KR102496546B1 - Laser machining apparatus, laser machining method, and computer-readable recording medium storing laser machining program - Google Patents

Abstract

[assignment]
In the laser processing in which a laser pulse is oscillated to a laser oscillator in synchronization with the completion of a positioning operation by an optical scanner for changing a laser irradiation position, the laser pulse from the laser oscillator is incident on the optical scanner. The object is to suppress adverse effects due to fluctuations in thermal lens action in optical elements.
[Solution]
The time point at which the positioning operation in the optical scanner is completed is predicted, and the time T until the positioning operation completion prediction point is n×T0 > T > (n-1)×T0 (T0 is a predetermined time, n is In the case of an integer greater than or equal to 2), the first laser pulse having the same pulse width as the processing laser pulse is used n-1 times, followed by the second laser pulse having a shorter pulse width than the processing laser pulse once, and the positioning from the oscillation time Each time the predetermined time T0 elapses from the time until the operation completion prediction time, dummy pulses are oscillated.

Description

Laser processing device, laser processing method, and recording medium recording programs therefor

The present invention relates to, for example, a laser device for drilling a printed circuit board using a laser, a laser processing method, and a recording medium recording a program therefor.

Conventionally, in a laser processing device using a laser oscillator such as a carbon dioxide laser oscillator, laser pulses are oscillated by the laser oscillator in synchronization with the completion of a positioning operation by a galvano scanner for changing the laser irradiation position. and a laser deflection unit using an Acousto-Optic Modulator (hereinafter abbreviated as "AOM") using a crystal such as germanium to generate a diffraction grating by ultrasonic waves, the laser pulse output from the laser oscillator It is known to deflect from the non-processing direction to the processing direction.

When germanium is used as the crystal of the AOM, when a laser pulse passes through the crystal, heat is generated due to light absorption, and it acts as a lens to the laser pulse (thermal lens action). Variations in the thermal lens action cause deterioration in processing quality.

In Patent Document 1, in laser processing that controls the laser output of a laser oscillator to saturate and reach a peak value in accordance with the completion timing of the positioning operation of the galvano scanner, the pulse width of the laser pulse oscillated by the laser oscillator is controlled or dummy. A technique for suppressing the adverse effect of the thermal lensing action of the AOM by making the energy received by the AOM approximately constant by controlling the number of pulses is disclosed.

However, Patent Literature 1 does not disclose how to determine the pulse width of a laser pulse and the number of dummy pulses, and specific means for realizing it are not clear. Therefore, in reality, adverse effects due to fluctuations in the thermal lens action of the AOM cannot be suppressed.

On the other hand, in Patent Document 2, as in Patent Document 1, as a technique for controlling the pulse width and pulse number of a laser pulse oscillated by a laser oscillator, the pulse width and repetition frequency are changed according to the length of the driving time during the driving period of the galvano scanner. Oscillating a dummy pulse to a laser oscillator is disclosed.

However, the technology of Patent Literature 2 is for stabilizing the output energy of the laser oscillator, and the thermal lens action of the AOM is not considered. According to Paragraph 0046 of Patent Document 2, since the pulse width and repetition frequency of the dummy pulse change each time the galvano scanner is driven, the energy received by the AOM constantly fluctuates, and the processing quality deteriorates due to the fluctuations in the action of the thermal lens. There are downsides to dropping.

JP4492041B JP5197271B

Therefore, in the present invention, in laser processing in which a laser pulse is oscillated to a laser oscillator in synchronization with the completion of a positioning operation by an optical scanner for changing a laser irradiation position, the laser pulse from the laser oscillator is incident on the optical scanner. It is aimed at suppressing adverse effects due to fluctuations in thermal lens action in the optical element of .

In order to solve the above problems, a representative laser processing apparatus disclosed herein is a laser oscillator for oscillating laser pulses, and an optical scanner in which the laser pulses are incident through an optical element, and irradiates the processing position on the workpiece according to processing data. In a laser processing apparatus having a laser oscillation controller for controlling oscillation of the laser pulse by the laser oscillator to oscillate a laser pulse for processing in synchronization with the completion of the positioning operation of the optical scanner. , A positioning completion prediction unit for predicting a point in time at which the positioning operation in the optical scanner is completed based on an oscillation time point of the laser pulse for processing whenever the optical scanner is newly driven, and the laser oscillation control unit, When the time T from the time of oscillation to the predicted completion of the positioning operation is n×T0 > T > (n-1)×T0 (T0 is a predetermined time and n is an integer greater than or equal to 2), the processing laser pulse The first laser pulse having the same pulse width as n-2 times , and then the second laser pulse having a shorter pulse width than the processing laser pulse once, in the time from the oscillation time to the predicted positioning operation completion time, the Each time a predetermined time T0 elapses, each dummy pulse is oscillated by the laser oscillator, and the second laser pulse has a pulse width for adjusting the duty until the subsequent processing laser pulse is oscillated. characterized by

In addition, in the representative laser processing method disclosed herein, a laser pulse oscillated by a laser oscillator is incident on an optical scanner that drives a laser pulse to be irradiated to a processing position on a workpiece according to processing data through an optical element, thereby determining the position of the optical scanner. In the laser processing method in which the laser oscillator oscillates the laser pulse for processing in synchronization with the completion of the operation, the positioning of the optical scanner is determined based on the oscillation time of the laser pulse for processing whenever the optical scanner is newly driven The time point at which the operation is completed is predicted, and the time T from the time point of the oscillation to the time point at which the positioning operation is predicted is n × T0 > T > (n-1) × T0 (T0 is a predetermined time, and n is 2 or more integer), the first laser pulse having the same pulse width as the processing laser pulse is used n-2 times , and then the second laser pulse having a shorter pulse width than the processing laser pulse is used once, and the positioning is determined from the oscillation point. The laser oscillator oscillates as a dummy pulse each time the predetermined time T0 elapses from the time until the operation completion prediction time, and the second laser pulse adjusts the duty until the subsequent processing laser pulse is oscillated. It is characterized in that it has a pulse width for

In addition, although typical features of the invention disclosed herein are as described above, for features not described here, they are applied to the examples described below, or as shown in the claims.

According to the present invention, in laser processing in which a laser pulse is oscillated to the laser oscillator in synchronization with the completion of a positioning operation by the optical scanner for changing the laser irradiation position, the path through which the laser pulse from the laser oscillator is incident on the optical scanner It is possible to suppress adverse effects caused by thermal lens action of the optical element in .

1 is a timing chart for explaining an aspect of oscillation of a laser pulse in a laser drilling device according to a first embodiment of the present invention.
2 is a control flow chart of the laser oscillation control unit of the laser drilling device according to the first embodiment of the present invention.
3 is a control flow chart of the laser oscillation control unit in the laser drilling device according to the first embodiment of the present invention.
4 is a control flow chart of a laser oscillation control unit in the laser drilling device according to the first embodiment of the present invention.
5 is a block diagram of a laser drilling device according to Embodiment 1 of the present invention.
6 is a timing chart when laser pulses for processing are oscillated from a laser oscillator in the laser drilling device according to the first embodiment of the present invention.
7 is a block diagram of a laser drilling device according to Embodiment 2 of the present invention.
8 is a timing chart for explaining aspects of laser pulse oscillation in the laser drilling device according to the second embodiment of the present invention.
9 is a block diagram of a laser drilling device according to Embodiment 3 of the present invention.
10 is a timing chart for explaining an aspect of oscillation of a laser pulse in the laser drilling device according to the third embodiment of the present invention.
11 is a timing chart for explaining aspects of laser pulse oscillation in the laser drilling device according to the third embodiment of the present invention.
12 is a timing chart when laser pulses for processing are oscillated from a laser oscillator in a laser drilling device according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described using drawings.

Example 1

5 is a block diagram of a laser drilling device according to Embodiment 1 of the present invention. Each component and connection line mainly shows what is considered necessary for explaining the present embodiment, and does not show everything necessary as a laser drilling device. The same applies to a block diagram of a laser drilling device described below.

In FIG. 5, 1 is a printed circuit board to be processed placed on a table (not shown), 2 is a laser oscillator that oscillates a laser pulse (L1), and 3 is a laser pulse (L1) output from the laser oscillator (2) to generate AOM. 4 changes the laser irradiation position of the laser pulse L2 deflected in the processing direction in the laser deflection unit 3 and moves to the perforated position of the printed circuit board 1 according to the processing data. It is a galvanoscanner as an optical scanner that is rotationally driven to irradiate. 5 is a damper that absorbs the laser pulse L3 emitted from the laser deflection unit 3 in the non-processing direction.

6 is an overall control unit for controlling the operation of the entire device, and the laser oscillation control unit outputs a laser oscillation instruction signal (S) for instructing the oscillation and attenuation of the laser pulse (L1) in the laser oscillator (2). (7), an AOM control unit 8 for outputting an AOM driving signal (D) for controlling the operation of the laser deflection unit 3, and a galvano control signal (G) for controlling the driving operation of the galvano scanner 4 ), the next galvano scanner ( The positioning completion prediction unit 10 is installed to predict the completion time of the positioning operation by calculating the time until the positioning operation of 4) is completed.

The overall control unit 6 is composed of a computer that executes the program stored in the program storage unit 11, and each component and connection line therein includes a logical one. That is, the laser oscillation control unit 7, the AOM control unit 8, the galvano control unit 9, and the positioning completion prediction unit 10 perform their respective functions by executing a program stored in the program storage unit 11 by a computer. It is a logical component to perform.

In addition, some of these components may be provided separately from the overall control unit 6, or may be constituted by hardware.

It is assumed that the overall control unit 6 has control functions other than those described herein and is also connected to blocks not shown.

According to the present invention, as the laser pulse L1 oscillated by the laser oscillator 2, which will be described in detail later, the laser pulse L1 oscillated for use in processing and the laser pulse L1 oscillated in order to suppress adverse effects due to variations in thermal lens action There are two types of beauty.

The AOM control unit 8 is configured to turn off the AOM drive signal D during the period in which the dummy laser pulses are oscillating, so that the dummy laser pulses are emitted from the laser deflection unit 3 in the non-processing direction to form a damper. (5) is absorbed.

FIG. 6 is a timing chart when laser pulses for processing are oscillated from the laser oscillator 2 in the laser drilling device of FIG. 5 .

In this laser drilling device, laser oscillation is performed in synchronization with the rotation stop of the galvano scanner 4 to irradiate the printed board 1.

In FIG. 6, under the control of the overall control unit 6, the galvano operation control signal G is turned on to rotate the galvano scanner 4, and the galvano scanner 4 rotates to the target position so that the positioning operation is performed. Upon completion, the galvano operation control signal (G) is turned off, and after time t10, the laser oscillation instruction signal (S) from the laser oscillation controller 7 is turned on for a predetermined time, and the oscillation of laser pulses for processing occurs in the laser oscillator (2) are directed to

Then, after time t20 after the laser oscillation instruction signal S is turned on, the laser pulse L1 is oscillated from the laser oscillator 2, and at the same time, after time t30, the AOM drive signal D is turned on only for a predetermined time becomes Laser pulses L2 deflected in the processing direction from the laser deflection unit 3 are irradiated onto the printed circuit board 1 via the galvano scanner 4. Thereafter, the galvano operation control signal (G) is turned on after a predetermined time t40 after the laser oscillation instruction signal (S) is turned off, and the galvano scanner (4) rotates to irradiate the next hole position, Then repeat the same process.

Here, the times t10 to t30 include the processing/response time of the related functional element and the signal propagation time between the functional elements.

In Fig. 6, the control procedure at the time of oscillation of the dummy laser pulse from the laser oscillator 2 is not shown, but it is as follows.

That is, in this case, while the galvano operation control signal G remains off, the laser oscillation instruction signal S is turned on only for the time corresponding to the pulse width of the dummy laser pulse, and the dummy laser pulse oscillates. This laser oscillator 2 is instructed, and a dummy laser pulse is oscillated from the laser oscillator 2 after a time corresponding to time t20 after the laser oscillation instruction signal S is turned on. At this time, as described above, the AOM driving signal D remains off, and the dummy laser pulse is emitted from the laser deflection unit 3 in the non-processing direction and is absorbed by the damper 5.

1(a) to (d) are timing charts for explaining the oscillation aspect of the laser pulse L1 in the laser drilling device of FIG. 5, which shows the laser oscillation controller 7 in FIGS. 2-4. It is realized by controlling according to the control flow chart.

1(a) to (d), in order to simplify the description, the waveform of the laser pulse L1 oscillated by the laser oscillator 2 is rectangular, and the galvano operation control signal G and the laser pulse L1 ) is shown, and t10 and t20 in FIG. 6 are set to zero, and the time point at which the positioning operation of the galvano scanner 4 is actually completed completely coincides with the time point predicted by the positioning completion prediction unit 10 I am doing it.

In addition, the same applies to the descriptions of the following drawings of the same type.

In FIG. 5, the positioning completion prediction unit 10 grasps the oscillation time point whenever the laser pulse for processing is oscillated by the laser oscillator 2, and whenever the galvano operation control signal G is turned on and driven, The time T from the starting point of the oscillation of the previously oscillated processing laser pulse to the completion of the positioning operation of the next galvano scanner 4 is calculated based on the information of the position of the next hole given from the galvano control unit 9. (Routine R1 in FIG. 2). In addition, this time T shall include the settling time for perfectly matching the galvanoscanner 4 to the target position.

1(a) shows that the positioning operation completion prediction time point A of the galvano scanner 4 is after T1 from the oscillation start point of the previous processing laser pulse, and the laser oscillator 2 re-oscillates in the shortest way. If T0 is the time to be secured in this case, T1/T0 (=n) < 1, that is, T1 is shorter than time T0 by the time t1.

In this case, the laser oscillator 2 does not oscillate a laser pulse at the predicted positioning operation completion time point (A), but after the time T0 from the previous processing laser pulse, that is, the time t1 from the predicted positioning operation completion time point (A). A laser pulse of a normal pulse width is oscillated for processing from the point of completion of the positioning operation delayed by (Routine R2 in FIG. 2).

In addition, although not shown in FIG. 1, in the case of T1/T0 (= n) = 1, a laser pulse having a normal pulse width is oscillated for processing at the point of completion of the positioning operation (routine R2 in FIG. 2).

In addition, it is assumed that the laser pulse whose pulse width is not described in FIG. 1 (a) is a normal pulse width, and the same applies to the following figures.

1(b) shows that the predicted positioning operation completion point (B) of the galvano scanner 4 is after T2 from the start point of oscillation of the previous laser pulse for processing, 1 < T2/T0 (= n) < 2, that is, T2 is greater than the time of 1 × T0 and shorter than the time of 2 × T0 by the time of t2.

In this case, the laser oscillator 2 first oscillates a laser pulse having a shorter pulse width Td2 than a normal laser pulse after time T0 from the oscillation start point of the previous processing laser pulse as a dummy (routine R3 in FIG. 3), After that, at the point of time B when the positioning operation is completed, a laser pulse having a normal pulse width is oscillated for processing (routine R2 in FIG. 2). Here, the pulse width Td2 of the dummy laser pulse is set to such a length that the duty during this period becomes constant.

In addition, in FIG. 1(b), the dummy pulse is hatched, but the same is applied in the following drawings of the same type.

In addition, although not shown in FIG. 1, when the predicted positioning operation completion point of the galvano scanner 4 is an integer multiple of 2 or more with respect to T0 from the oscillation start point of the previous processing laser pulse, the laser oscillator 2 Every time T0 elapses from the start of oscillation of the laser pulse for processing, a laser pulse with a normal pulse width is oscillated as a dummy pulse until the last T0 remains (routine R4 in FIG. 3), and then the positioning operation is completed. A laser pulse of a normal pulse width is oscillated for processing (routine R2 in FIG. 2).

1(c) shows that the predicted positioning operation completion point (C) of the galvano scanner 4 is after T3 from the oscillation start point of the previous processing laser pulse, T3 = 3 × T0 - t3, that is, T3 is 3 × T0 It is a case that is shorter than the time to be by the time to be t3.

In this case, the laser oscillator 2 first oscillates a laser pulse of a normal pulse width as a dummy after time T0 from the start of oscillation of the previous processing laser pulse (routine R5 in FIG. 4), and then again. A laser pulse with a shorter pulse width Td3 than normal is oscillated for dummy use (routine R3 in FIG. 3), and then, at the positioning operation completion point (C), a laser pulse with a normal pulse width is oscillated for processing (FIG. 3). Routine R2 in 2). Here, the pulse width Td3 of the dummy laser pulse is set to such a length that the duty in this period becomes constant.

1(d) shows that the predicted positioning operation completion point D of the galvano scanner 4 is after T4 from the start point of oscillation of the previous processing laser pulse, T4 = 4×T0−t4, that is, T4 is 4×T0 This is the case when it is earlier than the time of t4 by the time of t4.

In this case, the laser oscillator 2 first oscillates a laser pulse of a normal pulse width as a dummy every time T0 elapses from the oscillation start point of the previous processing laser pulse. That is, a laser pulse with a normal pulse width is oscillated twice as a dummy (routine R5 in FIG. 4), and then, after time T0, a laser pulse with a shorter pulse width Td4 than usual is oscillated as a dummy (Routine R5 in FIG. 3). After the routine R3) in , at the point of completion of the positioning operation (D), a laser pulse having a normal pulse width is oscillated for processing (routine R2 in FIG. 2). Here, the pulse width Td4 of the dummy laser pulse is set to such a length that the duty during this period becomes constant.

As described above, the laser oscillation control unit 7 calculates the time from the start of oscillation of the previous processing laser pulse to the predicted completion of the next positioning operation, T, where n is an integer of 2 or greater, n×T0 > T > (n- 1) If × T0, every time T0 elapses from the start point of the oscillation of the previous processing laser pulse, a laser pulse with a normal pulse width is used as a dummy (n-2) times, followed by a normal laser pulse Laser pulses with shorter pulse widths are oscillated once for dummy use, and at the point of completion of the positioning operation, laser pulses with normal pulse widths are oscillated for processing.

In addition, in the case of T ≤ T0, the dummy laser pulse is not oscillated, and only a laser pulse with a normal pulse width is oscillated for processing after time T0 from the previous laser pulse.

Therefore, in FIGS. 1(a) to (d), although the after the laser pulse of the normal pulse width for the second processing is not shown, it goes without saying that the oscillation of the laser oscillator 2 is controlled according to the above rule. .

According to the above configuration, the laser oscillator 2 basically uses a laser pulse having the same pulse width as the processing laser pulse for a dummy, and repeatedly oscillates the processing and dummy laser pulses at intervals of time T0. Only in the one-time case where T0 cannot be ensured, a laser pulse with a pulse width shorter than that of a normal laser pulse is oscillated as a dummy so that the duty during that period does not change.

Accordingly, the output duty of the laser oscillator 2 can be made constant, the energy received by the laser deflection section 3 can be made constant, and adverse effects due to fluctuations in the action of the thermal lens can be suppressed.

In addition, in the above description, in order to simplify the description, it is assumed that the actual completion time of the positioning operation of the galvano scanner 4 completely coincides with the positioning completion time predicted by the positioning completion prediction unit 10. did Oscillating a laser pulse of a normal pulse width for processing does not have to be at the time when the positioning operation of the galvano scanner 4 is actually completed, and there is a case where the positioning operation is slightly different from the predicted completion time. Therefore, if the oscillation of the laser oscillator 2 is controlled based on the prediction of the positioning operation completion point, there is a risk that the output duty cannot always be set to the theoretical value, but even if it is slightly different, the difference is insignificant, which is a practical problem. There is no, and adverse effects due to variations in thermal lensing action can be suppressed.

Example 2

Next, Example 2 of the present invention will be described. 7 is a block diagram of the laser drilling device of Example 2; The same reference numerals are assigned to the same components as those in FIG. 5 . This laser drilling device is a so-called two-axis laser drilling device that achieves high speed by performing parallel processing at two locations. FIG. 8 is a timing chart for explaining an aspect of oscillation of the laser pulse L1 in the laser drilling apparatus of FIG. 7 .

In FIG. 7 , 1-A and 1-B are printed circuit boards to be processed, respectively. Hereinafter, the system for processing the printed circuit board 1-A is referred to as the A-axis, and the system for processing the printed circuit board 1-B is referred to as the B-axis. 12 is a beam splitter that splits the laser pulse oscillated by the laser oscillator 2 into two directions, and 3-A and 3-B deflect the laser pulse output from the beam splitter 12 from the non-processing direction to the processing direction, respectively. It is an AOM, and the laser deflection parts 3-A and 3-B can receive laser pulses from the laser oscillator 2 at the same time.

4-A and 4-B change the laser irradiation position of the laser pulse deflected in the processing direction in the laser deflection parts 3-A and 3-B, respectively, and according to the processing data, It is a galvanoscanner as an optical scanner that is rotationally driven to irradiate.

A-axis and B-axis constitute one axis group (hereinafter referred to as “axis pair”) capable of simultaneously receiving laser pulses from the laser oscillator 2, and galvanoscanners 4-A and 4-B are laser It constitutes one galvano scanner group capable of simultaneously receiving laser pulses from the deflection sections 3-A and 3-B. When the laser deflection unit 3-A deflects the laser pulse from the beam splitter 12 to the A-axis galvanoscanner 4-A, the laser deflection unit 3-B deflects the beam splitter ( The laser pulse from 12) is deflected by the B-axis galvanoscanner 4-B.

In addition, the ATOM control unit 8 and the galvano control unit 9 are respectively provided for the A-axis system, although only one for the B-axis system is shown to simplify the drawing. In addition, the positioning completion prediction unit 10 can predict the completion point of the positioning operation of each of the galvanoscanners 4-A and 4-B, even if it is installed in each of the galvanoscanners 4-A and 4-B. good night.

In FIG. 7, the A-axis system and the B-axis system are capable of independently performing machining operations in parallel. That is, the galvano scanners 4-A and 4-B each perform a positioning operation based on separate processing data under the control of the corresponding galvano controller 9. Therefore, as shown in FIG. 8, even if the galvano scanners 4-A and 4-B start positioning operations at the same time, it cannot be said that the positioning operation completion points coincide.

According to the present invention, in the case of a system including a plurality of galvanoscanners capable of simultaneously receiving laser pulses from the laser oscillator 2, the positioning operation completion prediction time point at which the completion of the positioning operation is the latest among the galvanoscanners Based on this, the laser pulse from the laser oscillator 2 is oscillated.

For example, as shown in FIG. 8, when the positioning operation completion prediction time point (F) of the galvano scanner 4-A is later than the positioning operation completion time point (E) of the galvano scanner 4-B side , The laser oscillation controller 7 oscillates a laser pulse according to the positioning completion prediction time point F of the galvanoscanner 4-A, which has a late positioning operation completion time.

Furthermore, the predicted positioning operation completion point F here is the case of FIG. 1(d).

The laser oscillation controller 7 in Embodiment 2 is realized by changing and controlling the portion of step 20 in routine R1 in Fig. 2 in the control flow chart in Embodiment 1 as follows.

That is, in the part of step 20, whenever the galvano operation control signal G in each of the galvano scanners 4-A and 4-B is turned on and driven, the corresponding galvano controller 9 Based on the given next hole position information, the positioning completion point of the next galvanoscanners 4-A and 4-B is calculated from the oscillation start point of the previously oscillated processing laser pulse, and the later one is selected and set as T. If both are the same, let it be T.

Example 3

Next, Example 3 of the present invention will be described. 9 is a block diagram of the laser drilling device of Example 3; 5 and 7 will be described with the same reference numerals. Such a laser drilling device is a so-called 4-axis type laser drilling device that achieves high speed by performing parallel processing at four locations. 10 and 11 are timing charts for explaining aspects of laser pulse oscillation in the laser drilling device of FIG. 9 .

In FIG. 9 , 1-C to 1-F are printed circuit boards to be processed. Hereinafter, systems for processing printed circuit boards 1-C to 1-F are referred to as C-axis to F-axis, respectively. 3-CD and 3-EF are AOMs that deflect the laser pulse output from the beam splitter 12 from the non-processing direction to the processing direction, respectively, and the laser deflection units 3-CD and 3-EF are laser deflectors from the laser oscillator 2. Pulses can be received simultaneously. As will be described later, the laser deflecting units 3-CD and 3-EF each have two directions as processing directions.

4-C and 4-D respectively change the laser irradiation position of the laser pulse deflected in the processing direction in the laser deflection unit 3-CD, and rotate to irradiate the printed circuit board 1-C and 1-D perforated positions according to the processing data It is a galvanoscanner as an optical scanner. In addition, 4-E and 4-F change the laser irradiation position of the laser pulse deflected in the processing direction in the laser deflection unit 3-EF, respectively, and irradiate the perforated positions of the printed boards 1-E and 1-F according to the processing data. It is a galvanoscanner as an optical scanner driven by rotation.

The C-axis and E-axis and the D-axis and F-axis constitute one axis group (hereinafter referred to as "axis pair") capable of receiving laser pulses from each laser oscillator 2 simultaneously. That is, galvanoscanners 4-C and 4-E are one-way galvanoscanner group CE, galvanoscanners 4-D and 4-E in which laser deflection units 3-CD and 3-EF can simultaneously receive laser pulses. F constitutes the other galvanoscanner group DF capable of simultaneously receiving laser pulses from the laser deflection sections 3-A and 3-B, respectively.

When the laser deflection section 3-CD deflects the laser pulse from the beam splitter 12 to the C-axis galvanoscanner 4-C, the laser deflection section 3-EF at the same time deflects the laser pulse from the beam splitter 12. The pulse is deflected by the E-axis galvanoscanner 4-E. Although the timing is different from this, when the laser deflection unit 3-CD deflects the laser pulse from the beam splitter 12 to the D-axis galvanoscanner 4-D, the laser deflection unit 3-CD EF deflects the laser pulse from the beam splitter 12 to the F-axis galvanoscanner 4-F.

In addition, although only one ATOM control unit 8 and galvano control unit 9 are shown for each F axis system to simplify the drawing, they are installed in all axis systems. In addition, the positioning completion prediction unit 10 can predict the completion point of each positioning operation of the galvanoscanners 4-C, 4-D, 4-E, and 4-F, and the galvanoscanners 4-C and 4 -D, 4-E and 4-F may be provided respectively.

In Fig. 9, each shaft system can independently and parallelly perform machining operations. That is, each of the galvano scanners 4-C to 4-F performs a positioning operation based on separate processing data under the control of the corresponding galvano controller 9. Therefore, even if the galvanoscanners 4-C to 4-F start positioning operations at the same time, it is common for each positioning completion point to be different.

According to the present invention, in the case of a system including a plurality of galvanoscanner groups capable of simultaneously receiving laser pulses from the laser oscillator 2, positioning of all galvanoscanners belonging to each of the galvanoscanner groups is determined. Laser pulse from the laser oscillator 2 based on the positioning completion prediction time of the galvanoscanner whose positioning operation completes the latest in the galvanoscanner group whose operation is completed most quickly (hereinafter referred to as "the fastest group") oscillates

For example, as shown in FIG. 10, if positioning completion appears in the order of galvanoscanners 4-E, 4-C, 4-D, and 4-F, among the galvanoscanner groups CE and DF, each Based on the time (H) until the positioning completion prediction time of the galvanoscanner 4-C in which the positioning operation in the galvano scanner group CE of which the positioning operation of all belonging galvanoscanners is completed early, the positioning operation is completed late, A laser pulse is oscillated from the laser oscillator 2.

At this time, the laser deflection unit 3-CD is controlled to distribute laser pulses in the processing direction of the C-axis system and the E-axis system of the laser deflection unit 3-EF, respectively, and the printed circuit boards 1-C and 1-E are processed. all.

In addition, the predicted positioning operation completion point (H) here is the case of FIG. 1(d).

In addition, for example, as shown in FIG. 11, if the completion of the positioning operation appears in the order of galvanoscanners 4-D, 4-F, 4-E, 4-C, the galvanoscanner group CE, Among the DFs, the time until the positioning operation completion prediction point of the galvanoscanner 4-F in which the positioning operation of the galvanoscanner group DF of which the positioning operation of all the galvanoscanners belonging to each is completed earlier is completed earlier ( A laser pulse is oscillated from the laser oscillator 2 based on N).

At this time, the laser deflection unit 3-CD is controlled to distribute laser pulses in the processing direction of the D-axis system, and the laser deflection unit 3-EF is controlled to distribute laser pulses in the processing direction of the F-axis system. all.

Furthermore, the predicted positioning operation completion point N here is the case of FIG. 1(d).

According to the present invention, after the oscillation of the processing laser pulse toward the galvanoscanner, which has become the fastest group by the above, it becomes as follows.

The positioning completion prediction time of all galvanoscanners belonging to the galvanoscanner group that became the fastest group this time is newly predicted based on the oscillation start point of the laser pulse for processing this time, and at the same time, The prediction point of completion of the positioning operation of all the galvanoscanners belonging to the galvanoscanner group is newly predicted again.

In addition, by comparing the positioning operation completion prediction time, the time until the positioning operation completion prediction time of the galvano scanner whose positioning operation is completed late among all the galvanoscanners belonging to the galvanoscanner group that is newly the fastest group Based on this, the laser oscillator 2 oscillates a laser pulse.

For example, shown on the right side of FIG. 10, positioning of galvanoscanners 4-C and 4-E belonging to the galvanoscanner group CE, which became the fastest group based on the oscillation start point of the laser pulse for processing this time Operation completion prediction time TC-S, TE-S are newly predicted, and positioning operation completion prediction time TD- of galvanoscanners 4-D and 4-F belonging to the galvanoscanner group DF that did not become the fastest group S and TF-S are respectively predicted again.

The galvanoscanner that became the fastest group Before the lapse of time T0 from the oscillation start point of the laser pulse for processing that is oscillated based on the completion of the positioning operation of the galvanoscanner 4-C belonging to the group CE, the galvanometer that did not become the fastest group When the galvano scanners 4-D and 4-F belonging to the scanner group DF complete the positioning operation together, the case of FIG. 1 (a) becomes the case, and at the time T0 elapses, the laser pulse for processing is directed toward the galvano scanner group DF oscillates

Also, for example, shown on the right side of FIG. 11, the positions of galvanoscanners 4-D and 4-F belonging to the galvanoscanner group DF, which became the fastest group based on the oscillation start point of the current laser pulse for processing Positioning operation completion prediction time point TC of galvanoscanners 4-C and 4-E belonging to the galvanoscanner group CE that newly predicted TD-S and TF-S and did not become the fastest group -S, TE- Predict S again, respectively.

At the lapse of time T0 from the start of oscillation of the laser pulse for processing that is oscillated based on the completion of the positioning operation of the galvanoscanner 4-F belonging to the galvanoscanner group DF, which has become the fastest group, in any galvanoscanner group, If the galvano scanners to which they belong do not complete the positioning operation together, it becomes the case of any one of FIGS. 1(b) to (d), and a laser pulse for a dummy with a normal or shorter pulse width is oscillated.

Note that the dummy laser pulse in this case is referred to as a dummy laser pulse having a normal pulse width in which the pulse width is not described in FIG. 11 .

The laser oscillation controller 7 of the third embodiment is realized by changing and controlling the part of step 20 in the routine R1 in FIG. 2 in the control flow chart of the first embodiment as follows.

That is, in the part of step 20, each time the galvano operation control signals G of the galvano scanners 4-C, 4-D, 4-E, and 4-F are turned on and driven, each corresponding Positioning of the next galvano scanners 4-C, 4-D, 4-E, 4-FB from the start point of the oscillation of the laser pulse for processing previously oscillated by the information of the next hole position given from the galvano control unit 9 By calculating the operation completion time point, the positioning operation completion time point of the galvano scanner that completes the positioning operation late among the fastest groups is selected and set to T.

In addition, if all the positioning operation completion points of the galvano scanners in the fastest group are the same, it is sufficient to set it to T. In addition, if all the fastest groups are the same, the positioning operation completion time of the galvano scanner that completes the positioning operation late in one fastest group according to a predetermined priority is selected and set to T.

According to the above embodiments 2 and 3, a plurality of optical scanners are provided for changing the laser irradiation position of the laser pulses from the laser oscillators distributed in the processing direction, and processing of each of a plurality of printed boards or a predetermined Even in a so-called multi-axis laser processing device that achieves high-speed processing by parallelly processing a plurality of locations spaced apart from each other, the output duty of the laser oscillator becomes constant, and the energy received by the AOM can be made constant, so that the thermal lens The adverse effects caused by the action can be suppressed.

In the above embodiment, t10 and t20 in FIG. 6 were set to 0 and explained. However, as already described, in practice, a time delay of t10 + t20 occurs from when the galvano operation control signal G is turned off until the laser pulse for processing is oscillated in the laser oscillator 2.

12 is a timing chart when processing laser pulses are oscillated from a laser oscillator in a laser drilling device according to another embodiment of the present invention, but considering the time delay in FIGS. The control sequence shown in Fig. 6 may be started early without waiting for the point at which the positioning operation of the scanner is expected to be completed, thereby making it possible to speed up the machining operation.

12, the laser oscillation control unit 7 sends the laser oscillation instruction signal S to the laser oscillator ( 2) is output. In the laser oscillator 2, the laser pulse L1 is output after time t60 after the laser oscillation instruction signal S is turned on, and the AOM driving signal D is turned on for a predetermined time after time t70. A laser pulse (L2) deflected in the processing direction from AOM3 is incident on the galvano scanner (4). Thereafter, the galvano operation control signal G is turned on after a predetermined time t80 from the off of the laser oscillation instruction signal S, and the galvano scanner 4 is rotated to irradiate the next hole position.

In addition, although it is a predetermined time t50, it is necessary to set it shorter than the time t70 from when the laser oscillation instruction signal S turns on to when the AOM drive signal D turns on. Otherwise, the laser pulse L2 is output before the galvano scanner 4 completes the positioning operation, resulting in poor operation.

Also, in the above embodiment, the case of drilling a printed board has been described, but the present invention is not limited to this, and can provide laser processing in which a plurality of parts of a workpiece are sequentially processed.

Although the present invention has been specifically described based on the above embodiments, the present invention is not limited to the above embodiments, and various modifications are possible as well as various modifications are included without departing from the gist of the present invention.

1, 1-A, 1-B, 1-C to 1-F: printed board, 2: laser oscillator,
3, 3-A, 3-B, 3-CD ~ 3-EF: laser deflection part,
4, 4-A, 4-B, 4-C ~ 4-F : Galvanoscanner
5: damper 6: overall control unit
7: laser emission control unit 8: AOM control unit
9: Galvano control unit 10: Positioning completion prediction unit
11: program storage unit 12: beam splitter
S: laser oscillation instruction signal, G: galvano operation control signal
D: AOM drive signal L1 ~ L3: laser pulse
R1 ~ R5: Routine

Claims (8)

A laser oscillator that oscillates laser pulses, an optical scanner into which the laser pulses are incident through an optical element, and an optical scanner that is driven to irradiate the processing position on the workpiece according to processing data, and oscillation of the laser pulses by the laser oscillator In the laser processing apparatus having a laser emission control unit for oscillating a laser pulse for processing in synchronization with the completion of a positioning operation in the optical scanner as a laser emission control unit for controlling the optical scanner, the optical scanner is newly driven. a positioning completion prediction unit for predicting the completion point of the positioning operation in the optical scanner based on the oscillation point of the laser pulse for processing each time, and the laser oscillation controller predicts the completion of the positioning operation from the oscillation point When the time T to the point in time is n×T0 > T > (n-1)×T0 (T0 is a predetermined time and n is an integer greater than or equal to 2), the first laser pulse having the same pulse width as the processing laser pulse n-2 times , and then a second laser pulse having a shorter pulse width than the processing laser pulse once, every time the predetermined time T0 elapses from the time from the oscillation time to the predicted positioning operation completion time Each laser oscillator oscillates as a dummy pulse, and the second laser pulse has a pulse width for adjusting a duty until the subsequent processing laser pulse is oscillated. Device.
The method of claim 1, wherein the laser pulse from the optical device is incident on a plurality of the optical scanners at the same time, and the laser oscillation control unit determines the time at which the predicted positioning operation completion point is the latest among the plurality of optical scanners. Laser processing apparatus, characterized in that for controlling to the T.
The method of claim 1, wherein a plurality of the optical scanners form an optical scanner group to which the laser pulses are simultaneously incident from the optical element, and a plurality of corresponding optical scanner groups are installed, and the laser oscillation control unit comprises: among the plurality of optical scanner groups Based on the positioning completion prediction time of the optical scanner of which the positioning operation completion prediction time of all the optical scanners belonging to each of the optical scanner groups is the latest among the optical scanner groups of which the positioning operation completion prediction time is the earliest, A laser processing apparatus characterized in that the time is controlled by the above T.
The laser processing apparatus according to any one of claims 1 to 3, wherein the predetermined time T0 is a time to be secured when the laser oscillator re-oscillates in the shortest time.
4. The laser processing apparatus according to any one of claims 1 to 3, wherein the laser oscillation controller instructs the laser oscillator to oscillate the laser pulses before a time point at which the positioning operation is predicted to be completed.
5. The laser processing apparatus according to claim 4, wherein the laser oscillation control unit instructs the laser oscillator to oscillate the laser pulses before a time point at which the positioning operation is predicted to be completed.
A laser pulse oscillated by a laser oscillator is incident through an optical element to an optical scanner driven to irradiate a processing position on a workpiece according to processing data through an optical element, and synchronized with the completion of the positioning operation of the optical scanner, the laser oscillator In a laser processing method in which laser pulses for processing are oscillated, whenever the optical scanner is newly driven, the timing at which the positioning operation of the optical scanner is completed is predicted based on the oscillation time of the laser pulses for processing, When the time T from the oscillation point to the predicted positioning operation completion point is n×T0 > T > (n-1)×T0 (T0 is a predetermined time and n is an integer greater than or equal to 2), the processing laser The first laser pulse having the same pulse width as the pulse is n-2 times , followed by the second laser pulse having a shorter pulse width than the processing laser pulse once, in the time from the oscillation time to the predicted positioning operation completion time. Each time a predetermined time (T0) elapses, the laser oscillator oscillates as a dummy pulse, and the second laser pulse has a pulse width for adjusting the duty until the subsequent laser pulse for processing is oscillated. laser processing method.
A laser pulse oscillated by a laser oscillator is incident through an optical element to an optical scanner that is driven to irradiate the processing position on a workpiece according to processing data through an optical element, and the laser pulse for processing is transmitted to the laser oscillator in synchronization with the completion of the positioning operation of the optical scanner. In the recording medium recording a program for a laser processing method to oscillate, the program completes the positioning operation of the optical scanner based on the oscillation time of the laser pulse for processing whenever the optical scanner is newly driven. is predicted, and the time T from the oscillation time to the predicted positioning operation completion time is n × T0 > T > (n- 1) × T0 (T0 is a predetermined time, n is an integer greater than or equal to 2) In this case, the first laser pulse having the same pulse width as the processing laser pulse is applied n-2 times, followed by the second laser pulse having a shorter pulse width than the processing laser pulse once, predicting the completion of the positioning operation from the oscillation time. The laser oscillator oscillates as a dummy pulse each time the predetermined time T0 elapses from the time until the point in time, and the second laser pulse is a pulse for adjusting the duty until the subsequent laser pulse for processing is oscillated. A recording medium recording a program for a laser processing method, characterized in that for controlling the oscillation of the laser oscillator to have a width.

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