KR102495522B1 - Pulse sensing module and system for calculating blood pressure using the same - Google Patents

Abstract

A pulse sensing module for calculating blood pressure according to the present invention includes a piezoelectric layer including a piezoelectric material for generating a piezoelectric effect by a pulse - a first electrode line and a second electrode line disposed spaced apart from each other on one side of the piezoelectric layer. - is formed; a support layer that supports the piezoelectric layer and allows the piezoelectric material to grow in an intended direction during the process of forming the piezoelectric layer with the piezoelectric material; and a polymer layer in which at least a portion of the support layer is removed by back etching and filled in the provided space to ensure flexibility.

Description

Pulse sensing module and system for calculating blood pressure using the same

The present invention relates to a pulse sensing module and a system for calculating blood pressure using the same, and more particularly, to a pulse sensing module capable of calculating blood pressure by a piezoelectric effect through a piezoelectric material and for calculating blood pressure using the same. It's about the system.

BACKGROUND OF THE INVENTION [0002] In recent years, as living standards and health awareness have increased, interest in and demand for health examinations are increasing.

In general, blood pressure, pulse wave, electrocardiogram, and body fat are measured for basic medical treatment during a health checkup and used as basic data.

To this end, each clinic is equipped with a sphygmomanometer for measuring blood pressure, an electrocardiogram measuring device for measuring electrocardiogram, a body fat measuring device for measuring body fat, a pressure pulse meter for measuring pulse waves, and a volume pulse meter for measuring blood flow. .

As disclosed in Korean Patent Registration No. 10-1059528, a blood pressure monitor for measuring blood pressure is a method in which a compression part in the form of an armband is wrapped around the upper arm of a test subject, and then tightened and measured according to the circumference of the upper arm.

However, this type of blood pressure measurement caused inconvenience in that the testee had to tighten the compression part in the form of an armband with one hand when measuring the blood pressure by himself.

In addition, recently, a blood pressure measuring device is used in which the space into which the upper arm is inserted is fixedly formed in a circular shape, and when the examinee inserts the upper arm into the circular space and presses a button, the cuff automatically inflates and tightens the upper arm. there is.

However, since this blood pressure measurement device requires the upper arm to be inserted into the circular space, the distance the test subject's arm must be moved increases, causing discomfort. Since the arm must be inserted by moving the entire body, this also has a problem of inconvenient measurement.

In order to solve the above problem, a method for calculating blood pressure using a piezoelectric element has been developed as disclosed in Korean Patent Publication No. 10-2020-0057249, but it is unsuitable for mass production in terms of a transfer process. there is a problem.

Therefore, there is an urgent need to develop a blood pressure measuring device that minimizes the discomfort of the examinee in measuring blood pressure, accurately measures it in a simple way, and increases productivity.

An object of the present invention is a pulse sensing module for enabling blood pressure calculation through the piezoelectric effect of a piezoelectric material on the pulse and at the same time clearly defining the relationship between a voltage signal and blood pressure due to the piezoelectric effect to improve the accuracy of blood pressure calculation, and the same. It is to provide a system for calculating blood pressure using

A pulse sensing module for calculating blood pressure according to the present invention includes a piezoelectric layer including a piezoelectric material for generating a piezoelectric effect by a pulse - a first electrode line and a second electrode line disposed spaced apart from each other on one side of the piezoelectric layer. - is formed; a support layer that supports the piezoelectric layer and allows the piezoelectric material to grow in an intended direction during the process of forming the piezoelectric layer with the piezoelectric material; and a polymer layer in which at least a portion of the support layer is removed by back etching and filled in the provided space to ensure flexibility and stability.

The pulse sensing module for calculating blood pressure according to the present invention is applied to the piezoelectric layer to protect the piezoelectric layer, so that the first electrode terminal of the first electrode line and the second electrode terminal of the second electrode line are exposed. It may be characterized by further comprising; a protective layer having an opening.

The support layer of the pulse sensing module for calculating blood pressure according to the present invention includes a substrate layer, an oxide layer laminated on the substrate layer and defining a limit of the back etching during the back etching process, and a piezoelectric layer laminated on the oxide layer. In the process of forming the piezoelectric layer with a material, it may be characterized in that it includes a crystal layer that allows the piezoelectric material to grow in an intended direction.

The substrate layer of the pulse sensing module for calculating blood pressure according to the present invention includes silicon (Si), silicon on insulator (SOI), It may be characterized in that it is made of at least one of quartz (SiO2), sapphire (Al2O3), germanium (Ge), gallium arsenide (GaAs), and stainless steel.

The thickness of the substrate layer of the pulse sensing module for calculating blood pressure according to the present invention may be reduced by a polishing process before the back etching process so that the thickness is within a possible range of the back etching. .

The space removed and provided by the back etching of the pulse sensing module for calculating blood pressure according to the present invention is formed in a circular or pentagonal or more polygonal shape to reduce stress and cracks applied during the back etching process. The polymer layer may be characterized in that it is filled in the space provided in the circular or pentagonal or more polygonal shape.

The first electrode line and the second electrode line of the pulse sensing module for calculating blood pressure according to the present invention are located inside one side of the provided space removed by the back etching, which may occur during the back etching process. It may be characterized in that it is not affected by cracks.

The polymer layer of the pulse sensing module for calculating blood pressure according to the present invention may be characterized in that it is partitioned into a plurality of regions by a support layer that is removed by the back etching and remains within a range of the provided space.

In the pulse sensing module for calculating blood pressure according to the present invention, deformation of at least one of the first electrode line, the second electrode line, the piezoelectric layer, the protective layer, and the support layer is prevented during the back etching process, It may further include a deformation preventing portion attached to one surface of the protective layer so as to surround the first electrode line and the second electrode line, and the deformation preventing portion may be removed after the polymer layer is formed. .

A blood pressure calculation system for calculating blood pressure using a pulse sensing module according to the present invention includes a pulse sensing module; and a blood pressure calculation module configured to calculate a systolic blood pressure and a diastolic blood pressure of a user using a voltage signal generated by the piezoelectric effect, wherein the blood pressure calculation module filters noise of the voltage signal generated by the piezoelectric effect. A relational expression is derived based on the first voltage signal filtered by the signal processing unit and the standard systolic blood pressure and standard diastolic blood pressure obtained through the blood pressure monitor, and the systolic blood pressure and It may be characterized in that it includes a control unit that calculates the diastolic blood pressure.

The relational expression of the blood pressure calculation system for calculating blood pressure using the pulse sensing module according to the present invention may satisfy Conditional Expression 1 and Conditional Expression 2 below.

<conditional expression 1>

Y1 = A * X1 + B

<conditional expression 2>

Y2 = A * X2 + B

Here, Y1 is the reference systolic blood pressure (P _systolic ) obtained through the blood pressure monitor, Y2 is the reference diastolic blood pressure (P _diastolic ) obtained through the blood pressure monitor, and X1 is the maximum voltage average value for the first voltage signal (V _Max , _Avg ), X2 is the minimum voltage average value (V _Min , _Avg ) for the first voltage signal, and A and B are constants.

The controller of the blood pressure calculation system for calculating blood pressure using the pulse sensing module according to the present invention derives A and B through Conditional Expression 1 and Conditional Expression 2, and then calculates the blood pressure through Conditional Expression 3 and Conditional Expression 4 below. It may be characterized in that the systolic blood pressure (Y3) and the diastolic blood pressure (Y4) are calculated for the second voltage signal.

<conditional expression 3>

Y3 = A * X3 + B

<conditional expression 4>

Y4 = A * X4 + B

Here, X3 is the maximum voltage average value (V _Max , _Avg ) for the second voltage signal, and X4 is the minimum voltage average value (V _Min , _Avg ) for the second voltage signal.

According to the pulse sensing module and the system for calculating blood pressure using the same according to the present invention, blood pressure can be measured through the piezoelectric effect of the piezoelectric material on the pulse, thereby providing convenience to the subject.

In addition, the accuracy of blood pressure measurement can be improved by clearly defining the relationship between the voltage signal due to the piezoelectric effect and the blood pressure.

In addition, due to the omission of the transfer process during manufacturing, mass production is possible and productivity can be maximized.

1 is a view for explaining a pulse sensing module according to the present invention.
Figure 2 is a flow chart for explaining a manufacturing method of the pulse sensing module according to the present invention.
3 to 12 are views for explaining a manufacturing method of the pulse sensing module according to the present invention.
13 and 14 are views for explaining a modified example of the polymer layer of the pulse sensing module according to the present invention.
15 is a view for explaining a deformed arrangement state of electrode lines of the pulse sensing module according to the present invention.
16 is a block diagram illustrating a system for calculating blood pressure using a pulse sensing module according to the present invention.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings. However, the spirit of the present invention is not limited to the presented embodiments, and those skilled in the art who understand the spirit of the present invention may add, change, delete, etc. other elements within the scope of the same spirit, through other degenerative inventions or the present invention. Other embodiments included within the scope of the inventive idea can be easily proposed, but it will also be said to be included within the scope of the inventive concept.

In addition, components having the same function within the scope of the same idea appearing in the drawings of each embodiment are described using the same reference numerals.

1 is a diagram for explaining a pulse sensing module according to the present invention.

Referring to FIG. 1 , a pulse sensing module 100 according to the present invention is a module for calculating blood pressure by generating a voltage signal due to mechanical pressure caused by a pulse, and includes a piezoelectric layer 110, a protective layer 120, and a support layer. (130) and a polymer layer (140).

The piezoelectric layer 110 may be a layer made of a piezoelectric material for generating a piezoelectric effect by a pulse, and may be formed to a thickness of about 1 μm.

The piezoelectric material may be a material including perovskite, a ceramic material having a wurtzite structure, or a polymer material having a piezoelectric effect, but is not necessarily limited thereto and may implement a piezoelectric effect. Any material that exists can be applied.

A first electrode line 150 and a second electrode line 160 spaced apart from each other may be formed in a pattern on one surface of the piezoelectric layer 110 .

The protective layer 120 is applied to the piezoelectric layer 110 to protect the piezoelectric layer 110, and the first electrode terminal 152 of the first electrode line 150 and the second electrode It may include openings 121 and 122 through which the second electrode terminal 162 of the line 160 is exposed.

The openings 121 and 122 may enable a poling process of applying a high voltage to the first electrode line 150 and the second electrode line 160 to improve the polarity of the piezoelectric material. The electrode terminal 152 and the second electrode terminal 162 may be electrically connected to a blood pressure calculation module 200 (see FIG. 16) to be described later.

The protective layer 120 may be formed of epoxy that can be cured by ultraviolet (UV) light, for example, SU-8-based negative composed of Bisphenol A Novolacs (phenol-formaldehyde)-based Expoy. It can be photoresist.

The protective layer 120 surrounds an area other than the first electrode terminal 152 exposed through the first opening 121 among the entire areas of the first electrode line 150, and the second electrode line ( 160) may surround an area other than the second electrode terminal 162 exposed through the second opening 122.

On the other hand, in the pulse sensing module 100 according to the present invention, the protective layer 120 has problems in measuring the voltage signal due to the pulse even when the first electrode line 150 and the second electrode line 160 are exposed. If there is no , it may be a component that can be omitted.

The support layer 130 may be a layer that supports the piezoelectric layer 110 and allows the piezoelectric material to grow in an intended direction during the process of forming the piezoelectric layer 110 with the piezoelectric material.

The support layer 130 is made of silicon (Si), silicon on insulator (SOI), or quartz (SiO ₂ ) so that thermal damage or physical damage is minimized in the process of forming the piezoelectric layer by a heat treatment process. , sapphire (Al ₂ O ₃ ), germanium (Ge), gallium arsenide (GaAs), and a substrate layer 132 made of at least one material of stainless steel, laminated on the substrate layer 132, and the back etching process In the process of forming the oxide layer 134, which defines the limits of the back etching, and the piezoelectric layer 110 stacked on the oxide layer 134 and made of the piezoelectric material, the piezoelectric material is grown in an intended direction. A crystal layer 136 may be included.

Here, the support layer 130 may be implemented by stacking each layer of the substrate layer 132, the oxide layer 134, and the crystal layer 136, but is not necessarily limited thereto. It may be implemented as a layer of

In other words, the support layer 130 may be implemented as a single layer capable of performing all of the functions of the substrate layer 132, the function of the oxide layer 134, and the function of the crystal layer 136, , In this case, the support layer 130 may be formed of Al ₂ O ₃ -based sapphire, MgO, STO (SrTiO ₃ ), BTO (BaTiO ₃ ), LNO (LaNiO ₃ ), PTO (PbTiO ₃ ), or the like. .

The polymer layer 140 may be a layer that secures flexibility and stability by filling the space S provided by removing at least a portion of the support layer 130 by back etching.

The pulse sensing module 100 according to the present invention is implemented in a patch type or a band type and can be attached to a place where a pulse can be sensed. Even when the place to be attached is a curved skin surface, the polymer layer having flexibility and flexibility ( 140), it can adhere to the curved skin surface.

Hereinafter, an optimal manufacturing method of the pulse sensing module 100 as described above will be described.

2 is a flow chart for explaining a manufacturing method of the pulse sensing module according to the present invention, and FIGS. 3 to 12 are diagrams for explaining a manufacturing method for the pulse sensing module according to the present invention.

Referring to FIG. 2, the manufacturing method of the pulse sensing module 100 according to the present invention includes a first step of forming a support layer 130 (S10), a piezoelectric layer 110 made of a piezoelectric material on one surface of the support layer 130 A second step of forming (S20), a third step of performing a polishing process such that the thickness of the support layer 130 is reduced (S30), and a first electrode line ( 150) and a fourth step (S40) of forming the second electrode line 160, and a fifth step of forming a protective layer 120 protecting the first electrode line 150 and the second electrode line 160. Step S50, a sixth step of attaching a deformation preventing part 170 to one surface of the protective layer 120 to prevent deformation during a post process (back etching process) (S60), a back etching process is performed A seventh step (S70), an eighth step of forming the polymer layer 140 (S80), and a ninth step of removing the deformation preventing portion 170 (S90) may be included.

Hereinafter, each step will be described in detail with reference to FIGS. 3 to 12, and for convenience of explanation, the cross-sectional view is taken along line AA of FIG. 1 and is somewhat exaggerated.

A first step (S10) of forming the support layer 130 to manufacture the pulse sensing module 100 may proceed.

The support layer 130 minimizes damage due to thermal shock during at least one heat treatment process necessary in the process of forming the piezoelectric layer 110 or minimizes damage due to physical shock generated during the process, and is implemented as a crystalline material. It should be implemented as a layer that minimizes thermal damage by including at least some of the layers so that the piezoelectric material grows in the intended direction and at the same time minimizes the difference in the degree of thermal expansion with the piezoelectric layer 110 .

To this end, the support layer 130, as described with reference to FIG. 1, is Al ₂ O ₃ based sapphire, MgO, STO (SrTiO ₃ ), BTO (BaTiO ₃ ), LNO (LaNiO ₃ ), PTO (PbTiO ₃ ), etc. It can be implemented as one layer formed of the material of.

Also, as shown in FIG. 3 , the support layer 130 may be implemented by stacking each of the substrate layer 132 , the oxide layer 134 , and the crystal layer 136 .

The substrate layer 132 may be made of a material to prevent damage due to thermal shock in a heat treatment process required at least once in the process of forming the piezoelectric layer 110 or to prevent damage due to physical shock generated during the process, , preferably formed of a crystalline material.

For example, the substrate layer 132 may include silicon (Si), silicon on insulator (SOI), quartz (SiO ₂ ), sapphire (Al ₂ O ₃ ), germanium (Ge), and gallium arsenide. It may be made of at least one of (GaAs) and stainless steel, and may have a thickness of about 650 μm.

At least a portion of the substrate layer 132 may be removed during the seventh step (S70) in which back etching is performed, and the space (S, see FIG. 10) provided after being removed is filled with polymer to ensure flexibility and stability. can be made

The oxide layer 134 is stacked (deposited) on the substrate layer 132 and an etch stop layer for preventing damage to the piezoelectric layer 110 by defining a limit of the back etching during a back etching process function can be performed.

The oxide layer 134 may be formed of at least one of SiO ₂ , SiON, ZnO, TiOx, Al ₂ O ₃ , SnO ₂ , In ₂ O ₃ and IGZO (Indium Gallium Zinc Oxide), and has a thickness of about It may be 800 nm.

The crystal layer 136 may be a layer that is deposited (deposited) on the oxide layer 134 and allows the piezoelectric material to grow in an intended direction during the process of forming the piezoelectric layer 110 with the piezoelectric material.

The crystal layer 136 is made of Pt, Ti, Sapphire (Al ₂ O ₃ ), MgO, STO (SrTiO ₃ ), BTO ( BaTiO ₃ ), LNO (LaNiO ₃ ), and PTO (PbTiO ₃ ) may be formed of at least one material, and the thickness may be approximately 115 nm.

When the first step (S10) of forming the substrate layer 132, the oxide layer 134, and the crystal layer 136 is completed as described above, as shown in FIG. 4, a piezoelectric material is grown to form a piezoelectric layer 110. A second step (S20) of forming may proceed.

As described with reference to FIG. 1 , the piezoelectric material may be a material such as lead zirconate titanate (PZT), but is not necessarily limited thereto.

The second step (S20) of forming the piezoelectric layer 110, which is a piezoelectric thin film, using the piezoelectric material may be performed by various known methods, for example, DC/RF sputtering, aerosol deposition, and sol-gel solution It may be one of deposition methods such as process (heat treatment after spin coating) and screen/inkjet printing.

Here, when the piezoelectric layer 110 is formed by the sol-gel solution process, in order to remove organic components from the sol-gel solution thin film, a 0.4M PZT sol-gel solution (52:48 of 10 mol% PbO) A molar ratio of Zr:Ti) was spin-cast onto the wafer at 2500 rpm with a pyrolysis process in an air atmosphere at 450 °C for 10 min.

The deposition and thermal decomposition steps may be repeated several times to form the piezoelectric layer 110 having a thickness of approximately 1 μm, and crystallization of the piezoelectric material may be performed in air at 650° C. for 45 minutes. Rapid thermal annealing (RTA) may be used for the pyrolysis and crystallization process.

When the formation of the piezoelectric layer 110 is completed as described above, as shown in FIG. 5 , a third step (S30) in which a polishing process is performed to reduce the thickness of the substrate layer 132 of the support layer 130 is performed. can

The substrate layer 132 has a thickness of about 650 μm in order to prevent damage due to thermal shock in the heat treatment process required at least once in the process of forming the piezoelectric layer 110 or to prevent damage due to physical shock generated during the process. On the other hand, it is necessary to reduce the thickness in consideration of the specificity of the back etching process prior to the back etching process.

In the back etching process, there is a range within which the etching effect can be implemented, and if the substrate layer 132 has a thickness of about 650 μm, it is difficult to achieve the desired effect of etching, so that the third step (S30) ) through which the polishing process is performed so that the thickness of the substrate layer 132 becomes approximately 350 μm.

However, it should be noted that the third step (S30) is not necessarily an essential step and may be omitted depending on the type and thickness of the material of the substrate layer 132.

When the third step (S30) meaning the polishing process is completed as described above, as shown in FIGS. A fourth step (S40) of forming the two electrode lines 160 may proceed.

The first electrode line 150 and the second electrode line 160 may be performed through a normal semiconductor process such as sputtering or a PVD process, and may also be stacked according to a normal metal coating method.

The first electrode line 150 and the second electrode line 160 may be implemented as an Au/Cr electrode layer, and may have a thickness of approximately 115 nm.

When the stacking of the first electrode line 150 and the second electrode line 160 is completed as described above, a fifth step (S50) of forming the protective layer 120 may proceed as shown in FIG. 8 .

The protective layer 120 is applied to the piezoelectric layer 110 to protect the piezoelectric layer 110, but the first electrode terminal 152 of the first electrode line 150 and the second electrode line 160 It may be provided with openings 121 and 122 through which the second electrode terminal 162 is exposed.

As described with reference to FIG. 1, the protective layer 120 may be implemented with an epoxy that can be cured by ultraviolet (UV) light, for example, Bisphenol A Novolacs (phenol-formaldehyde)-based Expoy It may be a negative photoresist of the SU-8 series composed of.

The protective layer 120 is coated with photoresist, masked with a photomask, and then exposed and developed to form openings 121 and 122 through which the first electrode terminal 152 and the second electrode terminal 162 are exposed. can be provided

Here, the exposed first electrode terminal 152 and the second electrode terminal 162 can enable a polling process to be performed in a later step, and a blood pressure calculation module for measuring blood pressure (200, see FIG. 16) It can be used as a component for electrical connection with

The protective layer 120 may be approximately 2 μm.

When the lamination of the protective layer 120 is completed as described above, as shown in FIG. 9 , the first electrode line 150, the second electrode line 160, The first electrode line 150 and the second electrode line 160 are surrounded to prevent deformation of at least one of the piezoelectric layer 110, the protective layer 120, and the support layer 130. A sixth step (S60) of attaching the deformation preventing portion 170 to one surface of the layer 120 may proceed.

The deformation preventing portion 170 is a type of polymer layer, and for example, various types of tape such as thermal release or a polymer layer such as thick photo resist may be applied, and the adhesive strength may be weakened when heat is applied. there is.

After attaching the deformation preventing part 170 as described above, as shown in FIG. 10 , a seventh step ( S70 ) of performing back etching may be performed.

At least a portion of the substrate layer 132 may be removed by the back etching to provide a space S having a predetermined size, and the back etching may be performed on the back surface of the substrate layer 132 through a bosch process.

The above process is a deep reactive-ion etching (DRIE) process, and the space S may be formed in a circular or polygonal shape through the process.

On the other hand, when the back etching proceeds, the oxide layer 134 constituting the support layer 130 defines the limit of etching, in other words, functions as an etching stop layer to prevent damage to the piezoelectric layer 110 in advance can do.

When the space S is formed by the back etching process, as shown in FIG. 11 , an eighth step (S80) of forming a polymer layer 140 by filling the space S with a polymer may proceed. .

The polymer for implementing the polymer layer 140 is not particularly limited, and any material may be applied as long as the pulse sensing module 100 according to the present invention has flexibility and stability.

When the polymer layer 140 is formed as described above, a ninth step ( S90 ) of removing the deformation preventing portion 170 may proceed as shown in FIG. 12 .

Removal of the deformation preventing portion 170 may proceed through a process of applying heat.

After the first step (S10) to the ninth step (S90) are performed as described above, the first electrode terminal 152 and the second electrode terminal 162 are exposed through the openings 121 and 122, and then Additional processes such as electrical connection with the blood pressure calculation module 200 and external coating may be performed.

13 and 14 are views for explaining a modified example of the polymer layer of the pulse sensing module according to the present invention.

The space S provided by the seventh step S70 in which the back etching is performed with reference to FIG. 10 may be formed in a circular shape or a polygonal shape of pentagon or more to reduce stress and cracks applied during the back etching process. .

Due to this, the polymer layer 140 formed by filling the space S may also be formed in a circular shape or a pentagonal or more polygonal shape.

As shown in FIG. 13 , the space S may be formed in an octagonal shape, for example, and thus the polymer layer 140 may also be formed in an octagonal shape.

Meanwhile, the space S provided by the back etching process may have a shape as shown in FIG. 14 .

Here, the polymer layer 140 may be partitioned into a plurality of regions by the substrate layer 133 of the support layer 130 remaining within the range of the space S provided after being removed by the back etching.

The substrate layer 133 remaining within the range of the space S may function as a partition wall based on the polymer layer 140, and due to this, stress concentration that may occur at the boundary to be etched during back etching may cause Cracks can be avoided as much as possible.

15 is a view for explaining a deformed arrangement state of electrode lines of the pulse sensing module according to the present invention.

Referring to FIG. 15 , the space provided by removing the first electrode line 150 and the second electrode line 160 formed by the fourth step S40 described with reference to FIGS. 6 and 7 by back etching. Located inside one side of (S), it can be prevented from being affected by cracks that may occur during the back etching process.

Here, the inside of one side of the space S provided by being removed by the back etching refers to, as shown in FIG. 15 (b), when viewing the pulse sensing module 100 according to the present invention from the top, the One surface defining the space S, that is, a region corresponding to the inside of the boundary B to be etched. B), in the case of the first electrode line 150 and the second electrode line 160 described with reference to FIGS. 6 and 7, the first electrode terminal 152 and the second electrode terminal 162 are etched If cracks are generated at the boundary to be etched because it is located on the upper part of the remaining substrate layer 132 without being etched, a problem in which the electrode line is disconnected may occur.

For this reason, in this embodiment, as shown in FIG. 15, the first electrode line 150 and the second electrode line 160 are etched by positioning them inside one side of the provided space S removed by back etching. Even if a crack occurs at the boundary B, damage to the electrode can be prevented in advance.

16 is a block diagram illustrating a system for calculating blood pressure using a pulse sensing module according to the present invention.

Referring to FIG. 16, a system 10 for calculating blood pressure using a pulse sensing module uses the pulse sensing module 100 described with reference to FIGS. 1 to 15 and a voltage signal generated by the piezoelectric effect to allow a user to It may include a blood pressure calculation module 200 that calculates systolic blood pressure and diastolic blood pressure of .

Here, the blood pressure calculation module 200 includes a signal processing unit 210 for filtering noise of the voltage signal generated by the piezoelectric effect, and a first voltage signal filtered by the signal processing unit 210 and a blood pressure monitor (for example, the upper arm). A control unit 220 that derives a relational expression based on the standard systolic blood pressure and standard diastolic blood pressure obtained through a blood pressure monitor) and calculates the systolic blood pressure and the diastolic blood pressure for the second voltage signal based on the relational expression.

Here, the relational expression may be an expression that satisfies Conditional Expression 1 and Conditional Expression 2 below.

<conditional expression 1>

Y1 = A * X1 + B

<conditional expression 2>

Y2 = A * X2 + B

Here, Y1 is the reference systolic blood pressure (P _systolic ) obtained through the blood pressure monitor, Y2 is the reference diastolic blood pressure (P _diastolic ) obtained through the blood pressure monitor, and X1 is the maximum voltage average value for the first voltage signal (V _Max , _Avg ), X2 is the minimum voltage average value (V _Min , _Avg ) for the first voltage signal, and A and B are constants.

Hereinafter, an example of a process of deriving A and B will be described.

As shown in Table 1 below, the maximum voltage value and the minimum voltage value for the first voltage signal, the systolic blood pressure and the diastolic blood pressure measured through the blood pressure monitor are repeatedly performed a plurality of times (eg, 3 times) to ensure accuracy. The average value can be applied to conditional expression 1 and conditional expression 2.

Systolic blood pressure measured with a sphygmomanometer Diastolic blood pressure measured by blood pressure machine to the first voltage signal
maximum voltage value for to the first voltage signal
minimum voltage value for NO.1 139 82 0.2384976 -0.1424596 NO.2 140 90 0.20470455 -0.1177882 NO.3 138 87 0.234688 -0.1339108 AVG 139 86.333333 0.22596338 -0.1313862

Referring to Table 1, Y1 is 139, X1 is 0.22596338, Y2 is 86.333333, and X2 is -0.1313862.

Therefore, conditional expression 1 is

139 = 0.22596338 * A + B, and

Conditional expression 2 is

86.333333 = -0.1313862 * A + B

When Conditional Expression 1 and Conditional Expression 2 are combined together, A is 147.3814 and B is 105.6972.

Meanwhile, when A and B are derived through Conditional Expression 1 and Conditional Expression 2, the control unit 220 calculates the systolic blood pressure Y3 and the diastolic blood pressure Y4 for the second voltage signal through Conditional Expression 3 and Conditional Expression 4 below. can be calculated

<conditional expression 3>

Y3 = A * X3 + B

<conditional expression 4>

Y4 = A * X4 + B

Here, X3 is the maximum voltage average value (V _Max , _Avg ) for the second voltage signal, and X4 is the minimum voltage average value (V _Min , _Avg ) for the second voltage signal.

The second voltage signal is a pulse signal for a user who wants to measure blood pressure using the system 10 for calculating blood pressure using the pulse sensing module according to the present invention, and is the maximum voltage through at least one time. Average values (V _Max , _Avg ) and minimum voltage average values (V _Min , _Avg ) can be calculated, and the calculated values are substituted into Conditional Expressions 3 and 4 above to calculate the user's systolic blood pressure and diastolic blood pressure.

As described above, the system 10 for calculating blood pressure using the pulse sensing module according to the present invention calculates A and B, which are constants of a linear function, through the relationship between the voltage value of the voltage signal and the actually measured blood pressure, , A linear function relation expression including the calculated A and B is determined, and the user's blood pressure can be accurately calculated with a voltage signal by the user's pulse through the determined linear function relation expression.

In the above, the configuration and characteristics of the present invention have been described based on the embodiments according to the present invention, but the present invention is not limited thereto, and various changes or modifications can be made within the spirit and scope of the present invention. It will be apparent to those skilled in the art, and therefore such changes or modifications are intended to fall within the scope of the appended claims.

For example, in the above, it has been described that the pulse sensing module 100 is individually manufactured, but it is not necessarily limited thereto. might be manufactured.

10: system for calculating blood pressure using a pulse sensing module
100: pulse sensing module
110: piezoelectric layer
120: protective layer
121: first opening
122: second opening
130: support layer
132: substrate layer
134: oxide layer
136: crystal layer
140: polymer layer
150: first electrode line
152: first electrode terminal
160: second electrode line
162: second electrode terminal
170: deformation prevention unit
200: blood pressure calculation module

Claims (12)

In the pulse sensing module for calculating blood pressure,
a piezoelectric layer including a piezoelectric material for generating a piezoelectric effect by a pulse, wherein a first electrode line and a second electrode line spaced apart from each other are formed on one surface of the piezoelectric layer;
a support layer that supports the piezoelectric layer and allows the piezoelectric material to grow in an intended direction during the process of forming the piezoelectric layer with the piezoelectric material; and
A polymer layer in which at least a portion of the support layer is removed by back etching and filled in the provided space to ensure flexibility and stability;
The support layer is
A substrate layer, an oxide layer laminated on the substrate layer and defining a limit of the back etching during the back etching process, and a piezoelectric material laminated on the oxide layer and formed of the piezoelectric material in the process of forming the piezoelectric layer. A pulse sensing module, characterized in that it remains in the pulse sensing module without being removed.
According to claim 1,
A protective layer applied to the piezoelectric layer to protect the piezoelectric layer and having an opening through which the first electrode terminal of the first electrode line and the second electrode terminal of the second electrode line are exposed. Characterized by a pulse sensing module.
delete According to claim 1,
The substrate layer,
In order to minimize thermal damage or physical damage in the process of forming the piezoelectric layer, silicon (Si), silicon on insulator (SOI), quartz (SiO2), sapphire (Al2O3), germanium (Ge), A pulse sensing module, characterized in that made of at least one of gallium arsenide (GaAs) and stainless steel.
According to claim 1,
The substrate layer,
Pulse sensing module, characterized in that the thickness is reduced by a polishing process (polishing) to a thickness within the possible range of the back etching before the back etching process.
According to claim 1,
The space removed and provided by the back etching is
It is formed in a circular or pentagonal or more polygonal shape to reduce stress and cracks applied during the back etching process,
The polymer layer,
Pulse sensing module, characterized in that filled in the space provided in the circular or pentagonal or more polygonal shape.
According to claim 1,
The first electrode line and the second electrode line,
Positioned inside one side of the space provided to be removed by the back etching, the pulse sensing module, characterized in that not to be affected by cracks that may occur during the back etching process.
According to claim 1,
The polymer layer,
Pulse sensing module, characterized in that partitioned into a plurality of regions by the support layer remaining within the range of the space provided removed by the back etching.
According to claim 1,
a protective layer applied to the piezoelectric layer to protect the piezoelectric layer and having an opening through which the first electrode terminal of the first electrode line and the second electrode terminal of the second electrode line are exposed; and
During the back etching process, deformation of at least one of the first electrode line, the second electrode line, the piezoelectric layer, the protective layer, and the support layer is prevented, and the first electrode line and the second electrode line are surrounded. It further includes; a deformation prevention unit attached to one surface of the protective layer,
The deformation prevention unit,
Pulse sensing module, characterized in that removed after the polymer layer is formed.
In the blood pressure calculation system for calculating blood pressure using a pulse sensing module,
A pulse sensing module according to any one of claims 1, 2, 4 to 9; and
A blood pressure calculation module configured to calculate a systolic blood pressure and a diastolic blood pressure of a user using a voltage signal generated by the piezoelectric effect;
The blood pressure calculation module,
Derive a relational expression based on a signal processing unit for filtering noise of the voltage signal generated by the piezoelectric effect, and a first voltage signal filtered by the signal processing unit and a standard systolic blood pressure and a standard diastolic blood pressure obtained through a blood pressure monitor, A system for calculating blood pressure using a pulse sensing module, characterized in that it comprises a control unit for calculating the systolic blood pressure and the diastolic blood pressure for the second voltage signal by the relational expression.
According to claim 10,
The above relational expression is,
A system for calculating blood pressure using a pulse sensing module, characterized in that the following Conditional Expression 1 and Conditional Expression 2 are satisfied.

<conditional expression 1>
Y1 = A * X1 + B

<conditional expression 2>
Y2 = A * X2 + B

Here, Y1 is the reference systolic blood pressure (P _systolic ) obtained through the blood pressure monitor, Y2 is the reference diastolic blood pressure (P _diastolic ) obtained through the blood pressure monitor, and X1 is the maximum voltage average value for the first voltage signal (V _Max , _Avg ), X2 is the minimum voltage average value (V _Min , _Avg ) for the first voltage signal, and A and B are constants.
According to claim 11,
The control unit,
After deriving A and B through Conditional Expression 1 and Conditional Expression 2, systolic blood pressure (Y3) and diastolic blood pressure (Y4) for the second voltage signal are calculated through Conditional Expression 3 and Conditional Expression 4 below. A system for calculating blood pressure using a pulse sensing module that

<conditional expression 3>
Y3 = A * X3 + B

<conditional expression 4>
Y4 = A * X4 + B

Here, X3 is the maximum voltage average value (V _Max , _Avg ) for the second voltage signal, and X4 is the minimum voltage average value (V _Min , _Avg ) for the second voltage signal.

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