KR102501091B1 - Liquid crystalline resin composition for surface mount relay and surface mount relay using the same - Google Patents

Abstract

A liquid crystalline resin composition for a surface mount relay with excellent fluidity, which provides a molded article with excellent heat resistance and airtightness and suppressed deformation and desorption of filler, and a component for a surface mount relay and a surface mount relay using the same. The liquid crystal resin composition for a surface mount relay according to the present invention includes (A) liquid crystal resin, (B) fibrous wollastonite, and (C) mica, and the (A) liquid crystal resin is an essential component. It is a wholly aromatic polyesteramide that exhibits optical anisotropy when melted and is composed of a predetermined amount of the following structural units (I) to (VI), wherein the aspect ratio of the fibrous wollastonite (B) is 8 or more, and the surface mount relay is a surface-mounted relay having a base and a terminal protruding from the base, and soldering the terminal to a printed board.

Description

Liquid crystalline resin composition for surface mount relay and surface mount relay using the same

The present invention relates to a liquid crystal resin composition for a surface mount relay and a surface mount relay using the same.

With the development of the electronics industry, the production of relays is steadily increasing, and the fields where they are used, such as communication devices, OA devices, home appliances, and vending machines, are also spread across a wide range. BACKGROUND ART Conventionally, as a relay mounted on a printed circuit board and used, an insertion mounting type (through-hole type) relay is known. Insertion mounting relays have terminals protruding vertically from the relay body, and are mounted on one surface of a printed board by first inserting the terminals into holes in the printed board. Thereafter, by soldering the terminals on the other surface of the printed board, the insertion-mounted relay is fixed to the printed board in an electrically conductive manner.

Recently, as a new relay mounted on a printed circuit board and used, a surface mount type (surface mounting type) relay has been developed (for example, Patent Document 1). In a surface-mounted relay, the terminal protruding vertically from the relay body is bent at right angles so that the soldering surface is parallel to the relay body. For this reason, in a surface-mounted relay, without forming a hole in the printed board, the terminal is placed on a solder pad formed on a conductor pattern on the surface of the printed board, and a solder reflow process is performed to enable electrical conduction to the printed board. It is fixed.

Japanese Patent No. 3463310

As described above, since the surface mount relay is fixed to the printed circuit board by solder reflow treatment, the molded body constituting the surface mount relay, for example, a base, a case, a bobbin, etc., can withstand the solder reflow treatment. Excellent heat resistance is required. In addition, surface mount relays are also required to be able to maintain airtightness and shape even after solder reflow treatment.

By the way, liquid crystalline resin compositions are attracting attention because of their excellent heat resistance, dimensional accuracy, fluidity and the like. However, in the liquid crystalline resin composition, the filler protrudes from the surface of the molded body of the composition and further desorbs, causing functional failure such as poor conduction of the product. Further, when molding a liquid crystalline resin composition to obtain a molded body constituting a surface-mounted relay, the liquid crystalline resin composition is required to have good fluidity.

The present invention has been made in view of such a situation, and provides a molded article excellent in heat resistance and airtightness and suppressed deformation and peeling of filler, a liquid crystal resin composition for a surface mount relay with good fluidity, and a surface mount component comprising the composition. It is an object of the present invention to provide components for relays and surface mount relays including the components.

The present inventors have solved the above problems by combining a liquid crystal resin containing a specific structural unit in a predetermined amount with a predetermined amount, fibrous wollastonite, and mica, and setting the aspect ratio of the fibrous wollastonite within a predetermined range. I found out that it can be solved. Specifically, the present invention provides the following.

(1) A liquid crystal resin composition for a surface mount relay comprising (A) liquid crystal resin, (B) fibrous wollastonite, and (C) mica,

The (A) liquid crystalline resin consists of the following structural units (I) to (VI) as essential components,

The content of the constituent unit (I) is 50 to 70 mol% with respect to the total constituent units,

The content of structural unit (II) is 0.5 mol% or more and less than 4.5 mol% with respect to all the structural units,

The content of structural unit (III) is 10.25 to 22.25 mol% with respect to all the structural units,

The content of structural unit (IV) is 0.5 mol% or more and less than 4.5 mol% with respect to all the structural units,

The content of the structural unit (V) is 5.75 to 23.75 mol% with respect to all the structural units,

The content of the constituent unit (VI) is 1 to 7 mol% with respect to the total constituent units,

The total content of structural units (II) and (IV) with respect to all structural units is 1 mol% or more and less than 5 mol%,

The total content of constituent units (I) to (VI) is 100 mol% with respect to all constituent units,

A wholly aromatic polyester amide exhibiting optical anisotropy when melted, wherein the molar ratio of constituent unit (VI) to the sum of constituent units (V) and (VI) is 0.04 to 0.37;

The (B) aspect ratio of the fibrous wollastonite is 8 or more,

Regarding the entire liquid crystalline resin composition,

The (A) content of the liquid crystalline resin is 55 to 75% by mass,

The content of the fibrous wollastonite (B) is 2.5 to 17.5% by mass,

The content of the above (C) mica is 15 to 32.5% by mass,

The total content of the (B) fibrous wollastonite and the (C) mica is 25 to 45% by mass,

The surface-mounted relay is a surface-mounted relay having a base and a terminal protruding from the base and soldering the terminal to a printed circuit board liquid crystal resin composition.

(2) The total number of moles of constituent unit (III) and constituent unit (IV) is 1 to 1.1 times the total number of moles of constituent unit (V) and constituent unit (VI), or constituent unit (V) and constituent unit (VI) ) The liquid crystal resin composition according to (1), wherein the total number of moles of the constituent units (III) and (IV) is 1 to 1.1 times the total number of moles of the constituent units (III) and (IV).

(3) A surface-mounted relay component comprising the composition according to (1) or (2).

(4) A surface mount relay provided with the parts described in (3).

According to the present invention, a liquid crystalline resin composition for a surface mount relay with good flowability, which provides a molded article with excellent heat resistance and airtightness and suppressed deformation and peeling of filler, a component for a surface mount relay made of the composition, and the component It is possible to provide a surface mount relay having a.

Fig. 1 (a) is a perspective view schematically showing an embodiment of a surface-mounted relay according to the present invention, and Fig. 1 (b) is a partial cross-sectional view showing a section AA of Fig. 1 (a).
2(a) and 2(b) are side views schematically showing a state in which an embodiment of a surface-mounted relay according to the present invention is mounted on a printed circuit board.
Fig. 3 (a) is a plan view showing a relay case molded in an example, and Fig. 3 (b) is a partial longitudinal sectional view showing a BB cross section in Fig. 3 (a). In addition, unless otherwise specified, the units of numerical values in the drawings are mm (hereinafter, the same applies to Figs. 4(a) to 5(b)).
Fig. 4 (a) is a plan view showing a pedestal mounted from the bottom side of the relay case shown in Figs. 3 (a) and 3 (b), and Fig. 4 (b) is a CC section of Fig. 4 (a) It is a partial longitudinal section view.
Fig. 5 (a) is a relay in which the inside is sealed by mounting the pedestal shown in Figs. It is a partial longitudinal section showing the case. Fig. 5(b) is a diagram showing measurement points in the evaluation of the expansion during reflow of the relay case performed in the example. Specifically speaking, Fig. 5(b) is a plan view showing the relay case as in Fig. 3(a), and a plurality of positions indicated by black circles are measurement points.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described concretely.

<Liquid crystalline resin composition for surface mount relay>

The liquid crystal resin composition for a surface mount relay according to the present invention contains a specific liquid crystal resin, fibrous wollastonite, and mica in predetermined amounts, and the aspect ratio of the fibrous wollastonite is 8 or more, and the surface mount relay, A surface-mounted relay having a base and a terminal protruding from the base, and soldering the terminal to a printed circuit board. Hereinafter, components constituting the liquid crystalline resin composition according to the present invention will be described.

[liquid crystalline resin]

The liquid crystal resin composition according to the present invention includes a liquid crystal resin that is the wholly aromatic polyester amide. Since the melting point of the wholly aromatic polyester amide is low, the processing temperature can be lowered, and generation of decomposition gas during melting is suppressed. Liquid crystalline resin can be used individually by 1 type or in combination of 2 or more types.

The wholly aromatic polyesteramide in the present invention includes the following structural unit (I), the following structural unit (II), the following structural unit (III), the following structural unit (IV), the following structural unit (V), and the following structural unit It consists of units (VI).

Structural unit (I) is derived from 4-hydroxybenzoic acid (hereinafter also referred to as "HBA"). The wholly aromatic polyesteramide in the present invention contains 50 to 70 mol% of structural unit (I) with respect to all structural units. When the content of structural unit (I) is less than 50 mol% or exceeds 70 mol%, at least one of lowering the melting point and heat resistance tends to be insufficient. From the viewpoint of both low melting point and heat resistance, the content of structural unit (I) is preferably 54 to 67 mol%, more preferably 58 to 64 mol%.

Structural unit (II) is derived from 6-hydroxy-2-naphthoic acid (hereinafter also referred to as "HNA"). The wholly aromatic polyesteramide in the present invention contains 0.5 mol% or more and less than 4.5 mol% of the structural unit (II) with respect to all the structural units. When the content of structural unit (II) is less than 0.5 mol% or 4.5 mol% or more, at least one of lowering the melting point and heat resistance tends to be insufficient. From the viewpoint of both low melting point and heat resistance, the content of structural unit (II) is preferably 0.75 to 3.75 mol%, more preferably 1 to 3 mol%.

Structural unit (III) is derived from 1,4-phenylenedicarboxylic acid (hereinafter also referred to as "TA"). The wholly aromatic polyesteramide in the present invention contains 10.25 to 22.25 mol% of constituent unit (III) with respect to all constituent units. When the content of structural unit (III) is less than 10.25 mol% or exceeds 22.25 mol%, at least one of lowering the melting point and heat resistance tends to be insufficient. From the viewpoint of both low melting point and heat resistance, the content of structural unit (III) is preferably 12.963 to 20.75 mol%, more preferably 15.675 to 19.25 mol%.

Structural unit (IV) is derived from 1,3-phenylenedicarboxylic acid (hereinafter also referred to as "IA"). The wholly aromatic polyesteramide in the present invention contains 0.5 mol% or more and less than 4.5 mol% of the structural unit (IV) with respect to all the structural units. When the content of structural unit (IV) is less than 0.5 mol% or 4.5 mol% or more, at least one of lowering the melting point and heat resistance tends to be insufficient. From the viewpoint of both low melting point and heat resistance, the content of structural unit (IV) is preferably 0.5 to 3.75 mol%, more preferably 0.5 to 3 mol%.

The structural unit (V) is derived from 4,4'-dihydroxybiphenyl (hereinafter also referred to as "BP"). The wholly aromatic polyesteramide in the present invention contains 5.75 to 23.75 mol% of structural unit (V) with respect to all structural units. When the content of the constituent unit (V) is less than 5.75 mol% or exceeds 23.75 mol%, at least one of lowering the melting point and heat resistance tends to be insufficient. From the viewpoint of both low melting point and heat resistance, the content of the structural unit (V) is preferably 8.5 to 20.375 mol%, more preferably 11.25 to 17 mol% (eg 11.675 to 17 mol%).

Structural unit (VI) is derived from N-acetyl-p-aminophenol (hereinafter also referred to as "APAP"). The wholly aromatic polyesteramide in the present invention contains 1 to 7 mol% of structural unit (VI) with respect to all structural units. When the content of structural unit (VI) is less than 1 mol% or exceeds 7 mol%, at least one of lowering the melting point and heat resistance tends to be insufficient. From the viewpoint of both low melting point and heat resistance, the content of structural unit (VI) is preferably 1.5 to 7 mol%, more preferably 2 to 7 mol%.

The wholly aromatic polyesteramide in the present invention contains 1 mol% or more and less than 5 mol% of the sum of the structural units (II) and (IV) with respect to all the structural units. In the above wholly aromatic polyesteramide, when the flexible structural unit (II) having a naphthalene skeleton and the flexible structural unit (IV) having a benzene skeleton coexist in a total amount within the above range, both lowering the melting point and heat resistance are sufficient. easy to lose If the total content is less than 1 mol%, the ratio of the flexible constituent units becomes too small, and therefore, the melting point is easily reduced. When the total content is 5 mol% or more, the proportion of the flexible structural unit becomes too large, and thus the heat resistance tends to be insufficient. From the viewpoint of both low melting point and heat resistance, the total content is preferably 1.75 to 4.75 mol%, more preferably 2.5 to 4.5 mol%.

In the wholly aromatic polyesteramide of the present invention, the molar ratio of the structural unit (VI) to the total of the structural units (V) and (VI) is 0.04 to 0.37. If the molar ratio is less than 0.04, since the ratio of structural units having a biphenyl backbone increases, the crystallinity of the wholly aromatic polyester amide is lowered, and the coexistence of low melting point and heat resistance tends to be insufficient. In addition, if the molar ratio exceeds 0.37, since heterogeneous bonds other than ester bonds increase, the crystallinity of the wholly aromatic polyester amide is lowered, and compatibility of low melting point and heat resistance tends to be insufficient. From the viewpoint of both low melting point and heat resistance, the molar ratio is preferably 0.07 to 0.36, more preferably 0.11 to 0.35.

From the viewpoint of both low melting point and heat resistance, the total number of moles of structural unit (III) and structural unit (IV) (hereinafter also referred to as "number of moles 1A") is the sum of structural unit (V) and structural unit (VI). It is preferably 1 to 1.1 times the number of moles (hereinafter also referred to as “number of moles 2A”), or the number of moles 2A is preferably 1 to 1.1 times the number of moles 1A. The number of moles 1A is 1.02 to 1.06 times the number of moles 2A, or the number of moles 2A is more preferably 1.02 to 1.06 times the number of moles 1A. The number of moles 1A is 1.024 to 1.056 times the number of moles 2A, or more preferably the number of moles 2A is 1.024 to 1.056 times the number of moles 1A.

As described above, the wholly aromatic polyesteramide in the present invention contains each of the specific structural units (I) to (VI) and the sum of the structural units (II) and (IV), relative to all the structural units. While containing a specific amount, since the molar ratio of the structural unit (VI) to the total of the structural unit (V) and the structural unit (VI) is within a specific range, both low melting point and heat resistance are sufficient. Further, the wholly aromatic polyesteramide of the present invention contains 100 mol% of structural units (I) to (VI) in total with respect to all structural units.

Next, the manufacturing method of the wholly aromatic polyester amide in this invention is demonstrated. The wholly aromatic polyesteramide in the present invention is polymerized using a direct polymerization method or a transesterification method or the like. In the polymerization, a melt polymerization method, a solution polymerization method, a slurry polymerization method, a solid phase polymerization method, or the like, or a combination of two or more thereof is used, and the melt polymerization method or a combination of the melt polymerization method and the solid phase polymerization method is used. preferably used

In the present invention, upon polymerization, an acylating agent for the polymerization monomer or a terminally activated monomer can be used as an acid chloride derivative. Examples of the acylating agent include fatty acid anhydrides such as acetic anhydride.

In these polymerizations, various catalysts can be used. Representative examples include potassium acetate, magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, antimony trioxide, tris(2,4-pentanedio and metal salt-based catalysts such as nate)cobalt (III), and organic compound catalysts such as 1-methylimidazole and 4-dimethylaminopyridine.

As reaction conditions, they are, for example, a reaction temperature of 200 to 380°C and a final ultimate pressure of 0.1 to 760 Torr (ie, 13 to 101,080 Pa). In particular, in the melting reaction, for example, the reaction temperature is 260 to 380°C, preferably 300 to 360°C, and the ultimate pressure is 1 to 100 Torr (i.e., 133 to 13,300 Pa), preferably 1 to 50 Torr (i.e., 133 to 13,300 Pa). 6,670Pa).

The reaction may be initiated by putting all raw monomers (HBA, HNA, TA, IA, BP, and APAP), an acylating agent, and a catalyst in the same reaction vessel (one-stage method), or the raw monomers HBA, HNA, After acylating the hydroxyl groups of BP and APAP with an acylating agent, they may be reacted with the carboxyl groups of TA and IA (two-step method).

Melt polymerization is carried out at a predetermined degree of reduced pressure by starting the reduced pressure after the inside of the reaction system has reached a predetermined temperature. After the torque of the stirrer reaches a predetermined value, an inert gas is introduced, and the fully aromatic polyesteramide is discharged from the reaction system under reduced pressure through normal pressure to a predetermined pressurized state.

The molecular weight of the wholly aromatic polyesteramide produced by the above polymerization method can be further increased by solid-state polymerization by heating under normal pressure or reduced pressure in an inert gas. Preferred conditions for the solid-state polymerization reaction are a reaction temperature of 230 to 350°C, preferably 260 to 330°C, and a final ultimate pressure of 10 to 760 Torr (ie, 1,330 to 101,080 Pa).

Next, the properties of the wholly aromatic polyester amide are described. The wholly aromatic polyesteramide in the present invention exhibits optical anisotropy during melting. Exhibiting optical anisotropy upon melting means that the wholly aromatic polyesteramide in the present invention is a liquid crystalline resin.

In the present invention, the fact that the wholly aromatic polyesteramide is a liquid crystalline resin is an indispensable factor for the wholly aromatic polyesteramide to have both thermal stability and easy processability. Some wholly aromatic polyesteramides composed of the structural units (I) to (VI) do not form an anisotropic molten phase depending on the constituent components and sequence distribution in the polymer, but the liquid crystalline resin of the present invention does not form an anisotropic melt phase when melted. limited to wholly aromatic polyester amides exhibiting optical anisotropy.

The property of melting anisotropy can be confirmed by a conventional polarization inspection method using an orthogonal polarizer. More specifically, confirmation of the melting anisotropy can be performed by melting a sample placed on a Rincam hot stage using an Olympus polarizing microscope and observing it under a nitrogen atmosphere at a magnification of 150 times. Liquid crystalline resins are optically anisotropic and transmit light when inserted between orthogonal polarizers. If the sample is optically anisotropic, for example, polarized light is transmitted even in a state of a molten still liquid.

Since nematic liquid crystalline resins significantly decrease in viscosity at or above the melting point, liquid crystallinity at or above the melting point is generally an indicator of processability. The melting point is preferably as high as possible from the viewpoint of heat resistance, but considering the thermal deterioration during melt processing of the liquid crystalline resin and the heating ability of the molding machine, it is preferable that it is 360 ° C. or less. More preferably, it is 300-360 degreeC, More preferably, it is 340-358 degreeC.

The melt viscosity of the wholly aromatic polyesteramide at a temperature 10 to 30° C. higher than the melting point of the wholly aromatic polyesteramide in the present invention and at a shear rate of 1000/sec is preferably 500 Pa·s or less, more preferably It is preferably 0.5 to 300 Pa·s, and more preferably 1 to 100 Pa·s. When the melt viscosity is within the above range, the wholly aromatic polyesteramide itself or the composition containing the wholly aromatic polyesteramide tends to ensure fluidity during molding, and the filling pressure does not become excessive. . In addition, in this specification, melt viscosity refers to the melt viscosity measured based on ISO11443.

The liquid crystalline resin composition according to the present invention contains 55 to 75% by mass of the above liquid crystalline resin with respect to the entire liquid crystalline resin composition. If the content of the liquid crystalline resin is less than 55% by mass with respect to the entire liquid crystalline resin composition, the fluidity of the liquid crystalline resin composition tends to deteriorate, and the airtightness of molded bodies such as parts for surface mounted relays obtained from the liquid crystalline resin composition Since there is a possibility of deterioration, it is undesirable. If the content of the liquid crystalline resin exceeds 75% by mass with respect to the entire liquid crystalline resin composition, there is a fear that at least one of the deformation suppression effect, airtightness, etc. of molded bodies obtained from the liquid crystalline resin composition, such as parts for surface mounted relays, may decrease. undesirable because there is The liquid crystalline resin composition according to the present invention preferably contains 57.5 to 72.5% by mass, and more preferably 60 to 70% by mass of the liquid crystalline resin described above with respect to the entire liquid crystalline resin composition.

[(B) Fibrous wollastonite]

(B) The aspect ratio of fibrous wollastonite, that is, the value of average fiber length/average fiber diameter is 8 or more. The aspect ratio is preferably 10 to 25, more preferably 15 to 20, from the viewpoint of the effect of suppressing deformation of molded bodies such as parts for surface-mounted relays obtained from the liquid crystalline resin composition according to the present invention.

(B) It does not specifically limit as fibrous wollastonite, For example, a well-known fibrous wollastonite can be used. (B) Fibrous wollastonite may be used alone or in combination of two or more having different aspect ratios, average fiber lengths, and average fiber diameters.

(B) The average fiber diameter of the fibrous wollastonite is preferably 3.0 to 50 μm, more preferably 4.5 to 40 μm. When the average fiber diameter is 3.0 μm or more, molded articles such as parts for surface-mounted relays obtained from the liquid crystalline resin composition according to the present invention can easily secure sufficient mechanical strength and deflection temperature under load. When the average fiber diameter is 50 μm or less, the effect of suppressing napping on the surface of the molded article is likely to increase. In addition, in the present specification, as the average fiber diameter of (B) fibrous wollastonite in the liquid crystalline resin composition, the liquid crystalline resin composition was incinerated by heating at 600 ° C. for 2 hours, and the remaining fibrous wollastonite was observed with a scanning electron microscope, The average of the measured fiber diameter values for 100 fibrous wollastonite is used.

(B) The average fiber length of the fibrous wollastonite is preferably 30 to 800 μm, more preferably 50 to 600 μm. When the average fiber length is 30 μm or more, molded articles such as parts for surface-mounted relays obtained from the liquid crystalline resin composition according to the present invention can easily secure sufficient mechanical strength and deflection temperature under load. When the average fiber length is 800 μm or less, the effect of suppressing napping on the surface of the molded article is likely to increase. In this specification, as the average fiber length of (B) fibrous wollastonite in the liquid crystalline resin composition, 10 stereomicroscopic images of fibrous wollastonite remaining after incineration of the liquid crystalline resin composition by heating at 600 ° C. for 2 hours were obtained by CCD. It is transferred from the camera to the PC, and the average of the values measured for the fiber lengths of 100 fibrous wollastonite per 1 stereoscopic microscope image, that is, 1000 fibrous wollastonite in total, is used according to the image processing technique by the image measuring device.

The liquid crystal resin composition according to the present invention contains 2.5 to 17.5% by mass of (B) fibrous wollastonite with respect to the entire liquid crystal resin composition. (B) If the content of fibrous wollastonite is less than 2.5% by mass with respect to the entire liquid crystalline resin composition, the airtightness of molded bodies such as parts for surface mounted relays obtained from the liquid crystalline resin composition may decrease. This is not preferable. (B) If the content of fibrous wollastonite exceeds 17.5 mass% with respect to the entire liquid crystalline resin composition, the effect of suppressing deformation of molded bodies such as parts for surface mounted relays obtained from the liquid crystalline resin composition may decrease. This is not preferable. The (B) fibrous wollastonite in the present invention is preferably contained in the liquid crystalline resin composition in an amount of 3.5 to 14% by mass, more preferably 5 to 10% by mass with respect to the entire liquid crystalline resin composition.

[(C) Mica]

The liquid crystalline resin composition according to the present invention includes mica. As mica is included in the liquid crystalline resin composition according to the present invention, the fluidity of the liquid crystalline resin composition is easily improved, and a molded product with reduced deformation can be obtained. Mica can be used individually by 1 type or in combination of 2 or more types.

15-32.5 mass % of mica is contained with respect to the whole liquid crystalline resin composition. If the content of mica is less than 15 mass% with respect to the entire liquid crystalline resin composition, it is not preferable because suppression of deformation of a molded article obtained from the liquid crystalline resin composition is not sufficient. If the content of mica is more than 32.5 mass% with respect to the entire liquid crystalline resin composition, the fluidity of the liquid crystalline resin composition tends to deteriorate and molding of the liquid crystalline resin composition may become difficult, and furthermore, from the liquid crystalline resin composition It is not preferable because there is a possibility that the airtightness of molded bodies such as components for surface mounted relays obtained may decrease. It is preferable that mica is contained in 17-31.5 mass % with respect to the whole liquid crystalline resin composition in the liquid crystalline resin composition, and it is more preferable that it is contained in 20-30 mass %.

[Mica]

Mica is a pulverized product of silicate minerals containing aluminum, potassium, magnesium, sodium and iron. Examples of mica that can be used in the present invention include muscovite mica, phlogopite mica, biotite, and artificial mica.

Also, in the production of mica, a wet grinding method and a dry grinding method are known as methods for pulverizing minerals. The wet grinding method is a method in which raw mica is coarsely pulverized with a dry pulverizer, then water is added, wet pulverized in a slurry state, followed by dehydration and drying. Compared with the wet grinding method, the dry grinding method is an inexpensive and common method, but it is easier to grind the mineral thinly and finely using the wet grinding method. For the reason that mica having a preferable average particle diameter and thickness described later can be obtained, it is preferable to use a thin and fine pulverized product in the present invention. Therefore, in the present invention, it is preferable to use mica produced by a wet grinding method.

In addition, since the wet grinding method requires a step of dispersing the material to be ground in water, it is common to add a flocculating sedimentation agent and/or a sedimentation aid to the material to be ground in order to increase the dispersion efficiency of the material to be ground. Coagulant and settling aids that can be used in the present invention include poly aluminum chloride, aluminum sulfate, ferrous sulfate, ferric sulfate, copper chloride, poly iron sulfate, poly ferric chloride, iron-silica inorganic polymer coagulant, chloride Ferric-silica inorganic polymer coagulants, slaked lime (Ca(OH) ₂ ), caustic soda (NaOH), soda ash (Na ₂ CO ₃ ), and the like. These flocculating sedimentation agents and sedimentation aids are either alkaline or acidic in pH. When the mica used in the present invention is wet-ground, it is preferable not to use a flocculating sedimentation agent and/or a sedimentation aid. When using mica that has not been treated with a flocculating sedimentation agent and/or a sedimentation aid, decomposition of the liquid crystalline resin in the liquid crystalline resin composition is difficult to occur, and generation of a large amount of gas or molecular weight reduction of the liquid crystalline resin is difficult to occur. It is easy to keep the performance of the obtained molded body, such as a surface mount relay component, more favorable.

Mica that can be used in the present invention preferably has an average particle diameter of 10 to 100 µm, particularly preferably 20 to 80 µm, as measured by the microtrac laser diffraction method. When the average particle size of the mica is 10 μm or more, the effect of improving the rigidity of the molded body tends to be sufficient, so it is preferable. When the average particle diameter of mica is 100 μm or less, the rigidity of the molded article is easily improved sufficiently and the weld strength is easily increased, so it is preferable. In addition, when the average particle diameter of mica is 100 μm or less, it is easy to ensure sufficient fluidity for molding the surface-mounted relay component or the like of the present invention.

The thickness of the mica that can be used in the present invention is preferably 0.01 to 1 μm, particularly preferably 0.03 to 0.3 μm, as measured by electron microscopic observation. If the thickness of the mica is 0.01 μm or more, since the mica becomes difficult to break during melt processing of the liquid crystal resin composition, it is preferable because there is a possibility that the rigidity of the molded article can be easily improved. When the thickness of the mica is 1 μm or less, the effect of improving the rigidity of the molded body tends to be sufficient, which is preferable.

Mica usable in the present invention may be surface-treated with a silane coupling agent or the like, and/or may be granular by being granulated with a binder.

In the liquid crystal resin composition according to the present invention, the total content of (B) fibrous wollastonite and (C) mica is 25 to 45% by mass with respect to the entire liquid crystal resin composition. If the content is less than 25% by mass with respect to the entire liquid crystalline resin composition, it is not preferable because at least one of the deformation suppression effect and airtightness of molded articles such as parts for surface mount relays obtained from the liquid crystalline resin composition may deteriorate. not. If the content is more than 45% by mass with respect to the entire liquid crystalline resin composition, the fluidity of the liquid crystalline resin composition tends to deteriorate, and there is a risk that the airtightness of molded products such as parts for surface mounted relays obtained from the liquid crystalline resin composition may deteriorate. so it is not desirable It is preferable that it is 27.5-37.5 mass % with respect to the whole liquid crystalline resin composition, and, as for the said content, it is more preferable that it is 30-40 mass %.

[Other Ingredients]

In the liquid crystalline resin composition according to the present invention, other polymers, other fillers, known substances generally added to synthetic resins, that is, stabilizers such as antioxidants and ultraviolet absorbers, antistatic agents, flame retardants, etc. , colorants such as dyes and pigments, lubricants, release agents, crystallization accelerators, and other components such as crystal nucleating agents may be appropriately added according to required performance. The other components may be used singly or in combination of two or more.

As another polymer, liquid crystal resins other than (A) liquid crystal resin are mentioned, for example. However, it is preferable that the liquid crystalline resin composition according to the present invention does not contain a liquid crystalline resin other than the liquid crystalline resin (A) from at least one of the viewpoints of the deformation suppression effect of the molded body, airtightness, and the like. Examples of other polymers include epoxy group-containing copolymers. However, since it is difficult to generate gas by thermal decomposition of the epoxy group-containing copolymer and expansion of molded articles such as parts for surface mount relays due to it, the liquid crystal resin composition according to the present invention is suitable for use in the epoxy group-containing air It is preferable not to include coalescence.

Other fillers refer to fillers other than fibrous wollastonite, mica, and carbon black having an aspect ratio of 8 or more, for example, fibrous fillers other than fibrous wollastonite having an aspect ratio of 8 or more (eg, an aspect ratio of less than 8). Fibrous wollastonite, milled fiber, and plate-shaped fillers other than mica (for example, talc) are exemplified. However, from the viewpoints of fluidity of the liquid crystalline resin composition, effect of suppressing deformation of the molded body, effect of suppressing filler detachment, etc., the liquid crystalline resin composition according to the present invention does not contain fibrous wollastonite, milled fiber, and talc having an aspect ratio of less than 8. It is preferable not to

The method for producing the liquid crystalline resin composition according to the present invention is not particularly limited as long as the components in the liquid crystalline resin composition can be uniformly mixed, and can be appropriately selected from conventionally known methods for producing a resin composition. For example, after melt-kneading and extruding each component using a melt-kneading device such as a single-screw or twin-screw extruder, a method of processing the obtained liquid crystalline resin composition into a desired form such as powder, flakes, or pellets is exemplified. there is.

Since the liquid crystalline resin composition according to the present invention has excellent fluidity, the minimum filling pressure at the time of molding is unlikely to be excessive, and parts for surface-mounted relays and the like can be molded favorably.

The melt viscosity of the liquid crystalline resin composition measured according to ISO11443 at a shear rate of 1000/sec at a temperature 10 to 30°C higher than the melting point of the liquid crystalline resin is 500 Pa·s or less (more preferably 5 Pa·s or more) 100 Pa·s or less) is preferable in view of easy securing of fluidity of the liquid crystalline resin composition and difficulty of excessive filling pressure during molding of surface mounted relay components.

<Parts for surface mount relays and surface mount relays>

By molding the liquid crystalline resin composition according to the present invention, the surface-mounted relay component according to the present invention can be obtained. The component for a surface-mounted relay according to the present invention is excellent in heat resistance and airtightness, and deformation and detachment of filler are suppressed. Since the surface mount relay according to the present invention includes the above components, (1) it has excellent heat resistance and can withstand solder reflow treatment, (2) it can maintain airtightness and shape even after solder reflow treatment, ( 3) Separation of the filler is suppressed, and functional failure such as poor conduction is less likely to occur.

The surface mount relay component according to the present invention and the surface mount relay according to the present invention will be described. Fig. 1 (a) is a perspective view schematically showing an embodiment of a surface-mounted relay according to the present invention, and Fig. 1 (b) is a partial cross-sectional view showing a section AA of Fig. 1 (a). The surface mount relay 1 includes a base 2, a case 3, a coil block 4, an armature block 5, and a terminal 6.

The base 2 has terminals 6 protruding from the base 2 . A case 3 is disposed on the outer periphery of the upper surface of the base 2 . At the central portion of the upper surface of the base 2, the coil block 4 and the armature block 5 are arranged in this order.

The case 3 is arranged so as to cover the outer periphery of the upper surface of the base 2, the coil block 4 and the armature block 5. Inside the space on the hollow container formed by the base 2 and the case 3, the coil block 4 and the armature block 5 are accommodated.

The coil block 4 includes a bobbin 41 , a coil 42 , and an iron core 43 , and is disposed in the central portion of the upper surface of the base 2 . The bobbin 41 has a cylindrical portion penetrating in the long axis direction, and around the outer periphery of the bobbin 41, a coil 42 electrically connected to one end of a part of the terminal 6 is wound, and the bobbin 41 An iron core 43 is inserted into the cylindrical portion.

The armature block 5 includes an armature connecting portion 51 and an armature 52 extending in opposite directions from the armature connecting portion 51 along the long axis direction of the bobbin 41, and includes a coil block ( 4) placed on The armature 52 is electrically connected to one end of another part of the terminal 6 . When an electromagnet is formed by conduction to the coil 42, the tip of the armature 52 moves toward the coil block 4 side due to magnetic force. As a result, the signal from the input side including the coil 42 is transferred to the output side including the armature 52 .

The terminal 6 has one end electrically connected to the coil 42 or the armature 52, and the other end connected to the printed circuit board 7 to be described later in an electrically conductive manner. The terminal 6 protrudes from the base 2 and is soldered to the printed board 7 as will be described later.

Among the above-mentioned parts, the base 2, the case 3, and the bobbin 41 are excellent in heat resistance and airtightness, and can be formed as molded bodies in which deformation and detachment of filler are suppressed. It is preferably made of a liquid crystalline resin composition according to. That is, as components for surface-mounted relays according to the present invention, bases, cases, bobbins, and the like are exemplified.

In the surface mount relay 1, for example, the coil block 4 and the armature block 5 are arranged in this order at the center of the upper surface of the base 2, and then the upper surface of the base 2 It can be manufactured by arranging the case 3 on the outer periphery and adhering the base 2 and the case 3 with an adhesive.

A method of mounting the surface mount relay 1 on the printed circuit board 7 will be described. As shown in Fig. 2 (a), in the surface mount relay 1, the terminal 6 protruding vertically from the surface mount relay 1 is bent at right angles so that the soldering surface is parallel to the surface mount relay 1. there is. For this reason, the surface mount relay 1 connects the terminal 6 to a solder pad (not shown) formed on the conductor pattern 8 on the surface of the printed circuit board 7 without forming a hole in the printed board 7. It is mounted and fixed to the printed circuit board 7 so that electrical conduction is possible by performing a solder reflow process.

In addition, in the above description, as shown in Fig. 2(a), the case where the tip of the terminal 6 protruding vertically from the surface mount relay 1 is bent at right angles to the outside of the surface mount relay 1. showed On the other hand, as shown in FIG. 2(b), the tip of the terminal 6 protruding vertically from the surface mount relay 1 may be bent at right angles to the inside of the surface mount relay 1.

Example

Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited thereto.

<Examples 1 to 3, Comparative Examples 1 to 11>

In the following Examples and Comparative Examples, the liquid crystalline resins LCP1 to LCP4 were prepared as follows. At this time, the melting point and melt viscosity of the pellets were measured under the following conditions, respectively.

[Measurement of Melting Point]

After measuring the endothermic peak temperature (Tm1) observed when the liquid crystalline resin was heated from room temperature to 20°C/min with a DSC manufactured by TA Instruments, the temperature was maintained at (Tm1+40)°C for 2 minutes. After that, the temperature of the endothermic peak observed when the mixture was once cooled to room temperature under a temperature-decreasing condition of 20°C/min and then heated again under a temperature-raising condition of 20°C/min was measured.

[Measurement of Melt Viscosity]

Using capilograph type 1B manufactured by Toyo Seiki Manufacturing Co., Ltd., using an orifice with an inner diameter of 1 mm and a length of 20 mm at a temperature 10 to 30 ° C higher than the melting point of liquid crystalline resin, at a shear rate of 1000 / sec, ISO11443 Based on the above, the melt viscosity of the liquid crystal resin was measured. The measured temperature was 360°C for LCP1, 350°C for LCP2, 380°C for LCP3, and 380°C for LCP4.

(Method of manufacturing LCP1)

Into a polymerization vessel equipped with an agitator, a reflux column, a monomer inlet, a nitrogen inlet, and a decompression/outflow line, the following raw material monomers, a fatty acid metal salt catalyst, and an acylating agent were placed, and nitrogen substitution was initiated.

(I) 4-hydroxybenzoic acid: 1385 g (60 mol%) (HBA)

(II) 6-hydroxy-2-naphthoic acid: 88 g (2.8 mol%) (HNA)

(III) 1,4-phenylenedicarboxylic acid: 504 g (18.15 mol%) (TA)

(IV) 1,3-phenylenedicarboxylic acid: 19 g (0.7 mol%) (IA)

(V) 4,4'-dihydroxybiphenyl: 415 g (13.35 mol%) (BP)

(VI) N-acetyl-p-aminophenol: 126 g (5 mol%) (APAP)

Potassium Acetate Catalyst: 120mg

Acetic anhydride: 1662 g

After putting the raw materials into the polymerization vessel, the temperature of the reaction system was raised to 140°C and reacted at 140°C for 1 hour. Subsequently, the temperature was raised to 360° C. over 5.5 hours, and then the pressure was reduced to 10 Torr (i.e., 1330 Pa) for 20 minutes, and melt polymerization was performed while acetic acid, excess acetic anhydride, and other low-boiling components were distilled off. After the agitation torque reached a predetermined value, nitrogen was introduced and the polymer was discharged from the lower portion of the polymerization vessel by introducing nitrogen from a reduced pressure state to a pressurized state via normal pressure, and the strand was pelletized to pelletize. The obtained pellets had a melting point of 345°C and a melt viscosity of 10 Pa·s.

(Method of manufacturing LCP2)

Into a polymerization vessel equipped with an agitator, a reflux column, a monomer inlet, a nitrogen inlet, and a decompression/outflow line, the following raw material monomers, a fatty acid metal salt catalyst, and an acylating agent were supplied, and nitrogen substitution was initiated.

(I) 4-hydroxybenzoic acid: 1380 g (60 mol%) (HBA)

(II) 6-hydroxy-2-naphthoic acid: 157 g (5 mol%) (HNA)

(III) 1,4-phenylenedicarboxylic acid: 484 g (17.5 mol%) (TA)

(V) 4,4'-dihydroxybiphenyl: 388 g (12.5 mol%) (BP)

(VI) N-acetyl-p-aminophenol: 126 g (5 mol%) (APAP)

Potassium Acetate Catalyst: 110mg

Acetic anhydride: 1659 g

After supplying raw materials to the polymerization vessel, the temperature of the reaction system was raised to 140°C and reacted at 140°C for 1 hour. Subsequently, the temperature was raised to 340° C. over 4.5 hours, and then the pressure was reduced to 10 Torr (i.e., 1330 Pa) for 15 minutes, and melt polymerization was performed while acetic acid, excess acetic anhydride, and other low-boiling components were distilled off. After the agitation torque reached a predetermined value, nitrogen was introduced and the polymer was discharged from the lower portion of the polymerization vessel by introducing nitrogen from a reduced pressure state to a pressurized state via normal pressure, and the strand was pelletized to pelletize. The obtained pellets had a melting point of 336°C and a melt viscosity of 20 Pa·s.

(Method of manufacturing LCP3)

Into a polymerization vessel equipped with an agitator, a reflux column, a monomer inlet, a nitrogen inlet, and a decompression/outflow line, the following raw material monomers, a fatty acid metal salt catalyst, and an acylating agent were supplied, and nitrogen substitution was initiated.

(I) 4-hydroxybenzoic acid: 1040 g (48 mol%) (HBA)

(II) 6-hydroxy-2-naphthoic acid: 89 g (3 mol%) (HNA)

(III) 1,4-phenylenedicarboxylic acid: 547 g (21 mol%) (TA)

(IV) 1,3-phenylenedicarboxylic acid: 91 g (3.5 mol%) (IA)

(V) 4,4'-dihydroxybiphenyl: 716 g (24.5 mol%) (BP)

Potassium Acetate Catalyst: 110mg

Acetic anhydride: 1644g

After supplying the raw materials to the polymerization vessel, the temperature of the reaction system was raised to 140°C and reacted at 140°C for 1 hour. Subsequently, the temperature was raised to 360° C. over 5.5 hours, and then the pressure was reduced to 5 Torr (i.e., 667 Pa) for 20 minutes, and melt polymerization was performed while acetic acid, excess acetic anhydride, and other low-boiling components were distilled off. After the agitation torque reached a predetermined value, nitrogen was introduced and the polymer was discharged from the lower portion of the polymerization vessel by introducing nitrogen from a reduced pressure state to a pressurized state via normal pressure, and the strand was pelletized to pelletize. The obtained pellets had a melting point of 355°C and a melt viscosity of 10 Pa·s.

(Method for producing LCP4)

Into a polymerization vessel equipped with an agitator, a reflux column, a monomer inlet, a nitrogen inlet, and a decompression/outflow line, the following raw material monomers, a fatty acid metal salt catalyst, and an acylating agent were supplied, and nitrogen substitution was initiated.

(I) 4-hydroxybenzoic acid: 37 g (2 mol%) (HBA)

(II) 6-hydroxy-2-naphthoic acid: 1218 g (48 mol%) (HNA)

(III) 1,4-phenylenedicarboxylic acid: 560 g (25 mol%) (TA)

(V) 4,4'-dihydroxybiphenyl: 628 g (25 mol%) (BP)

Potassium Acetate Catalyst: 165mg

Acetic anhydride: 1432 g

After supplying the raw materials to the polymerization vessel, the temperature of the reaction system was raised to 140°C and reacted at 140°C for 1 hour. Subsequently, the temperature was raised to 360° C. over 5.5 hours, and then the pressure was reduced to 5 Torr (i.e., 667 Pa) for 30 minutes, and melt polymerization was performed while acetic acid, excess acetic anhydride, and other low-boiling components were distilled off. After the agitation torque reached a predetermined value, nitrogen was introduced and the polymer was discharged from the lower portion of the polymerization vessel by introducing nitrogen from a reduced pressure state to a pressurized state via normal pressure, and the strand was pelletized to pelletize. The obtained pellets were subjected to heat treatment at 300°C for 3 hours under a nitrogen stream. The pellets had a melting point of 348°C and a melt viscosity of 9 Pa·s.

(Ingredients other than liquid crystalline resin)

· Fibrous filler

Fibrous wollastonite 1: NYGLOS 8 (manufactured by NYCO Materials, aspect ratio 17, average fiber length 136 μm, average fiber diameter 8 μm)

Fibrous wollastonite 2: NYAD 325 (manufactured by NYCO Materials, aspect ratio 5, average fiber length 50 μm, average fiber diameter 5 μm)

Milled fiber: PF70E001 manufactured by Nitbo Co., Ltd., fiber diameter 10㎛, average fiber length 70㎛ (maker nominal value)

Glass fiber: ECS03T-786H manufactured by Nippon Electric Glass Co., Ltd., chopped strand with a fiber diameter of 10 μm and a length of 3 mm

· Platy filler

mica; AB-25S manufactured by Yamaguchi Mica Industry Co., Ltd., average particle diameter 25㎛

talc; Matsumura Industrial Co., Ltd. Crown Talc PP, average particle diameter 10㎛

Each liquid crystalline resin obtained above and components other than the liquid crystalline resin mentioned above were mixed using a twin-screw extruder to obtain a liquid crystalline resin composition. The blending amount of each component is as shown in Table 1 and Table 2. In addition, "%" regarding the compounding quantity in the table|surface below shows mass %. In addition, the extrusion conditions at the time of obtaining a liquid crystalline resin composition are as follows.

[Extrusion conditions]

The temperature of the cylinder installed in the main feed port was 250°C, and the temperatures of the other cylinders were all as follows. The liquid crystalline resin was supplied from the main feed port in its entirety. In addition, the filler was supplied from the side feed port.

Different cylinder temperatures:

360°C (Examples 1 to 3 and Comparative Examples 1 to 7 and 11)

350°C (Comparative Example 8)

370°C (Comparative Examples 9 and 10)

(Measurement of Melt Viscosity of Liquid Crystalline Resin Composition)

Capillograph type 1B manufactured by Toyo Seiki Seisakusho Co., Ltd. is used, and an orifice with an inner diameter of 1 mm and a length of 20 mm is used at a temperature 10 to 30 ° C higher than the melting point of liquid crystalline resin, at a shear rate of 1000 / sec, in accordance with ISO11443. The melt viscosity of the liquid crystalline resin was measured. In addition, the measurement temperature is 360 ° C. for the liquid crystalline resin composition using LCP1, 350 ° C. for the liquid crystalline resin composition using LCP2, 380 ° C. for the liquid crystalline resin composition using LCP3, and 380 ° C. for the liquid crystalline resin composition using LCP4. It was 380°C. The results are shown in Table 1 and Table 2.

Based on the method described below, the physical properties of the molded article molded from the liquid crystalline resin composition were measured. Each evaluation result is shown in Table 1 and Table 2.

(load deflection temperature)

A molded article was obtained by injection molding the liquid crystalline resin composition under the following molding conditions, and the deflection temperature under load was measured in accordance with ISO75-1,2. The deflection temperature under load was used as an indicator of the heat resistance of the molded article.

[Molding conditions]

Molding machine: Sumitomo Heavy Machinery Co., Ltd., SE100DU

Cylinder temperature:

360°C (Examples 1 to 3 and Comparative Examples 1 to 7 and 11)

350°C (Comparative Example 8)

370°C (Comparative Examples 9 and 10)

Mold temperature: 90℃

Injection speed: 33mm/sec

(bending test)

The liquid crystalline resin composition was injection molded under the following molding conditions to obtain a molded article having a thickness of 0.8 mm, and the bending strength, bending breaking strain, and bending elastic modulus were measured in accordance with ASTM D790.

[Molding conditions]

Molding machine: Sumitomo Heavy Machinery Co., Ltd., SE100DU

Cylinder temperature:

360°C (Examples 1 to 3 and Comparative Examples 1 to 7 and 11)

350°C (Comparative Example 8)

370°C (Comparative Examples 9 and 10)

Mold temperature: 90℃

Injection speed: 33mm/sec

(relay case minimum charging pressure)

The liquid crystalline resin composition was injection molded under the following molding conditions (gate: pin gate, gate size: φ 0.3 mm) to obtain a relay case as shown in Figs. 3(a) and 3(b).

[Molding conditions]

Molding machine: Sumitomo Heavy Machinery Co., Ltd., SE30DUZ

Cylinder temperature:

360°C (Examples 1 to 3 and Comparative Examples 1 to 7 and 11)

350°C (Comparative Example 8)

370°C (Comparative Examples 9 and 10)

Mold temperature: 90℃

Injection speed: 200mm/sec

When injection molding the relay case, the minimum injection and filling pressure at which a good molded body can be obtained was measured as the minimum filling pressure.

(relay case variant)

The dimensions of the bottom face of the relay case shown in Figs. 3(a) and 3(b) obtained as described above were measured by a Mitutoyo QuickVision 404 PROCNC image measuring machine. The measurement was performed before and after the reflow under the following conditions, and evaluated according to the following criteria.

(circle) (good): The absolute value of the dimensional change before and after reflow was less than 0.6% of the dimension before reflow.

x (defect): The absolute value of the dimensional change before and after reflow was 0.6% or more of the dimension before reflow.

[Reflow conditions]

Measuring device: Conveyor type hot air circulation dryer DFC-27-022S manufactured by Futaba Scientific Co., Ltd.

Sample transfer rate: 0.45 mm/min

Reflow furnace passage time: 5 minutes

Temperature conditions in the preheating zone: 185°C

Temperature conditions in the reflow zone: 295°C

Peak temperature: 257°C

(expands when reflowing the relay case)

From the bottom side of the relay case shown in Figs. 3 (a) and 3 (b) obtained as described above, the pedestal (the material is the same as that of the relay case) shown in Figs. 4 (a) and 4 (b) is mounted, , As shown in FIG. 5 (a), the inside of the relay case was sealed. After this relay case was subjected to reflow under the above-mentioned conditions, it was left standing on a horizontal desk, and the height of the top surface of the relay case was measured with a QuickVision 404 PROCNC image measuring machine manufactured by Mitutoyo. At that time, the heights are measured at a plurality of positions indicated by black circles in FIG. 5 (b), and the difference between the maximum height and the minimum height from the least square plane is taken as a plan view of the upper surface of the relay case, and the following criteria evaluated according to

○ (Good): The flatness was less than 0.45 mm, and expansion did not occur during reflow in the relay case.

× (poor): The flatness was 0.45 mm or more, and expansion occurred in the relay case during reflow.

(filler detachment)

After the relay case shown in FIGS. 3(a) and 3(b) obtained as described above was subjected to reflow under the above conditions, the state of desorption of the filler was observed and evaluated according to the following criteria.

(circle) (good): There was no change and detachment|desorption of the filler was suppressed.

x (defect): The filler was detaching.

(relay case confidentiality)

In the same manner as described above, as shown in Fig. 5 (a), the inside of the relay case was sealed. After this relay case was subjected to reflow under the conditions described above, it was immersed in 70°C warm water for 1 minute. The presence or absence of air bubbles at that time was observed and evaluated according to the following criteria.

(circle) (good): Bubbles were not observed.

x (poor): Air bubbles were observed.

As shown in Tables 1 and 2, in the examples, the melt viscosity, load bending temperature, bending strength, bending breaking deformation, and bending elastic modulus showed good values, the relay case minimum filling pressure was 80 MPa or less, and the relay case Deformation, expansion upon relay case reflow, relay case filler detachment, and relay case airtightness evaluations were all good. Therefore, the liquid crystalline resin composition according to the present invention is excellent in fluidity, and molded articles such as parts for surface mount relays obtained from this liquid crystalline resin composition are excellent in heat resistance and airtightness, and deformation and desorption of filler are suppressed. Confirmed. Therefore, the liquid crystalline resin composition can be suitably used for production of components for surface-mounted relays and surface-mounted relays.

1 surface mount relay
2 bass
3 cases
4 coil block
41 bobbin
42 coil
43 iron core
5 armature block
51 armature connection
52 armature
6 terminal
7 printed board
8 conductor pattern

Claims (4)

A liquid crystal resin composition for a surface mount relay comprising (A) liquid crystal resin, (B) fibrous wollastonite, and (C) mica,
The (A) liquid crystalline resin consists of the following structural units (I) to (VI) as essential components,
The content of the constituent unit (I) is 50 to 70 mol% with respect to the total constituent units,
The content of structural unit (II) is 0.5 mol% or more and less than 4.5 mol% with respect to all the structural units,
The content of structural unit (III) is 10.25 to 22.25 mol% with respect to all the structural units,
The content of structural unit (IV) is 0.5 mol% or more and less than 4.5 mol% with respect to all the structural units,
The content of the structural unit (V) is 5.75 to 23.75 mol% with respect to all the structural units,
The content of the constituent unit (VI) is 1 to 7 mol% with respect to the total constituent units,
The total content of structural units (II) and (IV) with respect to all structural units is 1 mol% or more and less than 5 mol%,
The total content of constituent units (I) to (VI) is 100 mol% with respect to all constituent units,
A wholly aromatic polyesteramide exhibiting optical anisotropy when melted, wherein the molar ratio of the constituent unit (VI) to the sum of the constituent units (V) and (VI) is 0.04 to 0.37;
The aspect ratio of the (B) fibrous wollastonite is 8 or more,
Regarding the entire liquid crystalline resin composition,
The (A) content of the liquid crystalline resin is 55 to 75% by mass,
The content of the fibrous wollastonite (B) is 2.5 to 17.5% by mass,
The content of the above (C) mica is 15 to 32.5% by mass,
The total content of the (B) fibrous wollastonite and the (C) mica is 25 to 45% by mass,
The surface-mounted relay is a surface-mounted relay having a base and a terminal protruding from the base, and soldering the terminal to a printed circuit board liquid crystal resin composition.
[Formula 1]

According to claim 1,
The total number of moles of constituent units (III) and (IV) is 1 to 1.1 times the total number of moles of constituent units (V) and (VI), or the sum of constituent units (V) and (VI) A liquid crystal resin composition in which the number of moles is 1 to 1.1 times the total number of moles of the constituent units (III) and (IV). A surface-mounted relay component comprising the composition according to claim 1 or 2. A surface-mounted relay comprising the component according to claim 3.

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