KR102489778B1 - Manufacturing method of Flexible Flat Cable or Flexible Printed Circuit capable of spontaneous double side etching and composition of double sided tape for double side etching - Google Patents

Abstract

The present invention relates to a method for manufacturing a flexible flat cable (FFC) or a flexible printed circuit (FPC) capable of simultaneous etching on both sides, and a double-sided adhesive tape composition for etching both sides for realizing the same. laminating the flexible copper laminate on both sides of the double-sided adhesive tape; manufacturing a flexible flat cable or a flexible printed circuit through a normal manufacturing process using the flexible copper laminate; and peeling off the double-sided adhesive tape; a method for manufacturing a flexible flat cable or a flexible printed circuit and a double-sided adhesive tape composition for the same, characterized in that a plurality of flexible flat cables or flexible printed circuits can be manufactured at the same time provides

Description

Manufacturing method of Flexible Flat Cable or Flexible Printed Circuit capable of spontaneous double side etching and composition of double sided tape for double side etching}

The present invention relates to a method for manufacturing a flexible flat cable (FFC) or a flexible printed circuit (FPC) capable of simultaneous etching on both sides, and a double-sided adhesive tape composition for etching both sides for realizing the same, which improves productivity For the purpose, double-sided adhesive tape for double-sided etching is interposed between copper foil so that both sides can be etched simultaneously.

In recent years, the electronics industry has developed flexible printed circuits that can be easily embedded in a small space and these surface-mounted flexible printed circuits according to the development of circuit integration, miniaturization of parts (chip parts), and surface mount technology to mount them. A flexible flat cable for connection has been developed and is widely used throughout the electronic industry, such as portable terminals and various displays. In general, the process of manufacturing a flexible printed circuit and a flexible flat cable is as follows.

After bonding the flexible copper clad laminate (FCCL), which is the basic material, and films such as polyimide (PI), polycyclohexylenedimethylene terephthalate (PCT), and polyethylene naphthalate (PEN) used as the insulation layer, the upper part of the flexible copper clad laminate It is formed by plating a copper thin film layer on it. As shown in FIG. 1 as a pretreatment process, the laminating process is a rate-limiting process.

Here, dry film, which is a photoreceptor, is attached, the circuit printed mask is covered and exposed, and etchant is sprayed to corrode and remove unnecessary parts to form a circuit, and then the dry film is removed, washed, and dried to perform an etching process. to finish

Then, a flexible printed circuit or a flexible flat cable can be manufactured by laminating insulating films having materials such as polyimide (PI), polycyclohexylenedimethylene terephthalate (PCT), polyethylene naphthalate (PEN), etc. as described above. This is a finishing process, and as shown in FIG. 1, the laminating process is a rate-limiting process.

However, as can be seen through the above manufacturing process, productivity decline is caused by consuming most of the manufacturing time in the laminating process performed in the pretreatment and finishing steps rather than in the process of manufacturing by printing the actual circuit, and such a laminating process There is a problem in that over-investment in facilities to reduce bottlenecks in the following process occurs.

Korean Registered Patent No. 1831298

The present invention has been made to solve the problems of the prior art as described above, and the present invention is resistant to etching liquid and can be easily peeled off by physical treatment after manufacture by interposing a double-sided adhesive tape between soft copper laminates, The pretreatment process (insulation film laminating process) can be omitted, and double-sided etching is possible during the etching process, so that flexible printed circuits or flexible flat-panel cables can be manufactured simultaneously. It is an object of the present invention to provide a process for manufacturing a flexible printed circuit or a flexible flat cable capable of halving the rate-limiting process time by simultaneously laminating.

In addition, another object of the present invention is to provide a double-sided tape composition that is resistant to the etchant and can be easily peeled off by physical treatment.

In order to achieve the above object, the present invention comprises the steps of laminating a flexible copper laminate on both sides of a double-sided adhesive tape; manufacturing a flexible flat cable or a flexible printed circuit through a normal manufacturing process using the flexible copper laminate; and peeling off the double-sided adhesive tape, wherein a plurality of flexible flat cables or flexible printed circuits can be simultaneously manufactured.

The step of peeling the double-sided adhesive tape; is preferably performed by foaming the double-sided adhesive tape.

During the foaming, heating is performed, and the foaming temperature by heating is preferably in the range of 80 to 180°C.

During the foaming, heating is performed, and the foaming time by warming is preferably in the range of 20 seconds to 30 minutes.

In addition, the present invention is a composition for a double-sided adhesive tape for producing a flexible flat cable or a flexible printed circuit, comprising a polymer obtained by mixing and polymerizing at least one acrylic monomer and at least one saturated or unsaturated hydrocarbon monomer or oligomer; and at least one physical, organic or inorganic foaming agent.

The acrylic monomer preferably has a structure represented by the following formula (1).

[Formula 1]

Here, R ₁ is hydrogen (H) or a methyl group (-CH ₃ ), R ₂ and R ₃ are each hydrogen (H) or a hydrocarbon having 1 to 12 carbon atoms, and R ₄ is a hydrocarbon having 1 to 18 carbon atoms

The content of the acrylic monomer is preferably 1 to 40% by weight based on the total weight of the composition.

The unsaturated hydrocarbon is preferably at least one selected from butadiene and isoprene.

The content of the unsaturated hydrocarbon is preferably more than 0 and 30% by weight or less based on the total weight of the composition.

The saturated or unsaturated hydrocarbon oligomer is preferably at least one selected from aromatic or aliphatic petroleum resins.

The saturated or unsaturated hydrocarbon oligomer is preferably greater than 0 and less than 10% by weight based on the total weight of the composition.

The physical foaming agent preferably has a spherical core-shell structure consisting of a polymer shell and a core filled with a volatile foaming agent, and includes at least one type having different particle diameters or foaming temperatures.

The organic blowing agent is selected from among benzenesulfonylhydrazide, p-Toluenesulfonylhydrazide, or p,p'-oxybis(benzenesulfonylhydrazide). It is preferable that it is at least 1 sort(s) selected.

The inorganic foaming agent is preferably at least one selected from sodium bicarbonate (NaHCO ₃ ) and potassium bicarbonate (KHCO ₃ ).

It is preferable that the weight of at least one of the physical, organic and inorganic foaming agents is 5 to 30% by weight based on the total weight of the composition alone or in combination.

According to the present invention as described above, a double-sided printed circuit is manufactured by interposing a foamable double-sided adhesive tape between two flexible copper laminates and then subjected to double-sided etching, and the double-sided adhesive tape is peeled off by foaming. It is possible to produce 2 sheets, and by carrying out the laminating process of the film used as the insulating layer simultaneously on both sides, the production time can be divided in half, which has the effect of improving productivity by about 4 times.

1 is a comparison diagram of a laminating process for manufacturing a conventional flexible printed circuit or flexible flat cable and a laminating process according to the present invention.
2 is an enlarged picture of the surface after the etching resistance test for Example 1 of the present invention.
3 is an enlarged photograph of the surface after an etching resistance test for a comparative example.
4 is a photograph of the etching resistance test for Example 1 of the present invention for 10 seconds, 30 seconds, and 60 seconds, respectively.
5 is a photograph of the etching resistance test for Example 2 of the present invention for 10 seconds, 30 seconds, and 60 seconds, respectively.
6 is a photograph of the etching resistance test for Example 3 of the present invention for 10 seconds, 30 seconds, and 60 seconds, respectively.
7 is a photograph of Comparative Example 3 in which an etching resistance test was performed for 10 seconds, 30 seconds, and 60 seconds, respectively.
8 is a photograph of the etching resistance test for Example 4 of the present invention for 10 seconds, 30 seconds, and 60 seconds, respectively.
9 is a photograph of the etching resistance test for Example 5 of the present invention for 10 seconds, 30 seconds, and 60 seconds, respectively.
10 is a photograph of the etching resistance test for Example 6 of the present invention for 10 seconds, 30 seconds, and 60 seconds, respectively.

Hereinafter, the present invention will be described in more detail based on the accompanying drawings and preferred embodiments.

The present invention comprises the steps of laminating a flexible copper laminate on both sides of a double-sided adhesive tape, manufacturing a printed circuit through a series of conventional manufacturing processes, and physically peeling the printed circuit formed on both sides of the double-sided adhesive tape in a peeling process. It provides a method for manufacturing a flexible flat cable or flexible printed circuit, characterized in that a plurality of printed circuits comprising the step, for example, two sheets can be simultaneously manufactured. This is as shown in the lower part of FIG. 1 .

In addition, the double-sided adhesive tape is composed of a polymer polymerized from a mixture containing at least one acrylic monomer and at least one saturated or unsaturated hydrocarbon monomer or oligomer and at least one physical, organic or inorganic foaming agent added thereto It provides a double-sided adhesive tape composition characterized in that.

As mentioned in the background art, the above-mentioned series of manufacturing processes refers to the process of flexible flat cable or flexible printed circuit currently being mass-produced, and the physical method in the peeling process refers to manufacturing by reducing the contact area by foaming at a certain temperature. It refers to a method of peeling off a printed circuit without deformation or damage.

The foaming process is performed in a warming environment, and the temperature during heating is preferably 80° C. or more and 180° C. or less. If the foaming temperature is 80° C. or less, the foaming agent is pre-foamed in the etching process and the above purpose cannot be achieved, and 180° C. When foaming at a higher temperature than above, the performance of the circuit formed by oxidation of copper deteriorates, so the foaming temperature has critical significance in the above range.

In addition, the foaming time is preferably 20 seconds or more and 30 minutes or less. If the foaming time is less than 20 seconds, the contact area is not sufficiently reduced due to insufficient foaming, so there is a risk of deformation when removing the printed circuit formed on both sides because the adhesive strength is reduced. In the above case, the foamed double-sided tape is reflowed over time at high temperature, and the adhesive strength increases again by increasing the contact area, so there is a possibility that the printed circuit formed on both sides may be deformed when removing the foaming time. There is critical significance in the above range.

On the other hand, in order to manufacture a flexible flat cable or a flexible printed circuit through the above manufacturing process, there must be no inflow of etching liquid through the interface between the tape and the flexible copper laminate that are adhered on both sides. If the etchant flows into the interface, not only the back surface is oxidized, but also the side surface is over-etched, which may cause product defects.

Therefore, in order to solve the above-mentioned problem, it is possible to think of a method of lowering the secondary transition temperature (glass transition temperature, Tg) of the adhesive to increase the wettability of the interface or to improve the adhesive strength with the ductile copper laminate, but both methods are excessive. Since the decrease in adhesiveness is small even after foaming due to the initial adhesiveness, deformation of the printed circuit formed on both sides cannot be avoided during peeling, so the problem still exists.

Accordingly, the inventors of the present invention have achieved the above object by adding at least one acrylic monomer having a structure of Formula 1 to the polymerized product, focusing on the fact that the basic material can effectively block the acidic etchant.

[Formula 1]

Here, R ₁ is hydrogen (H) or a methyl group (-CH ₃ ), R ₂ and R ₃ are each hydrogen (H) or a hydrocarbon having 1 to 12 carbon atoms, and R ₄ is a hydrocarbon having 1 to 18 carbon atoms.

The content of the acrylic monomer having the structure of Formula 1 is preferably 1% by weight or more and 40% by weight or less based on the total weight of the composition. The above weight % range has critical significance because it cannot be used as an adhesive because it aggregates with each other due to the difference.

Unsaturated hydrocarbons included in the polymer may be used individually or in combination with butadiene or isoprene, and the unsaturated hydrocarbons are preferably used in an amount of 30% by weight or less based on the total weight of the composition to control the secondary transition temperature, and use more than that. Since phase separation is caused due to a polarity difference with the compound of Formula 1, the above numerical value has critical significance.

In addition, in the above composition, the saturated or unsaturated hydrocarbon oligomer used to control the adhesive strength of the pressure-sensitive adhesive may be selected and added at least one selected from aromatic or aliphatic petroleum resins, and the content is preferably 10% by weight or less, and when it is greater than or equal to 10% by weight Excessive adhesive force makes it impossible to achieve the above purpose. Therefore, the above figures have critical significance.

In the composition, the physical foaming agent has a spherical core-shell structure consisting of a polymer shell and a core filled with a volatile foaming agent, and has a different particle size or foaming temperature. At least one physical foaming agent includes In the composition, the organic foaming agent is benzenesulfonylhydrazide, p-Toluenesulfonylhydrazide or para, para-oxybis (benzenesulfonylhydrazide) (p, p'-oxybis ( Among benzenesulfonylhydrazide)), at least one organic foaming agent having a different particle size or foaming temperature may be included. In the composition, the inorganic foaming agent may include at least one inorganic foaming agent having different particle diameters or foaming temperatures from sodium bicarbonate (NaHCO ₃ ) or potassium bicarbonate (KHCO ₃ ).

The above foaming agents may be used alone or in combination with at least one physical, organic and inorganic foaming agent in an amount of 5% by weight or more and 30% by weight or less based on the total weight of the composition. When used in excess of 30% by weight, over-foaming causes deformation of the printed circuit and reflow of the adhesive, so that the desired decrease in adhesive strength cannot be expected, which is of critical significance.

Hereinafter, it will be described in detail based on the accompanying drawings and embodiments of the present invention. The invention may be embodied in many different forms and is not limited to the embodiments set forth herein.

Example 1.

(1) Put 90g of 2-EHA (2-ethylhexyl acrylate), 6g of 2-HEA (2-hydroxyethyl acrylate), 24g of DMA (N,N'-dimethyl acrylamide) and 180g of EA (Ethylacetate) as a solvent in a 500㎖ flask. After stirring for 30 minutes while evacuating with nitrogen, 0.01 g of AIBN (Azobisisobutyronitrile) and 0.1 g of 1-dodecanethiol were added, and reacted at 60 ° C. for 8 hours (solid content 43%, conversion rate 97%).

(2) 6.45 g (15% of solid content) of physical foaming agent (average particle diameter: 16㎛, foaming temperature: 100 to 140 ° C) and 0.622 g of curing agent (HDI, Hexamethylene Diisocyanate) (40 mol% compared to HEA) in 100 g of the polymerization solution was added and stirred to prepare a solution for preparing a double-sided adhesive tape.

(3) The solution was coated on both sides to a thickness of 50 μm on a 50 μm PET film and then aged at 50° C. for 72 hours to prepare a double-sided adhesive tape.

(4) A flexible copper laminate sample for double-sided etching was prepared by laminating a flexible copper laminate having a thickness of 35 μm on both sides of the double-sided adhesive tape prepared in (3) above.

(5) Then, in order to compare productivity, the process was performed as follows.

1) The total manufacturing time was compared by performing a conventional etching process.

2) The flexible copper laminate was immersed in an etchant for 10 seconds, 30 seconds, and 60 seconds, then washed and dried to compare etching resistance.

Thereafter, the solid content of the composite was 40 to 43% by weight and the conversion rate was in the range of 95 to 99%, and the quantitative additive was calculated based on the solid content and conversion rate.

Comparative Example 1.

(1) A PEN film was laminated to the flexible copper laminate as an insulating layer and thermally compressed at 150° C. for 1.5 hours to prepare an etching sample.

(2) The prepared sample was compared with the effect of the present invention by performing a conventional etching process and comparing the total manufacturing time.

Comparative Example 2.

(1) Put 90g of 2-EHA (2-ethylhexyl acrylate), 6g of 2-HEA (2-hydroxyethyl acrylate), 24g of MA (Methyl acrylate), and 180g of EA (Ethylacetate) as a solvent into a 500㎖ flask and evacuate with nitrogen for 30 g. After stirring for a minute, 0.01 g of AIBN (Azobisisobutyronitrile) and 0.1 g of 1-dodecanethiol were added, followed by reaction at 60° C. for 8 hours. (solid content 42%, conversion rate 98%)

(2) 6.3 g (15% of solid content) of physical foaming agent (average particle diameter: 16㎛, foaming temperature: 100-160 ° C) and 0.608 g of curing agent (HDI, Hexamethylene Diisocyanate) (40 mol% compared to HEA) in 100 g of the polymerization solution was added and stirred to prepare a double-sided adhesive tape solution.

(3) The solution was coated on both sides to a thickness of 50 μm on a 50 μm PET film and then aged at 50° C. for 72 hours to prepare a double-sided adhesive tape.

(4) A flexible copper laminate sample for double-sided etching was prepared by laminating a flexible copper laminate having a thickness of 35 μm on both sides of the double-sided adhesive tape prepared in (3) above.

(5) Thereafter, the flexible copper laminate was immersed in an etchant for 10 seconds, 30 seconds, and 60 seconds, washed, and dried to compare etching resistance to the degree of immersion.

Example 2

Almost the same as Example 1, except that polymerization was performed using AN (Acrylonitrile) instead of DMA, and the soft copper laminate was immersed in an etchant for 10 seconds, 30 seconds, and 60 seconds, then washed and dried. The etch resistance was compared to the degree of deposition.

Example 3

Most of the same as Example 1, but polymerization was performed using DAEA (N, N-dimethylaminoethyl acrylate) instead of DMA, and the soft copper laminate was immersed in an etching solution for 10 seconds, 30 seconds, and 60 seconds, then washed, dried, and deposited The etch resistance was compared to the extent that it was.

Comparative Example 3.

Most of the same as Example 1, except that DMA was used at 1% by weight and the rest was polymerized using MA (Methyl acrylate), and the soft copper laminate was immersed in an etching solution for 10 seconds, 30 seconds, and 60 seconds, followed by washing, The etching resistance was compared to the degree of drying and deposition.

Example 4

Most of the same as Example 1, but 10% by weight of DMA was used and the rest was polymerized using MA (Methyl acrylate), and the soft copper laminate was immersed in an etchant for 10 seconds, 30 seconds, and 60 seconds, then washed, The etching resistance was compared to the degree of drying and deposition.

Example 5.

Most of the same as in Example 1, but polymerization was performed by using 30% by weight of DMA and subtracting the increased amount (10% by weight) from 2-HEA, and immersing the flexible copper laminate in the etchant for 10 seconds, 30 seconds, and 60 seconds After washing and drying, etching resistance was compared to the degree of deposition.

Example 6.

Most of the same as Example 1, but 40% by weight of DMA was used, and the increased amount (20% by weight) was subtracted from 2-HEA to polymerize. Etching resistance was compared to the degree of washing and drying and deposition.

Comparative Example 4.

It is the same as in Example 1 except that the amount of the foaming agent was added in an amount of 5% by weight relative to the solid content, and the flexible copper laminate was immersed in an etching solution for 10 seconds, 30 seconds, and 60 seconds, then washed and dried to compare etching resistance to the extent of immersion. did

Example 7.

It is the same as in Example 1 except that the amount of the foaming agent was added in an amount of 30% by weight relative to the solid content, and the flexible copper laminate was immersed in an etchant for 10 seconds, 30 seconds, and 60 seconds, then washed and dried to compare etching resistance to the extent of immersion. did

As can be seen from Test Result 1 below, the manufacturing time of the flexible flat cable or flexible printed circuit manufactured by the present invention is 61.5 minutes per sheet, and the manufacturing time of the product manufactured by the conventional method is 212 minutes per sheet, according to the present invention. In the case of this, productivity improvement of about 3.5 times can be expected.

Test result 1 division Example 1 Comparative Example 1 note preprocessing time 2 minutes 91 minutes Example: 1 minute each side Comparative example: 1 minute single side + 90 minutes thermal compression etching time 30 minutes 30 minutes post-processing time 91 minutes 91 minutes Total Time 123 minutes 212 minutes production purchase 2 sheets 1 sheet production time per unit 61.5 minutes 212 minutes about 3.5 times

As can be seen from Test Result 2 below, when a general double-sided adhesive is used, the etchant permeates into the interface between the double-sided adhesive tape and the flexible copper laminate, and the printed circuit formed by corroding the back surface of the flexible copper laminate is short-circuited or crushed ( Marked portion in Fig. 3) The etching resistance is remarkably lowered, and therefore, a basic compound must be contained.

Test result 2 division Example 1 Comparative Example 2 note etching resistance 10 seconds ◎ X 30 seconds ◎ X 60 seconds ◎ X Picture Figure 2 Figure 3

Excellent ◎ / Excellent ○ / Normal △ / Poor X

Looking at test result 3 below, the basic compound is not limited to the type, and as can be seen from test result 4 below, if the content of the basic compound is below the critical value, the etchant flows to the interface between the double-sided adhesive tape and the flexible copper laminate. It permeates and corrodes the back surface of the ductile copper laminate, so it can be seen that there is a critical value in the amount.

Test result 3 division Example 1 Example 2 Example 3 etching resistance 10 seconds ◎ ◎ ◎ 30 seconds ◎ ○ ◎ 60 seconds ◎ ○ ◎ Picture Figure 4 Fig. 5 Fig. 6

Excellent ◎ / Excellent ○ / Normal △ / Poor X

Test result 4 division etching resistance Picture 10 seconds 30 seconds 60 seconds Comparative Example 3 △ △ X Fig. 7 Example 4 ○ ○ △ Fig. 8 Example 1 ◎ ◎ ◎ Figure 4 Example 5 ◎ ◎ ◎ Fig. 9 Example 6 ○ ○ ○ Fig. 10

Excellent ◎ / Excellent ○ / Normal △ / Poor X

As can be seen from the test result 5 below, the amount of the foaming agent affects the peel strength after etching, and it is preferable that the peel strength is low, so the amount of the foaming agent added also has a critical value.

Test result 5 division Comparative Example 4 Example 1 Example 7 adhesiveness
(gf/in) before firing 1,291 327 80 after firing 258 0 0

Although the present invention has been described in more detail by way of examples above, the present invention is not necessarily limited to these embodiments and may be variously modified and implemented without departing from the spirit of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

Claims (15)

laminating the flexible copper laminate on both sides of the double-sided adhesive tape;
manufacturing a flexible flat cable or a flexible printed circuit through a normal manufacturing process using the flexible copper laminate; and
Peeling off the double-sided adhesive tape;
Including,
The double-sided adhesive tape is a polymer obtained by mixing and polymerizing at least one acrylic monomer and at least one saturated or unsaturated hydrocarbon monomer or oligomer; and
At least one physical, organic or inorganic foaming agent;
It is prepared from a composition comprising a, wherein the acrylic monomer has a structure represented by Formula 1 below,
A method for manufacturing a flexible flat cable or a flexible printed circuit, characterized in that a plurality of the flexible flat cable or flexible printed circuit can be simultaneously manufactured.
[Formula 1]

Here, R ₁ is hydrogen (H) or a methyl group (-CH ₃ ), R ₂ and R ₃ are each hydrogen (H) or a hydrocarbon having 1 to 12 carbon atoms, and R ₄ is a hydrocarbon having 1 to 18 carbon atoms According to claim 1,
The method of manufacturing a flexible flat cable or flexible printed circuit, characterized in that the peeling of the double-sided adhesive tape is performed by foaming the double-sided adhesive tape. According to claim 2,
A method for manufacturing a flexible flat cable or flexible printed circuit, characterized in that heating is performed during the foaming, and the foaming temperature by heating is in the range of 80 to 180 ° C. According to claim 3,
The method of manufacturing a flexible flat cable or flexible printed circuit, characterized in that heating is performed during the foaming, and the foaming time by heating is in the range of 20 seconds to 30 minutes. A composition for a double-sided adhesive tape for producing a flexible flat cable or a flexible printed circuit,
Polymers obtained by mixing and polymerizing at least one acrylic monomer and at least one saturated or unsaturated hydrocarbon monomer or oligomer; and
At least one physical, organic or inorganic foaming agent;
Including,
The acrylic monomer is a composition for a double-sided adhesive tape, characterized in that it has a structure of formula (1).
[Formula 1]

Here, R ₁ is hydrogen (H) or a methyl group (-CH ₃ ), R ₂ and R ₃ are each hydrogen (H) or a hydrocarbon having 1 to 12 carbon atoms, and R ₄ is a hydrocarbon having 1 to 18 carbon atoms delete According to claim 5,
The composition for double-sided adhesive tape, characterized in that the content of the acrylic monomer is 1 to 40% by weight relative to the total weight of the composition. According to claim 5,
The composition for a double-sided adhesive tape, characterized in that the unsaturated hydrocarbon is at least one selected from butadiene and isoprene. According to claim 8,
The composition for double-sided adhesive tape, characterized in that the content of the unsaturated hydrocarbon is more than 0 and 30% by weight or less relative to the total weight of the composition. According to claim 5,
The composition for double-sided adhesive tape, characterized in that the saturated or unsaturated hydrocarbon oligomer is at least one selected from aromatic or aliphatic petroleum resins. According to claim 10,
The composition for double-sided adhesive tape, characterized in that the saturated or unsaturated hydrocarbon oligomer is greater than 0 and less than 10% by weight relative to the total weight of the composition. According to claim 5,
The physical foaming agent has a spherical core-shell structure consisting of a polymer wall material (shell) and an interior (core) filled with a volatile foaming agent, and has a different particle diameter or foaming temperature. Characterized in that it includes at least one kind Composition for double-sided adhesive tape. According to claim 5,
The organic blowing agent is selected from among benzenesulfonylhydrazide, p-Toluenesulfonylhydrazide, or p,p'-oxybis(benzenesulfonylhydrazide). A composition for a double-sided adhesive tape, characterized in that it is at least one selected. According to claim 5,
The inorganic foaming agent is sodium bicarbonate (NaHCO ₃ ) or potassium bicarbonate (Potassium bicarbonate: KHCO ₃ ) A composition for double-sided adhesive tape, characterized in that at least one selected from. According to claim 5,
A composition for double-sided adhesive tape, characterized in that the weight of at least one of the physical, organic and inorganic foaming agents alone or in combination is 5 to 30% by weight based on the total weight of the composition.

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