KR102494897B1 - Unit for exchnaging heat and apparatus for treaing substrate - Google Patents

Abstract

The present invention provides a heat exchange unit. In one embodiment, the heat exchange unit includes a tubular housing having a predetermined length; a heat exchanging housing disposed inside the housing, having an outer diameter smaller than an inner diameter of the housing, and sealing an inner space; a heat exchange line provided inside the heat exchange housing and through which a heat exchange fluid can pass; a heat exchange fluid supply line extending from one end of the heat exchange line and passing through the housing and the heat exchange housing; and a heat exchange fluid return line extending from the other end of the heat exchange line and passing through the housing and the heat exchange housing.

Description

Heat exchange unit and substrate processing system {UNIT FOR EXCHNAGING HEAT AND APPARATUS FOR TREAING SUBSTRATE}

The present invention relates to a heat exchange unit that exchanges heat from a fluid and an apparatus for processing a substrate to which the heat exchange unit is applied. More specifically, it relates to a substrate processing system including a heat exchange unit for heat-exchanging exhaust gas exhausted from a process chamber among substrate processing systems and re-supplying the same to the process chamber.

BACKGROUND OF THE INVENTION In manufacturing semiconductor devices, a substrate is subjected to a high-temperature treatment. For example, in the manufacture of OLEDs and flexible displays, high-temperature treatment of 200° C. or higher is performed to form a substrate. An example of requiring high-temperature treatment is a polyimide curing (PIC) process as a thermal curing process for forming a plastic substrate made of polyimide.

1 is a conventional substrate processing system for thermal curing. The process gas used for curing the substrate in the thermal curing chamber 1 is exhausted from the thermal curing chamber 1 to the exhaust line 3 by the exhaust unit 4 as a high-temperature exhaust gas together with by-products. Exhaust gas is generally a harmful gas and is released to the outside by passing through a scrubber 5 for decomposing harmful components.

An object of the present invention is to provide a heat exchange unit for heat-exchanging exhaust gas discharged from a process chamber during substrate processing and supplying the exhaust gas back to the process chamber, and a substrate processing system including the same.

An object of the present invention is to provide a compact and lightweight heat exchange unit for heat exchange of exhaust gas discharged from a heat treatment chamber.

An object of the present invention is to provide a heat exchange unit capable of increasing heat exchange efficiency in response to a change in an inflow amount of a fluid to be heat exchanged through temperature control of the heat exchange unit, and a substrate processing system including the same.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

The present invention provides a heat exchange unit. In one embodiment, the heat exchange unit includes a tubular housing having a predetermined length; a heat exchanging housing disposed inside the housing, having an outer diameter smaller than an inner diameter of the housing, and sealing an inner space; a heat exchange line provided inside the heat exchange housing and through which a heat exchange fluid can pass; a heat exchange fluid supply line extending from one end of the heat exchange line and passing through the housing and the heat exchange housing; and a heat exchange fluid return line extending from the other end of the heat exchange line and passing through the housing and the heat exchange housing.

In one embodiment, the inside of the heat exchange housing may be filled with a filling fluid.

In one embodiment, the filling fluid may include epoxy.

In one embodiment, the heat exchanger may further include a heat dissipation plate provided to surround the heat exchange housing by contacting the outside of the heat exchange housing.

In addition, the present invention provides a substrate processing system. In one embodiment, a substrate processing system includes a process chamber in which processing of a substrate is performed; an exhaust line for discharging process gas used in the process chamber from the process chamber; a heat exchange unit according to any one of claims 1 to 4 provided in the exhaust line; a cooling device connected to the heat exchange fluid supply line and the heat exchange fluid recovery line to supply low-temperature heat exchange fluid to the heat exchange line; a filter provided downstream of the heat exchange unit; A circulation line having one end connected downstream of the heat exchange unit and the other end connected to the process chamber supplies recycled process gas to the process chamber.

In one embodiment, the process chamber may be a heat treatment chamber that heat-treats a substrate.

In one embodiment, the cooling device may cool the heat exchange fluid recovered from the heat exchange unit and supply the cooled low-temperature heat exchange fluid to the heat exchange unit.

In one embodiment, the controller further includes a plurality of heat exchange units provided along the flow of the process gas discharged from the process chamber, and the temperature of the heat exchange fluid supplied to each of the plurality of heat exchange units is It is provided controllably, and a temperature sensor is provided between each of the heat exchange units, and when the temperature of the process gas measured by the temperature sensor is equal to or greater than a predetermined temperature: the controller controls the heat exchanger provided upstream of the temperature sensor. The temperature of the heat exchange fluid provided to at least one of the units may be lowered than the temperature of the group supply.

According to various embodiments of the present invention, exhaust gas used and discharged from a process chamber during a substrate processing process may be heat-exchanged and re-supplied to the process chamber, thereby reducing the amount of process gas used.

According to various embodiments of the present invention, a heat exchange unit that heats exhaust gas used and discharged from a process chamber can be made compact and lightweight.

According to various embodiments of the present invention, a cooling rate may be increased in response to a change in an inflow amount of a fluid to be heat exchanged through temperature control of the heat exchange unit.

The effects of the present invention are not limited to the above-mentioned effects, and effects not mentioned will be clearly understood by those skilled in the art from this specification and the accompanying drawings.

1 is a conventional substrate processing system for thermal curing.
2 is a block diagram of a substrate processing system according to an embodiment of the present invention.
3 is a perspective view of a heat exchange unit according to an embodiment of the present invention.
FIG. 4 is a plan view of the heat exchange unit according to the exemplary embodiment shown in FIG. 3 as viewed in the X direction.
FIG. 5 is a cross-sectional view of the heat exchange unit according to the exemplary embodiment shown in FIG. 3 taken along an XY plane.
6 is a partial cross-sectional view schematically illustrating a heat exchange assembly provided in the heat exchange unit according to the exemplary embodiment shown in FIGS. 3 to 5 .
FIG. 7 is a use state diagram illustrating a state in which a cooling device is connected to and operated in the heat exchange unit according to the exemplary embodiment shown in FIGS. 3 to 5 .
8 is a use state diagram illustrating an example of utilization of a heat exchange unit according to an embodiment of the present invention.
FIG. 9 is a flow chart illustrating a method of operating the heat exchange unit according to the utilization example shown in FIG. 8 according to an embodiment.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. In addition, in describing preferred embodiments of the present invention in detail, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, the same reference numerals are used throughout the drawings for parts having similar functions and actions.

'Including' a certain component means that other components may be further included, rather than excluding other components unless otherwise stated. Specifically, terms such as "comprise" or "having" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features or It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Singular expressions include plural expressions unless the context clearly dictates otherwise. In addition, shapes and sizes of elements in the drawings may be exaggerated for clearer description.

The term “and/or” includes any one and all combinations of one or more of the listed items. In addition, the meaning of "connected" in the present specification means not only when member A and member B are directly connected, but also when member A and member B are indirectly connected by interposing member C between member A and member B. do.

Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following examples. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes of elements in the figures are exaggerated to emphasize clearer description.

The substrate processing system according to an embodiment of the present invention is used for heat treatment of a substrate such as a glass substrate used for a flat panel display device such as LCD or OLED or for a solar cell. It can also be used for heat treatment of substrates such as semiconductor wafers.

In an embodiment of the present invention, a substrate processing system including a heat treatment chamber (PIC chamber) in which polyimide (PI) formed on a glass substrate is heat-treated and cured is described as a process chamber. However, the present invention is not limited thereto, and can be applied to various types of apparatus for performing heat treatment on a substrate.

2 is a block diagram of a substrate processing system according to an embodiment of the present invention. Referring to FIG. 2 , the substrate processing system 1000 includes a process chamber 1 , an exhaust unit 4 , a heat exchange unit 100 , a cooling device 200 and a scrubber 5 . In addition, the substrate processing system 1000 may include a filter 300 .

The heat exchange unit 100, the exhaust unit 4, and the filter 300 connected directly or indirectly to the process chamber 1 are described as including one each, but the size of the process chamber 1 and the amount of process gas supplied Depending on, each may be formed in two or more.

The substrate processing system 1000 cools the process chamber 1 and the substrate to a temperature at which the substrate can be discharged by supplying a cooled process gas into the process chamber 1 after heat treatment of the substrate is performed in the process chamber 1. let it

The hot process gas is discharged from the process chamber 1 through a discharge line 3 while the exhaust unit 4 operates. The exhausted process gas is cooled in the heat exchange unit 100, filtered in the filter 300, and supplied to the process chamber 1 again.

The process chamber 1 is provided in connection with an air supply line 2 , an exhaust line 3 , and a circulation line 220 . A heating module (not shown) is provided in the process chamber 1 to heat the process space inside the process chamber 1 to a set temperature according to heat treatment conditions.

The process chamber 1 accommodates a substrate in a processing space and performs heat treatment according to set heat treatment conditions. The process chamber 1 may maintain normal pressure during the heat treatment process or maintain an inert atmosphere by process gas such as nitrogen gas.

The process chamber 1 may be formed as a chamber for a batch type heat treatment apparatus. In addition, the process chamber 1 may be formed as a chamber for an in-line heat treatment apparatus. In the batch type heat treatment apparatus chamber and the inline heat treatment apparatus chamber, inlets and outlets through which substrates are taken in and out may be sealed by separate shutters while the heat treatment process is in progress.

The air supply line 2 is made in the form of a pipe. The air supply line 2 supplies process gas into the process chamber 1 . A plurality of air supply lines 2 connected to the process chamber 1 may be provided. The air supply line 2 may include a main air supply line and at least a plurality of sub air supply lines (not shown).

The air supply line 2 may include a first air supply control valve 2a connected in the middle. The first air supply control valve 2a controls the flow of process gas flowing through the air supply line 2 . The first air supply control valve 2a is closed when heat treatment is in progress in the process chamber 1 to block the flow of process gas, and is opened when heat treatment is finished to supply process gas to the process space of the process chamber 1. make it possible

The exhaust line 3 is formed in a tubular shape, and the exhaust line 3 is used inside the process chamber 1 to discharge heated process gas and supply it to the heat exchange unit 100 .

The exhaust line 3 may include a main exhaust line and at least two sub exhaust lines.

In addition, the exhaust line 3 may further include an exhaust control valve 3a. The exhaust control valve 3a controls the flow of process gas flowing through the exhaust line 3 . The exhaust control valve 3a may be closed when heat treatment is in progress in the process chamber 1 to block the flow of process gas, and may be opened when heat treatment is finished to allow process gas to be discharged.

The heat exchange unit 100 may be connected to the exhaust line 3 of the process chamber 1 . The heat exchange unit 100 may be provided downstream of the exhaust control valve 3a. Although one heat exchange unit 100 is shown according to an embodiment, a plurality of heat exchange units 100 may be continuously or discontinuously provided on the exhaust line 3 . An exhaust unit 4 may be connected downstream of the heat exchange unit 100 based on the flow of exhausted process gas.

The exhaust unit 4 may be provided as a pump in which a space between an intake port (not shown) and an exhaust port (not shown) is sealed from the outside. For example, the exhaust unit 4 may be provided as a ring blower or a turbo blower. Also, the exhaust unit 4 may be formed as a rotary pump or a booster pump. The ring blower and the turbo blower are different in specific structure, but the space between the intake and exhaust ports is sealed to the outside, so that the gas sucked into the intake port is not discharged in the middle, and all is discharged through the exhaust port. In addition, the rotary pump and the booster pump are different from the blower in their specific structure, but the space between the intake and exhaust ports is also sealed to the outside, so that the gas sucked into the intake port is not discharged in the middle, and all are discharged through the exhaust port. Thus, the exhaust unit 4 prevents the intake process gas from leaking out. Since the ring blower and the turbo blower are commonly used devices, detailed descriptions thereof are omitted. On the other hand, the exhaust unit 4 may be a general blower when there is no need to seal between the intake port (not shown) and the exhaust port (not shown) from the outside.

The heat exchange unit 100 cools the used process gas exhausted through the exhaust line 3 . The heat exchange unit 100 may form part of the exhaust line 3 . Meanwhile, when the exhaust unit 4 is provided downstream of the heat exchange unit 100, the heat exchange unit 100 can prevent the exhaust unit 4 from being damaged by high-temperature process gas. The heat exchange unit 100 will be described in detail below in FIG. 3 .

A circulation control valve 310 is provided at the end of the exhaust line 3 downstream of the exhaust unit 4 . The circulation control valve 310 is connected to the exhaust line 6 and the circulation line 320 so that the process gas discharged from the exhaust line 3 flows to the exhaust line 6 or the circulation line 320. control the The circulation control valve 310 may be provided as a three-way valve.

A scrubber (5) is installed in the discharge line (6). The treated exhaust gas is discharged past the scrubber (5). The scrubber 5 decomposes or removes harmful components of harmful gases contained in the exhaust gas.

A filter 400 may be provided in the circulation line 320 . The filter 400 serves to remove foreign substances from the process gas. A plurality of filters 400 may be provided. Also, the filter 400 may be installed in the exhaust line 3 instead of being installed in the circulation line 320 . When installed in the exhaust line 3, it may be installed downstream of the heat exchange unit 100. The filter 400 is formed by including a filter such as a HEPA filter, a woolpa filter, a carbon filter, or a mesh filter. Since the filters are widely used in a semiconductor process or a flat panel display device manufacturing process, a detailed description thereof will be omitted.

A second air supply control valve 320a may be provided downstream of the filter 400 on the circulation line 320 . The second air supply control valve 320a may be closed when air is not supplied through the circulation line 320 .

3 is a perspective view of a heat exchange unit according to an embodiment of the present invention. FIG. 4 is a plan view of the heat exchange unit according to the exemplary embodiment shown in FIG. 3 as viewed in the X direction. FIG. 5 is a cross-sectional view of the heat exchange unit according to the exemplary embodiment shown in FIG. 3 taken along an XY plane. Referring to FIGS. 3, 4, and 5, a heat exchange unit 100 according to an exemplary embodiment will be described.

The heat exchange unit 100 includes a housing 110 and a heat exchange assembly 150 .

The housing 110 is made in a tubular shape. Flanges 120 may be provided at both ends of the housing 110 . The flange 120 is a component for connecting and coupling the heat exchange unit 100 to a component such as the exhaust line 3 . A through hole through which a coupling part passes may be formed in the flange 120 . The flange 120 and the housing 110 may be coupled by welding. Exhaust gas flowing along the exhaust line 3 passes through the heat exchange unit 100 through the inner space 111 of the housing 110 connected to the exhaust line 3 .

A heat exchange assembly 150 is provided in the inner space 11 of the housing 110 .

6 is a partial cross-sectional view schematically illustrating a heat exchange assembly provided in the heat exchange unit according to the exemplary embodiment shown in FIGS. 3 to 5 . The heat exchange assembly 150 will be described in detail with reference to FIG. 5 . The heat exchange assembly 150 includes a heat exchange housing 151 and a heat exchange fluid line 153 . The heat exchanging assembly 150 may further include a heat sink 157 .

The heat exchange housing 151 is provided in a tubular shape. The outer diameter of the heat exchange housing 151 is provided smaller than the inner diameter of the housing 110 . As the outer diameter of the heat exchange housing 151 is smaller than the inner diameter of the housing 110, the flow rate that can pass through the inner space 111 of the housing 110 increases, but the heat exchange efficiency may decrease. Consider this trade-off relationship. Thus, the outer diameter of the heat exchange housing 151 can be appropriately designed. The length of the heat exchange housing 151 is provided shorter than the length of the housing 110 so that the heat exchange housing 151 can be located in the inner space 111 of the housing 110 .

A heat exchange line 153 is provided in the inner space 152 of the heat exchange housing 151 . The heat exchange line 153 is formed in a coil shape. One end of the heat exchange line 153 extends to the heat exchange fluid supply line 154 and the other end of the heat exchange line 153 extends to the heat exchange fluid discharge line 155. The heat exchange fluid supply line 154 and the heat exchange fluid discharge line 155 pass through the heat exchange housing 151 and come out of the heat exchange housing 151 . In addition, the heat exchange fluid supply line 154 and the heat exchange fluid discharge line 155 pass through the housing 110 and pass through the housing 110 to the outside. The positions where the heat exchange fluid supply line 154 and the heat exchange fluid discharge line 155 pass through the heat exchange housing 151 may be sealed. Sealing can be done by welding. Also, the positions of the heat exchange fluid supply line 154 and the heat exchange fluid discharge line 155 penetrating the housing 110 may be sealed. Sealing can be done by welding.

The heat exchange fluid supply line 154 serves as a supply port for the heat exchange fluid, and the heat exchange fluid discharge line 155 serves as a discharge port for the heat exchange fluid. The heat exchange fluid introduced through the heat exchange fluid supply line 154 flows along the heat exchange line 153 and is discharged through the heat exchange fluid discharge line 155 . The heat exchange line 153, the heat exchange fluid supply line 154, and the heat exchange fluid discharge line 155 may be made of a metallic material having high thermal conductivity. Alternatively, the heat exchange line 153, the heat exchange fluid supply line 154, and the heat exchange fluid discharge line 155 may be made of a resin material having high thermal conductivity and high heat resistance.

The inner space 152 of the heat exchange housing 151 is sealed. In the heat exchange housing 151, a portion where the heat exchange fluid supply line 154 and the heat exchange fluid discharge line 155 penetrate may be welded to seal the inside of the heat exchange housing 151.

A filling fluid may be filled in the inner space 152 of the heat exchange housing 151 . The filling fluid may be provided as a fluid having a high heat transfer rate. The filling fluid may be provided in liquid form. The filling fluid may be provided with a low viscosity material. The filling fluid may include epoxy.

The heat exchange fluid flowing through the heat exchange line 153 exchanges heat with the exhaust gas outside the heat exchange housing 151 and is discharged through the heat exchange fluid discharge line 155 .

A heat sink 157 is wrapped around the heat exchange housing 151 . The heat sink 157 is provided in contact with the heat exchanging housing 151 so that heat conduction can occur well. In addition, the heat sink 157 is preferably designed to have a large contact area without obstructing the flow of exhaust gas passing through the inner space 111 of the housing 110 .

The heat exchange housing 151, the heat exchange line 153, and the heat sink 157 are preferably made of a material having high thermal conductivity. In addition, it is preferable to use a material that is not deformed by high-temperature exhaust fluid. For example, the heat sink 157 may be made of aluminum.

FIG. 7 is a use state diagram illustrating a state in which a cooling device is connected to and operated in the heat exchange unit according to the exemplary embodiment shown in FIGS. 3 to 5 . Referring to FIG. 7 , the heat exchange fluid supply line 154 of the heat exchange unit 150 is connected to the supply line 210, and the heat exchange fluid discharge line 155 of the heat exchange unit 150 is connected to the recovery line 220. do. The supply line 210 and the return line 220 are connected to the cooling device 200 . The cooling device 200 may be provided with a cooler. A chiller may be a device that takes heat from a heat exchange fluid using evaporation, compression, condensation, or expansion. Alternatively, a Peltier element or the like may be provided as a cooler. The cooling device 200 removes heat from the heat exchange fluid introduced through the recovery line 220 to cool it, discharges the cooled heat exchange fluid through the supply line 210, and transfers it to the heat exchange unit 100. In this embodiment, the heat exchange fluid is preferably provided as a fluid with a low freezing point. More specifically, it is preferable to provide a freezing point of 0 ° C or less.

The low-temperature heat exchange fluid supplied through the supply line 210 cools the heat exchange housing 151 and the heat sink 157 while passing through the heat exchange line 153 . As a result, heat exchange occurs between the heat exchange assembly 150 and the high-temperature exhaust gas. That is, the heat exchange assembly 150 takes heat from the hot exhaust gas. The heat exchange fluid containing the stolen heat is returned to the cooling device 200 through the recovery line 220, cooled again, and supplied to the heat exchange unit 100. In addition, the introduced high-temperature exhaust gas A is cooled by taking away heat and discharged from the heat exchange unit 100 .

8 is a state diagram illustrating a use example of a heat exchange unit according to an embodiment of the present invention. A plurality of heat exchange units 100 may be provided on the exhaust line 3 . For example, in the heat exchange unit 100, the first heat exchange unit 100a and the second heat exchange unit 100b may be directly or indirectly connected. In one embodiment, the heat exchange unit located upstream of the flow of the exhaust gas is the first heat exchange unit 100a, and the heat exchange unit located downstream of the first heat exchange unit 100a is the second heat exchange unit 100b. is defined as The first heat exchange unit 100a and the second heat exchange unit 100b may share one cooling device 200 .

9 is a flowchart illustrating a method of operating the heat exchange unit according to the utilization example shown in FIG. 8 according to an embodiment. With further reference to FIG. 8 and FIG. 9 , an operating method according to an embodiment of the heat exchange unit according to the utilization example shown in FIG. 8 will be described.

Exhaust gas having a first temperature is introduced into the first heat exchange unit 100a (S110). The first temperature is different depending on the process, but may be a temperature of about 250°C or higher based on the PIC process. The introduced exhaust gas of the first temperature is subjected to primary cooling while passing through the first heat exchange unit 100a (S120). A first temperature sensor (not shown) may be provided between the first heat exchange unit 100a and the second heat exchange unit 100b. A first temperature sensor (not shown) measures the temperature of the exhaust gas in which the primary cooling has been performed (S120). When the temperature of the exhaust gas subjected to the primary cooling is equal to or less than the first set temperature, secondary cooling is performed (S130). If the temperature of the exhaust gas subjected to the primary cooling is not equal to or lower than the first set temperature, the supply temperature of the heat exchange fluid supplied to the first heat exchange unit 100a is lowered. The lowering of the supply temperature of the heat exchange fluid supplied to the first heat exchange unit 100a may be performed by controlling the set temperature of the cooler CH1 provided in the cooling device 200 to be lower (S135). For example, the first set temperature may be 80 °C.

Exhaust gas having a first set temperature or less flows into the second heat exchange unit 100b, and secondary cooling is performed (S140). A second temperature sensor (not shown) may be provided downstream of the second heat exchange unit 100b. A second temperature sensor (not shown) measures the temperature of exhaust gas subjected to secondary cooling (S150). When the temperature of the exhaust gas subjected to the secondary cooling is equal to or less than the second set temperature, the cooled exhaust gas is sent to the filter 400 to be purified (S160). If the temperature of the exhaust gas subjected to the secondary cooling is not equal to or less than the second set temperature, the supply temperature of the heat exchange fluid supplied to the second heat exchange unit 100b is lowered. The lowering of the supply temperature of the heat exchange fluid supplied to the second heat exchange unit 100b may be performed by controlling the set temperature of the cooler CH2 provided in the cooling device 200 to be lower (S155).

The exhaust gas cooled and purified by passing through the filter 400 is re-supplied to the process chamber 1 as a process gas (S170).

The above-described control operation of the cooling device may be performed by a controller (not shown). A controller (not shown) may control the entire operation of the substrate processing system 1000 . The controller (not shown) may include a Central Processing Unit (CPU), Read Only Memory (ROM), and Random Access Memory (RAM). The CPU executes desired processing according to various recipes stored in these storage areas. In the recipe, process time, process pressure, process temperature, and various gas flow rates, which are control information of the device for process conditions, are input. On the other hand, recipes indicating these programs and processing conditions may be stored in a hard disk or semiconductor memory. In addition, the recipe may be set in a predetermined position in the storage area while being accommodated in a storage medium readable by a portable computer such as a CD-ROM or DVD.

In the above-described embodiment, an example of cooling a high-temperature fluid passing through the inner space 111 of the housing 110 of the heat exchange fluid by the heat exchange unit 100 has been described, but, if necessary, the heat exchange unit 100 uses the heat exchange fluid If the fluid passing through the inner space 111 of the housing 110 is to be heated, the heat exchange unit 100 is connected to the heat exchange fluid heating device to supply a high-temperature heat exchange fluid to the inner space of the housing 110 ( 111) can also be used to heat the fluid passing through it.

The above detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and describe preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed in this specification, within the scope equivalent to the written disclosure and / or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in the specific application field and use of the present invention are also possible. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to cover other embodiments as well.

Claims (8)

In the substrate processing system,
a process chamber in which processing of the substrate is performed;
an exhaust line for discharging a process gas used in the process chamber from the process chamber, wherein the process gas discharged from the process chamber has a temperature of 250 °C or higher;
a heat exchange unit provided in the exhaust line;
a cooling device connected to the heat exchange fluid supply line and the heat exchange fluid return line of the heat exchange unit to supply low-temperature heat exchange fluid to the heat exchange line;
a filter provided downstream of the heat exchange unit;
a circulation line having one end connected downstream of the heat exchange unit and the other end connected to the process chamber to supply recycled process gas to the process chamber;
an exhaust unit generating a flow of the process gas in the exhaust line and provided downstream of the following heat exchange units;
including a controller;
The heat exchange unit,
a tubular housing having a predetermined length;
flanges provided at both ends of the housing and formed with through holes through which coupling parts pass to connect and couple the heat exchange unit to the exhaust line;
a heat exchanging housing disposed inside the housing, having an outer diameter smaller than an inner diameter of the housing, and sealing an inner space;
a heat exchange line provided inside the heat exchange housing, through which heat exchange fluid can pass, and having a coil shape;
a heat exchange fluid supply line extending from one end of the heat exchange line and passing through the housing and the heat exchange housing and protruding from the housing to form a supply port connected to the cooling device;
A heat exchange fluid recovery line extending from the other end of the heat exchange line and passing through the housing and the heat exchange housing and protruding from the housing to form a discharge port connected to the cooling device;
The inside of the heat exchange housing is filled with a filling fluid,
The cooling device is
cooling the heat exchange fluid recovered from the heat exchange unit and supplying the cooled low-temperature heat exchange fluid to the heat exchange unit;
The heat exchange unit,
To include a first heat exchange unit along the flow of the process gas and a second heat exchange unit positioned downstream of the first heat exchange unit to enable primary cooling and secondary cooling of the process gas discharged from the process chamber A plurality of heat exchange units are provided,
The temperature of the heat exchange fluid supplied to each of the plurality of heat exchange units is provided in a controllable manner,
A first temperature sensor is provided between the first heat exchange unit and the second heat exchange unit,
A second temperature sensor is provided downstream of the second heat exchange unit,
When the temperature of the process gas measured by the first temperature sensor is not equal to or less than a first set temperature:
The controller lowers the temperature of the heat exchange fluid supplied to the first heat exchange unit so that the temperature of the process gas passing through the first heat exchange unit is lower than the first set temperature,
When the temperature of the process gas measured by the second temperature sensor is not equal to or less than a second set temperature:
Wherein the controller lowers the temperature of the heat exchange fluid provided to the second heat exchange unit so that the temperature of the process gas passing through the second heat exchange unit is lower than the second set temperature. delete According to claim 1,
The filling fluid is a substrate processing system comprising an epoxy (Epoxy). According to claim 1,
The substrate processing system further includes a heat sink provided to surround the heat exchange housing in contact with the outside of the heat exchange housing. delete According to claim 1,
The process chamber is a substrate processing system that is a heat treatment chamber for heat treating a substrate.
delete delete

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