispersing nozzle 310. By dispersing the deposition material toward the space (Z1), and secondarily controlling the flow rate of the deposition material for each position through the injection control module 330, the deposition material in a primarily dispersed state is deposited in the deposition space (Z2). It is possible to spray evenly on all parts of the

Meanwhile, the deposition material flow control and guide unit 500 is disposed inside the chamber 100, and the deposition material sprayed by the deposition material injection unit 300 so that the deposition material can be uniformly deposited on the deposition target S. It serves to guide the flow direction exhausted to the outside of the chamber 100.

As shown in detail in FIG. 2 , the deposition material flow control and guide unit 500 includes a separation membrane module 510 and a flow control baffle 530 .

First, the separation membrane module 510 is disposed inside the chamber 100, and the deposition material spray unit 300 and the deposition material spray unit 300 guide a flow direction in which the deposition material sprayed from the deposition material spray unit 300 is exhausted to the outside. It is disposed while surrounding the target (S) and serves to separate the space inside the chamber 100 into a dispersion space (Z1), a deposition space (Z2) and a discharge space (Z3), and at least one separation membrane module 510 It is placed and provided in the required location.

As described above, although the size of the chamber cannot be easily changed in general, since the desired area for deposition can vary depending on the type and size of the deposition target, a difference in temperature occurs for each location inside the chamber, resulting in deposition There is a problem in that a phenomenon in which the deposition material is cooled and accumulated at a location far from the deposition target is low in temperature.

Therefore, according to an embodiment of the present invention, the space inside the chamber 100 is separated into a dispersion space (Z1), a deposition space (Z2), and a discharge space (Z3) by a separation membrane module 510 to be described later, thereby depositing Since it is possible to prevent the deposition material from flowing to a location far from the deposition target, a phenomenon in which the deposition material is cooled and accumulated at a specific location can be prevented.

The separation membrane module 510 includes an upper separation membrane module 511 and a lower separation membrane module 513 .

The upper separator module 511 is disposed along the side of the deposition material spray unit 300 and the deposition target S to form a boundary between the dispersion space Z1 and the deposition space Z2, thereby distributing the flow of the deposition material. (Z1) and serves to lead to the deposition space (Z2).

That is, as shown in detail in FIG. 2 , the upper separator module 511 includes a first upper separator module 511a contacting at least one side of the deposition material spray unit 300 to form a dispersion space Z1, and a second upper separator module 511a. 1 including the second upper separator module 511b connected to the lower part of the upper separator module 511a to form the deposition space Z2, together with the lower part of the deposition material spray unit 300, the dispersion space Z1 and deposition The space (Z2) is separated.

At this time, the first upper separator module 511a is provided to protrude more from the inner wall of the chamber 100 than the second upper separator module 511b, thereby providing a space on the side of the deposition target S so that the deposition material is deposited. Guide to flow to the side of (S).

The lower separator module 513 is disposed below the deposition target S and serves to form a lower boundary of the deposition space Z2.

That is, by blocking the space between the deposition target S and the lower surface of the chamber 100, the deposition material is prevented from unnecessarily flowing in the empty space in the chamber, and the deposition material is discharged from the deposition space Z2 to the discharge space ( It serves to guide the flow direction so that it can move directly to Z3).

The membrane module 510 having such a structure has the advantage of being made of a plate-shaped plate and can be simply assembled by simply placing it in a desired position.

That is, since the purpose is to prevent the deposition material from flowing to the portion indicated by hatching in FIG. 2, the separator module 510 made of a plate-shaped plate is placed along the boundary of the portion indicated by hatching, thereby simplifying manufacturing. However, it is possible to prevent the deposition material from flowing more efficiently, and eventually guide the flow direction of the deposition material.

Here, although metals such as stainless steel, carbon steel, titanium, and tantalum are recommended, the separator module 510 may be manufactured using any material that is lower than the temperature applied to the deposition process and has no reactivity.

Next, the flow control baffle 530 is coupled to the separation membrane module 510 to guide the flow direction so that the deposition material flows from the deposition space Z2 to the discharge space Z3, but from the deposition space Z2 to the discharge space ( It serves to control the flow rate of the deposition material flowing into Z3).

According to the present invention, by providing the flow control baffle 530, since the exhaust area for exhausting the source gas is narrow even if the source gas is supplied to a large area, the deposited material inside the chamber while the supplied source gas moves to the exhaust port. It is possible to solve the problem that the flow of is not uniform.

As shown in detail in FIG. 3, the flow control baffle 530 is spaced apart from each other by a predetermined distance and has a plurality of flow guide holes 531 formed therethrough, and the upper separation membrane module 510 and the lower separation membrane are formed. When the deposition material disposed between the modules 510 and flowing from the top to the bottom inside the deposition space Z2 flows in a horizontal direction toward the discharge space Z3 located on the side of the deposition space Z2. It serves to guide the flow direction of the material.

In detail, as shown in FIG. 3, the inside of the flow control baffle 530 is the deposition space Z2 and the outside of the flow control baffle 530 is the discharge space Z3, along the direction of the arrow. The deposition material flowing from the top to the bottom inside the deposition space Z2 passes through the flow guide hole 531 and is guided to flow toward the discharge space Z3 located on the side of the deposition space Z2. .

In addition, the plurality of flow guide holes 531 may be provided with different diameters in order to control the flow amount of the deposition material for each flow guide hole. It may be provided smaller than the diameter of the hole.

To explain this in detail, as shown in FIG. 2 , a discharge pipe 700 is connected to the discharge space Z3, and a pump (not shown) that helps exhaust gas is connected.

However, in general, since the discharge pipe 700 is not connected to the entire area of the discharge space Z3 but only to a specific location, when strong discharge occurs in the area to which the discharge pipe 700 is connected, the amount of gas in the area Since the flow increases and the flow rate increases, the flow of the deposition material in the deposition space Z2 is affected and there is a problem in that it does not flow uniformly.

Therefore, by setting the diameter of the flow guide hole located close to the area connected to the discharge pipe 700 to be smaller than the flow guide hole located far from the area connected to the discharge pipe 700, the amount of flow is adjusted to be small, thereby depositing materials passing through each flow guide hole. Since the flow rate of can be adjusted for each region, eventually the flow of the deposition material inside the deposition space Z2 can be adjusted to be uniform.

In contrast, the flow control baffle 530 according to another embodiment of the present invention is selectively coupled to the plurality of flow guide holes 531 and has a predetermined inner diameter so that the flow rate of the deposition material is individually controlled at the coupled position. The branch may further include a flow control insertion tube (535).

That is, by manufacturing all the flow guide holes 531 formed in the flow control baffle 530 to have the same diameter and inserting a separate flow control insertion pipe 535, the injection amount at a desired location can be individually controlled. there is

And in this case, there is an advantage in that the amount of injection can be customized according to various deposition environments.

As described above, according to the present embodiment, the deposition material can be uniformly deposited on the deposition target by effectively controlling the flow rate of the deposition material while efficiently guiding the deposition material to flow uniformly along the deposition space by a simple structure. there will be

As such, the present invention is not limited to the described embodiments, and it is obvious to those skilled in the art that various modifications and variations can be made without departing from the spirit and scope of the present invention. Therefore, it should be said that such modifications or variations fall within the scope of the claims of the present invention.

S: Evaporation target Z1: Dispersion space
Z2: deposition space Z3: discharge space
100: chamber 300: deposition material spraying unit
310: dispersion nozzle 330: spray control module
331: injection guide hole 335: injection amount control insertion tube
500: deposition material flow control and guide unit 510: separation membrane module
511a, 511b: upper membrane module 513: lower membrane module
530: flow control baffle 531: flow guide hole
535: flow control insertion pipe

Claims (12)

A chamber in which a deposition process is performed;
a deposition material spraying unit disposed above a deposition target disposed inside the chamber and injecting a deposition material toward the deposition target; and
It is disposed inside the chamber and adjusts the flow of the deposition material for guiding a flow direction in which the deposition material sprayed by the deposition material spray unit is exhausted to the outside of the chamber so that the deposition material can be uniformly deposited on the deposition target. including a guide unit;
The inner space of the chamber is separated into a dispersion space, a deposition space, and a discharge space by at least a portion of the deposition material spraying unit and at least a portion of the deposition material flow control and guide unit,
The deposition material flow control and guide unit,
It is disposed inside the chamber, and is disposed while surrounding the deposition material spray unit and the deposition target so as to guide a flow direction in which the deposition material sprayed from the deposition material spray unit is exhausted to the outside, thereby creating a space inside the chamber. At least one separation membrane module separating a dispersion space, a deposition space, and a discharge space; and
It is coupled to the separator module and guides a flow direction so that the deposition material flows from the deposition space to the discharge space, and includes a flow control baffle for adjusting the flow amount of the deposition material flowing from the deposition space to the discharge space. ,
The deposition material injection unit,
a dispersing nozzle disposed above the chamber to spray the deposition material toward a lower portion and radially dispersing the deposition material toward the dispersing space; and
A spray control module disposed below the dispersing nozzle to spray the deposition material sprayed from the dispersing nozzle from the dispersing space toward the deposition space, and controlling the spray amount of the deposition material sprayed toward the deposition target. and
The separation membrane module,
an upper separator module disposed along side surfaces of the deposition material injection unit and the deposition target to form a boundary between the dispersion space and the deposition space to guide the flow of the deposition material into the dispersion space and the deposition space; and
A lower separator module disposed below the deposition target to form a lower boundary of the deposition space;
The upper separator module,
a first upper separation membrane module contacting one side of the injection control module to form the dispersion space above the injection control module; and
Including a second upper separator module connected to the lower portion of the first upper separator module to form the deposition space under the spray control module,
Separating the dispersion space and the deposition space together with the spray control module,
The flow control baffle,
It is disposed between the second upper separator module and the lower separator module to separate the deposition space and the discharge space,
The deposition apparatus, characterized in that the first upper separator module protrudes more from the inner wall of the chamber than the second upper separator module. delete delete delete According to claim 1,
The flow control baffle,
A plurality of flow guide holes are formed that are spaced apart from each other by a predetermined distance, and are disposed between the upper separator module and the lower separator module to flow from an upper direction to a lower direction in the deposition space. and guiding a flow direction of the deposition material when the deposition material flows in a horizontal direction toward the discharge space located at a side of the deposition space. According to claim 5,
The plurality of flow guide holes are provided with different diameters in order to control the flow amount of the deposition material for each flow guide hole. According to claim 6,
In the plurality of flow guide holes, the diameter of the flow guide holes in the central area is smaller than the diameters of the flow guide holes in both end areas. According to claim 5,
The flow control baffle,
The deposition apparatus further comprises a flow rate control insertion pipe having a predetermined inner diameter so as to be selectively coupled to the plurality of flow guide holes and to individually control the flow rate of the deposition material at the coupled position. delete According to claim 1,
The injection control module,
A deposition apparatus according to claim 1 , wherein a plurality of jetting guide holes are formed spaced apart from each other and penetrating in a vertical direction toward the deposition target to guide a jetting direction of the deposition material. According to claim 10,
The injection control module,
The deposition apparatus of claim 1, further comprising at least one injection amount control insertion tube selectively coupled to the plurality of injection guide holes and having a predetermined inner diameter to individually control the injection amount of the deposition material at the coupled position. According to claim 1,
The dispersing nozzle,
a nozzle tube through which the deposition material flows; and
and a dispersion head connected to the nozzle tube and provided with a plurality of dispersion nozzle holes spaced apart from each other along a circumferential direction.

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